JP2005062170A - Electrical connection structure of three dimensional body and integrated body using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to connect electrically a plurality of three dimensional bodies each other easily for sure and with high accuracy. <P>SOLUTION: A connection structure is provided which connects with the connection surface of the three dimensional body 10 in an opposite state. A strain gage 30 and a wiring pattern 40 which is connected electrically are formed at a functional element formation surface 22 on the three dimensional body 10. The wiring pattern 40 is introduced to a ridge line 21 which is formed by the functional element forming surface 22 and a wiring surface 23 as the connection surface having an adjoining relation, to form a first land 42. A second land 43 which extends with a predetermined dimension from the ridge line 21 is formed at a position corresponding to the first land 42 of the wiring surface 23. A cross linkage is performed on a conductive connection pad 50 which demonstrates a connection property by being pressurized mutually, when both lands 42, 43 are a connected state over the first and second lands 42, 43. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention has a rectangular parallelepiped shape, and an electrical connection structure of a three-dimensional body in which an electrical functional element such as a stress detection element represented by a strain gauge and various integrated circuits is attached at an appropriate place, and this structure. It relates to the aggregate used.

  Conventionally, a stress detection sensor of a structure as described in Patent Document 1 is known. This stress detection sensor includes a three-dimensional body having at least a rectangular parallelepiped shape made of a non-conductive material, and a strain gauge made of a metal resistance foil or a semiconductor element attached to each surface of the three-dimensional body. It is configured. Such a stress detection sensor is embedded in a structure for measuring internal stress, such as an axle of a vehicle. Then, by causing a predetermined arithmetic circuit to calculate a strain signal output via a signal line drawn from each strain gauge, it is possible to accurately detect the stress generated inside the structure. By using such a stress detection sensor, the detection accuracy is dramatically improved compared to the conventional stress detection method in which a strain gauge is attached to the surface of the structure. For example, when the stress detection sensor is applied to the axle of a vehicle Attention has been focused on the realization of highly accurate ABS (anti-lock braking system) control.

By the way, even if one stress detection sensor having a strain gauge attached to each surface of such a three-dimensional body can sufficiently perform its function, a plurality of stress detection sensors can be one-dimensionally arranged. By connecting to a long linear shape, connecting two-dimensionally and expanding in a plane, or connecting three-dimensionally and expanding in space, The obtained integrated body of stress detection sensors can detect internal stress more appropriately in accordance with the shape of the structure to be measured, and has the advantage that the detection power is improved geometrically. . An assembly of such stress detection sensors is disclosed in Patent Document 2.
Japanese Patent No. 2736395 Japanese Patent No. 3131642

  By the way, in Patent Document 1, the electrical connection of each three-dimensional body in the integrated body of stress detection sensors is described only as integrating the three-dimensional bodies, and there is no description regarding a specific connection method, They were connected by a known method based on the technology level at that time. In the known connection method, first, land portions of the wiring pattern on each surface are formed at each corner (ridge line portion) of the three-dimensional body, and a connection pad made of, for example, gold is laminated on the land portion. . Then, the three-dimensional connection pads connected to each other are connected to each other by subjecting them to high-temperature heat treatment in a state where they are in contact with each other.

  However, in such a conventional method for connecting a three-dimensional body, a plurality of stress detection sensors that are in contact with each other are heated to a high temperature, so that the gold constituting the connection pad and the land portion of the wiring pattern are formed. The formation and growth of an alloy with aluminum forms voids (holes) in the synthetic resin material constituting the three-dimensional body, the heated synthetic resin three-dimensional body deteriorates due to thermal corrosion, Furthermore, there is a problem that inconveniences such as an adverse effect on the electrical functional element mounted on the three-dimensional body occur.

  The present invention has been made to solve the above-described problems, and suppresses the formation of voids and thermal corrosion on a three-dimensional body, and an electrical functional element mounted on the three-dimensional body. Provided is a three-dimensional body electrical connection structure that can easily and securely connect a plurality of three-dimensional bodies to each other with high precision by preventing as much as possible the adverse effects of the structure, and an integrated body using this structure The purpose is to do.

  The electrical connection structure for a three-dimensional body according to claim 1 includes a three-dimensional body having a substantially rectangular parallelepiped and having an electrical functional element in place at least on a surface made of a non-conductive material and another three-dimensional body. An electrical connection structure of a three-dimensional body that is electrically connected in an opposing state at joint surfaces that are joined to each other, and is electrically connected to the electrical functional element on a first surface of the three-dimensional body. A conductive wiring pattern is formed, and the wiring pattern is led to a ridge formed by the second surface as the bonding surface adjacent to the first surface, and the first land is formed. A second land extending from the ridge line by a predetermined dimension at a position corresponding to the first land on the second surface, and the first and second lands. Are pressed against each other in close contact with both lands. Connection layer that serves the bonding performance by is characterized in that it is crosslinked.

  The three-dimensional body electrical connection structure according to claim 2 is the three-dimensional body electrical connection structure according to claim 1, wherein the other three surfaces excluding the second surface adjacent to the first surface. A third land corresponding to the first land is formed on a third surface which is at least one surface of the first land, and a fourth land corresponding to the second land is formed on the first surface. A connection layer made of the same material as that of the connection layer is provided across the third and fourth lands.

  The electrical connection structure for a three-dimensional body according to claim 3 is the electrical connection structure for a three-dimensional body according to claim 1 or 2, wherein the connection layer has at least a thickness dimension of the electrical functional element. It is characterized by being thickly dimensioned.

