JP2005101059A - Substrate treatment equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate treatment equipment in which substrate carriage control can be facilitated while enhancing throughput. <P>SOLUTION: The substrate treatment equipment is constituted by juxtaposing units (cells) to be controlled each comprising a section performing required treatment on a substrate, and a single main carrying mechanism for delivering the substrate to the treatment section. A controller of each cell makes a decision whether carriable conditions of that cell are satisfied nor not (steps S4<SB>F</SB>, S4<SB>R</SB>) upon the occurrence of a specified decision-making start event (step S1), and executes the carriage of the substrate in that cell if the conditions are satisfied otherwise waits a next decision-making start event. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus that performs a series of processes on a substrate (hereinafter simply referred to as “substrate”) such as a semiconductor substrate, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk.

  Conventionally, in such a substrate processing apparatus, for example, photolithography is performed by applying a photoresist film to a substrate, performing an exposure process on the substrate coated with the photoresist film, and developing the substrate after the exposure process. Used in the process.

  This is shown in the plan view of FIG. 13 and will be described below. This substrate processing apparatus is a cassette mounting table 101 on which a plurality of cassettes C in which a plurality of unprocessed (for example, 25) substrates W or substrates W that have been processed in the processing unit 104 described later are stored are mounted. And an indexer 103 including a transport mechanism 108a that horizontally moves in front of each cassette C and transfers the substrate W between each cassette C and a processing unit 104 described later, a plurality of processing units 104, and a plurality of processing units 104 The substrate main transport path 105, which is a path for transporting the substrate W between the processing sections 104, and the interface 106 that relays the transfer of the substrate W between the processing section 104 and the external processing apparatus 107.

  The external processing apparatus 107 is a separate apparatus from the substrate processing apparatus, and is configured to be detachable from the interface 106 of the substrate processing apparatus. When the substrate processing apparatus is an apparatus that performs the above-described resist coating and development processing, the external processing apparatus 107 is an exposure apparatus that performs an exposure process on the substrate W.

  Also, a main transport mechanism 108b that transports the substrate main transport path 105 and a transport mechanism 108c that transports the transport path of the interface 106 are provided. In addition, a mounting table 109 a is disposed at a connecting portion between the indexer 103 and the main substrate transport path 105, and a mounting table 109 b is disposed at a connecting portion between the main substrate transport path 105 and the interface 106.

  In the substrate processing apparatus described above, substrate processing is performed in the following procedure. One substrate is taken out from the cassette C containing unprocessed substrates W by the transport mechanism 108a and transported to the mounting table 109a in order to transfer the substrate W to the main transport mechanism 108b. After receiving the substrate W placed on the mounting table 109a, the main transport mechanism 108b performs a predetermined process (for example, a process such as resist coating) in each processing unit 104. The substrate W is loaded into each. When each predetermined process ends, the main transport mechanism 108b unloads the substrate W from each of the processing units 104, and loads the substrate W into another processing unit 104 (for example, heat treatment) to perform the next processing. To do.

  Thus, when a series of processes before exposure ends, the main transport mechanism 108b transports the substrate W processed by the processing unit 104 to the placement unit 109b. In order to transfer the substrate W to the transport mechanism 108c, the substrate W is mounted on the mounting table 109b described above. The transport mechanism 108 c receives the substrate W placed on the placement table 109 b and then transports it to the external processing apparatus 107. When a predetermined process (for example, a process such as an exposure process) is completed after being loaded into the external processing apparatus 107, the transport mechanism 108c unloads the substrate W from the external processing apparatus 107 and transports it to the placement unit 109b. After that, the main transport mechanism 108b transports the substrate to each processing unit 104, and a series of post-exposure heating processing, cooling processing, and development processing is performed. It is carried into C. And it pays out from the cassette mounting base 101, and a series of board | substrate processes are complete | finished.

Conventionally, the substrate conveyance as described above is performed by a so-called “tact operation”. The “tact operation” will be described below with reference to FIG. Here, for the sake of simplicity of explanation, the substrate transfer between the _four processing units 104 _{1 to} 104 4 arranged in parallel will be described. If the actual processing time of the substrate W in a certain processing unit 104 is T _A , and the preparation time required for loading / unloading the substrate to / from the processing unit 104 is T _B , the processing unit 104 is “T _A + T _B ” time. Each has the ability to dispense one board. This substantial processing time “T _A + T _B ” is called the cycle time of the processing unit 104. In the example illustrated in FIG. 14, each cycle in which the processing unit 104 ₁ is “19 seconds”, the processing unit 104 ₂ is “21 seconds”, the processing unit 104 ₃ is “24 seconds”, and the processing unit 104 ₄ is “22 seconds”. Suppose you have time.

Assuming that a plurality of substrates W are sequentially loaded into the processing unit 104 ₁ and are transported and processed sequentially toward the processing unit 104 ₄ , the processing capability of the entire substrate processing apparatus is the processing having the maximum cycle time. It determined according to section 104 _3. That is, this substrate processing apparatus has the ability to process a substrate at a rate of one piece per 24 seconds. Therefore, the main transport mechanism 108b is regularly operated in time so that the substrate W is delivered every time (for example, 24 seconds) according to the maximum cycle time between the processing units 104 _{1 to} 104 _4. “Tact operation”. In other words, the “tact operation” is a substrate transport operation in which the main transport mechanism 108b is repeatedly operated at predetermined time intervals to sequentially transport the substrates.

However, the conventional example having such a configuration has the following problems.
That is, a conventional substrate processing apparatus that transports a substrate by the “tact operation” as described above
Since the substrates are transferred and processed between the processing units at predetermined time intervals, there is an advantage that the history of each substrate becomes constant. However, it is necessary to accurately control the main transport mechanism 108b in terms of time. Therefore, there is a problem that the control becomes complicated as the number of processing units constituting the substrate processing apparatus increases.

  In addition, when a processing unit of a substrate processing apparatus, for example, changes the processing time of a substrate or adds a processing unit, the influence extends to the substrate transport of the entire substrate processing apparatus. There is also a problem that it is not easy to cope with such a specification change.

Further, in the example of FIG. 14, the main transport mechanism 108b, regardless of the level of processing capabilities of the processing unit 104 ₁ to 104 _4, all of the processing unit 104 ₁ to 104 per ₄ during a time determined for ( In this example, since the substrate is transported every "24 seconds", there is a problem that the throughput of the substrate processing apparatus is lowered.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of easily performing control related to substrate transport and improving throughput. .

In order to achieve such an object, the present invention has the following configuration.
That is, the invention according to claim 1 includes a processing unit that performs a required process on a substrate, and a single main transport mechanism that delivers the substrate to the processing unit. A substrate processing apparatus configured and configured by juxtaposing the controlled units, wherein each controlled unit has an inlet substrate mounting portion on which a substrate is mounted to receive the substrate in the controlled unit And an exit substrate mounting portion for mounting a substrate to pay out the substrate from the controlled unit, and a main transfer mechanism of each controlled unit includes the inlet substrate mounting portion and Each unit to be controlled is provided with a unit control means for transferring the substrate through the exit substrate mounting unit and for controlling at least the substrate transfer operation of the main transport mechanism of each controlled unit for each controlled unit. Means The control relating to a series of substrate transport including the delivery of the substrate to the processing unit and the delivery of the substrate to the substrate mounting unit is performed independently as follows: (1) A target corresponding to each unit control means A transportable condition for determining whether the substrate can be moved in the control unit is preset, and (2) a determination process start event that is a condition for starting the determination process of the transportable condition is (3) When the determination process start event occurs, it is determined whether or not the transportable condition is satisfied. (4) When the transportable condition is satisfied, Substrate transport within the controlled unit is executed, and (5) when the transportable condition is not satisfied, the next determination processing start event is waited.

  In the present invention, the entrance substrate placement unit and the exit substrate placement unit capture the function of the substrate placement unit with reference to one controlled unit. In other words, an exit substrate placement portion of a controlled unit corresponds to an entrance substrate placement portion based on the controlled unit adjacent to the controlled unit. As described above, the exit substrate mounting portion and the entrance substrate mounting portion coincide with each other between adjacent controlled units.

  According to the first aspect of the present invention, required processing for the substrate is sequentially performed by the plurality of controlled units arranged in parallel. In each controlled unit, each main transport mechanism transfers the substrate to the processing unit in parallel. That is, since the main transfer mechanism of each controlled unit operates in parallel, the transfer speed of the substrate to each processing unit is equivalently improved, so that the throughput of the substrate processing apparatus can be improved. In addition, since the entrance substrate placement unit and the exit substrate placement unit are provided separately, the substrate received by the controlled unit and the substrate dispensed from the controlled unit interfere with each other at the substrate placement unit. Therefore, the substrate can be smoothly transferred between the processing blocks.

    The present invention intends to improve the throughput of the substrate processing apparatus also from the control aspect. The control method of the present invention is so-called distributed control. For this purpose, the delivery of the substrate between the controlled units is performed via the distinguished entrance substrate placement portion and the exit substrate placement portion. As a result, the control means of each controlled unit need only perform a series of controls starting from receipt of the substrate placed on the entrance substrate placement unit and being completed by placing the substrate on the exit substrate placement unit. That is, it is not necessary to consider the movement of the main transport mechanism of the adjacent controlled unit. Therefore, the burden on the control means of each controlled unit is reduced, and the throughput of the substrate processing apparatus can be improved. In addition, the number of controlled units can be increased or decreased relatively easily. On the other hand, in the conventional substrate processing apparatus, the operation of determining the operation order of the substrate transport mechanism and each processing unit (scheduling) is complicated because the substrate transport mechanism and each processing unit are centrally controlled. This is one factor that hinders throughput improvement.

  As described above, in the present invention, the control related to substrate transport is performed independently for each controlled unit. That is, in the unit control means of each controlled unit, a transportable condition for determining whether the substrate can be moved in the controlled unit is set in advance, and a transportable condition determination process is performed. A determination process start event, which is a condition for starting, is determined in advance. Each unit control means determines whether or not a transportable condition is satisfied when a determination process start event occurs.

  When the transportable condition is satisfied, the substrate transport in the controlled unit is executed. Specifically, the main transport mechanism receives the substrate placed on the entrance substrate placement unit of the controlled unit, transports it to the required processing unit, and the substrate already processed in the processing unit. Is moved to the next processing section. The substrate that has been subjected to all necessary processing in the controlled unit is placed on the exit substrate mounting portion of the controlled unit. On the other hand, when the transportable condition is not satisfied, the transportable condition determination process is performed in the same manner as described above after waiting for the next determination process start event.

  As described above, according to the present invention, when a controlled process start event occurs individually for each controlled unit, it is determined that the transportable condition is satisfied, and the substrate is transferred within the controlled unit. Thus, the substrate transfer control of each controlled unit does not need to consider the substrate transfer status of the adjacent controlled unit. Therefore, even if there are a large number of controlled units constituting the substrate processing apparatus, it is possible to easily perform the control related to the substrate conveyance. In addition, even if the substrate processing time in a controlled unit is changed or a new controlled unit is added, it is not necessary to change the substrate transfer control of the controlled unit adjacent to it. A high substrate processing apparatus can be realized.

  Furthermore, according to the present invention, the substrates are sequentially transported when the transportable condition of each controlled unit is established, so that the conventional device transports the substrates by “tact operation” at predetermined time intervals. The throughput of the substrate processing apparatus can be improved as compared with a substrate transporting apparatus.

  In the present invention, preferably, the transportable condition is at least: (a) a substrate is placed on the entrance substrate mounting portion, (b) no substrate is placed on the exit substrate placement portion, and (c) transport. The condition is that all the conditions that the processing unit on the path is in a state where the substrate can be replaced are satisfied (the invention according to claim 2).

  If the substrate transport in the controlled unit is executed when such a transportable condition is satisfied, the substrate will not stagnate in the controlled unit. In other words, the substrate placed on the entrance substrate placement unit is transported to the next processing unit on the transport path and replaced with the processed substrate, and the processed substrate is transported to the next necessary processing unit, Similarly, it can be replaced with a processed substrate. Then, the substrate that has been subjected to all the processes necessary for the controlled unit is placed on the exit substrate mounting portion.

  Incidentally, as a condition that can be transported, only (a) that the substrate is placed on the entrance substrate mounting section, the condition is that the processing section on the transport path is not in a state where the substrate can be replaced. First, the substrate placed on the entrance substrate placement unit is transferred to the processing unit. Then, the substrate is kept in a state of being held by the main transport mechanism until the processing unit can replace the substrate. Such a waiting state may adversely affect the substrate. For example, if heat transfer occurs between the substrate and the main transport mechanism during the waiting time and the temperature of the main transport mechanism rises, the heat is transmitted from the main transport mechanism to the subsequent substrate, causing variations in the substrate temperature. May cause. Of course, if such waiting for processing does not become a problem, only the condition (a) may be set as the transportable condition.

  Instead of the above condition (a), it is assumed that (a1) it is predicted that a substrate is placed on the entrance substrate mounting portion (the invention according to claim 3), or (b) (B1) It is assumed that there is no substrate in the exit substrate mounting part (the invention according to claim 4), or in place of the condition (c), (C1) When the main transport mechanism transfers the substrate before the processing unit on the transport path, the processing unit may be predicted to be in a state where the substrate can be replaced (claim). Item 5).

