JP2005057203A - Wafer, integrated circuit chip, and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer and an integrated circuit chip by which individual information of the wafer and the integrated circuit chip is easily acquired. <P>SOLUTION: Microchips 1 which communicate an individual identification information are formed on a wafer 2. The microchips 1 are formed on each IC chip 3. These microchips 1 are formed by an identical wafer process, by which the individual identification information of the wafer 2 or the IC chip 3 is easily acquired. Moreover, it is prevented that a portion where the individual identification information is written is lost by a dropout or the like is prevented, for the microchips 1 are formed by the identical wafer process. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a configuration of a wafer and an IC (Integrated Circuit) chip, and in particular, a wafer and an IC chip in which a microchip such as an RFID (Radio Frequency IDentification) tag having a communication function of individual identification information is configured separately from a product IC. And a manufacturing method thereof.

  In recent years, most of information communication devices, home appliances, etc. are equipped with IC chips, and the demand for IC chips has become enormous. Under such circumstances, how to efficiently produce IC chips and wafers is important.

  Conventionally, the wafer ID is printed on the outer peripheral portion of the wafer, and the product name is often printed on the outer peripheral portion of the IC chip. However, the wafer ID is discarded when it is cut into individual chips in the dicing process, and the product name printed on the IC chip becomes invisible due to resin sealing. As related techniques, there are inventions disclosed in JP-A-7-66091, JP-A-7-60580, and JP-A-8-148538.

  In the identification information reading method disclosed in Japanese Patent Laid-Open No. 7-66091, identification information for process management for manufacturing an integrated circuit is written on a wafer. Then, the light emitted from a single light source is irradiated onto the wafer, and the identification information written on a part of the wafer is read in a non-contact manner due to the difference in reflectance.

  In the FA system disclosed in Japanese Patent Application Laid-Open No. 7-60580, a memory that records all or part of information such as processing conditions of a workpiece, and a circuit that converts the information in the memory into radio waves are provided. The radio wave tag is attached to each workpiece through a frame or the like, and the reader receives the radio wave generated by the radio wave tag and controls the processing apparatus.

Further, in the method of manufacturing a semiconductor device disclosed in Japanese Patent Application Laid-Open No. 8-148538, the semiconductor wafer manufacturing flow, in-process, and the following are performed in order to carry out progress management of the stored semiconductor wafer by the carrier case itself. An information processing unit for storing and determining necessary information such as processes and a non-contact communication interface for performing communication for exchanging semiconductor wafer identification information and process management information with the outside. .
JP 7-66091 A Japanese Patent Laid-Open No. 7-60580 JP-A-8-148538

  In the above-described method of printing the wafer ID on the outer peripheral part of the wafer and printing the product name etc. on the outer peripheral part of the IC chip, both cannot be used in the middle of the process, so product information necessary for production is included in the product slip. It was necessary to write and attach it to the product lot so that the product slip and the product lot were always kept together.

  In addition, the automation of equipment has progressed, and the productivity of the machining work itself has been greatly improved, but the current situation is that there has not been much improvement in production peripheral work and production preparation work. The work becomes complicated due to the production of a small number of products and the complexity of the structure of the semiconductor device, and various confirmation operations and judgments are often required, and these have become a factor of new productivity reduction.

  In other words, the number of products per lot decreases and the number of lots increases, so the preparation work for the next input lot increases, the lot completion processing work (such as accounting for the number of products, description on the slip) increases, There is a problem that the number of similar varieties increases due to the varieties and the structural complexity, and the mistakes in checking the conditions between the product and the device increase.

  Further, in the identification information reading method disclosed in Japanese Patent Laid-Open No. 7-66091, identification information for process management for manufacturing an integrated circuit written on a wafer is optically read. However, since identification information is written on the wafer, it is difficult to manage the information in units of IC chips. Further, when the portion where the identification information is written is dirty or scratched, the identification information may not be read correctly.

  In the FA system disclosed in Japanese Patent Application Laid-Open No. 7-60580, a radio wave tag is attached to each workpiece via a frame or the like. However, since a radio wave tag is attached to the wafer, it is difficult to manage information on an IC chip basis. Further, if the radio wave tag is separated from the wafer due to dropping of the radio wave tag, it becomes impossible to manage information.

  Further, in the method of manufacturing a semiconductor device disclosed in Japanese Patent Application Laid-Open No. 8-148538, the information processing unit and the non-contact communication interface are provided in the carrier case itself for storing the semiconductor wafer. Is difficult to manage. Moreover, since a carrier case becomes large, it is inconvenient to carry and store.

