JP2011235557A - Bonding film transfer device, and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding film transfer device which has a simple structure, and also, can transfer a bonding film on the surface of an adherend, thereby, the adherend and other adherend are efficiently bonded together through the transferred bonding film, and to provide a bonding device which can efficiently bond the adherend, to which the bonding film has been transferred by the bonding film transfer device, and other adherend.SOLUTION: The bonding film transfer sheet 1 includes: a base material; and the bonding film deposited on the base material; the bonding film being transferable to the first adherend 5. The bonding film transfer device 500 includes: a plasma processing mechanism (activation means) 520 to apply the plasma processing on the bonding film of the bonding film transfer sheet 1; a first adherend supply mechanism 530 to supply the first adherend 5 to the surface of the bonding film and bond the bonding film transfer sheet 1 and the first adherend 5 together to obtain a first temporary bonding body 7; a pressing mechanism 540 to press the first temporary bonding body 7; and a peeling mechanism 550 to peel the base material off the first temporary bonding body 7.

Description

  The present invention relates to a bonding film transfer apparatus and a bonding apparatus.

When joining (adhering) two members (base materials), conventionally, a method of using an adhesive such as an epoxy adhesive, a urethane adhesive, or a silicone adhesive is often used.
For example, in a droplet discharge head (inkjet recording head) provided in a conventional inkjet printer, members made of different materials such as a resin material, a metal material, and a silicon-based material are bonded together using an adhesive (for example, , See Patent Document 1).
Thus, when bonding a member using an adhesive agent, a liquid or paste-like adhesive agent is apply | coated to an adhesive surface, and members are bonded together through the apply | coated adhesive agent. Thereafter, the bonding is completed by curing the adhesive by the action of heat or light.

  However, when applying an adhesive to the bonding surface of the member, it is necessary to use a complicated method such as a printing method. For example, when an adhesive is selectively applied to a partial region of the adhesive surface, it is extremely difficult to strictly control the position accuracy and thickness of the application. For this reason, it is difficult to bond the members of the droplet discharge head with high dimensional accuracy by the bonding method using the adhesive. As a result, it has been difficult to sufficiently improve the printing accuracy of the printer.

Also, since the curing time of the adhesive becomes very long, it takes a long time to bond, and the positions of the members are shifted during curing, or between members having a difference in thermal expansion coefficient due to heating during curing Thermal stress remains at the adhesive interface, which may cause deformation and damage of the droplet discharge head.
Further, depending on the constituent material of the member, it is necessary to use a primer in order to increase the bonding strength, and the cost and labor for that purpose complicate the bonding process.

On the other hand, there is a solid bonding method as a bonding method that does not use an adhesive.
Solid bonding is a method of directly bonding members without an intermediate layer such as an adhesive.
According to such solid bonding, since an intermediate layer such as an adhesive is not used, a bonded body with high dimensional accuracy can be obtained.

However, there is a problem that the members are limited because there are restrictions on the constituent materials that can be joined. In general, materials that can be joined are limited to silicon-based materials and some metal materials, and only the same kind of materials can be joined.
Further, the atmosphere for performing solid bonding is limited to a reduced-pressure atmosphere, and there is a limitation in the bonding process, such as requiring high-temperature (700 to 800 ° C.) heat treatment.
Furthermore, in solid joining, since the whole surface which mutually contacts is joined among each joining surface of two members, it is difficult to selectively join a part. For this reason, even if members made of different materials can be joined, a large stress is generated at the joining interface due to the difference in thermal expansion coefficient, which may cause problems such as warpage and peeling of the joined body. .

In response to such a problem, a method for selectively joining two members firmly with high dimensional accuracy selectively in a partial region of the joining surface is required.
Therefore, Patent Document 2 proposes a method of bonding members using a bonding film formed by plasma polymerization.
Since such a bonding film is formed by a vapor deposition method, it is easier to strictly control the positional accuracy and thickness of the bonding film than in the past. However, when patterning a bonding film formed by plasma polymerization, it is necessary to remove unnecessary portions by using a photolithography technique and an etching technique, and there is a concern that the manufacturing process is complicated and the cost is increased.
Further, in Patent Document 2, since it is necessary to form a bonding film on the surface of a member used for bonding, the film forming apparatus and the member are inseparable, and a member must be prepared where the film forming apparatus is located. Don't be. However, since the film forming apparatus is large in size, heavy in weight, and extremely low in portability, there is a concern that the manufacturing process of the product may involve geographical restrictions on the flow lines of the members.

JP 2002-254660 A JP 2008-307873 A

  An object of the present invention is an apparatus capable of transferring a bonding film to the surface of an adherend despite a simple structure, and the adherend and the other adherend through the transferred bonding film. A bonding film transfer device that enables efficient bonding to each other, and a bonding device that can efficiently bond the adherend to which the bonding film has been transferred by the bonding film transfer device and the other adherend. It is to provide.

The above object is achieved by the present invention described below.
The bonding film transfer apparatus of the present invention is provided on one surface of a flexible substrate, and has an Si skeleton having an atomic structure including a siloxane (Si-O) bond, and an organic group bonded to the Si skeleton. A bonding film transfer sheet having a bonding film containing a leaving group consisting of
A bonding film transfer apparatus for transferring the bonding film to an adherend,
An activating means for activating the bonding film of the bonding film transfer sheet by applying plasma treatment or energy irradiation treatment;
An adherend supply means for supplying an adherend so as to be in contact with the activated bonding film, and obtaining a first temporary bonded body formed by bonding the bonding film transfer sheet and the adherend;
Pressing means for pressing the first temporary joined body;
Peeling means for peeling the base material from the pressed first temporary joined body to transfer at least a part of the bonding film to the adherend side to obtain a second temporary joined body. ,
The activating means, the adherend supplying means, the pressing means, and the peeling means are arranged in this order, and the bonding film transfer sheet can be moved so as to pass through the respective means. It is characterized by that.
Thus, the apparatus can transfer the bonding film to the surface of the adherend despite the simple structure, and the adherend and other adherends can be efficiently transferred through the transferred bonding film. A bonding film transfer device that can be bonded well is obtained.

In the bonding film transfer apparatus of the present invention, the bonding film transfer sheet can be sequentially supplied to the activation means, the adherend supply means, the pressing means, and the peeling means by conveying the bonding film transfer sheet. It is preferable to have a conveying means.
As a result, as long as the bonding film transfer sheet is pulled, the activation, the supply of the adherend, the pressing of the first temporary bonding body, and the peeling process can be sequentially performed. Without using a complicated mechanism for conveying the bonding film transfer sheet, the bonded structure is excellent in mass productivity despite its extremely simple structure.
In the bonding film transfer apparatus of the present invention, it is preferable that the bonding film transfer sheet has a belt shape and is supplied as a roll body wound up in a roll shape.
As a result, the winding means can simultaneously perform three procedures including supply, conveyance, and recovery of unnecessary portions of the bonding film transfer sheet.

In the bonding film transfer apparatus of the present invention, the conveying means is a drawing means for pulling out an outer end portion of the bonding film transfer sheet in the roll body, or a winding means for winding and collecting the end portion. It is preferable.
Accordingly, the bonding film transfer sheet can be sequentially supplied to the activating means, the adherend supply means, the pressing means, and the peeling means only by operating the winding means.

In the bonding film transfer apparatus of the present invention, the transport unit has the winding unit,
It is preferable that the activating means, the adherend supply means, the pressing means, and the peeling means are all disposed between the roll body and the winding means.
As a result, the adherend supply mechanism can reliably stack the adherend on the region of the bonding film transfer sheet where the plasma treatment has been performed.

In the bonding film transfer apparatus of the present invention, it is preferable that a control unit that controls the operation of the transport unit to stop during the operation of supplying the adherend by the adherend supply unit.
According to the atmospheric pressure plasma processing apparatus, plasma processing can be easily performed without using expensive equipment such as decompression means. In addition, when plasma treatment is performed in a reduced pressure atmosphere, there is a risk that unintentionally trapped gas inside the bonding film or gas generated over time may be forcibly drawn out of the bonding film. There is a risk of damage to the film and a decrease in adhesion. On the other hand, the above-mentioned problems can be solved by performing plasma treatment under atmospheric pressure.

In the bonding film transfer apparatus of the present invention, the activation means for performing the plasma treatment is preferably an atmospheric pressure plasma treatment apparatus.
Thereby, it is possible to efficiently perform plasma processing on the entire bonding film transfer sheet.
In the bonding film transfer apparatus of the present invention, the bonding film transfer sheet has a strip shape,
It is preferable that the activating means is configured to activate the entire width direction of the belt-like bonding film transfer sheet.
Accordingly, the adherend can be pressed while being conveyed, and thus the time required for the process can be shortened.

In the bonding film transfer apparatus of the present invention, the pressing device has two rollers, and the first temporary bonded body is pressed by passing the first temporary bonded body between these rollers. It is preferable to be configured to obtain.
As a result, the adherend and the bonding film transfer sheet can be pressed uniformly without unevenness.
In the bonding film transfer apparatus of the present invention, it is preferable that at least one of the two rollers has a resilient member on the surface.
Thereby, the adhesiveness can be expressed as necessary and sufficiently in the bonding film.
In the bonding film transfer device of the present invention, the pressing force by the pressing device is preferably 0.2 MPa or more and 10 MPa or less.
Thereby, when a to-be-adhered body has a convex part, when a 1st temporary joining body is pressed, it can prevent that a convex part deform | transforms.

In the bonding film transfer apparatus of the present invention, the adherend has a convex portion on the surface thereof,
The adherend supply means is preferably configured to supply the adherend so that the convex portion and the bonding film are in contact with each other.
As a result, a first temporary joined body is obtained in which the bonding film transfer sheet and the adherend are partially joined in a region corresponding to the shape of the convex portion in plan view. Further, by subjecting the first temporary joined body to the peeling process, the joining film can be easily patterned corresponding to the shape of the convex portion in plan view.
In the bonding film transfer apparatus of the present invention, the bonding film is preferably formed by plasma polymerization.
As a result, a dense and homogeneous bonding film can be efficiently produced, and a bonding film that can be particularly strongly bonded to the adherend is obtained.

The bonding apparatus of the present invention includes a second activation unit that activates the second temporary bonded body obtained by the bonding film transfer apparatus of the present invention by performing plasma treatment or energy irradiation treatment,
A second adherend is supplied so as to be in contact with the activated bonding film, and a second bonded body obtained by bonding the second temporary bonded body and the second adherend is obtained. An adherend supply means;
And a second pressing means for pressing the joined body.
As a result, the adhesiveness can be expressed in the second temporary joined body when necessary, and the joined body can be quickly produced using the adhesiveness. It is possible to reliably prevent the occurrence of defects.

In the joining device of the present invention, the second activating means, the second adherend supplying means, and the second pressing means are arranged in this order, and the second activating means is It is preferable that it is disposed on the end side of the bonding film transfer apparatus.
As a result, the time for which the surface of the bonding film of the second temporary bonded body is left is shortened, and contamination of the bonding film, adhesion of foreign matters, and the like are prevented, so that favorable bonding is possible.

It is a figure (sectional drawing) for demonstrating the joining method performed using the joining film transfer apparatus of this invention, and the joining apparatus of this invention. It is a figure (sectional drawing) for demonstrating the joining method performed using the joining film transfer apparatus of this invention, and the joining apparatus of this invention. It is the elements on larger scale which show the state before energy provision of the joining film with which the joining film transfer sheet used in the joining film transfer apparatus of this invention is provided. It is the elements on larger scale which show the state after the energy provision of the joining film with which the joining film transfer sheet used in the joining film transfer apparatus of this invention is provided. It is a longitudinal cross-sectional view which shows typically the plasma polymerization apparatus used in order to form the joining film of the joining film transfer sheet | seat used for the joining film transfer apparatus of this invention. It is a figure (longitudinal sectional view) for demonstrating the method of producing a joining film | membrane on the base material with which the peeling layer was formed into a film. It is a perspective view showing typically composition of an embodiment of a joining device of the present invention. It is a perspective view showing typically composition of an embodiment of a joining device of the present invention. It is a figure (sectional drawing) for demonstrating the other structural example of the joining method performed using the joining film transfer apparatus of this invention, and the joining apparatus of this invention. It is a figure (sectional drawing) for demonstrating the other structural example of the joining method performed using the joining film transfer apparatus of this invention, and the joining apparatus of this invention.

