JP2005072091A - High frequency electronic component and transmitter/receiver - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance reliability and productivity by detecting failure of joint between a conductive cap and a ground electrode surely. <P>SOLUTION: An electronic component 9, e.g. a filter, is mounted on the surface 2A of an insulating substrate 2. A ground electrode 11 consisting of four separate electrodes 12 is provided on the insulating substrate 2 and the separate electrodes 12 are arranged while being insulated from each other. Furthermore, a conductive cap 13 bonded to each separate electrode 12 while covering the electronic component 9 is fixed to the surface 2A of the insulating substrate 2. Resistance between the conductive cap 13 and the separate electrode 12 can be measured for each separate electrode 12 and incomplete connection thereof can be detected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a high frequency electronic component suitably used for mounting, for example, an electronic component element for processing a high frequency signal and packaging it on a mother board or the like, and a transmission / reception apparatus using the high frequency electronic component.

  Generally, as a high-frequency electronic component, an electronic component element having a spatial electromagnetic field spread such as a filter and a resonator is mounted on the surface of the insulating substrate, and the insulating substrate covers the electronic component element. Is known in which a conductive cap made of a metal material or the like is provided as a shield member on the surface (see, for example, Patent Document 1). In such a conventional technique, the ground electrode is provided on the insulating substrate, and the conductive cap is connected to the ground electrode at a plurality of locations by soldering or the like.

Japanese Patent Laid-Open No. 9-307397

  By the way, in the above-described prior art, the conductive cap is electrically grounded via the ground electrode in order to shield the electromagnetic field between the electronic component element and the outside. However, the impedance (ground impedance) between the conductive cap and the ground electrode varies depending on the number of connection points between the conductive cap and the ground electrode and the resistance value of the connection point. At this time, since the electronic component element having a spatial electromagnetic field spread such as a filter is mounted on the substrate, if the impedance between the conductive cap and the ground electrode changes, the electrical characteristics of the electronic component element ( For example, the pass band and the pass gain also change. In particular, when the frequency of the signal processed by the electronic component element increases, such a change in electrical characteristics tends to increase.

  For this reason, since the ground impedance of the conductive cap affects the electrical characteristics of the electronic component element, it is necessary to manage the resistance value between the conductive cap and the ground electrode at the time of shipment. However, in the prior art, there are a plurality of connection points between the conductive cap and the ground electrode on the substrate, but since the plurality of connection points are electrically connected in the substrate, the resistance value of each connection point is determined. It could not be measured. As a result, the conventional technique has a problem that a connection portion failure (initial failure) cannot be detected by inspection at the time of shipment, and reliability is lowered. In addition, since it is impossible to identify a defective portion where a connection failure or the like has occurred, it is difficult to analyze the cause of the failure, and it is not possible to repair only the defective portion, which tends to reduce productivity.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to reliably detect a defect in a connection portion between a conductive cap and a ground electrode, and to improve reliability and productivity. An object of the present invention is to provide a high-frequency electronic component capable of improving the frequency and a transceiver device using the high-frequency electronic component.

  In order to solve the above-described problems, the present invention covers an insulating substrate, an electronic component element provided on the surface of the insulating substrate, a ground electrode provided on the insulating substrate, and the electronic component element. The present invention is applied to a high-frequency electronic component including a conductive cap provided on the surface of the insulating substrate and connected to the ground electrode at a plurality of locations.

  A feature of the configuration adopted by the invention of claim 1 is that the ground electrode is composed of a plurality of separation electrodes that are separated from each other at locations connected to the conductive cap, and each of the separation electrodes includes: And a conductive portion connected to the conductive cap and a connection portion connected to the conductive portion and connected to the ground on the motherboard side.

  According to a second aspect of the present invention, the conducting portion of the separation electrode is constituted by a surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is connected to the surface electrode and is connected to the end surface of the insulating substrate. It is comprised by the provided end surface electrode.

  According to a third aspect of the present invention, the conducting portion of the separation electrode is constituted by a surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is connected to the surface electrode and on the back surface of the insulating substrate. The back electrode is provided.

  According to a fourth aspect of the present invention, the conducting portion and the connecting portion of the separation electrode are constituted by end face electrodes provided on the end face of the insulating substrate.

  In the invention of claim 5, the insulating substrate is formed using a ceramic material.

  In the invention of claim 6, the insulating substrate is formed using a resin material.

