JP2005072622A - Method of manufacturing mounting substrate and method of mounting electronic circuit element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve problems that, in a mounting substrate, a support substrate which originally is not necessary is required and excessive material is needed, and moreover, the thickness of the support substrate causes an electronic circuit device to be large size, in cases where a printed circuit board, a ceramic substrate, or a flexible sheet etc. are adopted, and especially, to realize a low-profile electronic circuit device, the flexible sheet made of a thin resin is adopted, when the electronic circuit component is mounted in the substrate. <P>SOLUTION: After forming an isolation groove 72 in a conductive foil 70, the conductive foil 70 is used as a support substrate and an insulating resin 50 is deposited on the conductive foil 70. After reversing the insulating resin 50, in turn, the insulating resin 50 is used as a support substrate and the conductive foil is ground and is isolated as a conductive path. Accordingly, the circuit is constituted by a necessary and minimum material and also can be manufactured. Furthermore, by embedding the conductive path 51 in the insulating resin 50 and incurvating a side face of the conductive path 51 or providing eaves, the substrate in which falling-off of the conductive path 51 is prevented can be realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mounting board manufacturing method and an electronic circuit element mounting method, and more particularly to a mounting board manufacturing method and an electronic circuit element mounting method having a substantially flat surface in which a conductive path is embedded in an insulating resin. is there.

  2. Description of the Related Art Conventionally, an electronic circuit device set in an electronic device is configured by mounting an electronic circuit element on a printed board or a ceramic board on which a conductive path is formed. For example, from manufacturing a printed board to mounting an electronic circuit element. Was formed through a process as shown in FIG. 14 (see Patent Document 1 below).

  First, as shown in FIG. 14A, a support substrate 102 serving as a support member for the conductive path 101 is prepared. The support substrate 102 is a resin substrate in which an epoxy resin is filled in glass fiber, and has a thickness of about 1 mm.

  Subsequently, as shown in FIG. 14B, the copper foil 104 coated with the adhesive resin 103 is bonded to the support substrate 102 by pressure bonding or thermocompression bonding. The thickness of the copper foil 104 is generally 18 μm and 35 μm.

  Subsequently, as shown in FIG. 14C, the copper foil 104 is patterned to form a conductive path 101, whereby a conductive path 101 having a thickness of 18 μm or 35 μm is pasted on the support substrate 102 as thick as 1 mm. The combined printed circuit board 105 is completed.

  Finally, as shown in FIG. 14D, the electronic circuit element 105 is mounted. Here, reference numeral 105A denotes a package sealed with a normal transfer mold, in which the periphery of the semiconductor chip is covered with a resin layer, and lead terminals for external connection are derived from the sides of the resin layer. Reference numeral 105B denotes a face-down type semiconductor device such as a BGA or CSP, and a solder ball is formed on the chip surface for external connection. Furthermore, 105C is a passive element such as a chip capacitor or a chip resistor.

By the above manufacturing method, an electronic circuit device in which a predetermined circuit is realized by electrically connecting electronic circuit elements through a conductive path is completed.
Japanese Patent Laid-Open No. 5-121868

  Since an electronic circuit device configured by mounting these electronic circuit elements 105 on a printed circuit board 105 is mounted on a small and light electronic device such as a mobile phone, it is desired to be light and thin.

  However, the support substrate 102 made of a printed circuit board, a metal substrate, a ceramic substrate, or the like has a thickness as thick as 1 mm, and it has come to a limit to reduce the thickness. In addition, the electronic circuit device configured by mounting the electronic circuit element on the substrate is thick as a whole due to the thickness of the support substrate, so that the size cannot be increased or the weight thereof cannot be reduced. There is a problem that the size cannot be reduced and the weight cannot be reduced.

  When an electronic circuit element is assembled as a circuit, the minimum necessary component is a connection means such as the electronic circuit element 105 and the conductive path 101, and the support substrate 102 is unnecessary. However, in the manufacturing method as shown in FIG. 14, the support substrate 102 is necessary for processing the copper foil 104, and it was impossible to omit it. The same can be said even when a conductive path is formed on a ceramic substrate or a flexible sheet.

  Further, since the conductive path is simply attached to the support substrate 102, there is a problem that the conductive path is peeled off or warped. In particular, the peeling is remarkable in the pad having a very small bonding area, and the warping and peeling of the wiring is remarkable in the thin and long wiring.

  Furthermore, as shown in FIG. 14D, the electrodes of the electronic circuit element 105 may not be placed on the conductive path with high accuracy but may be placed out of the conductive path. In this case, since the conductive path 101 is as thick as 18 μm and 35 μm, there is a problem that the mounted electronic circuit element 105 cannot be shifted horizontally. For example, referring to the electronic circuit element 105A shown in FIG. 14D, there is a problem that the lead is brought into contact with the side wall of the conductive path 101 and is difficult to shift when it is horizontally shifted. In this case, the operator had to pick up the electronic circuit element 105A and rearrange it.

  The present invention has been made in view of the above-mentioned problems. First, it has a conductive path embedded in an insulating resin, and is solved by substantially matching the surface of the insulating resin and the surface of the conductive path. To do.

  Since the same surface is formed by the conductive path and the insulating resin, the mounted electronic circuit element can be shifted without hitting the side surface of the conductive path. In particular, electronic circuit elements mounted with a positional shift can be shifted and rearranged in the horizontal direction. In addition, if the brazing material is melted after the electronic circuit element is mounted, the electronic circuit element that has been mounted with a deviation tries to return itself to the upper part of the conductive path due to the surface tension of the melted brazing material, and the electronic circuit element itself recycles. Arrangement is made.

  Secondly, the problem is solved by having a conductive path embedded in an insulating resin, making the surface of the insulating resin substantially coincide with the surface of the conductive path, and curving the side surface of the conductive path.

  In particular, since the side surface of the conductive path is curved, an anchor effect is generated, and the disconnection of the conductive path can be suppressed. In particular, a thin and long wiring is warped by the curved structure, and peeling can be prevented.

  Third, the conductive path embedded in the insulating resin, the insulating resin surface and the conductive path surface are substantially matched, and the back surface of the conductive path is a first material constituting the conductive path This is solved by forming a different second material.