  The present invention has been made to solve the above problems, and a first object thereof is to provide a wafer and an integrated circuit chip that can easily acquire individual information of the wafer and the IC chip. is there.

  The second object is to provide a method for manufacturing a semiconductor device capable of improving the production efficiency of the semiconductor device.

  According to one aspect of the present invention, a wafer includes a plurality of integrated circuit chips to be products and a microchip capable of communicating individual identification information, and the microchip is the same in a different place from the plurality of integrated circuit chips. It is formed by a wafer process.

  According to another aspect of the present invention, the integrated circuit chip includes a product integrated circuit chip and a microchip capable of communicating individual identification information, and the microchip is formed in the integrated circuit chip by the same wafer process. It is formed.

  According to still another aspect of the present invention, there are provided a plurality of integrated circuit chips to be products, and a microchip formed in the same wafer process at a different location from the plurality of integrated circuit chips and capable of communicating individual identification information. A method of manufacturing a semiconductor device using a wafer, comprising: reading individual identification information from a microchip; receiving the read individual identification information; and managing a wafer based on the received individual identification information Performing the steps.

  According to still another aspect of the present invention, an integrated circuit chip including an integrated circuit chip to be a product and a microchip formed in the integrated circuit chip by the same wafer process and capable of communicating individual identification information is used. A method for manufacturing a semiconductor device, comprising: reading individual identification information from a microchip; receiving the read individual identification information; and managing an integrated circuit chip based on the received individual identification information Steps.

  According to one aspect of the present invention, since the microchip is formed on the wafer, it becomes possible to easily acquire the individual identification information of the wafer. Further, since the microchip is formed by the same wafer process, it is possible to prevent the portion where the individual identification information is written from being lost due to dropping or the like.

  According to another aspect of the present invention, since the microchip is formed on the integrated circuit chip, the individual identification information of the integrated circuit chip can be easily obtained. Further, since the microchip is formed by the same wafer process, it is possible to prevent the portion where the individual identification information is written from being lost due to dropping or the like.

  According to still another aspect of the present invention, since the wafer is managed based on the received individual identification information, the production management of the wafer becomes easy and the productivity of the wafer can be improved.

  According to still another aspect of the present invention, the integrated circuit chip is managed based on the received individual identification information. Therefore, the production management of the integrated circuit chip is facilitated, and the productivity of the integrated circuit chip is improved. Became possible.

(First embodiment)
The present invention aims to improve productivity by forming a microchip such as an RFID tag in an IC chip or wafer and integrating it with the IC chip or wafer. Details of the present invention will be described below.

  FIG. 1 is a diagram for explaining a conventional wafer ID printed on a wafer or a product type name of a chip printed on an IC chip. As shown in FIG. 1, the wafer ID number “ABC123456” is printed on the outer peripheral portion of the wafer 102, and the chip type name “ABC” is printed on the outer peripheral portion of the IC chip 103. Production is managed with reference to these pieces of information.

  FIG. 2 is a diagram showing an RFID tag 1 which is an example of a microchip formed on a wafer in the first embodiment of the present invention. The RFID tag 1 includes a memory 11 such as an EEPROM (Electrically Erasable Programmable Read Only Memory), an RF circuit 12, a micro antenna 13, and a logic circuit 14 that performs overall control of the RFID tag 1.

  The micro antenna 13 receives radio waves emitted from a reader / writer 21 composed of a transmission module and a control module. The RF circuit 12 generates power by electromagnetic induction using radio waves received by the micro antenna 13, and supplies power to each circuit. As a result, the logic circuit 14 reads information stored in the memory 11 and transmits the information to the reader / writer 21 via the RF circuit 12 and the micro antenna 13.

  Further, when the logic circuit 14 receives information from the reader / writer 21 via the micro antenna 13 and the RF circuit 12, the logic circuit 14 can also write the information in the memory 11.

  FIG. 3 is a diagram showing an example of a wafer according to the first embodiment of the present invention. As shown in FIG. 3, the microchip 1 is formed on the outer peripheral portion of the wafer 2. Since the microchip 1 is formed in the same process step as that of the wafer 2, the microchip 1 is integrated with the wafer 2.

  Individual identification information of the wafer 2 is written on the microchip 1. This enables communication of wafer individual information in a manufacturing process in the form of a wafer, such as a wafer process or a part of an assembly process.

