JP2005093766A - Lower receiver of substrate in electronic component mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lower receiver of a substrate in an electronic component mounter capable of receiving a substrate without damaging the surface of the electronic component or the substrate. <P>SOLUTION: In the lower receiver 6 for supporting a substrate by means of lower receiving pins 21 in an electronic component mounter, a lower receiving part is constituted by arranging a lower receiving pin module 20, provided with a pin height copy mechanism for making height positions of upper ends of a plurality of lower receiving pins 21 copy the lower surface profile of an objective substrate 10 to be received, on a lower receiving base 8a, and conductive resin ends 29 are fixed removably to the upper ends of the lower receiving pins 21. Consequently, the substrate can be received without damaging the surface of the electronic component or the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate receiving apparatus in an electronic component mounting apparatus that receives a substrate with a receiving pin in an electronic component mounting apparatus such as a screen printing apparatus or an electronic component mounting apparatus.

  As a substrate on which electronic components are mounted, there is a so-called double-sided mounting substrate in which electronic components are mounted on both sides as well as one side of the substrate. In the mounting process of the double-sided mounting substrate, first, mounting on the first surface is performed, and then the mounting operation such as solder printing, electronic component mounting, and reflow is performed on the second surface by inverting the substrate. At the time of mounting on this second surface, since the already mounted surface on which the electronic component has already been mounted faces downward, in an apparatus that needs to position and hold the board such as solder screen printing or component mounting, This already mounted surface is supported from below.

When receiving an already mounted surface, the mounted surface cannot be supported by the surface of the mounted component, so select a place where the mounted surface does not exist and select this position. A method of supporting by pins is used. Conventionally, as a receiving device used for receiving such an already mounted surface, by pressing the lower surface of the board against the receiving portion on which a large number of receiving pins are erected, A configuration in which the height position is made to follow the shape of the lower surface of the substrate is known (see, for example, Patent Document 1). By adopting such a configuration, there is an advantage that it is possible to greatly reduce the trouble of the setup change work for individually adjusting the height of the receiving pin every time the type of the substrate is switched.
JP 2002-335098 A

  However, in the conventional receiving device, the following problems occur in relation to the height position of the receiving pin. In the above-described work of copying the height of the receiving pin, since the copying operation is performed using only one sample substrate, the height of the electronic component in the mounted state and the solder joint portion by the individual substrate are used. If the shapes are slightly different, it is difficult to realize a uniform receiving state in which all the receiving pins are in contact with the lower surface of the substrate in the same state with good reproducibility. For this reason, in the part where the receiving pin is strongly pressed, there is a problem that the electronic component or the substrate is damaged such as a surface scratch.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate receiving device in an electronic component mounting apparatus that can receive a substrate without causing damage such as surface scratches on the electronic component or the substrate.

  The substrate receiving device in the electronic component mounting apparatus according to the present invention is a substrate receiving device in an electronic component mounting device that supports a substrate by a receiving pin in the electronic component mounting device. A lower receiving portion in which the pins are arranged in a vertical posture, a pin height copying mechanism for copying the height position of the upper end portion of the lower receiving pin to the shape of the lower surface of the lower receiving substrate, and the lower receiving pin And a resin end portion made of a conductive resin detachably attached to the upper end portion.

According to the present invention, a pin height tracing mechanism for copying the height position of the upper end portion of the lower receiving pin to the shape of the lower surface of the substrate to be received, and a conductive member detachably attached to the upper end portion of the lower receiving pin. By providing the resin end portion made of the conductive resin, the substrate can be received without damaging the electronic component or the substrate surface, such as a surface scratch.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2A is a front view of a substrate receiving apparatus according to an embodiment of the present invention, and FIG. FIG. 3 and FIG. 4 are sectional views of a substrate pin module in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. FIG. 6, FIG. 7, and FIG. 8 are diagrams illustrating a substrate underpinning method according to an embodiment of the present invention. It is explanatory drawing of a base preparation work.