  In general, due to the difference in thermal expansion coefficient between the insulating resin and the first material, the mounting substrate itself is warped, and the conductive path is curved or peeled off. In addition, since the thermal conductivity of the first material is superior to that of the insulating resin, the first material first rises in temperature and expands. Therefore, by covering the second material having a smaller thermal expansion coefficient than that of the first material, it is possible to prevent warping and peeling of the conductive path and warping of the mounting substrate. In particular, when Cu is employed as the first material, Ag or Ni is preferable as the second material.

  Fourth, the first conductive material has a conductive path embedded in an insulating resin, the surface of the insulating resin and the surface of the conductive path are substantially matched, and the back surface of the conductive path is a first material constituting the conductive path. This is solved by forming the eaves with the second material.

  By forming a film made of the second material on the surface of the conductive path, an eaves fixed to the conductive path can be formed. Therefore, the anchor effect can be generated in the same manner as the second solving means, and the warpage and disconnection of the conductive path can be prevented.

  Fifth, the first material is constituted by Cu as a main material, and the second material is solved by constituting Ni or Ag as a main material. Cu and Ni can be etched with an etchant such as ferric chloride or cupric chloride. Since Ni has an etching rate lower than that of Cu, an eaves made of Ni can be formed. Moreover, since Ag and Cu can be selectively etched, eaves can be formed.

  Sixth, the insulating resin is solved by being made of a single resin.

  In the conventional structure as shown in FIG. 12, in order to prevent peeling of the conductive path 101, another resin that covers the conductive path is required. However, in this case, since the conductive path is embedded in the insulating resin or an anchor effect is given to the side surface of the conductive path, the conductive path can be constituted by a single insulating resin and the conductive path.

  Seventh, the surface of the conductive path is solved by being formed lower than the surface of the insulating resin.

  When the conductive path is formed so as to be positioned below, a recessed portion of an insulating resin is formed around the conductive path. Therefore, when the lead is disposed on the conductive path, the side wall of the recessed portion made of an insulating resin serves as a stopper, and the electronic circuit element can be prevented from shifting. Even if the lead is disposed out of the conductive path, the lead is positioned on the insulating resin, so that it can be horizontally displaced.

  Eighth, the problem is solved by using the conductive path as an electrode, a bonding pad, a die pad region, or a wiring.

  Ninth, a conductive foil is prepared, and at least the conductive foil excluding the region that becomes the conductive path is removed thinner than the thickness of the conductive foil to form a separation groove, and the conductive foil surface and the separation groove are formed. The problem is solved by forming a conductive path separated by the separation groove by attaching an insulating resin and chemically or physically removing the back surface of the conductive foil.

  According to this method, the constituent material can be manufactured with the minimum necessary amount of the conductive foil and the insulating resin, and the insulating resin can be applied using the conductive foil as the material of the conductive path as the supporting substrate. When separating as a conductive path, the insulating resin can be used as a support substrate for separation processing. Therefore, as described in the conventional example, a printed circuit board which is not originally required for configuring a circuit is not required, and the cost can be reduced. Further, since a printed circuit board is unnecessary and the conductive path is embedded in an insulating resin, there is an advantage that a very thin substrate can be formed by adjusting the thickness of the insulating resin and the conductive foil.

  Further, since the process of removing the conductive foil thinner than the thickness of the conductive foil (for example, half etching) can be handled without separating the conductive paths individually, the workability of the subsequent insulating resin coating process is improved.

  Tenth, the problem is solved by grinding, polishing or etching the back surface of the conductive foil so that the surface of the insulating resin and the surface of the conductive path are substantially matched.

  By scraping or etching the back surface of the conductive foil until the insulating resin is exposed, the surface of the conductive path and the surface of the insulating resin can be made to coincide with each other. Placement is easy.

  Eleventh, in the conductive foil, when the conductive second material is formed on the conductive first material, and the separation groove is formed, an eave is formed by the second material. To solve this problem.

  When separated as a conductive path, an eaves is formed on the back surface of the conductive path as shown in FIG. 3, so that an anchor effect due to the eaves can be generated.

  Twelfth, the first material is composed of Cu as a main material, and the second material is composed of Ni as a main material. When a conductive path is formed with an etchant of ferric chloride or cupric chloride, since the etching rate of Ni is small, an eaves of Ni can be formed.

  Thirteenth, a conductive foil is prepared, a corrosion-resistant conductive film is formed in a region to be a conductive path, and the conductive film is used as a mask to remove it thinner than the thickness of the conductive foil to form a separation groove. The problem is solved by forming an electrically conductive path separated by the separation groove by attaching an insulating resin to the foil surface and the separation groove and chemically or physically removing the back surface of the conductive foil.

  14th is to solve the problem by using any one of Ag, Au, Pt or Pd as the corrosion-resistant conductive film.

  For example, if Ag that is corrosion resistant to the etching solution is deposited on a portion that becomes a conductive path, the coating film of Ag becomes an etching protective film, and a separation groove can be formed without adopting a resist. The same applies to other conductive films. Moreover, these corrosion-resistant conductive films can be used as they are as die pads and bonding pads.

  For example, Ag adheres to Au, and a brazing material can also be applied. If Au is coated on the back surface of the chip, it can be directly thermocompression bonded to the Ag coating. Au can also be bonded to the brazing material and can be bonded to the Au fine wire. Therefore, these films can be used as they are as die pads and bonding pads.

  Fifteenth, the problem is solved by forming the insulating resin from a single resin.

  Sixteenth, the problem is solved by forming the surface of the conductive path to be lower than the surface of the insulating resin.

Seventeenth, a mounting board having a conductive path embedded in an insulating resin and substantially matching the surface of the insulating resin and the surface of the conductive path is prepared.
The problem is solved by mounting an electronic circuit element on the conductive path and rearranging the position of the electronic circuit element.

  Since the surface of the conductive path and the surface of the insulating resin substantially coincide, even if the electronic circuit element is misplaced, it can be easily shifted.

Eighteenth, a mounting board having a conductive path embedded in an insulating resin and substantially matching the surface of the insulating resin and the surface of the conductive path is prepared.
The problem is solved by mounting the conductive path and the electronic circuit element via a brazing material and shifting the position of the electronic circuit element by the surface tension of the molten brazing material.