  If such “prediction” is performed, the main transport mechanism is ready for substrate transport in anticipation that the conditions of (a), (b), and (c) of claim 2 will be established in the near future. Can do. For example, the main transport mechanism can start moving toward the entrance substrate placement unit in anticipation of the substrate being placed on the entrance substrate placement unit. As a result, the efficiency of substrate transfer is improved, and the throughput of the substrate processing apparatus can be further improved.

  Further, in the present invention, in place of the condition (a), (a2) in order to wait for the substrate to be placed on the entrance substrate placement unit or to wait for the substrate to be placed on the entrance substrate placement unit. It is a condition that a predetermined waiting time has passed (invention of claim 6), or in place of the condition of (a), (a3) a substrate is placed on the entrance substrate mounting portion. It is also preferable that a predetermined waiting time elapses in order to wait for the substrate to be placed on the entrance substrate mounting portion. Invention).

  If the substrate transfer in the controlled unit is executed when the predetermined standby time has elapsed as described above, the following advantages are obtained. For example, when the substrate supply to the substrate processing apparatus is temporarily interrupted in order to switch the lot of the substrate group to be processed, the main transfer mechanism places the entrance substrate placement if the above standby time is not set. It will wait for a long time for the substrate to be placed on the part. If it does so, the board | substrate already processed in the to-be-controlled unit will not be sent to the following process part (or adjacent to-be-controlled unit), and the throughput of a substrate processing apparatus will fall. By setting the waiting time, it is possible to avoid waiting for a long time for the main transport mechanism to place the substrate on the entrance substrate mounting portion, and it is possible to prevent the throughput of the substrate processing apparatus from being lowered. .

  When a substrate is received by a certain controlled unit, necessary processing is performed on the substrate, and the time until the substrate is dispensed to the next controlled unit is the cycle time of the controlled unit, The waiting time is set to be equal to or longer than the maximum cycle time that is the cycle time of the controlled unit having the longest cycle time among the plurality of controlled units constituting the substrate processing apparatus. Is preferable (invention of claim 8).

  By setting the waiting time as described above, it is possible to avoid a situation in which a substrate placed on the entrance substrate mounting unit is unnecessarily long during normal operation in which a group of substrates are continuously inserted without interruption. can do.

  More preferably, the waiting time is set to a time substantially equal to the maximum cycle time (the invention according to claim 9).

  If the standby time is set as described above, the substrate placed on the entrance substrate mounting portion is not kept waiting for an unnecessarily long time during normal operation. The substrate transfer efficiency can be further increased without waiting for an unnecessarily long time for the substrate to be placed on the substrate platform.

  In the present invention, the determination process start event is, for example, predicted that (a) a substrate is placed on the entrance substrate placement portion, (a) a substrate is placed on the entrance substrate placement portion, C) The processing unit on the transfer path is in a state where the substrate can be replaced, (d) the substrate on the exit substrate mounting unit is dispensed, and (e) the substrate on the exit substrate mounting unit is dispensed. And (f) any one of the events that the substrate can be transferred to the processing unit that has been stopped (the invention according to claim 10).

  By using the event as described above as the determination process start event, the transportable condition is determined at an appropriate timing, and thus the throughput of the substrate processing apparatus can be increased.

  In the present invention, it is preferable that the inlet substrate mounting portion includes a feeding inlet substrate mounting portion used for transporting the substrate in a forward direction between the controlled units and a substrate extending between the controlled units. A return inlet substrate mounting portion used for transporting the substrate in the reverse direction, and the outlet substrate mounting portion is used for transporting the substrate in the forward direction between the controlled units. A placement unit and a return exit substrate placement unit that is used when the substrate is transported in the opposite direction between the controlled units. It is determined whether the event is an event related to the forward transfer or the event related to the reverse transfer, and if the event is an event related to the forward transfer, the forward transfer enable condition It is determined whether or not the condition is satisfied, and when the transfer enabling condition is satisfied, the forward substrate transfer is executed, and when the event is an event related to the reverse transfer, the reverse transfer is performed. It is determined whether or not the transportable condition is satisfied. When the transportable condition is satisfied, the substrate transport in the reverse direction is executed (the invention according to claim 11).

  With this configuration, the substrate can be transferred efficiently in both directions without interfering with the forward substrate transfer and the reverse substrate transfer, thereby improving the throughput of the substrate processing apparatus. it can.

  In the present invention, it is preferable that at least one controlled unit among the plurality of controlled units includes the feeding inlet substrate mounting unit, the return inlet substrate mounting unit, and the feeding unit. In addition to the exit substrate placement portion and the return exit substrate placement portion, another entrance substrate placement portion and an exit substrate placement portion are provided (the invention according to claim 12).

  If comprised in this way, since a board | substrate can be delivered between another controlled unit via another entrance substrate mounting part and an exit substrate mounting part, arrangement | positioning of a controlled unit group The degree of freedom increases.

  According to the present invention, each controlled unit individually determines whether or not the transportable condition is satisfied when the determination processing start event occurs, and executes the substrate transport in the controlled unit. Even when there are a large number of controlled units constituting the substrate processing apparatus, it is easy to control the substrate transport, and a highly versatile substrate processing apparatus can be realized. Furthermore, according to the present invention, each controlled unit executes substrate transport based on the establishment of each transportable condition, so that the throughput of the substrate processing apparatus can be improved.

Embodiments of the present invention will be described below with reference to the drawings.
1 is a plan view of a substrate processing apparatus according to an embodiment, FIG. 2 is a front view thereof, and FIG. 3 is a front view of a heat treatment section.

Here, a substrate processing apparatus that applies an antireflection film or a photoresist film to a semiconductor wafer (hereinafter simply referred to as a “substrate”) and performs chemical processing such as development processing on the exposed substrate is taken as an example. explain. Of course, the substrate which can be handled by the substrate processing apparatus according to the present invention is not limited to a semiconductor wafer, but includes various substrates such as a glass substrate for a liquid crystal display. Further, the chemical processing is not limited to coating formation processing such as a photoresist film and development processing, but includes various chemical processing.
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Please refer to FIG. The substrate processing apparatus according to the present embodiment is roughly divided into an indexer block 1 and three processing blocks (specifically, an antireflection film processing block 2 and a resist film processing block) for performing a required chemical liquid processing on the substrate. 3 and a development processing block 4) and an interface block 5, and these blocks are arranged side by side. The interface block 5 is provided with an exposure apparatus (stepper) STP which is an external apparatus separate from the substrate processing apparatus according to this embodiment. These blocks 1 to 5 are elements obtained by mechanically dividing the substrate processing apparatus according to this embodiment. Specifically, each block is assembled to an individual block frame (frame body), and the substrate processing apparatus is configured by connecting the block frames (see FIG. 8A).

On the other hand, as one of the features of the substrate processing apparatus according to the present embodiment, the unit of the controlled unit related to substrate conveyance is configured separately from each block which is a mechanical element. That is, a single controlled unit is configured including a processing unit that performs a required process on a substrate and a single main transport mechanism that transfers the substrate to the processing unit, and the controlled units are arranged in parallel. And a substrate processing apparatus is configured. Each controlled unit has an entrance substrate placement section for placing a substrate to receive the substrate in the controlled unit, and an exit substrate placement section for placing a substrate to eject the substrate from the controlled unit And are provided separately. Then, the main transfer mechanism of each controlled unit transfers the substrates to each other via the inlet substrate mounting portion and the outlet substrate mounting portion, and performs the substrate transfer operation of the main transfer mechanism of each controlled unit. At least unit control means for controlling is provided for each controlled unit, and each unit control means performs control related to a series of substrate transport including delivery of the substrate to the processing unit and delivery of the substrate to the substrate mounting unit, respectively. It is supposed to be done independently.
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Hereinafter, the unit of the controlled unit in the apparatus of this embodiment is referred to as a “cell”. FIG. 8B shows the arrangement of the cells constituting the control system of the embodiment apparatus. In the figure, C1 is an indexer cell, C2 is an antireflection film processing cell, C3 is a resist film processing cell, C4 is a development processing cell, C5 is a post-exposure heating processing cell, and C6 is an interface cell.

  In the following, for convenience of explanation, the configuration of the embodiment apparatus will be described for each block, the correspondence between the blocks 1 to 5 and the cells C1 to C6 will be described, and finally the substrate transfer control in the embodiment apparatus. Will be described.

  First, the indexer block 1 will be described. The indexer block 1 is a mechanism for taking out the substrates from the cassette C that stores the substrates W in multiple stages and storing the substrates W in the cassette C. Specifically, the cassette mounting table 6 on which a plurality of cassettes C are placed side by side, and an indexer for sequentially taking out unprocessed substrates W from each cassette C and storing processed substrates W in each cassette C in order. And a transport mechanism 7. The indexer transport mechanism 7 includes a movable table 7a that can move horizontally along the cassette mounting table 6 (in the Y direction). A holding arm 7b for holding the substrate W in a horizontal posture is mounted on the movable table 7a. The holding arm 7b is configured to move up and down (Z direction) on the movable table 7a, to turn in a horizontal plane, and to move back and forth in the turning radius direction.

  An antireflection film processing block 2 is provided adjacent to the indexer block 1 described above. As shown in FIG. 4, an atmosphere blocking partition wall 13 is provided between the indexer block 1 and the antireflection film processing block 2. Two substrate platforms PASS1 and PASS2 on which the substrate W is placed in order to transfer the substrate W between the indexer block 1 and the antireflection film processing block 2 are provided on the partition wall 13 close to each other in the vertical direction. Yes.

  The upper substrate platform PASS1 dispenses the substrate W from the indexer block 1 to the antireflection film processing block 2, and the lower substrate platform PASS2 transfers the substrate W from the antireflection film processing block 2 to the indexer block 1. Each is provided to return. Speaking on the basis of the antireflection film processing block 2, the substrate platform PASS1 corresponds to an entrance substrate platform for receiving the substrate W in the antireflection film processing block 2. In particular, when the transport direction of the substrate W flowing from the indexer block 1 toward the exposure apparatus STP is the forward direction, the substrate platform PASS1 uses the feeding entrance substrate mounting used when transporting the substrate W in the forward direction. It corresponds to the placement part. On the other hand, the substrate platform PASS2 is an exit substrate platform for delivering the substrate W from the antireflection film processing block 2, and in particular, the substrate W is moved in the reverse direction (in this embodiment, from the exposure apparatus STP to the indexer block). This corresponds to a return exit substrate mounting portion used when transporting in the transport direction of the substrate W flowing toward 1).

  The substrate platforms PASS1 and PASS2 are provided so as to partially penetrate the partition wall 13. The substrate platforms PASS1 and PASS2 are composed of a plurality of support pins fixedly installed, and this is the same for the other substrate platforms PASS3 to PASS10 described later. The substrate platforms PASS1 and PASS2 are provided with optical sensors (not shown) that detect the presence / absence of the substrate W. Based on the detection signals of the sensors, the indexer transport mechanism 7 and antireflection described later. The first main transport mechanism 10A of the film processing block 2 determines whether or not the substrate can be delivered to the substrate platforms PASS1 and PASS2. Similar sensors are also provided in the other substrate platforms PASS3 to PASS10.

  The antireflection film processing block 2 will be described. The antireflection film processing block 2 is a mechanism for applying and forming an antireflection film below the photoresist film in order to reduce standing waves and halation generated during exposure. Specifically, an antireflection film application processing unit 8 for applying an antireflection film on the surface of the substrate W, and an antireflection film heat treatment unit 9 for heat-treating the substrate W in connection with the formation of the antireflection film, And a first main transport mechanism 10A for delivering the substrate W to the antireflection film application processing unit 8 and the antireflection film heat treatment unit 9.

  In the antireflection film processing block 2, the antireflection film coating processing unit 8 and the antireflection film heat treatment unit 9 are arranged to face each other with the first main transport mechanism 10 </ b> A interposed therebetween. Specifically, the coating treatment unit 8 is located on the front side of the apparatus, and the heat treatment unit 9 is located on the rear side of the apparatus. The point that the chemical solution processing unit and the heat processing unit are arranged to face each other across the main transport mechanism is the same in the other resist film processing block 3 and the development processing block 4. With such an arrangement, the chemical treatment unit and the heat treatment unit are separated from each other, so that the thermal influence on the chemical treatment unit from the heat treatment unit can be suppressed. In this embodiment, a thermal partition (not shown) is provided on the front side of the heat treatment part 9 to avoid thermal influence on the antireflection film coating treatment part 8. Similar thermal partition walls are provided in the other resist film processing block 3 and the development processing block 4.

  As shown in FIG. 2, the antireflection film application processing unit 8 includes three antireflection film application processing units 8 a to 8 c having the same configuration (hereinafter, indicated by reference numeral “8” unless otherwise distinguished). Are stacked in a vertical direction. Each coating processing unit 8 includes a spin chuck 11 that rotates while adsorbing and holding the substrate W in a horizontal posture, a nozzle 12 that supplies a coating liquid for an antireflection film onto the substrate W held on the spin chuck 11, and the like. It has.