  First, referring to FIG. 1, the structure of a screen printing apparatus, which is an electronic component mounting apparatus in which a substrate receiving apparatus is incorporated, will be described. In FIG. 1, a substrate positioning unit 1 is configured by stacking a θ-axis table 4 on a moving table composed of a Y-axis table 2 and an X-axis table 3, and further disposing a Z-axis table 5 thereon. Yes. On the Z-axis table 5, a lowering device 6 for holding and receiving a substrate 10 on which electronic components are mounted is disposed. The lower receiving device 6 has a plurality of lower receiving pin units 9 arranged on the lower receiving base portion 8a (see FIG. 2) of the upper surface of the lower raising / lowering portion 8 provided so as to be movable up and down with respect to the Z-axis table 5. Configured.

  In this screen printing apparatus, cream solder is printed on the substrate 10 on which electronic components are already mounted on one side. The substrate 10 received by a transport conveyor (not shown) is clamped at both end portions thereof by the clamper 7 in a state where the already mounted surface is received by the receiving device 6. By driving the substrate positioning unit 1, the substrate 10 can be moved in the X direction and the Y direction to adjust the position of the substrate 10 during screen printing. The printed substrate 10 is carried out by a carry-out conveyor (not shown).

  A screen mask 11 is disposed above the substrate positioning unit 1, and the screen mask 11 is configured by mounting a mask plate 11b on a holder 11a. The substrate 10 is aligned with the mask plate 11b by the substrate positioning unit 1 and abuts from below the mask plate 11b. A squeegee unit 13 is disposed on the screen mask 11. The squeegee unit 13 includes two squeegees 13b that are driven up and down by a cylinder 13a. The squeegee unit 13 can reciprocate in the horizontal direction (Y direction) by a moving means (not shown).

  In a state where the substrate 10 is in contact with the lower surface of the mask plate 11b, cream solder is supplied onto the mask plate 11b, and the squeegee 13b is brought into contact with the surface of the mask plate 11b and slid on the surface of the substrate 10. The cream solder is printed through the pattern holes provided in the mask plate 11b.

  A substrate warp correction unit 14 (substrate pressing means) is disposed above the substrate positioning unit 1 so as to be able to advance and retract in the horizontal direction. The substrate warp correction unit 14 includes a warp correction plate 14b that can be moved up and down by a cylinder 14a. In a state where the warp correction plate 14b is moved above the substrate positioning portion 1 and lowered with respect to the substrate 10, the lower support raising / lowering portion 8 is raised and the lower support pin unit 9 is pressed against the lower surface of the substrate 10, The warp of the substrate 10 can be corrected.

Next, the substrate support device 6 will be described with reference to FIG. In FIG. 2 (a), a lower lift 8 is disposed on the Z-axis table 5 so as to be lifted and lowered by a lift mechanism (not shown). A plurality of lower receiving pin units 9 are attached to the lower receiving base portion 8 a on the upper surface of the lower receiving raising / lowering portion 8.

  The lower receiving pin unit 9 includes a plurality of lower receiving pin modules 20 (four in the present embodiment) that hold the lower receiving pins 21 arranged in a vertical posture so as to be movable up and down and can be set to any desired pin height. This is a combination. As shown in FIG. 2B, by arranging the receiving pin units 9 on the receiving base portion 8a according to the size of the substrate 10 and the receiving position, a plurality of receiving members corresponding to the substrate 10 are provided. A lower receiving portion in which the pins 21 are arranged in a vertical posture is configured. Of course, the lower receiving pin module 20 may be arranged alone on the lower receiving base portion 8a.

  Next, the structure of the receiving pin module 20 will be described with reference to FIG. In FIG. 3, reference numeral 22 denotes a prismatic holding block (holding body) that holds the receiving pin 21 in a vertical posture so as to be slidable in the vertical direction. The piston 23 is slid on the housing portion 22a formed inside. It fits freely. A lower receiving pin 21 mainly composed of a hollow shaft is slidably inserted into a sliding hole 23 a provided in the central portion of the piston 23. A resin end 29 made of a conductive resin is detachably attached to the upper end of the lower receiving pin 21, and the lower portion of the lower receiving pin 21 is inserted into the pin holding hole 22e. A spring 27 (biasing means) is mounted in the pin holding hole 22e, and the lower receiving pin 21 is biased upward by the spring 27.

