JP2005089609A - Method and apparatus for applying adhesive tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for applying an adhesive tape, enabling the adhesive tape to be smoothly released from a release liner. <P>SOLUTION: The method for applying the adhesive tape 4 released from the release liner 6 onto the surface of an article 2 is characterized by facilitating releasing the adhesive tape 4 from the release liner 6 by heating the release area between the release liner 6 and the adhesive tape 4 to room temperature (20°C) to 80°C by any heating means enabling temperature control. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an adhesive tape application method and application device, and more particularly to an adhesive tape application method and application device on an article such as a semiconductor wafer, a lead frame, and various printed boards.

  For example, thin processing methods for semiconductor wafers (hereinafter referred to as wafers) include mechanical and chemical methods such as grinding methods, polishing methods (CMP), and etching methods. These methods are generally used as a method of processing the back surface of a wafer after affixing an adhesive tape for pattern protection on the wafer surface on which a wiring pattern is formed.

  In a back grinding apparatus for processing the back surface of the wafer, the front surface of the wafer is sucked and held by a chuck table, and the back surface of the wafer is ground with a grindstone. For this reason, when processing the back surface, the circuit formed on the front surface side of the wafer may be damaged or soiled. Therefore, an adhesive tape for pattern protection is applied to the wafer surface for processing.

  And as for the structure of this adhesive tape, the release liner as a cover film is provided in the adhesive surface. In general, the surface of the release liner is subjected to a release treatment such as forming a release layer or the like in order to improve the release property with the pressure-sensitive adhesive (see, for example, Patent Document 1). .

  However, since this adhesive tape is directly attached to the pattern surface formed on the wafer surface, the release treatment agent applied to the release liner surface for release treatment is transferred to the adhesive side. As a result, the wafer pattern surface may be contaminated.

Then, the adhesive tape using the release liner which does not perform a mold release process is being used (for example, patent document 2). However, in the case of a release liner that has not been subjected to a release treatment, there is a problem that the release of the adhesive and the liner cannot be performed smoothly, and the automatic processing operation cannot be stably performed by the apparatus. In addition, the release liner is heavy and difficult to release, and the adhesive surface is roughened and the adhesiveness of the wafer surface is reduced compared to the case of the release liner that has been subjected to the release treatment. It stretches or breaks. Furthermore, there is a problem that large static electricity is generated.
JP-A-9-123360 JP, 2002-59515, A Therefore, even if it is an adhesive tape with a heavy release of an adhesive and a release liner, the sticking device of an adhesive tape which makes release of an adhesive and a release liner smooth with a light force is desired. ing.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the sticking method and sticking apparatus of an adhesive tape which enabled the release liner of an adhesive tape to be performed smoothly.

  The adhesive tape attaching method according to the present invention is an adhesive tape attaching method for attaching an adhesive tape released from a release liner to the surface of an article, and heating a release part of the release liner and the adhesive tape. Thus, the release of the adhesive tape from the release liner is facilitated.

  By heating the release part of the release liner and the adhesive tape, it becomes possible to easily release the adhesive tape from the release tape, and even if the adhesive tape is not subjected to release treatment, The surface of the pressure-sensitive adhesive is not roughened, and the pressure-sensitive adhesive tape does not stretch, so that the pressure-sensitive adhesive force of the pressure-sensitive adhesive does not deteriorate. Further, since the adhesive tape can be easily released from the release liner, it is possible to smoothly apply the adhesive tape to the article surface without generating large static electricity.

  Moreover, it is preferable that the sticking method of the adhesive tape which concerns on this invention heats a mold release site | part of a release liner and an adhesive tape in the temperature range of room temperature (20 degreeC)-80 degreeC.

  Decreasing the adhesive strength of the adhesive tape by heating the release part of the release liner and the adhesive tape to a temperature range of room temperature (20 ° C) to 80 ° C, preferably 40 ° C to 60 ° C, more preferably 50 ° C. It is possible to easily release the pressure-sensitive adhesive tape and the release liner without causing them.

