JP2005086458A - Array type ultrasonic vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic scanning array type ultrasonic vibrator for reducing a cross talk, raising a yield in manufacturing and obtaining a reliable vibration action, so as to reduce a manufacture cost. <P>SOLUTION: An array type ultrasonic vibrator 1 has, as basic configuration components, a piezoelectric vibrator 11, acoustic matching layers 12, 13, and a backing layer 18, and includes at least one element for mechanically connecting the individual devices constituting the ultrasonic vibrator array. The element for mechanically connecting the devices has a means satisfying at least one of the following conditions, i.e: the frequency characteristics of transverse wave vibration to be propagated through the element have no peculiar resonance frequency; a transverse wave resonance sharpness is smaller than the resonance sharpness of the resonance frequency in longitudinal vibration in each device constituting the ultrasonic vibrator array; a transverse vibration resonance frequency is not equal to a longitudinal vibration resonance frequency. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an array-type ultrasonic transducer, and more particularly to an array-type ultrasonic transducer used for an ultrasonic endoscope, an ultrasonic probe, or the like that obtains an ultrasonic tomographic image.

  2. Description of the Related Art In recent years, an ultrasonic diagnostic apparatus using an ultrasonic transducer (ultrasonic transducer) is widely used for medical diagnosis. Such an ultrasonic diagnostic apparatus employs an electronic scanning ultrasonic transducer in addition to a mechanical scanning ultrasonic transducer that mechanically scans ultrasonic waves by rotating a single ultrasonic transducer. Has been.

  This electronic scanning ultrasonic transducer generally uses an array type ultrasonic transducer configured in a form in which elements of a plurality of ultrasonic transducers are arranged in a predetermined direction.

  In a conventional electronic scanning array type ultrasonic transducer, for example, a signal (signal) electrode and a ground (ground) electrode are provided on both surfaces of a piezoelectric transducer, and a matching layer is laminated on the piezoelectric transducer. In general, a plurality of elements are dividedly formed by providing a cut groove reaching the midway depth of the matching layer. In this case, some ground electrodes are configured to be connected by a common ground line so as to be a common ground.

  FIG. 18 shows the configuration of a conventional electronic scanning array type ultrasonic transducer more specifically.

  FIG. 18 is a cross-sectional view schematically showing a configuration of a conventional electronic scanning array ultrasonic transducer.

  As shown in FIG. 18, a conventional electronic scanning array ultrasonic transducer 101 includes a piezoelectric transducer 111, an acoustic matching layer including a first acoustic matching layer 112 and a second acoustic matching layer 113, and a backing layer. 118 (also referred to as a damping layer) is a basic component, and as described above, the signal electrode 115 and the ground electrode (not shown) are provided on both surfaces of the piezoelectric vibrator 111. The ground electrode is commonly grounded by a predetermined common ground line 121.

  A first acoustic matching layer 112 and a second acoustic matching layer 113 are sequentially stacked on one surface of the piezoelectric vibrator 111 with a common ground line 121 interposed therebetween. Further, an acoustic lens 116 is laminated on the second acoustic matching layer 113.

  An insulating layer 117 is provided on the other surface of the piezoelectric vibrator 111 with the signal electrode 115 interposed therebetween, and a backing layer 118 is laminated on the insulating layer 117.

  A dividing groove 119 is formed in a predetermined portion of the second acoustic matching layer 113 from the insulating layer 117 through the piezoelectric vibrator 111, thereby dividing the piezoelectric vibrator 111 into a plurality of elements. The dividing groove 119 is filled with a filling member 120 such as silicone resin.

  The dividing groove 119 is provided to suppress crosstalk (which is interference of vibrations of adjacent vibrators, which will be described later, which means beam disturbance) generated in the ultrasonic vibrator.

  The acoustic lens 116 is provided on the side from which the ultrasonic waves are emitted, and is formed of, for example, a silicone resin. As shown in FIG. 18, the acoustic lens 116 is continuous from one end to the other end in the arrangement direction of a plurality of elements including the piezoelectric vibrator 111 and the two acoustic matching layers (112, 113). It is formed in a form and is arranged so as to have a so-called bridge structure.

  Some electronic scanning ultrasonic transducers can be operated by a sector scanning scanning method. In this sector scanning method, for example, a plurality of transducers are driven with a phase difference. Therefore, in the conventional electronic scanning ultrasonic transducer, so-called crosstalk in which vibrations of adjacent transducers interfere with each other may occur due to such a driving method. In this case, for example, an image signal at the time of constructing an ultrasonic image may be adversely affected, the ultrasonic image that can be acquired is deteriorated, and a good ultrasonic image cannot be obtained. Therefore, reducing and suppressing the occurrence of such crosstalk in an ultrasonic transducer has been a very important technical issue.

  Accordingly, various proposals for suppressing and reducing crosstalk have been conventionally made by, for example, Japanese Patent Application Laid-Open No. 2002-224104.

  FIG. 19 is a diagram illustrating another configuration of a conventional electronic scanning array ultrasonic transducer, and schematically illustrates the configuration of the array ultrasonic transducer disclosed in Japanese Patent Application Laid-Open No. 2002-224104. FIG.

  As shown in FIG. 19, the array-type ultrasonic transducer 101A has a conductive first on the lower surface (acoustic radiation surface side) of a belt-shaped piezoelectric transducer having electrodes (ground electrode 114A and signal electrode 115A) on both surfaces. A plurality of arrayed piezoelectric vibrators 111A are formed in the element arrangement direction by adhering the acoustic matching layer 112 and forming the dividing grooves 119A by a dicing machine. In this case, the generation of crosstalk is suppressed by forming the dividing groove 119A deeply.

  The second acoustic matching layer 113 is disposed on the lower surface of the first acoustic matching layer 112, and the acoustic lens 116 is disposed on the lower surface thereof. A backing frame member 118Aa is provided inside the acoustic lens 116, and a cable wiring board 122 is erected on the upper surface of the piezoelectric vibrator 111 inside the acoustic frame 116. This is filled with a backing material to form a backing layer 118A.

  The signal electrode 115A on the upper surface of the piezoelectric vibrator 111 is electrically connected to the cable wiring board 122 via the signal wiring wire 115Aa and the signal wiring land 115Ab. A ground wiring land 114 </ b> Aa is provided on the mounting surface of the cable wiring board 122. Although not shown, the ground wiring land 114Aa is electrically connected to the ground electrode 114A via a predetermined cable line or the like.

  In addition, the dividing groove 119A is filled with a filling member 120A such as a conductive adhesive in a portion that does not contact each piezoelectric vibrator 111A. This prevents a decrease in strength due to the formation of the dividing groove 119A, and at the same time ensures a common ground between the ground electrode 114A on the lower surface of each piezoelectric vibrator 111A and the first acoustic matching layer 112. It is configured as follows.

  With such a configuration, the occurrence of crosstalk is suppressed, and the common ground of the ground electrode 114A of the piezoelectric vibrator 111A can be stably secured.

  By the way, the occurrence of crosstalk is caused by mechanically connecting and bridging elements (elements) constituting the ultrasonic vibrator, such as the common ground line 121 and the filling member 120 / elements filled in the element gaps. It has been found that this is caused by propagation in the form of transverse wave vibration through the mounted base (for example, the backing layer 118, the insulating layer 117, and the acoustic lens 116).

  Specifically, for example, reference A (filling member filled in the dividing groove), reference B (common ground line 121 itself), reference C (near the boundary surface between the matching layer and the acoustic lens), reference D shown in FIG. It has been found that crosstalk is likely to occur through a portion indicated by (near the boundary surface between the insulating layer and the backing layer) or the like.

When the transverse wave vibration propagating through such a part causes resonance vibration, crosstalk increases, and specifically, the vibration modes are Rayleigh wave, Lamb wave surface wave, plate wave (bending wave, love wave). Either bulk wave or Stoneley wave interface wave. In this case, although the resonance frequency varies depending on each vibration mode, the resonance frequency f can be expressed by the following equation in any case.

here,
Resonance frequency: f
Bridge part thickness dimension: t
Length of bridge part: l
Shear modulus: G
Density: rho
If each of these parameters is constant in the elevation direction or the arrangement direction, strong resonance occurs, and thus there is a tendency that crosstalk increases.
JP 2002-224104 A

  However, depending on the configuration of the conventional electronic scanning type array ultrasonic transducer disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2002-224104, etc., no consideration is given to each parameter in the above equation (1). Since this is not done, there is a problem that the crosstalk generated by the transverse wave vibration in the array-type ultrasonic transducer cannot be reliably reduced or suppressed.