  Here, with reference to FIG. 5, the mounting method of the resin end part 29 and the resin end part 29 is demonstrated. A fitting portion 29a that fits into the inner hole 21a of the lower receiving pin 21 is provided below the resin end portion 29, and the resin end portion 29 is lowered by press-fitting the fitting portion 29a into the inner hole 21a. Attached to the receiving pin 21. A slot 21b is provided at the upper end of the lower receiving pin 21, and when the resin end 29 is removed from the lower receiving pin 21, a sharp pin is inserted into the slot 21b to insert the resin end 29 into the lower end. Extract. The function of the resin end portion 29 will be described later.

  A seal member (not shown) for sealing the contact surface with the inner periphery of the housing portion 22a and the contact surface with the outer periphery of the lower receiving pin 21 is mounted on the outer peripheral surface of the piston 23 and the inner surface of the insertion hole 23a. The pressurized air is supplied from the air supply source 28 through the air supply hole 22c provided in the side surface into the pressurizing chamber 22b at the upper part of the housing portion 22a. Pushed down.

  A brake plate 24 provided with an insertion hole 24 a through which the lower receiving pin 21 is inserted is supported below the piston 23 by a pin 25. The opposite side of the shaft support end of the brake plate 24 is urged in the direction of the arrow by a spring 26 mounted on the spring seat 22d. The hole diameter of the insertion hole 24a is set to be somewhat larger than the diameter of the lower receiving pin 21, and when the brake plate 24 is horizontal, the insertion hole 24a does not contact the lower receiving pin 21 (see FIG. 4). 3, the edge of the insertion hole 25 a is set to contact the lower receiving pin 21 in a state where the brake plate 24 is inclined at a predetermined angle.

  As described above, the brake plate 24 is inclined from the horizontal posture in a state where it is biased by the spring 26. As a result, the edge of the insertion hole 24a is pressed against the outer peripheral surface of the lower receiving pin 21 by an urging force to generate “galling”, whereby the vertical position of the lower receiving pin 21 is fixed at an arbitrary position. That is, the brake plate 24 and the spring 26 provided with the insertion hole 24a are position fixing means for fixing the vertical position of the lower receiving pin 21 at an arbitrary position. The spring 26 is a pressing means that presses the insertion hole 24 a against the lower receiving pin 21.

Then, as shown in FIG. 4, the pressurized chamber 22b is pressurized by supplying pressurized air from the air supply hole 22c, and the piston 23 is pushed downward by the applied pressure. As a result, the brake plate 24 is pushed down against the urging force of the spring 26 and becomes in a horizontal state. As a result, the insertion hole 24a does not contact the lower receiving pin 21, and the position fixing of the lower receiving pin 21 is released. That is, the piston 23 and the air supply source 28 serve as pressing release means.

  The screen printing apparatus and the receiving apparatus are configured as described above. Hereinafter, the preparation work for receiving performed prior to screen printing will be described with reference to FIGS. First, in accordance with the substrate 10 to be received, the lower receiving pin unit 9 is arranged on the lower receiving base portion 8a to constitute the lower receiving portion. Here, the quantity and arrangement of the receiving pin units 9 are determined according to the size of the substrate 10 and the position of the electronic component P on the already mounted surface (see FIG. 2).

  At this time, regarding the lower receiving pin module 20 corresponding to a specific position where the electronic component P does not exist on the lower surface of the substrate 10, the upper and lower sides of the lower receiving pin 20 (see the lower receiving pin 21A hatched in FIG. 6A). Keep the position fixed. The specific position is appropriately determined in accordance with the size and rigidity of the substrate as an appropriate position and number as a correction action point for applying a force for correcting the warp of the substrate 10.