  Even if the electronic circuit elements are displaced from each other, as long as the brazing material is melted, the electronic circuit elements are naturally rearranged on the conductive path, so that the rearrangement by the mounting apparatus and the operator can be reduced.

  As will be apparent from the above description, the mounting board is composed of a conductive path and an insulative resin, which are the minimum necessary, and has no waste. Conventionally, when manufacturing a conductive path, a support substrate is required, but when an insulating resin is attached, a conductive foil serving as a conductive path is employed as the support substrate, and when separating the conductive path, An insulating resin that embeds the conductive path is used as the support substrate. Therefore, it is possible to realize a mounting substrate that has no extra components and can significantly reduce costs. Further, by adjusting the coating thickness of the insulating resin and the thickness of the conductive foil, a very thin mounting substrate can be realized.

  Moreover, since the same surface is formed of the conductive path and the insulating resin, the mounted electronic circuit element can be shifted without hitting the side surface of the conductive path.

  Further, since the second material is formed on the back side of the conductive path, it is possible to suppress warpage of the mounting substrate, warpage of the conductive path, in particular, elongated wiring, and peeling due to a difference in thermal expansion coefficient.

  Furthermore, since the side surface of the conductive path is curved, an anchor effect is generated, and the disconnection of the conductive path can be suppressed. In particular, a thin and long wiring is warped by the curved structure, and peeling can be prevented.

  Moreover, the eaves fixed to the conductive path can be formed by forming a film made of the second material on the surface of the conductive path. Therefore, an anchor effect can be generated, and the warpage and disconnection of the conductive path can be prevented.

  Further, Cu and Ni can be etched with an etchant such as ferric chloride or cupric chloride. Since Ni has an etching rate lower than that of Cu, an eaves made of Ni can be formed.

  Further, the insulating resin can be applied using the conductive foil as the material of the conductive path as a supporting substrate, and when separating the conductive foil as the conductive path, the insulating resin can be separated into the supporting substrate by turning it over. Accordingly, the conductive foil and the insulating resin can be manufactured with the necessary minimum. As described in the conventional example, a printed circuit board that is not originally required for configuring a circuit is not required, and the cost can be reduced. In addition, because the printed circuit board is unnecessary, the conductive path is embedded in the insulating resin, and the thickness of the insulating resin and conductive foil can be adjusted, so that a very thin mounting board can be formed. There is also.

  Further, the process of removing the conductive foil thinner than the thickness of the conductive foil (for example, half-etching) can be handled without separating the conductive paths individually, so that the workability is improved in the subsequent insulating resin coating process.

  Moreover, since the same surface is formed of the conductive path and the insulating resin, the mounted electronic circuit element can be shifted without hitting the side surface of the conductive path. In particular, electronic circuit elements mounted with a positional shift can be shifted and rearranged in the horizontal direction. In addition, if the brazing material is melted after the electronic circuit element is mounted, the electronic circuit element that has been mounted with a deviation tries to return itself to the upper part of the conductive path due to the surface tension of the melted brazing material, and the electronic circuit element itself recycles. Placement is possible.

  Further, when the surface of the conductive path is formed so as to be positioned below the insulating resin, a recessed portion of the insulating resin is formed around the conductive path. Therefore, when the lead is disposed on the conductive path, the side wall of the recessed portion made of an insulating resin serves as a stopper, and the electronic circuit element can be prevented from shifting. Even if the lead is disposed out of the conductive path, the lead is positioned on the insulating resin, so that it can be shifted horizontally.

<First embodiment for explaining mounting substrate>
First, the structure of the mounting substrate of the present invention will be described with reference to FIG. In the drawing, wavy lines are provided, which are divided into a left side and a right side, and embodiments having different structures are shown.

  On the left side of FIG. 1, there is shown a mounting substrate 52 that has a conductive path 51 embedded in an insulating resin 50, and the surface of the insulating resin 50 and the surface of the conductive path 51 coincide with each other.

  This structure is composed of two materials, a plurality of conductive paths 51 and an insulating resin that embeds the conductive paths 51, and a spacing portion 72 </ b> A made of the insulating resin 50 is provided between the conductive paths 51. The surface of the separation portion 72A and the surface of the conductive path 51 are substantially coincident with each other.

  As the insulating resin, a thermosetting resin such as an epoxy resin or a polyimide resin, or a thermoplastic resin such as polyphenylene sulfide can be used. As the conductive path 51, a conductive foil mainly made of Cu, a conductive foil mainly made of Al, or a conductive foil made of an alloy such as Fe-Ni can be used.

  The feature of this structure is that the surface of the insulating resin 50 and the surface of the conductive path 51 are substantially coincident and there is no step, so that the mounted electronic circuit element 53 can be moved horizontally as it is. Have. This feature will be described later with reference to FIG.

<Second Embodiment Explaining Mounting Board>
Next, the mounting substrate 52 shown on the right side of FIG. 1 will be described.

  The mounting substrate 52 has a conductive path 51 embedded in the insulating resin 50, and the surface of the insulating resin 50 and the surface of the conductive path 51 coincide. Further, in the mounting substrate 52, a second material different from the first material constituting the conductive path 51 is formed on the back surface of the conductive path 51.

  This structure is substantially the same as the structure on the left side of FIG. 1, but a second material is formed on the back surface of the conductive path 51. Therefore, in addition to the features described on the right side of FIG. 1, the following two features are provided.

  The first feature is that a second material is provided to prevent warping of the conductive path and the mounting substrate.

  In general, due to the difference in thermal expansion coefficient between the insulating resin and the first material, the mounting substrate itself is warped, and the conductive path is curved or peeled off. In addition, since the thermal conductivity of the first material is superior to that of the insulating resin, the first material first rises in temperature and expands. Therefore, by covering the second material having a smaller thermal expansion coefficient than that of the first material, it is possible to prevent warping and peeling of the conductive path and warping of the mounting substrate. In particular, when Cu is employed as the first material, Ag or Ni is preferable as the second material.

  The second feature is that the anchor effect is provided by the second material. Since the eaves 71 are formed of the second material, and the eaves 71 attached to the conductive path 51 are embedded in the insulating resin 50, an anchor effect is generated and the conductive path 51 can be prevented from coming off. .