Hereinafter, a bonding film transfer apparatus and a bonding apparatus according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
1 and 2 are diagrams (cross-sectional views) for explaining a bonding film transfer apparatus of the present invention and a bonding method performed using the bonding apparatus of the present invention, and FIG. 3 is used in the bonding film transfer apparatus of the present invention. FIG. 4 is a partial enlarged view showing a state before the energy is applied to the bonding film provided in the bonding film transfer sheet, FIG. FIG. In the following description, the upper side in FIGS. 1 and 2 is referred to as “upper” and the lower side is referred to as “lower”.

The bonding film transfer apparatus of the present invention is an apparatus for transferring a bonding film onto the surface of an adherend using a bonding film transfer sheet 1 as shown in FIG. 1. The bonding apparatus of the present invention transfers the bonding film. It is an apparatus which joins the adherend and other adherends.
Here, prior to the description of the bonding film transfer apparatus and the bonding apparatus, the bonding film transfer sheet 1 will be described first.

A bonding film transfer sheet 1 shown in FIG. 1 includes a base material 2, a release layer 4 formed on the base material 2, and a bonding film 3 formed on the release layer 4. It is used to transfer the bonding film 3 to one adherend 5.
The bonding film 3 is formed, for example, by plasma polymerization, and includes a Si skeleton having an atomic structure including a siloxane (Si—O) bond and a leaving group bonded to the Si skeleton.
In such a bonding film 3, energy is applied to at least a part of the bonding film 3, whereby a leaving group existing in the bonding film 3 is released from the Si skeleton, and the bonding film 3 is bonded to the region to which energy is applied. Is expressed.

By using the bonding film transfer sheet 1, adherends can be bonded to each other as follows.
That is, the method of bonding the first adherend 5 and the second adherend 6 using the bonding film transfer sheet 1 imparts energy to the upper surface (surface) of the bonding film 3 of the bonding film transfer sheet 1. At the same time, the bonding film transfer sheet 1 and the first adherend 5 are laminated so that the bonding film 3 and the first adherend 5 are in close contact with each other to obtain the first temporary bonded body 7. And the second temporary bonded body 8 is obtained by transferring the bonding film 3 to the first adherend 5 by peeling the substrate 2 and the release layer 4 from the first temporary bonded body 7. The second step is performed so that energy is applied to the upper surface (peeling surface) of the bonding film 3 of the second temporary bonding body 8 and the bonding film 3 and the second adherend 6 are in close contact with each other. And a third step of stacking the temporary joined body 8 and the second adherend 6 to obtain the joined body 10.

In the second step, the bonding film 3 is transferred to the first adherend 5 having the convex portions 51 on the surface using the adhesiveness developed in the bonding film 3. This transfer is performed by bonding the bonding film transfer sheet 1 and the first adherend 5 and then peeling the interface between the bonding film 3 and the release layer 4. Thereby, a part of the bonding film 3 (bonding film 33) moves to the first adherend 5. The first adherend 5 to which the bonding film 33 has been transferred develops adhesiveness by applying energy again to the peeled surface of the bonding film 33 in the third step, and the second adherend 6 is applied to the second adherend 6. It becomes possible to join. Thereby, the joined body 10 formed by joining the first adherend 5 and the second adherend 6 through the joining film 33 is obtained.
The joined body 10 obtained in this manner is obtained by firmly joining the first adherend 5 and the second adherend 6 with high dimensional accuracy even at a low temperature.

(Bonding film transfer sheet)
As described above, the bonding film transfer sheet 1 shown in FIG. 1 includes the base material 2, the release layer 4, and the bonding film 3. Hereinafter, the configuration of each part will be described in detail.
The substrate 2 supports the release layer 4 and the bonding film 3. Moreover, the base material 2 shown in FIG. 1 is a board | substrate form (sheet form) whose both surfaces are flat surfaces, and the thickness is uniform as a whole.

  As a constituent material of the base material 2, for example, polyolefin such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), cyclic polyolefin, modified polyolefin, polyvinyl chloride, polyvinylidene chloride, Polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylpentene-1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer Copolymer (AS resin), butadiene-styrene copolymer, polyoxymethylene, polyvinyl alcohol (PVA), ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate (PET Polyester such as polyethylene naphthalate, polybutylene terephthalate (PBT), polycyclohexane terephthalate (PCT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyacetal (POM), polyphenylene Oxide, modified polyphenylene oxide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, styrene, polyolefin, polyvinyl chloride , Polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluoro rubber, chlorinated polyethylene Various thermoplastic elastomers such as epoxy resins, epoxy resins, phenol resins, urea resins, melamine resins, aramid resins, unsaturated polyesters, silicone resins, polyurethanes, etc., or copolymers, blends, polymer alloys mainly containing these Such as Fe, Ni, Co, Cr, Mn, Zn, Pt, Au, Ag, Cu, Pd, Al, W, Ti, V, Mo, Nb, Zr, Pr, Nd, Sm, etc. Metals or alloys containing these metals, carbon steel, stainless steel, indium tin oxide (ITO), metal materials such as gallium arsenide, silicon materials such as single crystal silicon, polycrystalline silicon, amorphous silicon , Silicate glass (quartz glass), alkali silicate glass, soda lime glass, potash lime glass, lead (alkali) glass, barium moth Glass materials such as glass, borosilicate glass, ceramic materials such as alumina, zirconia, ferrite, silicon nitride, aluminum nitride, boron nitride, titanium nitride, silicon carbide, boron carbide, titanium carbide, tungsten carbide, graphite Examples thereof include carbon-based materials, paper, cloth, or composite materials obtained by combining one or more of these materials.

  Among these, as the base material 2, a flexible material is used. Thereby, when the bonding film transfer sheet 1 is laminated on the first adherend 5, the adhesion at the lamination interface can be enhanced. This is because the base material 2 has flexibility, so that even if the surface of the first adherend 5 is uneven, the bonding film transfer sheet 1 can be deformed along the uneven shape. This is because the adhesion between the two is improved. Therefore, since the base material 2 has flexibility, in the first temporary joined body 7, the uneven lamination of the joining film transfer sheet 1 and the first adherend 5 is suppressed, and the joining film 3 is reliably secured. Can be transferred.

Moreover, when the base material 2 and the peeling layer 4 are peeled from the bonding film transfer sheet 1 laminated with the first adherend 5, the base material 2 can be easily bent. For this reason, the peeling operation is facilitated, and problems such as the base material 2 damaging the bonding film 3 at the time of peeling are prevented.
Furthermore, since the base material 2 has flexibility, the bonding film transfer sheet 1 itself also has flexibility. Since such a bonding film transfer sheet 1 can be wound up in a roll shape, space saving can be achieved during storage and transportation. Further, the bonding film transfer sheet 1 wound up in a roll shape can be easily supplied in a required length by being sequentially fed out. For this reason, the bonding film transfer sheet 1 is excellent in affinity to the bonding film transfer apparatus 500.

Such a base material 2 is preferably a resin-based material. Since the base material 2 having a resin material as a main material is particularly excellent in flexibility, the above-described effects become more remarkable. In particular, even when curved with a small radius of curvature, there is little risk of breakage, so the above-described peeling process can be performed easily and reliably.
Furthermore, since the resin-based material is lightweight, even if a large amount of the bonding film transfer sheet 1 is wound up in a roll shape, the roll is relatively light and excellent in portability, so that handling is easy. .
In the bonding film transfer sheet 1, although the peeling is positively generated at the interface between the peeling layer 4 and the bonding film 3, the interface between the base material 2 and the peeling layer 4 needs to be adhered as firmly as possible. is there. For this reason, it is preferable that the upper surface of the base material 2 is subjected to a surface treatment for increasing the adhesion with the release layer 4 before the release layer 4 is formed.

Examples of the surface treatment include physical surface treatment such as sputtering treatment and blast treatment, plasma treatment using oxygen plasma, nitrogen plasma, etc., corona discharge treatment, etching treatment, electron beam irradiation treatment, ultraviolet irradiation treatment, ozone Examples include chemical surface treatment such as exposure treatment, or a combination of these. By performing such treatment, the upper surface of the substrate 2 can be cleaned and activated. As a result, the adhesion strength of the release layer 4 to the substrate 2 can be reliably increased.
Further, in the physical surface treatment, by increasing the surface roughness of the upper surface of the substrate 2, an anchor effect can be produced at the interface between the substrate 2 and the release layer 4, and the adhesion strength can be improved.

The average thickness of the base material 2 is appropriately set according to the constituent material and the desired flexibility, but as an example, it is preferably about 0.01 mm or more and 10 mm or less, preferably 0.1 mm or more and 3 mm. More preferably, it is about the following.
The Young's modulus (tensile modulus) of the substrate 2 is preferably about 1 GPa to 20 GPa, more preferably about 2 GPa to 12 GPa, at a general room temperature (25 ° C.). If the range of the Young's modulus is about this level, the base material 2 has sufficient flexibility, and the effects as described above are surely exhibited.

A release layer 4 is provided on the upper surface of the substrate 2 as described above. The release layer 4 is formed on the upper surface of the substrate 2 and serves as a base layer for the bonding film 3.
The release layer 4 is required to have a low adhesion strength with the bonding film 3 while firmly adhering to the substrate 2 as described above. For this reason, the constituent material of the release layer 4 is selected based on the balance between the adhesion to the substrate 2 and the adhesion to the bonding film 3.

Examples of the constituent material of the release layer 4 include fluorine resin, olefin resin, styrene resin, acrylic resin, silicone resin, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyvinyl chloride, polyvinyl alcohol, ABS resin, Various resin materials such as polyphenylene sulfide resin can be used. According to the resin material, the release layer 4 can be configured without affecting the mechanical properties (flexibility, rigidity, etc.) of the substrate 2.
Of these, fluorine resins are preferably used. Since the fluorine-based resin has particularly excellent releasability with respect to the bonding film 3, smooth peeling becomes possible. For this reason, the bonding film 3 can be transferred without unevenness.

Examples of the fluororesin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), ethylene-tetrafluoroethylene copolymer (ETFE), and perfluoroethylene-propene copolymer. Examples thereof include a combination (FEP) and an ethylene-chlorotrifluoroethylene copolymer (ECTFE). Note that a fluorine-based inorganic material such as potassium fluoride titanate, potassium silicofluoride, potassium fluoride zirconate, or silicofluoric acid may be used instead of the fluorine-based resin.
The release layer 4 made of such a material can be obtained by, for example, applying various liquid phase film-forming methods, CVD methods, and vacuum deposition methods in which a liquid film is obtained by applying or printing a liquid material and then forming a film by drying. The film is formed by various vapor deposition methods such as sputtering and plasma polymerization, various plating methods such as electroplating and electroless plating.

The release layer 4 can also be formed by supplying a coupling agent having a functional group having a low affinity for the bonding film 3 to the upper surface of the substrate 2. According to such a coupling agent, it is possible to form an extremely thin release layer 4 of about one molecule or several molecules. For this reason, the adhesiveness of the peeling layer 4 with respect to the base material 2 improves, and when the base material 2 is curved, the peeling layer 4 becomes difficult to peel from the base material 2.
Moreover, in the peeling layer 4 formed using the coupling agent, the density of functional groups having low affinity for the bonding film 3 described above increases. For this reason, the functional groups are arranged without gaps on the surface of the release layer 4, and the bonding strength at the interface between the release layer 4 and the bonding film 3 can be suppressed evenly.

  Examples of the functional group having low affinity for the bonding film 3 (showing peelability) include a fluorine atom, a fluoroalkyl group, a fluoroalkenyl group, a fluoroalkynyl group, a fluoroaryl group, a fluoroalkoxy group, and a fluoroaryloxy group. , Fluoro groups such as fluoroalkylthio group and fluoroarylthio group, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group And an alkyl group.

  Examples of the coupling agent containing a fluoro group include tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, Examples include decafluoro-1,1,2,2 tetrahydrooctyltrichlorosilane, trifluoropropyltrimethoxysilane, and γ-glycidoxypropyltrimethoxysilane.

  Such a release layer 4 preferably has a surface energy (surface free energy) smaller than the surface energy of the first adherend 5. As a result, the first adherend 5 exhibits relatively high adhesion to the bonding film 3 and is firmly bonded to the bonding film 3, while the release layer 4 is relative to the bonding film 3. Shows low adhesion. That is, the interface between the first adherend 5 and the bonding film 3 is bonded relatively firmly, while the bonding strength at the interface between the release layer 4 and the bonding film 3 is relatively low. Thus, when the bonding film transfer sheet 1 and the first adherend 5 are laminated and the base material 2 and the release layer 4 are peeled from the obtained first temporary joined body 7, the first adherend is transferred. Peeling can be reliably generated at the interface between the release layer 4 and the bonding film 3 without causing peeling at the interface between the adherend 5 and the bonding film 3. As a result, the bonding film 3 can be reliably transferred to the first adherend 5.