  As described above, according to the wafer in the present embodiment, since the microchip is formed on the wafer, individual information on the wafer can be easily obtained. In addition, since the microchip on which the individual information is written is formed integrally with the wafer, the portion where the individual information is written does not drop out, and it is possible to prevent problems such as failure to acquire the individual information. It became.

  In addition, since individual information can be read / written at any timing and individual information can be held for a certain period of time, it is possible to prevent product mistakes, lots, etc., and improve wafer productivity. It was.

(Second Embodiment)
FIG. 4 is a diagram showing an example of an IC chip according to the second embodiment of the present invention. As shown in FIG. 4, the microchip 1 is formed on the outer periphery of the IC chip 3. The microchip 1 is the same as that described in the first embodiment, and is formed in the same process step as the process step of the wafer 2 and is therefore integrated with the IC chip 3.

  Individual identification information of the IC chip 3 is written in the microchip 1. As a result, the individual identification information can be communicated after the wafer process, the assembly process, the final test process, and the final product.

  As described above, according to the IC chip in the present embodiment, since the microchip is formed on the IC chip, individual information on the IC chip can be easily obtained. In addition, since the microchip in which the individual information is written is formed integrally with the IC chip, the portion in which the individual information is written is not dropped, and it is possible to prevent a problem that the individual information cannot be acquired. It has become possible.

  In addition, since individual information can be read / written at any timing and individual information can be retained for a certain period of time, it is possible to prevent product mistakes and lot mixing, and improve the productivity of semiconductor devices including IC chips. It became possible to plan.

(Third embodiment)
FIG. 5 is a diagram illustrating an example of a wafer and an IC chip according to the third embodiment of the present invention. As shown in FIG. 5, the microchip 1 is formed on the outer peripheral portion of the wafer 2, and the microchip 1 is formed on the outer peripheral portion of the IC chip. The microchip 1 is the same as that described in the first embodiment and the second embodiment, and is formed in the same process step as the process step of the wafer 2. Therefore, the microchip 1 is integrated with the wafer 2 and the IC chip 3. It has become.

  In the microchip 1, individual identification information of the wafer 2 or individual identification information of the IC chip 3 is written. As a result, it becomes possible to communicate individual information after the wafer process, the assembly process, the final test process, and the final product.

  As described above, according to the wafer and the IC chip in the present embodiment, since the microchip is formed on the wafer and the IC chip, individual information on the wafer and the IC chip can be easily obtained. became. In addition, since the microchip in which the individual information is written is formed integrally with the wafer and the IC chip, the portion in which the individual information is written is not dropped, and the problem that the individual information cannot be acquired is prevented. It became possible.

  In addition, since individual information can be read / written at any timing and individual information can be retained for a certain period of time, it is possible to prevent product mistakes and lots from being mixed, improve wafer productivity, and include IC chips. It became possible to improve the productivity of the equipment.

(Fourth embodiment)
FIG. 6 is a diagram illustrating a method for manufacturing a semiconductor device according to the fourth embodiment of the present invention. Individual information recorded on the microchip 1 formed on the wafer 2 is read by the microchip reader 21. This individual information is sent to a computer 22 such as a system server and an equipment terminal, and production equipment 23. The computer 22 can manage the wafer by displaying the product type information sent from the microchip reader 21 on the screen or printing it out.

  Further, the production facility (production management system) 23 can manage the manufacturing process and control the transfer device based on the product type information sent from the microchip reader 21. Further, by writing information into the microchip 1 using a microchip writer, it is possible to change the process or change the conveyance by the conveyance device.

  As described above, according to the manufacturing method of the semiconductor device in the present embodiment, the individual information of the microchip 1 formed on the wafer 2 is sent to the computer 22 and the production facility 23. Based on this, it becomes possible to manage wafers, manage manufacturing processes, and control transfer devices.

(Fifth embodiment)
FIG. 7 is a diagram illustrating a method of manufacturing a semiconductor device according to the fifth embodiment of the present invention. Individual information recorded on the microchip 1 formed on the IC chip 3 is read by the microchip reader 21. This individual information is sent to a computer 22 such as a system server and an equipment terminal, and production equipment 23. The computer 22 displays the product type information sent from the microchip reader 21 on the screen or prints it out. It is possible to manage individual information in any of the wafer state, chip single state, frame state, and package single state.

