JP2005079556A - Transferring device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transferring device that is excellent in mass-productivity by solving the problem of the conventional transferring method that a series of transferring processes, such as lamination, photoirradiation, peeling, etc., must be performed on each substrate. <P>SOLUTION: The transferring device 100 transfers elements 304 from a plurality of original substrates 300 on which the elements 304 are formed through sacrificial layers 302 composed of a material in which the coupling force between atoms falls when the material is irradiated with light to a transferred substrate 112. The transferring device 100 is provided with a transferred substrate transporting means 110 which transports the transferred substrate 112, an adhesion means 160 which adheres the elements 304 formed on the original substrates 300 to the transferred substrate 112, and a light irradiation means 170 which lowers the adhesion between the substrates 112 and 300 by irradiating light upon the sacrificial layers 302 synchronously to the adhering operation of the adhesion means 160. The transferring device 100 is also provided with a peeling means 180 which peels the original substrates 300 from the elements 304 adhered to the transferred substrate 112 synchronously to the light irradiating operation of the light irradiation means 170. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a transfer device that transfers an element or the like formed on a predetermined substrate to another substrate.

A conventional transfer method is disclosed in Japanese Patent Laid-Open No. 10-125931 (Patent Document 1). In the transfer method disclosed in Patent Document 1, after a thin film device layer formed on a substrate via a separation layer is bonded to a transfer body, the thin film device is transferred to the transfer body by releasing the substrate.
Japanese Patent Laid-Open No. 10-125931

  However, in the conventional transfer method, a series of transfer processes such as bonding, light irradiation, and peeling are required for each substrate. For example, when transferring elements formed on a large number of substrates to another substrate. There was a problem that it took an enormous amount of time.

  Therefore, an object of the present invention is to provide a transfer apparatus that can solve the above-described problems and is excellent in mass productivity. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.

  In order to solve the above-described problems, according to the first aspect of the present invention, a transfer destination is transferred from a plurality of transfer source substrates on which elements are formed through a sacrificial layer made of a material whose bonding force between atoms is reduced by light irradiation. A transfer device for transferring the element to a film, the film transfer means for transferring the transfer destination film, the bonding means for bonding the element formed on the transfer source substrate to the transfer destination film, and the bonding In synchronization with the bonding operation of the means, the light irradiation means for irradiating the sacrificial layer with light to reduce the adhesion between the element and the transfer source substrate, and the light irradiation means for irradiating light And a peeling means for peeling the transfer source substrate from the element bonded to the transfer destination film in synchronism with the transfer destination film.

  In such a configuration, each means for performing the transfer process operates in synchronization. Therefore, the predetermined means can perform the predetermined process on the predetermined substrate and the other means can perform the other process on the other substrate, thereby dramatically improving the productivity of the transfer element. be able to.

  Here, the element means an electrical component having a certain electrical characteristic and having a terminal connected to another element in order to form a circuit. Examples of the element include a diode, a transistor, a resistor, a capacitor, and a wiring. The element is preferably a structure in which thin films for realizing a predetermined function such as a semiconductor layer, a dielectric layer, and an insulating layer are stacked. For example, the element includes a thin film circuit layer or a fine structure as a circuit board. Can also work. The element can also function as an electro-optical element by including an electro-optical material. Examples of the thin film circuit layer include functional elements (for example, switching elements) configured by using a thin film such as a TFT (thin film transistor) or a thin film diode, and the thin film circuit device includes a circuit including the thin film circuit layer. For example, a driver circuit including the TFT can be exemplified.

  The peeling means includes means for fixing the transfer source substrate, means for moving the fixed transfer source substrate in a predetermined direction, and means for transporting the transfer destination substrate in a direction different from the predetermined direction. It is preferable to have.

  In such a configuration, when the peeling means performs the peeling process, the transfer destination substrate and / or the transfer source substrate are transported. Therefore, according to this configuration, since the transfer destination substrate and the transfer source substrate can be transported and peeled off, the productivity of the transfer element can be further improved. Further, since the element and / or the transfer destination substrate can be peeled from the transfer source substrate by transporting the transfer destination substrate and the transfer source substrate, the transfer element can be produced very easily.