  The specific surface energy of the release layer 4 is preferably 5 mN / m or more and 200 mN / m or less, and more preferably 10 mN / m or more and 100 mN / m or less. If the surface energy of the release layer 4 is within the above range, the release layer 4 is peeled off at the interface between the release layer 4 and the bonding film 3 when it is manufactured and distributed as the bonding film transfer sheet 1 and is not intended. When the bonding film 3 is transferred to the first adherend 5, it is easily and reliably peeled off at the interface between the peeling layer 4 and the bonding film 3 by applying an appropriate peeling force. Can be made.

  On the other hand, the surface energy of the first adherend 5 may be higher than the surface energy of the release layer 4, but is preferably 1.1 times or more, more preferably 1.5 times or more, and still more preferably. 2 times or more. If there is such a difference, the variation in the surface energy of the release layer 4 and the first adherend 5 is sufficiently absorbed, so that the magnitude relationship between the adhesion strengths of both is prevented from being partially reversed. can do.

As a constituent material of the first adherend 5 having such a large surface energy, an inorganic material is preferably used as will be described in detail later.
Further, the surface energy of the release layer 4 is preferably smaller than the surface energy of the first adherend 5 as described above. However, the surface adherence between the first adherend 5 and the bonding film 3 by some surface treatment or the like. When the bonding strength is forcibly increased, it is not necessarily small. Examples of the surface treatment include the same surface treatment as that performed on the substrate 2 described above.

  The average thickness of the release layer 4 is not particularly limited, but is preferably about 0.1 μm to 1000 μm, more preferably about 1 μm to 500 μm. Thereby, the adhesiveness of the peeling layer 4 with respect to the base material 2 and the peeling property of the peeling layer 4 become favorable. Moreover, if the thickness of the release layer 4 is within the above range, the smoothness of the surface of the release layer 4 can be relatively enhanced even when the surface smoothness of the substrate 2 is low. As a result, a gap generated at the interface between the release layer 4 and the bonding film 3 is suppressed. When the bonding film transfer sheet 1 and the first adherend 5 are stacked and further pressed, the bonding film transfer is performed. The sheet 1 and the first adherend 5 can be adhered to each other without unevenness. As a result, the bonding film 3 can be reliably transferred.

The bonding film 3 is provided on the upper surface of the release layer 4 as described above. As described above, the bonding film 3 is characterized in that adhesiveness is developed in the region by applying energy to at least a part of the region.
Such a bonding film 3 is formed by, for example, plasma polymerization. As shown in FIG. 3, a Si skeleton 301 including a siloxane (Si—O) bond 302 and having a random atomic structure (amorphous structure). And a leaving group 303 bonded to the Si skeleton 301. Such a bonding film 3 becomes a strong film that is difficult to be deformed due to the influence of the Si skeleton 301 including the siloxane bond 302 and having a random atomic structure. This is presumably because the crystallinity of the Si skeleton 301 becomes low (becomes amorphous), so that defects such as dislocations and misalignments at the crystal grain boundaries hardly occur. For this reason, the bonding film 3 itself has high bonding strength, chemical resistance, light resistance and dimensional accuracy, and the bonded body 10 finally obtained also has high bonding strength, chemical resistance, light resistance and dimensional accuracy. Things are obtained.

When energy is applied to such a bonding film 3, the leaving group 303 is detached from the Si skeleton 301, and active hands 304 are generated on the surface 35 and inside of the bonding film 3 as shown in FIG. 4. As a result, adhesiveness is developed on the surface of the bonding film 3. When such adhesiveness develops, the bonding film 3 can be bonded to the first adherend 5 firmly and efficiently.
Note that the bond energy between the leaving group 303 and the Si skeleton 301 is smaller than the bond energy of the siloxane bond 302 in the Si skeleton 301. For this reason, the bonding film 3 selectively breaks the bond between the leaving group 303 and the Si skeleton 301 and prevents the leaving group 303 from being removed while preventing the Si skeleton 301 from being destroyed by the application of energy. Can be separated.

Further, such a bonding film 3 is a solid having no fluidity. For this reason, conventionally, the thickness and shape of the adhesive layer (bonding film 3) hardly change compared to a liquid or viscous liquid adhesive. Thereby, the dimensional accuracy of the joined body 10 becomes remarkably higher than the conventional one. Furthermore, since the time required for curing the adhesive is not required, bonding in a short time is possible.
Further, when the manufactured bonding film transfer sheet 1 is distributed, since the bonding film 3 is solid, problems such as the bonding film 3 flowing out during distribution or storage are prevented.

  Note that, in the bonding film 3, among the atoms obtained by removing H atoms from all atoms constituting the bonding film 3, the total of Si atom content and O atom content is 10 atomic% or more and 90 atomic% or less. Is preferably about 20 atomic% or more and 80 atomic% or less. If Si atoms and O atoms are contained in the above-mentioned range, the bonding film 3 forms a strong network of Si atoms and O atoms, and the bonding film 3 itself becomes strong. In addition, the bonding film 3 exhibits particularly high bonding strength with respect to the first adherend 5.

The abundance ratio of Si atoms to O atoms in the bonding film 3 is preferably about 3: 7 to 7: 3, more preferably about 4: 6 to 6: 4. By setting the abundance ratio of Si atoms and O atoms so as to be within the above range, the stability of the bonding film 3 is increased, and the first adherend 5 can be bonded more firmly. Become.
In addition, the crystallinity of the Si skeleton 301 in the bonding film 3 is preferably 45% or less, and more preferably 40% or less. As a result, the Si skeleton 301 includes a sufficiently random atomic structure and exhibits more amorphous characteristics. For this reason, the characteristics of the Si skeleton 301 described above become obvious, and the dimensional accuracy and adhesiveness of the bonding film 3 become more excellent.

Note that the crystallinity of the Si skeleton 301 can be measured by a general crystallinity measurement method, and specifically, a method of measuring based on the intensity of scattered X-rays in a crystal portion (X-ray method). , The method of obtaining from the intensity of the crystallization band of infrared absorption (infrared method), the method of obtaining based on the area under the differential curve of nuclear magnetic resonance absorption (nuclear magnetic resonance absorption method), It can be measured by a chemical method utilizing the difficulty.
Among these, the X-ray method is preferably used from the viewpoint of convenience and the like.

  Further, when the crystallinity of the Si skeleton 301 is measured, the above-described measurement method may be applied to the bonding film 3, but it is preferable to pre-treat the bonding film 3 in advance. Examples of the pretreatment include a treatment for applying energy to the bonding film 3 described later (for example, an ultraviolet irradiation treatment). By applying energy, the leaving group in the bonding film 3 is released, and the crystallinity of the Si skeleton 301 can be measured more accurately.

  The bonding film 3 preferably contains Si—H bonds in the structure. This Si—H bond is generated in the polymer when the silane undergoes a polymerization reaction by a gas phase film forming method such as plasma polymerization. At this time, the Si—H bond is regularly generated as a siloxane bond. It is thought to interfere with what is done. For this reason, the siloxane bond is formed so as to avoid the Si—H bond, and the regularity of the atomic structure of the Si skeleton 301 is lowered. Thus, according to the vapor phase film forming method such as plasma polymerization, the Si skeleton 301 having a low crystallinity can be efficiently formed.

  On the other hand, the greater the Si—H bond content in the bonding film 3, the lower the crystallinity. Specifically, in the infrared absorption spectrum of the bonding film 3, when the intensity of the peak attributed to the siloxane bond is 1, the intensity of the peak attributed to the Si—H bond is 0.001 or more and 0.2 or less. Is preferably about 0.002 to 0.05, more preferably about 0.005 to 0.02. When the ratio of the Si—H bond to the siloxane bond is within the above range, the atomic structure in the bonding film 3 is relatively random. For this reason, when the peak intensity of the Si—H bond is within the above range with respect to the peak intensity of the siloxane bond, the bonding film 3 is particularly excellent in bonding strength, chemical resistance, and dimensional accuracy.

Further, as described above, the leaving group 303 bonded to the Si skeleton 301 acts to generate an active hand in the bonding film 3 by detaching from the Si skeleton 301. Therefore, although the leaving group 303 is relatively easily and uniformly desorbed by being given energy, it is securely bonded to the Si skeleton 301 so as not to be desorbed when no energy is given. It needs to be a thing.
In the film formation by a gas phase film formation method such as plasma polymerization, the component of the source gas is polymerized to generate a Si skeleton 301 including a siloxane bond and a residue bonded thereto. The residue can be a leaving group 303.

  From this point of view, the leaving group 303 includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or each of these atoms. What consists of at least 1 sort (s) selected from the group which consists of an atomic group arrange | positioned so that it may couple | bond with frame | skeleton 301 is used preferably. Such a leaving group 303 is relatively excellent in bond / elimination selectivity by energy application. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness of the bonding film 3 can be made higher.

Examples of the atomic group (group) arranged so that each atom as described above is bonded to the Si skeleton 301 include, for example, an alkyl group such as a methyl group and an ethyl group, and an alkenyl group such as a vinyl group and an allyl group. Aldehyde group, ketone group, carboxyl group, amino group, amide group, nitro group, halogenated alkyl group, mercapto group, sulfonic acid group, cyano group, isocyanate group and the like.
Among these groups, the leaving group 303 is particularly preferably an organic group, and more preferably an alkyl group. Since the organic group and the alkyl group have high chemical stability, the bonding film 3 including the organic group and the alkyl group has excellent weather resistance and chemical resistance.

Here, when the leaving group 303 is a methyl group (—CH ₃ ) in particular, the preferred content is defined as follows from the peak intensity in the infrared light absorption spectrum.
That is, in the infrared absorption spectrum of the bonding film 3, when the intensity of the peak attributed to the siloxane bond is 1, the intensity of the peak attributed to the methyl group is about 0.05 to 0.45. Preferably, it is about 0.1 or more and 0.4 or less, more preferably about 0.2 or more and 0.3 or less. When the ratio of the peak intensity of the methyl group to the peak intensity of the siloxane bond is within the above range, it is necessary and sufficient in the bonding film 3 while preventing the methyl group from inhibiting the generation of the siloxane bond more than necessary. Since a number of active hands are generated, sufficient adhesiveness is generated in the bonding film 3. Further, the bonding film 3 exhibits sufficient weather resistance and chemical resistance due to the methyl group.

Examples of the constituent material of the bonding film 3 having such characteristics include a polymer containing a siloxane bond such as polyorganosiloxane and an organic group capable of forming a leaving group 303 bonded thereto.
The bonding film 3 made of polyorganosiloxane itself has excellent mechanical properties. In addition, it exhibits particularly excellent adhesion to many materials. Therefore, the bonding film 3 made of polyorganosiloxane adheres particularly firmly to the base material 2 and also exhibits a particularly strong adhesion force to the first adherend 5, and as a result, The base material 2 and the first adherend 5 can be firmly bonded.
Polyorganosiloxane usually exhibits water repellency (non-adhesiveness), but when given energy, it can easily desorb organic groups, changes to hydrophilicity, and exhibits adhesiveness. However, there is an advantage that the non-adhesiveness and the adhesiveness can be controlled easily and reliably.

  This water repellency (non-adhesiveness) is mainly an effect of organic groups (for example, alkyl groups) contained in the polyorganosiloxane. Therefore, the bonding film 3 made of polyorganosiloxane exhibits an adhesive property on the surface 35 when energy is applied thereto, and at the portion other than the surface 35, the action and effect of the organic group described above is obtained. Has the advantage of being Therefore, such a bonding film 3 has excellent weather resistance and chemical resistance, and is effectively used, for example, in assembling an optical element or a droplet discharge head that is exposed to chemicals for a long time. It will be a thing.

  Further, among polyorganosiloxanes, those mainly composed of a polymer of octamethyltrisiloxane are preferred. The bonding film 3 mainly composed of a polymer of octamethyltrisiloxane is particularly excellent in adhesiveness. Moreover, since the raw material which has octamethyltrisiloxane as a main component is liquid at normal temperature and has an appropriate viscosity, there is also an advantage that it is easy to handle.

The average thickness of the bonding film 3 is preferably about 1 nm to 1000 nm, and more preferably about 2 nm to 800 nm. By setting the average thickness of the bonding film 3 within the above range, the base material 2 and the first adherend 5 are bonded more firmly while preventing the dimensional accuracy of the bonded body 10 from significantly decreasing. be able to.
That is, when the average thickness of the bonding film 3 is less than the lower limit, sufficient bonding strength may not be obtained. On the other hand, when the average thickness of the bonding film 3 exceeds the upper limit, the dimensional accuracy of the bonded body 10 may be reduced.