  In addition, in the conventional means for manufacturing an array type ultrasonic transducer, there is a problem that, for example, each element falls down after dicing, and the yield in component manufacturing is liable to decrease. However, improving such problems has become a bigger issue than before.

  The present invention has been made in view of the above-described points, and the object of the present invention is to reduce and suppress the occurrence of a chromo stroke, and at the same time, it is possible to improve the manufacturing yield. An object is to provide an inexpensive electronic scanning array type ultrasonic transducer capable of obtaining a reliable vibration action and contributing to a reduction in manufacturing cost.

  In order to achieve the above object, an array type ultrasonic transducer according to a first invention is an array type ultrasonic transducer having a piezoelectric vibrator, an acoustic matching layer, and a backing layer as basic constituent elements. In the array-type ultrasonic transducer having at least one element that mechanically connects the elements constituting the transducer array, the element that mechanically connects the elements is the frequency of the transverse wave vibration that propagates the element. Does not have a resonance frequency intrinsic to the characteristics, or has a transverse wave resonance sharpness smaller than the resonance sharpness at the resonance frequency when each of the elements constituting the ultrasonic transducer array vibrates longitudinally, or transverse vibration Means is provided for satisfying at least one of resonance frequency ≠ longitudinal vibration resonance frequency.

  According to a second aspect of the present invention, in the array-type ultrasonic transducer according to the first aspect of the present invention, the element that mechanically connects the elements of the piezoelectric vibrator is between the elements of the piezoelectric vibrator. It is the filling member with which the space | gap part provided is filled.

  A third aspect of the present invention is the array-type ultrasonic transducer according to the first aspect, wherein the element for mechanically connecting the elements of the piezoelectric transducer is a partial region of the acoustic matching layer. It is characterized by being.

  According to a fourth aspect of the present invention, in the array-type ultrasonic transducer according to the first aspect of the present invention, the element that mechanically connects the respective elements of the piezoelectric vibrator is a wiring having the ground electrode of each element as a common ground It is characterized by being.

  According to a fifth invention, in the array-type ultrasonic transducer according to the first invention, the element that mechanically connects the elements of the piezoelectric transducer is the acoustic lens.

  According to a sixth invention, in the array-type ultrasonic transducer according to the first invention, the element that mechanically connects the elements of the piezoelectric transducer is the backing layer.

  According to the present invention, it is possible to reduce and suppress the occurrence of the chromo stroke, and at the same time, it is possible to improve the manufacturing yield, thereby obtaining a more reliable vibration action and at the same time contributing to the reduction of the manufacturing cost. Thus, an inexpensive electronic scanning array ultrasonic transducer can be provided.

The present invention will be described below with reference to the illustrated embodiments.
FIG. 1 is a cross-sectional view schematically showing the configuration of the array-type ultrasonic transducer according to the first embodiment of the present invention.

  The array-type ultrasonic transducer 1 according to the present embodiment includes a piezoelectric transducer 11 and an acoustic matching layer composed of a first acoustic matching layer 12 and a second acoustic matching layer 13 as basic constituent elements. Lens 16, insulating layer 17, backing layer 18, filling member 20 filled in dividing groove 19, signal line (not shown) such as a flexible printed circuit board connected to each signal electrode, and each ground electrode And a common ground line (not shown) connected to the.

  A first acoustic matching layer 12 and a second acoustic matching layer 13 are sequentially stacked on one surface of the piezoelectric vibrator 11. An acoustic lens 16 is further laminated on the second acoustic matching layer 13. An insulating layer 17 is laminated on the other surface of the piezoelectric vibrator 11, and a backing layer 18 is laminated on the insulating layer 17.

  A dividing groove 19 is formed at a predetermined portion from the piezoelectric vibrator 11 to the first acoustic matching layer 12 and the second acoustic matching layer 13. The piezoelectric vibrator 11, the first acoustic matching layer 12, and the second acoustic matching layer 13 are divided into a plurality of elements (elements) by the division grooves 19. Thus, a plurality of ultrasonic transducer arrays (hereinafter simply abbreviated as arrays) are formed.

  A gap member of the dividing groove 19 is filled with a filling member 20 made of, for example, a slurry-like silicone resin as an element for mechanically connecting the elements of the piezoelectric vibrators 11 constituting the array.

  The dividing groove 19 is formed so that one surface, that is, the surface on the side of the insulating layer 17 in this embodiment is a flat surface, and the other surface, that is, the vicinity of the tip of the dividing groove 19 is a cylindrical curved surface. Has been. And it forms so that some clearance t1 may remain between the front-end | tip part vicinity of the division | segmentation groove | channel 19, and the boundary surface of the 2nd acoustic matching layer 13 and the acoustic lens 16. FIG. That is, the second acoustic matching layer 13 has a bridge structure leaving an extremely thin thin layer portion 13a.

  Therefore, the thin layer portion 13 a is a partial region of the acoustic matching layer and functions as an element that mechanically connects the elements of the piezoelectric vibrator 11. By providing this thin layer portion 13a, it is possible to prevent each array from falling down after dicing, for example, in the manufacturing process of the array type ultrasonic transducer 1, and to secure the strength of each array. Accordingly, this suppresses a decrease in yield during the manufacture of components.

  As described above, the tip of the dividing groove 19 is formed in a curved surface having a cylindrical cross section. Thereby, the gap dimension between the tip portion and the boundary surface between the second acoustic matching layer 13 and the acoustic lens 16 is set to be non-uniform in the arrangement direction of the elements of the piezoelectric vibrator 11. In other words, the thickness dimension of the thin layer portion 13a is within the range of the width l (el) 1 of the dividing groove 19 and viewed from the symbol t1 (minimum dimension) shown in FIG. It is set to change within the range of t2 (maximum dimension).

  On the other hand, the acoustic lens 16 is provided on the side from which the ultrasonic waves are emitted, and is formed of, for example, a silicone resin. As shown in FIG. 1, the acoustic lens 16 is formed in a continuous form from one end to the other end in the arrangement direction of a plurality of elements including the piezoelectric vibrator 11 and the two acoustic matching layers (12, 13). It has a bridge structure. Similarly, the insulating layer 17 and the backing layer 18 have a bridge structure formed continuously in the arrangement direction of each element. Therefore, as a result, the acoustic lens 16 and the backing layer 18 also function as elements that mechanically connect the elements of the piezoelectric vibrator 11.

It has been found that the transverse wave vibration propagating through the bridge structure portion like the thin layer portion 13a tends to increase the crosstalk when the resonance vibration occurs. In this case, the resonance frequency f can be expressed by the following equation.

Resonance frequency: f
Bridge part thickness dimension: t
Length of bridge part: l
Shear modulus: G
Density: rho
According to the above formula, the resonance frequency f is proportional to the thickness dimension t of the bridge part and inversely proportional to the length dimension l of the bridge part. If these parameters are constant in the elevation direction or the arrangement direction, strong resonance will occur, and there is a tendency for crosstalk to increase.

And, as a condition for causing resonance vibration and crosstalk, for example, (Condition 1) When having a resonance frequency f _ot unique to the frequency characteristics of the transverse wave vibration propagating through the elements that mechanically connect the elements,
(Condition 2) When the transverse wave resonance sharpness Q _ot is larger than the resonance sharpness Q _oL at the resonance frequency f _oL when each element vibrates longitudinally in the thickness direction,
(Condition 3) When the relationship between the transverse vibration frequency f _ot and the longitudinal vibration frequency f _oL matches,
It is. Therefore, if the setting is made so as to avoid these conditions, the crosstalk can be reduced and suppressed.

  In other words, any one of the above-described parameters, that is, the thickness t, the length l (el), the displacement elastic modulus G, and the density ρ is at least one of the arrangement direction, the elevation direction, and the thickness direction of each element. May be set to be non-uniform.

