JP2005101347A - Attaching method of ic chip and wafer used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attach a minute IC chip to a desired place. <P>SOLUTION: The IC chip is attached by a process wherein a wafer and a plurality of dicing tapes (6, 7) are superposed and fixed onto a dicing surface plate (8) so as to expose the pattern surface of the wafer (5), a process wherein the dicing of wafer is effected in X-axis direction with a cutting depth arriving at the middle of the thickness of the dicing tape (6) for an upper layer, a process wherein the dicing of wafer is effected in Y-axis direction with a cutting depth arriving at the middle of the thickness of the dicing tape (7) for a lower layer, a process wherein the dicing tapes (6, 7) are peeled between the upper and lower layers to take out a belt type tape piece (6a) extended into Y-axis direction, and a process wherein the IC chip (4) on the tape piece is peeled off from the tape piece by pushing the tape piece against a predetermined attaching place from the back side of the same to bond the same. According to these processes, the minute IC chip (4) can be simply and correctly attached to the predetermined attaching place. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC chip mounting method and a wafer used in the method.

  Conventionally, in order to attach an IC chip to a predetermined location, the wafer is attached on a single dicing tape on the opposite pattern surface, diced in the XY axis direction, and the adhesive force is applied by irradiating the dicing tape with ultraviolet rays. The IC chip is sucked from the pattern surface side with a thin suction tube and peeled off from the dicing tape, and the IC chip is sucked and received from the non-pattern surface side with another suction tube. The pattern surface side is pressed against a predetermined portion where a conductive adhesive is applied in advance.

  According to the conventional mounting method, two types of suction pipes must be prepared and complicated movements must be made for each suction pipe. Therefore, the structure of the apparatus for mounting the IC chip is complicated and the production efficiency is also reduced. There is. In addition, IC chips have been increasingly miniaturized in recent years. For example, IC chips having a side of about 0.1 mm to 0.2 mm are produced. .

  The object of the present invention is to provide means for solving the above-mentioned problems.

  In order to solve the above-mentioned problems, the invention according to claim 1 is directed to dicing determination by superposing the wafer (5) and the plurality of dicing tapes (6, 7) so that the pattern surface of the wafer (5) is exposed. A step of fixing on the board (8), a step of dicing the wafer (5) in the X-axis direction with a depth of cut reaching the middle thickness of the upper layer dicing tape (6), and a lower layer dicing tape (7 ) A process of dicing the wafer (5) in the Y-axis direction with a depth of cut that reaches the middle of the wall thickness, and a strip-shaped tape piece extending in the Y-axis direction by peeling the dicing tape (6, 7) between the upper and lower layers ( 6a) and a step of pressing and sticking the IC chip (4) on the tape piece (6a) from the back of the tape piece (6a) to a predetermined mounting location and peeling off from the tape piece (6a). IC chip mounting method The adopted.

  The invention according to claim 2 adopts the IC chip mounting method according to claim 1, wherein the IC chip (4) diced has an antenna.

  Further, the invention according to claim 3 adopts the IC chip mounting method in which the diced IC chip (4) is attached to the antenna (2, 15, 16) in the IC chip mounting method according to claim 1. To do.

  According to a fourth aspect of the present invention, there is provided the IC chip mounting method according to any one of the first to third aspects, wherein the tape piece (6a) is connected in the longitudinal direction and supplied to a predetermined mounting location. The chip mounting method is adopted.

  Further, the invention according to claim 5 is a wafer (5) used in the method for mounting an IC chip according to any one of claims 1 to 4, wherein a plurality of dicings are performed so that a pattern surface is exposed. The wafer (5) superimposed on the tape (6, 7) is employed.