Furthermore, if the average thickness of the bonding film 3 is within the above range, the shape of the bonding film 3 can be maintained to some extent. For this reason, for example, even when unevenness exists on the bonding surface of the substrate 2 (surface adjacent to the bonding film 3), the bonding film follows the shape of the unevenness depending on the height of the unevenness. 3 can be deposited. As a result, the bonding film 3 can absorb the unevenness and reduce the height of the unevenness generated on the surface. Then, when the bonding film transfer sheet 1 and the first adherend 5 are bonded together, the adhesion between them can be improved.
Note that the degree of the shape followability as described above becomes more significant as the thickness of the bonding film 3 increases. Therefore, the thickness of the bonding film 3 should be as large as possible in order to sufficiently ensure the shape following ability.

  Although the bonding film 3 has been described in detail above, such a bonding film 3 is produced by a vapor deposition method such as plasma polymerization. Among these, the plasma polymerization can efficiently produce a dense and homogeneous bonding film 3. Thereby, the bonding film 3 can be particularly strongly bonded to the first adherend 5. Furthermore, the bonding film 3 produced by plasma polymerization is maintained for a relatively long time in a state where energy is applied and activated. For this reason, the manufacturing process of the joined body 10 can be simplified and efficient. In addition to the plasma polymerization method, the bonding film 3 can be produced by various liquid phase film forming methods in addition to various vapor phase film forming methods such as a CVD method (particularly plasma CVD method) and a PVD method.

The bonding film transfer sheet 1 as described above may have a cover sheet provided so as to cover the upper surface of the bonding film 3 as necessary. Such a cover sheet protects the upper surface of the bonding film 3 and prevents adhesion of foreign matters, damage to the bonding film 3 and the like. Thereby, the bonding film transfer sheet 1 is excellent in durability, and is suitable for long-term storage and distribution.
This cover sheet is peeled off before using the bonding film transfer sheet 1. At this time, since it is necessary to surely peel off at the interface between the bonding film 3 and the cover sheet, the adhesion strength at the interface is preferably smaller than the adhesion strength between the peeling layer 4 and the bonding film 3.

From this viewpoint, the cover sheet preferably has a surface energy smaller than that of the release layer 4. As a result, the release layer 4 exhibits relatively high adhesion to the bonding film 3 and is relatively strongly adhered to the bonding film 3, while the cover sheet has relatively low adhesion to the bonding film 3. Will be shown. As a result, even if energy is given to the bonding film transfer sheet 1 unintentionally, the cover sheet and the bonding film 3 are prevented from being bonded, and the bonding film 3 is reliably peeled off. A possible cover sheet is obtained.
Specifically, the surface energy of the cover sheet is preferably about 0.3 to 0.95 times the surface energy of the release layer 4, and preferably about 0.4 to 0.9 times. Is more preferable.
Examples of the constituent material of the cover sheet include the same constituent materials as those of the base material 2 described above.

In addition, since the bonding film transfer sheet 1 may be stored or distributed in a state of being wound in a roll shape, a flexible cover sheet is preferably used as the base sheet 2.
The bonding film transfer sheet 1 may be one in which the peeling layer 4 is omitted when the substrate 2 itself has peelability with respect to the bonding film 3.

As the base material 2 having releasability with respect to the bonding film 3, a resin-based material is preferably used as the main material, and this resin-based material is any one of fluorine-based resin, polyolefin, polyester, and polyimide. Is more preferable. Such a substrate 2 is not only excellent in flexibility, but also has excellent peelability from the bonding film 3.
Moreover, the base material 2 preferably has the same characteristics as the release layer 4. That is, the surface energy of the substrate 2 is preferably smaller than the surface energy of the first adherend 5.
Further, the specific surface energy of the substrate 2 is preferably 5 mN / m or more and 200 mN / m or less, and more preferably 10 mN / m or more and 100 mN / m or less.

Hereinafter, a method for producing the bonding film 3 will be described.
First, prior to explaining the method for producing the bonding film 3, a plasma polymerization apparatus used for producing the bonding film 3 by plasma polymerization will be described.
FIG. 5 is a longitudinal sectional view schematically showing a plasma polymerization apparatus used for forming a bonding film of a bonding film transfer sheet used in the bonding film transfer apparatus of the present invention. In the following description, the upper side in FIG. 5 is referred to as “upper” and the lower side is referred to as “lower”.

  The plasma polymerization apparatus 100 shown in FIG. 5 includes a chamber 101, a first electrode 130 that supports the substrate 2, a second electrode 140, and a power supply circuit 180 that applies a high-frequency voltage between the electrodes 130 and 140. A gas supply unit 190 that supplies gas into the chamber 101 and an exhaust pump 170 that exhausts the gas in the chamber 101 are provided. Among these parts, the first electrode 130 and the second electrode 140 are provided in the chamber 101. Hereinafter, each part will be described in detail.

The chamber 101 is a container that can keep the inside airtight, and is used with the inside being in a reduced pressure (vacuum) state. Therefore, the chamber 101 has pressure resistance that can withstand a pressure difference between the inside and the outside.
The chamber 101 shown in FIG. 5 has a substantially cylindrical chamber body whose axis is arranged along the horizontal direction, a circular side wall that seals the left opening of the chamber body, and a circle that seals the right opening. And side walls.

A supply port 103 is provided above the chamber 101, and an exhaust port 104 is provided below the chamber 101. A gas supply unit 190 is connected to the supply port 103, and an exhaust pump 170 is connected to the exhaust port 104.
In this embodiment, the chamber 101 is made of a highly conductive metal material and is electrically grounded via the ground wire 102.

The first electrode 130 has a plate shape and supports the base material 2 on which the release layer 4 (not shown in FIG. 5) is formed.
The first electrode 130 is provided on the inner wall surface of the side wall of the chamber 101 along the vertical direction, whereby the first electrode 130 is electrically grounded via the chamber 101. As shown in FIG. 5, the first electrode 130 is provided concentrically with the chamber body.

An electrostatic chuck (suction mechanism) 139 is provided on the surface of the first electrode 130 that supports the substrate 2.
The electrostatic chuck 139 can support the base material 2 along the vertical direction as shown in FIG. Moreover, even if the base material 2 has some warpage, the base material 2 can be subjected to plasma treatment in a state in which the warpage is corrected by being attracted to the electrostatic chuck 139.

The second electrode 140 is provided to face the first electrode 130 with the base material 2 interposed therebetween. Note that the second electrode 140 is provided in a state of being separated (insulated) from the inner wall surface of the side wall of the chamber 101.
A high frequency power source 182 is connected to the second electrode 140 via a wiring 184. A matching box (matching unit) 183 is provided in the middle of the wiring 184. The wiring 184, the high-frequency power source 182 and the matching box 183 constitute a power circuit 180.
According to such a power supply circuit 180, since the first electrode 130 is grounded, a high frequency voltage is applied between the first electrode 130 and the second electrode 140. As a result, an electric field whose direction is reversed at a high frequency is induced in the gap between the first electrode 130 and the second electrode 140.

The gas supply unit 190 supplies a predetermined gas into the chamber 101.
A gas supply unit 190 shown in FIG. 5 stores a liquid storage unit 191 that stores a liquid film material (raw material liquid), a vaporizer 192 that vaporizes the liquid film material to change it into a gaseous state, and stores a carrier gas. And a gas cylinder 193. Each of these parts and the supply port 103 of the chamber 101 are connected by a pipe 194, and a mixed gas of a gaseous film material (raw material gas) and a carrier gas is supplied from the supply port 103 into the chamber 101. It is configured to supply.

The liquid film material stored in the liquid storage unit 191 is a raw material that is polymerized by the plasma polymerization apparatus 100 to form a polymer film on the surface of the substrate 2.
Such a liquid film material is vaporized by the vaporizer 192 and is supplied into the chamber 101 as a gaseous film material (raw material gas). The source gas will be described in detail later.
The carrier gas stored in the gas cylinder 193 is a gas that is discharged due to the action of an electric field and introduced to maintain this discharge. Examples of such a carrier gas include Ar gas and He gas.

A diffusion plate 195 is provided near the supply port 103 in the chamber 101.
The diffusion plate 195 has a function of promoting the diffusion of the mixed gas supplied into the chamber 101. Thereby, the mixed gas can be dispersed in the chamber 101 with a substantially uniform concentration.

The exhaust pump 170 exhausts the inside of the chamber 101, and includes, for example, an oil rotary pump, a turbo molecular pump, or the like. Thus, by exhausting the chamber 101 and reducing the pressure, the gas can be easily converted into plasma. In addition, contamination and oxidation of the base material 2 due to contact with the air atmosphere can be prevented, and reaction products resulting from the plasma treatment can be effectively removed from the chamber 101.
The exhaust port 104 is provided with a pressure control mechanism 171 that adjusts the pressure in the chamber 101. Thereby, the pressure in the chamber 101 is appropriately set according to the operation state of the gas supply unit 190.

Next, a method for producing the bonding film 3 on the substrate 2 on which the release layer 4 is formed using the plasma polymerization apparatus 100 will be described.
FIG. 6 is a diagram (longitudinal sectional view) for explaining a method of producing the bonding film 3 on the substrate 2 on which the release layer 4 is formed. In the following description, the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.
The bonding film 3 can be obtained by supplying a mixed gas of a source gas and a carrier gas in a strong electric field to polymerize molecules in the source gas and deposit a polymer on the release layer 4. . Details will be described below.

First, the base material 2 on which the release layer 4 is formed is prepared.
Next, after the base material 2 on which the release layer 4 is formed is stored in the chamber 101 of the plasma polymerization apparatus 100 to be in a sealed state, the inside of the chamber 101 is brought into a reduced pressure state by the operation of the exhaust pump 170.
Next, the gas supply unit 190 is operated to supply a mixed gas of the source gas and the carrier gas into the chamber 101. The supplied mixed gas is filled into the chamber 101 (see FIG. 6A).

Here, the ratio (mixing ratio) of the source gas in the mixed gas is slightly different depending on the type of the source gas and the carrier gas, the target film forming speed, and the like. For example, the ratio of the source gas in the mixed gas is 20 % Is preferably set to about 70% or less, and more preferably set to about 30% or more and 60% or less. As a result, it is possible to optimize the conditions for formation (film formation) of the polymer film.
Further, the flow rate of the gas to be supplied is appropriately determined depending on the type of gas, the target film formation rate, the film thickness, etc., and is not particularly limited, but usually the flow rates of the source gas and the carrier gas are respectively It is preferably set to about 1 ccm or more and 100 ccm or less, and more preferably set to about 10 ccm or more and 60 ccm or less.

Next, the power supply circuit 180 is activated, and a high frequency voltage is applied between the pair of electrodes 130 and 140. As a result, gas molecules existing between the pair of electrodes 130 and 140 are ionized to generate plasma. The molecules in the source gas are polymerized by the energy of the plasma, and the polymer is adhered and deposited on the release layer 4 as shown in FIG. Thereby, the bonding film 3 made of a plasma polymerization film is formed (see FIG. 6C).
Further, the surface of the release layer 4 is activated and cleaned by the action of plasma. For this reason, the polymer of the source gas is easily deposited on the surface of the release layer 4, and the bonding film 3 can be stably formed. As described above, according to the plasma polymerization, the bonding film 3 can be reliably formed on the release layer 4 regardless of the constituent material of the release layer 4.

Examples of the source gas include organosiloxanes such as methylsiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane, and methylphenylsiloxane.
The plasma polymerized film obtained by using such a raw material gas, that is, the bonding film 3 is composed of a polymer obtained by polymerizing these raw materials, that is, a polyorganosiloxane.

In the plasma polymerization, the frequency of the high frequency applied between the pair of electrodes 130 and 140 is not particularly limited, but is preferably about 1 kHz to 100 MHz, and more preferably about 10 MHz to 60 MHz.
The high frequency output density is not particularly limited, but is preferably about 0.01 W / cm ² or more and 100 W / cm ² or less, more preferably about 0.1 W / cm ² or more and 50 W / cm ² or less. Preferably, it is about 1 W / cm ² or more and 40 W / cm ² or less. By setting the high-frequency power density within the above range, the Si skeleton 301 having a random atomic structure can be reliably secured while preventing the plasma gas from being added to the source gas more than necessary because the high-frequency power density is too high. Can be formed. That is, when the high-frequency output density is lower than the lower limit value, the molecules in the raw material gas cannot cause a polymerization reaction, and the bonding film 3 may not be formed. On the other hand, when the power density of the high frequency exceeds the upper limit, the structure that can be the leaving group 303 is separated from the Si skeleton 301 due to decomposition of the source gas or the like, and the leaving group in the resulting bonding film 3 is separated. There is a possibility that the content of 303 is lowered or the randomness of the Si skeleton 301 is lowered (regularity is increased).