  In the invention of claim 7, the insulating substrate is constituted by a multilayer substrate in which an insulating layer and an electrode layer are laminated.

  According to an eighth aspect of the present invention, an element ground electrode connected to the electronic component element and insulated from the separation electrode is provided on the back surface of the insulating substrate at a position facing the electronic component element.

  According to a ninth aspect of the present invention, the separation electrode is disposed on both ends of the conductive cap with the electronic component element interposed therebetween.

  Further, as in the invention of claim 10, the transmitting / receiving device may be configured using the high-frequency electronic component device according to the present invention.

  According to the first aspect of the present invention, since the plurality of separation electrodes are separated from each other at locations connected to the conductive cap, the resistance value between the conductive cap and each separation electrode is measured. By doing so, it is possible to individually detect the resistance value of each connection point. For this reason, the defect of a connection location can be detected reliably, the reliability of the apparatus can be improved, and only the location where the defect has occurred can be repaired, so that productivity can be improved.

  In addition, the conductive cap can be grounded by connecting the connecting portion of the separation electrode to the ground on the motherboard side, and the number of the separation electrode connected to the ground on the motherboard side can be selected to The ground impedance can be adjusted. Thereby, the electrical property of an electronic component element can be adjusted suitably.

  According to the invention of claim 2, the conducting portion of the separation electrode is constituted by the surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is connected to the surface electrode and provided on the end surface of the insulating substrate. Since the end face electrode is used, the conductive cap can be attached to the insulating substrate using the surface electrode, and the insulating board can be bonded to the mother board using the end face electrode. Further, since the insulating substrate and the mother board can be joined by soldering the end face electrodes, a solder fillet can be formed between them, and the joining strength can be increased.

  According to the invention of claim 3, the conducting portion of the separation electrode is constituted by a surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is connected to the surface electrode and provided on the back surface of the insulating substrate. Since the back electrode is configured, the conductive cap can be attached to the insulating substrate using the front electrode, and the insulating substrate can be bonded to the motherboard using the back electrode. Further, since it is not necessary to provide the end face electrode on the outer peripheral edge of the insulating substrate, it is not necessary to secure a portion for processing the end face electrode on the insulating substrate, and the insulating substrate can be downsized.

  According to invention of Claim 4, since the conduction | electrical_connection part of a separation electrode and the connection part were comprised by the end surface electrode provided in the end surface of the insulating board | substrate, a conductive cap can be attached to an insulating board | substrate using an end surface electrode. As compared with the case where the conductive cap is attached using the surface electrode, it is not necessary to secure a margin for attaching the conductive cap to the outer peripheral side of the insulating substrate, and the insulating substrate can be downsized. Further, since the insulating substrate and the mother board can be joined by soldering the end face electrodes, a solder fillet can be formed between them, and the joining strength can be increased.

  According to the invention of claim 5, since the insulating substrate is formed using a ceramic material, it is possible to reduce the loss of the insulating substrate, for example, with a high dielectric constant, and the electrical components of electronic component elements such as filters and resonators. The characteristics can be enhanced.

  According to the invention of claim 6, since the insulating substrate is formed using the resin material, the cost can be reduced as compared with the case where the ceramic material or the like is used. In addition, since the mother board is generally formed using a resin material, the coefficient of linear expansion between the insulating substrate and the mother board can be made closer, the stress acting on the solder joining between them can be reduced, and solder mounting Reliability can be improved.

  According to the invention of claim 7, since the insulating substrate is constituted by a multilayer substrate in which an insulating layer and an electrode layer are laminated, it is possible to easily perform complicated wiring and the like, and to make the entire electronic component multifunctional. High functionality can be achieved.

  According to the invention of claim 8, since the back surface of the insulating substrate is provided with the element ground electrode connected to the electronic component element and insulated from the separation electrode at a position facing the electronic component element, It is possible to reduce the inductance and stabilize the grounding of the component element and improve the heat dissipation.

  According to the ninth aspect of the present invention, since the separation electrode is disposed on both ends of the conductive cap with the electronic component element interposed therebetween, when the separation electrode is disposed only on one end of the conductive cap, other than the conductive cap. There is a possibility that the end side becomes an open end and acts as an unnecessary open stub. On the other hand, such inconvenience can be prevented and the electromagnetic field shielding property can be improved.