<Third embodiment for explaining a mounting substrate>
Next, the mounting substrate 60 shown on the left side of FIG. 6 will be described. The mounting substrate 60 has a conductive path 51 embedded in the insulating resin 50, and the surface of the insulating resin 50 and the surface of the conductive path 51 coincide. In addition, the side surface of the conductive path 51 embedded in the mounting substrate 60 is curved.

  Except for the curved structure, since it is substantially the same as the mounting substrate 52 shown on the left side of FIG. 1, only the curved structure will be described.

  This curved structure is formed by non-anisotropic etching as will be apparent from the description of the manufacturing method later. In particular, the side surface of the conductive path 51 has a structure in which the side surface above and / or below the predetermined position protrudes outward. It has a feature that can prevent it from coming off.

<Fourth Embodiment Explaining Mounting Board>
Next, the mounting substrate 60 shown on the right side of FIG. 6 will be described. The mounting substrate 60 is substantially the same except that the projection 71 on the back surface of the conductive path is different from the left side of FIG.

  As apparent from the above description, in order to generate the anchor effect, there are mainly two types of structures, the first structure is the eaves 71, and the second structure is the conductive path 51. It is a side curved structure. The mounting substrate 60 further prevents the conductive path 51 from coming off by adopting these two structures. Further, when 1 μm to 7 μm of Ni is deposited on a 70 μm Cu foil, and wet etching is performed with ferric chloride or cupric chloride, the length of the eaves 71 is generated to about 5 to 15 μm.

<Fifth Embodiment Explaining Mounting Board>
Next, the mounting substrate 61 shown on the left side of FIG. 9 will be described.

  The mounting substrate 61 has a conductive path 51 embedded in the insulating resin 50, and is formed so that the surface of the conductive path 51 is lower than the surface of the insulating resin 50. Note that the conductive path 51 is substantially the same as the left side of FIG. 1 except that the surface of the conductive path 51 is formed low.

  The mounting substrate 61 is characterized in that the surface of the conductive path 51 is formed low. If the lead terminal of the electronic circuit element is properly arranged in the conductive path 51 formed low, the connecting portion of the lead terminal 55 is formed in contact with the side wall of the recessed portion 63 because the recessed portion 63 is formed. Has no features. Details will be described with reference to FIG. 10B.

<Sixth Embodiment for Explaining Mounting Board>
Next, the mounting substrate 61 shown on the right side of FIG. 9 will be described.

  The mounting substrate 61 has a conductive path 51 embedded in the insulating resin 50, is formed so that the surface of the conductive path 51 is lower than the surface of the insulating resin 50, and on the back surface of the conductive path 51. A second material different from the first material is formed, and an eaves 71 is formed. In addition, it is substantially the same as the left side of FIG. 9 except the eaves 71 being formed.

  The feature of the mounting substrate 61 is that the surface of the conductive path 51 is formed low, so that once the electronic circuit element is appropriately disposed in the conductive path 51, the lead terminal of the electronic circuit element is connected to the recess 63. It has a feature that it does not shift due to contact with the side wall. Further, the conductive path 51 does not come off due to the anchor effect of the eaves.

<Seventh Embodiment for Explaining Mounting Board>
Next, the mounting board 62 shown on the left side of FIG. 11 will be described. The mounting substrate 62 has a conductive path 51 embedded in the insulating resin 50, is formed so that the surface of the conductive path 51 is lower than the surface of the insulating resin 50, and the side surface of the conductive path 51 is It is configured to be curved. Except for the fact that the surface of the conductive path 51 is formed low, it is substantially the same as the left side of FIG.

  The mounting substrate 62 is characterized by the fact that the surface of the conductive path 51 is formed low, so that once the electronic circuit element is properly disposed in the conductive path 51, the lead terminal 55 of the electronic circuit element is provided with the recess 63. The conductive path 51 does not come off due to the curved structure.

<Eighth Embodiment Explaining Mounting Board>
Next, the mounting substrate 62 shown on the right side of FIG. 11 will be described. The mounting substrate 62 has a conductive path 51 embedded in the insulating resin 50, is formed so that the surface of the conductive path 51 is lower than the surface of the insulating resin 50, and the side surface of the conductive path 51 is The eaves 71 are also formed at the same time as being curved. It is substantially the same as the left side of FIG. 11 except that the eaves are formed, and is substantially the same as the right side of FIG. 6 except that the conductive path 51 is formed lower than the insulating resin 50. Are the same.

  The mounting substrate 62 is characterized by the fact that the surface of the conductive path 51 is formed low, so that once the electronic circuit element is properly disposed in the conductive path 51, the lead terminal 55 of the electronic circuit element is provided with the recess 63. The conductive path 51 does not come off due to the curved structure and the eaves structure.

  Next, what is formed as a conductive path will be described with reference to FIG. Since the conductive path 51 can be formed in various patterns, it can be employed as various electrodes, die pads, bonding pads, or wiring. In particular, it is very significant to apply this conductive path to wiring. That is, when considering the wiring pattern of the hybrid substrate and the printed circuit board, the wiring is thin and there is a long one that extends from one end of the substrate to the other end. This thin and long wiring has a problem that it is easily warped when heat is applied and peels off when a heat cycle is applied. In addition, a small-sized conductive path such as a bonding pad is easy to peel off because of a small bonding area. However, in the present invention, the conductive path 51 is embedded in the insulating resin 50, the side surface has a curved structure, and / or the eaves are formed, thereby generating an anchor effect. Therefore, these problems are solved at a time. Has characteristics. This is true for all the mounting boards described so far.

<A 1st embodiment explaining a manufacturing method of a mounting board>
Next, a method for manufacturing the mounting substrate 52 will be described using the left side of FIG. 2, the left side of FIG. 3, and the left side of FIG.

  First, as shown in FIG. 2, a sheet-like conductive foil 70 is prepared. The conductive foil 70 is selected in consideration of the adhesiveness, bonding property, and plating property of the brazing material. As the material, a conductive foil mainly composed of Cu, a conductive foil mainly composed of Al, or Fe is used. A conductive foil made of an alloy such as Ni is employed.