  Therefore, in the present embodiment, the thickness dimension t of the bridge portion is displaced in the range of the thickness dimension t1 to the thickness dimension t2 as described above, that is, nonuniform in the arrangement direction of the elements. Is set to

  An outline of the procedure for manufacturing the array-type ultrasonic transducer of this embodiment configured as described above will be briefly described below.

  First, the second acoustic matching layer 13, the first acoustic matching layer 12, the piezoelectric vibrator 11, and a flexible substrate (not shown) are sequentially joined.

  In this case, the first acoustic matching layer 12 and the second acoustic matching layer 13 are laminated and bonded to one surface of the piezoelectric vibrator 11. Further, a flexible substrate (not shown) is laminated and bonded to the other surface of the piezoelectric vibrator 11.

  In the state where the layers are joined in this way, the dicing groove 19 is formed by performing a cutting process with a dicing machine at a predetermined pitch and groove width (see reference numeral 1 in FIG. 1).

  Next, the filling member 20 is injected into the gap portion of the dividing groove 19, and the filling member 20 is cured by allowing a certain time to elapse.

  After the filling member 20 is cured, the insulating layer 17 is bonded, and the backing layer 18 is bonded.

  Note that the insulating layer 17 is not necessarily an essential component, and the insulating layer 17 may be omitted. In recent years, various array-type ultrasonic transducers in which the insulating layer 17 is omitted have been manufactured and put into practical use.

  In the array type ultrasonic transducer 1 of the present embodiment generated in this way, the cross section in the vicinity of the tip of the dividing groove 19 is formed into a cylindrical curved surface. It becomes non-uniform in the arrangement direction. As a result, conditions that can avoid the above-described conditions (1) to (3) in which crosstalk occurs are set.

  As described above, according to the first embodiment, the thickness of the thin layer portion 13a (bridge portion) is obtained by devising the cross-sectional shape of the tip portion of the dividing groove 19 and forming a cylindrical curved surface. The dimension can be set non-uniformly in the arrangement direction of the elements. Thereby, the crosstalk which generate | occur | produces in the thin layer part 13a (bridge site | part) can be reduced easily and suppressed.

  In the first embodiment described above, an example is given in which the shape of the tip portion of the dividing groove 19 is formed to be a cylindrical curved surface. However, the thickness dimension of the bridge portion is not set in the arrangement direction of each element. Any shape that can be set uniformly may be used. Each of the second to third embodiments shown in FIGS. 2 to 4 is an example of various shapes in which the thickness dimension of the bridge portion can be set non-uniformly in the arrangement direction of each element.

  FIG. 2 is a cross-sectional view schematically showing the configuration of the array-type ultrasonic transducer according to the second embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the above-described first embodiment, and is different only in that it is configured by changing the shape of the dividing groove. Therefore, in the present embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  In the array-type ultrasonic transducer 1A of the present embodiment, as shown in FIG. 2, one surface of the dividing groove 19A, that is, the surface on the side of the insulating layer 17 is flat, and the other surface, that is, the tip of the dividing groove 19A. The cross-sectional shape in the vicinity of the section is formed to be a ship bottom shape.

  That is, the tip end portion of the dividing groove 19A is set such that the groove width l (el) 2 at the most distal portion is narrower than the groove width l (el) 1 of the main part. And the slope part is formed between the most advanced part and the predetermined part of the main part. Thereby, the thickness dimension t of the bridge part is changed from the thickness dimension t1 (minimum dimension part) in the part of the groove width l (el) 2 to the thickness dimension t2 (maximum dimension part) in the part of the groove width l (el) 1 ), That is, non-uniformity in the arrangement direction of the elements. Other configurations are the same as those in the first embodiment described above.

  According to the second embodiment configured as described above, it is possible to obtain the same effect as that of the first embodiment.

  FIG. 3 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the third embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the first and second embodiments described above, and is different only in that the shape of the dividing groove is different. Therefore, also in this embodiment, the same components as those in the first and second embodiments described above are denoted by the same reference numerals, detailed description thereof will be omitted, and only different parts will be described below.

  In the array type ultrasonic transducer 1B of the present embodiment, as shown in FIG. 3, the sectional shape of the dividing groove 19B is formed to be substantially trapezoidal.

  As a result, the groove width l (el) 2 at the most distal portion of the dividing groove 19B is set to be narrower than the groove width l (el) 1 at the base, and a tapered slope is formed between the most distal portion and the base. Therefore, the sectional shape of the dividing groove 19B is substantially trapezoidal.

  Therefore, the thickness dimension t of the bridge part is changed from the thickness dimension t1 (minimum dimension part) in the part of the groove width l (el) 2 to the thickness dimension t2 (maximum dimension part) in the part of the groove width l (el) 1. It is set so as to be displaced in the range of, i.e., non-uniform in the arrangement direction of each element. Other configurations are the same as those in the first embodiment described above.

  In addition, in the dividing groove in the present embodiment, a larger effect can be obtained as the setting of the taper angle is increased.

  According to the third embodiment configured as described above, the same effect as that of the first embodiment can be obtained. Further, in this dividing groove 19B, the thin layer portion 13a has a uniform heat t1, but by making l (El) 1 non-uniform as in the first and second embodiments. Good crosstalk characteristics can be obtained.

  FIG. 4 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the fourth embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the first to third embodiments described above, except that the configuration of the divided grooves is different. Therefore, also in the present embodiment, the same components as those in the first to third embodiments described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  In the array type ultrasonic transducer 1C of this embodiment, as shown in FIG. 4, one surface of the dividing groove 19C, that is, the surface on the side of the insulating layer 17 is a flat surface, and the other surface, that is, the tip of the dividing groove 19C. The section in the vicinity of the part is formed to have a slope.

  As a result, the thickness t of the thin layer portion 13a (bridge portion) at the tip portion of the dividing groove 19C is changed from the thickness dimension t1 (minimum size portion) at the most distal portion to the groove width l (el) 1. Is set so as to be displaced within the range of the thickness dimension t2 (maximum dimension portion), that is, non-uniform in the arrangement direction of the elements. Other configurations are the same as those in the first embodiment described above.

  According to the fourth embodiment configured as described above, it is possible to obtain the same effect as that of the first embodiment.

  As described above, the first to fourth embodiments pay attention to the sectional shape of the dividing grooves 19, 19 A, 19 B, and 19 C in the vicinity of the boundary surface between the second acoustic matching layer 13 and the acoustic lens 16, and this This is an example of a means for realizing reduction and suppression of crosstalk caused by transverse wave vibration (see symbol C shown in FIG. 18) propagating through the thin layer portion 13a of the part.

  Note that the shape of the dividing groove is not limited to the above example, and various other shapes can be considered as long as the above conditions for avoiding the conditions (1) to (3) for generating the crosstalk are satisfied. .

  Next, in an array type ultrasonic transducer, an example of means for reducing and suppressing crosstalk caused by transverse wave vibration (see symbol A shown in FIG. 18) that propagates through a filling member that fills the gaps of the division grooves. Is described below.

  FIG. 5 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the fifth embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the first embodiment described above, and the shape of the dividing groove and the filling member that fills the gap portion of the dividing groove are different. Therefore, also in this embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  In the fifth to seventh embodiments described below, an array type ultrasonic transducer having an insulating layer omitted is described as an example. However, when an insulating layer is provided, Is the same.

  As shown in FIG. 5, the cross-sectional shape of the dividing groove 19 </ b> D in the array type ultrasonic transducer 1 </ b> D of the present embodiment is a normal substantially rectangular shape. A small gap t1 is formed between the front end surface of the dividing groove 19D and the boundary surface between the second acoustic matching layer 13 and the acoustic lens 16. That is, the second acoustic matching layer 13 has a bridge structure leaving an extremely thin thin layer portion 13a. And the filling member 20D is filled in the inside of the space | gap part of this division | segmentation groove | channel 19D.

  The filling member 20D has a configuration in which predetermined fine powder particles 20a are mixed and cured in a viscoelastic resin 20 such as a slurry-like silicone resin. In other words, the filling member 20 </ b> D is made of a composite resin formed in a form in which fine powder particles 20 a are randomly dispersed in the viscoelastic resin 20.

  Here, as the fine powder particles 20a mixed in the filling member 20D, a compound having good thermal conductivity and electrical insulation is used. Specifically, for example, tungsten trioxide, aluminum oxide, aluminum nitride, silicon carbide, zirconium oxide or the like is used.