The pressure in the chamber 101 at the time of film formation is preferably about 133.3 × 10 ⁻⁵ Pa to 1333 Pa (1 × 10 ⁻⁵ Torr to 10 Torr), preferably 133.3 × 10 ⁻⁴ Pa. More preferably, it is about 133.3 Pa or less (1 × 10 ⁻⁴ Torr or more and 1 Torr or less).
The raw material gas flow rate is preferably about 0.5 sccm to 200 sccm, more preferably about 1 sccm to 100 sccm. On the other hand, the carrier gas flow rate is preferably about 5 sccm or more and 750 sccm or less, and more preferably about 10 sccm or more and 500 sccm or less.
The treatment time is preferably about 1 to 10 minutes, more preferably about 4 to 7 minutes.
Moreover, it is preferable that the temperature of the base material 2 is 25 degreeC or more, and it is more preferable that it is about 25 degreeC or more and 100 degrees C or less.

The bonding film 3 is obtained as described above.
The bonding film 3 has a relatively high translucency depending on the thickness. The refractive index of the bonding film 3 can be adjusted by appropriately setting the conditions for forming the bonding film 3 (conditions during plasma polymerization, composition of the raw material gas, and the like). Specifically, the refractive index of the bonding film 3 can be increased by increasing the high frequency power density during plasma polymerization, and conversely, the bonding can be achieved by decreasing the high frequency power density during plasma polymerization. The refractive index of the film 3 can be lowered.

Specifically, according to plasma polymerization using a silane-based gas as a raw material, the bonding film 3 having a refractive index range of about 1.35 to 1.6 is obtained. Since the refractive index of such a bonding film 3 is close to that of quartz or quartz glass, for example, it is suitably used when manufacturing an optical component having a structure in which the optical path penetrates the bonding film 3. Further, since the refractive index of the bonding film 3 can be adjusted, the bonding film 3 having a desired refractive index can be manufactured.
In addition, since the bonding film 3 is close to the thermal expansion coefficient of quartz or quartz glass, the difference in the thermal expansion coefficient between the bonding film 3 and the optical component is reduced, and deformation after bonding of the bonded body 10 can be suppressed.

(Bonding film transfer device and bonding device)
Next, a method for bonding adherends to each other using the bonding apparatus of the present invention using the bonding film transfer sheet as described above will be described.
First, the joining apparatus of the present invention will be described.
7 and 8 are perspective views schematically showing the configuration of the embodiment of the joining device of the present invention. In the following description, the upper side in FIGS. 7 and 8 is referred to as “upper” and the lower side is referred to as “lower”.

A bonding film transfer apparatus 500 illustrated in FIG. 7 includes a flat plate stage 501, and rollers 502 and 503 provided at both ends of the stage 501.
The stage 501 may be placed in a state of being fixed on the roller 502 and the roller 503 as shown in FIG. 7, but the belt on which the roller 502 and the roller 503 rotate and the stage 501 is also rotated by the rotation. It may be a conveyor.

  In addition, a sheet roll (roll body) 510 obtained by winding the long (band-shaped) bonding film transfer sheet 1 into a roll shape is rotatably provided above the left side of the stage 501. The outer end of the bonding film transfer sheet 1 is drawn out from the sheet roll 510, and the fed bonding film transfer sheet 1 passes from the left end to the right end on the stage 501, It is structured to be wound by a winding roll (winding means) 511 provided on the lower right side.

A driving means (such as a motor) (not shown) is connected to the rotation shaft of the winding roll 511, and the winding roll 511 is rotated by this driving means. As a result, the bonding film transfer sheet 1 is wound (collected) by the take-up roll 511, and the entire bonding film transfer sheet 1 is pulled to move to the right side on the stage 501. In other words, with the structure as described above, the three procedures including supplying, transporting, and collecting unnecessary portions of the bonding film transfer sheet 1 can be performed simultaneously only by the winding roll 511.
The recovered bonding film transfer sheet 1 is regenerated as the bonding film transfer sheet 1 again by peeling off the peeling layer 4 and the bonding film 3 and then forming the peeling layer 4 and the bonding film 3 again. Can do.

In the sheet roll 510, the bonding film transfer sheet 1 is wound so that the surface on which the bonding film 3 is provided faces upward.
The take-up roll 511 can be replaced with other transport means that can transport the bonding film transfer sheet 1. For example, when the bonding film transfer sheet 1 does not have a length sufficient to wind up, the above-described belt capable of simply pulling the bonding film transfer sheet 1 or carrying the bonding film transfer sheet 1 can be conveyed. It can be replaced by a conveyor or the like.

A guide roll 512 and a guide roll 513 are rotatably provided on the right side of the sheet roll 510 and the left side of the take-up roll 511, respectively. Among these, the guide roll 512 changes the advancing direction of the bonding film transfer sheet 1 fed from the upper left side of the stage 501 toward the lower right side to the horizontal direction. On the other hand, the guide roll 513 changes the traveling direction of the bonding film transfer sheet 1 traveling on the stage 501 from the left side to the right side so as to face the winding roll 511.
By the sheet roll 510, the take-up roll 511, the guide roll 512, and the guide roll 513 as described above, the bonding film transfer sheet 1 is conveyed from the left side to the right side along the upper surface of the stage 501.

  Between the guide roll 512 and the guide roll 513, a plasma processing mechanism (activation means) 520, a first adherend supply mechanism (adherence supply means) 530, and a pressing mechanism (pressing means) are arranged from the left side. 540 and a peeling mechanism (peeling means) 550 are sequentially provided. That is, the bonding film transfer sheet 1 is stretched so as to sequentially pass through the plasma processing mechanism 520, the first adherend supply mechanism 530, the pressing mechanism 540, and the peeling mechanism 550. Thus, when the bonding film transfer sheet 1 is wound up by the winding roll 511, a specific region of the bonding film transfer sheet 1 is sequentially provided to each of the mechanisms described above. Accordingly, as long as the bonding film transfer sheet 1 is pulled, each process of plasma treatment, supply of the first adherend 5, pressing, and peeling can be sequentially performed. Despite the extremely simple structure, the time required for manufacturing one joined body 10 is short, and the mass productivity is excellent.

  Moreover, if it is the above structures, each process of plasma processing, supply of the 1st to-be-adhered body 5, a press, and peeling will be performed with respect to the strip | belt-shaped joining film | membrane transfer sheet 1 shifting a position. By doing so, a plurality of bonded bodies 10 can be manufactured one after another from one bonding film transfer sheet 1. As a result, the waiting time of the process in each mechanism can be shortened, and the number of joined bodies 10 that can be manufactured per unit time can be greatly increased.

  The plasma processing mechanism 520 includes a plasma source 521 that is provided above the stage 501 and can supply the plasma P toward the bonding film 3 of the bonding film transfer sheet 1. Examples of the plasma source 521 include various atmospheric pressure plasma sources such as the direct plasma system, the remote plasma system, and the downflow plasma system as described above. When the bonding film transfer sheet 1 passes between the plasma source 521 and the stage 501, energy is applied to the bonding film 3 during the passage, and adhesiveness is developed.

Further, the plasma processing mechanism 520 is preferably a long one longer than the width of the bonding film transfer sheet 1. According to such a plasma processing mechanism 520, since the plasma processing can be performed over the entire width of the bonding film transfer sheet 1, if the bonding film transfer sheet 1 is moved (passed) from the left side to the right side, the bonding film Plasma processing can be efficiently performed on the entire transfer sheet 1.
Note that the plasma processing mechanism 520 may be replaced with another mechanism that can impart energy to the bonding film 3. Examples of such a mechanism include an ultraviolet irradiation mechanism such as a UV lamp and a UV laser, an electron beam irradiation mechanism that irradiates an electron beam, a heating mechanism that applies heat, and an ozone generation mechanism that applies ozone gas.

A first adherend supply mechanism 530 is provided on the right side of the plasma processing mechanism 520.
The first adherend supply mechanism 530 takes out the first adherend 5 from the storage unit 531 for storing the first adherend 5 and the storage unit 531, and places it on the bonding film transfer sheet 1. And vertical conveying means 532 to be placed.
The storage unit 531 is supported above the bonding film transfer sheet 1 by four support columns 533 and is configured to store a plurality of first adherends 5 in an overlapping manner.

  In addition, the vertical conveying means 532 has a gripping tool (not shown) provided so as to be movable along the four support columns 533, and this gripping tool causes one first object to be received from the storage portion 531. The substrate 5 is taken out and vertically conveyed onto the bonding film transfer sheet 1 and stacked. The first adherend 5 laminated on the bonding film transfer sheet 1 is bonded to the bonding film transfer sheet 1 by the adhesiveness developed in the bonding film 3.

The first adherend supply mechanism 530 preferably includes fine movement means (not shown) that finely adjusts the placement position when the first adherend 5 is placed. Thereby, the lamination position of the 1st to-be-adhered body 5 with respect to the area | region which performed the plasma processing of the bonding film transfer sheet 1 can be adjusted correctly (alignment).
Note that the configuration of the first adherend supply mechanism 530 is not limited to the above. For example, the structure may be such that the first adherend 5 is adsorbed by a method such as suction and conveyed by an arm type manipulator.

A pressing mechanism 540 is provided on the right side of the first adherend supply mechanism 530.
The pressing mechanism 540 includes a pressing roller 541 and a pressing roller 542 provided above and below the stage 501. Between the two pressing rollers 541 and 542, the stage 501 and the bonding film transfer sheet 1 are positioned, and the distance between the two pressing rollers 541 and 542 is that the first adherend 5 is transferred to the bonding film. The distance that can be pressed against the sheet 1 is adjusted. By the pressing mechanism 540, the first adherend 5 and the bonding film transfer sheet 1 are more firmly bonded, and the first temporary bonded body 7 is obtained.

  In addition, the pressing mechanism 540 includes a separation distance adjusting unit (not shown) that adjusts the separation distance between the two pressing rollers 541 and 542, and accordingly, according to the thickness of the first adherend 5. The separation distance can be freely adjusted.

By using the pressure roller in this way, the first adherend 5 can be pressed while being conveyed, and therefore the time required for the process can be shortened.
Moreover, it is preferable that the surface of the two pressing rollers 541 and 542 has elasticity. Thereby, the 1st to-be-adhered body 5 and the joining film | membrane transfer sheet 1 can be pressed uniformly, without unevenness.

The configuration of the pressing mechanism 540 is not limited to the above. For example, a flat load generator may be used to press the stopped first adherend 5 and bonding film transfer sheet 1.
A peeling mechanism 550 is provided on the right side of the pressing mechanism 540.
The peeling mechanism 550 includes an adsorbing unit 551 that adsorbs the upper surface of the first adherend 5, a manipulator 552 that moves the adsorbing unit 551, and a guide that changes the traveling direction of the bonding film transfer sheet 1 from the horizontal direction to the lower side. A roll 513. The upper surface of the first temporary bonded body 7, that is, the upper surface of the first adherend 5 is adsorbed by the adsorbing means 551, and the traveling direction of the bonding film transfer sheet 1 is changed by the guide roll 513 while fixing the position. Then, a force that separates the first adherend 5 and the bonding film transfer sheet 1 acts, and the interface between the two adheres. As a result, a part of the bonding film 3 is transferred to the first adherend 5 to obtain the second temporary bonded body 8, and the remaining bonding film 3 is wound up with the base material 2 and the release layer 4. 511 is wound up.
As the adsorbing means 551, one using an attractive force or an electrostatic force can be used.

The obtained second temporary joined body 8 is gripped by the suction means 551 and the manipulator 552, and is subjected to a joining process with the second adherend 6 in the joining apparatus 600 shown in FIG.
In the bonding film transfer apparatus 500, the plasma processing mechanism 520, the first adherend supply mechanism 530, the pressing mechanism 540, the peeling mechanism 550, and the take-up roll 511 are electrically connected to a control unit 560 that controls these operations. Connected. By this control unit 560, the operation of each unit is controlled cooperatively.