  The thickness of the conductive foil is preferably about 10 μm to 300 μm in consideration of the later etching, and here, a copper foil of 70 μm (2 ounces) is employed. However, it is basically good if it is 300 μm or more and 10 μm or less. As will be described later, it is only necessary to form a separation groove 72 </ b> B that is shallower than the thickness of the conductive foil 70.

  In addition, the sheet-like conductive foil 70 is prepared by being wound into a roll with a predetermined width, and this may be conveyed to each step described later, or a conductive foil cut into a predetermined size is prepared, You may convey to each process mentioned later.

  Subsequently, there is a step of removing the conductive foil 70 excluding at least the region to be the conductive path 51 thinner than the thickness of the conductive foil 70. There is a step of coating the insulating resin 50 on the separation groove 72B and the conductive foil 70 formed by this removal step.

  For example, a photoresist is formed on the Cu foil 70, the photoresist is patterned so that the conductive foil 70 excluding the region to be the conductive path 51 is exposed, and etching is performed through the photoresist.

  The depth of the separation groove 72 formed by etching is, for example, 50 μm, and its side surface is a rough surface, so that the adhesiveness with the insulating resin 50 is improved.

  The side wall of the separation groove 72 is schematically illustrated as a straight line, but has a different structure depending on the removal method. This removal process can employ wet etching, dry etching, laser evaporation, and dicing. In the case of wet etching, ferric chloride or cupric chloride is mainly used as the etchant, and the conductive foil is dipped in the etchant or showered with the etchant. Since wet etching is generally non-anisotropic, the side surface has a curved structure. Details will be described in the manufacturing method of FIGS.

  In the case of dry etching, etching can be performed anisotropically or non-anisotropically. At present, it is said that Cu cannot be removed by reactive ion etching, but it can be removed by sputtering. Etching can be anisotropic or non-anisotropic depending on sputtering conditions.

  Further, in the case of a laser, a separation groove can be formed by direct laser irradiation, and an etching mask is not required. In dicing, it is impossible to form a complicated bent pattern, but it is possible to form a lattice-like separation groove.

  In the left side of FIG. 2, if a conductive film that is corrosion resistant to the etching solution is selectively applied to a portion that forms a conductive path, this conductive film becomes an etching protective film, and without using a resist. The separation groove can be etched. Possible materials for the conductive film are Ag, Au, Pt, Pd, and the like. In addition, these corrosion-resistant conductive films have the feature that they can be used as they are as die pads and bonding pads.

  For example, Ag adheres to Au and also to a brazing material. Therefore, if the Au coating is coated on the back surface of the chip, the chip can be thermocompression bonded to the Ag coating as it is, and the chip can be fixed via a brazing material such as solder. Further, since an Au fine wire can be adhered to the Ag conductive film, wire bonding is also possible. Accordingly, there is an advantage that these conductive films can be used as they are as die pads and bonding pads.

  On the other hand, the step of attaching the insulating resin 50 to the conductive foil 70 and the separation groove 72B can be realized by transfer molding, injection molding, or dipping. As the resin material, a thermosetting resin such as an epoxy resin or a polyimide resin can be realized by transfer molding, and a thermoplastic resin such as polyphenylene sulfide can be realized by injection molding.

  In the present embodiment, the thickness of the insulating resin coated on the surface of the conductive foil 70 is about 100 μm. This thickness can be increased or decreased in consideration of strength.

  The feature of this step is that when the insulating resin 50 is coated, the conductive foil 70 that becomes the conductive path 51 becomes a support substrate. Conventionally, as shown in FIG. 14C, the conductive path 101 is formed by using the support substrate 102 that is not originally required. However, in the present invention, the conductive foil 70 serving as the support substrate is made of a material necessary as an electrode material. is there. Therefore, there is a merit that the work can be performed with the constituent materials omitted as much as possible, and the cost can be reduced.

Further, since the separation groove 72 </ b> B is formed shallower than the thickness of the conductive foil, the conductive foil 70 is not individually separated as the conductive path 51. Accordingly, the sheet-like conductive foil 70 can be handled as a unit, and when molding an insulating resin, it has a feature that the work of carrying and mounting to a mold becomes very easy. (See the left side of Fig. 3 above)
Subsequently, as shown in FIG. 1, there is a step of chemically and / or physically removing the back surface of the conductive foil 70 and separating it as a conductive path 51. In FIG. 3, the conductive foil 70 is positioned below, but in FIG. 1, the conductive foil 70 is inverted to remove the conductive foil 70 from above. Here, the removing step is performed by polishing, grinding, etching, metal evaporation of laser, or the like.

  In the experiment, the entire surface is shaved by about 30 μm with a polishing apparatus or a grinding apparatus to expose the insulating resin 50. As a result, the conductive path 51 having a thickness of about 40 μm is separated. Alternatively, the entire surface of the conductive foil 70 may be wet-etched before the insulating resin 50 is exposed, and then the entire surface may be shaved by a polishing or grinding apparatus to expose the insulating resin 50.

  As a result, the surface of the conductive path 51 is exposed to the insulating resin 50. FIG. 4 shows this state. 4A is applied as a mounting substrate for transistors, and FIG. 4B is applied as a mounting substrate for forming a circuit by forming a plurality of electronic circuit elements and providing wiring H. FIG. Both are prepared as large plates, formed in a matrix, and divided at the dotted line before or after mounting the electronic circuit elements. However, it is also possible to make one circuit as it is and use it as it is.

  In addition, the conductive path 51 is embedded in the insulating resin 50, and a flat mounting substrate in which the surface of the insulating resin 50 and the surface of the conductive path 51 coincide with each other can be realized.

  The feature of this process is that the insulating path 50 can be used as a support substrate to separate the conductive path 51. The insulating resin 50 is a material necessary as a material for embedding the conductive path 51, and does not require an unnecessary support substrate 102 unlike the conventional manufacturing method of FIG. 12C. Therefore, it has the characteristics that it can be manufactured with a minimum amount of material and cost can be reduced.

  The thickness of the insulating resin from the back surface of the conductive path 51 can be adjusted when the insulating resin is attached in the previous step. Therefore, the mounting substrate 52 has a feature that the thickness can be increased or decreased. Here, a mounting substrate is obtained in which a conductive path 51 of 40 μm is embedded in an insulating resin 50 having a thickness of 140 μm (see FIG. 1 above).