  According to the invention of claim 10, since the transmission / reception device is configured using the high-frequency electronic component device according to the present invention, it is possible to reliably detect and repair a connection failure between the conductive cap and the separation electrode. Overall reliability and productivity can be improved.

  Hereinafter, a high-frequency electronic component according to an embodiment of the present invention and a transmission / reception apparatus using the high-frequency electronic component will be described in detail with reference to the accompanying drawings.

  First, FIG. 1 to FIG. 5 show a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a package component as a high-frequency electronic component according to the present embodiment. The substrate 2, the signal electrode 8, the electronic component element 9, the ground electrode 11, the conductive cap 13, etc.

  Reference numeral 2 denotes an insulating substrate constituting the main body portion of the package component 1, and the insulating substrate 2 is formed in a substantially square shape using, for example, an insulating ceramic material, and the electronic component element 9 and the like are formed on the surface 2A thereof. In addition to being mounted, a back surface side element ground electrode 6 for the electronic component element 9 is formed on the back surface 2B. The insulating substrate 2 has four side end surfaces 2C extending perpendicularly to the front surface 2A and the back surface 2B, and end surface electrodes 12B and the like to be described later are formed on the end surface 2C.

  On the surface 2 A side of the insulating substrate 2, a surface-side element ground electrode 3 for grounding the electronic component element 9 is formed so as to cover substantially the entire surface, and a signal is input to the electronic component element 9. Two connection pads 4 for outputting are formed in a state of being insulated from the surface-side element ground electrode 3. The surface-side element ground electrode 3 is connected to element end face electrodes 5 provided at a total of six locations on the end face 2C of the insulating substrate 2, and the back face 2B of the insulating substrate 2 through the through holes 3A. Are connected to the back-side element ground electrode 6. The back-side element ground electrode 6 is disposed at a position facing the electronic component element 9 and covers the electronic component element 9 from the back surface 2B side of the insulating substrate 2.

  On the other hand, the connection pad 4 is connected to the input / output back electrode 7 provided on the back surface 2B of the insulating substrate 2 through the through hole 4A, and the front end side of the input / output back electrode 7 is insulative. It extends toward the end face 2C side of the substrate 2 and is connected to a signal electrode 8 comprising an end face electrode provided on the end face 2C.

  Reference numeral 9 denotes an electronic component element mounted on the surface 2A side of the insulating substrate 2. The electronic component element 9 is configured by an element having a spatial electromagnetic field spread, such as a planar filter or a resonator. Yes. The electronic component elements 9 such as a planar filter and a resonator are configured by, for example, a microstrip line, a circular electrode, a circular opening electrode, and the like, and input / output terminals thereof are connected to the connection pads 4 using bonding wires 10. At the same time, the ground terminal is joined to the surface-side element ground electrode 3. Thereby, the electronic component element 9 inputs or outputs a high frequency signal such as a microwave and a millimeter wave through the signal electrode 8 and performs various signal processing.

  Reference numeral 11 denotes a ground electrode provided on the insulating substrate 2, and the ground electrode 11 is constituted by four separation electrodes 12 provided in total, two on each of the left and right sides of the insulating substrate 2. These separation electrodes 12 are separated from each other in an insulated state, and are disposed on both left and right ends of a conductive cap 13 (to be described later) with the electronic component element 9 interposed therebetween. The separation electrode 12 includes a surface electrode 12A that forms a conducting portion provided on the surface 2A of the insulating substrate 2, and an end surface that forms a connection portion connected to the surface electrode 12A and provided on the end surface 2C of the insulating substrate 2. It is comprised by the electrode 12B.

  The surface electrode 12A extends toward the left and right end surfaces 2C of the insulating substrate 2 while being insulated from the surface-side element ground electrode 3 and the connection pad 4, and is also described later by soldering or the like. Bonded to the conductive cap 13. On the other hand, the end face electrode 12B forms an opening having a semicircular cross section, extends in the thickness direction of the insulating substrate 2, and is joined to a mother board 16 described later by soldering or the like.

  A conductive cap 13 is provided on the surface 2A of the insulating substrate 2 so as to cover the electronic component element 9, and the conductive cap 13 is formed on the lower surface side (insulating substrate 2 side) using, for example, a conductive metal material. It is formed in a substantially rectangular box shape having an opening, and protects the electronic component element 9 and performs electromagnetic shielding.