  The filling member 20D is formed as follows in the process of manufacturing the array type ultrasonic transducer 1D.

  That is, the manufacturing method of the array type ultrasonic transducer 1D of the present embodiment is the same as that of the first embodiment described above. That is, the array type ultrasonic transducer 1D is formed in such a manner that the second acoustic matching layer 13, the first acoustic matching layer 12, the piezoelectric transducer 11 and the flexible substrate (not shown) are sequentially joined, The split grooves 19D having a pitch and a groove width (see reference numeral 1 in FIG. 1) are formed.

  Thereafter, the filling member 20D is filled into the gaps of the dividing grooves 19D. In this case, first, the viscoelastic resin 20 is injected into the gap portion of the dividing groove 19D, and in addition to this, predetermined fine powder particles 20a are mixed.

  In this state, the filling member 20D is cured when a certain time elapses, but a part of the fine powder particles 20a is arbitrarily subjected to the action of gravity in the viscoelastic resin 20 before being completely cured. It will sink. Thereby, the inside of the void portion of the dividing groove 19D is set so that the density distribution of the fine powder particles 20a is different in the thickness direction of the array type ultrasonic transducer 1D, that is, in the height direction of the void portion.

  Then, after the filling member 20D is cured, the backing layer 18 is bonded to the other surface of the piezoelectric vibrator 11. In this way, the array type ultrasonic transducer 1D of the present embodiment is formed. Other configurations are the same as those in the first embodiment described above.

  In the array type ultrasonic transducer 1D of this embodiment configured as described above, the transverse wave vibration propagating through the dividing groove 19D is attenuated by the filling member 20D. Therefore, this reduces and suppresses crosstalk. Other configurations are the same as those in the first embodiment described above.

  As described above, in the fifth embodiment, the filling member 20D in the form in which the predetermined fine powder particles 20a are mixed and cured in the viscoelastic resin 20 is filled in the gaps of the divided grooves 19D. Therefore, the transverse wave vibration propagating through the dividing groove 19D is attenuated by the filling member 20D, and the crosstalk caused by the transverse wave vibration can be easily reduced and suppressed.

  Note that, as described above, in the fifth embodiment, the one in which the cross-sectional shape of the dividing groove 19D is formed in an ordinary substantially rectangular shape is applied. In this case, it is conceivable that crosstalk is caused by the transverse wave vibration propagating through the thin layer portion 13a.

  Therefore, in the fifth embodiment, the same sectional shape of the dividing groove 19D as that in any one of the first to fourth embodiments described above can be applied. Then, the transverse wave vibration propagating through the tip portion of the dividing groove 19 can be attenuated to reduce and suppress the occurrence of crosstalk.

  FIG. 6 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the sixth embodiment of the present invention.

  The present embodiment has substantially the same configuration as the first and fifth embodiments described above, and the shape of the dividing groove and the filling member that fills the gap portion of the dividing groove are different. Therefore, also in the present embodiment, the same components as those in the first and fifth embodiments described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  As shown in FIG. 6, the cross-sectional shape of the dividing groove 19 in the array type ultrasonic transducer 1E of the present embodiment is such that the cross section in the vicinity of the tip is a cylindrical curved surface as in the first embodiment. Is formed. In this case, a slight gap t <b> 1 is formed between the tip of the dividing groove 19 and the boundary surfaces of the second acoustic matching layer 13 and the acoustic lens 16. That is, the second acoustic matching layer 13 has a bridge structure leaving an extremely thin thin layer portion 13a. The dividing groove 19 is filled with a slurry-like filling member 20E.

  The filling member 20E has a configuration in which predetermined fine powder particles 20b are mixed and cured in a viscoelastic resin 20 such as a slurry-like silicone resin. In other words, the filling member 20E is made of a composite resin formed in a form in which the fine powder particles 20b are randomly dispersed in the viscoelastic resin 20.

  Here, hollow glass fine particles are used as the fine powder particles 20b mixed in the filling member 20E. In addition to this, fine powder particles 20a made of at least one of tungsten trioxide, aluminum oxide, aluminum nitride, silicon carbide, zirconium oxide, etc. (fine powder particles in the above-described fifth embodiment) It is good also as a mixture containing.

  The filling member 20E is formed in substantially the same manner as in the fifth embodiment described above in the process of manufacturing the array type ultrasonic transducer 1E. However, in this case, since the hollow glass fine particles are used as the fine powder particles 20b to be mixed in the filling member 20E, the fine powder particles 20b (hollow) with respect to the viscoelastic resin 20 injected into the gaps of the dividing grooves 19D. When mixing the glass fine particles), it is necessary to consider the buoyancy of the fine powder particles 20b.

  That is, in the above-described fifth embodiment, when the fine powder particles 20a are mixed with the viscoelastic resin 20, the settlement action due to gravity is used. In the present embodiment, the fine powder particles are used. The buoyancy effect of 20b is used.

  The manufacturing method other than this point is the same as that of the fifth embodiment described above.

  In the array type ultrasonic transducer 1E of this embodiment configured as described above, the transverse wave vibration propagating through the dividing groove 19 is attenuated by the filling member 20E. Therefore, this reduces and suppresses crosstalk. Other configurations are the same as those in the first embodiment.

  As described above, according to the sixth embodiment, the same effect as in the fifth embodiment can be obtained.

  In the sixth embodiment, the sectional shape of the dividing groove 19 is the same as that of the first embodiment. With regard to the cross-sectional shape of the dividing groove 19, the same effect can be obtained even if the same shape as that of any one of the above-described second to fourth embodiments is applied instead.

  FIG. 7 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the seventh embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the first or sixth embodiment described above, and only the filling member that fills the gap portion of the dividing groove is different. Therefore, also in the present embodiment, the same components as those in the first or sixth embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  As shown in FIG. 7, the cross-sectional shape of the dividing groove 19 in the array type ultrasonic transducer 1F of the present embodiment is such that the cross section in the vicinity of the tip is a cylindrical curved surface as in the first embodiment. Is formed. The dividing groove 19 is filled with a slurry-like filling member 20F.

  The filling member 20F has a form in which predetermined fine powder particles 20c are mixed with a viscoelastic resin such as a silicone resin and cured. In other words, the filling member 20F is made of a composite resin formed in a form in which fine powder particles 20c are randomly dispersed in the viscoelastic resin 20.

  Here, as the fine powder particles 20c mixed in the filling member 20F, for example, bell structure fine particles containing fine particles in the hollow portion are used.

  In addition to this, a mixture containing fine powder particles 20a made of at least one of tungsten trioxide, aluminum oxide, aluminum nitride, silicon carbide, zirconium oxide, and the like may be used.

  The filling member 20F is formed in the same process as the fifth or sixth embodiment described above in the process of manufacturing the array-type ultrasonic transducer 1F. However, in the present embodiment, bell structure fine particles are used as the fine powder particles 20c mixed in the filling member 20F. The bell structure fine particles differ depending on whether the buoyancy occurs or sinks in the viscoelastic resin 20 depending on the material of the fine particles enclosed in the hollow interior. Therefore, the manufacturing method may be appropriately changed depending on the material of the fine particles to be enclosed in the hollow interior of the bell structure fine particles. That is, when the bell structure fine particles have the property of sinking, the bell structure fine particles are manufactured according to the above-described manufacturing method of the fifth embodiment. Just follow the method.

  In the array type ultrasonic transducer 1F of the present embodiment configured as described above, the transverse wave vibration propagating through the dividing groove 19 is attenuated by the filling member 20F. Therefore, this reduces and suppresses crosstalk. Other configurations are the same as those in the first embodiment.

  As described above, according to the seventh embodiment, the same effects as those of the fifth and sixth embodiments can be obtained.

  In the seventh embodiment as well, the same sectional shape of the dividing groove 19 as that in the first embodiment is applied as in the sixth embodiment. Therefore, the same effect can be obtained by applying the same sectional shape of the dividing groove 19 as that of any one of the second to fourth embodiments described above.

  Next, an example of means for reducing and suppressing crosstalk caused by transverse wave vibration (see reference C shown in FIG. 18) propagating through the acoustic lens in the array type ultrasonic transducer will be described below.

  FIG. 8 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the eighth embodiment of the present invention.

