JP2005079325A - ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器 - Google Patents

ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器 Download PDF

Info

Publication number
JP2005079325A
JP2005079325A JP2003307423A JP2003307423A JP2005079325A JP 2005079325 A JP2005079325 A JP 2005079325A JP 2003307423 A JP2003307423 A JP 2003307423A JP 2003307423 A JP2003307423 A JP 2003307423A JP 2005079325 A JP2005079325 A JP 2005079325A
Authority
JP
Japan
Prior art keywords
heat
heat radiating
heat receiving
receiving end
outer tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003307423A
Other languages
English (en)
Japanese (ja)
Inventor
Isao Okutsu
功 奥津
Satoshi Ooka
聡 大岡
Hiroki Haba
寛樹 幅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2003307423A priority Critical patent/JP2005079325A/ja
Priority to TW093111133A priority patent/TW200508845A/zh
Priority to US10/847,246 priority patent/US20050045310A1/en
Priority to CNA2004100475026A priority patent/CN1592567A/zh
Publication of JP2005079325A publication Critical patent/JP2005079325A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003307423A 2003-08-29 2003-08-29 ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器 Pending JP2005079325A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003307423A JP2005079325A (ja) 2003-08-29 2003-08-29 ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器
TW093111133A TW200508845A (en) 2003-08-29 2004-04-21 Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
US10/847,246 US20050045310A1 (en) 2003-08-29 2004-05-17 Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
CNA2004100475026A CN1592567A (zh) 2003-08-29 2004-05-21 具有密封容器的热管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003307423A JP2005079325A (ja) 2003-08-29 2003-08-29 ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器

Publications (1)

Publication Number Publication Date
JP2005079325A true JP2005079325A (ja) 2005-03-24

Family

ID=34214132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003307423A Pending JP2005079325A (ja) 2003-08-29 2003-08-29 ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器

Country Status (4)

Country Link
US (1) US20050045310A1 (zh)
JP (1) JP2005079325A (zh)
CN (1) CN1592567A (zh)
TW (1) TW200508845A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007094648A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 電子機器
WO2014136266A1 (ja) * 2013-03-08 2014-09-12 株式会社 東芝 電子機器

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437005C (zh) * 2005-07-08 2008-11-26 富准精密工业(深圳)有限公司 扁平式热管
US20070121291A1 (en) * 2005-11-30 2007-05-31 Inventec Corporation Heat sink module of a notebook computer
JP2007286785A (ja) * 2006-04-14 2007-11-01 Fujitsu Ltd 電子機器および冷却部品
TWI315461B (en) * 2006-11-13 2009-10-01 Asustek Comp Inc Portable electronic device
TWI413887B (zh) 2008-01-07 2013-11-01 Compal Electronics Inc 熱管結構
CN101493294B (zh) * 2008-01-21 2010-10-13 仁宝电脑工业股份有限公司 热管结构
TWM375205U (en) * 2009-09-24 2010-03-01 Celsia Technologies Taiwan Inc Flat hot pipe
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
CN103906412A (zh) * 2012-12-29 2014-07-02 鸿富锦精密工业（深圳）有限公司 散热装置
EP3182045B1 (en) * 2015-12-14 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded heat pipe and method of manufacturing
US10485135B2 (en) * 2017-06-30 2019-11-19 Dell Products, L.P. Storage device cooling utilizing a removable heat pipe
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
CN213841858U (zh) * 2020-11-05 2021-07-30 亚浩电子五金塑胶（惠州）有限公司 热管及具有其的散热结构
JP7097477B1 (ja) * 2021-05-12 2022-07-07 レノボ・シンガポール・プライベート・リミテッド 電子機器、冷却装置、及び冷却装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273100A (en) * 1979-02-16 1981-06-16 W. R. Grace & Co. Passive solar heating and cooling panels
DE3008068A1 (de) * 1979-03-03 1980-09-11 Canon Kk Faksimilegeraet
US5451989A (en) * 1989-07-28 1995-09-19 Canon Kabushiki Kaisha Ink jet recording apparatus with a heat pipe for temperature stabilization
WO1992004722A1 (en) * 1990-09-03 1992-03-19 The Furukawa Electric Co., Ltd. Material for electrical wiring and transformer
US6113212A (en) * 1998-04-16 2000-09-05 Eastman Kodak Company Method and apparatus for thermal control of LED printheads
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
US6366460B1 (en) * 1998-07-27 2002-04-02 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007094648A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 電子機器
WO2014136266A1 (ja) * 2013-03-08 2014-09-12 株式会社 東芝 電子機器
JP2014174979A (ja) * 2013-03-08 2014-09-22 Toshiba Corp 電子機器

Also Published As

Publication number Publication date
US20050045310A1 (en) 2005-03-03
CN1592567A (zh) 2005-03-09
TW200508845A (en) 2005-03-01

Similar Documents

Publication Publication Date Title
JP2005079325A (ja) ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器
JP4719079B2 (ja) 電子機器
JP4837126B2 (ja) 電子機器
JP3634825B2 (ja) 電子機器
KR100487213B1 (ko) 집열부 및 냉각팬을 구비한 냉각 장치와, 이 냉각 장치를포함한 전자 기기
US7742295B2 (en) Cooling device and electronic device
JP5148079B2 (ja) 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
US6894900B2 (en) Heat sink with heat pipe and base fins
US7667961B2 (en) Electronic apparatus
US20090129020A1 (en) Electronic apparatus
JP5283836B2 (ja) 液冷ユニット用受熱器および液冷ユニット並びに電子機器
US7679907B2 (en) Electronic apparatus and fin unit
JP2009104241A (ja) 電子機器
JP2018049536A (ja) 電子機器
JP2009169752A (ja) 電子機器
US20080253082A1 (en) Cooling system with flexible heat transport element
JP7273116B2 (ja) 電子機器及び冷却モジュール
EP3518072B1 (en) Heat transferring module
JP2008277355A (ja) 冷却装置および電子機器
JP2009266123A (ja) 電子機器
JP2009193463A (ja) 電子機器
US20110141695A1 (en) Electronic device
JP2006163563A (ja) 冷却装置及びそれを備えた電子機器
JP2000022369A (ja) 電子機器用放熱装置
TWI301745B (en) Heat dissipation device with heat pipe