  If the substrate 10 is held by the clamper 7, the substrate warp correction portion 14 (FIG. 1) is moved onto the substrate 10 as shown in FIG. 6A, and then the warp correction is performed as shown in FIG. 6B. The plate 14b is lowered and pressed against the clamper 7. Then, in this state, as shown in FIG. At this time, for the lower support pins 21 other than the lower support pins 21 </ b> A of the specific position described above, pressurized air is supplied into the pressurizing chamber 22 c in each lower support pin module 20, and the upper and lower positions of the lower support pins 21 are fixed. Cancel.

  When the lower support raising / lowering portion 8 is raised, the resin end 29 attached to the upper end portion of the lower support pin 21 of each lower support pin unit 9 comes into contact with the lower surface of the substrate 10 or the electronic component P. At this time, when the resin end portion 29 attached to the lower receiving pin 21A whose vertical position is fixed contacts the lower surface of the substrate 10, the substrate 10 is pushed up and pressed against the warp correction plate 14b. Thus, the vertical warping of the substrate 10 is corrected following the lower surface of the warp correction plate 14b.

  Further, the upper end portions of the lower receiving pins 21 whose vertical position is released are brought into contact with the electronic component P in the ascending process and pushed downward, and stop at a height corresponding to the shape of each electronic component P. Thereby, the vertical position of each lower receiving pin 21 follows the shape of the lower surface of the substrate 10. In this state, the supply of pressurized air is stopped in each of the receiving pin modules 20. Thereby, the insertion hole 24a of the brake plate 24 is pressed against the lower receiving pin 21, and the vertical position of the lower receiving pin 21 is fixed.

  That is, the lower receiving pin module 20 having a position fixing means for fixing the vertical position of the lower receiving pin 21 at an arbitrary position and a pressing releasing means for releasing the position fixing of the lower receiving pin 21 is an upper end of the lower receiving pin 21. This is a pin height copying mechanism for copying the height position of the portion to the shape of the lower surface of the substrate to be received. The pin height tracing mechanism is not limited to the above-described configuration. For example, instead of the spring 27 that biases the lower receiving pin 20 upward, a biasing means based on fluid pressure is used, and fluid movement is blocked by valve control. Accordingly, various copying mechanisms such as a method for fixing the vertical position of the lower receiving pin 20 can be employed.

  Next, as shown in FIG. 7B, the warp correction plate 14b is raised and the lower support raising / lowering portion 8 is lowered. As a result, the lower receiving base portion 8a on the upper surface of the lower receiving lift 8 is prepared with a lower receiving portion in which the height of each lower receiving pin 21 is set in accordance with the shape of the mounted surface of the target substrate 10. Complete. In the subsequent production of the substrate 10, the substrate receiving is performed by the receiving portion.

  By using the base plate device 6 combined with the base pin module 20 that can fix and release the vertical position in any position, electronic components can be mounted on the already mounted surface as conventionally required. There is no need to perform a complicated preparation work for selecting a non-existing baseable part for each substrate and mounting a base pin on each baseable part. Therefore, the efficiency of the setup change work can be improved, and the receiving position can be set at an appropriate support interval regardless of the presence or absence of the placeable receiving part. Can be improved.

  Further, by mounting the resin end portion 29 on the upper end portion of the lower receiving pin 21 of such a lower receiving device 6, in the conventional lower receiving device having the pin height copying mechanism, the height of the lower receiving pin is set. It is possible to prevent the following problems that have occurred in association with each other. That is, there is a slight individual difference in the height of each board that is inevitably generated in the work of copying the height of the receiving pin, for example, the height of the electronic component in the mounted state and the shape of the solder joint. Even in this case, these slight differences are absorbed by the resin end 29 being slightly deformed. Therefore, in a partially conventional underlay device, damage such as a scratch on the surface of an electronic component or a substrate that is generated by directly pressing the metal underpin 20 does not occur. Since a conductive resin is used for the resin end portion 29, static electricity charged on the substrate is eliminated through the resin end portion 29 when receiving, and no trouble due to electrostatic charging occurs.