  As shown in FIG. 3, the antireflection film heat treatment section 9 includes a plurality of heating plates HP for heating the substrate W to a predetermined temperature, and a plurality of cooling plates CP for cooling the heated substrate W to room temperature. In order to improve the adhesion between the resist film and the substrate W, a heat treatment part such as a plurality of adhesion treatment parts AHL for heat treating the substrate W in a vapor atmosphere of HMDS (hexamethyldisilazane) is included. A heater controller (CONT) is disposed at the lower part of these heat treatment parts 9, and a pipe wiring part and a spare space are provided at the upper part of the heat treatment part 9 (the portion indicated by “x” in FIG. 3). Space is allocated.

  The antireflection film heat treatment section 9 is configured by arranging the respective heat treatment sections (HP, CP, AHL) in a vertical stack, and a plurality of examples of a group of heat treatment sections arranged in layers (in this embodiment, two rows). ). The point that the chemical processing parts are stacked in the vertical direction and the group of heat processing parts that are stacked in the vertical direction are arranged in parallel in a plurality of rows also in the other resist film processing block 3 and the development processing block 4 It is the same.

  As described above, the chemical processing section and the heat treatment section are stacked one above the other in each processing block 2 to 4, thereby reducing the space occupied by the substrate processing apparatus. In addition, by arranging a group of heat treatment parts arranged in a stack over a plurality of rows, maintenance of the heat treatment part becomes easy, and it is not necessary to extend duct piping and power supply equipment necessary for the heat treatment part to a very high position. There is an advantage.

  The first main transport mechanism 10A will be described. The second, third, and fourth main transport mechanisms 10B, 10C, and 10D provided in the other resist film processing block 3, the development processing block 4, and the interface block 5 described later are configured in the same manner. ing. Hereinafter, the first to fourth main transport mechanisms 10 </ b> A to 10 </ b> D will be described as the main transport mechanism 10 when they are not particularly distinguished.

  Please refer to FIG. FIG. 4A is a plan view of the main transport mechanism 10 and FIG. The main transport mechanism 10 includes two holding arms 10a and 10b that hold the substrate W in a horizontal posture in close proximity to each other. The holding arms 10a and 10b have a "C" shape in plan view in a plan view, and a plurality of pins 10c projecting inward from the inside of the "C" -shaped arm. The peripheral edge is supported from below. The base 10d of the main transport mechanism 10 is fixedly installed with respect to the apparatus base. A screw shaft 10e is rotatably supported on the base 10d. A motor 10f that rotationally drives the screw shaft 10e is provided on the base 10d. The lifting platform 10g is screwed to the screw shaft 10e, and the motor 10f rotationally drives the screw shaft 10e so that the lifting table 10g is guided up and down by the guide shaft 10j. An arm base 10h is mounted on the lifting platform 10g so as to be pivotable about the vertical axis. The lifting platform 10g is provided with a motor 10i that drives the arm base 10h to rotate. The above-mentioned two holding arms 10a and 10b are arranged above and below on the arm base 10h. Each holding arm 10a, 10b is configured to be able to move forward and backward independently in the turning radius direction of the arm base 10h by a drive mechanism (not shown) provided in the arm base 10h.

  A resist film processing block 3 is provided adjacent to the antireflection film processing block 2 described above. As shown in FIG. 4, an atmosphere blocking partition 13 is also provided between the antireflection film processing block 2 and the resist film processing block 3. Two substrate platforms PASS3 and PASS4 for transferring the substrate W between the antireflection film processing block 2 and the resist film processing block 3 are provided on the partition wall 13 close to each other in the vertical direction.

  As in the case of the above-described substrate platforms PASS1 and PASS2, the upper substrate platform PASS3 is used for dispensing the substrate W, and the lower substrate platform PASS4 is used for returning the substrate W. The substrate platforms PASS 3 and PASS 4 partially penetrate the partition wall 13. Here, the substrate platform PASS3 corresponds to the sending exit substrate platform if the antireflection film processing block 2 is used as a reference, and the sending entrance substrate if the resist film processing block 3 is used as a reference. It corresponds to the mounting part. Further, the substrate platform PASS4 corresponds to the return entrance substrate platform if the antireflection film processing block 2 is used as a reference, and the return exit substrate mount if the resist film processing block 3 is used as a reference. It corresponds to the placement part. Below these substrate platforms PASS3 and PASS4, two water-cooled cooling plates WCP are provided above and below the partition wall 13 to roughly cool the substrate W.

  The resist film processing block 3 will be described. The resist film processing block 3 is a mechanism for applying and forming a photoresist film on the substrate W on which an antireflection film has been applied. In this embodiment, a chemically amplified resist is used as the photoresist. The resist film processing block 3 includes a resist film coating processing unit 15 that coats and forms a photoresist film on a substrate W on which an antireflection film is coated, and a resist that heat-treats the substrate in connection with the coating formation of the photoresist film. A film heat treatment section 16 and a second main transport mechanism 10B for delivering the substrate W to the resist film coating treatment section 15 and the resist film heat treatment section 16 are provided.

  As shown in FIG. 2, the resist film coating processing unit 15 moves up and down three resist film coating processing units 15 a to 15 c (hereinafter denoted by reference numeral “15” unless otherwise distinguished). Are arranged in a stacked manner. Each coating processing unit 15 includes a spin chuck 17 that rotates while adsorbing and holding the substrate W in a horizontal posture, a nozzle 18 that supplies a coating liquid for a resist film onto the substrate W held on the spin chuck 17, and the like. I have.

  As shown in FIG. 3, the resist film heat treatment section 16 includes a plurality of heating sections PHP with a temporary substrate placement section that heats the substrate W to a predetermined temperature, and a plurality of cooling sections that cool the substrate W to room temperature with high accuracy. A heat treatment part such as a single cooling plate CP is included. The points where the heat treatment parts are stacked one above the other and arranged in parallel are the same as in the case of the anti-reflection film processing block 2.

  A heating unit PHP with a temporary substrate placement unit will be described. Please refer to FIG. The figure (a) is a fracture | rupture side view of the heating part PHP, (b) is a fracture | rupture top view. The heating unit PHP places the substrate W on the heating plate HP on which the substrate W is placed and performs heat treatment, and the upper position or the lower position (upward position in the present embodiment) away from the heating plate HP. A substrate temporary placement unit 19 and a local transport mechanism 20 for a heat treatment unit that transports the substrate W between the heating plate HP and the substrate temporary placement unit 19 are provided. The heating plate HP is provided with a plurality of movable support pins 21 that appear and disappear on the plate surface. Above the heating plate HP, there is provided an upper lid 22 that can be raised and lowered to cover the substrate W during the heat treatment. The temporary substrate placement portion 19 is provided with a plurality of fixed support pins 23 that support the substrate W.

  The local transport mechanism 20 includes a holding plate 24 that holds the substrate W in a horizontal posture. The holding plate 24 is moved up and down by a screw feed drive mechanism 25 and moved forward and backward by a belt drive mechanism 26. Yes. The holding plate 24 is formed with a plurality of slits 24 a so as not to interfere with the movable support pin 21 and the fixed support pin 23 when the holding plate 24 advances above the heating plate HP and the temporary substrate placement unit 19. The local transport mechanism 20 includes means for cooling the substrate in the process of transporting the substrate W from the heating plate HP to the temporary substrate placement unit 19. This cooling means is configured, for example, by providing a cooling water channel 24b inside the holding plate 24 and circulating the cooling water through the cooling water channel 24b.

  The local transport mechanism 20 described above is installed on the opposite side of the second main transport mechanism 10B, that is, on the back side of the apparatus, with the heating plate HP and the temporary substrate placement part 19 in between. An opening 19a that allows the second main transport mechanism 10B to enter the front side of the upper portion of the casing 27 that covers the heating plate HP and the temporary substrate placement portion 19, that is, the portion that covers the temporary substrate placement portion 19 is provided. However, an opening 19b that allows the local transport mechanism 20 to enter is provided on the back side thereof. Further, a lower part of the casing 27, that is, a part covering the heating plate HP is closed on the front side, and an opening 19c that allows entry of the local transport mechanism 20 is provided on the rear side.

  The substrate W is taken in and out of the heating unit PHP as described above. First, the main transport mechanism 10 (second main transport mechanism 10B in the case of the resist film processing block 3) holds the substrate W and places the substrate W on the fixed support pins 23 of the temporary substrate placement section 19. Put. Subsequently, the substrate W is received from the fixed support pins 23 by slightly rising after the holding plate 24 of the local transport mechanism 20 enters the lower side of the substrate W. The holding plate 24 holding the substrate W is withdrawn from the housing 27 and lowered to a position facing the heating plate HP. At this time, the movable support pin 21 of the heating plate HP is lowered and the upper lid 22 is raised. The holding plate 24 holding the substrate W advances above the heating plate HP. After the movable support pin 21 rises and receives the substrate W, the holding plate 24 is retracted. Subsequently, the movable support pins 21 are lowered to place the substrate W on the heating plate HP, and the upper lid 22 is lowered to cover the substrate W. In this state, the substrate W is heated. When the heat treatment is finished, the upper lid 22 rises and the movable support pin 21 rises to lift the substrate W. Subsequently, after the holding plate 24 advances below the substrate W, the movable support pin 23 descends, whereby the substrate W is delivered to the holding plate 24. The holding plate 24 holding the substrate W is withdrawn and further lifted to transport the substrate W to the temporary substrate placement unit 19. The substrate W supported by the holding plate 24 in the temporary substrate placement unit 19 is cooled by the cooling function of the holding plate 24. The holding plate 24 transfers the cooled substrate W (returned to room temperature) onto the fixed support pins 23 of the temporary substrate placement unit 19. The main transport mechanism 10 takes out and transports the substrate W.

  As described above, the main transport mechanism 10 only delivers the substrate W to the temporary substrate placement unit 19 and does not deliver the substrate to the heating plate HP, so the temperature of the main transport mechanism 10 rises. Can be avoided. Further, since the opening 19c for putting the substrate W in and out of the heating plate HP is located on the side opposite to the side on which the main transport mechanism 10 is disposed, the main transport is performed in a thermal atmosphere leaking from the opening 19c. The temperature of the mechanism 10 does not increase, and the resist film coating processing unit 15 is not adversely affected by the heat atmosphere leaked from the opening 19c.

  A development processing block 4 is provided adjacent to the resist film processing block 3 described above. As shown in FIG. 4, a partition wall 13 is provided between the resist film processing block 3 and the development processing block 4. The partition wall 13 is provided between the processing blocks 3 and 4. Two substrate platforms PASS5, 6 for delivery and two water-cooled cooling plates WCP are provided in a stacked manner in order to roughly cool the substrate W. Here, the substrate platform PASS5 corresponds to the delivery exit substrate platform if the resist film processing block 3 is used as a reference, and the delivery entrance substrate placement is described based on the development processing block 4. It corresponds to the part. Further, the substrate platform PASS6 corresponds to the return entrance substrate platform when the resist film processing block 3 is used as a reference, and the return exit substrate platform when the development processing block 4 is used as a reference. It corresponds to.

  The development processing block 4 will be described. The development processing block 4 is a mechanism for performing development processing on the exposed substrate W. Specifically, with respect to the development processing unit 30 that performs development processing on the exposed substrate W, the development heat treatment unit 31 that heat-treats the substrate in relation to the development processing, and the development processing unit 30 and the development heat treatment unit 31 And a third main transport mechanism 10C for delivering the substrate W.

  As shown in FIG. 2, the development processing unit 30 is configured by stacking five development processing units 30a to 30e (hereinafter denoted by reference numeral “30” unless otherwise specified) having the same configuration. Has been. Each development processing unit 30 includes a spin chuck 32 that rotates by adsorbing and holding the substrate W in a horizontal posture, a nozzle 33 that supplies a developer onto the substrate W held on the spin chuck 32, and the like.

  As shown in FIG. 3, the development heat treatment section 31 includes heat treatment sections such as a plurality of heating plates HP, a heating section PHP with a temporary substrate placement section, and a cooling plate CP. The points where the heat treatment units are stacked one above the other and arranged in parallel are the same as in the other processing blocks 2 and 3. In order to transfer the substrate W between the development processing block 4 and the interface block 5 adjacent to the development processing block 4 in the row of the thermal processing units on the right side (side adjacent to the interface block 5) of the development thermal processing unit 31. These two substrate platforms PASS7 and PASS8 are provided close to each other in the vertical direction. The upper substrate platform PASS7 is for dispensing the substrate W, and the lower substrate platform PASS8 is for returning the substrate W. Here, the substrate platform PASS7 corresponds to the delivery outlet substrate platform if the development processing block 4 is used as a reference, and the delivery platform substrate placement unit if the interface block 5 is used as a reference. Equivalent to. Further, the substrate platform PASS8 corresponds to a return entrance substrate platform if the development processing block 4 is used as a reference, and corresponds to a return exit substrate platform if the interface block 5 is used as a reference. To do.

  The interface block 5 will be described. The interface block 5 is a mechanism for delivering the substrate W to the exposure apparatus STP, which is an external apparatus separate from the substrate processing apparatus. In addition to the interface transport mechanism 35 for transferring the substrate W to and from the exposure apparatus STP, the interface block 5 in this embodiment apparatus exposes the peripheral portion of the substrate W coated with the photoresist 2. And a fourth main transport mechanism 10D that delivers the substrate W to the edge exposure unit EEW and the thermal processing unit PHP with a temporary substrate placement unit disposed in the development processing block 4 and the edge exposure unit EEW. .