  Further, the production facility (production management system) 23 can manage the manufacturing process and control the transfer device based on the product type information sent from the microchip reader 21. In any of the wafer state, chip single state, frame state, and package single state, it is possible to manage the manufacturing process. Further, by writing information into the microchip 1 using a microchip writer, it is possible to change the process or change the conveyance by the conveyance device.

  As described above, according to the method of manufacturing a semiconductor device in the present embodiment, the individual information of the microchip 1 formed on the IC chip 3 is sent to the computer 22 and the production facility 23. Even in the product state, based on the individual information, it is possible to manage the IC chip, manage the manufacturing process, control the transfer device, and the like.

(Sixth embodiment)
The system in the sixth embodiment of the present invention is the same as the system in the fourth embodiment shown in FIG. 6 or the fifth embodiment shown in FIG. Moreover, the location where the microchip 1 is formed may be any location shown in FIGS.

  In the present embodiment, based on the individual information sent from the microchip reader 21, the computer 22 automatically prints the product slip or counts the product quantity, and automates the part that has been manually performed. To do.

  As described above, in the method of manufacturing a semiconductor device according to the present embodiment, by automating the portion that has been conventionally performed manually, the workload is reduced, the operation time is reduced, and a simple operation error is prevented. It was possible to improve productivity.

(Seventh embodiment)
The system in the seventh embodiment of the present invention is the same as the system in the fourth embodiment shown in FIG. 6 or the fifth embodiment shown in FIG. Moreover, the location where the microchip 1 is formed may be any location shown in FIGS.

  In the present embodiment, production information such as which production facility 23 is producing is managed based on the individual information sent from the microchip reader 21. For example, each of the production facilities 23 is provided with a microchip reader 21, and the microchip reader from which the individual information of the microchip 1 is read out can be discriminated and it can be managed which production facility 23 is producing. .

  Based on the information, production indices such as the production volume of the day and the operation status of the apparatus can be grasped in real time, so that the problem can be detected early and the situation can be judged quickly.

(Eighth embodiment)
FIG. 8 shows an example of a conventional method for manufacturing a semiconductor device. First, after the wafer test of the wafer 2 is performed by the wafer test device 24, the wafer ID number of the wafer 2 read by the barcode reader 31 and the positions of the good IC chip and the defective IC chip on the wafer 2 are determined. The wafer map data 104 shown is registered in the computer 22 in association with it.

  Next, the wafer 2 is attached to the wafer ring 41 by the wafer mounter 25. At this time, a barcode label in which the ring number is written is affixed to the wafer ring 42, and the wafer ID number of the wafer 2 and the ring number read by the barcode reader 31 are associated with each other to the computer 22. be registered.

  Next, the wafer dicing device 26 forms kerfs in the wafer 2 in a grid pattern. When the die bonder 27 attaches the dies one by one to a predetermined position of the lead frame or package, the wafer map data 104 is acquired based on the ring number read by the barcode reader 31, and the non-defective IC chip is obtained. The defective IC chip is selected and die bonding of the wafer ring 43 to the die is performed.

  FIG. 9 is a diagram illustrating an example of a semiconductor device manufacturing method according to the eighth embodiment of the present invention. First, after a wafer test of the wafer 2 is performed by the wafer test apparatus 24, information indicating whether the IC chip is a good product or a defective product is provided to the microchip 1 of each IC chip by the microchip writer. Is written. Further, the wafer map data may be written to the microchip 1 of the wafer 2.

  Next, after the wafer 2 is attached to the wafer ring 44 by the wafer mounter 25, the wafer dicing device 26 forms kerfs in the shape of a grid in the wafer 2 of the wafer ring 45. Then, when the dies are mounted one by one at a predetermined position of the lead frame or the package by the die bonder 27, the non-defective IC chip and the defective IC chip are selected based on the information read by the microchip reader 21, Die bonding of the wafer ring 46 to the die is performed.

  As described above, according to the method for manufacturing a semiconductor device in the present embodiment, information indicating whether the product is a good product or a defective product is written in the microchip 1 formed on each IC chip, and at the time of die bonding. Since the information is read and die bonding is performed, a large-scale communication system linking the wafer test apparatus 24, the wafer mounter 25, the die bonder 27, the computer 22 and the like is not necessary, and the production cost can be reduced. It was.

  In addition, since a unique number assigned to the wafer ring is unnecessary, production management can be easily performed. In addition, since information indicating whether or not the IC chip itself is a non-defective product is written, data is lost or a data error occurs due to a trouble in a communication system such as a computer. It has become possible to prevent it.