  In addition, since the resin material is easily worn, the upper end surface of the resin end 29 is worn by repeatedly using the resin end 29 on a large number of substrates. Even in such a case, in the lower receiving pin module 20 shown in the present embodiment, since the lower receiving pin 21 is configured to follow the shape of the lower surface of the substrate, the resin end 29 is worn considerably. However, the same resin end portion 29 can be used repeatedly as long as it is within the allowable range of the lifting stroke of the lower receiving pin 21.

  FIG. 8 shows an example in which such a receiving device is used for screen printing. FIG. 8A shows the screen printing apparatus shown in FIG. 1, in which the upper surface of the substrate 10 on which the electronic component P is mounted on the lower surface is aligned with the mask plate 11b of the screen mask 11, A state in which the height of the lower receiving pin 21 is made to conform to the shape of the lower surface of the substrate 10 is shown. At this time, the arrangement of the lower receiving pin units 9 on the lower receiving base portion 8a of the lower receiving lift unit 8 is such that the lower receiving pins 21 are arranged not only in the range of the substrate 10 but also in the outer portion of the substrate 10. It is a base pin arrangement.

  In a state after the preparation work, the upper and lower positions of the lower support pins 21 outside the range of the substrate 10 are fixed at a height position that follows the lower surface of the mask plate 11b. Thus, in the screen printing operation in which the squeegee 13b is slid on the screen mask 11b, the lower surface of the mask plate 11b in the peripheral portion of the substrate 10 as well as the substrate 10 as shown in FIG. Is supported from below.

  For this reason, the mask plate 11b located in the peripheral part of the board | substrate 10 does not droop down in squeezing. As a result, the adhesion failure between the mask plate 11b and the upper surface of the substrate 10 due to partial deformation of the mask plate 11b does not occur, and the printing quality can be stabilized.

  In the above example, an example in which the receiving device is used for a screen printing device has been shown. However, in addition to this, for devices that need to receive a substrate after mounting an electronic component on one side, such as an electronic component mounting device. The present invention can be applied to this.

  The substrate receiving apparatus of the present invention has an effect that the substrate can be received without damaging the electronic component or the surface of the substrate, such as surface scratches. Electronic components such as screen printing devices and electronic component mounting devices This is useful in the field of receiving a substrate with a receiving pin in a mounting apparatus.

1 is a front view of a screen printing apparatus according to an embodiment of the present invention. (A) Front view of substrate receiving apparatus according to one embodiment of the present invention (b) Partial plan view of substrate receiving apparatus according to one embodiment of the present invention Sectional drawing of the base pin module of the board | substrate in the apparatus for electronic member mounting of one embodiment of this invention Sectional drawing of the base pin module of the board | substrate in the apparatus for electronic component mounting of one embodiment of this invention The fragmentary perspective view of the base pin of the base pin module of the board in the electronic component mounting apparatus of one embodiment of the present invention Explanatory drawing of the base preparation work in the base plate method of one embodiment of the present invention Explanatory drawing of the base preparation work in the base plate method of one embodiment of the present invention Explanatory drawing of the base preparation work in the base plate method of one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate positioning part 6 Bottom receiving apparatus 8 Bottom receiving raising / lowering part 8a Bottom receiving base part 9 Bottom receiving pin unit 10 Board | substrate 14 Warp correction part 20 Bottom receiving pin module 21 Bottom receiving pin 29 Resin edge part

Claims (1)

An electronic component mounting apparatus that supports a substrate with a lower receiving pin in the electronic component mounting apparatus, wherein the lower receiving portion includes a plurality of the lower receiving pins arranged in a vertical posture; A pin height tracing mechanism for copying the height position of the upper end portion of the receiving pin to the shape of the lower surface of the substrate to be received, and a resin end made of a conductive resin detachably attached to the upper end portion of the lower receiving pin An apparatus for mounting a substrate in an apparatus for mounting electronic components, comprising:

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