  The three-dimensional body electrical connection structure according to claim 4 is the three-dimensional body electrical connection structure according to any one of claims 1 to 3, wherein the wiring pattern is made of any of aluminum, nickel, and copper. The connecting layer is formed of gold or an indium-tin alloy.

  The electrical connection structure for a three-dimensional body according to claim 5 is the electrical connection structure for a three-dimensional body according to any one of claims 1 to 4, wherein each surface of the three-dimensional body is made of an insulating material. The protective layer is laminated.

  The three-dimensional body electrical connection structure according to claim 6 is the three-dimensional body electrical connection structure according to claim 5, wherein the protective layer is formed of silicon oxide or silicon nitride. Is.

  The invention according to claim 7 is the electrical connection structure of the three-dimensional body according to any one of claims 1 to 6, wherein a conductive adhesive layer is laminated on the connection layer. Is.

  The electrical connection structure for a three-dimensional body according to claim 8 is the electrical connection structure for a three-dimensional body according to any one of claims 1 to 7, wherein a conductive adhesive is included on a surface of the connection layer. The particulate adhesive holding spheres to be transferred are printed or printed.

  The electrical connection structure of the three-dimensional body according to claim 9 is the electrical connection structure of the three-dimensional body according to claim 8, wherein the adhesive holding sphere is crushed by applying pressure or vibration. It is a feature.

  The electrical connection structure for a three-dimensional body according to claim 10 includes a three-dimensional body having a substantially rectangular parallelepiped and having an electrical functional element in place at least on a surface made of a non-conductive material and another three-dimensional body. An electrical connection structure of a three-dimensional body that is electrically connected in an opposing state at joint surfaces that are joined to each other, and is electrically connected to the electrical functional element on a first surface of the three-dimensional body. A conductive wiring pattern is formed, and the wiring pattern is led to a ridge formed by the second surface as the bonding surface adjacent to the first surface, and the first land is formed. A second land extending from the ridge line by a predetermined dimension at a position corresponding to the first land on the second surface, and the first and second lands. Are pressed against each other in close contact with both lands. As a result, the connection layer exhibiting the bonding performance is cross-linked, and fine particles of the adhesive holding spheres containing the conductive adhesive are transferred or printed on the surface of the connection layer. It is characterized by being crushed by applying pressure or vibration.

  An integrated body according to claim 11 is an integrated body obtained by integrating a plurality of the three-dimensional bodies using the electrical connection structure according to any one of claims 1 to 10, wherein the first tertiary A connection layer of another three-dimensional body is brought into contact with the connection layer of the original body and pressed together so that a plurality of three-dimensional bodies are integrated and formed in at least a two-dimensional direction. is there.

  An integrated body using the electrical connection structure of a three-dimensional body according to claim 12, wherein the integrated body using the electrical connection structure of the three-dimensional body according to claim 11, Further, a conductive adhesive layer is interposed between the connection layer of another three-dimensional body.

  An assembly using the three-dimensional body electrical connection structure according to claim 13 is an assembly using the three-dimensional body electrical connection structure according to claim 12, wherein the conductive adhesive layer is in the form of fine particles. The adhesive holding sphere is included in the adhesive holding sphere, and the adhesive holding sphere is obtained by crushing by applying pressure or vibration while being transferred or printed on the connection layer. is there.

  The integrated body using the three-dimensional body electrical connection structure according to claim 14 is joined to each other in the integrated body using the three-dimensional body electrical connection structure according to any one of claims 11 to 13. An insulating material is filled between the one three-dimensional body and the other three-dimensional body.

  The integrated body using the three-dimensional body electrical connection structure according to claim 15 is an integrated body using the three-dimensional body electrical connection structure according to claim 14, wherein the electrical functional element has a predetermined structure. A stress detecting element for detecting stress or strain acting on a body, wherein the insulating material has a mechanical strength equivalent to that of the three-dimensional body.

  An integrated body using the three-dimensional body electrical connection structure according to claim 16 is an integrated body using the three-dimensional body electrical connection structure according to claim 14, wherein the electrical functional element has a predetermined structure. A stress detection element for detecting stress or strain acting on a body, wherein the insulating material has rigidity capable of transmitting stress acting on the predetermined structure.

  According to the electrical connection structure of a three-dimensional body according to claim 1, the second surface which is a joint surface of one three-dimensional body and the second surface of another three-dimensional body are opposed to each other, When pressure is applied in the direction in which the three-dimensional bodies approach each other in a state where the respective facing connection layers are in contact with each other, the connection layer is formed of a material that exhibits bonding performance by being pressurized. By doing so, the contact layers that are in contact with each other are joined together, whereby the three-dimensional bodies are electrically connected to each other via the connection layers and are also structurally connected and integrated.

  In the state where the adjacent three-dimensional bodies are integrated, the signal output from the electrical functional element provided on the first surface of the one three-dimensional body is the wiring pattern, the first land at the tip thereof, and One and other three-dimensional bodies can communicate with each other, such as being transmitted to other three-dimensional bodies via a connection layer, and signals can be transmitted via these. Thus, the signal can be guided to a predetermined output end position.

  Then, the contact layers that are brought into contact with each other when the plurality of three-dimensional bodies are pressed in directions approaching each other at a temperature near room temperature, for example, are easily joined without using the conventional heat treatment. Because they are integrated with each other, there is no void or thermal corrosion caused by heat treatment of the three-dimensional body, and there is no adverse effect on the electrical functional elements mounted on the three-dimensional body. In doing so, the plurality of three-dimensional bodies are reliably electrically connected to each other with high accuracy.