  Moreover, the adhesive tape sticking device of the present invention is an adhesive tape sticking device for sticking an adhesive tape to the surface of an article, the chuck table for placing the article, and the adhesive tape on the article placed on the chuck table. Supplied from the tape supply unit, the release mechanism unit for releasing the adhesive tape from the release liner, the liner take-up unit for winding the release liner released from the release mechanism unit, and the tape supply unit A sticking mechanism for sticking the adhesive tape to be applied on the article, and the release mechanism is provided with a heating means for heating the release part of the adhesive tape and the release liner. It is characterized by.

  According to such a configuration, the operation of applying the adhesive tape to the article can be performed continuously and stably.

  Moreover, it is preferable that a heating means can control temperature in the sticking apparatus of this invention. In addition, it is preferable that this heating means can control the temperature within a temperature range of room temperature (20 ° C.) to 80 ° C., preferably 40 ° C. to 60 ° C., more preferably 50 ° C.

  According to such a configuration, the adhesive tape and the release liner can be easily released without reducing the adhesive force of the adhesive tape.

  In the adhesive tape sticking device according to the present invention, it is preferable that the heating means is a roller in which a heater is incorporated, and the heating means is a plate in which the heater is incorporated.

  According to such a configuration, it is possible to efficiently heat the release site between the adhesive tape and the release liner, and it is possible to smoothly release the adhesive tape and the release liner.

  According to the present invention, the release liner of the adhesive tape can be released with a light force by heating the release site between the adhesive tape and the release liner. Therefore, the release liner can be released with a light force even in the case of a release liner that has not been subjected to release treatment on the surface of the adhesive, or even in the case of a wide adhesive tape. Can be performed stably. Furthermore, by releasing the release liner, it is possible to prevent roughening of the pressure-sensitive adhesive surface and minimize the generation of static electricity without extending the pressure-sensitive adhesive tape.

  Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, an adhesive tape attaching apparatus 1 according to this embodiment includes a wafer storage unit 11a, 11b that stores a wafer 2 that is an article to which an adhesive tape is applied, and a wafer from the wafer storage unit 11a, 11b. 2, a robot arm 12 that carries 2, an alignment stage 14 that places and positions the wafer 2 that is carried by the robot arm 12, a chuck table 3 that holds the positioned wafer 2, and a substrate that is placed on the chuck table 3. A tape supply unit 5 for supplying the adhesive tape 4 to the wafer 2 formed; a release mechanism unit 7 for releasing the adhesive tape 4 from the release liner 6; and a release liner 6 released by the release mechanism unit 7. A liner take-up unit 8 for winding up, a sticking mechanism unit 9 for sticking the adhesive tape 4 supplied from the tape supply unit 5 on the wafer 2, and a sticking to the wafer 2 The pressure-sensitive adhesive sheet 4 that is an adhesive tape cut-out means 10 crop along the outer periphery of the wafer 2, and is configured to unwanted tape winding portion 15 for winding the adhesive tape 4 which has become unnecessary as a main unit.

  As shown in FIG. 2, the wafer storage portions 11a and 11b can store and load the wafers 2 in multiple stages. At this time, the wafer 2 maintains a horizontal posture with the pattern surface facing upward.

  The robot arm 12 is configured to turn by a drive mechanism (not shown). A wafer holding part 17 having a horseshoe shape is provided at its tip. The wafer holding part 17 is provided with a suction hole (not shown) so that the wafer 2 is vacuum-sucked from the back surface.

  That is, the robot arm 12 sucks and holds the wafer 2 from the back surface by the wafer holding unit 17 moving forward and backward through the gap between the wafers 2 stored in multiple stages in the wafer cassettes 11a and 11b. The alignment stage 14, the chuck table 3, and the wafer cassettes 11a and 11b are conveyed in this order.

  The alignment stage 14 aligns the mounted wafer 2 based on an orientation flat or the like.

  The chuck table 3 is positioned based on the orientation flat of the transferred wafer 2 as a reference, and covers the entire back surface of the wafer 2 for vacuum suction. That is, the chuck table 3 is provided with suction holes in the outer peripheral area and the center thereof.