  As shown in FIG. 2, the edge exposure unit EEW has a spin chuck 36 that rotates by sucking and holding the substrate W in a horizontal posture, and a light irradiator 37 that exposes the periphery of the substrate W held on the spin chuck 36. Etc. The two edge exposure portions EEW are stacked in the vertical direction at the center of the interface block 5. The fourth main transport mechanism 10D disposed adjacent to the edge exposure unit EEW and the heat processing unit of the development processing block 4 has the same configuration as the main transport mechanism 10 described in FIG.

  Please refer to FIG. 2 and FIG. FIG. 5 is a side view of the interface block 5. A substrate return buffer RBF is provided below the two edge exposure units EEW, and two substrate platforms PASS9 and PASS10 are stacked on the lower side. When the development processing block 4 cannot perform the development processing of the substrate W due to a failure or the like, the buffer RBF for returning the substrate is subjected to the heat treatment after the exposure by the heating unit PHP of the development processing block 4. The substrate W is temporarily stored and stored. The buffer RBF is composed of a storage shelf that can store a plurality of substrates W in multiple stages. The substrate platforms PASS9 and PASS10 are used to transfer the substrate W between the fourth main transport mechanism 10D and the interface transport mechanism 35, and the upper side is for substrate feeding and the lower side is for substrate return. ing.

  As shown in FIGS. 1 and 5, the interface transport mechanism 35 includes a movable table 35a that can move horizontally in the Y direction, and a holding arm 35b that holds the substrate W is mounted on the movable table 35a. The holding arm 35b is configured to be capable of moving up and down, turning, and moving forward and backward in the turning radius direction. One end (position P1 shown in FIG. 5) of the transport path of the interface transport mechanism 35 extends to below the stacked substrate platforms PASS9 and PASS10, and between this position P1 and the exposure apparatus STP. Deliver the substrate W. At the other end position P2 of the transport path, the substrate W is transferred to the substrate platforms PASS9 and PASS10, and the substrate W is stored and taken out from the sending buffer SBF. The sending buffer SBF temporarily stores and stores the substrate W before the exposure processing when the exposure apparatus STP cannot accept the substrate W, and includes a storage shelf that can store a plurality of substrates W in multiple stages. ing.

  In the substrate processing apparatus configured as described above, clean air is supplied to the indexer block 1, the processing blocks 2, 3, 4, and the interface block 5 in a downflow state. Avoids adverse effects on the process caused by hoisting and airflow. In addition, the inside of each block is kept at a slightly positive pressure with respect to the external environment of the apparatus to prevent intrusion of particles and contaminants from the external environment. In particular, the air pressure in the antireflection film processing block 2 is set to be higher than the air pressure in the index block 1. As a result, the atmosphere in the indexer block 1 does not flow into the anti-reflection film processing block 2, so that the processing blocks 2, 3, and 4 can perform processing without being affected by the external atmosphere.

  Next, each of the above-described blocks 1 to 5 which are elements obtained by mechanically dividing the substrate processing apparatus according to the present embodiment, and each controlled unit (cell) C1 to C6 which is a unit of control in the present embodiment apparatus. The relationship will be described.

  The indexer cell C1 includes a cassette mounting table 6 and an indexer transport mechanism 7. The cell C1 has the same configuration as the indexer block 1 which is a mechanically divided element as a result. The antireflection film processing cell C2 includes an antireflection film application processing unit 8, an antireflection film heat treatment unit 9, and a first main transport mechanism 10A. The cell C2 also has the same configuration as the antireflection film processing block 2 which is a mechanically divided element. The resist film processing cell C3 includes a resist film coating processing unit 15, a resist film heat treatment unit 16, and a second main transport mechanism 10B. The cell C3 also has the same configuration as the resist film processing block 3 which is a mechanically divided element.

  On the other hand, the development processing cell C4 includes the development processing unit 30, the development heat treatment unit 31 excluding the heat treatment unit (heating unit PHP in the embodiment) used for post-exposure heating, and the third main transport mechanism 10C. Including. The cell C3 is different from the development processing block 4 which is a mechanically divided element in that it does not include a heating part PHP used for post-exposure heating.

  The post-exposure heating processing cell C5 includes a post-exposure heating heat treatment section (in the embodiment, a heating section PHP provided in the development processing block 4) that heat-treats the exposed substrate W before development, and an edge exposure section. EEW and the fourth main transport mechanism 10D are included. The cell C5 extends over the development processing block 4 and the interface block 5 which are mechanically divided elements, and is a characteristic cell of the apparatus of this embodiment. As described above, since one cell is configured including the heat treatment section (heating section PHP) for post-exposure heating and the fourth main transport mechanism 10D, the exposed substrate is quickly carried into the heating section PHP. Heat treatment can be performed. This is suitable when a chemically amplified photoresist that requires rapid heating after exposure is used.

  The above-described substrate platforms PASS7 and PASS8 transfer the substrate W between the third main transport mechanism 10C of the development processing cell C4 and the fourth main transport mechanism 10D of the post-exposure heating processing cell C5. Intervene in. Here, the substrate platform PASS7 corresponds to the feed exit substrate platform if the development cell C4 is used as a reference, and the feed entrance substrate if the post-exposure heating cell C5 is used as a reference. It corresponds to the mounting part. Further, the substrate platform PASS8 corresponds to a return inlet substrate platform if the development processing cell C4 is used as a reference, and the return exit substrate mounting if the post-exposure heating processing cell C5 is used as a reference. It corresponds to the placement part.

  The interface cell C6 includes an interface transport mechanism 35 that delivers the substrate W to the exposure apparatus STP that is an external apparatus. The cell C6 is different from the interface block 5 which is a mechanically divided element in that it does not include the fourth main transport mechanism 10D and the edge exposure unit EEW. The substrate platforms PASS9 and PASS10 described above are interposed in the transfer of the substrate W between the fourth main transport mechanism 10D of the post-exposure heating processing cell C5 and the interface transport mechanism 35. Here, the substrate platform PASS9 corresponds to a feed exit substrate platform if the post-exposure heating processing cell C5 is used as a reference, and the feed entrance substrate substrate is used if the interface cell C6 is used as a reference. It corresponds to the placement part. Further, the substrate platform PASS10 corresponds to a return entrance substrate platform when the post-exposure heating processing cell C5 is used as a reference, and a return exit substrate platform when the interface cell C6 is used as a reference. It corresponds to the part.

  The apparatus according to the present embodiment is configured by arranging the six cells C1 to C6 described above in parallel, and the transfer of the substrate between the cells C1 to C6 is performed via the substrate platforms PASS1 to PASS10. In other words, a single controlled unit (cell) according to the present invention includes a single main transport mechanism, and the main transport mechanism receives a substrate received from a specific entrance substrate mounting section as a specific exit substrate mounting. It is configured to include a processing unit that delivers a substrate before it is placed on the mounting unit.

  As shown in FIG. 9A, the cells C1 to C6 are cell controllers (units) that at least control the substrate transfer operation of the main transport mechanism (including the indexer transport mechanism 7 and the interface transport mechanism 35) of each cell. Control means) CT1 to CT6 are provided individually. Each of the cell controllers CT1 to CT6 independently starts a series of controls starting from receiving a substrate placed on a predetermined entrance substrate placement unit and being completed by placing the substrate on the predetermined exit substrate placement unit. To do. Specifically, the cell controllers CT1 to CT6 of the cells C1 to C6 send information that the substrate is placed on a predetermined substrate placement unit to the cell controller of the adjacent cell, and the cell controller CT1 to CT6 receives the substrate. The cell controller exchanges information that information indicating that a substrate has been received from a predetermined substrate platform is returned to the cell controller of the original cell. Such exchange of information is performed via a main controller (main control means) MC that is connected to the cell controllers CT1 to CT6 and collectively manages them. The main controller MC is configured to be able to communicate with a host computer HC that manages the entire semiconductor manufacturing process in which the substrate processing apparatus according to this embodiment is installed. The substrate processing conditions in the cells C1 to C6 are collected by the main controller MC via the cell controllers CT1 to CT6 and transmitted to the host computer HC. As a result, the state of each of the cells C1 to C6 can be easily grasped by the host computer HC.

  Each of the cell controllers CT1 to CT6 advances the control only for the transfer of the substrate in each cell without considering the movement of the main transport mechanism in the adjacent cells. Therefore, the control burden on each of the cell controllers CT1 to CT6 is reduced. On the other hand, according to the control method of the conventional substrate processing apparatus, as shown in FIG. 9B, each of the blocks 1 to 5 gives information related to substrate transport to the controller CT0 for schedule management of the substrate processing. Since the controller CT0 comprehensively manages the substrate conveyance, the burden on the controller CT10 increases.

  As described above, according to this embodiment, the control burden on the controllers CT1 to CT6 of each cell is reduced, so that the throughput of the substrate processing apparatus can be improved accordingly. In addition, according to the conventional control method shown in FIG. 9B, when a processing unit is newly added, it is necessary to significantly modify the schedule management program of the controller CT0. Therefore, even if a new cell is added, the adjacent cells are not affected, so that the cell can be easily added. The type of cell to be added is not particularly limited. For example, the thickness of the resist film applied to the substrate W is inspected between the resist film processing cell C3 and the development processing cell C4, or the developed resist film. An inspection cell for inspecting the line width may be added. In this case, the inspection cell includes a substrate inspection unit that inspects the substrate and a main conveyance mechanism for substrate inspection that conveys the substrate to the inspection unit, as in the other cells of the apparatus of the present embodiment. Composed. Further, the transfer of the substrate between the inspection cell and the adjacent cell is performed via the inlet substrate mounting portion and the outlet substrate mounting portion.

  Another feature of the substrate processing apparatus according to this embodiment is that the antireflection film processing cell C2, the resist film processing cell C3, and the development processing cell C4, which are controlled units, use the main transport mechanism to transfer the substrate W. When the process of transporting from a specific position to another position is a single process, the first, second, and third main transport mechanisms 10A, 10B, and 10C of the cells C2, C3, and C4 have approximately the same number of transports. The process is borne. Specifically, as will be clarified in the description of the operation of the apparatus according to the present embodiment, which will be described later, as shown in FIG. 10, the main transport mechanisms 10A, 10B, and 10C bear approximately six transport processes.

  In the apparatus of this embodiment, the time required for the main transport mechanism 10 to perform one transport process is about 4 seconds. Accordingly, in each of the cells C2 to C3, the main transport mechanism 10 bears six transport processes, so that each of the cells C2 to C3 moves the substrate W to the adjacent cell at a rate of once every 24 seconds (a processing cycle of 24 seconds). Will be discharged. That is, the apparatus of this embodiment can process 150 substrates W per hour. If the number of transfer processes borne by one main transfer mechanism is larger than that of other main transfer mechanisms, the throughput of the substrate processing apparatus is determined by the processing cycle (cycle time) of the cell to which the main transfer mechanism belongs. Is done. For example, when each of the main transport mechanisms 10A and 10C of the cells C2 and C4 bears five transport processes, and the main transport mechanism 10B of the cell C3 bears eight transport processes, between the cells C2 to C4, the cell C3 Since the substrate W flows only in the processing cycle (32 seconds in this case), even if the main transport mechanisms 10A and 10C of the cells C2 and C4 have room, the substrate processing apparatus has 112.5 substrates per hour. Only the substrate W can be processed.

  On the other hand, in this embodiment apparatus, the main transport mechanisms 10A, 10B, and 10C of the antireflection film processing cell C2, the resist film processing cell C3, and the development processing cell C4 bear substantially the same number of transport processes. Thus, it is possible to avoid any one main transport mechanism from quickly reaching the limit of the transport process, and as a result, the throughput of the substrate processing apparatus can be improved.

  On the other hand, with regard to the post-exposure heating processing cell C5 adjacent to the development processing cell C4, the number of transport steps borne by the fourth main transport mechanism 10D belonging to the cell C5 is set to five. In the post-exposure heating processing cell C5, it is necessary to strictly manage the time from when the substrate W is exposed to when the heating process is performed, so that the transport burden of the fourth main transport mechanism 10D has a margin, The transport burden is set lower than that of other cells. If it is not necessary to allow the fourth main transport mechanism 10D to have a particular margin, the processing cell C5 has a space for one transport process. It is also possible to add a new processing unit, for example, an inspection unit for the substrate W, to the post-exposure heating processing cell C5 by using this empty conveyance process. Even if the substrate inspection unit is added, the main transport mechanism 10D of the cell C5 bears six transport processes like the main transport mechanisms of the other cells. That is, even if a substrate inspection unit is added to the cell C5 having a margin in the transfer process, the processing cycle of the cell C5 is only 24 seconds, which is the same as other cells, so that the throughput of the substrate processing apparatus is reduced. Absent.

  Next, the operation of the substrate processing apparatus according to this embodiment will be described. In particular, refer to FIG. 10 for the respective transport steps by the main transport mechanisms 10A to 10D of the antireflection film processing cell C2, the resist film processing cell C3, the development processing cell C4, and the post-exposure heating processing cell C5. . In the following description, for ease of understanding, a series of substrate flows in each of the cells C1 to C6 will be described first, and then the conditions of transportable conditions for starting substrate transport in each of the cells C1 to C6 are described. The determination process will be described.

