TW200508845A - Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit - Google Patents

Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit

Info

Publication number
TW200508845A
TW200508845A TW093111133A TW93111133A TW200508845A TW 200508845 A TW200508845 A TW 200508845A TW 093111133 A TW093111133 A TW 093111133A TW 93111133 A TW93111133 A TW 93111133A TW 200508845 A TW200508845 A TW 200508845A
Authority
TW
Taiwan
Prior art keywords
heat pipe
cooling unit
end portion
electronic apparatus
heat
Prior art date
Application number
TW093111133A
Other languages
English (en)
Inventor
Isao Okutsu
Satoshi Ooka
Hiroki Haba
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200508845A publication Critical patent/TW200508845A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093111133A 2003-08-29 2004-04-21 Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit TW200508845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003307423A JP2005079325A (ja) 2003-08-29 2003-08-29 ヒートパイプ、ヒートパイプを有する冷却装置および冷却装置を搭載した電子機器

Publications (1)

Publication Number Publication Date
TW200508845A true TW200508845A (en) 2005-03-01

Family

ID=34214132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111133A TW200508845A (en) 2003-08-29 2004-04-21 Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit

Country Status (4)

Country Link
US (1) US20050045310A1 (zh)
JP (1) JP2005079325A (zh)
CN (1) CN1592567A (zh)
TW (1) TW200508845A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437005C (zh) * 2005-07-08 2008-11-26 富准精密工业(深圳)有限公司 扁平式热管
JP2007094648A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 電子機器
US20070121291A1 (en) * 2005-11-30 2007-05-31 Inventec Corporation Heat sink module of a notebook computer
JP2007286785A (ja) * 2006-04-14 2007-11-01 Fujitsu Ltd 電子機器および冷却部品
TWI315461B (en) * 2006-11-13 2009-10-01 Asustek Comp Inc Portable electronic device
TWI413887B (zh) 2008-01-07 2013-11-01 Compal Electronics Inc 熱管結構
CN101493294B (zh) * 2008-01-21 2010-10-13 仁宝电脑工业股份有限公司 热管结构
TWM375205U (en) * 2009-09-24 2010-03-01 Celsia Technologies Taiwan Inc Flat hot pipe
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
CN103906412A (zh) * 2012-12-29 2014-07-02 鸿富锦精密工业（深圳）有限公司 散热装置
JP5592019B1 (ja) * 2013-03-08 2014-09-17 株式会社東芝 電子機器
EP3182045B1 (en) * 2015-12-14 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded heat pipe and method of manufacturing
US10485135B2 (en) * 2017-06-30 2019-11-19 Dell Products, L.P. Storage device cooling utilizing a removable heat pipe
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
CN213841858U (zh) * 2020-11-05 2021-07-30 亚浩电子五金塑胶（惠州）有限公司 热管及具有其的散热结构
JP7097477B1 (ja) * 2021-05-12 2022-07-07 レノボ・シンガポール・プライベート・リミテッド 電子機器、冷却装置、及び冷却装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273100A (en) * 1979-02-16 1981-06-16 W. R. Grace & Co. Passive solar heating and cooling panels
DE3008068A1 (de) * 1979-03-03 1980-09-11 Canon Kk Faksimilegeraet
US5451989A (en) * 1989-07-28 1995-09-19 Canon Kabushiki Kaisha Ink jet recording apparatus with a heat pipe for temperature stabilization
WO1992004722A1 (en) * 1990-09-03 1992-03-19 The Furukawa Electric Co., Ltd. Material for electrical wiring and transformer
US6113212A (en) * 1998-04-16 2000-09-05 Eastman Kodak Company Method and apparatus for thermal control of LED printheads
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
US6366460B1 (en) * 1998-07-27 2002-04-02 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器

Also Published As

Publication number Publication date
US20050045310A1 (en) 2005-03-03
CN1592567A (zh) 2005-03-09
JP2005079325A (ja) 2005-03-24

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