  The conductive cap 13 includes a top plate portion 13A having a substantially rectangular plate shape, and a frame-shaped peripheral wall portion 13B extending from the outer peripheral edge of the top plate portion 13A toward the insulating substrate 2. . And the site | part which opposes the separation electrode 12 (surface electrode 12A) among the front end side of the surrounding wall part 13B is joined to the surface electrode 12A using the solder 14, and the other site | part sandwiches insulation members 15, such as a resin material, on the surface It faces the side element ground electrode 3. As a result, the conductive cap 13 is connected to the ground 18 of the mother board 16 through the separation electrode 12, but is insulated from the surface-side element ground electrode 3.

  Reference numeral 16 denotes a mother board on which the package component 1 is mounted. The mother board 16 is formed of, for example, an insulating resin material, and a signal wiring pattern 17 made of a conductive thin film connected to the signal electrode 8 is provided on the surface thereof. In addition, a ground 18 made of a conductive thin film connected to the element end face electrode 5, the back side element ground electrode 6, and the separation electrode 12 is provided. The signal electrode 8 and the signal wiring pattern 17 are joined by soldering, and the element end face electrode 5, the separation electrode 12 and the ground 18 are also joined by soldering. A solder fillet is formed. On the other hand, the back-side element ground electrode 6 and the ground 18 are joined using solder bumps or the like.

  The package component 1 according to the present embodiment has the above-described configuration, and the operation thereof will be described next.

  First, the package component 1 is placed on the mother board 16, the signal electrode 8 is joined to the signal wiring pattern 17, and the element end face electrode 5, the back side element ground electrode 6, and the separation electrode 12 are joined to the ground 18. . As a result, the high-frequency signal transmitted through the signal wiring pattern 17 is input to the electronic component element 9 through the signal electrode 8, and various signal processing is performed by the electronic component element 9 including a filter, a resonator, and the like. The high-frequency signal after the signal processing is output toward the signal wiring pattern 17 of the mother board 16 through the other signal electrode 8.

  However, in the first embodiment, since the plurality of separation electrodes 12 are separated from each other at locations connected to the conductive cap 13, the separation electrodes 12 are separated from each other between the conductive cap 13 and each separation electrode 12. By measuring the resistance value, it is possible to individually detect the resistance value at each connection point. For this reason, it is possible to reliably detect an initial defective product due to a defective connection portion, and to improve the reliability of the package component 1.

  In addition, when the conductive cap 13 and the separation electrode 12 are joined by soldering, even when a connection failure occurs between the conductive cap 13 and any of the separation electrodes 12, for example, a tester By measuring the resistance value between the conductive cap 13 and each separation electrode 12 using, for example, the separation electrode 12 in which connection failure has occurred can be specified. For this reason, only the separation electrode 12 which has become a defective portion can be repaired by soldering again, and the yield and productivity can be improved.

  Further, since the conductive cap 13 is connected to the ground 18 of the mother board 16 using a plurality of separation electrodes 12 separated from each other in an insulated state, the conductive cap 13 is connected to the ground 18 on the mother board 16 side by appropriately setting the shape of the ground 18. The number of separation electrodes 12 can be selected. That is, in the first embodiment, the four separation electrodes 12 are all connected to the ground 18 of the mother board 16. However, as shown by a two-dot chain line in FIG. By removing the portion 19 facing the separation electrode 12, only two separation electrodes 12 can be connected to the ground 18.

  At this time, while the electrical characteristics such as the band and gain of the electronic component element 9 change according to the ground impedance of the conductive cap 13, the number of separation electrodes 12 connected to the ground 18 on the mother board 16 side is appropriately selected. By doing so, the ground impedance of the conductive cap 13 can be adjusted. As a result, by appropriately setting the shape of the ground 18 on the mother board 16 side, the electrical characteristics of the electronic component element 9 can be adjusted as appropriate, so that one type of package component 1 is used to support a plurality of electrical characteristics. It becomes possible.

  Further, since the conducting portion of the separation electrode 12 is constituted by the surface electrode 12A and the connection portion of the separation electrode 12 is constituted by the end face electrode 12B, the conductive cap 13 can be attached to the insulating substrate 2 using the surface electrode 12A. In addition, the insulating substrate 2 can be bonded to the mother board 16 using the end face electrode 12B. Further, since the insulating substrate 2 and the mother board 16 can be joined by soldering the end face electrode 12B, the joining state of the solder between the end face electrode 12B and the ground 18 can be easily confirmed visually. Connection failure can be detected. Further, a solder fillet can be formed between the end face electrode 12B and the ground 18, so that the bonding strength can be increased and the mounting reliability can be improved.