  First, the indexer transport mechanism 7 of the indexer cell C1 (indexer block 1) moves horizontally to a position facing a predetermined cassette C. Subsequently, when the holding arm 7b moves up and down and moves forward and backward, the unprocessed substrate W stored in the cassette C is taken out. With the substrate W held by the holding arm 7b, the indexer transport mechanism 7 moves horizontally to a position facing the substrate platforms PASS1 and PASS2. Then, the substrate W on the holding arm 7b is placed on the upper substrate platform PASS1 for delivering the substrate. When the processed substrate W is placed on the lower substrate platform PASS2 for returning the substrate, the indexer transport mechanism 7 receives the processed substrate W on the holding arm 7b, The processed substrate W is stored in the cassette C. Thereafter, similarly, the operation of taking out the unprocessed substrate W from the cassette C and transporting it to the substrate platform PASS1 and receiving the processed substrate W from the substrate platform PASS2 and storing it in the cassette C is repeated.

  The operation of the antireflection film processing cell C2 (antireflection film processing block 2) will be described. When an after-mentioned determination process start event occurs, the cell controller CT2 of the antireflection film processing cell C2 determines whether or not a transportable condition described later is satisfied in the cell C2. Then, if the forward feed condition is satisfied, the forward substrate transfer is executed as follows.

  In order to receive the unprocessed substrate W placed on the substrate platform PASS1 (“feed inlet substrate platform” on the basis of the processing cell C2 for antireflection film), as shown in FIG. The first main transport mechanism 10A of C2 moves the holding arms 10a and 10b integrally up and down and to a position facing the substrate platforms PASS1 and PASS2. Then, the processed substrate W held by one holding arm 10b is returned to the lower return substrate platform PASS2 (referring to the antireflection film treatment cell C2 as “return exit substrate placement”). The unprocessed substrate W placed on the upper feeding inlet substrate platform PASS1 is driven again, and the holding arm 10b that has been emptied is driven again. The transfer operation of the processed substrate W and the unprocessed substrate W using only the holding arm 10b is performed.

  Specifically, the holding arm 10b is moved forward to place the processed substrate W on the return exit substrate platform PASS2. The holding arm 10b that has passed the processed substrate W moves back to the original position. Subsequently, after the holding arms 10a and 10b are slightly raised together, the holding arm 10b that has been emptied is moved forward again to move the unprocessed substrate W on the feeding inlet substrate platform PASS1 to the holding arm 10b. Receive on. The holding arm 10b that has received the substrate W moves back to the original position.

  As described above, in this embodiment, the transfer operation of the processed substrate W and the unprocessed substrate W to the substrate platforms PASS1 and PASS2 is performed using only the holding arm 10b. After the substrate W held on one holding arm 10a is transferred to the substrate platform PASS2, both the holding arms 10a and 10b are in an empty state, so that no matter which holding arm 10a or 10b is used. The substrate W of the substrate platform PASS1 can be received. However, in this embodiment, the substrate W heated by being processed by the heating plate HP is received by the holding arm 10a disposed on the upper side, so that the holding arm 10a that was originally empty is not used. The arm 10b is re-driven to receive the substrate W of the substrate platform PASS1. The method for delivering the substrate W to such two substrate platforms using only one holding arm 10b is the following other processing cells C2 to C4 (however, the post-exposure heating processing cell C5 is used). The same applies to (except).

  Delivery of the unprocessed substrate W and the processed substrate W to the substrate platforms PASS1 and PASS2 is shown in FIG. 10 in the transport process (1 + α) of the first main transport mechanism 10A. Here, “α” means that the holding arms 10a and 10b are moved from the position facing the substrate platform PASS2 to the position facing the substrate platform PASS1 in order to receive the unprocessed substrate W from the substrate platform PASS1. The conveyance process moved up a little is shown. As described above, since the substrate platforms PASS1 and PASS2 are arranged close to each other in the vertical direction, the time required for movement between the substrate platforms PASS1 and PASS2 is short and can be ignored. Accordingly, the transport process (1 + α) can be handled as one transport process (in this embodiment, a substrate transfer operation performed within a predetermined time (for example, 4 seconds) using the main transport mechanism).

  When the delivery of the substrate W to the substrate platforms PASS1 and PASS2 is finished, the first main transport mechanism 10A includes an empty holding arm 10a that does not hold the substrate W and a holding arm that holds the unprocessed substrate W. 10b is moved up and down and swiveled together to oppose a predetermined cooling plate CP of the heat treatment section 9 for antireflection film. Usually, this cooling plate CP contains a substrate W which has been subjected to a preceding process. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP on the holding arm 10a. Subsequently, the holding arm 10b holding the unprocessed substrate W is moved forward to place the unprocessed substrate W on the cooling plate CP. The substrate W placed on the cooling plate CP is accurately cooled to room temperature while the main transport mechanism 10A performs another transport operation. Since the transfer of the substrate W to the cooling plate CP using the two holding arms 10a and 10b is performed without the lifting and lowering operation of the holding arms 10a and 10b, the transfer of the substrate to the cooling plate CP is not performed. This is performed within one transport process of one main transport mechanism 10A (see the transport process (2) of the first main transport mechanism 10A shown in FIG. 10).

  When the delivery of the substrate W to the cooling plate CP is finished, the holding arm 10a holding the cooled substrate W and the empty holding arm 10b are moved up and down and swiveled together to perform a predetermined antireflection film coating process. It is made to oppose the part 8. In general, the anti-reflection coating application unit 8 contains a substrate W that has been subjected to a preceding process. Therefore, first, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 11 in the antireflection coating application unit 8 on the holding arm 10b. Subsequently, the holding arm 10 a holding the substrate W is moved forward to place the substrate W on the spin chuck 11. The substrate W placed on the spin chuck 11 is coated with an antireflection film while the main transport mechanism 10A performs another transport operation. The delivery of the substrate to the spin chuck 11 corresponds to the transfer step (3) of the first main transfer mechanism 10A shown in FIG. Note that “BARC” in FIG. 10 means the antireflection film coating processing section 8.

  When the delivery of the substrate W to the spin chuck 11 is completed, the holding arm 10a in an empty state and the holding arm 10b holding the substrate W coated with the antireflection film are moved up and down and swiveled together to form a predetermined Oppose to heating plate HP. Usually, since the substrate W that has been pre-processed is also contained in the heating plate HP, first, the empty holding arm 10a is moved forward to move the processed substrate W on the heating plate HP onto the holding arm 10a. To receive. Subsequently, the holding arm 10b is moved forward to place the substrate W on the heating plate HP. The substrate W placed on the heating plate HP is heat-treated while the main transport mechanism 10A performs another transport operation, and the excess solvent contained in the antireflection film on the substrate W is removed. The delivery of the substrate W to the heating plate HP corresponds to the transport process (4) of the first main transport mechanism 10A shown in FIG.

  When the transfer of the substrate W to the heating plate HP is finished, the holding arm 10a holding the heat-treated substrate W and the empty holding arm 10b are moved up and down and swung together to be installed on the partition wall 13. It is made to oppose to the water cooling type cooling plate WCP. As described above, first, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate WCP on the holding arm 10b. Subsequently, the holding arm 10a is moved forward to place the substrate W on the cooling plate WCP. The substrate W placed on the cooling plate WCP is roughly cooled while the main transport mechanism 10A performs another transport operation. The delivery of the substrate W to the cooling plate WCP corresponds to the transfer step (5) of the first main transfer mechanism 10A shown in FIG.

  When the transfer of the substrate W to the cooling plate WCP is finished, the empty holding arm 10a and the holding arm 10b holding the roughly cooled substrate W are raised together, and above the cooling plate WCP. It is made to oppose the board | substrate mounting part PASS3 and PASS4 which are arrange | positioned. Then, the holding arm 10b is moved forward, and the substrate W is placed on the upper substrate platform PASS3 (“feeding exit substrate platform” on the basis of the antireflection film processing cell C2). Usually, from the development processing cell C4 via the resist film processing cell C3 to the lower substrate platform PASS4 (“return entrance substrate platform” on the basis of the antireflection film processing cell C2). The developed substrate W that has been sent is placed. Therefore, if the reverse transportable condition is satisfied, the holding arms 10a and 10b are slightly lowered together, and then the empty holding arm 10b is moved forward again on the substrate platform PASS4. The developed substrate W is received on the holding arm 10b.

  The delivery of the substrate W to the substrate platforms PASS3 and PASS4 corresponds to the transport process (6 + α) of the first main transport mechanism 10A shown in FIG. As described above, “α” is a short-time transfer process in which the holding arms 10a and 10b are slightly raised and lowered. Therefore, the transport process (6 + α) can be handled as one transport process.

  The first main transport mechanism 10A provided in the anti-reflection film processing cell C2 repeatedly performs the substrate transport from the transport process (1 + α) to the transport process (6 + α) described above in accordance with the establishment of the transportable condition. Here, when the transport process (1 + α) to the transport process (6 + α) are summed, the first main transport mechanism 10A bears approximately six transport processes. If the transfer time required for one transfer process is 4 seconds, the first main transfer mechanism 10A completes one cycle of substrate transfer in approximately 24 seconds. In other words, the substrate W is paid out to the adjacent resist film processing cell C3 once every 24 seconds (150 wafers / hour). In the normal continuous processing state, the above-described forward substrate transport and the reverse substrate transport proceed in parallel. For example, at the start of loading a group of substrates W, only the forward transportable conditions are satisfied. Therefore, only forward substrate transfer is executed. On the contrary, near the end of the processing of the group of substrates W, only the reverse transferable condition is satisfied, so that only the reverse substrate transfer is executed. This also applies to the other cells C2 to C6.

  The operation of the resist film processing cell C3 (resist film processing block 3) will be described. The cell controller CT3 of the resist film processing cell C3 determines whether or not a predetermined transportable condition is satisfied for the cell C3 when a predetermined determination processing start event occurs for the cell C3. To do. Then, if the forward feed condition is satisfied, the forward substrate transfer is executed as follows. In order to receive the substrate W coated with the antireflection film, placed on the substrate platform PASS3 (“feed entrance substrate platform” on the basis of the resist film processing cell C3), FIG. As shown in FIG. 10, the second main transport mechanism 10B of the cell C3, like the above-described first main transport mechanism 10A, mounts the development-processed substrate W held on one holding arm 10b. It is placed on the placement portion PASS4 (“return exit substrate placement portion” in terms of the resist film processing cell C3). Then, the substrate W on the substrate platform PASS3 is received again on the holding arm 10b. Delivery of the substrate W to the substrate platforms PASS3 and PASS4 is shown in FIG. 10 in the transport process (1 + α) of the second main transport mechanism 10B. As described above, since “α” can be ignored in time, the transport process (1 + α) can be handled as one transport process.

  When the delivery of the substrate W to the substrate platforms PASS3 and PASS4 is finished, the second main transport mechanism 10B moves the holding arm 10a in the empty state and the holding arm 10b holding the substrate W into the resist film heat treatment unit 16. To a position facing a predetermined cooling plate CP. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP, and then the holding arm 10b is moved forward to move the unprocessed substrate W to the cooling plate CP. put on top. The delivery of the substrate to the cooling plate CP corresponds to the transport process (2) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the cooling plate CP is completed, the holding arm 10a holding the cooled substrate W and the empty holding arm 10b are opposed to a predetermined resist film coating processing unit 15. Move to. First, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 17 in the resist film coating processing section 15, and the holding arm 10a holding the substrate W is moved forward. The substrate W is placed on the spin chuck 17. The substrate W placed on the spin chuck 17 is coated with a resist film while the main transport mechanism 10B performs another transport operation. The delivery of the substrate to the spin chuck 17 corresponds to the transfer step (3) of the second main transfer mechanism 10B shown in FIG. Note that “PR” in FIG. 10 means the resist film coating processing section 15.

  When the delivery of the substrate W to the spin chuck 17 is finished, the holding arm 10a in an empty state and the holding arm 10b holding the substrate W on which a resist film is applied and formed are heated to a predetermined heating unit with a temporary substrate placement unit. Opposite to PHP. First, the empty holding arm 10a is moved forward to receive the processed substrate W placed on the temporary substrate placement part 19 on the heating part PHP. Subsequently, the holding arm 10 b is moved forward to place the unprocessed substrate W on the temporary substrate placement unit 19. The substrate W placed on the temporary substrate placement unit 19 is placed on the heating plate HP of the heating unit PHP by the local transport mechanism 20 of the heating unit PHP while the main transport mechanism 10B performs another transport operation. To be heat treated. The substrate W that has been heat-treated on the heating plate HP is returned to the temporary substrate placement unit 19 by the same local transport mechanism 20. The substrate W is held by the holding plate 24 of the local transport mechanism 20 and returned to the temporary substrate placement unit 19, and is cooled by the cooling mechanism of the holding plate 24 in the substrate platform 20. The delivery of the substrate W to the heating unit PHP corresponds to the transport process (4) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the heating unit PHP is completed, the holding arm 10a holding the heat-treated substrate W and the empty holding arm 10b are opposed to the cooling plate CP of the resist film heat-treating unit 16. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate CP, and the holding arm 10a is moved forward to place the unprocessed substrate W on the cooling plate CP. The delivery of the substrate W to the cooling plate CP corresponds to the transport process (5) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the cooling plate CP is completed, the empty holding arm 10a and the holding arm 10b holding the cooled substrate W are opposed to the substrate platforms PASS5 and PASS6. Subsequently, the holding arm 10b is moved forward, and the substrate W is placed on the upper substrate placement portion PASS5 (the “outlet substrate placement portion for feeding” on the basis of the resist film processing cell C3). Put. If the reverse transportable condition is satisfied, the lower substrate returning substrate platform PASS6 (“return entrance substrate platform” on the basis of the resist film processing cell C3). The development-processed substrate W placed on is received again by the holding arm 10b.

