JP2005072505A - Substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component Download PDF

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Publication number
JP2005072505A
JP2005072505A JP2003303722A JP2003303722A JP2005072505A JP 2005072505 A JP2005072505 A JP 2005072505A JP 2003303722 A JP2003303722 A JP 2003303722A JP 2003303722 A JP2003303722 A JP 2003303722A JP 2005072505 A JP2005072505 A JP 2005072505A
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substrate
insulating substrate
electronic component
external
mounting
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Japanese (ja)
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Koichi Hirayama
浩一 平山
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component that has a small mounting area for an external electric circuit board and is excellent in connection reliability. <P>SOLUTION: The substrate 6 for mounting electronic component includes an insulating substrate 1 having a mounting section 1a for mounting an electronic component 5 on its top surface, a wiring layer 2 led out from the circumference of the mounting section 1a of the substrate 1 to the bottom surface of the substrate 1, and a plurality of outside connecting pads 3 formed on the bottom surface of the substrate 1 in a state where the pads 3 are electrically connected to the wiring layer 2. The substrate 6 also includes external lead terminals 4 the one end sections of which are joined to the pads 3 along the surfaces of the pads 3 and the other end sections of which are electrically connected to an external electric circuit. The central parts of the external lead terminals 4 between one end sections and the other end sections are extended toward the outside on the oblique downside and, at the same time, the other end sections are made parallel to the bottom surface of the insulating substrate 1 and positioned on the inside than the side face of the substrate 1. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

本発明は、半導体素子や水晶発振子等の電子部品を搭載するための電子部品搭載用基板に関するものである。   The present invention relates to an electronic component mounting substrate for mounting electronic components such as semiconductor elements and crystal oscillators.

従来、半導体素子や水晶発振子等の電子部品を搭載するための電子部品搭載用基板としての一般的なフラットリードタイプのもの（ＱＦＰ：Quad Flat Package）は、通常、上面の中央部に電子部品の搭載部を有する四角形状の絶縁基板と、搭載部の周辺から絶縁基板の下面にかけて導出された配線層と、配線層と電気的に接続するようにして絶縁基板の下面の外周部に形成された外部接続用のパッドと、パッドに一端部が接合された外部リード端子とを具備した構造である。   Conventionally, a general flat lead type (QFP: Quad Flat Package) as an electronic component mounting substrate for mounting an electronic component such as a semiconductor element or a crystal oscillator usually has an electronic component at the center of the upper surface. Formed on the outer periphery of the lower surface of the insulating substrate so as to be electrically connected to the wiring layer, and the wiring layer led out from the periphery of the mounting portion to the lower surface of the insulating substrate. And a pad for external connection and an external lead terminal having one end joined to the pad.

外部リード端子は、一般に、帯状の金属材料（鉄−ニッケル合金や鉄−ニッケル−コバルト合金等）から成り、一端部はパッドの表面に沿って、銀ろう等のろう材を介して接合されている。このリード端子は、パッドに接合された一端部から他端部にかけて、絶縁基板の下面の延長面とほぼ平行に、絶縁基板の側面よりも外側に突き出るようにして延びており、他端部が外部電気回路の所定位置に絶縁基板の側面と平行に、半田等の低融点ロウ材を介して電気的に接続される。   The external lead terminal is generally made of a band-shaped metal material (iron-nickel alloy, iron-nickel-cobalt alloy, etc.), and one end thereof is joined along the surface of the pad via a brazing material such as silver brazing. Yes. The lead terminal extends from one end portion joined to the pad to the other end portion so as to protrude outward from the side surface of the insulating substrate substantially parallel to the extended surface of the lower surface of the insulating substrate. It is electrically connected to a predetermined position of the external electric circuit in parallel with the side surface of the insulating substrate through a low melting point solder such as solder.

この電子部品搭載用基板の搭載部に電子部品を搭載するとともに必要に応じて蓋体や封止樹脂等で気密封止することにより電子装置となる。そして、外部リード端子の他端部を外部電気回路基板に半田等の導電性の接続材を介して接続することにより電子装置が外部電気回路基板に実装され、搭載した電子部品が外部電気回路に電気的に接続される。
特開平６−３７２３４号公報 An electronic device is obtained by mounting an electronic component on the mounting portion of the electronic component mounting substrate and hermetically sealing with a lid or a sealing resin as necessary. Then, the electronic device is mounted on the external electric circuit board by connecting the other end portion of the external lead terminal to the external electric circuit board through a conductive connecting material such as solder, and the mounted electronic component is connected to the external electric circuit. Electrically connected.
JP-A-6-37234