<Second Embodiment Explaining Method for Manufacturing Mounting Board>
Next, a method for manufacturing the mounting substrate 52 having the eaves 71 will be described using the right side of FIG. 2, the right side of FIG. 3, and the right side of FIG. Since the second material 58 is substantially the same as the left side of FIG. 2, the left side of FIG. 3, and the left side of FIG.

  First, as shown in the right side of FIG. 2, a conductive foil 70 in which a second material 58 having a low etching rate is coated on a conductive foil 70 made of a first material is prepared.

  For example, it is preferable to deposit Ni on a Cu foil because Cu and Ni can be etched at once with ferric chloride or cupric chloride, and Ni is formed into eaves 71 due to the difference in etching rate. . The thick solid line is Ni58, and the film thickness is preferably about 1 to 10 μm. Further, the eaves 71 are more easily formed as the Ni film is thicker.

  The second material may be coated with a material that can be selectively etched with the first material. In this case, first, a film made of the second material is patterned so as to cover the region where the conductive path 51 is formed, and the eaves can be formed by etching the film made of the first material using this film as a mask. . As the second material, Al, Ag, Au, or the like can be considered.

  Subsequently, there is a step of removing the conductive foil 70 excluding at least the region to be the conductive path 51 thinner than the thickness of the conductive foil 70. There is a step of covering the separation groove 72B and the conductive foil 70 formed by this removing step with the insulating resin 50.

  A photoresist is formed on the Ni 58, the photoresist is patterned so that the Ni 58 excluding the region to be the conductive path 51 is exposed, and etching is performed through the photoresist.

  As described above, when etching is performed using ferric chloride and cupric chloride etchants, since the etching rate of Ni is smaller than the etching rate of Cu, eaves 71 appear as etching progresses.

  The step of covering the conductive foil 70 and the separation groove 72B with the insulating resin 50, the step of chemically and / or physically removing the back surface of the conductive foil 70, and separating the conductive path 51 (FIG. 1) Since it is the same as a manufacturing method, the description is abbreviate | omitted.

<Third Embodiment for explaining a method of manufacturing a mounting substrate>
Next, a manufacturing method of the mounting substrate 60 in which the side surface of the conductive path is curved will be described with reference to the left side of FIG. 7, the left side of FIG. 8, and the left side of FIG.

  First, as shown on the left side of FIG. 7, a sheet-like conductive foil 70 is prepared. Here, a 70 μm (2 ounce) copper foil was employed in order to etch non-anisotropically and to have a curved structure on the side surface. If it is too thin, it is considered that the separation groove 72B penetrates to the back surface because the etching speed is high.

  Subsequently, there is a step of removing the conductive foil 70 excluding at least the region to be the conductive path 51 thinner than the thickness of the conductive foil 70. By this removal step, the separation groove 72B is formed, and then there is a step of covering the conductive foil 70 and the separation groove 72 with the insulating resin 50.

  For example, on the left side of FIG. 8A, a photoresist is formed on the Cu foil 70, the photoresist is patterned so that the conductive foil 70 excluding the region to be the conductive path 51 is exposed, and etching is performed through the photoresist. .

  This manufacturing method is characterized by non-anisotropic etching by wet etching or dry etching, and its side surface is rough and curved. Note that the depth of the separation groove 72 formed by etching is about 50 μm.

  In the case of wet etching, ferric chloride or cupric chloride is used as the etchant, and the conductive foil is dipped in the etchant or showered.

  In particular, as shown in FIG. 8B, directly under the photoresist PR serving as an etching mask, the etching in the horizontal direction is difficult to proceed, and a deeper portion is etched in the horizontal direction. As shown in the figure, when the opening diameter of the opening corresponding to the position decreases from a position where the side surface of the separation groove 72B is located upward, an inversely tapered structure is formed, and a structure having an anchor structure is obtained. Further, by adopting a shower ring, etching proceeds in the depth direction and lateral etching is suppressed, so that this anchor structure appears remarkably.

  Further, on the left side of FIG. 7, even if the portion corresponding to the conductive path is partially plated with a metal such as Ag, Au, Pd, Pt, etc., and the wet etching is performed using this metal as a mask, the same anchor structure is obtained according to the above-described principle. Can be formed.

  On the other hand, the step of covering the conductive foil 70 and the separation groove 72B with the insulating resin 50 can be realized by transfer molding, injection molding, or dipping. As the resin material, a thermosetting resin such as epoxy resin or polyimide resin can be realized by transfer molding, and a thermoplastic resin such as polyphenylene sulfide can be realized by injection molding, and the coating thickness from the conductive foil 70 is about 100 μm. is there. This thickness can be increased or decreased in consideration of strength.

The feature of this step is that when the insulating resin 50 is coated, the conductive foil 70 that becomes the conductive path 51 becomes a support substrate. Conventionally, as shown in FIG. 14C, the support substrate 102 that is not originally required is adopted and formed. However, in the present invention, the conductive foil 70 is necessary as an electrode material. However, there is an advantage that waste of materials can be saved as much as possible. Moreover, since the separation groove is formed shallower than the thickness of the conductive foil, it is not individually separated as a conductive path. Therefore, it can be handled as a sheet-like conductive foil 70 and can be easily transported and mounted in a mold. (Refer to the left side of Fig. 8A)
Subsequently, as shown on the left side of FIG. 6, there is a step of chemically and / or physically removing the back surface of the conductive foil 70 and separating it as the conductive path 51. In FIG. 8A, the conductive foil 70 is positioned below, but in FIG. 6, it is inverted to remove the conductive foil 70 from above. Here, the removing step is performed by polishing, grinding, etching, metal evaporation of laser, or the like.

  Here, the entire surface is shaved by about 30 μm by a polishing apparatus or a grinding apparatus to expose the insulating resin 50. As a result, the conductive path 51 is easily separated with a thickness of about 40 μm.

  Alternatively, the entire surface of the conductive foil 70 may be etched until the insulating resin 50 is exposed, and then the entire surface may be shaved by a polishing or grinding apparatus to expose the insulating resin 50. Further, etching may be performed from the back surface until the conductive foil is separated as a conductive path.