  According to the first aspect of the invention, the wafer (5) and the plurality of dicing tapes (6, 7) are overlaid on the dicing platen (8) so that the pattern surface of the wafer (5) is exposed. A step of dicing the wafer (5) in the X-axis direction with a depth of cut reaching the middle of the thickness of the upper layer dicing tape (6), and a thickness of the lower layer dicing tape (7). A step of dicing the wafer (5) in the Y-axis direction with a cutting depth reaching the middle, and a step of peeling the dicing tape (6, 7) between the upper and lower layers and taking out a strip-like tape piece (6a) extending in the Y-axis direction And a step of pressing and sticking the IC chip (4) on the tape piece (6a) from the back of the tape piece (6a) to a predetermined mounting location, and peeling off the tape piece (6a). Because it is the mounting method of Be an IC chip (4) can be mounted easily and accurately to a predetermined mounting position.

  According to the second aspect of the present invention, in the IC chip mounting method according to the first aspect, since the diced IC chip (4) is a method for mounting an IC chip having an antenna, the IC chip (4) is a predetermined one. At the same time, it can be used as a non-contact type wireless tag, IC card, inlet or the like.

  According to a third aspect of the present invention, in the method for attaching an IC chip according to the first aspect, the IC chip is attached by attaching the diced IC chip (4) to the antenna (2, 15, 16). Therefore, even a small IC chip (4) can be easily and accurately attached to the antenna (2, 15, 16) and used as an inlet or the like.

  According to a fourth aspect of the present invention, in the method for mounting an IC chip according to any one of the first to third aspects, the IC is connected to the tape piece (6a) in the longitudinal direction and supplied to a predetermined mounting location. Since it is a chip mounting method, a large number of IC chips (4) can be continuously supplied to a predetermined mounting location to increase production efficiency.

  According to a fifth aspect of the present invention, there is provided a wafer (5) used in the IC chip mounting method according to any one of the first to fourth aspects, wherein a plurality of dicing pieces are exposed so that the pattern surface is exposed. Since the wafer (5) is superposed on the tape (6, 7), a large number of IC chips (4) can be accurately taken out one by one by dicing.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
First, a wireless tag having an IC chip attached by the IC chip attachment method according to the present invention will be described.

  As shown in FIG. 1, the wireless tag includes a sheet-like base material 1, an antenna 2 formed in a spiral shape on the base material 1, a connecting piece 3 that connects between ends of the antenna 2, an antenna 2 and an IC chip 4 bonded to each other.

  The antenna 2 is formed on a sheet-like base material 1 made of paper, resin or the like by etching, silk screen printing, or the like. The connecting piece 3 is formed in a strip shape with a conductive sheet such as a metal foil, and both ends thereof are bonded to the end of the antenna 2 with a conductive adhesive or the like. The IC chip 4 has a pattern surface on one side, and electrodes 4a and 4b (see FIG. 5) for connecting to the antenna are formed.

  The surface of the wireless tag is covered with a protective layer (not shown) such as a resin film, for example, to obtain a finished product. Various information is read from or written to the IC chip 4 of the wireless tag in a magnetic field by a reader / writer (not shown).

  The IC chip 4 is attached to the antenna 2 through the following steps.

  (1) First, the completed wafer 5 shown in FIG. 3A is overlapped with a plurality of dicing tapes 6 and 7 so that the pattern surface is exposed as shown in FIG. Secure on board 8.

  The dicing tapes 6 and 7 are sheets on which an adhesive layer (not shown) whose adhesive strength is reduced by heating or irradiation with light of a predetermined wavelength is formed, and a plurality of dicing tapes 6 and 7 are formed via the adhesive layer. The wafer 5 is attached to the adhesive layer of the uppermost dicing tape 6. Commercially available products can be used as the dicing tapes 6 and 7.

  The wafer 5 may be pasted after the dicing tapes 6 and 7 are pasted together, or after the wafer 5 is pasted on the dicing tape 6, another dicing tape 7 is attached to the dicing tape 6. You may make it stick.

  (2) As shown in FIG. 3C, the wafer 5 is diced in the X-axis direction with a cutting depth that reaches the middle of the thickness of the upper-layer dicing tape 6.