  Further, since the insulating substrate 2 is formed using a ceramic material, the insulating substrate 2 can be reduced in loss with a high dielectric constant, for example, and the electrical characteristics of the electronic component element 9 such as a filter and a resonator can be improved. Can do.

  Further, since the back surface side element ground electrode 6 is provided on the back surface 2B of the insulating substrate 2 so as to face the electronic component element 9, it is connected to the electronic component element 9 and provided on the front surface 2A of the insulating substrate 2. By connecting the surface side element ground electrode 3 using the through hole 3A (via), the inductance between the electronic component element 9 and the ground 18 can be reduced, and the grounding of the electronic component element 9 can be reduced. Stabilization and heat dissipation can be improved.

  Further, since the separation electrode 12 is disposed on both ends of the conductive cap 13 with the electronic component element 9 interposed therebetween, when the separation electrode 12 is disposed only on one end of the conductive cap 13, the other end of the conductive cap 13 is disposed. There is a possibility that the side becomes an open end and acts as an unnecessary open stub. On the other hand, such inconvenience can be prevented and the shielding performance of the electromagnetic field can be enhanced.

  In the first embodiment, the surface-side element ground electrode 3 and the conductive cap 13 are electrically insulated from each other. However, in the present invention, the individual separation electrodes 12 and the conductive caps 13 are used. It is only necessary to be able to measure the resistance value between the first electrode and the second electrode. For example, one conductive point (connection point) may be provided between the surface-side element ground electrode 3 and the conductive cap 13.

  Next, FIG. 6 thru | or FIG. 9 shows the 2nd Embodiment of this invention, The characteristics of this embodiment are comprised by the surface electrode provided in the surface of the insulating substrate, and the conduction | electrical_connection part of an isolation electrode, The connection portion of the separation electrode is constituted by a back electrode provided on the back surface of the insulating substrate. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  Reference numeral 21 denotes a package component as a high-frequency electronic component according to the present embodiment. The package component 21 includes an insulating substrate 22, a signal electrode 25, an electronic component element 9, a ground electrode 26, a conductive cap 13, and the like which will be described later. Has been.

  Reference numeral 22 denotes an insulating substrate that constitutes a main body portion of the package component 21. The insulating substrate 22 has a rectangular surface 22A and a back surface 22B in substantially the same manner as the insulating substrate 2 according to the first embodiment. Four side end faces 22C are formed on the outer peripheral side.

  23 is a surface-side element ground electrode formed on the surface 22A of the insulating substrate 22. The surface-side element ground electrode 23 is insulated in substantially the same manner as the surface-side element ground electrode 3 according to the first embodiment. The surface 22A of the conductive substrate 22 is covered over substantially the entire surface. The front-side element ground electrode 23 is connected to the back-side element ground electrode 24 provided on the rear face 22B of the insulating substrate 22 through the through hole 23A. The back-side element ground electrode 24 is disposed at a position facing the electronic component element 9 and covers the electronic component element 9 from the back surface 22B side of the insulating substrate 22.

  Reference numeral 25 denotes two signal electrodes composed of element back electrodes provided on the back surface 22B of the insulating substrate 22. The signal electrodes 25 are connected to the front surface 22A of the insulating substrate 22 through the through holes 4A. It is connected to the pad 4 for use.

  Reference numeral 26 denotes a ground electrode provided on the insulating substrate 22, and the ground electrode 26 is constituted by four separation electrodes 27 provided in total, two on each of the left and right sides of the insulating substrate 22. These separation electrodes 27 are separated from each other while being insulated from each other in substantially the same manner as the separation electrode 12 according to the first embodiment, and the left and right sides of the conductive cap 13 are sandwiched between the electronic component elements 9. It is arranged on both ends. In addition, the separation electrode 27 is provided on the back surface 22B of the insulating substrate 22 which is connected to the surface electrode 27A via the through hole 27B and the surface electrode 27A forming a conduction portion provided on the surface 22A of the insulating substrate 22. And a back surface electrode 27C forming a connecting portion.

  The surface electrode 27A is insulated from the surface-side element ground electrode 23 and the connection pad 4 and joined to the conductive cap 13 by soldering or the like, and the back electrode 27C is soldered or the like to a mother board (not shown). ).