Specifically, the first adherend supply mechanism 530 and the take-up roll 511 operate according to the region where the plasma processing is performed by the plasma processing mechanism 520, and the first adherend 5 is reliably placed in this region. It is controlled to be laminated.
In addition, when the first adherend supply mechanism 530 supplies the first adherend 5, the operation of the take-up roll 511 is temporarily stopped. Thereby, since the bonding film transfer sheet 1 is stopped, the first adherend supply mechanism 530 can reliably stack the first adherend 5 on the region where the plasma treatment is performed.
Examples of the control unit 560 include various ICs and various LSIs.
Further, the operation of the peeling mechanism 550 is started when the operation of the pressing mechanism 540 ends. This control is also performed by cooperative control of the pressing mechanism 540 and the peeling mechanism 550.

A bonding apparatus 600 shown in FIG. 8 is an apparatus for bonding the second adherend 6 to the second temporary bonded body 8 obtained by the bonding film transfer apparatus 500 to obtain the bonded body 10.
8 includes a plasma processing mechanism (second activation means) 610, a second adherend supply mechanism (second adherend supply means) 620, and a press provided in order from the left side. A mechanism (second pressing means) 630 is provided. Moreover, the joining apparatus 600 has a conveyance means (not shown) that sequentially conveys the second temporary joined body 8 to each of the mechanisms.

The plasma processing mechanism 610 includes a base 611 on which the second temporary joined body 8 can be placed, and a plasma source 612 that performs plasma processing on the second temporary joined body 8. When the plasma P is generated from the plasma source 612, the bonding film 33 of the second temporary bonded body 8 is subjected to plasma processing. Thereby, energy is given to the bonding film 33 and adhesiveness is expressed.
As the plasma source 612, the same plasma source 521 as described above can be used. In addition, the plasma treatment may be replaced by the energy beam irradiation treatment as described above.

A second adherend supply mechanism 620 is provided on the right side of the plasma processing mechanism 610.
The second adherend supply mechanism 620 is provided on the base 621 on which the second temporary joined body 8 can be placed on the upper surface, and stores the second adherend 6. The storage unit 622 includes a storage unit 622 and a vertical transport unit 623 that takes out the second adherend 6 from the storage unit 622 and places the second adherend 6 on the second temporary joined body 8.

  The storage unit 622 and the vertical transport unit 623 have the same configuration as the storage unit 531 and the vertical transport unit 532 described above. That is, the storage unit 622 is supported above the base 621 by four support columns 624 and configured to store a plurality of second adherends 6 in a stacked manner. Further, the vertical conveying means 623 has a gripping tool (not shown) provided so as to be movable along the four support columns 624, and this gripping tool causes one second object to be received from the storage portion 622. The body 6 is taken out, vertically transported onto the second temporary joined body 8, and laminated. The second adherend 6 laminated on the second temporary bonded body 8 is bonded to the second temporary bonded body 8 by the adhesiveness developed in the bonding film 33. As a result, the first adherend 5 and the second adherend 6 are bonded via the bonding film 33, and the bonded body 10 is obtained.

According to such a joining apparatus 600, the second temporary joined body 8 can be made to exhibit adhesiveness when necessary, and the joined body 10 can be quickly manufactured using the adhesiveness. Therefore, it is possible to reliably prevent the occurrence of a device failure such that the second temporary joined body 8 adheres to the device.
Note that the configuration of the second adherend supply mechanism 620 is not limited to the above. For example, the structure may be such that the second adherend 6 is adsorbed by a method such as suction and conveyed by an arm type manipulator (not shown).

A pressing mechanism 630 is provided on the right side of the second adherend supply mechanism 620.
The pressing mechanism 630 includes a base 631 and a load generator 632 that is provided on the base 631 and applies a load so as to press the joined body 10 from above and below across the joined body 10. The load generator 632 has, for example, two flat members, and applies the load by sandwiching and pressing the joined body 10 between the members. As a result, a pressing force is applied to the joined body 10, and the joined body 10 is more firmly joined.
The configuration of the pressing mechanism 630 is not limited to the above. For example, a structure in which a pressing force is applied to the joined body 10 by using two rollers sandwiching the joined body 10 and inserting the joined body 10 between these rollers may be used.

  In addition, the bonding apparatus 600 is preferably disposed so that the plasma processing mechanism 610 is adjacent to the end of the bonding film transfer apparatus 500 (the peeling mechanism 550). As a result, the second temporary bonded body 8 obtained by the bonding film transfer apparatus 500 is conveyed to the plasma processing mechanism 610 of the bonding apparatus 600 as it is. As a result, the time for which the surface of the bonding film 33 of the second temporary bonded body 8 is left is shortened, and the bonding film 33 is prevented from being contaminated, adhered to foreign matter, and the like, so that good bonding is possible.

  Further, since both the bonding film transfer apparatus 500 and the bonding apparatus 600 do not require a vacuum apparatus or the like as compared with the plasma polymerization apparatus 100, the apparatus configuration is simple, lightweight, and inexpensive. For this reason, these apparatuses are excellent in portability compared with the plasma polymerization apparatus 100. Even if the plasma polymerization apparatus 100 is not provided, the bonded body 10 can be manufactured as long as the bonding film transfer sheet 1 is prepared. There is also an advantage of becoming.

(Joining method)
Next, a method for bonding the first adherend 5 and the second adherend 6 using the bonding film transfer apparatus 500 and the bonding apparatus 600 described above will be described.
In this bonding method, the upper surface (surface) of the bonding film 3 of the bonding film transfer sheet 1 is subjected to plasma treatment (giving energy), and the bonding film 3 and the first adherend 5 are in close contact with each other. The first step of laminating the bonding film transfer sheet 1 and the first adherend 5 to obtain the first temporary bonded body 7, and peeling the substrate 2 and the release layer 4 from the first temporary bonded body 7. As a result, a second step of transferring a part of the bonding film 3 (bonding film 33) to the first adherend 5 to obtain the second temporary bonding body 8, and the second temporary bonding body 8 The upper surface (peeling surface) of the bonding film 33 is subjected to plasma treatment (giving energy), and the second temporary bonded body 8 and the second bonded body 6 are in contact with each other so that the bonding film 33 and the second adherend 6 are in close contact with each other. The adherend 6 is laminated to obtain a joined body 10. Hereinafter, each process will be described sequentially.

[1] First, a sheet roll 510 is prepared by winding the bonding film transfer sheet 1 as shown in FIG.
Next, the bonding film transfer sheet 1 is fed out from the sheet roll 510, and plasma processing is performed on the bonding film transfer sheet 1 by the plasma processing mechanism 520 on the stage 501 (energy is applied). When the plasma treatment is performed, adhesiveness is developed on the upper surface 31 of the bonding film 3.
Note that only a target region of the bonding film 3 can be selectively plasma-treated by covering a part of the bonding film transfer sheet 1 with a mask or the like. As a result, only a part of the bonding film 3 can be transferred to the first adherend 5 in a process described later.

  Further, atmospheric pressure plasma is preferably used as the plasma exposed to the bonding film 3. According to atmospheric pressure plasma, plasma treatment can be easily performed without using expensive equipment such as decompression means. In addition to the direct plasma method in which plasma is generated in the vicinity of the bonding film 3 as described above, this plasma processing is performed by a remote plasma method or a downflow plasma method in which the object to be processed and the plasma generation unit are separated from each other. Are also preferably used. According to the direct plasma method, since plasma is generated in the vicinity of the bonding film 3, plasma processing can be performed efficiently and uniformly. In addition, when the object to be processed and the plasma generating part are separated from each other as in the remote plasma method or the down flow plasma method, the object to be processed and the plasma generating part do not interfere with each other. Can be avoided from ion damage.

Further, when the plasma treatment is performed in a reduced pressure atmosphere, there is a possibility that a gas unintentionally confined inside the bonding film 3 or a gas generated over time is forcibly extracted to the outside of the bonding film 3. . When such a phenomenon occurs, the bonding film 3 is damaged, resulting in a decrease in adhesiveness, and an increase in the refractive index is unintentionally changed.
On the other hand, by performing plasma treatment under atmospheric pressure, the bonding film 3 can exhibit adhesiveness without being damaged.

  Further, energy can be selectively applied to the surface of the bonding film 3 by using plasma. This is because in the case of plasma, unlike ultraviolet rays, it is difficult to enter the bonding film 3. Therefore, only the plasma processing surface (upper surface) of the bonding film 3 is activated to exhibit adhesiveness, and the lower surface (interface with the peeling layer 4) is hardly activated. For this reason, the potential adhesiveness on the lower surface is surely maintained, and thereafter, when energy is applied to the lower surface, the adhesiveness can be reliably expressed.

  In this way, the surface 31 of the bonding film 3 to which energy has been applied and activated is bonded to an unterminated bond (dangling bond) and a hydroxyl group formed by contacting the bond with water around it (dangling bond). OH group) is exposed. The above-mentioned “activate” means either a state in which the bond near and inside the upper surface 31 is cut and an unterminated bond is generated or a hydroxyl group is bonded to the bond. Or a state in which these states are mixed.

  In addition, when irradiating energy rays instead of plasma treatment or with plasma treatment, it is particularly preferable to use ultraviolet rays (for example, a wavelength of about 126 nm to about 300 nm). According to such ultraviolet rays, it is possible to process a wide range in a shorter time without unevenness while preventing a significant deterioration in the characteristics of the bonding film 3. For this reason, the upper surface 31 of the bonding film 3 can be activated more efficiently.

Further, the wavelength of the ultraviolet light is more preferably about 160 nm to 200 nm.
Further, the time for irradiating with ultraviolet rays is not particularly limited as long as the chemical bond in the vicinity of the upper surface 31 of the bonding film 3 can be broken, but it is preferably about 0.5 to 30 minutes. More preferably, it is about 1 minute or more and 10 minutes or less.

In addition, when irradiating an energy ray with respect to a partial area | region of the bonding film 3, if it is an energy ray with high directivity like a laser beam and an electron beam, it irradiates toward the target direction, It is possible to selectively and easily irradiate the region with energy rays.
Moreover, even if it is an energy ray with low directivity, if it irradiates so that areas other than a predetermined area may be covered, an energy ray can be selectively irradiated with respect to a predetermined area.

[2] Next, the winding roll 511 is rotated to wind up the bonding film transfer sheet 1 and move the plasma-treated region to the first adherend supply mechanism 530.
Then, as shown in FIG. 1 (b), the region to which the bonding film transfer sheet 1 has been subjected to plasma processing and the convex portion 51 of the first adherend 5 are formed by the first adherend supply mechanism 530. The bonding film transfer sheet 1 and the first adherend 5 are stacked so as to be in contact with each other. Thereby, in the area | region 32 corresponding to the planar view shape of the convex part 51, the 1st temporary joining body 7 formed by joining the joining film transfer sheet 1 and the 1st to-be-adhered body 5 partially is obtained ( (Refer FIG.1 (c)).

In the first temporary joined body 7 thus obtained, the joining strength between the joining film transfer sheet 1 and the first adherend 5 is preferably 5 MPa (50 kgf / cm ² ) or more, and preferably 10 MPa ( 100 kgf / cm ² ) or more is more preferable. The first temporary bonded body 7 having such bonding strength is obtained by bonding the bonding film 3 and the first adherend when the substrate 2 and the peeling layer 4 are peeled from the bonding film transfer sheet 1 in the process described later. Thus, it is possible to reliably prevent peeling at the interface with 5.

[3] Next, the first temporary joined body 7 is moved to the pressing mechanism 540 by rotating the winding roll 511 again. Then, the first temporary joined body 7 is passed between the pressing roller 541 and the pressing roller 542 of the pressing mechanism 540. As a result, a pressing force is applied to the first provisional bonded body 7. At this time, the convex portion 51 selectively presses a part of the bonding film 3, and is selected against the region 32 of the bonding film 3. Thus, a pressing force is applied. As a result, the bonding of the first temporary bonded body 7 is further strengthened.
According to such a method, the area to be transferred can be easily changed only by appropriately changing the shape of the convex portion 51 according to the shape (planar shape) of the area 32 to be transferred.

In addition, it is preferable that the lower surface of the convex part 51 in FIG.1 (b) is a flat surface, and it is preferable that the cross-sectional shape of the convex part 51 is a trapezoid or a rectangle. Thereby, the convex part 51 can press a part of the bonding film 3 uniformly and accurately.
Further, the height of the convex portion 51 is not particularly limited, but is preferably about 50 μm or more and 5 mm or less, and more preferably about 100 μm or more and 3 mm or less. As a result, the convex portion 51 reliably prevents defects and the like, and even if the bonding film transfer sheet 1 undulates with the pressing, only the target region is pressed without pressing the non-target region. It can be surely pressed.