  This embodiment basically has the same configuration as that of the first embodiment described above, and is different in the shape of the dividing groove and the shape of the acoustic lens. Therefore, also in this embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  In the eighth to tenth embodiments described below, an array type ultrasonic transducer having an insulating layer 17 as in the first embodiment will be described as an example. However, the same applies when the insulating layer is omitted.

  As shown in FIG. 8, the cross-sectional shape of the dividing groove 19D in the array type ultrasonic transducer 1G of the present embodiment is a normal substantially rectangular shape (similar to the fifth embodiment, see FIG. 5). A small gap t1 is formed between the front end surface of the dividing groove 19D and the boundary surface between the second acoustic matching layer 13 and the acoustic lens 16. That is, the second acoustic matching layer 13 has a bridge structure leaving an extremely thin thin layer portion 13a. And the filling member 20 which consists of silicone resin etc. is filled in the space | gap part of this division groove | channel 19D, for example.

  Further, the acoustic lens 16G in the present embodiment has a substantially flat boundary surface with the second acoustic matching layer 13, and the acoustic lens 16G itself mechanically connects each element of the piezoelectric vibrator 11 constituting the array. Since it is an element to be connected, it has a structure in which the transverse wave vibration propagates through this portion and crosstalk is likely to occur.

  Therefore, in the acoustic lens 16G of the present embodiment, a curved concave portion 16a having a curved surface is provided at a predetermined portion on the outer surface, that is, each portion corresponding to each divided groove 19D. By providing the curved concave portion 16a, the thickness dimension t3 of the acoustic lens 16G at the site corresponding to the dividing groove 19D is set to be different from the thickness dimension t4 of the acoustic lens 16G at the other site. Become. Therefore, the transverse wave vibration propagating through the acoustic lens 16G is attenuated, and thus the crosstalk caused by the transverse wave vibration is reduced and suppressed. Other configurations are the same as those in the first embodiment described above.

  As described above, in the eighth embodiment, only by devising the surface shape of the acoustic lens 16G, the transverse wave vibration propagating through the acoustic lens 16G is attenuated, and crosstalk caused thereby is easily reduced. Can be deterred.

  Note that, as described above, in the eighth embodiment, the one in which the cross-sectional shape of the dividing groove 19D is formed in an ordinary substantially rectangular shape is applied. In this case, it is also conceivable that crosstalk occurs due to the transverse wave vibration propagating through the thin layer portion 13a as in the fifth embodiment.

  Therefore, also in the eighth embodiment, if the cross-sectional shape of the dividing groove 19D is the same as that of any one of the first to fourth embodiments described above, crosstalk can be reliably reduced and suppressed. it can.

  FIG. 9 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the ninth embodiment of the present invention.

  This embodiment has a configuration substantially similar to that of the first and eighth embodiments described above, and the shape of the dividing groove and the shape of the acoustic lens are different. Therefore, also in this embodiment, the same components as those in the first and eighth embodiments described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  As shown in FIG. 9, the cross-sectional shape of the dividing groove 19 in the array type ultrasonic transducer 1H of the present embodiment is such that the cross section in the vicinity of the tip is a cylindrical curved surface as in the first embodiment. Is formed. The dividing groove 19 is filled with a filling member 20.

  Further, in the acoustic lens 16H in the present embodiment, the boundary surface with the second acoustic matching layer 13 is substantially flat like the above-described eighth embodiment, and the acoustic lens 16H itself constitutes an piezoelectric vibration. It is an element that mechanically connects each element of the child 11. For this reason, the structure is such that cross-talk is likely to occur due to the propagation of the transverse wave vibration through this portion.

  Therefore, in the acoustic lens 16H of the present embodiment, a curved convex portion 16b having a curved surface is provided at a predetermined portion on the outer surface, that is, each portion corresponding to each divided groove 19 is formed. By providing the curved convex portion 16b, the thickness dimension t3 of the acoustic lens 16H at the portion corresponding to the dividing groove 19 and the thickness dimension t4 of the acoustic lens 16H at other portions are set to be different. become. Therefore, the transverse wave vibration propagating through the acoustic lens 16H is thereby attenuated, and thus crosstalk caused by the transverse wave vibration is reduced and suppressed. Other configurations are the same as those in the first embodiment described above.

  As described above, in the ninth embodiment, just by devising the surface shape of the acoustic lens 16H as in the eighth embodiment, the transverse wave vibration propagating through the acoustic lens 16H is attenuated. Thus, the crosstalk generated thereby can be easily reduced and suppressed.

  The surface shapes of the acoustic lenses 16G and 16H in the above-described eighth and ninth embodiments are not limited to the above-described example, and the conditions (1) to (3) that cause the above-described crosstalk can be avoided. Various other shapes are possible as long as the shape satisfies the conditions.

  Further, in the above-described ninth embodiment, the sectional shape of the dividing groove 19 is formed in the same manner as in the above-described first embodiment, but apart from this, in the above-described second to fourth embodiments. Even if any one of them is applied, the same effect can be obtained.

  FIG. 10 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the tenth embodiment of the present invention. FIG. 11 is a diagram showing a state of a pre-process for forming an acoustic lens in the process of manufacturing the array-type ultrasonic transducer of the present embodiment.

  In the eighth and ninth embodiments described above, the shape of a predetermined portion (the portion corresponding to each divided groove) on the outer surface of the acoustic lens is devised to reduce crosstalk and suppress it. is there. On the other hand, this embodiment obtains the same effect by devising the shape of the surface of the acoustic lens on the acoustic matching layer side.

  That is, the basic configuration of the present embodiment is substantially the same as that of the first embodiment described above, except that the arrangement of the dividing grooves and the shape of the acoustic lens are slightly different. Therefore, in the present embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  As shown in FIG. 10, the dividing groove 19J in the array type ultrasonic transducer 1J of the present embodiment is formed so that the cross-sectional shape near the tip thereof is a cylindrical curved surface as described above. This is the same as the embodiment.

  The dividing groove 19J is formed so as to reach a part of the acoustic lens 16J from the piezoelectric vibrator 11 through the first acoustic matching layer 12 and the second acoustic matching layer 13.

  Accordingly, the acoustic lens 16J has a plurality of curved concave portions 16c that engage with the shape of the tip of the dividing groove 19J, that is, a cross-sectional shape that becomes a cylindrical curved surface.

  Therefore, in the state in which the array type ultrasonic transducer 1J of the present embodiment is formed, a part of the tip of the dividing groove 19J is engaged with the curved recess 16c of the acoustic lens 16J, so that the gap of the dividing groove 19J. The part is in a sealed state. The sealed dividing groove 19 is filled with a filling member 20. Other configurations are the same as those in the first embodiment described above.

  An outline of the procedure for manufacturing the array-type ultrasonic transducer of this embodiment configured as described above will be briefly described below.

  First, in a predetermined mold (not shown), the second acoustic matching layer 13, the first acoustic matching layer 12, the piezoelectric vibrator 11, and a flexible substrate (not shown) are sequentially joined onto the temporary plate member 16Ja. Then, a part of the unit indicated by reference numeral 1Ja in FIG. 11 is formed.

  In this case, the first acoustic matching layer 12 and the second acoustic matching layer 13 are laminated and bonded to one surface of the piezoelectric vibrator 11, and the temporary plate member 16 Ja is attached to the second acoustic matching layer 13. Be joined.

  Here, the temporary plate member 16Ja is formed of a material having low adhesiveness such as a fluororesin, and is temporarily disposed as a positioning member instead of the acoustic lens 16J.

  Further, a flexible substrate (not shown) is laminated and bonded to the other surface of the piezoelectric vibrator 11.

  Thus, the temporary plate member 16Ja and each layer (13, 12, 11, 17) are placed on the dicing stage so that the piezoelectric vibrator 11 is on the upper surface, and depending on a predetermined pitch and groove width. Dicing with a dicing machine. Thereby, the dividing groove 19J is formed.

  Next, a slurry that is a mixture of powder in a silicone resin precursor solution, for example, which becomes the filling member 20 is injected into the gap of the dividing groove 19J through the mold, and after a certain period of time, the filling member 20 is Harden.

  After the filling member 20 is cured, the insulating layer 17 is bonded, and the backing layer 18 is bonded. As a result, the state shown in FIG. 11 is obtained.