  In claim 1, the presence or absence of an electrical functional element on the second surface, which is a joint surface of the three-dimensional body, is not particularly defined. This means that there is an electrical functional element on the second surface. This is not to specify that no electrical functional element is present on the second surface as well as the first surface. In other words, those provided with an electrical functional element on the second surface also belong to the technical scope of claim 1. The invention of claim 2 positively defines this.

  According to the electrical connection structure of the three-dimensional body according to claim 2, the first surface of the three-dimensional body provided with the electrical functional element functions as a joint surface, and thereby the three-dimensional bodies adjacent to each other. Since the facing surface is used as a mounting space for the electrical functional element, the mounting ratio of the electrical functional element for each three-dimensional body is improved, and the three-dimensional body can be used with multiple functions.

  According to the electrical connection structure for a three-dimensional body according to claim 3, since the mutual interference of the electrical functional elements mounted on the opposing surfaces is prevented between the three-dimensional bodies joined to each other, they interfere with each other. It is possible to avoid the adverse effects caused by this.

  According to the electrical connection structure of the three-dimensional body according to claim 4, aluminum, nickel, and copper are all suitable as a material for the wiring pattern, and the wiring pattern can be easily and reliably formed on the surface of the three-dimensional body. Can be made. In addition, even if gold and indium-bell alloys are not placed in such a high temperature atmosphere, they have the property of being bonded to each other by being pressed together, so they are arranged side by side in a substantially normal temperature atmosphere. By pressurizing each of the three-dimensional bodies toward each other, the three-dimensional bodies can be easily joined to each other through the connection layers. The workability of the connection work of the three-dimensional body can be improved.

  According to the electrical connection structure of the three-dimensional body according to claim 5, since the protective layer made of an insulating material is laminated on each surface of the three-dimensional body, the electrical functional element mounted on the surface and the wiring pattern And the like are protected against a force applied from the outside, and damage due to abrasion or the like can be reliably prevented.

  According to the invention described in claim 6, since both silicon oxide and silicon nitride can form a strong network-structured film by chemical bonding, the protective layer made of these has a three-dimensional body. The electrical functional element formed on the surface can be reliably protected.

  According to the electrical connection structure of the three-dimensional body according to claim 7, each connection layer that is in contact with each other in a state where the three-dimensional body is adjacent is bonded to each other by the conductive adhesive. The original body is more firmly integrated. In addition, it is possible to ensure conductivity between the connection layers facing each other with a conductive adhesive.

  According to the electrical connection structure of the three-dimensional body according to claim 8, the operation for causing the adhesive-holding sphere to be crushed by the adhesive-holding sphere sandwiched between the connection layers of the adjacent three-dimensional bodies. Since the conductive adhesive contained in the adhesive-holding sphere flows out and is interposed between the connection layers facing each other, the connection layers facing each other can be integrated by bonding. Can do. In addition, it is possible to ensure conductivity between the connection layers facing each other with a conductive adhesive.

  According to the electrical connection structure of the three-dimensional body according to claim 9, pressure or vibration is applied to the adhesive holding sphere sandwiched between the connection layers of the adjacent three-dimensional body via the connection layers. By performing the treatment, the adhesive-holding sphere can be easily crushed, and the conductive adhesive contained therein can be easily discharged.

  According to the three-dimensional body electrical connection structure of the tenth aspect, the same effects as the first, eighth, and ninth aspects of the invention can be obtained.

  According to the integrated body of claim 11, since the integrated body is formed by stacking a plurality of three-dimensional bodies in at least a two-dimensional direction, the three-dimensional body is shaped into the structure to be measured. In addition, it is possible to construct an aggregate that matches the structure by combining two-dimensionally or three-dimensionally, and this improves the geometric accuracy of detection accuracy that could not be obtained with a single three-dimensional body. As a result, the detection item or the detection range can be expanded.

  According to the integrated body of claim 12, the conductive adhesive layer interposed between the three-dimensional bodies facing each other realizes a more reliable bonding state between the adjacent three-dimensional bodies, and the three-dimensional body. An electrical connection between the bodies can be ensured.

  According to the integrated body according to claim 13, an operation for crushing the adhesive holding sphere in the adhesive holding sphere held between adjacent connection layers of the adjacent three-dimensional body, that is, pressure treatment or By applying the vibration applying treatment, the conductive adhesive contained in the adhesive holding sphere flows out and is interposed between the connection layers facing each other. Can be In addition, it is possible to ensure conductivity between the connection layers facing each other with a conductive adhesive.

  According to the integrated body of the fourteenth aspect, an electrical short circuit between the three-dimensional bodies can be prevented by the insulating material existing between the three-dimensional bodies adjacent to each other.

  According to the integrated body according to claim 15, the integrated body obtained by integrating the three-dimensional body by mounting a stress detecting element which is a kind of electrical functional element on the surface of the three-dimensional body, By embedding in a structure which is a stress measurement object, it functions as a stress detection sensor. Then, as an insulating material interposed between the three-dimensional bodies, for example, an epoxy resin such as an epoxy resin having mechanical strength equivalent to that of the three-dimensional body is used, so that the integrated body has a plurality of three-dimensional bodies. However, it is suitable as a stress detection sensor used under severe conditions.

  According to the integrated body of the sixteenth aspect, the three-dimensional body is integrated by mounting an electrical functional element formed on the surface of the three-dimensional body or a stress detecting element represented by a strain gauge as a part thereof. The integrated body obtained in this way functions as a stress detection sensor by embedding it in a structure which is a stress measurement object. As an insulating material interposed between the three-dimensional bodies, for example, an epoxy resin having a mechanical characteristic (rigidity) equivalent to that of the three-dimensional body or a predetermined structure (stress measurement object) By adopting, it is possible to prevent electrical short circuit between three-dimensional bodies adjacent to each other, and to transmit physical stress to multiple three-dimensional bodies stably and without generating residual stress. The detection accuracy can be greatly improved. In addition, the three-dimensional bodies as a plurality of stress detection sensors are integrated with each other by connecting via an insulating material having the same rigidity, so that the detection accuracy is improved and the detection value of each stress detection sensor Can be integrated and the detection capability can be greatly enhanced.