  The transfer apparatus may further include surface treatment means for treating the surface of the transfer source substrate in synchronization with the operation of bonding by the bonding means. In this configuration, when the bonding unit performs the bonding process on the predetermined transfer source substrate, the surface processing unit can perform the surface process on the other transfer source substrate. Therefore, the productivity of the transfer element can be further improved.

  In addition, the transfer device may further include a cleaning unit that cleans the element that has been peeled off from the transfer source substrate in synchronization with the peeling operation of the peeling unit. In such a configuration, when the peeling unit performs a peeling process on a predetermined transfer source substrate, the cleaning unit can perform a cleaning process on an element or the like peeled from another transfer source substrate. Therefore, the productivity of the transfer element can be further improved.

  The transfer apparatus may further include a winding unit that winds the transfer destination substrate to which the element peeled from the transfer source substrate is bonded. In such a configuration, the transfer destination substrate onto which a large number of elements have been transferred is wound up in a roll shape, for example, so that the transfer destination substrate on which the transfer process has been performed can be stored compactly.

  In addition, the transfer device further includes means for attaching a conductive film to the transfer destination substrate to which the element peeled from the transfer source substrate is bonded, and the winding means includes the conductive member. The transfer destination substrate on which the adhesive film is bonded may be wound up.

  In such a configuration, the transfer destination substrate is wound up in a state where the conductive film is in contact with or close to the element or the like transferred to the transfer destination substrate. Accordingly, even when static electricity is generated in the transfer destination substrate, the element, or the like by the transfer process, the static electricity can be removed by the conductive film, so that electrostatic breakdown of the element or the like can be prevented.

  In addition, it is preferable that the transfer device further includes a substrate transport unit that transports the transfer source substrate so that the transfer source substrate faces the transfer destination substrate. In such a configuration, since the transfer source substrate and the transfer destination substrate are transported opposite to each other, the processing performed by each unit on the transfer source substrate and the transfer destination substrate can be easily synchronized.

  Hereinafter, the present invention will be described through embodiments of the invention with reference to the drawings. However, the following embodiments do not limit the invention according to the claims, and are described in the embodiments. Not all combinations of features are essential for the solution of the invention.

  FIG. 1 is a diagram showing a configuration of a transfer apparatus 100 according to an embodiment of the present invention. The transfer apparatus 100 includes a transfer destination substrate transport unit 110, a transfer source substrate transport unit 120, a transfer source substrate surface treatment unit 130, a protective film peeling unit 140, a transfer destination substrate surface treatment unit 150, and an adhesion unit 160. The light irradiation means 170, the transfer source substrate peeling means 180, the cleaning means 190, and the bonding means 200 are provided.

  The transfer destination substrate transport unit 110 transports the transfer destination substrate 112. In this embodiment, the transfer destination substrate transport unit 110 includes a pulling unit 114 that pulls out and transports the transfer destination substrate 112 wound up in a roll shape, a winding unit 116 that winds up the transported transfer destination substrate 112, and a transfer And a transport direction changing unit 118 that changes the transport direction of the front substrate 112. The drawing unit 114, the winding unit 116, and the conveyance direction changing unit 118 are units that convey the transfer destination substrate 112 by a rotation operation such as a roller.

  The transfer destination substrate 112 is a thin plate material such as a plastic film that can be wound up. In the present embodiment, in the transfer destination substrate 112, a protective film 142 that protects the bonding surface is bonded to the bonding surface to which the element 304 is bonded. In this embodiment, the transfer device 100 includes a protective film peeling unit 140 that peels the protective film 142 from the transfer destination substrate 112. The protective film peeling means 140 includes a means 144 for changing the conveying direction of the protective film 142 and a protective film winding means 146 that winds up the protective film 142, and includes a conveying direction of the transfer destination substrate 112. The protective film 142 is peeled from the transfer destination substrate 112 by conveying the protective film 142 in different directions. The transfer destination substrate 112 may be a substrate in which an adhesive is previously applied to the bonding surface.

  The transfer source substrate transport unit 120 transports the transfer source substrate 300 on which the element 304 is formed via the sacrificial layer 302. The transfer source substrate transfer unit 120 changes the transfer direction of the transfer film 122, the transfer film 122 for placing the transfer source substrate 300, the means 124 for sending out the transfer film 122, the means 126 for winding up the transfer film 122, and the transfer film 122. Means 128. The transfer source substrate transport unit 120 is preferably configured such that the transport film 122 and the transfer destination substrate 112 are transported substantially in parallel at a portion of the transport film 122 where the transfer source substrate 300 is placed.