  The delivery of the substrate W to the substrate platforms PASS5 and PASS6 corresponds to the transport process (6 + α) of the second main transport mechanism 10B shown in FIG. The transport process (6 + α) is handled as one transport process.

  The second main transport mechanism 10B provided in the resist film processing cell C3 repeatedly performs the transport of each substrate from the transport process (1 + α) to the transport process (6 + α) as described above, when the transportable condition is satisfied. Here, when the transport process (1 + α) to the transport process (6 + α) of the second main transport mechanism 10B are totaled, the second main transport mechanism 10B has approximately six transport processes similar to the first main transport mechanism 10A. Will bear. Accordingly, the second main transport mechanism 10B completes one cycle of substrate transport in the same cycle as the first main transport mechanism 10A (approximately 24 seconds in this embodiment). In other words, the substrate W is dispensed to the adjacent development processing cell C4 once every 24 seconds (150 sheets / hour).

  The operation of the development processing cell C4 will be described. The cell controller CT4 of the development cell C4 determines whether or not a transportable condition set in advance for the cell C4 is satisfied when a predetermined determination process start event occurs for the cell C4. Then, if the forward feed condition is satisfied, the forward substrate transfer is executed as follows. In order to receive the substrate W on which the resist film is applied, which is placed on the substrate platform PASS5 (“feeding entrance substrate platform” on the basis of the development processing cell C4), it is shown in FIG. As described above, the third main transport mechanism 10C of the cell C4 first transfers the developed substrate W held on the holding arm 10b to the substrate platform PASS6 (referring to the development processing cell C4 as “return exit substrate”). The substrate W on the substrate platform PASS5 is again received on the holding arm 10b. Delivery of the substrate W to the substrate platforms PASS5 and PASS6 is shown in FIG. 10 in the transport process (1 + α) of the third main transport mechanism 10C.

  When the delivery of the substrate W to the substrate platforms PASS5 and PASS6 is finished, the third main transport mechanism 10C transfers the empty holding arm 10a and the holding arm 10b holding the substrate W to the developing heat treatment unit 31. The substrate is moved to a position facing the substrate platforms PASS7 and PASS8 disposed in the laminated structure. Subsequently, the holding arm 10b is moved forward so that a resist film is coated on the upper substrate loading portion PASS7 (“feeding substrate substrate loading portion” based on the development cell C4). The attached substrate W is placed. Then, if the reverse transportable condition is satisfied, the substrate is placed on the lower substrate returning substrate platform PASS8 (“return inlet substrate platform” on the basis of the development cell C4). The post-exposure heat-treated substrate W is again received by the holding arm 10b. Delivery of the substrate W to the substrate platforms PASS7 and PASS8 is shown in FIG. 10 in the transport process (2 + α) of the third main transport mechanism 10C. Note that in the development processing cell C4, the substrate transport in the forward direction is the substrate transport until the substrate W is placed on the substrate platform PASS7 after receiving the substrate W placed on the substrate platform PASS5 (through the cell C4). In the reverse direction, the substrate transport in the reverse direction is performed by receiving the substrate W placed on the substrate platform PASS8 and processing the substrate W later (CP, SD, HP, WCP). It should be noted that this is a series of substrate conveyance until the substrate is placed on the substrate platform PASS6.

  When the delivery of the substrate W to the substrate platforms PASS7 and PASS8 is finished, the third main transport mechanism 10C includes an empty holding arm 10a and a holding arm 10b that holds the heated substrate W after the exposure. Is moved to a position facing a predetermined cooling plate CP of the heat treatment section 31 for development. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP, and then the holding arm 10b is moved forward to move the unprocessed substrate W to the cooling plate CP. put on top. The delivery of the substrate to the cooling plate CP corresponds to the transfer step (3) of the third main transfer mechanism 10C shown in FIG.

  When the delivery of the substrate W to the cooling plate CP is finished, the holding arm 10a holding the cooled substrate W and the holding arm 10b in an empty state are moved to a position facing a predetermined development processing unit 30. . First, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 32 in the development processing unit 30, and the holding arm 10a holding the substrate W is moved forward to move the substrate. W is placed on the spin chuck 32. The substrate W placed on the spin chuck 32 is developed while the main transport mechanism 10C performs another transport operation. The transfer of the substrate to the spin chuck 32 corresponds to the transfer step (4) of the third main transfer mechanism 10C shown in FIG. Note that “SD” in FIG. 10 means the development processing unit 30.

  When the delivery of the substrate W to the spin chuck 32 is finished, the empty holding arm 10a and the holding arm 10b holding the developed substrate W are opposed to a predetermined heating plate HP of the development heat treatment section 31. Let First, the empty holding arm 10a is moved forward to receive the processed substrate W placed on the heating plate HP. Subsequently, the holding arm 10b is moved forward to place the unprocessed substrate W on the heating plate HP. The delivery of the substrate W to the heating plate HP corresponds to the transport process (5) of the third main transport mechanism 10C shown in FIG.

  When the transfer of the substrate W to the heating plate HP is finished, the holding arm 10a holding the heated substrate W and the empty holding arm 10b are placed on the partition wall 13 on the resist film processing cell C3 side. It is made to oppose the installed water cooling type cooling plate WCP. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate WCP, and the holding arm 10a is moved forward to place the unprocessed substrate W on the cooling plate WCP. The delivery of the substrate W to the cooling plate WCP corresponds to the transport process (6) of the third main transport mechanism 10C shown in FIG.

  The third main transport mechanism 10C provided in the development processing cell C4 repeatedly performs the transport of each substrate from the transport process (1 + α) to the transport process (6) described above according to the establishment of the transportable condition. Here, when the transport process (1 + α) to the transport process (6) of the third main transport mechanism 10C are totaled, the third main transport mechanism 10C is similar to the first and second main transport mechanisms 10A and 10B. Approximately six transport steps are borne. Accordingly, the third main transport mechanism 10B completes one cycle of substrate transport in the same cycle as the first and second main transport mechanisms 10A and 10B (approximately 24 seconds in this embodiment). In other words, the substrate W is discharged to the adjacent post-exposure heating processing cell C5 at a rate of once every 24 seconds (150 wafers / hour).

  The operation of the post-exposure heating processing cell C5 will be described. The cell controller CT5 of the post-exposure heating processing cell C5 determines whether or not a predetermined transportable condition is satisfied for the cell C5 when a predetermined determination processing start event occurs for the cell C5. judge. Then, if the forward feed condition is satisfied, the forward substrate transfer is executed as follows. In order to receive the substrate W on which the resist film is applied, which is placed on the substrate platform PASS7 (“feeding entrance substrate platform” on the basis of the post-exposure heating processing cell C5). As shown in FIG. 10, the fourth main transport mechanism 10D of the cell C5 moves the post-exposure heat-treated substrate W held by the holding arm 10b to the substrate platform PASS8 (based on the post-exposure heating treatment cell C5). In other words, it is placed on the “return exit substrate mounting portion”), and then the substrate W on the substrate mounting portion PASS7 is received again on the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS7 and PASS8 corresponds to the transport process (1 + α) of the fourth main transport mechanism 10D shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS7 and PASS8 is finished, the fourth main transport mechanism 10D moves the holding arm 10a in an empty state and the holding arm 10b holding the substrate W into a predetermined edge exposure unit EEW. Move to a position opposite to. First, the empty holding arm 10a is moved forward to receive the peripherally exposed substrate W on the spin chuck 36 of the edge exposure unit EEW, and then the holding arm 10b is moved forward to move the unprocessed substrate. W is placed on the spin chuck 36. The peripheral portion of the substrate W placed on the spin chuck 36 is exposed while the main transport mechanism 10D performs another transport operation. The delivery of the substrate to the spin chuck 36 corresponds to the transport step (2) of the fourth main transport mechanism 10D shown in FIG.

  When the transfer of the substrate W to the spin chuck 36 is finished, the fourth main transport mechanism 10D transfers the holding arm 10a holding the peripherally exposed substrate W and the empty holding arm 10b to the developing heat treatment section 31. It moves to a position facing a certain cooling plate CP. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate CP, and the holding arm 10a is moved forward to place the peripherally exposed substrate W on the cooling plate CP. . The delivery of the substrate W to the cooling plate CP corresponds to the transport process (3) of the fourth main transport mechanism 10D shown in FIG.

  When the delivery of the substrate W to the cooling plate CP is finished, the fourth main transport mechanism 10D transfers the holding arm 10a in an empty state and the holding arm 10b holding the cooled substrate W to the substrate platform PASS9. And move to a position facing the PASS 10. Subsequently, the holding arm 10b is moved forward so that the substrate W is placed on the upper substrate placement portion PASS9 (the “exit substrate placement portion for sending” on the basis of the post-exposure heating processing cell C5)). Put. When the reverse transportable condition is satisfied, the lower substrate return substrate placement unit PASS10 (“return entrance substrate placement unit” on the basis of the post-exposure heating processing cell C5) The substrate W exposed by the exposure apparatus STP is received by the holding arm 10a. The delivery of the substrate W to the substrate platforms PASS9 and PASS10 corresponds to the transport process (4 + α) of the fourth main transport mechanism 10D shown in FIG.

  In this embodiment, the substrate W is delivered only to the substrate platforms PASS9 and PASS10 using the two holding arms 10a and 10b. This is because the substrate W is transferred to the substrate platforms PASS9 and PASS10 and the substrate W is transferred to the heating unit PHP described later (once: odd times) between the substrate platforms PASS7 and PASS8. When the substrate is transferred to the substrate platforms PASS9 and PASS10 using only one holding arm 10b, the holding arm used to transfer the substrate W to the substrate platforms PASS7 and PASS8 is one cycle in the transport process. This is to avoid this.

  When the delivery of the substrate W to the substrate platforms PASS9 and PASS10 is finished, the fourth main transport mechanism 10C causes the holding arm 10a holding the exposed substrate W and the holding arm 10b in an empty state to heat treatment for development. It moves to the position which opposes the heating part PHP with the predetermined substrate temporary placement part in the part 31. First, the empty holding arm 10b is moved forward to receive the post-exposure heat-treated substrate W in the heating unit PHP (specifically, on the temporary substrate placement unit 19), and then hold it. The arm 10a is moved forward to place the exposed substrate W on the heating unit PHP (specifically, on the temporary substrate placement unit 19). The substrate W placed on the temporary substrate placement unit 19 is transferred to the heating plate HP by the local transport mechanism 20 and subjected to heat treatment while the main transport mechanism 10D performs another transport operation, and then is also transported locally. The mechanism 20 returns the substrate to the temporary substrate placement portion 19 and cools the temporary substrate placement portion 19. The delivery of the substrate to the heating unit PHP corresponds to the transport step (5) of the fourth main transport mechanism 10D shown in FIG. In addition, in the post-exposure heating processing cell C5, the substrate transport until receiving the substrate W placed on the substrate platform PASS10 and placing the substrate W on the substrate platform PASS8 through the heating unit PHP is in the reverse direction. Note that this corresponds to a substrate transfer of

  The fourth main transport mechanism 10D provided in the post-exposure heating processing cell C5 repeatedly carries the substrates from the transport process (1 + α) to the transport process (5) described above according to the establishment of the transportable condition. Here, when the transport process (1 + α) to the transport process (5) of the fourth main transport mechanism 10D are summed, the fourth main transport mechanism 10D is 1 more than the first to third main transport mechanisms 10A to 10C. This means that only about five transport steps are required. Looking only at the post-exposure heating processing cell C5, the fourth main transport mechanism 10D can operate in a cycle of 20 seconds when the time required for one transport process is 4 seconds. Since the third main transport mechanisms 10A to 10C move in a cycle of 24 seconds, after all, from the post-exposure heating processing cell C5, as in the other cells, once every 24 seconds (150 sheets / hour). The substrate W is dispensed to the adjacent interface cell C6.

  The operation of the interface cell C6 will be described. The cell controller CT6 of the interface cell C6 determines whether or not a transportable condition set in advance for the cell C6 is satisfied when a predetermined determination processing start event occurs for the cell C6. Then, if the forward feed condition is satisfied, the forward substrate transfer is executed as follows. Specifically, when the peripherally exposed substrate W is placed on the substrate platform PASS9 (“feed inlet substrate platform” on the basis of the interface cell C6), the interface transport mechanism of the interface cell C6. 35 receives the substrate W from the substrate platform PASS9 and transfers it to the adjacent exposure apparatus STP. Further, if the reverse transportable condition is satisfied, the interface transport mechanism 35 receives the exposed substrate W from the exposure apparatus STP, and returns the substrate to the substrate platform PASS10 (interface cell) for returning the substrate. Speaking on the basis of C6, it is placed on the “return exit substrate mounting portion”). The interface transport mechanism 35 repeatedly performs such a substrate transport operation.

  Next, with reference to the flowchart of FIG. 11, a process for determining a transportable condition for starting substrate transport performed by the cell controllers CT1 to CT6 of the cells C1 to C6 will be described.