  Next, the temporary plate member 16Ja is removed from the unit shown in FIG. 11 to form the acoustic lens 16J. As a result, the state shown in FIG. 10 is obtained, and the array-type ultrasonic transducer 1J of the present embodiment is formed.

  The array type ultrasonic transducer 1J of the present embodiment formed in this way has a cylindrical curved surface in the cross-sectional shape of the tip of the split groove 19J, so that the tip of the split groove 19J (the gap of each element). The thickness dimension of the acoustic lens 16J in the arrangement direction of each element is non-uniform in the portion where the tip = the region of l (el) 1 is in contact with the acoustic lens 16J.

  In other words, since the boundary surface between the acoustic lens 16J and the second acoustic matching layer 13 is set to be non-planar, the transverse wave vibration propagating through this portion is attenuated, and crosstalk caused thereby is reduced. Will be deterred.

  In the tenth embodiment described above, the cross-sectional shape of the dividing groove 19J is formed in the same manner as in the first embodiment described above, but separately from those in the second to fourth embodiments described above. Even if any one of them is applied, the same effect can be obtained.

  Moreover, it is also possible to easily apply any of the filling members 20D, 20E, and 20F in the fifth to seventh embodiments described above to the above-described eighth, ninth, and tenth embodiments. is there. In that case, the crosstalk can be more reliably reduced.

  Next, in the array-type ultrasonic transducer, a means for reducing and suppressing crosstalk caused by transverse wave vibration (see symbol D shown in FIG. 18) propagating through the boundary surface between the filling member of the dividing groove and the backing layer. An example of this will be described below.

  FIG. 12 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the eleventh embodiment of the present invention.

  The present embodiment basically has substantially the same configuration as that of the first embodiment described above, and the shape of the filling member after curing and the boundary surface between the filling member and the backing layer. The cross-sectional shape is different. Therefore, also in this embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  In the 11th to 14th embodiments described below, an array type ultrasonic transducer in which the insulating layer 17 is omitted is taken as an example in the same manner as in the above 5th to 6th embodiments. Although described, the same applies to the case where an insulating layer is provided.

  As shown in FIG. 12, the dividing groove 19 in the array type ultrasonic transducer 1K of the present embodiment is formed so that the cross section near the tip thereof is a cylindrical curved surface as in the first embodiment described above. ing. A small gap remains between the apex of the tip and the boundary surface of the second acoustic matching layer 13 and the acoustic lens 16. That is, the second acoustic matching layer 13 has a bridge structure leaving the thin layer portion 13a having the thickness t1. The dividing groove 19 is filled with a filling member 20.

  Further, on one surface of the backing layer 18K, that is, the surface bonded to one surface of the piezoelectric vibrator 11, a meniscus formed of a curved convex surface directed toward the dividing groove 19 on each of the portions corresponding to the dividing grooves 19 is provided. A plurality of 18a are formed.

  That is, the meniscus 18a formed between the backing layer 18K and the dividing groove 19 is located on the side of the dividing groove 19 from the boundary surface between the filling member 20 and the backing layer 18K filled in the gap of the dividing groove 19. It has a curved surface facing toward.

  The meniscus 18a is formed as follows. That is, in the process of manufacturing the array-type ultrasonic transducer 1K of the present embodiment, the second acoustic matching layer 13, the first acoustic matching layer 12, the piezoelectric transducer 11, the flexible substrate (like the first embodiment described above) After sequentially joining, a split groove 19 having a predetermined pitch and groove width (see reference numeral 1 (el) 1 shown in FIG. 12) is formed.

  Then, the slurry which mixed the powder, for example with the silicone resin precursor solution used as the filling member 20 inside the space | gap part of the division | segmentation groove | channel 19 is filled. In this case, for example, a slurry in which powder is mixed with a silicone resin precursor solution, which becomes the filling member 20, is injected into the gap portion of the division groove 19. Keep it slightly less than. As a result, the meniscus 18 a is formed on the other surface of the dividing groove 19 (the surface on the side on which the backing layer 18 </ b> K is formed) by the surface tension of the filling member 20. And when the fixed time passes, the said filling member 20 will harden | cure.

  Thereafter, injection for forming the backing layer 18K on the other surface side of the piezoelectric vibrator 11 is performed. As a result, the backing layer 18K is formed including the inside of the meniscus 18a.

  In this way, the array type ultrasonic transducer 1K of the present embodiment is formed. Other configurations are the same as those in the first embodiment described above.

  As described above, in the eleventh embodiment, the meniscus 18a facing the dividing groove 19 is formed on the boundary surface between the filling member 20 of the dividing groove 19 and the backing layer 18K. The transverse wave vibration propagating through the surface is attenuated, and the crosstalk generated thereby can be easily reduced and suppressed.

  In the present embodiment, it is desirable to use the same resin as the basic material for the filling member 20 and the backing layer 18K. In this way, since the bonding force between the filling member 20 and the backing layer 18K is increased, it is possible to contribute to improving the durability of the generated array type ultrasonic transducer 1K.

  FIG. 13 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the twelfth embodiment of the present invention.

  This embodiment has substantially the same configuration as that of the above-described eleventh embodiment, and only the shape of the dividing groove is different. Therefore, in the present embodiment, the same components as those in the eleventh embodiment described above are denoted by the same reference numerals, detailed description thereof is omitted, and only different portions will be described below.

  As shown in FIG. 13, the cross-sectional shape of the dividing groove 19 </ b> A in the array type ultrasonic transducer 1 </ b> L of the present embodiment is formed in the same manner as in the second embodiment described above, and the second acoustic matching layer 13 has This also applies to a bridge structure that leaves an extremely thin thin layer portion 13a. The dividing groove 19A is filled with a filling member 20.

  Further, on one surface of the backing layer 18L, that is, the surface joined to one surface of the piezoelectric vibrator 11, the divided grooves 19A are respectively formed on the portions corresponding to the divided grooves 19A, as in the above-described eleventh embodiment. A meniscus 18a having a curved convex surface directed toward the side is formed.

  The method for forming the meniscus 18a is the same as that in the eleventh embodiment. Other configurations are the same as those in the eleventh embodiment.

  As described above, in the twelfth embodiment, the same effect as in the eleventh embodiment can be obtained.

  FIG. 14 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the thirteenth embodiment of the present invention.

  This embodiment basically has a configuration substantially similar to that of the above-described eleventh embodiment, and is a shape after curing of the filling member, that is, a meniscus at the interface between the filling member and the backing layer. The only difference is the shape (convex direction).

  That is, the sectional shape of the dividing groove 19 in the array type ultrasonic transducer 1M of the present embodiment is the same as that of the first and eleventh embodiments.

  Further, the filling member 20 filled in the dividing groove 19 is formed to be a meniscus 20d having a curved convex surface directed toward the backing layer 18M. Accordingly, the surface of the backing layer 18M on the side to be joined to the piezoelectric vibrator 11 is formed with each of the portions corresponding to the dividing grooves 19 by the curved recesses 18b.

  This meniscus 20d is formed in the process of manufacturing the array type ultrasonic transducer 1M of the present embodiment in the same manner as in the eleventh embodiment. However, in this case, the injection amount of the filling member 20 to be injected into the gap portion of the division groove 19 is slightly larger than the internal volume of the gap portion of the division groove 19. Thereby, the meniscus 20d which becomes a curved convex surface toward the backing layer 18M side by the surface tension of the filling member 20 is formed.

  Other configurations of the array type ultrasonic transducer 1M of the present embodiment formed in this way are the same as those of the first and eleventh embodiments described above.

  As described above, in the thirteenth embodiment, the same effect as in the eleventh embodiment can be obtained.

  FIG. 15 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the fourteenth embodiment of the present invention.

  The present embodiment has substantially the same configuration as that of the thirteenth embodiment described above, and only the shape of the dividing groove is different.

  That is, the cross-sectional shape of the dividing groove 19A in the array type ultrasonic transducer 1N of this embodiment is the same as that of the second and twelfth embodiments described above.

  Further, the filling member 20 filled in the dividing groove 19A is formed to be a meniscus 20d having a curved convex surface directed toward the backing layer 18N. Accordingly, each of the portions corresponding to the dividing grooves 19A is formed by the curved recesses 18b on the surface of the backing layer 18N that is joined to the piezoelectric vibrator 11.