  1 and 2 are perspective views showing an embodiment of a three-dimensional body according to the present invention. FIG. 1 is a state before two three-dimensional bodies 10 are connected, and FIG. The state where the original body 10 is connected is shown. In the present embodiment, a so-called cubic sensor for a stress detection sensor is exemplified as the three-dimensional body 10. As shown in FIG. 1, a three-dimensional body 10 includes a three-dimensional body main body 20 having a rectangular parallelepiped shape, and a strain gauge (stress detecting element (electrical functional element) attached to a predetermined surface of the three-dimensional body main body 20. 30), the wiring pattern 40 drawn from the strain gauge 30 on the surface of the three-dimensional body main body 20, and the conductive state connected to the wiring pattern 40 formed so as to straddle the ridge line portion 21 of the three-dimensional body main body 20. And a conductive connection pad (connection layer) 50.

  In the present embodiment, the three-dimensional body 20 is a small body formed of a non-conductive material made of a hard synthetic resin such as polyethylene terephthalate or polyvinyl chloride. In the present embodiment, the three-dimensional body body 20 has a length of one side. A cubic shape in which is set to 1 mm to 5 mm is employed. The present invention is not limited to the three-dimensional body 20 having a cubic shape, and various shapes such as a flat rectangular parallelepiped shape can be employed.

  In addition, the present invention is not limited to the three-dimensional body 20 being made of a non-conductive material, but is made of a metal material such as stainless steel and the surface is covered with a coating made of a non-conductive material. It may be. As the coating, a coating made of silicon oxide or a coating made of silicon nitride is preferably used.

  Further, the present invention is not limited to the fact that the length of one side of the three-dimensional body main body 20 which is a small form is set to the above-mentioned dimensions, and various dimensions are set according to the use and situation. Can do.

  The in-device transport unit 20 is provided only for connection between the functional element forming surface 22 provided with the strain gauges 30 among the six surfaces and the other three-dimensional body main body 20 provided with no strain gauges 30. A wiring surface 23 provided with only the wiring pattern 40 (sometimes the wiring pattern 40 may not be provided) is set. In the example shown in FIG. 1, for the three-dimensional body 20 shown on the left side, functional element forming surfaces 22 are formed on three mutually orthogonal surfaces that can be visually recognized, and the remaining three surfaces hidden behind in FIG. The wiring surface 23 is set for each. In the three-dimensional body 10 shown on the right side in FIG. 1, the wiring surface 23 is set on the left side surface that can be visually recognized.

  In addition, this invention is not limited to not providing an electrical functional element in the wiring surface 23, You may provide a various electrical functional element according to a condition. Examples of such an electrical functional element include a noise removal circuit made of a semiconductor and an amplification circuit that amplifies a detection signal.

  The strain gauge 30 detects a slight deformation of the three-dimensional body main body 20 in response to a change in stress of the three-dimensional body 10 in a state where the three-dimensional body 10 is embedded in a predetermined structure, and outputs it as an electrical signal. It is made of a metal resistive foil or a semiconductor. In this embodiment, the strain gauge 30 includes a first strain gauge 31 arranged on a straight line connecting one vertex angle point of the functional element forming surface 22 and the vertex angle point facing the vertex angle point. The second strain gauge 32 is arranged on a straight line orthogonal to the first strain gauge 31 and passing through the center position of the functional element forming surface 22. By forming the strain gauge 30 in such a cross shape, it is possible to detect the stress generated in the direction parallel to the functional element formation surface 22 in the structure to be measured with high accuracy.

  The wiring pattern 40 electrically connects the tip portions of the first and second strain gauges 31 and 32 and the conductive connection pad 50, or one conductive connection pad 50 and another conductive connection pad 50. Are electrically connected without passing through the strain gauge 30, and are formed of a conductive material such as aluminum, nickel or copper.

  A land 41 (a first land 42 as a contact) is formed at a position facing the ridge line portion 21 of the wiring pattern 40, and a function adjacent to the functional element forming surface 22 on which the first land 42 is formed. Lands 41 corresponding to the first lands 42 (second lands 42 not connected to the wiring pattern 40) are also formed on the element forming surface 22 with the ridge line portion 21 in between (see FIG. 3).

  In the example shown in FIG. 1, four first and second lands 41 and 42 are provided per one ridge line portion 21, but each first and second land 41 and 42 per one ridge line portion 21. The number is not limited to four, but may be one or more, for example, two, three, or five or more, depending on the use and situation of the three-dimensional body 10. Furthermore, there may be a ridge line portion 21 in which neither of the first and second lands 41 and 42 is provided. Incidentally, in this embodiment, the 1st land 42 or the 2nd land 42 is provided in each surface of all the ridgeline part 21 positions. In this embodiment, the land 41 is formed wider than the wiring pattern 40 by using the same material as the wiring pattern 40.

  The conductive connection pad 50 is used when the three-dimensional bodies 10 are electrically and structurally connected to each other, and is formed on one surface of the three-dimensional body 20 with the ridge line portion 21 as a boundary. It is formed in an L shape in a side view so as to straddle the land 41 and the land 41 formed on the other surface.

  In the present embodiment, the conductive connection pad 50 is made of gold or indium-tin alloy. However, the present invention is not limited to the conductive connection pad 50 being gold or indium-tin alloy. In addition, various metal materials that are easily integrated by being pressed against each other with an appropriate pressure can be employed.