  Step S1: In the cell controllers CT1 to CT6 of the cells C1 to C6 shown in FIG. 9, a determination process start event that is a condition for starting the determination process of the transportable condition is determined and set in advance. Although the specific matter of the determination process start event is not particularly limited, it is preferably an event related to the separation of the substrate transfer because of the nature of determining the transferable condition based on the occurrence of this event. As the determination process start event, for example, (a) the substrate W is placed on the feeding or returning entrance substrate placing part (PASS), (b) the feeding or returning entrance substrate placing. It is predicted that the substrate W will be placed in the section (PASS), (c) the processing section on the transport path is in a state where the substrate W can be replaced, and (d) an outlet for sending or returning. It is predicted that the substrate W of the substrate platform (PASS) has been dispensed, (e) the substrate W of the exit substrate platform (PASS) for delivery or return has been dispensed, ) The substrate can be transferred to the processing unit that has been stopped. The transportable condition determination process may be performed when any one of these events occurs. In addition, in the case of an apparatus that performs forward (feed) conveyance and reverse (return) conveyance in parallel as in this embodiment, (g) a condition that allows conveyance even when conveyance on one side is completed. This determination process may be performed.

  Each of the cell controllers CT1 to CT6 monitors the occurrence of the determination process start event as described above. If a predetermined event occurs, the cell controllers CT1 to CT6 move to the processing after step S2. In addition, after moving to the process after step S2, when another determination process start event occurs continuously, the determination process based on the event is made to wait, or the event that can be determined to be unnecessary is discarded. To do.

  Step S2: In this step S2, it is determined whether the determination process start event detected in step S1 is an event related to forward substrate transport or an event related to reverse substrate transport. For example, in the processing cell C2 for antireflection film, when the substrate W is placed on the substrate platform PASS1 (feeding entrance substrate platform), the substrate W is transported in the forward direction and each processing unit of the cell C2 is placed. Therefore, it is determined that the substrate is transported in the forward direction. Conversely, when the substrate W is placed on the substrate platform PASS4 (return entrance substrate platform) in the antireflection film processing cell C2, the substrate W is transported in the reverse direction and returned to the indexer cell C1. Therefore, it is determined that the substrate is conveyed in the reverse direction.

  In the case of the determination process start event (c) or (f) described in step S1, the processing unit is used in the forward transfer process of the substrate W or used in the reverse transfer process. It is determined whether the transfer is in the forward direction or in the reverse direction depending on whether the transfer is in the normal direction. In the case of the determination processing start event of (D) and (E), when the substrate W of the outlet substrate mounting part (PASS3 in the case of the cell C2) is discharged (is lost), the substrate is transferred in the forward direction. In addition, when the substrate W of the return exit substrate mounting portion (PASS) is discharged (has disappeared), it is determined that the substrate is transported in the reverse direction. In the case of the determination process start event of (g), when the forward substrate transport is finished, in the normal continuous operation state, the substrate transport in the reverse direction should be performed next to the forward substrate transport. It is determined that the substrate is conveyed in the reverse direction. Similarly, when the substrate transport in the reverse direction is completed, it is determined that the substrate is transported in the forward direction.

Step S3 _F, S3 _R: When the determination processing start event in step S2 is determined to relate to substrate transfer in the forward direction, to start the forward body timer for transport (step S3 _F). On the other hand, if it is determined that the determination process start event is related to the substrate transport in the reverse direction, the reverse substrate transport timer is started (step S3 _R ). In these timers, the substrate W is placed on the entrance substrate placement unit (the feeding entrance substrate placement unit in the case of forward substrate transport, and the return entrance substrate placement unit in the case of substrate transport in the reverse direction). In order to wait for this, a predetermined waiting time is set. The significance of setting the “standby time” will be described in steps S4 _F and S4 _R.

Step S4 _F, S4 _R: determining at the steps S4 _F, S4 _R, forward (or backward) whether transportable condition is satisfied. The transportable condition is a condition set in advance for each cell in order to determine whether or not the substrate W can be moved in the forward direction (or the reverse direction) within the cell. The transportable conditions are not particularly limited, but are set as follows in this embodiment. In other words, (a) the substrate W is placed on the entrance substrate placement portion (a feeding entrance substrate placement portion in the case of forward substrate transport, and a return entrance substrate placement portion in the case of reverse substrate transport). Or that a predetermined waiting time has elapsed to wait for the substrate to be placed on the entrance substrate placement portion, (b) the exit substrate placement portion (in the case of forward substrate transport) There is no substrate W in the sending exit substrate mounting section, or in the case of reverse substrate transport, the return exit substrate mounting section), and (c) the processing section on the transport path is in a state where the substrate can be replaced. This condition is that all the conditions are satisfied. Hereinafter, each condition will be described.

  The condition that “the substrate W is placed on the entrance substrate mounting portion” in the first half of (a) is that when the substrate W is placed on the entrance substrate placement portion, the substrate W is quickly taken into the cell. This is a condition set to perform necessary processing. For example, in the case of the antireflection film processing cell C2, the substrate W is placed on the substrate platform PASS1 when the substrate is transferred in the forward direction, and the substrate is placed on the substrate platform PASS4 when the substrate is transferred in the reverse direction. The fact that W is placed corresponds to this condition. The cell controller CT2 of the cell C2 can know that the substrate W has been placed on the substrate platforms PASS1 and PASS4 based on detection signals from optical sensors provided on the substrate platforms PASS1 and PASS4, respectively. .

In the latter half of (a), the condition that “a predetermined waiting time has passed for waiting for the substrate to be placed on the entrance substrate mounting portion” is that the main transport mechanism has the substrate on the entrance substrate placement portion. This is a condition set to avoid waiting for a long time for W to be placed. As it is apparent from the flowchart of FIG. 11, if the transportable condition is satisfied in step S4 _F, S4 _R, wait for the next determination processing start event returns to step S1, determine the establishment of transportable condition and so on to To do. If the substrate W is not placed on the entrance substrate mounting portion for a long time, the above processing procedure is repeated indefinitely. Then, even if there is a substrate W that has already been processed in the cell, the substrate W is not delivered to the adjacent cell, and as a result, the throughput of the substrate processing apparatus is reduced. When a group of substrates W are continuously input, such a situation does not occur. However, for example, the processing of the group of substrates W is completed, and the substrate group is switched to another lot (that is, FIG. 1). In the case where the cassette C is transferred to the cassette mounting table 6 shown in FIG. In such a case, if the substrate in the cell is transported to the next processing unit (or to an adjacent cell) on the condition that a preset standby time elapses, the substrate transport processing efficiency can be improved. A decrease can be prevented.

  Although how long the standby time is set is arbitrary, it is preferable to set as follows. In other words, when a substrate W is received by a certain cell, a necessary process is performed on the substrate W, and the time from when the substrate W is dispensed to the next cell is defined as the cycle time of the cell, the standby state is established. The time is preferably set to a time equal to or greater than the maximum cycle time which is the cycle time of the cell having the longest cycle time among the cells C1 to C6 constituting the substrate processing apparatus. In the case of the apparatus of this embodiment, the maximum cycle time is “24 seconds”, so the standby time is preferably “24 seconds or more”. More preferably, the standby time is set to a time substantially equal to the maximum cycle time (“24 seconds” in the case of this embodiment).

The standby time is set as described above for the following reason. In a normal state where a group of substrates W are continuously charged, the cycle time of the entire substrate processing apparatus converges to the maximum cycle time. In the case of the present embodiment, it is “24 seconds”. When the standby time is set to a time shorter than the maximum cycle time (for example, “22 seconds”) in an apparatus that performs such a movement in a normal state, the main transport mechanism is moved by the passage of the standby time “22 seconds”. Execute substrate transfer in the cell. At this time, for example, if the substrate W is placed on the entrance substrate platform after 24 seconds from the start of standby (timer start in steps S3 _F and S3 _R ), the substrate W is received by the main transport mechanism. This is after the processing of the substrate currently being transported by the main transport mechanism is completed. If it does so, the board | substrate set | placed on the entrance board | substrate mounting part will be waited unnecessarily in the state, and the efficiency of board | substrate conveyance falls that much. By setting the standby time to a time equal to or greater than the maximum cycle time, such a problem can be avoided.

  On the other hand, if the standby time is set to a time considerably longer than the maximum cycle time, the main transport mechanism waits unnecessarily long for the substrate to be placed on the entrance substrate mounting portion when the loading of the substrate W is interrupted. become. Considering that the cycle time of the entire substrate processing apparatus during steady operation converges to the maximum cycle time, if the substrate W is not placed on the entrance substrate mounting portion even after the maximum cycle time has elapsed, lot switching is performed. It is considered that the loading of the substrate W is interrupted due to the above, and in this case, it is preferable to shift to the substrate transport in the cell. Accordingly, it can be said that the stand-by time is preferably set at a time substantially equal to the maximum cycle time from the viewpoint of substrate transfer efficiency.

  The condition that “the substrate W does not exist in the exit substrate mounting portion” in (b) is a condition for determining whether or not the substrate W can be dispensed to an adjacent cell. For example, in the case of the antireflection film processing cell C2, there is no substrate W in the substrate platform PASS3 when the substrate is transferred in the forward direction, and there is no substrate W in the substrate platform PASS2 when the substrate is transferred in the reverse direction. This corresponds to this condition. The cell controller CT2 of the cell C2 can know that the substrate W is not in the substrate platforms PASS3 and PASS2 by detection signals from optical sensors provided in the substrate platforms PASS3 and PASS2, respectively.

  The condition (c) that “the processing unit on the transfer path is in a state where the substrate can be replaced” is to determine whether the substrate W in each processing unit in the cell is in a state where the substrate can be transferred. Is the condition. The cell controller of each cell determines whether this condition is satisfied by monitoring the processing time in each processing unit.

The process proceeds to step S4 _F, S4 step S5 transportable condition _R is next if satisfied _F, S5 _R, if not also satisfied either transportable condition, following determination process disclosed event returns to step S1 Wait for. In addition to the three conditions (a), (b), and (c) described above, for example, “the processing unit on the transfer path or the main transfer mechanism is stopped due to an alarm or the like. It may be a condition that it is not. If such a condition is added, it is possible to avoid the problem that the substrate W is transported to the abnormal processing unit or the substrate W is handled by the abnormal main transport mechanism.

Step S5 _F, S5 _R: In these steps S5 _F, S5 _R, resets the timer which sets the wait time.

Step S6 _F, S6 _R: reverse when running forward substrate conveyed if the transportable condition in the forward direction is established (step S6 _F), transportable condition of the reverse is true Direction substrate transfer (step S6 _R ). In a normal operation state in which a group of substrates W are continuously inserted, it is normal that a determination processing start event related to forward substrate transfer and a determination processing start event related to reverse substrate transfer occur alternately. Therefore, forward substrate transport and reverse substrate transport are performed alternately. However, the forward substrate transfer is continuously executed at the start of the loading of the substrate group, and the reverse substrate transfer is continuously executed near the end of the processing of the substrate group.

  As described above, in the substrate processing apparatus according to the present embodiment, the main transfer mechanism 10 of each of the cells C1 to C6 (however, the indexer transfer mechanism 7 in the case of the indexer cell C1 and the interface transfer mechanism in the case of the interface cell C6). 35) operate in parallel and proceed with processing a plurality of substrates W, so that the throughput of the substrate processing apparatus is improved. In addition, since the entrance substrate placement unit and the exit substrate placement unit are provided separately, the substrate W received in the cell and the substrate to be dispensed from the cell do not interfere with each other without interfering with each other in the substrate placement unit. The substrate can be transported smoothly. Furthermore, since the substrate mounting unit for feeding and the substrate mounting unit for returning are also provided separately, the substrate transported in the forward direction and the substrate transported in the reverse direction interfere with each other in the substrate mounting unit. There is no problem, and bidirectional substrate transfer can be performed smoothly.

  Further, the substrate processing apparatus according to the present embodiment determines that the transportable condition is satisfied when each of the cells C1 to C6 individually generates a determination process start event, and transports the substrate in the controlled unit. Since it is executed, the substrate transfer control of each of the cells C1 to C6 does not need to consider the substrate transfer status of adjacent cells. Therefore, even when there are a large number of cells constituting the substrate processing apparatus, it is possible to easily perform the control related to the substrate transport. In addition, even if the substrate processing time in a cell is changed or a new cell is added, there is no need to change the substrate transfer control of the cell adjacent to it. can do.

  Furthermore, the substrate processing apparatus according to the present embodiment determines that the transportable condition is satisfied when each of the cells C1 to C6 individually generates a determination processing start event, and transports the substrate in the controlled unit. Since this is performed, the throughput of the substrate processing apparatus can be improved compared to a conventional substrate processing apparatus that performs a tact operation. In a normal operation state in which a group of substrates are continuously input, the apparatus of this embodiment delivers the substrate W to the adjacent cell every about 24 seconds. It appears that the substrate is transported in a similar operation cycle. However, it should be noted that the apparatus of this embodiment is not controlled so that the main transport mechanism moves regularly in a cycle of 24 seconds unlike the conventional apparatus. The apparatus of this embodiment only converges to a cycle time of 24 seconds as a result of each substrate determining whether the transferable condition is satisfied and executing substrate transfer. Therefore, for example, when the loading of a group of substrates W is started or near the end, only forward or reverse substrate transport occurs, so that the transportable condition is compared with that in the normal operation state. There is a possibility that it will be established earlier in time. As soon as the transportable condition is satisfied, the efficiency of transporting the substrate is increased, and the throughput of the substrate processing apparatus is improved. For the same reason, if the cell having the maximum cycle time is shortened due to shortening of the processing time or the like, the substrate processing apparatus according to the present embodiment automatically performs with the shortened maximum cycle time. Substrate conveyance is performed. If the conventional apparatus is used, it is impossible to cope with the shortening of the cycle time unless the control program for the transport mechanism is changed. However, according to the present embodiment, the substrate transport control program can be changed as the cycle time is shortened. It is basically unnecessary and can be said to be extremely versatile.

