JP2005051211A5 - - Google Patents
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- JP2005051211A5 JP2005051211A5 JP2004185758A JP2004185758A JP2005051211A5 JP 2005051211 A5 JP2005051211 A5 JP 2005051211A5 JP 2004185758 A JP2004185758 A JP 2004185758A JP 2004185758 A JP2004185758 A JP 2004185758A JP 2005051211 A5 JP2005051211 A5 JP 2005051211A5
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- semiconductor film
- light emitting
- tft
- amorphous semiconductor
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Claims (20)
前記走査線駆動回路は、前記発光素子への電流の供給を制御するTFTのゲートのスイッチングを制御する機能を有し、The scanning line driving circuit has a function of controlling switching of a gate of a TFT that controls supply of current to the light emitting element,
前記発光素子への電流の供給を制御するTFT及び前記走査線駆動回路が有するTFTは、ゲート電極上に形成されたゲート絶縁膜と、前記ゲート絶縁膜上に形成されたセミアモルファス半導体膜と、前記セミアモルファス半導体膜上に形成された一対の半導体膜と、を有し、The TFT for controlling the supply of current to the light emitting element and the TFT included in the scanning line driving circuit include a gate insulating film formed on a gate electrode, a semi-amorphous semiconductor film formed on the gate insulating film, A pair of semiconductor films formed on the semi-amorphous semiconductor film,
前記一対の半導体膜には、一導電性を付与する不純物元素が添加されており、An impurity element imparting one conductivity is added to the pair of semiconductor films,
前記一対の半導体膜の一方の端部を前記一対の半導体膜の他方で囲むようにレイアウトされていることを特徴とする発光装置。The light emitting device is laid out so that one end of the pair of semiconductor films is surrounded by the other of the pair of semiconductor films.
前記走査線駆動回路は、前記発光素子への電流の供給を制御するTFTのゲートのスイッチングを制御する機能を有し、The scanning line driving circuit has a function of controlling switching of a gate of a TFT that controls supply of current to the light emitting element,
前記発光素子への電流の供給を制御するTFT及び前記走査線駆動回路が有するTFTは、ゲート電極上に形成されたゲート絶縁膜と、前記ゲート絶縁膜上に形成されたセミアモルファス半導体膜と、前記セミアモルファス半導体膜上に形成された一対の半導体膜と、を有し、The TFT for controlling the supply of current to the light emitting element and the TFT included in the scanning line driving circuit include a gate insulating film formed on a gate electrode, a semi-amorphous semiconductor film formed on the gate insulating film, A pair of semiconductor films formed on the semi-amorphous semiconductor film,
前記一対の半導体膜は、前記セミアモルファス半導体膜上に形成された第1の半導体膜と、前記第1の半導体膜上に形成された第2の半導体膜と、の積層構造からなり、The pair of semiconductor films has a stacked structure of a first semiconductor film formed on the semi-amorphous semiconductor film and a second semiconductor film formed on the first semiconductor film,
前記セミアモルファス半導体膜には、しきい値制御のための第1の不純物元素が添加されており、The semi-amorphous semiconductor film is doped with a first impurity element for threshold control,
前記第1の半導体膜は、バッファ層であり、The first semiconductor film is a buffer layer;
前記第2の半導体膜は、一導電性を付与する第2の不純物元素が添加されており、A second impurity element imparting one conductivity is added to the second semiconductor film,
前記第1の不純物元素は、前記第2の不純物元素と逆の導電性を付与する不純物元素であることを特徴とする発光装置。The light-emitting device, wherein the first impurity element is an impurity element imparting conductivity opposite to that of the second impurity element.