  In this embodiment, an adhesive is applied to the sacrificial layer 302 formed on the transfer source substrate 300, and the element 304 is fixed on the sacrificial layer 302 via the adhesive. That is, in this embodiment, the element 304 is formed on another substrate and then transferred to the transfer source substrate 300. The adhesive is preferably a water-soluble adhesive.

  The transfer source substrate surface processing means 130 processes the surface of the element 304 formed on the transfer source substrate 300. The element 304 may include an insulating film or the like formed over the plurality of elements 304 on the surface. In this case, the transfer source substrate surface processing means 130 processes the surface of the insulating film or the like.

  Specifically, the transfer source substrate surface processing means 130 applies ultraviolet (UV) cleaning, coupling processing, oxygen plasma processing, corona discharge to the surface of the element 304 where the element 304 is bonded to the transfer destination substrate 112. It is a means for performing processing such as processing, and removes contaminants and the like present on the surface. In this embodiment, the transfer source substrate surface processing means 130 is a UV lamp that emits ultraviolet rays, and removes contaminants and the like present on the surface by irradiating the surface of the element 304 with ultraviolet rays.

  The transfer destination substrate surface processing means 150 processes the surface of the transfer destination substrate 112 from which the protective film 142 has been peeled, that is, the adhesion surface. In this embodiment, the transfer destination substrate surface processing means 150 applies an adhesive to the adhesive surface by spray coating, blade coating, or the like. The transfer destination substrate surface treatment means 150 may further include means for removing contaminants and the like present on the surface by ultraviolet (UV) cleaning, coupling treatment, oxygen plasma treatment, corona discharge treatment, and the like. Further, when an adhesive is applied to the transfer destination substrate 112 in advance, the transfer destination substrate surface treatment means 150 may be a means for removing the contaminants and the like.

  The bonding unit 160 bonds the transfer source substrate 300 and the transfer destination substrate 112. Specifically, the bonding unit 160 bonds the transfer source substrate 300 and the transfer destination substrate 112 by bonding the element 304 formed on the transfer source substrate 300 and the bonding surface of the transfer destination substrate 112. Further, the bonding unit 160 bonds the transfer source substrate 300 and the transfer destination substrate 112 by a method according to the characteristics of the adhesive applied to the bonding surface of the transfer destination substrate 112 such as pressurization, ultraviolet irradiation, heating, and the like. To do.

  In the present embodiment, the adhesive unit 160 is configured by a plurality of members disposed to face each other with the transfer destination substrate 112 and the transfer source substrate 300 interposed therebetween, and either the transfer destination substrate 112 or the transfer source substrate 300 or The transfer source substrate 300 and the transfer destination substrate 112 are bonded together by pressing both in a direction substantially perpendicular to the transfer direction of the transfer destination substrate 112 and / or the transfer source substrate 300.

  The light irradiation means 170 irradiates the sacrificial layer 302 with light. The light irradiation means 170 is, for example, an excimer laser, a lamp that emits light such as ultraviolet rays, or a semiconductor laser. Further, the light irradiation means 170 may further include means for holding the transfer source substrate 300, and the sacrificial layer 302 may be irradiated with light through the means. In this case, the means is preferably made of a material that transmits light.

  The transfer source substrate peeling unit 180 transfers the element 304 to the transfer destination substrate 112 by peeling the transfer source substrate 300 from the transfer destination substrate 112. In this embodiment, the transfer source substrate peeling unit 180 includes a moving unit 182 that moves the transfer source substrate 300 in a predetermined direction, and a transport direction changing unit 184 that transports the transfer destination substrate 112 in a direction different from the predetermined direction. It is configured. The moving means 182 includes a means for fixing the transfer source substrate 300 such as a vacuum chuck. Further, the transport direction changing unit 184 transports the transfer destination substrate 112 in a direction away from the transfer source substrate 300.

  The cleaning unit 190 cleans the element 304 transferred to the transfer destination substrate 112. In the present embodiment, the cleaning unit 190 sprays a cleaning liquid onto the element 304 in a shower shape, thereby adhering or remaining on the surface of the element 304 and / or the transfer destination substrate 112, the sacrificial layer 302, contaminants, and the like. Remove. The cleaning unit 190 preferably includes a unit for drying the cleaned element 304 and the transfer destination substrate 112.