しかしながら、このような従来の電子部品搭載用基板は、外部リード端子が絶縁基板の側面よりも外側に延びているため、外部電気回路基板に実装したときの平面視における占有面積が大きくなってしまうという問題点があった。電子装置の占有面積が大きくなると、外部電気回路基板や、外部電気回路基板を組み込む電子機器(コンピュータや携帯電話等）の小型化が困難になってしまう。   However, in such a conventional electronic component mounting board, since the external lead terminals extend outward from the side surface of the insulating substrate, the occupied area in a plan view when mounted on the external electric circuit board becomes large. There was a problem. When the area occupied by the electronic device increases, it becomes difficult to reduce the size of the external electric circuit board and electronic devices (such as computers and mobile phones) incorporating the external electric circuit board.

また、外部リード端子が絶縁基板の下面の延長面とほぼ平行であるため、外部電気回路基板に実装したときに、外部リード端子や絶縁基板の下面と外部電気回路基板の表面とが非常に近接したものであることから、また、外部リード端子を外部電気回路に接続する半田として錫−銀系等のいわゆる鉛フリー半田が多用されるようになってきており、このような鉛フリー半田の半田付け温度が高く、半田付け時に流れやすいことから、外部リード端子を外部電気回路に接続するときに半田が外部リード端子と外部電気回路の基板との間に広がってしまい、隣接するリード端子間で電気的な短絡を生じやすくなってしまうという問題点があった。   In addition, since the external lead terminals are almost parallel to the extended surface of the bottom surface of the insulating substrate, the external lead terminals and the bottom surface of the insulating substrate are very close to the surface of the external electrical circuit substrate when mounted on the external electrical circuit substrate. In addition, so-called lead-free solders such as tin-silver-based solders are often used as solder for connecting external lead terminals to external electric circuits. Since the soldering temperature is high and it is easy to flow during soldering, the solder spreads between the external lead terminal and the board of the external electrical circuit when connecting the external lead terminal to the external electrical circuit. There has been a problem that electrical shorts are likely to occur.

本発明は上記従来の問題に鑑みて完成されたものであり、その目的は、外部電気回路基板に対する実装面積が小さく、かつ接続の信頼性に優れた電子部品搭載用基板を提供することである。   The present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide an electronic component mounting board having a small mounting area with respect to an external electric circuit board and excellent connection reliability. .

本発明の電子部品搭載用基板は、上面に電子部品が搭載される搭載部を有する絶縁基板と、該絶縁基板の前記搭載部の周辺から前記絶縁基板の下面にかけて導出された配線層と、該配線層に電気的に接続されて前記絶縁基板の下面に形成された複数の外部接続用のパッドと、該パッドに一端部が前記パッドの表面に沿って接合されているとともに他端部が外部電気回路に電気的に接続される外部リード端子とを具備しており、該外部リード端子は、前記一端部と前記他端部との間の中央部が斜め下方の外側に向かって延びるとともに前記他端部が前記絶縁基板の下面に平行とされており、前記他端部が前記絶縁基板の側面よりも内側に位置していることを特徴とするものである。   An electronic component mounting board according to the present invention includes an insulating substrate having a mounting portion on which an electronic component is mounted on an upper surface, a wiring layer led from the periphery of the mounting portion of the insulating substrate to the lower surface of the insulating substrate, A plurality of pads for external connection electrically connected to the wiring layer and formed on the lower surface of the insulating substrate, one end of which is joined to the pad along the surface of the pad, and the other end is external An external lead terminal electrically connected to the electric circuit, and the external lead terminal has a central portion between the one end and the other end extending obliquely downward and outward. The other end portion is parallel to the lower surface of the insulating substrate, and the other end portion is located inside the side surface of the insulating substrate.

本発明の電子部品搭載用基板によれば、外部リード端子は、一端部と他端部との間の中央部が斜め下方の外側に向かって延びるとともに他端部が絶縁基板の下面に平行とされており、他端部が絶縁基板の側面よりも内側に位置していることから、他端部を外部電気回路に接続し、実装したときの実装面積を、絶縁基板の上面または下面の面積とほぼ同じ程度にまで小さくすることができる。   According to the electronic component mounting board of the present invention, the external lead terminal has a central portion between one end portion and the other end portion extending obliquely downward and the other end portion being parallel to the lower surface of the insulating substrate. Since the other end is located inside the side surface of the insulating substrate, the mounting area when the other end is connected to an external electric circuit and mounted is the area of the upper or lower surface of the insulating substrate. Can be reduced to approximately the same level.