  The method for forming the meniscus 20d is exactly the same as in the thirteenth embodiment. Other configurations are the same as those in the thirteenth embodiment.

  As described above, in the fourteenth embodiment, the same effect as in the eleventh embodiment can be obtained.

  In addition, in the above-mentioned 11th-14th embodiment, since the cross-sectional shape of the division | segmentation groove | channel (19 * 19A) is formed similarly to the above-mentioned 1st or 2nd embodiment, the said 1st or 2nd The same effect as that of the second embodiment can be obtained.

  Therefore, apart from this, the cross-sectional shape of the dividing groove may be the same as that of any of the third or fourth embodiment described above. In this case, in addition to the effect of attenuating the transverse wave vibration propagating through the boundary surface between the filling member 20 of the dividing groove and the backing layer 18, the boundary surface between the acoustic lens 16 and the second acoustic matching layer 13 is further reduced. It is possible to reduce the crosstalk and suppress the crosstalk by attenuating the transverse wave vibration propagating through the antenna.

  Moreover, it is also possible to easily apply any of the filling members 20D, 20E, and 20F in the fifth to seventh embodiments described above to the above-described eleventh to fourteenth embodiments. In that case, it is possible to further reduce the crosstalk by attenuating the transverse wave vibration propagating through the dividing groove.

  Furthermore, any one of the acoustic lenses 16G, 16H, and 16J in the eighth to tenth embodiments can be easily applied to the above-described eleventh to fourteenth embodiments. In this case, it is possible to further reduce the crosstalk by attenuating the transverse wave vibration propagating through the acoustic lens.

  By the way, in an ordinary case, an array type ultrasonic transducer is usually configured by providing a common ground line, which is a wiring for making each ground electrode provided in each element of the piezoelectric transducer a common ground. . There is a case in which the transverse wave vibration propagates through such a common ground line (see symbol B shown in FIG. 18). That is, the common ground line may be an element that mechanically connects the elements of the piezoelectric vibrator.

  Therefore, with regard to a device for reducing and suppressing crosstalk caused by transverse wave vibration propagating through the common ground line, for example, the width dimension and thickness dimension of the common ground line are not uniform in the length direction. Set, that is, the cross-sectional shape is formed substantially the same as the cross-sectional shape of the tip portion of the dividing groove of the first to fourth embodiments described above, or the material of the common ground line is, for example, a superelastic alloy or a damping alloy Various means are conceivable, such as an ultrasonic sound-absorbing material.

  For example, FIG. 16 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the fifteenth embodiment of the present invention.

  The array-type ultrasonic transducer 1P according to the present embodiment includes a piezoelectric transducer 11, an acoustic matching layer including the first acoustic matching layer 12 and the second acoustic matching layer 13, and a backing layer 18 as basic components. A signal electrode 15 and a ground electrode 14 are provided on both surfaces of the piezoelectric vibrator 11. The ground electrode 14 is commonly grounded by a predetermined common ground line 21P.

  A first acoustic matching layer 12 and a second acoustic matching layer 13 are sequentially stacked on the one surface side of the piezoelectric vibrator 11 with the ground electrode 14 interposed therebetween. Furthermore, an acoustic lens 16 is laminated on the second acoustic matching layer 13.

  An insulating layer 17 is provided on the other surface side of the piezoelectric vibrator 11 with the signal electrode 15 interposed therebetween, and a backing layer 18 is laminated on the insulating layer 17.

  A dividing groove 19 </ b> D having a substantially rectangular cross section is formed in a predetermined portion of the second acoustic matching layer 13 from the insulating layer 17 through the piezoelectric vibrator 11. The piezoelectric vibrator 11 is divided into a plurality of elements by the division grooves 19D.

  Note that a slight gap t1 is left between the front end surface of the dividing groove 19D and the boundary surfaces of the second acoustic matching layer 13 and the acoustic lens 16. That is, the second acoustic matching layer 13 has a bridge structure leaving an extremely thin thin layer portion 13a.

  The gaps of the dividing grooves 19D are filled with a filling member 20 in a form in which a slurry-like silicone resin or the like is cured.

  The acoustic lens 16 is provided on the side from which the ultrasonic waves are emitted, and is formed of, for example, a silicone resin. The acoustic lens 16 is formed in a continuous form from one end portion to the other end portion in the arrangement direction of a plurality of elements including the piezoelectric vibrator 11 and the two acoustic matching layers (12, 13). It is arranged so as to have a bridge structure.

  In the common ground line 21P, an arcuate curved concave portion 21a is formed at a portion corresponding to the dividing groove 19D. By providing the curved concave portion 21a, the minimum width dimension t6 of the common ground line 21P corresponding to the dividing groove 19D is set different from the width dimension t5 of the common ground line 21P in other areas. become. In this case, the width dimension of the curved recess 21a of the common ground line 21P gradually changes from the minimum dimension t6 to the line width dimension t5.

  Therefore, the transverse wave vibration propagating through the common ground line 21P is thereby attenuated, and thus crosstalk generated due to the transverse wave vibration is reduced and suppressed.

  As described above, according to the fifteenth embodiment, it is possible to reduce and suppress crosstalk generated by the transverse wave vibration propagating through the common ground line 21P in the array type ultrasonic transducer 1P.

  FIG. 17 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to the sixteenth embodiment of the present invention.

  The configuration of this embodiment is substantially the same as that of the fifteenth embodiment described above, except that the shape of the common ground line is slightly different. Therefore, the same components as those in the fifteenth embodiment described above are denoted by the same reference numerals, and description thereof is omitted.

  In the common ground line 21Q in the array type ultrasonic transducer 1Q of the present embodiment, an arc-shaped curved convex portion 21b is formed at a portion corresponding to the dividing groove 19D. By providing the curved concave portion 21b, the maximum width dimension t7 of the common ground line 21Q corresponding to the dividing groove 19D is set to be different from the line width dimension t5 of the common ground line 21P in other positions. It will be. In this case, the width dimension of the curved recess 21a of the common ground line 21P gradually changes between the maximum dimension t7 and the line width dimension t5.

  Therefore, the transverse wave vibration propagating through the common ground line 21Q is thereby attenuated, and thus the crosstalk caused by the transverse wave vibration is reduced and suppressed.

  As described above, according to the sixteenth embodiment, just like the fifteenth embodiment described above, the cross generated by the transverse wave vibration propagating through the common ground line 21Q in the array type ultrasonic transducer 1Q. Talk can be reduced and suppressed.

  It is to be noted that the shape of the common ground line is changed by changing the thickness in the boundary region of adjacent elements (elements) as in the fifteenth embodiment shown in FIG. 16 or the sixteenth embodiment shown in FIG. Although the structure to reduce is disclosed, as a modification of these embodiments, for example, an ultrasonic absorbing material is formed in the boundary region between adjacent elements of the common ground line, or the material is modified such as ion implantation. It is also possible to provide an ultrasonic absorption region.

  As described above, in each of the above-described embodiments, the portion where the transverse wave vibration can propagate, that is, the elements of the piezoelectric vibrator are mechanically connected to each other, and the crosstalk is reduced and suppressed in each portion. Various examples of the means are shown. Therefore, it is possible to easily combine the respective constituent features of the embodiments, and in that case, a more reliable effect can be expected.

[Appendix]
According to the embodiment of the above invention, an invention having the following configuration can be obtained.

(1) An array-type ultrasonic vibrator having a piezoelectric vibrator, an acoustic matching layer, and a backing layer as basic constituent elements, and at least elements that mechanically connect the elements constituting the ultrasonic vibrator array In an array type ultrasonic transducer having one,
The elements that mechanically connect the elements do not have a resonance frequency f _ot inherent to the frequency characteristics of the transverse vibration that propagates the elements, or the elements that constitute the ultrasonic transducer array vibrate longitudinally. _Whether the resonance sharpness Q _ot is smaller than the resonance sharpness Q _oL at the resonance frequency f _oL or the transverse vibration frequency f _ot ≠ longitudinal vibration frequency f _oL / n (n = integer),
An array-type ultrasonic transducer comprising means for satisfying at least one of the conditions.