  The bonding unit 200 bonds the conductive film 202 to the transfer destination substrate 112. In the present embodiment, the laminating unit 200 pulls out the wound conductive film 202 and transports the conductive film 202 in a direction substantially the same as the transport direction of the transfer destination substrate 112. By this, it has the conveyance direction change means 204 which bonds the electroconductive film 202 to the transfer destination board | substrate 112, and is comprised. The conductive film 202 is a metal film made of, for example, aluminum or copper. In this embodiment, the bonding unit 200 bonds the conductive film 202 to the surface of the transfer destination substrate 112 opposite to the surface to which the element 304 is transferred, but the surface of the transfer destination substrate 112 to which the element 304 is transferred. You may stick together. That is, the bonding unit 200 may bond the conductive film 202 to the transfer destination substrate 112 so as to cover the element 304.

  FIG. 2 is a functional block diagram illustrating a control system of the transfer apparatus 100. The transfer apparatus 100 includes a control unit 400 that controls each unit illustrated in FIG. In the present embodiment, each means is configured to be controlled by the control means 400, but an individual control means for controlling the means is provided for each means, and the control means 400 controls each individual control means. You may comprise so that it may control.

  The control unit 400 controls the transfer destination substrate transport unit 110 to stop for a predetermined time after the transfer destination substrate 112 has moved a predetermined distance. That is, the control unit 400 controls the transfer destination substrate transport unit 110 so that the transfer destination substrate 112 repeats transport and stop. Specifically, the control unit 400 transfers the transfer source substrate 300 bonded to the transfer destination substrate 112 so that the transfer source substrate 300 stops at the position where the light irradiation unit 170 and the transfer source substrate peeling unit 180 are provided for the predetermined time. The front substrate transfer means 110 is controlled.

  In the present embodiment, the adhesion unit 160, the light irradiation unit 170, and the transfer source substrate peeling unit 180 are provided at a predetermined distance. That is, the bonding unit 160, the light irradiation unit 170, and the transfer source substrate peeling unit 180 are provided at equal intervals. Further, the transfer source substrate transport unit 120 transports a plurality of transfer source substrates 300, and the control unit 400 includes a predetermined transfer source substrate 300 among the plurality of transfer source substrates 300 provided with the bonding unit 160. When stopping at the position, the transfer destination substrate transport unit 110 is controlled so that the other transfer source substrate 300 stops at the position where the light irradiation unit 170 and the transfer source substrate peeling unit 180 are provided.

  The control unit 400 controls the transfer source substrate transport unit 120 so that the transfer source substrate 300 is transported in accordance with the transport of the transfer destination substrate 112. Specifically, the control unit 400 moves the predetermined transfer source substrate 300 when the region to which the predetermined transfer source substrate 300 is to be bonded is transferred to the position where the bonding unit 160 is provided. The transfer source substrate transport unit 120 is controlled so as to be transported to the position. The control unit 400 may control the transfer operation of the transfer source substrate transfer unit 120 in synchronization with the transfer operation of the transfer destination substrate transfer unit 110.

  The control unit 400 controls the operations of the protective film peeling unit 140 and the bonding unit 200 in synchronization with the transfer operation of the transfer destination substrate transfer unit 110. That is, the control unit 400 peels off the protective film 142 from the transfer destination substrate 112 in accordance with the transfer of the transfer destination substrate 112, and attaches the conductive film 202 to the transfer destination substrate 112. The bonding means 200 is controlled.

  Further, the control unit 400 synchronizes with the transfer operation of the transfer destination substrate transfer unit 110 and / or the transfer source substrate transfer unit 120, the transfer source substrate surface processing unit 130, the transfer destination substrate surface processing unit 150, the bonding unit 160, The operations of the light irradiation means 170 and the cleaning means 190 are controlled. Specifically, in the present embodiment, the control unit 400 controls the transfer destination substrate transport unit 110 and the transfer source substrate transport unit 120 so that the transfer destination substrate 112 and the transfer source substrate 300 repeat transport and stop. The control unit 400 is configured such that when the transfer destination substrate 112 and / or the transfer source substrate 300 are stopped, the transfer source substrate surface processing unit 130, the transfer destination substrate surface processing unit 150, the adhesion unit 160, the light irradiation unit 170, And each means is controlled so that the cleaning means 190 operates.