  As a result, the surface of the conductive path 51 is exposed to the insulating resin 50. Moreover, the conductive path 51 is embedded in the insulating resin 50, and a flat substrate in which the surface of the insulating resin 50 and the surface of the conductive path 51 coincide can be realized.

  The feature of this step is that the conductive path 51 can be separated using the insulating resin 50 as a support substrate. The insulating resin 50 is a material necessary as a material for embedding the conductive path 51, and does not require an unnecessary support substrate 102 unlike the conventional structure of FIG. 14C. Therefore, it has the characteristics that it can be manufactured with a minimum amount of material and cost can be reduced.

Further, the side surface of the conductive path 51 has a curved structure, and the conductive path 51 does not come out of the insulating resin 50. Again, the 40 μm conductive path 51 is embedded in the 140 μm thick insulating resin 50. (See Figure 6 above)
<Fourth Embodiment Explaining Method for Manufacturing Mounting Board>
Next, a method for manufacturing the mounting substrate 60 in which the side surface of the conductive path is curved and provided with eaves will be described with reference to the right side of FIG. 7, the right side of FIG. 8, and the right side of FIG. In addition, since it is the same as the previous manufacturing method except the eaves 71 being formed, description is simplified.

  First, as shown on the left side of FIG. 7, a sheet-like conductive foil 70 to which the second material 58 is applied is prepared.

  Subsequently, there is a step of removing the conductive foil 70 excluding at least the region to be the conductive path 51 thinner than the thickness of the conductive foil 70. By this removal step, the separation groove 72B is formed, and then there is a step of covering the conductive foil 70 and the separation groove 72 with the insulating resin 50.

  For example, a photoresist is formed on the Ni 58 on the left side of FIG. 8A, the photoresist is patterned so that the Ni 58 excluding the region to be the conductive path 51 is exposed, and etching is performed through the photoresist. As a result, an eaves of Ni is formed.

Subsequently, the insulating resin 50 is coated on the conductive foil 70 and the separation groove 72B. (Refer to the left side of Fig. 8A)
Subsequently, as shown on the right side of FIG. 6, the back surface of the conductive foil 70 is chemically and / or physically removed and separated as a conductive path 51.

As a result, the surface of the conductive path 51 is exposed to the insulating resin 50. Moreover, the conductive path 51 is embedded in the insulating resin 50, and a flat substrate in which the surface of the insulating resin 50 and the surface of the conductive path 51 coincide can be realized. Further, since the side surface of the conductive path 51 has a curved structure and the eaves 71 are formed, the conductive path 51 does not come out of the insulating resin 50. (See Figure 6 above)
<Fifth Embodiment Explaining Method for Manufacturing Mounting Board>
Next, with reference to the left side of FIG. 2, the left side of FIG. 3, the left side of FIG. 1, and the left side of FIG. 9, a manufacturing method of the mounting substrate 61 provided with the low conductive path 51 will be described. Since the left side of FIG. 2, the left side of FIG. 3, and the left side of FIG. 1 are formed by the same manufacturing method, the description thereof is omitted.

  After the surface of the conductive path 51 and the surface of the insulating resin 50 are made to coincide in the process of FIG. 1, if the conductive path 51 is further etched by wet etching or dry etching, as shown on the left side of FIG. The surface is located below the surface of the insulating resin 50.

  Further, on the left side of FIG. 3, if the entire surface is etched, the conductive path 51 is naturally separated, and further, the surface of the conductive path 51 is formed lower than the surface of the insulating resin.

  Since the recess 63 is provided by the step of forming the conductive path 51 low, the lead terminal 55 can be prevented from being displaced.

<Sixth Embodiment Explaining Manufacturing Method of Mounting Board>
Next, a method for manufacturing the mounting substrate 61 having the eaves will be described with reference to the right side of FIG. 2, the right side of FIG. 3, the right side of FIG. 1, and the right side of FIG. The right side of FIG. 2, the right side of FIG. 3, and the right side of FIG. 1 are formed by the same manufacturing method, and thus description thereof is omitted.

  After the surface of the conductive path 51 and the surface of the insulating resin 50 are made to coincide in the process of FIG. 1, if the conductive path 51 is further etched by wet etching or dry etching, as shown on the right side of FIG. The surface is located below the surface of the insulating resin 50.

  Further, on the right side of FIG. 3, if the entire surface is etched, the conductive path 51 is naturally separated, and further, the surface of the conductive path 51 is formed lower than the surface of the insulating resin.

<Seventh Embodiment Explaining Manufacturing Method of Mounting Board>
Next, a method for manufacturing the mounting substrate 62 will be described with reference to the left side of FIG. 7, the left side of FIG. 8A, the left side of FIG. 6, and the left side of FIG. Since the left side of FIG. 7, the left side of FIG. 8A, and the left side of FIG. 6 are formed by the same manufacturing method, description thereof is omitted.

  After the surface of the conductive path 51 and the surface of the insulating resin 50 are made to coincide in the process of FIG. 6, if the conductive path 51 is further etched by wet etching or dry etching, as shown on the left side of FIG. The surface is located below the surface of the insulating resin 50.

  In the left side of FIG. 8, if the entire surface is etched, the conductive path 51 is naturally separated, and further, the surface of the conductive path 51 is formed lower than the surface of the insulating resin.

<Eighth Embodiment Explaining Manufacturing Method of Mounting Board>
Next, a method for manufacturing the mounting substrate 62 will be described with reference to the right side of FIG. 7, the right side of FIG. 8A, the right side of FIG. 6, and the right side of FIG. Since the right side of FIG. 7, the right side of FIG. 8A, and the right side of FIG. 6 are formed by the same manufacturing method, the description thereof is omitted.

  If the surface of the conductive path 51 and the surface of the insulating resin 50 are made to coincide with each other in the process of FIG. 6, then the conductive path 51 is further etched by wet etching or dry etching, as shown on the right side of FIG. The surface is located below the surface of the insulating resin 50.

  On the right side of FIG. 8, if the entire surface is etched, the conductive path 51 is naturally separated, and further, the surface of the conductive path 51 is formed lower than the surface of the insulating resin.

<Ninth Embodiment for Explaining Mounting Board>
Next, the mounting substrate 80 shown in FIG. 12 will be described with reference to FIGS. 2, 3, and 12.