Moreover, it is preferable that the first adherend 5 has rigidity. This prevents the convex portion 51 from being deformed when the first temporary joined body 7 is pressed. As a result, it is possible to reliably prevent the shape of the region 32 to be transferred from being deformed and to enable accurate bonding.
Specifically, the Young's modulus (flexural modulus) of the first adherend 5 is preferably about 5 GPa to 50 GPa at a general room temperature (25 ° C.), and is about 12 GPa to 30 GPa. Is more preferable.
In addition, although the convex part 51 may be formed by what kind of method, for example, it can form by the method which combined the photolithography technique and the etching technique, the laser processing method, the electron beam processing method etc.

  Here, it is preferable that a hydroxyl group (OH group) is bonded to the surface of the first adherend 5 that contacts the bonding film 3. When the surface of the first adherend 5 is in such a state, the bonding strength between the first adherend 5 and the bonding film 3 is improved, and the bonding film transfer sheet 1 and the first film 1 are bonded. The adherend 5 can be bonded more firmly. Such an effect is assumed to be due to the following phenomenon.

In this step, when the bonding film 3 and the first adherend 5 are brought into contact (adherence), the hydroxyl groups present on the surface of the first adherend 5 and the activated surface of the bonding film 3 are obtained. Are attracted to each other by hydrogen bonding, and an attractive force is generated between the hydroxyl groups.
Further, the hydroxyl groups attracting each other by this hydrogen bond are dehydrated and condensed depending on the temperature condition or the like. As a result, at the contact interface between the bonding film 3 and the first adherend 5, the bonds to which the detached OH groups are bonded are bonded through oxygen atoms. Thereby, the bonding film 3 and the first adherend 5 are bonded chemically and firmly.

  In order to form a state in which a hydroxyl group is bonded to the surface of a region of the first adherend 5 where the bonding film 3 is to be adhered, for example, oxygen plasma or the like is applied to the first adherend 5. The method of performing this plasma processing, the method of performing an etching process, the method of irradiating an electron beam, the method of irradiating with ultraviolet light, the method of exposing to ozone, or the method of combining these, etc. By using such a method, it is possible to clean the surface of the first adherend 5 and to activate the surface by cutting some of the bonds near the surface. A hydroxyl group (OH group) is naturally bonded to the surface in such a state when surrounding moisture comes into contact therewith. In this way, a state in which hydroxyl groups are bonded can be formed.

Some constituent materials of the first adherend 5 have hydroxyl groups bonded to the surface without the above treatment. Examples of such constituent materials include various metal materials such as stainless steel and aluminum, silicon-based materials such as silicon and quartz glass, and oxide-based ceramic materials (inorganic materials) such as alumina. Note that the first adherend 5 may not be entirely made of the material as described above, and at least the vicinity of the surface may be made of the material as described above.
The surface of the first adherend 5 made of such a material is covered with an oxide film, and a hydroxyl group is bonded to the surface of the oxide film. Therefore, when the first adherend 5 made of such a material is used, the bonding film transfer sheet 1 and the first adherend 5 are firmly bonded without performing a process for exposing the hydroxyl group. can do.

  Moreover, the surface and the inside of the first adherend 5 may contain active bonds (dangling bonds) that are not terminated. Furthermore, a state where a hydroxyl group and dangling bonds are mixed may be used. When dangling bonds are included in the surface and inside of the first adherend 5, the dangling bonds exposed on the surface of the bonding film 3 are derived from covalent bonds constructed in a network shape. Strong bonding is made. As a result, the bonding film transfer sheet 1 and the first adherend 5 can be bonded more firmly.

Further, the first adherend 5 may have a bonding film similar to the bonding film 3 on the surface thereof. As a result, the bonding films are bonded to each other between the bonding film transfer sheet 1 and the first adherend 5, so that the bonding strength is increased as compared with bonding through the single-layer bonding film 3. be able to. In addition, strong bonding is possible regardless of the constituent material of the first adherend 5.
In addition, it is necessary to give energy to the bonding film provided in advance on the surface of the first adherend 5 prior to bonding.

  Further, the activated state of the surface of the bonding film 3 to which energy is applied and activated is gradually reduced over time. For this reason, it is preferable that the bonding film transfer sheet 1 is laminated on the first adherend 5 as soon as possible after application of energy. Specifically, it is preferable to laminate within 60 minutes after application of energy, and more preferably within 5 minutes. Within such a time, since the surface of the bonding film 3 maintains a sufficiently active state, a sufficient bonding strength can be obtained when bonded.

  In other words, the bonding film 3 before activation is chemically stable and excellent in weather resistance. For this reason, the bonding film 3 before activation is suitable for long-term storage. Therefore, if the bonding film transfer sheet 1 is manufactured or purchased in large quantities and stored, and energy is applied immediately before lamination with the first adherend 5, the first temporary bonded body 7 is obtained. This is effective from the viewpoint of manufacturing efficiency of the joined body 10.

In the conventional solid bonding such as silicon direct bonding or optical contact, even if the surface is activated, the active state is maintained for only a very short time of several seconds to several tens of seconds in the atmosphere. For this reason, after the surface was activated, there was a problem that it was not possible to ensure sufficient time for performing operations such as bonding the two members to be joined together.
On the other hand, according to the present invention, the active state can be maintained for a relatively long time of several minutes or more even after energy is applied by the action of the plasma polymerized film. For this reason, the time required for the work can be sufficiently secured, and the efficiency of the joining work can be improved.

  The pressing force applied to the first temporary joined body 7 is preferably about 0.2 MPa to 10 MPa, more preferably about 1 MPa to 5 MPa. Thereby, in the bonding film 3, the adhesiveness can be expressed as necessary and sufficiently. In addition, although this pressure may exceed the said upper limit, depending on each constituent material of the base material 2 or the 1st to-be-adhered body 5, damage etc. may arise.

The time for pressurization is not particularly limited, but is preferably about 10 seconds to 30 minutes. In addition, what is necessary is just to change suitably the time to pressurize according to the pressure at the time of pressurizing. Specifically, the higher the pressure at which the first temporary joined body 7 is pressed, the more sufficient adhesiveness can be expressed even if the pressing time is shortened.
The pressing of the first temporary joined body 7 may be performed in any atmosphere, but is preferably performed in an air atmosphere. Thereby, it is not necessary to spend time and cost to control the atmosphere, and the activation process can be performed more easily.

  [4] Next, as shown in FIG. 1 (d), the substrate 2 and the release layer 4 are peeled from the first temporary joined body 7 by the peeling mechanism 550. This peeling is performed by peeling the base material 2 and the peeling layer 4 from the first temporary joined body 7 so as to widen the interface between the peeling layer 4 and the bonding film 3 (second step). As a result, a second temporary bonded body 8 obtained by transferring a part of the bonding film 3 to the first adherend 5 is obtained (see FIG. 2E).

In this peeling, a portion (bonding film 33) of the bonding film 3 facing the convex portion 51 of the first adherend 5 is transferred to the first adherend 5, and the remaining portion of the bonding film 3 is The substrate 2 and the release layer 4 are peeled off without being transferred. For this reason, the second temporary bonded body 8 includes the first adherend 5 and the bonding film 33 partially provided on the upper surface of the convex portion 51. By using the bonding film transfer sheet 1 in this manner, the bonding film 3 can be efficiently and simply patterned simply by appropriately selecting the shape of the convex portion 51.
Note that the upper surface of the bonding film 33 transferred to the obtained second temporary bonded body 8 is a peeling surface peeled from the peeling layer 4.

[5] Next, the obtained second temporary bonded body 8 is placed on the base 611 of the bonding apparatus 600, and the upper surface of the bonding film 33 is subjected to plasma processing by the plasma processing mechanism 610.
The plasma treatment applied to the bonding film 33 is the same as the plasma treatment for the bonding film 3 described above.

[6] Next, a second adherend 6 to be joined to the second temporary joined body 8 is prepared. The shape of the second adherend 6 is not particularly limited, and may be either a flat plate shape or a block shape. Here, a flat plate shape will be described as an example.
The constituent material of the second adherend 6 is the same as the constituent material of the substrate 2.
Next, as shown in FIG. 2F, the second adherend supply mechanism 620 causes the second temporary bonded body 8 and the second temporary bonded body 8 to be in contact with each other so that the bonding film 33 and the second adherend 6 are in contact with each other. The adherend 6 is laminated. Thereby, the joined body 10 shown in FIG.

Next, the obtained bonded body 10 is pressed in the thickness direction (the direction in which the second temporary bonded body 8 and the second adherend 6 approach each other) (third step). Thereby, the convex portion 51 presses the bonding film 33, and a pressing force is applied to the bonding film 33. As a result, the bonding of the bonded body 10 is strengthened.
The pressing force when pressing the bonded body 10 is the same as the pressing force applied to the first temporary bonded body 7 described above.

  In this way, the bonding film 3 can freely control the region where the adhesiveness is developed by appropriately selecting the shape of the convex portion 51. By utilizing this, the bonding film 3 can be patterned, and the bonding film 33 with a finer pattern can be obtained as compared with the conventional patterning method. Specifically, when the line-shaped bonding film 33 adjacent to the gap is formed, the width of the gap can be as small as 1 μm or less.

  Moreover, such an effect cannot be obtained by a conventional joining method such as an adhesive or solid joining, and is extremely useful from the viewpoint of increasing the efficiency of the joining process. That is, since the bonding strength can be easily adjusted by selecting a region to which energy is applied, the local concentration of stress generated in the bonding portion is reduced by optimizing the shape and area of the bonding film 33. be able to. Thereby, the thermal expansion difference produced between the 1st to-be-adhered body 5 and the 2nd to-be-adhered body 6 can be relieve | moderated.

In addition, the bonding film transfer sheet 1 has a sheet-like form that is easy to handle and suitable for distribution and storage, and by simply applying physical or chemical energy, it can exhibit strong adhesiveness freely. obtain. For this reason, the bonding film transfer sheet 1 has excellent affinity for mass production processes of various products.
Specifically, since a bonding film formed by plasma polymerization has conventionally been required to be directly formed on the surface of a member used for bonding, a member is prepared at a place where a film forming apparatus is set. There was a need. This is because the film forming apparatus is large and heavy, and cannot be moved easily. However, when there is a geographical restriction that the film forming apparatus and the member are inseparable as described above, there is a problem that the flow line of the member is limited, and the degree of freedom of the manufacturing process of the product is lowered. .

  On the other hand, according to the present invention, the process of forming the bonding film and the process of bonding the members can be performed at different locations. For this reason, if a large amount of the bonding film transfer sheet 1 is manufactured, the bonding film transfer sheet 1 can be transported to a desired location and the members can be bonded at the desired location. As a result, the degree of freedom of the product manufacturing process is dramatically increased, and the mass production efficiency can be improved.

Further, since the bonding film 33 is excellent in bonding strength, chemical resistance, and dimensional accuracy, the obtained bonded body 10 is also excellent in bonding strength, chemical resistance, and dimensional accuracy.
In particular, the bonded body 10 is not bonded based on a physical bond such as an anchor effect like an adhesive used in a conventional bonding method, but is a strong chemical bond that occurs in a short time like a covalent bond. Based on the joining. For this reason, the joined body 10 is extremely difficult to be peeled off, and joining unevenness or the like hardly occurs.
In addition, according to the bonding method using the bonding film transfer apparatus 500 and the bonding apparatus 600, heat treatment at a high temperature (about 700 ° C. or more and about 800 ° C. or less) is not required unlike the conventional solid bonding. A base material composed of a low material can also be used for bonding. Thereby, the range of selection of the constituent material of a base material can be expanded.

  Further, according to the present invention, in the bonding between the first adherend 5 and the second adherend 6, the peeling surface of the bonding film 33 becomes the bonding interface. Since this peeling surface is in contact with the peeling layer 4 until immediately before peeling and is protected from adhesion or damage of foreign matter, it is in a state suitable for good bonding. Furthermore, even when energy is applied to the bonding film 3 in the first step, since the leaving group is difficult to be removed in the vicinity of the release surface, the state immediately after the film formation is easily maintained, and the adhesiveness is sufficiently latent. There is also an advantage of gaining. Therefore, by applying energy to the peeling surface, the peeling surface is firmly bonded to the second adherend 6. In this way, by using the bonding film transfer sheet 1 and the bonding film transfer apparatus and bonding apparatus of the present invention, the bonding film 3 that is formed by a vapor phase film forming method and whose expression of adhesiveness can be freely controlled is obtained. Since the double-sided tape can be handled like the first adherend 5 and the second adherend 6 can be easily and firmly joined to each other.