  The control unit 400 includes a transfer destination substrate transport unit 110 and / or a transfer source substrate transport unit 120, a transfer source substrate surface treatment unit 130, a transfer destination substrate surface treatment unit 150, an adhesion unit 160, a light irradiation unit 170, and a cleaning unit 190. In synchronization with this operation, the operation of the transfer source substrate peeling means 180 is controlled. Specifically, the control unit 400 transfers the transfer source substrate peeling unit 180 so that the moving unit 182 fixes the transfer source substrate 300 when the transfer destination substrate transfer unit 110 stops transferring the transfer destination substrate 112. To control. Then, when the transfer destination substrate transport unit 110 transports the transfer destination substrate 112, the control unit 400 transfers the transfer source substrate peeling unit 180 so that the moving unit 182 moves the transfer source substrate 300 in accordance with the transport operation. To control.

  With reference to FIGS. 1 and 2, the operation of the transfer apparatus 100 transferring the element 304 formed on the transfer source substrate 300 to the transfer destination substrate 112 will be described. Hereinafter, an operation of sequentially transferring a plurality of transfer source substrates 300 to the transfer destination substrate 112 will be described as an example.

  First, the drawing unit 114 constituting the transfer destination substrate transport unit 110 pulls out the transfer destination substrate 112. The protective film peeling means 140 peels off the protective film 142 attached to the drawn transfer destination substrate 112 in accordance with the transfer of the transfer destination substrate 112. Subsequently, the transfer destination substrate surface processing means 150 applies an adhesive to the surface of the transfer destination substrate 112 from which the protective film 142 has been peeled, that is, the transfer surface of the transfer destination substrate 112 onto which the element 304 is transferred.

  On the other hand, in accordance with the transfer operation of the transfer destination substrate transfer unit 110, first, the first transfer source substrate 300 is loaded. The input first transfer source substrate 300 is placed on the transport film 122 and transported to a position where the transfer source substrate surface processing means 130 is provided. At this time, it is preferable that the transfer destination substrate 112 is transferred in synchronization with an operation in which the transfer source substrate transfer unit 120 transfers the first transfer source substrate 300. That is, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 in accordance with the transport of the first transfer source substrate 300. Then, the first transfer source substrate 300 stops at the position where the transfer source substrate surface processing unit 130 is provided, and the transfer destination substrate transport unit 110 is transferred to the transfer destination while the first transfer source substrate 300 is stopped. The conveyance of the substrate 112 is stopped.

  Next, the transfer source substrate surface processing unit 130 processes the surface of the first transfer source substrate 300. In this embodiment, while the transfer source substrate surface processing unit 130 is processing the surface of the first transfer source substrate 300, the transfer destination substrate transfer unit 110 stops the transfer of the first transfer source substrate 300. Then, the transfer destination substrate transport unit 110 stops the transport of the transfer destination substrate 112.

  Next, the transfer source substrate transport unit 120 transports the first transfer source substrate 300 subjected to the surface treatment to a position where the bonding unit 160 is provided. At this time, the second transfer source substrate 300 is loaded, and the transfer source substrate transport unit 120 transports the first transfer source substrate 300 to the position where the bonding unit is provided, and the second transfer source substrate 300. Is transferred to a position where the transfer source substrate surface processing means 130 is provided, and then the transfer is stopped.

  In addition, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 in synchronization with the operation of the transfer source substrate transport unit 120 transporting the first transfer source substrate 300 and the second transfer source substrate 300. At this time, when the first transfer source substrate 300 stops, the transfer destination substrate transport unit 110 transfers the transfer destination substrate 112 so that the region where the adhesive is applied faces the first transfer source substrate 300. The front substrate 112 is transferred. For example, the transfer distance of the transfer source substrate 300 from the transfer source substrate surface processing means 130 to the bonding means 160 is substantially equal to the transfer distance of the transfer destination substrate 112 from the transfer destination substrate surface processing means 150 to the bonding means 160. The transfer destination substrate transport unit 110 and the transfer source substrate transport unit 120 transport the transfer destination substrate 112 and the transfer source substrate 300 at substantially the same speed, respectively.