  Since FIG. 2 and FIG. 3 are the same, description thereof is omitted. In FIG. 3, an etching mask covered with a portion corresponding to the conductive path 51 is formed, and etching is performed until the conductive foil 70 is separated as the conductive path 51, whereby the mounting substrate 80 of FIG. 12 can be formed. In this structure, although the surface of the conductive path 51 is formed so as to protrude from the surface of the insulating resin 50, a part of the conductive path 51 is embedded in the insulating resin 50, so that the conductive path 51 can be prevented from coming off.

<Tenth Embodiment for explaining a Mounting Board>
Further, the mounting substrate 81 shown in FIG. 13 will be described with reference to FIGS. 7, 8, and 13. In FIG. 8, an etching mask covered with a portion corresponding to the conductive path 51 is formed, and etching is performed until the conductive foil 70 is separated as the conductive path 51, whereby the mounting substrate 81 of FIG. 13 can be formed. In this structure, the surface of the conductive path 51 is formed so as to protrude from the surface of the insulating resin 50, but part of the conductive path 51 is embedded in the insulating resin 50, so that the conductive path 51 can be prevented from coming off.

<First Embodiment Explaining Mounting Method>
Next, a method for mounting an electronic circuit element will be described with reference to FIG. In FIG. 5B, a package type electronic circuit element 56 is mounted.

  If the lead is attached so as to be displaced from the conductive path 51, the step cannot be displaced due to the conventional method, but in the present invention, the surface of the insulating resin 50 and the surface of the conductive path 51 coincide. Therefore, it can be easily shifted.

  Further, when the solder paste is applied and the electronic circuit element 56 is temporarily fixed, the electronic circuit elements may be displaced from each other. However, since the surface of the conductive path and the surface of the insulating resin coincide with each other, the electronic circuit element can be rearranged at an appropriate position by simply shifting the electronic circuit element in the horizontal direction. This is because it is only necessary to shift in the horizontal direction when using the mounting device, so that the workability of the mounting device is improved.

  Furthermore, even if the electronic circuit elements are displaced and disposed during temporary fixing with the paste, they are naturally repositioned due to the surface tension of the molten solder in the solder reflow process. In particular, since the surface of the conductive path and the surface of the insulating resin coincide with each other, this rearrangement is easily performed.

  If this structure is adopted, even if the electronic circuit elements 56 and 57 are deviated from the conductive path 51 and are fixed, the electronic circuit element is naturally caused by the surface tension of the molten brazing material by melting the brazing material again. It has a feature that it is returned to the conductive path 51 and rearranged at an appropriate position.

Recently, both the size of the conductive path 51 and the size of the electronic circuit element are very small, and the electronic circuit element is often mounted in a shifted state. It is possible to suppress the problem of being displaced and fixed. (See Figure 5 above)
<Second Embodiment Explaining Mounting Method>
Subsequently, referring to FIG. 10, a method of mounting the electronic circuit element will be described. Here, since the surface of the conductive path 51 is formed lower than the surface of the insulating resin, the recess 63 is formed. For example, when the lead terminal 55 of the electronic circuit element 56 is disposed on the conductive path 51, the periphery thereof is formed by the recessed portion 63, so that the lead terminal is disposed without being shifted due to a step formed around the periphery.

It is a figure explaining the mounting substrate of this invention. It is a figure explaining the manufacturing method of the mounting substrate of this invention. It is a figure explaining the manufacturing method of the mounting substrate of this invention. FIG. 4 is a perspective view of FIG. 3. It is a figure explaining the mounting board | substrate of this invention with which the electronic circuit element was mounted. It is a figure explaining the mounting substrate of this invention. It is a figure explaining the manufacturing method of the mounting substrate of this invention. It is a figure explaining the manufacturing method of the mounting substrate of this invention. It is a figure explaining the mounting substrate of this invention. It is a figure explaining the mounting board | substrate with which the electronic circuit element was mounted. It is a figure explaining the mounting substrate of this invention. It is a figure explaining the mounting substrate of this invention. It is a figure explaining the mounting substrate of this invention. It is a figure explaining the manufacturing method of the conventional mounting board | substrate.

Explanation of symbols

50 Insulating resin
51 Conductive path
52 Mounting board
53 Semiconductor device
54 Sealing resin
55 Lead terminal
56 Electronic circuit elements
58 Second material (Ni)
70 conductive foil
71 Eaves
72 Separation groove

Claims (10)

Preparing a conductive foil, forming a separation groove shallower than the thickness of the conductive foil on the surface of the conductive foil excluding at least a region to be a conductive path;
Coating the surface of the conductive foil with an insulating resin so as to fill the separation groove;
Removing the conductive foil from the back surface until the insulating resin filled in the separation groove protrudes to the outside, and separating the conductive path.   The method for manufacturing a mounting substrate according to claim 1, wherein the separation groove is formed by etching.   The method for manufacturing a mounting board according to claim 1, wherein a side surface of the insulating resin protruding outward and a side surface of the conductive path are continuous curved surfaces.   The method for manufacturing a mounting substrate according to claim 1, wherein the conductive path includes a pad and a wiring continuously extending from the pad. Preparing a conductive foil, forming a separation groove shallower than the thickness of the conductive foil on the surface of the conductive foil excluding at least a region to be a conductive path;
Coating the surface of the conductive foil with an insulating resin so as to fill the separation groove;
The conductive foil is removed from the back surface until the insulating resin filled in the separation groove protrudes to the outside, the conductive path is separated, and the exposed surface of the conductive path is positioned inside the insulating resin. Process,
And a step of mounting the electronic circuit element on the exposed surface of the conductive path.   6. The method of mounting an electronic circuit element according to claim 5, wherein the lowermost part of the electronic circuit element is located inside the protruding surface of the insulating resin.   6. The method of mounting an electronic circuit element according to claim 5, wherein the electronic circuit element is fixed to the conductive path through a brazing material.   6. The method of mounting an electronic circuit element according to claim 5, wherein the separation groove is formed by etching.   6. The method of mounting an electronic circuit element according to claim 5, wherein a side surface of the insulating resin protruding outward and a side surface of the conductive path are continuous curved surfaces. 6. The method for mounting an electronic circuit element according to claim 5, wherein the conductive path includes a pad and a wiring extending continuously from the pad.

Images