  Then, the conductive connection pad 50 is formed by using the metal material as a raw material and subjecting the three-dimensional body 20 to a known vapor deposition or plating process using each land 41 as a target.

  FIG. 3 is a partially cutaway enlarged perspective view showing an embodiment of the conductive connection pad 50, and FIG. 4 is a cross-sectional view showing an embodiment of the adhesive holding sphere 60 applied to the surface of the conductive connection pad 50. FIG. First, as shown in FIG. 3, particulate adhesive holding spheres 60 are provided on one surface in a laminated state on the surface of the conductive connection pad 50. The adhesive holding sphere 60 has a very small particle size of several μm to several tens of μm (approximately 5 μm in the present embodiment). As shown in FIG. 4, a predetermined material (for example, silica particles) having a spherical shape is used. ) And a known conductive adhesive 62 (for example, silver paste or carbon paste) sealed in the micro hollow sphere 61. In FIG. 3, the thickness of the material is exaggerated.

  The adhesive-holding sphere 60 is a predetermined material (usually silica particles) that constitutes the wall material (in this embodiment, the micro-hollow sphere 61) to the interface of the core material (in this embodiment, the conductive adhesive 62). ), And an interfacial reaction method in which a film is formed using a chemical reaction at the interface of the core material.

  Incidentally, the application of the adhesive holding sphere 60 to the surface of the conductive connection pad 50 is performed by a normal printing process (inkjet method, etc.) or transfer, or the adhesive holding sphere 60 is directed toward the surface of the adhesive holding sphere 60 to which an adhesive has been applied in advance. The adhesive holding sphere 60 is sprayed or applied.

  The adhesive holding sphere 60 is easily crushed by being pressurized at a predetermined pressure or given vibration, and the conductive adhesive 62 inside leaks out. The application of vibration may be performed by a predetermined vibrator, but it is very effective to supply ultrasonic waves to the three-dimensional body 10.

  FIG. 5 is an enlarged explanatory view of a main part of the three-dimensional body 10 for explaining the operation of the adhesive holding sphere 60. FIG. 5A shows that one three-dimensional body 10 faces the other three-dimensional body 10. (B) shows a state in which the conductive connection pads 50 of the three-dimensional bodies 10 are in contact with each other via the crushed adhesive holding spheres 60. In FIG. 5, the size of the adhesive holding sphere 60 is exaggerated for convenience of explanation.

  First, as shown in FIG. 5A, with one three-dimensional body 10 opposed to the other three-dimensional body 10, by pressing toward the other three-dimensional body 10 (sometimes pressing). However, since the hollow hollow sphere 61 of the adhesive holding sphere 60 is crushed and the conductive adhesive 62 in the inside leaks out, the electrically conductive connection opposite to each other is caused by the leaked conductive adhesive 62. The pads 50 are bonded to each other as shown in FIG. 5B, and the adjacent three-dimensional bodies 10 are thereby electrically connected to each other and structured by the adhesive force of the conductive adhesive 62. Will be integrated.

  A protective layer 70 may be laminated on the surface of the three-dimensional body 10 as shown in FIG. As the protective layer 70, a silicon oxide or silicon nitride film is employed. Note that the protective layer 70 is not formed on the conductive connection pad 50 in order to ensure conductivity. Due to the presence of the protective layer 70, the strain gauge 30 and the wiring pattern 40 formed on the surface of the three-dimensional body 20 are handled during the manufacturing process of the three-dimensional body 10 and during the assembly operation of the assembly 80 described later. Protected from external forces.

  And in this embodiment, as shown in (b) of FIG. 5, the conductive connection pads 50 facing each other are bonded to each other, so that the adjacent three-dimensional bodies 10 are connected to each other, An insulating material 71 is filled between the protective layers 70. As the insulating material 71, for example, an epoxy resin is preferably used. Specifically, a viscous epoxy resin is injected into the gap between the opposing three-dimensional body bodies 20. Since the three-dimensional body 10 is rigidly integrated and rigid enough to transmit stress by curing the epoxy resin after the injection, the obtained integrated body 80 described later is a stress detection sensor. It becomes suitable as.

  6A and 6B are perspective views showing four forms of the assembly 80 according to the present invention. FIG. 6A is a linear array assembly 81 in which the three-dimensional body 10 is 1 × 4, and FIG. The body 10 has 2 × 4 planar array assemblies 82, (c) the 3D body 10 has 2 × 2 plane array assemblies 83, and (d) the 3D body 10 has 2 × 2 × 2 Each three-dimensional array assembly 84 is shown.

  First, a linear array integrated body 81 shown in FIG. 6 (a) has a predetermined ultrasonic oscillator from four ends in the longitudinal direction to the four three-dimensional bodies 10 in a state where the four three-dimensional bodies 10 are arranged in series. It is formed by applying a pressurizing process with a predetermined pressure while applying mechanical fine vibrations by ultrasonic vibrations oscillated from. Such a linear array assembly 81 is suitable for internal stress detection when the structure to be measured is a long rod-like structure.

  Next, the planar array assembly 82 shown in FIG. 6B is formed by arranging two of the linear array assemblies 81 of FIG. 6A in the width direction. Such a planar array assembly 82 is suitable for detecting internal stress when the structure to be measured is a wide long material.

  Next, the planar array assembly 83 shown in FIG. 6C is formed by combining the four three-dimensional bodies 10 so as to form a square in plan view. The planar array assembly 83 is suitable for internal stress detection when the structure to be measured is a plate-like body.

