JP2005101643A5 - - Google Patents
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- JP2005101643A5 JP2005101643A5 JP2004329962A JP2004329962A JP2005101643A5 JP 2005101643 A5 JP2005101643 A5 JP 2005101643A5 JP 2004329962 A JP2004329962 A JP 2004329962A JP 2004329962 A JP2004329962 A JP 2004329962A JP 2005101643 A5 JP2005101643 A5 JP 2005101643A5
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- optical element
- substrate
- stage
- optical
- light
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Claims (9)
前記ボンディングユニットは、前記光素子及びステージに固定された基板の位置を認識する検知ユニットによって得られる位置情報に基づいて光素子を基板に対して位置合わせし固着するボンディングヘッドを有し、
前記検知ユニットの照明光源は、前記基板に第1の光を照明する第1の照明光源と、前記第1の照明光源とは別に設けられ、かつ前記光素子に第2の光を照明する第2の照明光源とを有することを特徴とする光モジュールの組立装置。 An optical module assembly apparatus comprising: a stage for fixing a substrate on which an optical element is mounted; and a bonding unit that holds the optical element and aligns and fixes the optical element to the substrate fixed to the stage,
The bonding unit has a bonding head for aligning and fixing the optical element with respect to the substrate based on position information obtained by a detection unit that recognizes the position of the substrate fixed to the optical element and the stage,
An illumination light source of the detection unit is provided separately from the first illumination light source for illuminating the substrate with the first light and the first illumination light source, and illuminates the optical element with the second light. An optical module assembling apparatus comprising two illumination light sources.
第1の照明光源から前記基板に照明された第1の光と、前記第1の照明光源とは別に設けられた第2の照射光源から前記光素子に照明された第2の光とを用いて、前記光素子と基板の位置情報を得、その位置情報によって前記位置合わせを行うことを特徴とする光モジュールの組立方法。 An optical module assembling method comprising: a stage for fixing a substrate on which an optical element is mounted; and a bonding unit for holding the optical element and aligning and fixing the optical element to the substrate fixed to the stage,
First light illuminated on the substrate from a first illumination light source and second light illuminated on the optical element from a second irradiation light source provided separately from the first illumination light source are used. A method of assembling the optical module, comprising obtaining positional information of the optical element and the substrate and performing the alignment based on the positional information.
前記ボンディングユニットが、前記光素子及びステージに固定された基板の位置を認識する検知ユニットと、この検知ユニットによって得られる位置情報に基づいて光素子を基板に対して位置合わせし固着するボンディングヘッドとを有し、
前記検知ユニットの照明光源は、前記光素子の発光面の位置情報を得る光を照明する照明光源を有することを特徴とする光モジュールの組立装置。 An optical module assembly apparatus comprising: a stage for fixing a substrate on which an optical element is mounted; and a bonding unit that holds the optical element and aligns and fixes the optical element to the substrate fixed to the stage,
A detection unit for recognizing the position of the substrate fixed to the optical element and the stage, and a bonding head for aligning and fixing the optical element to the substrate based on position information obtained by the detection unit; Have
The optical module assembling apparatus, wherein the illumination light source of the detection unit includes an illumination light source that illuminates light for obtaining positional information of a light emitting surface of the optical element.
前記光素子に照射された光を用いて前記光素子の発光面の位置情報を得て、前記光素子の位置情報に基づいて前記位置合わせを行うことを特徴とする光モジュールの組立方法。 An optical module assembly method for holding an optical element on a stage for fixing a substrate on which the optical element is mounted, and aligning and fixing the optical element to the substrate fixed to the stage,
A method of assembling an optical module, comprising: obtaining position information of a light emitting surface of the optical element using light irradiated to the optical element; and performing the alignment based on the positional information of the optical element.
前記光素子に照射された光を用いて前記光素子の発光面の位置情報を得て、前記光素子の位置情報に基づいて前記位置合わせ作業時の前記光素子の位置情報を得ることを特徴とする光モジュールの組立方法。 An optical module assembly method for holding an optical element on a stage for fixing a substrate on which the optical element is mounted, and aligning and fixing the optical element to the substrate fixed to the stage,
The position information of the light emitting surface of the optical element is obtained using the light irradiated to the optical element, and the position information of the optical element at the time of the alignment operation is obtained based on the position information of the optical element. Assembling method of optical module.
Light irradiated to the optical element, method of assembling an optical module according to any one of claims 6 to 8 characterized in that it is a light that is not transmitted through the optical element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004329962A JP3977372B2 (en) | 2004-11-15 | 2004-11-15 | Optical module assembly method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004329962A JP3977372B2 (en) | 2004-11-15 | 2004-11-15 | Optical module assembly method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20905898A Division JP3789232B2 (en) | 1998-07-24 | 1998-07-24 | Optical module assembling apparatus and assembling method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005101643A JP2005101643A (en) | 2005-04-14 |
JP2005101643A5 true JP2005101643A5 (en) | 2005-09-15 |
JP3977372B2 JP3977372B2 (en) | 2007-09-19 |
Family
ID=34464340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004329962A Expired - Fee Related JP3977372B2 (en) | 2004-11-15 | 2004-11-15 | Optical module assembly method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3977372B2 (en) |
-
2004
- 2004-11-15 JP JP2004329962A patent/JP3977372B2/en not_active Expired - Fee Related
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