  Further, the chuck table 3 is provided with a groove for cutting the adhesive tape 4 along the outer peripheral edge of the wafer 2 by inserting a blade edge 20 of an adhesive tape cutting means 10 described later. A plurality of grooves according to the outer diameter of the wafer 2 having different sizes are provided. The initial position where the cutting edge 20 of the adhesive tape cutting means 10 for the groove is inserted is a wide groove provided in the radial direction of the chuck table 3, and is connected to all of the plurality of grooves.

  As shown in FIG. 3, the tape supply unit 5 winds the adhesive tape 4 with the release liner 6 fed from the tape bobbin 21 around the release mechanism unit 7 composed of the guide roller groups 7a, 7b, 7c, and 7d. Guide the times. The tape supply unit 5 is pivotally supported by a vertical wall of the apparatus main body (not shown) and is restricted from rotating through a brake mechanism or the like.

  Of the guide roller groups 7a, 7b, 7c, and 7d constituting the release mechanism unit 7, the guide roller 7d corresponding to the release portion between the adhesive tape 4 and the release liner 6 has a temperature of room temperature (20 ° C.) to 80 ° C. The temperature can be controlled in the range. As shown in FIG. 5, the guide roller 7d includes a heat insulating plate 42 provided at both shaft ends, and a flange 43 that is fixed to the heat insulating plate and inserted into a shaft 36 in which a round bar-shaped heater 35 is incorporated. A sensor 41 for measuring the temperature of the shaft 36 in which the heater 35 is incorporated, a roller surface 38 in contact with the shaft 36 and the release liner 6, and a collar body inserted between the shaft 36 and the roller surface 38. , And a bearing 40 for rotating the roller surface 38 about the shaft 36 as an axis.

  The release liner winding unit 8 includes a collection bobbin 22 linked to a driving mechanism such as a motor, and guide roller groups 8a and 8b pivotally supported on a vertical wall of an apparatus main body (not shown).

  As shown in FIG. 4, the tape applying mechanism unit 9 is held by the rail 24 of the apparatus main body so that the frame 23 can slide in the tape running direction, and is interlocked and connected via a driving unit such as a motor (not shown). ing. An affixing roller 25 is rotatably supported on the frame 23, and the affixing roller 25 is driven to swing up and down by a cylinder (not shown). That is, the adhesive roller 4 is applied to the surface of the wafer 2 while the application roller 25 rolls by pressing the surface of the adhesive tape 4.

  As shown in FIG. 2, the adhesive tape cutting means 10 controls a cutter unit 26 attached to the ball shaft 25 so as to be movable up and down, a lift drive unit 27 that moves the cutter unit 26 up and down, and the lift drive unit 27. And a control unit (not shown).

  The cutter unit 26 is connected at one end to an arm 28 that is cantilevered by an elevating drive unit 27, a motor 29 attached to the upper end of the arm 28, and a rotating shaft of a motor 29 that penetrates the arm 28 downward. It is comprised from the blade edge | tip 20 of the cutter attached so that turning was possible.

  The elevating drive unit 27 moves up and down along the ball shaft 25. Note that a stopper for regulating the lowermost position (height) of the lifting drive unit 27 is provided at the bottom of the ball shaft 25, although not shown.

  The motor 29 transmits the rotational force to the blade edge 20 via the rotation shaft, and turns the blade edge 20.

  As shown in FIG. 4, the unnecessary tape peeling mechanism 30 is held by the rail 24 of the apparatus main body so that the frame 31 can be slid in the tape running direction, and is interlocked and connected via a drive unit such as a motor (not shown). Has been. A peeling roller 32 is rotatably supported on the frame 31. The peeling roller 32 is driven to swing up and down by a cylinder (not shown). The peeling roller 32 is for peeling off the unnecessary adhesive tape 4 after being cut along the outer peripheral edge of the wafer 2 from the wafer 2.