  Further, the three-dimensional array assembly 84 shown in FIG. 6D is formed by stacking the planar array assembly 83 shown in FIG. Such a three-dimensional array assembly 84 is suitable for internal stress detection when the structure to be measured is a massive body.

  FIG. 6 shows only four examples of the integrated body 80, and it is possible to assemble the optimal integrated body 80 as appropriate according to the shape, usage status, size, and the like of the structure to be measured.

  As described above in detail, the electrical connection of the three-dimensional body 10 according to the present invention has a substantially rectangular parallelepiped shape, and at least a surface provided with a strain gauge 30 as an electrical functional element at an appropriate position is made of a non-conductive material. This is for electrically connecting the three-dimensional body 10 and the other three-dimensional body 10 in an opposing state at a joint surface that joins the three-dimensional body 10 to each other. 30 is formed, and the wiring pattern 40 is led to the ridge line portion 21 formed by the wiring surface 23 as a bonding surface adjacent to the functional element formation surface 22. The first land 42 is formed, the second land 43 extending from the ridge line portion 21 by a predetermined dimension is formed at a position corresponding to the first land 42 on the wiring surface 23, and the first land 42 is formed. And second land In close contact with both the lands 42 and 43 over a 2, 43, in which the conductive connection pads 50 which exhibits a bonding performance by being pressed together become crosslinked.

  Therefore, the functional element forming surface 22 or the wiring surface 23 that is a bonding surface of one three-dimensional body 10 and the functional element forming surface 22 or the wiring surface 23 that is a bonding surface of another three-dimensional body 10 are opposed to each other. When pressure is applied toward the three-dimensional bodies 10 toward each other in a state where the opposing conductive connection pads 50 are in contact with each other, the conductive connection pads 50 are bonded to each other by being pressurized. By being formed of the material to be exhibited, the contact layers that are in contact with each other are bonded to each other, whereby the three-dimensional bodies 10 are electrically connected to each other via the connection layers and are also structurally connected. be able to.

  Further, in a state where the adjacent three-dimensional bodies 10 are integrated, a signal output from the strain gauge 30 provided on the functional element forming surface 22 of the one three-dimensional body 10 is the wiring pattern 40, the first of the tip thereof. It is transmitted to the other three-dimensional body 10 via the land 42 and the conductive connection pad 50, and the one and the other three-dimensional body 10 can exchange signals with each other.

  Then, the contacted conductive connection pads 50 can be easily made by pressing the plurality of three-dimensional bodies 10 in a direction approaching each other at a temperature near room temperature, for example, without using the conventional heat treatment. Since the three-dimensional body 10 is joined and integrated with each other, voids and thermal corrosion generated by performing the heat treatment on the three-dimensional body 10 do not occur, and the strain gauge 30 mounted on the three-dimensional body 10 is adversely affected. In addition, the plurality of three-dimensional bodies 10 can be electrically connected to each other with high accuracy.

  Further, since the thickness of the conductive connection pad 50 is set to be at least larger than the thickness of the electrical functional element, the strain gauges 30 mounted on the opposing surfaces between the three-dimensional bodies 10 joined to each other are mutually connected. Interference is prevented and adverse effects due to interference with each other can be avoided.

  In addition, since the wiring pattern 40 is formed of any one of aluminum, nickel, and copper, aluminum, nickel, and copper are all suitable as the material of the wiring pattern 40 and can be easily formed on the surface of the three-dimensional body 10. And the wiring pattern 40 can be formed reliably. Further, since the conductive connection pad 50 is made of gold or an indium-tin alloy, the gold and the indium-tin alloy are bonded to each other by being pressed even if they are not placed in such a high temperature atmosphere. The plurality of three-dimensional bodies 10 arranged side by side in a substantially normal temperature atmosphere are pressurized toward each other so that each three-dimensional body 10 is adjacent to each other. The joined ones can be easily joined to each other via the conductive connection pads 50, thereby improving the workability of the connection work of the three-dimensional body 10.

  In addition, since the protective layer 70 made of an insulating material is laminated on each surface of the three-dimensional body 10, the force applied from the outside by the strain gauge 30, the wiring pattern 40, etc. mounted on the surface of the three-dimensional body 20 is provided. It is protected against damage and can be reliably prevented from being damaged by scratching.

  In addition, since the protective layer 70 is formed of silicon oxide or silicon nitride, both silicon oxide and silicon nitride can form a strong network-structured film by chemical bonding. The protective layer 70 can reliably protect the strain gauge 30 formed on the surface of the three-dimensional body 10.

  And if the particulate adhesive holding sphere 60 containing the conductive adhesive 62 is applied to the surface of the conductive connection pad 50, the state is sandwiched between the conductive connection pads 50 of the adjacent three-dimensional body 10 When the adhesive holding sphere 60 is subjected to an operation for crushing the adhesive holding sphere 60, the conductive adhesive 62 contained in the adhesive holding sphere 60 flows out and the conductive connecting pads 50 are opposed to each other. Therefore, the conductive connection pads 50 opposed to each other can be easily integrated by bonding. In addition, the conductive adhesive pad 62 ensures electrical conductivity between the conductive connection pads 50 facing each other.

  If such an adhesive-holding sphere 60 is used that is easily crushed by applying pressure or vibration, adhesion in a state of being sandwiched between the conductive connection pads 50 of the adjacent three-dimensional body 10. By applying pressure or vibration treatment to the agent holding sphere 60 via the respective conductive connection pads 50, the adhesive holding sphere 60 is easily crushed, and thereby the conductive adhesive 62 contained therein is easily discharged. be able to.