また、外部リード端子は、一端部と他端部との間の中央部が斜め下方の外側に向かって延びるとともに他端部が絶縁基板の下面に平行とされていることから、外部リード端子（特に他端部およびその近辺）と外部電気回路基板との間に十分なスペースを確保することができ、他端部を外部電気回路に接続する際に、半田が上下方向のみならず横方向に広がることを効果的に防止して外部リード端子間の電気的短絡を防止することができる。   The external lead terminal has a central portion between one end portion and the other end portion extending obliquely downward and the other end portion being parallel to the lower surface of the insulating substrate. In particular, a sufficient space can be secured between the other end portion and the vicinity thereof and the external electric circuit board. When the other end portion is connected to the external electric circuit, the solder is not only in the vertical direction but also in the horizontal direction. Spreading can be effectively prevented to prevent an electrical short circuit between the external lead terminals.

本発明の電子部品搭載用基板を添付図面に基づき詳細に説明する。図１は本発明の電子部品搭載用基板の実施の形態の一例を示す断面図である。図１において、１は絶縁基板、２は配線層、３はパッド、４は外部リード端子である。これらの絶縁基板１、配線層２、パッド３および外部リード端子４とで、半導体素子や水晶発振子等の電子部品５を収容する電子部品搭載用基板６が主に構成される。   The electronic component mounting substrate of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing an example of an embodiment of an electronic component mounting board according to the present invention. In FIG. 1, 1 is an insulating substrate, 2 is a wiring layer, 3 is a pad, and 4 is an external lead terminal. The insulating substrate 1, the wiring layer 2, the pad 3, and the external lead terminal 4 mainly constitute an electronic component mounting substrate 6 that houses an electronic component 5 such as a semiconductor element or a crystal oscillator.

本発明における絶縁基板１は、上面のほぼ中央部に電子部品を搭載するための搭載部１ａを有している。この絶縁基板１は、酸化アルミニウム質焼結体、ガラスセラミック焼結体、窒化アルミニウム質焼結体、ムライト質焼結体等のセラミック材料や、エポキシ樹脂、ポリイミド樹脂等の有機樹脂、または、セラミックフィラー粉末を有機樹脂で結合してなる複合材料等の絶縁材料により形成される。   The insulating substrate 1 according to the present invention has a mounting portion 1a for mounting an electronic component at a substantially central portion of the upper surface. This insulating substrate 1 is made of a ceramic material such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a mullite sintered body, an organic resin such as an epoxy resin or a polyimide resin, or a ceramic. It is formed of an insulating material such as a composite material obtained by bonding filler powder with an organic resin.

絶縁基板１は、例えば、酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム、酸化ケイ素等の原料粉末を有機バインダー等とともにシート状に成形して得た複数のセラミックグリーンシートを積層し焼成することにより形成される。   If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a plurality of ceramic green sheets obtained by forming raw powders such as aluminum oxide and silicon oxide together with an organic binder into a sheet shape are laminated. It is formed by firing.

この絶縁基板１の搭載部１ａの周辺から絶縁基板１の下面にかけて配線層２が導出されている。この配線層２は、搭載部１ａの周辺に露出した部位に電子部品５の電極が半田やボンディングワイヤを介して電気的に接続され、電子部品５の電極を絶縁基板１の下面まで導出する機能をなす。   A wiring layer 2 is led out from the periphery of the mounting portion 1 a of the insulating substrate 1 to the lower surface of the insulating substrate 1. The wiring layer 2 has a function in which an electrode of the electronic component 5 is electrically connected to a portion exposed around the mounting portion 1a via solder or a bonding wire, and the electrode of the electronic component 5 is led to the lower surface of the insulating substrate 1. Make.

また、絶縁基板１の下面には、外部接続用のパッド３が複数形成されており、パッド３は配線層２と電気的に接続されている。この接続パッド３は、外部リード端子４をロウ付けすることにより絶縁基板１に取着するためのロウ付け用金属層として機能する。   A plurality of external connection pads 3 are formed on the lower surface of the insulating substrate 1, and the pads 3 are electrically connected to the wiring layer 2. The connection pads 3 function as a brazing metal layer for attaching to the insulating substrate 1 by brazing the external lead terminals 4.

これらの配線導体２および接続パッド３は、タングステン、モリブデン、マンガン、銅、銀、金、パラジウム等の金属材料により形成されている。これらの金属材料は、メタライズ層、めっき層、金属箔等の形態で絶縁基板１に被着形成され、例えば、タングステンのメタライズ層から成る場合であれば、タングステンの粉末に有機溶剤、バインダーを添加し混練して得た金属ペーストを、絶縁基板１となるセラミックグリーンシートに塗布しておくこと等により形成される。   These wiring conductors 2 and connection pads 3 are formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, gold, or palladium. These metal materials are deposited on the insulating substrate 1 in the form of a metallized layer, a plating layer, a metal foil, etc. For example, if it is made of a metallized layer of tungsten, an organic solvent and a binder are added to the tungsten powder. A metal paste obtained by kneading is applied to a ceramic green sheet to be the insulating substrate 1 or the like.