  Next, the bonding unit 160 bonds the first transfer source substrate 300 and the transfer destination substrate 112, and the transfer source substrate surface processing unit 130 processes the surface of the second transfer source substrate 300. In the present embodiment, after the bonding unit 160 bonds the first transfer source substrate 300 to the transfer destination substrate 112, the first transfer source substrate 300 is separated from the transport film 112 and bonded to the transfer destination substrate 112. Held in.

  Next, the transfer source substrate transport unit 120 transports the second transfer source substrate 300 subjected to the surface treatment to a position where the bonding unit 160 is provided. At this time, the third transfer source substrate 300 is loaded, and the transfer source substrate transport unit 120 transports the second transfer source substrate 300 to the position where the bonding unit is provided, and also transfers the third transfer source substrate 300. After transporting to the position where the transfer source substrate surface processing means 130 is provided, the transport is stopped.

  In addition, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 in synchronization with the operation of the transfer source substrate transport unit 120 transporting the second transfer source substrate 300 and the third transfer source substrate 300. That is, the transfer destination substrate transport unit 110 transports the first transfer source substrate 300 bonded to the transfer destination substrate 112 in synchronization with the transport operation of the transfer source substrate transport unit 120. Further, when the second transfer source substrate 300 and the third transfer source substrate 300 stop, the transfer destination substrate transport unit 110 stops at the position where the light irradiation unit 170 is provided. Then, the transfer destination substrate 112 is conveyed. In addition, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 so that the region where the adhesive is applied on the transfer destination substrate 112 faces the second transfer source substrate 300.

  Next, the light irradiation means 170 irradiates the sacrificial layer 302 formed on the first transfer source substrate 300 with light, and the bonding means 160 bonds the second transfer source substrate 300 and the transfer destination substrate 112, The transfer source substrate surface processing unit 130 processes the surface of the third transfer source substrate 300. Accordingly, the sacrificial layer 302 can be easily peeled from the element 304 and / or the transfer source substrate 300.

  Next, the transfer source substrate transport unit 120 transports the third transfer source substrate 300 subjected to the surface treatment to a position where the bonding unit 160 is provided. At this time, the fourth transfer source substrate 300 is loaded, and the transfer source substrate transporting unit 120 transports the third transfer source substrate 300 to the position where the bonding unit is provided, and also transfers the fourth transfer source substrate 300. After transporting to the position where the transfer source substrate surface processing means 130 is provided, the transport is stopped.

  In addition, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 in synchronization with the operation of the transfer source substrate transport unit 120 transporting the third transfer source substrate 300 and the fourth transfer source substrate 300. That is, the transfer destination substrate transport unit 110 transports the first transfer source substrate 300 and the second transfer source substrate 300 bonded to the transfer destination substrate 112 in synchronization with the transport operation of the transfer source substrate transport unit 120. . Further, when the third transfer source substrate 300 and the fourth transfer source substrate 300 are stopped, the transfer destination substrate transport unit 110 stops the first transfer source substrate 300 at the position where the moving unit 182 is provided. Further, the transfer destination substrate 112 is transported so that the second transfer source substrate 300 stops at the position where the light irradiation means 170 is provided. Further, the transfer destination substrate transport unit 110 transports the transfer destination substrate 112 so that the region where the adhesive is applied on the transfer destination substrate 112 faces the third transfer source substrate 300.

  Hereinafter, since the transfer source substrate 300 introduced after the first transfer source substrate 300 is transported and processed in the same manner as the first transfer source substrate 300, the processing of the first transfer source substrate 300 is performed. Only will be described.

  The first transfer source substrate 300 is stopped at a position where the transfer source peeling unit 180 is provided, and the moving unit 182 fixes the stopped first transfer source substrate 300. At this time, the other transfer source substrate 300 introduced after the first transfer source substrate 300 is transported and processed in the same manner as the first transfer source substrate 300.

  Then, in synchronization with the transfer destination substrate transport unit 110 transporting the transfer destination substrate 112, the moving unit 182 moves the first transfer source substrate 300 in a direction substantially parallel to the transport direction of the transfer destination substrate 112. To do. Then, the transport direction changing unit 184 changes the transport direction of the transfer destination substrate 112 to a direction different from the moving direction of the moving unit 182. Specifically, the transfer direction of the transfer destination substrate 112 is changed to a direction in which the transfer destination substrate 112 and the element 304 are separated from the transfer source substrate 300. Then, the transfer destination substrate 112 and the transfer source substrate 300 are further transported in different directions, whereby the element 304 is peeled from the transfer source substrate 300.