  The integrated body 80 according to the present invention is obtained by integrating a plurality of the three-dimensional bodies 10 as described above, and another three-dimensional body is formed on the conductive connection pad 50 of the one three-dimensional body 10. Since the plurality of three-dimensional bodies 10 are integrated in at least a two-dimensional direction by abutting the ten conductive connection pads 50 and being pressed against each other, the three-dimensional body 10 is formed of the structure to be measured. It is possible to construct an integrated body 80 suitable for the structure by combining linearly, planarly, or three-dimensionally according to the shape, thereby detecting that could not be obtained with one three-dimensional body 10. It is possible to improve the accuracy of the geometrical series and to increase the detection items or the detection range.

  In such an integrated body 80, the conductive material obtained by crushing the adhesive holding sphere 60 between the conductive connection pad 50 of one three-dimensional body 10 and the conductive connection pad 50 of another three-dimensional body 10. Since the conductive adhesive 62 is interposed, the conductive connection pads 50 opposed to each other by the adhesion by the conductive adhesive 62 are integrated, and the conductive connection pads 50 opposed to each other are electrically conductive. The conductive adhesive 62 ensures the electrical conductivity.

  Further, in such an integrated body 80, a strong bonding performance is provided between one three-dimensional body 10 and another three-dimensional body 10 joined to each other, and the structural body is extremely solid in a solidified state. Since the strong insulating material 71 made of, for example, epoxy resin or the like is filled, the integrated body 80 can reliably bring the three-dimensional bodies 10 into an integrated state.

  In the present embodiment, the strain gauge 30 which is a kind of stress detection element is employed as the electrical functional element, and the three-dimensional body 10 is used as a stress detection sensor. Not only can the sensor itself be used as a stress detection sensor, but the integrated body 80 obtained by integrating the sensor can correspond to the structures under measurement in a wider range. That is, the integrated body 80 as a stress detection sensor has mechanical characteristics (rigidity) equivalent to that of the stress measurement object, so that the physical stress to each three-dimensional body 10 constituting the integrated body 80 is stabilized. If the residual stress occurs between different stress measurement objects, it is possible to obtain a remarkable effect that it is possible to transmit in a state where no residual stress is generated. The disadvantage that the transmitted stress is hindered can be solved.

  The present invention is not limited to the above embodiment, and includes the following contents.

  (1) In the above embodiment, the functional element forming surface 22 is formed on the three surfaces of the three-dimensional body 20 and the wiring surface 23 without the strain gauge 30 is formed on the remaining three surfaces. The invention is not limited to such surface setting (arrangement), and various surface settings can be made. It is as follows when enumerating all surface settings including those of the above embodiment.

a) One surface is a functional element forming surface 22 and the remaining five surfaces are wiring surfaces 23
b) Two surfaces are functional element formation surfaces 22 and the remaining four surfaces are wiring surfaces 23.
c) Three surfaces are functional element formation surfaces 22 and the remaining three surfaces are wiring surfaces 23.
d) Four surfaces are functional element formation surfaces 22 and the remaining two surfaces are wiring surfaces 23.
e) Five surfaces are functional element formation surfaces 22 and the remaining one surface is a wiring surface 23.
f) All surfaces are functional element forming surfaces 22
g) All surfaces are wiring surfaces 23
In the case of g) in which all the surfaces of the three-dimensional body 20 are the wiring surfaces 23, the three-dimensional body 10 itself does not serve as a sensor, but simply functions as a conducting member.

  (2) In the above embodiment, the adhesive holding sphere 60 is applied to the surface of the conductive connection pad 50. However, in the present invention, the layer of the adhesive holding sphere 60 is provided on the surface of the conductive connection pad 50. The conductive adhesive is not limited to being formed, but may be applied directly to the conductive connection pad 50.

  (3) When the three-dimensional body according to the present invention is a flat substrate 11 having electrical functional elements mounted on one side or both sides as shown in FIG. A U-shaped pad 50 ′ formed in a U shape so as to sandwich the back surface can be employed. By adopting such a U-shaped pad 50 ′, it is possible to easily obtain an integrated body in which a plurality of substrates 11 are stacked or integrated in a two-dimensionally expanded state by connecting edges.

  In addition, the board | substrate 11 provided with the U-shaped pad 50 'shown in FIG. 7 is contained in the technical scope of this invention. The reason is that the substrate 11 itself is a three-dimensional body having a rectangular parallelepiped shape, and the upper surface and the lower surface of the substrate 11 in FIG. 7 are the first surfaces according to the present invention, and the edge surface of the substrate 11 is the present invention. In this case, the U-shaped pad 50 'extends from the first surface to the second surface so as to exhibit an L shape as a whole. It is because it can be considered that the front-end | tip parts of each extended thing are integrated.

It is a perspective view which shows one Embodiment of the three-dimensional body which concerns on this invention, and has shown the state before two three-dimensional bodies are connected. It is a perspective view showing one embodiment of a three-dimensional body concerning the present invention, and shows the state where two three-dimensional bodies were connected to each other. It is a partially cutaway enlarged perspective view showing an embodiment of a conductive connection pad. It is sectional drawing which shows one Embodiment of the adhesive agent holding | maintenance sphere provided on the surface of an electroconductive connection pad. (A) is a state where one three-dimensional body is approaching toward the other three-dimensional body, (B) shows a state in which the conductive connection pads of the three-dimensional bodies are in contact with each other via the crushed adhesive holding spheres. It is a perspective view which shows four forms of the integration | stacking body concerning this invention, (A) is a linear array integration body of 1x4 three-dimensional bodies, (b) is a 2x4 three-dimensional body. The planar array assembly (c) shows a 2 × 2 planar array assembly with a three-dimensional body, and (d) shows a 3 × 2 × 2 three-dimensional array assembly. It is a perspective view which shows one Embodiment of the board | substrate with which the U-shaped pad was applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Three-dimensional body 11 Board | substrate 20 Three-dimensional body main body 21 Edge line part 22 Functional element formation surface 23 Wiring surface 30 Strain gauge (Stress detection element (electrical functional element))
31 First strain gauge 32 Second strain gauge 40 Wiring pattern 41 Land 42 First land 43 Second land 50 Conductive connection pad (connection layer)
50 'U-shaped pad (connection layer)
60 Adhesive-holding sphere 61 Micro hollow sphere 62 Conductive adhesive 70 Protective layer 71 Insulating material 80 Accumulation body 81 Linear arrangement accumulation body 82, 83 Planar arrangement accumulation body 84 Three-dimensional arrangement accumulation body