  Thus, the package component 21 according to the present embodiment configured as described above can obtain substantially the same operational effects as the package component 1 of the first embodiment. In particular, in the present embodiment, the conducting portion of the separation electrode 27 is constituted by the surface electrode 27A, and the connection portion of the separation electrode 27 is constituted by the back electrode 27C. Therefore, the conductive cap 13 is insulated using the surface electrode 27A. The insulating substrate 22 can be attached to the motherboard using the back electrode 27C. Further, since it is not necessary to provide an end face electrode on the outer peripheral edge of the insulating substrate 22, it is not necessary to secure a portion for processing the end face electrode on the insulating substrate 22, and the insulating substrate 22 can be downsized. In addition, the solder does not protrude (expand) from the end face 22C of the insulating substrate 22, and the mounting area of the package component 21 can be reduced.

  Next, FIGS. 10 to 14 show a third embodiment. The feature of this embodiment is that the conduction part and the connection part of the separation electrode are constituted by end face electrodes provided on the end face of the insulating substrate. It is in. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  Reference numeral 31 denotes a package component as a high-frequency electronic component according to the present embodiment. The package component 31 includes an insulating substrate 32, a signal electrode 8, an electronic component element 9, a ground electrode 33, a conductive cap 35, and the like, which will be described later. Has been.

  Reference numeral 32 denotes an insulating substrate constituting the main body portion of the package component 31. The insulating substrate 32 has a rectangular surface 32A and a back surface 32B in substantially the same manner as the insulating substrate 2 according to the first embodiment. Four side end surfaces 32C are formed on the outer peripheral side.

  Reference numeral 33 denotes a ground electrode provided on the insulating substrate 32, and the ground electrode 33 is constituted by four separation electrodes 34 provided in total, two on each of the left and right sides of the insulating substrate 32. These separation electrodes 34 are separated from each other while being insulated from each other in substantially the same manner as the separation electrode 12 according to the first embodiment, and left and right of a conductive cap 35 to be described later with the electronic component element 9 interposed therebetween. It is arranged on both ends of the direction. The separation electrode 34 is composed of an end face electrode provided on the end face 32C of the insulating substrate 32, and forms a conducting portion connected to the conductive cap 35 and also a connecting portion connected to the ground of the motherboard. .

  The separation electrode 34 is insulated from the surface-side element ground electrode 3 and the connection pad 4 and joined to the conductive cap 35 by soldering or the like, and also joined to a mother board (not shown) by soldering or the like. Is.

  A conductive cap 35 is provided on the surface 32A of the insulating substrate 32 so as to cover the electronic component element 9, and the conductive cap 35 is substantially rectangular in the same manner as the conductive cap 13 according to the first embodiment. A plate-shaped top plate portion 35A and a frame-shaped peripheral wall portion 35B extending from the peripheral side of the top plate portion 35A toward the insulating substrate 2 are formed in a substantially rectangular box shape.

  In addition, a protrusion 36 is formed at a portion corresponding to the separation electrode 34 on the distal end side of the peripheral wall 35 </ b> B, and the protrusion 36 is joined to the separation electrode 34 using a solder 37. On the other hand, the distal end side of the peripheral wall portion 35B is separated from the surface 32A in a state of floating from the surface 32A of the insulating substrate 32, and a gap is formed between the peripheral wall portion 35B and the insulating substrate 32. Thereby, the conductive cap 35 is insulated from the signal electrode 8 and the like.

  Thus, the package component 31 according to the present embodiment configured as described above can obtain substantially the same effects as the package component 1 according to the first embodiment. In particular, in this embodiment, since the conducting portion and the connecting portion of the separation electrode 34 are constituted by the end face electrodes provided on the end face 32C of the insulating substrate 32, the conductive cap is formed by using the separation electrode 34 composed of the end face electrodes. 35 can be attached to the insulating substrate 32, and it is necessary to secure a margin for attaching the conductive cap 35 to the outer peripheral side of the insulating substrate 32 as compared with the case where the conductive cap 35 is attached using the surface electrode. Insulating substrate 32 can be reduced in size. In addition, since the insulating substrate 32 and the mother board can be joined by soldering the separation electrode 34, a solder fillet can be formed between them, and the joining strength can be increased.

  Next, FIG. 15 shows a fourth embodiment according to the present invention. The feature of this embodiment is that a communicator device as a transmitting / receiving device is configured using a package component as a high frequency electronic component. .