The present invention is not limited to the embodiment described above, and can be modified as follows, for example.
(1) In the above-described embodiment, as one of the transportable conditions, “entrance substrate placement portion (feed substrate placement portion for forward substrate transport, return entrance for reverse direction substrate transport”) The condition is that “the substrate W is placed on the substrate mounting portion)”. Instead of this condition, “it is predicted that the substrate is placed on the entrance substrate mounting portion” may be used as a condition. In the above-described embodiment, for example, when the indexer transport mechanism 7 of the indexer cell C1 shifts to an operation for delivering the substrate W to the substrate platform PASS1, the cell controller CT1 of the cell C1 moves to the main controller MC (FIG. 9)), the cell controller CT2 predicts that the substrate W is placed on the substrate platform PASS1 by sending the substrate W payout notice information to the cell controller CT2 of the adjacent antireflection film processing cell C2. can do. Then, when it is predicted that the substrate W is placed on the substrate platform PASS1 in this way, if the main transport mechanism 10A of the cell C2 starts to move toward the substrate platform PASS1, the substrate platform is placed. When the substrate W is placed on the part PASS1, the main transport mechanism 10A faces the PASS1 almost simultaneously and can immediately receive the placed substrate W. That is, since the time from when the substrate W is placed on the substrate platform PASS1 to when it is received by the main transport mechanism 10 is shortened, the efficiency of substrate transport can be increased.

  (2) Similarly, the transportable condition of the above embodiment (b) “exit substrate mounting portion (feeding substrate mounting portion for forward substrate transport, return outlet for reverse substrate transport) Instead of “there is no substrate W in the substrate mounting portion)”, “it is predicted that there is no substrate in the exit substrate mounting portion” may be used as a condition. In the above embodiment, for example, when the main transport mechanism 10B of the resist film processing cell C3 shifts to an operation for receiving the substrate W placed on the substrate platform PASS3, the cell controller CT3 of the cell C3 is the main controller. The cell controller CT2 does not have the substrate W in the substrate platform PASS3 by sending the reception notice information of the substrate W to the cell controller CT2 of the adjacent antireflection film processing cell C2 via the controller MC (see FIG. 9). Can be predicted. By starting substrate conveyance based on such prediction, the efficiency of substrate conveyance can be increased.

  (3) Similarly, instead of “carryable condition (c)“ the processing unit on the conveyance path is in a state where the substrate can be replaced ”” in the above embodiment, “the main conveyance mechanism is a processing unit on the conveyance path” It is also possible to use the condition that the processing unit is predicted to be in a state where the substrate can be replaced when the substrate is transferred before the step “. Since the cell controller of each cell performs time management of processing in the processing unit in each cell, the end time of processing in each processing unit can be predicted. Specifically, in the above embodiment, since the time required for one transport process of the main transport mechanism 10 of each cell is about 4 seconds, for example, the substrate W placed on the entrance substrate platform is used as the next processing unit. It takes at least 4 seconds to transport it. Therefore, when it is determined that the transportable condition is satisfied in a certain cell, even if the substrate processing in the processing unit is not completed, for example, if the end of the processing is predicted after 4 seconds, the entrance substrate mounting unit If a certain substrate W is received and headed to the next processing section, the substrate processing is completed almost simultaneously with the main transport mechanism facing the processing section. As a result, the substrate W can be replaced as soon as the processing of the substrate W is completed, and the efficiency of substrate transport can be improved.

  (4) In the above embodiment, each of the processing cells C2 to C5 has four substrate placement portions (that is, a feeding inlet substrate placement portion, a return inlet substrate placement portion, and a feeding outlet substrate placement portion). However, at least one processing cell may further include another inlet substrate mounting portion and an outlet substrate mounting portion). For example, in the substrate processing apparatus shown in FIG. 12, the anti-reflection film processing cell C2 includes a feeding inlet substrate platform PASS1, a return inlet substrate platform PASS4, a feeding outlet substrate platform PASS3, and a return substrate. In addition to the exit substrate platform PASS2, another entrance substrate platform PASS6 and an exit substrate platform PASS5 are provided. The development processing cell C4 is adjacent to the antireflection film processing cell C2 so as to share the substrate platforms PASS3 and PASS4, and the resist film processing cell C3 is adjacent to be shared with the substrate platforms PASS5 and PASS6. doing. According to this example, the substrate W processed in the antireflection film processing cell C2 is sent to the resist film processing cell C3 via the exit substrate platform PASS5, and the substrate W processed in the cell C3 is transferred to the resist film processing cell C3. The film is returned to the antireflection film processing cell C2 through the entrance substrate platform PASS6 and further sent to the development processing cell C4 through the substrate platform PASS3. The developed substrate W is returned to the antireflection film processing cell C2 via the substrate platform PASS4 and then directly returned to the indexer cell C1 without passing through the resist film processing cell C3. As described above, when six or more substrate mounting portions are provided in at least one processing cell, the degree of freedom in arranging the processing cells can be improved.

  (5) Each of the first to fourth main transport mechanisms 10A to 10D includes two holding arms 10a and 10b, but includes a single holding arm or three or more holding arms. Also good.

  (6) In the embodiment, the post-exposure heating processing cell C5 is disposed across the development processing block 4 and the interface block 5, but the post-exposure heating processing cell C5 is an independent block (individual block frame). You may comprise as (element assembled | attached to (frame)).

  (7) In the embodiment, the antireflection film processing block 2 and the resist film processing block 3 are provided separately. However, the antireflection film coating process and the resist film coating process are performed in a single processing block. It may be. Further, when the antireflection film coating process is unnecessary, the antireflection film processing block 2 may not be provided.

  As described above, the present invention is suitable for a substrate processing apparatus that performs a series of processes on a substrate such as a semiconductor substrate, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk.

It is the top view which showed schematic structure of the substrate processing apparatus which concerns on one Example of this invention. It is the front view which showed schematic structure of the Example apparatus. It is a front view of a heat treatment part. It is a fracture | rupture front view which shows the periphery structure of the board | substrate mounting part provided in the partition. It is a side view which shows schematic structure of an interface block. (A) is a top view which shows schematic structure of a main conveyance mechanism, (b) is the front view. (A) is a fracture | rupture side view of the heating part with a substrate temporary placement part, (b) is a fracture | rupture top view. (A) is the top view which showed the block arrangement of the Example apparatus, (b) is the top view which showed the cell arrangement of the Example apparatus. (A) is the block diagram which showed the control system of the Example apparatus, (b) is the block diagram of the control system of the conventional apparatus shown for the comparison. It is the figure which showed the flow of the board | substrate conveyance by the 1st-4th main conveyance mechanism. It is a flowchart with which it uses for operation | movement description of an Example apparatus. It is a figure which shows the layout of the substrate processing apparatus which concerns on a modification. It is the top view which showed schematic structure of the conventional substrate processing apparatus. It is a figure where it uses for description of the tact operation | movement of the conventional substrate processing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Indexer block 2 ... Antireflection film processing block 3 ... Resist film processing block 4 ... Development processing block 5 ... Interface block 7 ... Indexer transport mechanism 10A to 10D ... First to fourth main transport mechanisms 35 ... Interface Transport mechanism C1 ... indexer cell C2 ... antireflection film processing cell C3 ... resist film processing cell C4 ... development processing cell C5 ... post-exposure heating processing cell C6 ... interface cell W ... substrate PASS1 to PASS10 ... substrate mounting part

Claims (12)

A single controlled unit is configured including a processing unit that performs a required process on the substrate and a single main transfer mechanism that delivers the substrate to the processing unit, and the controlled units are arranged in parallel. A substrate processing apparatus comprising:
In each of the controlled units, an inlet substrate mounting portion for mounting the substrate to receive the substrate in the controlled unit, and an outlet substrate mounting for mounting the substrate to eject the substrate from the controlled unit Is provided separately from the
The main transfer mechanism of each controlled unit performs substrate transfer via the inlet substrate mounting portion and the outlet substrate mounting portion.
And, each control unit is provided with unit control means for controlling at least the substrate transfer operation of the main transport mechanism of each control unit,
Each unit control means independently performs control related to a series of substrate transport including delivery of the substrate to the processing unit and delivery of the substrate to the substrate mounting unit as follows.
(1) A transportable condition for determining whether the substrate can be moved in the controlled unit corresponding to each unit control means is preset,
(2) A determination process start event which is a condition for starting the determination process of the transportable condition is determined in advance,
(3) When the determination process start event occurs, it is determined whether the transportable condition is satisfied,
(4) When the transportable condition is satisfied, transport the substrate in the controlled unit,
(5) The substrate processing apparatus, which waits for a next determination processing start event when the transportable condition is not satisfied. The substrate processing apparatus according to claim 1,
The transportable conditions are at least: (a) a substrate is placed on the entrance substrate mounting portion, (b) no substrate is placed on the exit substrate placement portion, and (c) a processing portion on the transport path is a substrate. Is a substrate processing apparatus on condition that all the conditions are satisfied. The substrate processing apparatus according to claim 2,
In place of the condition (a), the substrate processing apparatus is provided on the condition that (a1) the substrate is predicted to be placed on the entrance substrate mounting portion. The substrate processing apparatus according to claim 2,
In place of the condition (b), a substrate processing apparatus is provided on the condition that (b1) no substrate is expected in the exit substrate mounting portion. The substrate processing apparatus according to claim 2,
In place of the condition (c), (c1) when the main transport mechanism transports the substrate before the processing unit on the transport path, it is predicted that the processing unit is in a state where the substrate can be replaced. A substrate processing apparatus which is subject to The substrate processing apparatus according to claim 2,
Instead of the above condition (a), (a2) a waiting time set in advance to wait for the substrate to be placed on the entrance substrate placement portion or to place the substrate on the entrance substrate placement portion. Substrate processing apparatus that is subject to the conditions. The substrate processing apparatus according to claim 2,
Instead of the condition (a), (a3) it is predicted to wait for the substrate to be placed on the entrance substrate placement unit, or to wait for the substrate to be placed on the entrance substrate placement unit. Substrate processing apparatus provided that the waiting time has passed. The substrate processing apparatus according to claim 6 or 7,
When a substrate is received by a certain controlled unit, necessary processing is performed on the substrate, and the time until the substrate is dispensed to the next controlled unit is the cycle time of the controlled unit,
The waiting time is set to a time equal to or longer than the maximum cycle time which is the cycle time of the controlled unit having the longest cycle time among the plurality of controlled units constituting the substrate processing apparatus. Processing equipment. The substrate processing apparatus according to claim 8, wherein
The waiting time is set to a time substantially equal to the maximum cycle time that is the cycle time of the controlled unit having the longest cycle time among the plurality of controlled units constituting the substrate processing apparatus. Processing equipment. The substrate processing apparatus according to claim 2,
The determination process start event is:
(A) The substrate is placed on the entrance substrate mounting part.
(B) It is predicted that the substrate will be placed on the entrance substrate mounting part.
(C) The processing section on the transport path is in a state where the substrate can be replaced,
(D) The substrate of the exit substrate mounting part has been paid out,
(E) It is predicted that the substrate of the exit substrate mounting portion has been paid out,
(F) A substrate processing apparatus including any one of the facts that the substrate can be transferred to the stopped processing unit. The substrate processing apparatus according to any one of claims 1 to 10,
The inlet substrate placement unit is used when a substrate is transported in the opposite direction between the feeding inlet substrate placement unit used for transporting the substrate in the forward direction between the controlled units and the controlled unit. And a return entrance substrate mounting portion.
The exit substrate placement unit is used when a substrate is transported in the reverse direction between the controlled exit substrate placement unit and each controlled unit, which is used when the substrate is transported between the controlled units in the forward direction. And a return exit substrate mounting portion.
Each unit control means includes:
When the determination process start event occurs, it is determined whether the event is an event related to the forward transport or an event related to the reverse transport,
If the event is an event related to the forward transfer, it is determined whether or not the forward transfer condition is satisfied. If the transfer enable condition is satisfied, the forward substrate transfer is performed. Run
If the event is an event related to the transport in the reverse direction, it is determined whether or not the reverse transport condition is satisfied. If the transport condition is satisfied, the substrate transport in the reverse direction is performed. A substrate processing apparatus for executing The substrate processing apparatus according to claim 11, wherein
At least one controlled unit among the plurality of controlled units includes the feeding inlet substrate mounting portion, the returning inlet substrate mounting portion, the feeding outlet substrate mounting portion, and the return. In addition to the outlet substrate mounting section for use, a substrate processing apparatus further comprising another inlet substrate mounting section and an outlet substrate mounting section.

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