外部リード端子４は、鉄−ニッケル合金、鉄−ニッケル−コバルト合金等の鉄を主成分とする合金や、銅、または銅を主成分とする合金等の金属材料により形成されている。このリード端子４の一端部が、パッド３に銀ろう等のろう材を介して接合されている。   The external lead terminal 4 is made of a metal material such as an iron-based alloy such as iron-nickel alloy or iron-nickel-cobalt alloy, copper, or an alloy mainly composed of copper. One end of the lead terminal 4 is joined to the pad 3 via a brazing material such as silver brazing.

リード端子４の一端部は、パッド３の表面に沿って接合されており、これにより、この一端部とパッド３との接合面積を十分に確保し、リード端子４をパッド３に強固に接合するようにしている。   One end portion of the lead terminal 4 is bonded along the surface of the pad 3, thereby ensuring a sufficient bonding area between the one end portion and the pad 3 and firmly bonding the lead terminal 4 to the pad 3. I am doing so.

このリード端子４の他端部を外部電気回路基板に半田等の導電性の接続材を介して接続することにより、電子部品搭載用基板に搭載した電子部品５が、配線層２と外部リード端子４とを介して外部電気回路に電気的に接続される。   By connecting the other end of the lead terminal 4 to the external electric circuit board via a conductive connecting material such as solder, the electronic component 5 mounted on the electronic component mounting board is connected to the wiring layer 2 and the external lead terminal. 4 is electrically connected to an external electric circuit.

また、本発明の電子部品搭載用基板においては、外部リード端子４は、一端部と他端部との間の中央部が斜め下方の外側に向かって延びるとともに他端部が絶縁基板１の下面に平行とされている。   In the electronic component mounting board of the present invention, the external lead terminal 4 has a central portion between one end portion and the other end portion extending obliquely downward and the other end portion being the lower surface of the insulating substrate 1. It is parallel to.

この構成により、外部リード端子４と外部電気回路基板との間に十分なスペースを確保することができ、半田が広がることを効果的に防止して外部リード端子４間の電気的短絡を防止することができる。外部リード端子４と外部電気回路基板との間に十分なスペースを確保するためには、外部リード端子４の一端部と他端部との間の上下方向の間隔は０．５ｍｍ以上であるのがよい。また、低背化の点では、外部リード端子４の一端部と他端部との間の上下方向の間隔は２ｍｍ以下がよい。   With this configuration, it is possible to secure a sufficient space between the external lead terminal 4 and the external electric circuit board, effectively preventing the solder from spreading and preventing an electrical short circuit between the external lead terminals 4. be able to. In order to secure a sufficient space between the external lead terminal 4 and the external electric circuit board, the vertical distance between one end and the other end of the external lead terminal 4 is 0.5 mm or more. Is good. Further, in terms of reducing the height, the distance in the vertical direction between the one end and the other end of the external lead terminal 4 is preferably 2 mm or less.

また本発明の電子部品搭載用基板においては、外部リード端子４の他端部が絶縁基板１の側面よりも内側に位置している。外部リード端子４の他端部を絶縁基板１の側面よりも内側に位置させることにより、他端部を外部電気回路に接続し実装したときの電子部品搭載用基板（電子装置）の実装面積を、絶縁基板の上面または下面の面積とほぼ同じ程度にまで小さくすることができる。   In the electronic component mounting board of the present invention, the other end portion of the external lead terminal 4 is located on the inner side of the side surface of the insulating substrate 1. By mounting the other end portion of the external lead terminal 4 on the inner side of the side surface of the insulating substrate 1, the mounting area of the electronic component mounting board (electronic device) when the other end portion is connected to the external electric circuit and mounted. The area of the upper or lower surface of the insulating substrate can be reduced to almost the same extent.