  41 is a communication device according to the present embodiment. The communication device 41 includes, for example, a signal processing circuit 42, a package component 43 that is connected to the signal processing circuit 42 and transmits a high-frequency signal, and a high-frequency signal. A package component 44 as a down-converter for receiving, and the package components 43 and 44 are constituted by any of the package components according to the first to third embodiments, for example, and are connected to the antenna via the antenna duplexer 45. 46.

  In the transmission package component 43, a mixer 47, a band-pass filter 48, and a power amplifier 49 as electronic component elements are connected in series with each other, and the mixer 47, the band-pass filter 48, and the power amplifier 49 are covered. A conductive cap (not shown) is provided. A band pass filter 50 and an amplifier 51 are connected in series between the mixer 47 and the output side of the signal processing circuit 42.

  On the other hand, in the receiving package component 44, a band pass filter 52, a low noise amplifier 53, and a mixer 54 as electronic component elements are connected in series with each other, and the band pass filter 52, the low noise amplifier 53, and the mixer 54 are connected to each other. A conductive cap (not shown) is provided so as to cover the surface. A band pass filter 55 and an amplifier 56 are connected in series between the mixer 54 and the input side of the signal processing circuit 42. An oscillator 57 is connected to the mixers 47 and 54.

  The communication device according to the present embodiment has the above-described configuration, and the operation thereof will be described next.

  First, at the time of transmission, the intermediate frequency signal (IF signal) output from the signal processing circuit 42 is amplified by the amplifier 51 and input to the mixer 47 after unnecessary signals are removed by the band pass filter 50. At this time, the mixer 47 multiplies the intermediate frequency signal and the carrier wave from the oscillator 57 and upconverts the signal to a high frequency signal (RF signal). The high-frequency signal output from the mixer 47 is transmitted from the antenna 46 through the antenna duplexer 45 after unnecessary signals are removed by the band-pass filter 48, amplified to transmission power by the power amplifier 49. The

  On the other hand, at the time of reception, the high frequency signal received from the antenna 46 is input to the band pass filter 52 via the antenna duplexer 45. As a result, unnecessary signals are removed from the high-frequency signal by the band-pass filter 52, and then amplified by the low-noise amplifier 53 and input to the mixer 54. At this time, the mixer 54 multiplies the high-frequency signal and the carrier wave from the oscillator 57 and down-converts it to an intermediate frequency signal. An unnecessary signal is removed from the intermediate frequency signal output from the mixer 54 by the band pass filter 55, amplified by the amplifier 56, and then input to the signal processing circuit 42.

  Thus, according to the present embodiment, since the communication device can be configured using the package parts 43 and 44, the connection failure between the conductive caps and the separation electrodes (both not shown) of the package parts 43 and 44 is ensured. Therefore, the reliability and productivity of the entire communication device can be improved.

  In the fourth embodiment, the case where the package parts 43 and 44 according to the present invention are applied to the communication device 41 as a transmission / reception device has been described as an example. However, the transmission / reception device is applied to, for example, a radar device. May be.

  In the first to third embodiments, the insulating substrates 2, 22, and 32 are formed using a ceramic material. However, as in the first modification shown in FIG. The substrate 2 ′ may be formed using a resin material.

  In this case, the cost can be reduced compared to the case where a ceramic material or the like is used. Further, since the mother board is generally formed using a resin material, the coefficient of linear expansion between the insulating substrate 2 'and the mother board can be brought close, the stress acting on the solder joining them can be reduced, and the solder can be reduced. The mounting reliability can be improved.

  Further, for example, as in the second modification shown in FIG. 17, the insulating substrate 2 ″ may be formed of a multilayer substrate in which an insulating layer and an electrode layer are laminated.

  In this case, complicated wiring and the like can be easily performed by the electrode layers in the multilayer substrate, so that the entire electronic component can be multifunctional and highly functional.

  In the first to third embodiments, the ground electrodes 11, 26, 33 are constituted by the four separation electrodes 12, 27, 34. However, the ground electrode is constituted by a plurality of separation electrodes. The ground electrode may be constituted by two, three, or five or more separation electrodes.

  Further, in the first to third embodiments, the connection pads 4 of the insulating substrates 2, 22, and 32 and the electronic component elements 9 are connected using the bonding wires 10. The mounting method may be solder mounting, flip chip mounting, or the like, and is not limited to a specific mounting method. Further, the shape of the conductive caps 13 and 35, the presence or absence of sealing, and the connection method (conduction method) between the conductive caps 13 and 35 and the separation electrodes 12, 27 and 34 are not limited to specific shapes and methods. Absent.