(2) In the array type ultrasonic transducer according to appendix (1),
The element that mechanically connects the respective elements of the piezoelectric vibrator is an array-type ultrasonic vibrator that is a filling member filled in a gap provided between the respective elements of the piezoelectric vibrator.

(3) In the array type ultrasonic transducer according to appendix (1),
The element that mechanically connects the respective elements of the piezoelectric vibrator is an array-type ultrasonic vibrator that is a partial region of the acoustic matching layer.

(4) In the array type ultrasonic transducer according to appendix (1),
The element that mechanically connects the respective elements of the piezoelectric vibrator is an array type ultrasonic vibrator that is a wiring having a ground electrode of each element as a common ground.

(5) In the array type ultrasonic transducer according to appendix (1),
The element that mechanically connects the respective elements of the piezoelectric vibrator is an array-type ultrasonic vibrator that is the acoustic lens.

(6) In the array type ultrasonic transducer according to appendix (1),
The element that mechanically connects the elements of the piezoelectric vibrator is the array-type ultrasonic vibrator that is the backing layer.

(7) In the array type ultrasonic transducer according to appendix (2),
The array-type ultrasonic transducer in which the acoustic characteristics of the filling member in the gap change with respect to the height direction of the gap.

(8) In the array type ultrasonic transducer according to appendix (2),
The filling member in the gap is an array type ultrasonic transducer made of a composite resin in which fine powder particles are dispersed in a viscoelastic resin.

(9) In the array type ultrasonic transducer according to appendix (8),
The above-mentioned fine powder particles are an array type ultrasonic vibrator which is a compound having good thermal conductivity and electrical insulation.

(10) In the array type ultrasonic transducer according to appendix (9),
The above-mentioned compound having good thermal conductivity and electrical insulation is at least one of tungsten trioxide, aluminum oxide, aluminum nitride, silicon carbide, and zirconium oxide.

(11) In the array type ultrasonic transducer according to appendix (8),
The above-mentioned fine powder particle is an array type ultrasonic vibrator which is either a hollow glass fine particle or a bell structure fine particle containing fine particles in a hollow part.

(12) In the array type ultrasonic transducer according to appendix (8),
The fine powder particles are composed of a mixture of at least one of tungsten trioxide, aluminum oxide, aluminum nitride, silicon carbide, and zirconium oxide and hollow glass fine particles or bell structure fine particles containing fine particles in the hollow portion. Array type ultrasonic transducer.

(13) In the array type ultrasonic transducer according to appendix (3),
An array-type ultrasonic transducer having a structure in which a part of the acoustic matching layer has a non-uniform thickness in the array direction.

(14) In the array type ultrasonic transducer according to appendix (13),
The array-type ultrasonic transducer in which the structure having a non-uniform thickness in the array direction is formed such that one surface is a flat surface and the other surface is a cylindrical curved surface.

(15) In the array type ultrasonic transducer according to appendix (13),
The structure having a non-uniform thickness in the array direction is an array type ultrasonic transducer in which one surface is a flat surface and the other surface is a ship bottom surface.

(16) In the array type ultrasonic transducer according to appendix (13),
The structure having a non-uniform thickness in the array direction is an array-type ultrasonic transducer in which one surface is a flat surface and the other surface has a slope.

(17) In the array type ultrasonic transducer according to appendix (14),
The wiring for grounding the ground electrode of each element in common is an array type ultrasonic transducer made of a sound absorbing material.

(18) In the array type ultrasonic transducer according to appendix (17),
The sound absorbing material is an array-type ultrasonic transducer that is a superelastic alloy or a vibration damping alloy.

(19) In the array type ultrasonic transducer according to appendix (4),
The array-type ultrasonic transducer in which the wiring for grounding the ground electrode of each element in common has a non-uniform thickness.

(20) In the array type ultrasonic transducer according to appendix (5),
A portion of the surface of the acoustic lens on the acoustic matching layer side that is in contact with the gap between the elements is an array-type ultrasonic transducer having a non-uniform thickness in each array direction.

(21) In the array type ultrasonic transducer according to appendix (6),
The backing layer is an array-type ultrasonic transducer in which a part of the surface on the piezoelectric transducer side is formed in a concave shape or a convex shape.

(22) In the array type ultrasonic transducer according to appendix (9),
Sequentially bonding the second acoustic matching layer, the first acoustic matching layer, the piezoelectric vibrator, a flexible substrate, and an insulating plate;
On the other hand, a step of performing a dicing process for generating divided grooves having a predetermined pitch and groove width;
A step of injecting the slurry-like filling member obtained by mixing the resin precursor solution exhibiting viscoelasticity with the fine powder particles into the void through the mold,
In this state, a step of curing after a certain period of time;
A method for manufacturing an array-type ultrasonic transducer including at least

1 is a cross-sectional view schematically showing a configuration of an array type ultrasonic transducer according to a first embodiment of the present invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 2nd Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 3rd Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 4th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 5th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 6th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 7th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 8th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 9th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 10th Embodiment of this invention. The figure which shows the state of the pre-process which forms an acoustic lens in the process of manufacturing the array type ultrasonic transducer | vibrator of FIG. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 11th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 12th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 13th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 14th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 15th Embodiment of this invention. Sectional drawing which shows schematically the structure of the array type ultrasonic transducer | vibrator of the 16th Embodiment of this invention. Sectional drawing which shows schematically the structure of the conventional electronic scanning type array type ultrasonic transducer | vibrator. The principal part perspective view which shows schematically another structure of the conventional electronic scanning type | mold array type ultrasonic transducer | vibrator.

Explanation of symbols

1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1J, 1K, 1L, 1M, 1N, 101, 101A ... Array-type ultrasonic transducers 11, 111, 111A ... Piezoelectric transducer 12・ 112 …… First acoustic matching layer (acoustic matching layer)
13 · 113 …… Second acoustic matching layer (acoustic matching layer)
13a …… Thin layer portion 14 · 114 · 114A ··· ground electrode 15 · 115 · 115A ··· signal electrode 16 · 16G · 16H · 16J · 116 · acoustic lens 16a ·· curved concave portion (acoustic lens)
16b ... curved convex part (acoustic lens)
16c ...... Curved recess (acoustic lens)
17 · 117 …… Insulating layer 18 ・ 18K ・ 18L ・ 18M ・ 18N ・ 118 ・ 118A …… Backing layer 18a …… Menicus 18b …… Bends 19 ・ 19A ・ 19B ・ 19C ・ 19D ・ 19J ・ 119 ・ 119A …… Dividing groove 20, 20D, 20E, 20F, 120, 120A ... Filling member 20 ... Viscoelastic resin (filling member)
20a: Fine powder particles 20b: Fine powder particles (hollow glass particles)
20c: Fine powder particles (bell structure fine particles)
20d ... Meniscus 21P / 21Q / 121 ... Common ground wire agent Patent attorney Susumu Ito

Claims (6)

An array-type ultrasonic vibrator having a piezoelectric vibrator, an acoustic matching layer, and a backing layer as basic constituent elements, and having at least one element that mechanically connects each element constituting the ultrasonic vibrator array In array type ultrasonic transducers,
The element that mechanically connects the elements does not have a resonance frequency specific to the frequency characteristics of the transverse vibration that propagates the elements, or when the elements that constitute the ultrasonic transducer array vibrate longitudinally. The resonance sharpness of the transverse wave is smaller than the resonance sharpness at the resonance frequency of the transverse vibration resonance frequency ≠ longitudinal vibration resonance frequency,
An array type ultrasonic transducer comprising means for satisfying at least one of the conditions. The element for mechanically connecting the elements of the piezoelectric vibrator is a filling member filled in a gap provided between the elements of the piezoelectric vibrator. Array type ultrasonic transducer. 2. The array type ultrasonic transducer according to claim 1, wherein the element that mechanically connects the respective elements of the piezoelectric transducer is a partial region of the acoustic matching layer. 2. The array type ultrasonic transducer according to claim 1, wherein the element that mechanically connects the elements of the piezoelectric vibrator is a wiring having a ground electrode of each element as a common ground. 2. The array type ultrasonic transducer according to claim 1, wherein the element that mechanically connects the elements of the piezoelectric transducer is the acoustic lens. 2. The array type ultrasonic transducer according to claim 1, wherein the element that mechanically connects the respective elements of the piezoelectric transducer is the backing layer.

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