このように外部リード端子４の他端部を絶縁基板１の側面よりも内側に位置させる場合、他端部の先端位置は、平面視で絶縁基板１の側面から３ｍｍ以内とすることが好ましい。外部リード端子４の他端部の先端位置が絶縁基板１の側面から３ｍｍよりも内側に入ってしまうと、外部リード端子４を外部電気回路に接続するときの位置合わせが難しくなり、外部リード端子４を対応する外部電気回路の所定部位に接続することが難しくなる傾向がある。   Thus, when the other end portion of the external lead terminal 4 is positioned inside the side surface of the insulating substrate 1, the tip position of the other end portion is preferably within 3 mm from the side surface of the insulating substrate 1 in plan view. If the tip of the other end portion of the external lead terminal 4 enters more than 3 mm from the side surface of the insulating substrate 1, it is difficult to align the external lead terminal 4 when connecting to the external electric circuit. It tends to be difficult to connect 4 to a predetermined part of the corresponding external electric circuit.

また、外部リード端子４のうち一端部と他端部との間の中央部が斜め下方に外側に向かって延びるようにするには、外部リード端子４をパッド３に接続する前に、あらかじめ一端部と他端部との間の中央部となる部位を下方に向けて折り曲げておく方法や、外部リード端子４をパッド３に接続した後に、外部リード端子４の他端部が絶縁基体１の側面よりも内側に位置するように、外部リード端子４の中央部に曲げ加工を施す方法等を用いることができる。   Further, in order for the central portion between the one end portion and the other end portion of the external lead terminal 4 to extend obliquely downward and outward, before the external lead terminal 4 is connected to the pad 3, A method of bending the central portion between the first portion and the other end portion downward, or after connecting the external lead terminal 4 to the pad 3, the other end portion of the external lead terminal 4 is connected to the insulating base 1. For example, a method of bending the central portion of the external lead terminal 4 so as to be located inside the side surface can be used.

なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更は可能である。例えば、外部リード端子４の露出表面にニッケル，金等のめっき層を被着させて、外部リード端子４の耐食性を向上させたり、半田等の接続強度をより強くするようにしたりしてもよい。   The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, a plating layer such as nickel or gold may be applied to the exposed surface of the external lead terminal 4 to improve the corrosion resistance of the external lead terminal 4 or to increase the connection strength of solder or the like. .

本発明の電子部品搭載用基板の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the board | substrate for electronic component mounting of this invention.

符号の説明Explanation of symbols

１・・・絶縁基板
２・・・配線層
３・・・パッド
４・・・外部リード端子
５・・・電子部品
６・・・電子部品搭載用基板 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Wiring layer 3 ... Pad 4 ... External lead terminal 5 ... Electronic component 6 ... Substrate for electronic component mounting

Claims (1)

上面に電子部品が搭載される搭載部を有する絶縁基板と、該絶縁基板の前記搭載部の周辺から前記絶縁基板の下面にかけて導出された配線層と、該配線層に電気的に接続されて前記絶縁基板の下面に形成された複数の外部接続用のパッドと、該パッドに一端部が前記パッドの表面に沿って接合されているとともに他端部が外部電気回路に電気的に接続される外部リード端子とを具備しており、該外部リード端子は、前記一端部と前記他端部との間の中央部が斜め下方の外側に向かって延びるとともに前記他端部が前記絶縁基板の下面に平行とされており、前記他端部が前記絶縁基板の側面よりも内側に位置していることを特徴とする電子部品搭載用基板。 An insulating substrate having a mounting portion on which an electronic component is mounted on an upper surface; a wiring layer led out from a periphery of the mounting portion of the insulating substrate to a lower surface of the insulating substrate; and electrically connected to the wiring layer and A plurality of pads for external connection formed on the lower surface of the insulating substrate, and an external device having one end joined to the pad along the surface of the pad and the other end electrically connected to an external electric circuit A lead terminal, and the external lead terminal has a central portion between the one end and the other end extending obliquely downward and the other end on the lower surface of the insulating substrate. The electronic component mounting board, wherein the board is parallel and the other end portion is located inside the side surface of the insulating substrate.
JP2003303722A 2003-08-27 2003-08-27 Substrate for mounting electronic component Withdrawn JP2005072505A (en)

Priority Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009506534A (en) * 2005-08-25 2009-02-12 マイクロン テクノロジー， インク． Land grid array semiconductor device package, assembly including the package, and manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009506534A (en) * 2005-08-25 2009-02-12 マイクロン テクノロジー， インク． Land grid array semiconductor device package, assembly including the package, and manufacturing method
JP4919103B2 (en) * 2005-08-25 2012-04-18 マイクロン テクノロジー， インク． Land grid array semiconductor device package, assembly including the package, and manufacturing method
US8796836B2 (en) 2005-08-25 2014-08-05 Micron Technology, Inc. Land grid array semiconductor device packages
US9355992B2 (en) 2005-08-25 2016-05-31 Micron Technology, Inc. Land grid array semiconductor device packages

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