  In the first to third embodiments, the electronic component element 9 separate from the insulating substrates 2, 22, and 32 is mounted on the insulating substrates 2, 22, and 32. When an electronic component element such as a strip line, a planar filter composed of a circular electrode, or a resonator is provided, a microstrip line or the like (electronic component element) may be formed integrally with an insulating substrate.

It is a perspective view which shows the package components by 1st Embodiment with a motherboard. It is a top view which shows the package components by 1st Embodiment. It is a bottom view which shows the package components by 1st Embodiment. It is sectional drawing which shows the package components seen from the arrow IV-IV direction in FIG. It is sectional drawing which shows the package components seen from the arrow VV direction in FIG. It is a top view which shows the package components by 2nd Embodiment. It is a bottom view which shows the package components by 2nd Embodiment. It is sectional drawing which shows the package components seen from the arrow VIII-VIII direction in FIG. It is sectional drawing which shows the package components seen from the arrow IX-IX direction in FIG. It is a top view which shows the package components by 3rd Embodiment. It is a bottom view which shows the package components by 3rd Embodiment. It is sectional drawing which shows the package components seen from the arrow XII-XII direction in FIG. It is sectional drawing which shows the package components seen from the arrow XIII-XIII direction in FIG. It is a side view which shows the package components seen from the arrow XIV-XIV direction in FIG. It is a block diagram which shows the communication apparatus by 4th Embodiment. It is sectional drawing of the same position as FIG. 5 which shows the package components by a 1st modification. It is sectional drawing of the same position as FIG. 5 which shows the package components by a 2nd modification.

Explanation of symbols

1, 21, 31, 43, 44 Package parts 2, 22, 32, 2 ', 2 "Insulating substrate 2A, 22A, 32A Front surface 2B, 22B, 32B Back surface 2C, 22C, 32C End surface 6, 24 Ground electrode 9 Electronic component element 11, 26, 33 Ground electrode 12, 27, 34 Separation electrode 12A, 27A Surface electrode (conduction part)
12B End face electrode (connection part)
16 Motherboard 18 Ground 27C Back electrode (connection part)

Claims (10)

An insulating substrate, an electronic component element provided on the surface of the insulating substrate, a ground electrode provided on the insulating substrate, and a ground electrode provided on the surface of the insulating substrate so as to cover the electronic component element In high-frequency electronic components consisting of conductive caps connected to electrodes at multiple locations,
The ground electrode is composed of a plurality of separation electrodes separated in a state of being insulated from each other at each location connected to the conductive cap,
Each of the separation electrodes is composed of a conductive portion connected to the conductive cap and a connection portion connected to the conductive portion and connected to the ground on the motherboard side.   The conducting portion of the separation electrode is constituted by a surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is constituted by an end surface electrode connected to the surface electrode and provided on the end surface of the insulating substrate. The high frequency electronic component according to claim 1.   The conducting portion of the separation electrode is constituted by a surface electrode provided on the surface of the insulating substrate, and the connecting portion of the separation electrode is constituted by a back electrode provided on the back surface of the insulating substrate connected to the surface electrode. The high frequency electronic component according to claim 1.   2. The high-frequency electronic component according to claim 1, wherein the conduction portion and the connection portion of the separation electrode are constituted by end face electrodes provided on an end face of the insulating substrate.   The high-frequency electronic component according to claim 1, 2, 3, or 4, wherein the insulating substrate is formed using a ceramic material.   The high frequency electronic component according to claim 1, 2, 3, or 4, wherein the insulating substrate is formed using a resin material.   The high-frequency electronic component according to claim 1, 2, 3, or 4, wherein the insulating substrate is a multilayer substrate in which an insulating layer and an electrode layer are laminated.   An element ground electrode connected to the electronic component element at a position facing the electronic component element and insulated from the separation electrode is provided on the back surface of the insulating substrate. 5. The electronic component for high frequency according to 5, 6 or 7.   9. The high-frequency electronic component according to claim 1, 2, 3, 4, 5, 6, 7 or 8, wherein the separation electrode is disposed on both ends of the conductive cap with the electronic component element interposed therebetween.   A transmission / reception device using the high-frequency electronic component according to claim 1.

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