Further, the bonded interface in the obtained bonded body 10 is excellent in both airtightness and liquid tightness. This is because the bonding film 33 itself has a high density and low air permeability, and the bonding mechanism is based on the chemical bond as described above, so that the passage of small molecules is restricted. Therefore, when the joined body 10 is manufactured by setting the joining region so that a closed space is formed, the airtightness of the obtained closed space (for example, the closed space 34 in FIG. 2) is determined by the leak amount (leakage using helium gas). Rate) of 1 × 10 ⁻⁹ Pa · m ³ / sec or less. With such a leak amount, the hermeticity of the closed space can be maintained over a long period of time. Therefore, the present invention is effective when the closed space is maintained in a reduced pressure state or replaced with a predetermined gas. Used.
In addition, after obtaining the joined body 10, you may make it perform either one or both of the following two processes [7A] and [7B] with respect to this joined body 10 as needed.

[7A] The obtained bonded body 10 is pressurized in a direction in which the first adherend 5 and the second adherend 6 approach each other.
Thereby, the surface of the bonding film 33 is closer to the surfaces of the first adherend 5 and the second adherend 6, and the bonding strength in the bonded body 10 can be further increased.
At this time, the pressure at the time of pressurizing the bonded body 10 is preferably as high as possible. Thereby, the joint strength in the joined body 10 can be increased in proportion to the pressure.

In addition, what is necessary is just to adjust this pressure suitably according to conditions, such as a constituent material and thickness of the 1st to-be-adhered body 5 or the 2nd to-be-adhered body 6, and a joining apparatus. Specifically, it is preferably about 1 MPa or more and 10 MPa or less, and more preferably about 1 MPa or more and 5 MPa or less.
The time for pressurization is not particularly limited, but is preferably about 10 seconds to 30 minutes.

[7B] The obtained bonded body 10 is heated.
Thereby, the joint strength in the joined body 10 can be further increased.
At this time, the temperature at which the joined body 10 is heated is not particularly limited as long as it is higher than room temperature and lower than the heat resistance temperature of the joined body 10, but is preferably about 25 ° C. or more and 100 ° C. or less, and more preferably 50 It is set to about 100 ° C. or higher. By heating at a temperature in such a range, it is possible to reliably increase the bonding strength while reliably preventing the bonded body 10 from being altered or deteriorated by heat.

Moreover, although heating time is not specifically limited, It is preferable that it is about 1 minute or more and 30 minutes or less.
Moreover, when performing both said process [7A] and [7B], it is preferable to perform these simultaneously. That is, it is preferable to heat the bonded body 10 while applying pressure. Thereby, the effect by pressurization and the effect by heating are exhibited synergistically, and the joint strength of the joined body 10 can be particularly increased.

In the case where the thermal expansion coefficients of the two adherends are substantially equal, it is preferable to heat the joined body 10 as described above, but the thermal expansion coefficients of the two adherends are greatly different from each other. For this, it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.
Specifically, although it depends on the difference in thermal expansion coefficient, it is preferable to heat at about 25 ° C. or more and 50 ° C. or less, and more preferably about 25 ° C. or more and 40 ° C. or less. In such a temperature range, even if the difference in thermal expansion coefficient is large to some extent (for example, 5 × 10 ⁻⁵ / K or more), the thermal stress generated at the bonding interface can be sufficiently reduced. As a result, it is possible to reliably prevent warpage, peeling, and the like in the joined body 10.
By performing the steps [7A] and [7B] as described above, the bonding strength of the bonded body 10 can be further improved.

  Here, in the above-described bonding method, the case where the base material 2 has a flat surface is described. However, in FIGS. 9 and 10, the bonding film having the base material 2 ′ having the convex portion 21 on the surface. A method for obtaining the joined body 10 using the transfer sheet 1 ′ and using a flat plate as the first adherend 5 ′ will be described. The joining method described below is the same as the joining method based on FIGS. 1 and 2 except that the configurations of the base material 2 ′ and the first adherend 5 ′ are different.

[1] First, a bonding film transfer sheet 1 ′ as shown in FIG. 9A is prepared. This bonding film transfer sheet 1 ′ has a base material 2 ′ having a convex portion 21 on the upper surface, and a release layer 4 and a bonding film 3 formed on the upper surface of the base material 2 ′ so as to cover the convex portion 21. Is.
In addition, the area | region corresponding to the convex part 21 among the peeling layer 4 and the bonding film 3 protrudes upward reflecting the shape of the convex part 21. FIG.
Next, the plasma processing mechanism 520 performs plasma processing on the bonding film transfer sheet 1 ′. As a result, adhesiveness develops on the upper surface 31 of the bonding film 3.

  [2] Next, the first adherend 5 is prepared by the first adherend supply mechanism 530, and as shown in FIG. 9B, the bonding film 3 and the first adherend 5 ′ Are laminated such that the bonding film transfer sheet 1 ′ and the first adherend 5 ′ are in contact with each other. As a result, in the region 32, a first temporary joined body 7 obtained by partially joining the bonding film transfer sheet 1 'and the first adherend 5' is obtained (see FIG. 9C).

[3] Next, a pressing force is applied to the first temporary joined body 7 by the pressing mechanism 540. Thereby, joining of the 1st temporary joined body 7 is strengthened more.
[4] Next, as shown in FIG. 9 (d), the substrate 2 ′ and the release layer 4 are peeled upward from the first temporary joined body 7 by the release mechanism 550. Thereby, a second temporary joined body 8 obtained by transferring a part of the joining film 3 to the first adherend 5 ′ is obtained (see FIG. 10E).
In this peeling, a portion (bonding film 33) corresponding to the convex portion 21 of the base material 2 ′ is transferred to the first adherend 5 ′ and the remaining portion of the bonding film 3 is transferred. It remains on the substrate 2 ′ side without any problems.

[5] Next, the plasma processing mechanism 610 performs plasma processing on the bonding film 33 of the obtained second temporary bonded body 8.
[6] Next, the second adherend 6 is prepared by the second adherend supply mechanism 620, and the bonding film 33 and the second adherend 6 come into contact with each other as shown in FIG. Thus, the 2nd temporary joined body 8 and the 2nd to-be-adhered body 6 are laminated | stacked. Thereby, the joined body 10 shown in FIG.
[7] Next, a pressing force is applied to the joined body 10 by the pressing mechanism 630. Thereby, joining of joined body 10 is strengthened more.

The joining method as described above is used to join various members.
Specifically, semiconductor elements such as transistors, diodes and memories, piezoelectric elements such as crystal oscillators, reflectors, optical lenses, diffraction gratings, optical elements such as optical filters, and photoelectric conversion elements such as solar cells , Semiconductor substrates and semiconductor elements mounted on them, insulating substrates and wiring or electrodes, inkjet recording heads, microreactors, microelectromechanical systems (MEMS) components such as micromirrors, sensors such as pressure sensors and acceleration sensors Parts, semiconductor element and electronic component package parts, magnetic recording medium, magneto-optical recording medium, recording medium such as optical recording medium, liquid crystal display element, organic EL element, electrophoretic display element parts, fuel When bonding battery parts or the like, the bonding film transfer device and the bonding device of the present invention are applicable.

As described above, the bonding film transfer apparatus and the bonding apparatus of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to these, and for example, each part constituting the bonding apparatus exhibits the same function. It can be replaced with any possible configuration. Moreover, arbitrary components may be added.
Moreover, as a bonding film transfer sheet used for the bonding apparatus, in addition to the form of a sheet roll wound up in a roll shape, for example, a sheet folded in a bellows shape may be used.

DESCRIPTION OF SYMBOLS 1, 1 '... Bonding film transfer sheet 10 ... Bonded body 2, 2' ... Base material 21 ... Convex part 3, 33 ... Bonding film 301 ... Si skeleton 302 ... Siloxane bond 303 ... Desorption Base 304 …… Active hand 31 …… Top surface 32 …… Region 34 …… Closed space 35 …… Surface 4 …… Peeling layer 5, 5 ′ …… First adherend 51 …… Protrusions 6 …… Second 7 ... First temporary joined body 8 ... Second temporary joined body 100 ... Plasma polymerization apparatus 101 ... Chamber 102 ... Ground wire 103 ... Supply port 104 ... Exhaust port 130 ... First electrode 139 ... Electrostatic chuck 140 ... Second electrode 170 ... Pump 171 ... Pressure control mechanism 180 ... Power supply circuit 182 ... High frequency power supply 183 ... Matching box 184 ... Wiring 190 ... Gas Supply unit 191 ... Liquid storage unit 192... Vaporizer 193... Gas cylinder 194... Pipe 195 .. Diffuser 500. 513 …… Guide roll 520 …… Plasma processing mechanism 521 …… Plasma source 530 …… First adherend supply mechanism 531 …… Storage unit 532 …… Vertical transporting means 533 …… Post 540 …… Pressing mechanism 541 542 …… Pressing roller 550 …… Peeling mechanism 551 …… Suction means 552 …… Manipulator 560 …… Control unit 600 …… Joint device 610 …… Plasma processing mechanism 611 …… Base 612 …… Plasma source 620 …… Second Adherend supply mechanism 621 …… Base 622 …… Storage unit 623 …… Vertical carrying Feeding means 624 …… Stand 630 …… Pressing mechanism 631 …… Base 632 …… Load generator P …… Plasma

Claims (15)

An Si skeleton provided on one surface of a flexible base material and having an atomic structure including a siloxane (Si-O) bond, and a leaving group bonded to the Si skeleton and made of an organic group Using a bonding film transfer sheet having a bonding film,
A bonding film transfer apparatus for transferring the bonding film to an adherend,
An activating means for activating the bonding film of the bonding film transfer sheet by applying plasma treatment or energy irradiation treatment;
An adherend supply means for supplying an adherend so as to be in contact with the activated bonding film, and obtaining a first temporary bonded body formed by bonding the bonding film transfer sheet and the adherend;
Pressing means for pressing the first temporary joined body;
Peeling means for peeling the base material from the pressed first temporary joined body to transfer at least a part of the bonding film to the adherend side to obtain a second temporary joined body. ,
The activating means, the adherend supplying means, the pressing means, and the peeling means are arranged in this order, and the bonding film transfer sheet can be moved so as to pass through the respective means. A bonding film transfer apparatus.   A transport unit that transports the bonding film transfer sheet to the activation unit, the adherend supply unit, the pressing unit, and the peeling unit in order, by transporting the bonding film transfer sheet. 2. The bonding film transfer apparatus according to 1.   The bonding film transfer apparatus according to claim 2, wherein the bonding film transfer sheet has a strip shape and is supplied as a roll body wound up in a roll shape.   4. The bonding film transfer according to claim 3, wherein the conveying means is a drawing means for pulling out an outer end portion of the bonding film transfer sheet in the roll body, or a winding means for winding and collecting the end portion. apparatus. The conveying means has the winding means,
The bonding film transfer apparatus according to claim 4, wherein the activation unit, the adherend supply unit, the pressing unit, and the peeling unit are all disposed between the roll body and the winding unit. .   6. The bonding film transfer apparatus according to claim 2, further comprising a control unit configured to control the operation of the transport unit to stop during the operation of supplying the adherend by the adherend supply unit.   7. The bonding film transfer apparatus according to claim 1, wherein the activating means for performing the plasma processing is an atmospheric pressure plasma processing apparatus. The bonding film transfer sheet has a strip shape,
The bonding film transfer apparatus according to claim 1, wherein the activating unit is configured to be able to activate the entire width direction of the belt-shaped bonding film transfer sheet.   The said pressing device has two rollers, It is comprised so that a said 1st temporary joining body can be pressed by allowing the said 1st temporary joining body to pass through between these rollers. 9. The bonding film transfer apparatus according to any one of 8 to 8.   The bonding film transfer device according to claim 9, wherein at least one of the two rollers includes a resilient member on a surface thereof.   The bonding film transfer device according to claim 1, wherein the pressing force by the pressing device is 0.2 MPa or more and 10 MPa or less. The adherend has a convex portion on the surface thereof,
The bonding film transfer device according to claim 1, wherein the adherend supply unit is configured to supply the adherend so that the convex portion and the bonding film are in contact with each other.   The bonding film transfer apparatus according to claim 1, wherein the bonding film is formed by plasma polymerization. A second activating means for activating the second temporary bonded body obtained by the bonding film transfer apparatus according to claim 1 by plasma treatment or energy irradiation treatment;
A second adherend is supplied so as to be in contact with the activated bonding film, and a second bonded body obtained by bonding the second temporary bonded body and the second adherend is obtained. An adherend supply means;
And a second pressing means for pressing the joined body.   The second activating means, the second adherend supply means, and the second pressing means are arranged in this order, and the second activating means is provided on the bonding film transfer device. The joining apparatus of Claim 14 arrange | positioned at the termination | terminus side.

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