  The laminated body of the wafer 5 and the dicing tapes 6 and 7 is fixed on the surface plate 8 for dicing, and a number of cuts 9 are made to the middle of the thickness of the upper dicing tape 6 in the X-axis direction by a diamond cutter (not shown). It is done.

  (3) As shown in FIG. 3D, the wafer 5 is diced in the Y-axis direction with a cutting depth that reaches the middle of the thickness of the lower-layer dicing tape 7.

  A large number of the notches 10 are cut by the diamond cutter to the middle thickness of the lower dicing tape 7 in the Y-axis direction so as not to damage the surface of the smooth dicing platen 8.

  The step (3) can be performed prior to the step (2).

  (4) As shown in FIG. 3 (E), the dicing tapes 6 and 7 are peeled off between the upper and lower layers and separated into strip-shaped tape pieces 6a extending in the Y-axis direction.

  Prior to the division, the laminated body of the wafer 5 and the dicing tapes 6 and 7 shown in FIG. 3D is heated or irradiated with ultraviolet light having a predetermined wavelength, and the adhesive layer of the dicing tapes 6 and 7 is formed. Reduces adhesive strength. After heating or ultraviolet light irradiation, the upper layer dicing tape 6 is peeled from the lower layer dicing tape 7, whereby a large number of tape pieces 6a carrying a large number of IC chips 4 are taken out as shown in FIG. .

  Although the adhesive strength of the upper dicing tape 6 holding the IC chip 4 is reduced by heating or ultraviolet light irradiation, according to the inventor's experiment, the IC chip 4 and the dicing are more than the adhesive strength between the dicing tapes 6 and 7. The adhesive strength with the tape 6 is stronger, and it has been confirmed that the IC chip 4 is not peeled off from the upper-layer dicing tape 6 in this peeling process.

  Adhesion between the wafer 5 and the upper dicing tape 6 is performed with an adhesive layer whose adhesive strength is reduced by heating or ultraviolet light irradiation, and adhesion between the dicing tapes 6 and 7 is reduced by adhesive or ultraviolet light irradiation or heating. It is possible to use the agent layer, and the dicing tapes 6 and 7 and the IC chip 4 may be peeled by different adhesive strength reducing means. In this way, the IC chip 4 is more reliably prevented from peeling off.

  (5) As shown in FIG. 4, the IC chip 4 on the tape piece 6a obtained in the step (4) above is pressed from the back of the tape piece 6a to a predetermined mounting location and adhered, and then peeled off from the tape piece 6a. take.

  In FIG. 4, reference numeral 1 a indicates a continuous sheet in which the antennas 2 are continuously formed at a predetermined interval, and the continuous sheet 1 a is intermittently sent in the arrow direction. A conductive adhesive 11 is applied in advance by silk screen printing or the like to the place where the IC chip 4 of each antenna 2 is pasted on the continuous sheet 1a. An anisotropic conductive film or paste can be used as the conductive adhesive 11.

  A tape piece 6a is disposed above the continuous sheet 1a in parallel with the feeding direction of the continuous sheet 1a. Both ends of the tape piece 6 a are sucked and held by suction pipes 12 and 13. More than two suction tubes may be provided. The tape pieces 6a held by the suction tubes 12 and 13 hold a large number of IC chips 4 in a row on the lower surface thereof, and the pattern surface of these IC chips 4 faces the antenna 2 on the continuous sheet 1a.

  As shown in FIG. 4, a pusher 14 is disposed at an intermediate position between the two suction pipes 12 and 13 so as to be reciprocally movable in the vertical direction. As shown in FIG. 5, when the continuous sheet 1 a is temporarily stopped, the pusher 14 is lowered, and the IC chip 4 on the tape piece 6 a is pressed from the back of the tape piece 6 a to a predetermined mounting position on the antenna 2. Thereby, the electrode 4 a on the pattern surface of the IC chip 4 is attached to the antenna 2 by the conductive adhesive 11. Also, the conductive adhesive 11 is electrically conductive only at the grained portions due to the pressure applied by the pusher 14 and the electrode 4 a and the antenna 2, and the electrode 4 a is electrically connected to the antenna 2.