  In addition to simply classifying the IC chip into a non-defective product and a defective product, the good product may be divided into a plurality of ranks and written to the microchip 1. This makes it possible to further improve productivity.

(Ninth embodiment)
FIG. 10 is a diagram illustrating an example of a conventional sorting method for a single package. First, lead processing is performed by the lead processing machine 28 to singulate the package. The single package 51 is mounted on the test board 52 and a final test (board test) is performed by the final test machine 29.

  The final test result by the final test machine 29 is registered in the computer 22 in association with the board number. When the sorter 30 sorts a single package, the final test result is read based on the board number, and a defective package alone is rejected from the test board 52.

  In recent years, a method has been put to practical use in which a final test is performed in a lead frame state and a package is separated into individual pieces according to the final test result. After the package is separated into pieces by equipment other than the tester, the non-defective product and the defective product are selected. At present, various non-defective / defective product selection methods have been developed, but there are advantages and disadvantages. For example, there is a method in which test results of individual packages are registered in a computer in units of frames, packages are separated into individual pieces, and good products are selected using data registered in the computer. However, both methods are indirect information transmission methods via a medium.

  In addition, a method of directly attaching a defect mark to a defective package has been developed. However, this method can be applied when simply selecting good products and defective products, but this method is difficult to handle when it is necessary to rank three or more types of good products. It is.

  FIG. 11 is a diagram showing an example of a method for selecting a single package according to the ninth embodiment of the present invention. First, lead processing is performed by the lead processing machine 28. Each IC chip 51 is subjected to a final test (frame test) by the final test machine 29 with a lead frame.

  The result of the final test by the final test machine 29 is written on the microchip 1 formed on each IC chip 51. When a single package is selected by the package piece / sorter 30, information written in the microchip 1 of each IC chip 51 is read by the microchip reader 21, and a defective single package is rejected.

  As described above, according to the method for selecting a single package in the present embodiment, the final test result by the final test machine 29 is written to the microchip 1 of each IC chip, and the IC chip is separated when the package is separated. Since the information written in the microchip 1 is read and selected, it is possible to prevent data errors and lost data due to indirect data collation, and to improve the productivity of the semiconductor device.

  In addition, since various information can be written on the microchip formed on the IC chip, for example, it is possible to deal with a plurality of good product ranks.

(Tenth embodiment)
In a general semiconductor device manufacturing mode, manufacturing is started after setting and confirming process conditions and apparatus conditions. This operation is generally performed manually or visually by the operator. That is, since conditions are set and confirmed based on the product name and condition table attached to the product, mistakes such as mistakes can be caused. In that case, defective products will continue to be made until the next confirmation, and there is a risk of causing a large loss. The tenth embodiment of the present invention solves this problem.

  The semiconductor device manufacturing system according to the tenth embodiment of the present invention is the same as the semiconductor device manufacturing system according to the fourth or fifth embodiment shown in FIG. 6 or FIG. In the present embodiment, the manufacturing conditions and apparatus conditions are written in the microchip 1, and the manufacturing conditions and apparatus conditions written in the microchip 1 are read and confirmed in the production facility 23, thereby setting the conditions of the operator. This prevents mistakes and confirmation errors and prevents defective products from being manufactured.

  As described above, according to the manufacturing method of the semiconductor device in the present embodiment, the process conditions and the apparatus conditions are written on the microchip, and compared with the conditions of the manufacturing apparatus, so that errors are eliminated. It became possible to prevent the production of defective products.

  In addition, if the manufacturing conditions read from the microchip are automatically set in the manufacturing apparatus or the like, it is possible to obtain a more reliable manufacturing method as compared with manual work or visual confirmation. .

(Eleventh embodiment)
In conventional production systems, production information and the like are manually input, and therefore, from the viewpoint of work efficiency, production information and the like are often input collectively after processing of a plurality of lots is completed. Therefore, in a production facility that requires real-time performance, production information may not be input in a timely manner, which may hinder production. The eleventh embodiment of the present invention solves this problem.

  The semiconductor device manufacturing system in the eleventh embodiment of the present invention is the same as the semiconductor device manufacturing system in the fourth or fifth embodiment shown in FIG. 6 or FIG. In the present embodiment, the information written in the microchip 1 is read out by the microchip reader 21 provided in each production facility 23, so that the computer 22 can produce information such as the progress of the product, the location, and the number of products produced. Information can be input and production status can be grasped in real time.