  Next, the transfer destination substrate transport unit 112 transports the peeled element 304 to the position where the cleaning unit 190 is provided, and then stops the transport. The cleaning unit 190 cleans the surface of the element 304 and / or the transfer destination substrate 112. After the elements 304 and the like are cleaned, the transfer destination substrate transport unit 110 further transports the transfer destination substrate 112. In synchronism with this transport operation, the bonding unit 200 bonds the conductive film 202 to the surface of the transfer destination substrate 112 opposite to the surface to which the element 304 is bonded. The transfer destination substrate transport unit 110 transports the transfer destination substrate 112 and the bonded conductive film 202, and the winding unit 116 winds the transfer destination substrate 112 to which the element 304 has been transferred.

  In this embodiment, the transfer device 100 is a device that transfers the element 304 to the transfer destination substrate 112 by a so-called roll-to-roll method, but is a device that transfers the element 304 to the transfer destination substrate 112 by a so-called roll-to-sheet method. Also good.

  According to the present embodiment, in each means for transferring the element 304 to the transfer destination substrate 112, the respective means are operated in synchronism with the tact time, so that the element 304 is efficiently transferred to the transfer destination substrate 112. be able to.

  The examples and application examples described through the embodiments of the present invention can be used in appropriate combination according to the application, or can be used with modifications or improvements, and the present invention is limited to the description of the above-described embodiments. It is not something. It is apparent from the description of the scope of claims that the embodiments added with such combinations or changes or improvements can be included in the technical scope of the present invention.

1 is a diagram illustrating a configuration of a transfer apparatus 100 according to an embodiment of the present invention. 3 is a functional block diagram showing a control system of the transfer apparatus 100. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Transfer apparatus, 110 ... Transfer destination board | substrate conveyance means, 112 ... Transfer destination board | substrate, 114 ... Pull-out means, 118 ... Conveyance direction change means, 120 ... Transfer source board | substrate conveyance means , 122 ... Conveying film, 130 ... Transfer source substrate surface treatment means, 140 ... Protective film peeling means, 142 ... Protective film, 146 ... Protective film winding means, 150 ... Transfer Pre-substrate surface treatment means, 160 ... Adhesion means, 170 ... Light irradiation means, 180 ... Transfer source substrate peeling means, 182 ... Movement means, 184 ... Conveyance direction change means, 190 ... Washing means 202 ... conductive film 206 ... drawing means 300 ... transfer source substrate 302 ... sacrificial layer 304 ... element 400 ... control means

Claims (7)

A transfer apparatus for transferring an element from a plurality of transfer source substrates on which elements are formed via a sacrificial layer to a transfer destination substrate,
A transfer destination substrate transfer means for transferring the transfer destination substrate;
Adhering means for adhering the element formed on the transfer source substrate to the transfer destination substrate;
Light irradiation means for reducing the adhesion between the transfer destination substrate and the transfer source substrate by irradiating the sacrificial layer with light in synchronism with the operation of the bonding means bonding;
A peeling means for peeling the transfer source substrate from the element bonded to the transfer destination substrate in synchronization with the operation of the light irradiation means irradiating light,
A transfer device comprising: The peeling means includes
Means for fixing the transfer source substrate;
Means for moving the fixed transfer source substrate in a predetermined direction;
Means for transporting the transfer destination substrate in a direction different from the predetermined direction;
The transfer device according to claim 1, comprising: The transfer apparatus according to claim 1, further comprising a surface processing unit that processes a surface of the transfer source substrate in synchronization with an operation of bonding the bonding unit. The transfer apparatus according to claim 1, further comprising a cleaning unit that cleans the element peeled off from the transfer source substrate in synchronization with an operation of the peeling unit peeling. The transfer apparatus according to claim 1, further comprising a winding unit that winds up the transfer destination substrate to which the element peeled from the transfer source substrate is bonded. A means for bonding a conductive film to the transfer destination substrate to which the element peeled from the transfer source substrate is bonded;
The transfer apparatus according to claim 5, wherein the winding unit winds the transfer destination substrate on which the conductive film is bonded. The transfer apparatus according to claim 1, further comprising transfer source substrate transport means for transporting the transfer source substrate so that the transfer source substrate faces the transfer destination substrate.