  The unnecessary tape take-up unit 15 has a recovery bobbin 33 pivotally supported on the vertical wall of the apparatus 1 and is linked to a drive unit such as a motor. That is, a predetermined amount of the adhesive tape 4 is fed out from the tape supply unit 5 and supplied onto the wafer 2, and the unnecessary adhesive tape 4 after cutting is wound around the recovery bobbin 33 by operating the drive unit. It has become.

  Next, a round operation of attaching the adhesive tape 4 to the surface of the wafer 2 will be described with reference to the drawings. The robot arm 12 takes out the wafer 2 to be taken out of the wafer storage portions 11a and 11b in which the wafers 2 are stored in multiple stages. At this time, the wafer holding portion 17 of the robot arm 12 is inserted into the gap between the wafers 2 in the wafer storage portions 11a and 11b. The robot arm 12 picks up and holds the wafer 2 from the back surface by the wafer holding unit 17 and transfers the wafer 2 to the alignment stage 14.

  The wafer 2 placed on the alignment stage 14 is aligned based on an orientation flat, a notch or the like. After the alignment, the back surface of the wafer 2 is sucked and held by the robot arm 12 and transferred to the chuck table 3.

  The wafer 2 placed on the chuck table 3 is aligned and held by suction. At this time, the sticking mechanism portion 9 and the tape peeling mechanism portion 30 of the adhesive tape 4 are located at the initial position, and the cutter unit 26 is located at the upper standby position.

  When the positioning of the wafer 2 is completed, the sticking roller 25 of the sticking mechanism 9 of the adhesive tape 4 swings down, and the sticking roller 25 presses the adhesive tape 4 while moving on the wafer 2 in the direction opposite to the tape running direction. And the adhesive tape 4 is uniformly attached to the entire surface of the wafer 2. When the sticking mechanism 9 of the adhesive tape 4 reaches the end position, the sticking roller 25 is raised.

  Next, the cutter unit 26 descends to the adhesive tape cutting position, and the blade edge 20 pierces and penetrates the adhesive tape 4. At this time, the blade edge 20 penetrating the adhesive tape 4 is stopped at a predetermined position (height). The cutting edge 20 stopped at a predetermined position moves along a groove provided in the chuck table 3. That is, the adhesive tape 4 is cut along the outer peripheral edge of the wafer 2. At this time, the adhesive tape 4 is tensioned by the sticking mechanism portion 9 and the unnecessary tape peeling mechanism portion 30.

  After cutting the adhesive tape 4, the cutter unit 26 moves up and returns to the standby position.

  Next, the unnecessary tape peeling mechanism unit 30 rolls up and peels the unnecessary adhesive tape 4 cut on the wafer 2 while moving on the wafer 2 in the direction opposite to the tape running direction.

  When the unnecessary tape peeling mechanism part 30 reaches the end position of the peeling work, the unnecessary tape peeling mechanism part 30 and the sticking mechanism part 9 move in the tape running direction and return to the initial position. At this time, the unnecessary adhesive tape 4 is wound around the recovery bobbin 33 by the winding roller 16. At the same time, the adhesive tape 4 is fed out from the tape supply unit 5 together with a certain amount of the release liner 6.

  The adhesive tape 4 with the release liner 6 supplied from the tape supply unit 5 is separated into the release liner 6 and the adhesive tape 4 between the guide rollers 7c and 7d when passing through the release mechanism unit 7. The At this time, since the guide roller 7d is heated to room temperature (20 ° C.) to 80 ° C., preferably 50 ° C., the release liner 6 is easily released from the adhesive tape 4 with a light force. For this reason, even if the release liner 6 is not subjected to a release treatment or the like, it is possible to release the release liner 6 from the adhesive tape 4 with a light force, and the sticking of the adhesive tape can be stably performed. Continuous processing is possible. Further, since the release liner 6 can be released with such a light force, it is possible to prevent the surface of the adhesive from being roughened without stretching the adhesive tape 4, and thus the adhesiveness of the adhesive tape 4 is deteriorated. In addition, since it becomes possible to suppress generation | occurrence | production of static electricity, the sticking process of the stable adhesive tape can be reliably performed continuously.

  In addition, this invention is not limited to the above embodiment example, For example, it is also possible to implement as follows.