Claims (16)

  Electrically connected in an opposing state at a joint surface that joins a three-dimensional body having an approximately rectangular parallelepiped and having an electrical functional element in place at least on the surface and made of a non-conductive material and the other three-dimensional body. An electrical connection structure of a three-dimensional body, wherein a conductive wiring pattern electrically connected to the electrical functional element is formed on a first surface of the three-dimensional body, and the wiring pattern is A first land is formed by being led to a ridge line formed by the second surface as the joint surface adjacent to the first surface, and the second surface of the second surface is formed by the first surface. A second land extending from the ridge line by a predetermined dimension is formed at a position corresponding to the first land, and is added to each other in a state of being in close contact with both lands across the first and second lands. Connecting layer that exhibits bonding performance when pressed is crosslinked Electrical connection structure of a three-dimensional body, characterized in that they are.   A third land corresponding to the first land is formed on a third surface which is at least one of the other three surfaces excluding the second surface adjacent to the first surface; A fourth land corresponding to the second land is formed on the first surface, and a connection layer made of the same material as the connection layer is provided across the third and fourth lands. The three-dimensional body electrical connection structure according to claim 1, wherein the three-dimensional body is electrically connected.   The electrical connection structure of a three-dimensional body according to claim 1 or 2, wherein the connection layer has a thickness dimension set to be at least thicker than a thickness dimension of the electrical functional element.   The tertiary according to any one of claims 1 to 3, wherein the wiring pattern is formed of any one of aluminum, nickel, and copper, and the connection layer is formed of gold or an indium-tin alloy. Original electrical connection structure.   The electrical connection structure for a three-dimensional body according to any one of claims 1 to 4, wherein a protective layer made of an insulating material is laminated on each surface of the three-dimensional body.   6. The three-dimensional electrical connection structure according to claim 5, wherein the protective layer is made of silicon oxide or silicon nitride.   The three-dimensional body electrical connection structure according to claim 1, wherein a conductive adhesive layer is laminated on the connection layer.   The three-dimensional body electricity according to any one of claims 1 to 7, wherein fine particles of adhesive holding spheres containing conductive adhesive are transferred or printed on the surface of the connection layer. Connection structure.   9. The electrical connection structure of a three-dimensional body according to claim 8, wherein the adhesive holding sphere is crushed by pressurization or application of vibration.   Electrically connected in an opposing state at a joint surface that joins a three-dimensional body having an approximately rectangular parallelepiped and having an electrical functional element in place at least on the surface and made of a non-conductive material and the other three-dimensional body. An electrical connection structure of a three-dimensional body, wherein a conductive wiring pattern electrically connected to the electrical functional element is formed on a first surface of the three-dimensional body, and the wiring pattern is A first land is formed by being led to a ridge line formed by the second surface as the joint surface adjacent to the first surface, and the second surface of the second surface is formed by the first surface. A second land extending from the ridge line by a predetermined dimension is formed at a position corresponding to the first land, and is added to each other in a state of being in close contact with both lands across the first and second lands. Connecting layer that exhibits bonding performance when pressed is crosslinked The surface of the connection layer is transferred or printed with fine-particle adhesive holding spheres containing conductive adhesive, and the adhesive holding spheres are to be crushed by applying pressure or vibration. Characteristic three-dimensional body electrical connection structure. An integrated body obtained by integrating a plurality of the three-dimensional bodies using the electrical connection structure according to any one of claims 1 to 10,
A connection layer of another three-dimensional body is brought into contact with the connection layer of the one three-dimensional body and pressed together to form a plurality of three-dimensional bodies integrated in at least a two-dimensional direction. An integrated body using a three-dimensional electrical connection structure.   The electrical connection of the three-dimensional body according to claim 11, wherein a conductive adhesive layer is interposed between the connection layer of the one three-dimensional body and the connection layer of the other three-dimensional body. An integrated body using a connection structure.   The conductive adhesive layer is encapsulated in a particulate adhesive holding sphere, and obtained by crushing by applying pressure or vibration while the adhesive holding sphere is transferred or printed on the connection layer. 13. The integrated body using the three-dimensional electrical connection structure according to claim 12, wherein the integrated body is a structure.   The electrical connection of a three-dimensional body according to any one of claims 11 to 13, wherein an insulating material is filled between the one-dimensional body and the other three-dimensional body joined to each other. Aggregate using structure.   The electrical functional element is a stress detection element that detects stress or strain acting on a predetermined structure, and the insulating material has mechanical strength equivalent to that of the three-dimensional body. 15. An integrated body using the three-dimensional electrical connection structure according to claim 14.   The electrical functional element is a stress detection element that detects stress or strain acting on a predetermined structure, and the insulating material has rigidity capable of transmitting stress acting on the predetermined structure. The integrated body using the three-dimensional body electrical connection structure according to claim 14.

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