  When the suction pipes 12 and 13 are lifted together with the pusher 14, the tape piece 6a is peeled off from the IC chip 4 on the antenna 2, and the IC chip 4 remains on the antenna 2 of the continuous sheet 1a.

  Thereafter, the continuous sheet 1a to which the IC chip 4 is adhered is divided at regular intervals to obtain the wireless tag shown in FIG.

  This IC chip mounting method can also be applied to the manufacture of an inlet as shown in FIG. That is, the IC chip 4 can be supplied and attached to the two antenna pieces 15 and 16 arranged opposite to each other by the above method. A conductive adhesive is applied in advance to locations corresponding to the IC chip 4 of the antenna pieces 15 and 16. The conductive adhesive may be an isotropic conductive film. The inlet shown in FIG. 2 can be bonded instead of the connecting piece 3 shown in FIG. In this case, the IC chip 4 in FIG. 1 is transferred from the central portion of the antenna 2 to the corner portion of the antenna 2.

  Further, an IC chip provided with an antenna from the beginning of wafer manufacture can be attached to a predetermined attachment location by this IC chip attachment method. In that case, it can be used as a non-contact type wireless tag, IC card, inlet or the like simultaneously with the mounting of the IC chip.

<Embodiment 2>
As shown in FIG. 6, in the second embodiment, unlike the case of the first embodiment, a large number of tape pieces 6a are connected in the longitudinal direction with joining pieces 17 and wound into a roll shape. While feeding out 6a, it supplies to the antenna 2 of the continuous sheet 1a which is a predetermined attachment location.

  Thereby, a large number of IC chips 4 can be continuously supplied to a predetermined mounting location, and the production efficiency of a wireless tag or the like can be increased.

  In the first and second embodiments, the antenna is supplied as a continuous sheet. However, the IC chip may be attached while being supplied as a single sheet divided for each antenna.

It is a perspective view of the wireless tag with which the IC chip was attached by the attachment method of the IC chip concerning the present invention. 1 is a perspective view of an inlet to which an IC chip is attached by an IC chip attachment method according to the present invention. It is process drawing of the first half of the attachment method of the IC chip which concerns on this invention. It is process drawing of the latter half of the attachment method of the IC chip which concerns on this invention. FIG. 5 is an elevational view showing an IC chip attaching step in FIG. 4. It is a perspective view which shows the other form of the attachment method of the IC chip which concerns on this invention.

Explanation of symbols

2 ... Antenna 4 ... IC chip 5 ... Wafer 6, 7 ... Dicing tape 6a ... Tape piece 8 ... Surface plate for dicing 15, 16 ... Antenna piece

Claims (5)

  The wafer and multiple dicing tapes are stacked and fixed on the dicing platen so that the pattern surface of the wafer is exposed, and the wafer is cut at a depth of cut up to the middle thickness of the upper dicing tape. A process of dicing in the X-axis direction, a process of dicing the wafer in the Y-axis direction with a depth of cut that reaches the middle of the thickness of the lower-layer dicing tape, and a strip extending in the Y-axis direction by peeling the dicing tape between the upper and lower layers Mounting the IC chip, comprising: a step of taking out the tape piece; and a step of pressing the IC chip on the tape piece from a back side of the tape piece against a predetermined mounting location and attaching the chip to the tape piece. Method. 2. The method of attaching an IC chip according to claim 1, wherein the diced IC chip has an antenna.
Is adopted.   2. The method of attaching an IC chip according to claim 1, wherein the diced IC chip is attached to an antenna.   4. The IC chip mounting method according to claim 1, wherein the tape pieces are connected in a longitudinal direction and supplied to a predetermined mounting location.   5. A wafer used for the IC chip mounting method according to claim 1, wherein the wafer is superposed on a plurality of dicing tapes so that a pattern surface is exposed.

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