  As described above, according to the method of manufacturing a semiconductor device in the present embodiment, the information on the microchip 1 is read out at each production facility 23 and the computer 22 manages the production information. Based on the optimal production management based on this, it was possible to shorten the construction period and the work-in-time.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure for demonstrating the kind name of the wafer ID printed on the conventional wafer, or the chip printed on the IC chip. It is a figure which shows the RFID tag which is an example of the microchip formed in the wafer in the 1st Embodiment of this invention. It is a figure which shows an example of the wafer in the 1st Embodiment of this invention. It is a figure which shows an example of the IC chip in the 2nd Embodiment of this invention. It is a figure which shows an example of the wafer and IC chip in the 3rd Embodiment of this invention. It is a figure which shows an example of the manufacturing method of the semiconductor device in the 4th Embodiment of this invention. It is a figure which shows an example of the manufacturing method of the semiconductor device in the 5th Embodiment of this invention. It is a figure which shows an example of the manufacturing method of the conventional semiconductor device. It is a figure which shows an example of the manufacturing method of the semiconductor device in the 8th Embodiment of this invention. It is a figure which shows an example of the selection method in the conventional package single-piece | unit. It is a figure which shows an example of the selection method of the package single-piece | unit in the 9th Embodiment of this invention.

Explanation of symbols

  1 microchip, 2,102 wafer, 3,103 IC chip, 11 memory, 12 RF circuit, 13 micro antenna, 14 logic circuit, 21 micro reader / writer, 22 computer, 23 production equipment, 24 wafer test device, 25 Wafer mounter, 26 Wafer dicing machine, 27 Die bonder, 28 Lead processing machine, 29 Final test machine, 30 Package piece / sorter, 31 Bar code reader, 41-46 Wafer ring, 51 Single package, 52 Test board, 104 Wafer Map data.

Claims (11)

A plurality of integrated circuit chips as products;
Including a microchip capable of communicating individual identification information,
The microchip is a wafer formed by the same wafer process at a different location from the plurality of integrated circuit chips. The wafer further includes a plurality of microchips capable of communicating individual identification information,
The wafer according to claim 1, wherein the plurality of microchips are formed on each of the plurality of integrated circuit chips by the same wafer process. An integrated circuit chip as a product;
Including a microchip capable of communicating individual identification information,
The microchip is an integrated circuit chip formed in the integrated circuit chip by the same wafer process. Manufacturing method of semiconductor device using wafer including a plurality of integrated circuit chips to be products and microchips formed in the same wafer process at different locations from the plurality of integrated circuit chips and capable of communicating individual identification information Because
Reading individual identification information from the microchip;
Receiving the read individual identification information;
A method of manufacturing a semiconductor device, comprising: managing a wafer based on the received individual identification information.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the step of managing the wafer includes a step of managing in which production facility the wafer is produced based on the received individual identification information. . The step of managing the wafer includes determining non-defective / defective products of a plurality of integrated circuit chips included in the wafer;
Writing the determination result of non-defective / defective products of the plurality of integrated circuit chips as map data on the microchip;
The method of manufacturing a semiconductor device according to claim 4, further comprising: reading out the determination result written in the microchip and selecting a good integrated circuit chip. The step of managing the wafer includes writing manufacturing conditions or apparatus conditions on the microchip;
The method for manufacturing a semiconductor device according to claim 4, further comprising: reading manufacturing conditions or apparatus conditions written in the microchip and confirming the manufacturing conditions or apparatus conditions. A manufacturing method of a semiconductor device using an integrated circuit chip including a product integrated circuit chip and a microchip formed in the integrated circuit chip by the same wafer process and capable of communicating individual identification information,
Reading individual identification information from the microchip;
Receiving the read individual identification information;
And a step of managing an integrated circuit chip based on the received individual identification information.   9. The semiconductor according to claim 8, wherein the step of managing the integrated circuit chip includes a step of managing in which production facility the integrated circuit chip is produced based on the received individual identification information. Device manufacturing method. Managing the integrated circuit chip comprises determining whether the integrated circuit chip is non-defective or defective;
Writing the determination result of the non-defective product / defective product of the integrated circuit chip into the microchip;
The method of manufacturing a semiconductor device according to claim 8, further comprising: reading out the determination result written in the microchip and selecting a good integrated circuit chip. Managing the integrated circuit chip includes writing manufacturing conditions or apparatus conditions to the microchip;
The method for manufacturing a semiconductor device according to claim 8, further comprising: reading manufacturing conditions or apparatus conditions written in the microchip and confirming the manufacturing conditions or apparatus conditions.

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