  In the above-described embodiment, the case where the release liner is released from the adhesive tape after the unnecessary tape is wound up is taken as an example. However, the release liner can also be released at the timing.

  In addition, the adhesive tape is not limited to a continuous adhesive tape, and may be an adhesive tape in which a label-like adhesive tape is disposed on a release liner.

  Furthermore, the heating means for heating the release part of the adhesive tape and the release liner is given as an example of a round bar heater, but the heating means can be any means that can heat the release part. The heater is not limited to the round bar-shaped heater described above, and may be, for example, a plate-shaped heater. The heating means may be an indirect method such as applying hot air as well as a type of heating that directly contacts the release liner as in the case of these heaters.

  Further, as an article, a wafer is taken as an example, but the present invention can also be applied to a case where an adhesive tape is stuck on a lead frame, or to a printed circuit board. When the article is a lead frame or a printed board, the shape of the chuck table can be changed according to the shape of the lead frame or the printed board, respectively.

  As described above, according to the present invention, the adhesive tape is released from the release liner by heating the release portion between the adhesive tape and the release liner when the adhesive tape is applied onto the wafer surface. Therefore, a stable adhesive tape sticking process can be reliably and continuously performed.

It is a perspective schematic diagram of an example of an embodiment of a sticking device of an adhesive tape concerning the present invention. It is a perspective schematic diagram of an important section of an example of an embodiment of a sticking device of an adhesive tape concerning the present invention. It is a perspective schematic diagram of an important section of an example of an embodiment of a sticking device of an adhesive tape concerning the present invention. It is a figure for demonstrating a series of operation | movement of the sticking process of an adhesive tape. It is the cross-sectional schematic which shows an example of the heating means of an example of embodiment of the adhesive tape sticking apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive tape sticking apparatus 2 Wafer 3 Chuck table 4 Adhesive tape 5 Tape supply part 6 Release liner 7 Release mechanism part 8 Release liner winding part 9 Adhesion mechanism part 10 Adhesive tape cutting means 11a, 11b Wafer storage part 14 Alignment Stage 15 Unnecessary tape take-up part 16 Take-up roller 17 Wafer holding part 20 Cutting edge 21 Tape bobbin 22 Recovery bobbin 23 Frame 24 Rail 25 Ball shaft 26 Cutter unit 27 Lifting drive part 30 Unnecessary tape peeling mechanism part 31 Frame 32 Peeling roller 33 Recovery Bobbin

Claims (8)

A method of applying an adhesive tape for attaching an adhesive tape released from a release liner to the surface of an article,
A method for applying an adhesive tape, comprising: heating the release part of the release liner and the adhesive tape to facilitate release of the adhesive tape from the release liner.   The method for applying a pressure-sensitive adhesive tape according to claim 1, wherein the release part of the release liner and the pressure-sensitive adhesive tape are heated in a temperature range of room temperature (20 ° C) to 80 ° C. An adhesive tape attaching device for attaching an adhesive tape to the surface of an article,
A chuck table for placing articles;
A tape supply unit for supplying an adhesive tape to the article placed on the chuck table;
A release mechanism for releasing the adhesive tape from the release liner;
A liner take-up portion for taking up the release liner released from the release mechanism portion;
An affixing mechanism for affixing the adhesive tape supplied from the tape supply unit on the article,
A pressure-sensitive adhesive tape sticking device, wherein the mold release mechanism portion is provided with a heating means for heating a release portion between the pressure-sensitive adhesive tape and the release liner.   The adhesive tape sticking device according to claim 3, wherein the heating means is temperature-controllable.   The pressure-sensitive adhesive tape sticking apparatus according to claim 4, wherein the heating means is capable of temperature control in a temperature range of room temperature (20 ° C) to 80 ° C.   The adhesive tape sticking device according to claim 4 or 5, wherein the heating means is a roller in which a heater is incorporated.   The adhesive tape sticking device according to claim 4 or 5, wherein the heating means is a plate in which a heater is incorporated. The adhesive tape sticking device according to any one of claims 3 to 7, wherein the article is a semiconductor wafer.