前記走査線駆動回路は、前記発光素子への電流の供給を制御するTFTのゲートのスイッチングを制御する機能を有し、The scanning line driving circuit has a function of controlling switching of a gate of a TFT that controls supply of current to the light emitting element,
前記発光素子への電流の供給を制御するTFT及び前記走査線駆動回路が有するTFTは、ゲート電極上に形成されたゲート絶縁膜と、前記ゲート絶縁膜上に形成されたセミアモルファス半導体膜と、前記セミアモルファス半導体膜上に形成された一対の半導体膜と、を有し、The TFT for controlling the supply of current to the light emitting element and the TFT included in the scanning line driving circuit include a gate insulating film formed on a gate electrode, a semi-amorphous semiconductor film formed on the gate insulating film, A pair of semiconductor films formed on the semi-amorphous semiconductor film,
前記一対の半導体膜は、前記セミアモルファス半導体膜上に形成された第1の半導体膜と、前記第1の半導体膜上に形成された第2の半導体膜と、の積層構造からなり、The pair of semiconductor films has a stacked structure of a first semiconductor film formed on the semi-amorphous semiconductor film and a second semiconductor film formed on the first semiconductor film,
前記セミアモルファス半導体膜には、しきい値制御のための第1の不純物元素が添加されており、The semi-amorphous semiconductor film is doped with a first impurity element for threshold control,
前記第1の半導体膜は、バッファ層であり、The first semiconductor film is a buffer layer;
前記第2の半導体膜は、一導電性を付与する第2の不純物元素が添加されており、A second impurity element imparting one conductivity is added to the second semiconductor film,
前記第1の不純物元素は、前記第2の不純物元素と逆の導電性を付与する不純物元素であり、The first impurity element is an impurity element imparting conductivity opposite to that of the second impurity element,
前記一対の半導体膜の一方の端部を前記一対の半導体膜の他方で囲むようにレイアウトされていることを特徴とする発光装置。The light emitting device is laid out so that one end of the pair of semiconductor films is surrounded by the other of the pair of semiconductor films.
ゲート絶縁膜と、前記セミアモルファス半導体膜と、前記一対の半導体膜を構成する半導体膜と、は連続成膜されたものであることを特徴とする発光装置。The light-emitting device, wherein the gate insulating film, the semi-amorphous semiconductor film, and the semiconductor films constituting the pair of semiconductor films are formed continuously.
前記セミアモルファス半導体膜上及び前記一対の半導体膜上には、窒化珪素膜が形成されており、A silicon nitride film is formed on the semi-amorphous semiconductor film and the pair of semiconductor films,
前記セミアモルファス半導体膜中の酸素濃度は5×10The oxygen concentration in the semi-amorphous semiconductor film is 5 × 10. 1919 atom/cmatom / cm 33 以下であることを特徴とする発光装置。A light emitting device characterized by the following.
前記一対の半導体膜は、セミアモルファス半導体で形成されていることを特徴とする発光装置。The pair of semiconductor films are formed of a semi-amorphous semiconductor.
前記走査線駆動回路が有するTFTのソース又はドレインと、前記発光素子への電流の供給を制御するTFTのソース又はドレインに、それぞれ電気的に接続された配線は、アルミニウム、チタン、タンタル若しくはモリブデン、又はこれらの元素の窒化物を含むことを特徴とする発光装置。 In any one of claims 1 to 7,
The wirings electrically connected to the source or drain of the TFT included in the scanning line driver circuit and the source or drain of the TFT for controlling the supply of current to the light emitting element are aluminum, titanium, tantalum, or molybdenum, Alternatively, a light-emitting device including a nitride of these elements.
前記アルミニウムには、チタン、シリコン、スカンジウム、ネオジウム又は銅が、0.5〜5原子%の濃度で添加されていることを特徴とする発光装置。 In claim 8 ,
A light-emitting device, wherein titanium, silicon, scandium, neodymium, or copper is added to the aluminum at a concentration of 0.5 to 5 atomic%.
信号線駆動回路を有し、A signal line driving circuit;
前記信号線駆動回路が有するTFTは、単結晶又は多結晶の半導体を用いていることを特徴とする発光装置。The TFT included in the signal line driver circuit uses a single crystal or polycrystal semiconductor.
信号線駆動回路を有し、A signal line driving circuit;
前記信号線駆動回路が有するトランジスタは、SOIを用いていることを特徴とする発光装置。The transistor included in the signal line driver circuit uses SOI.
前記発光素子への電流の供給を制御するTFTはマルチゲート構造を有することを特徴とする発光装置。 In any one of Claims 1 to 11 ,
The light-emitting device, wherein the TFT for controlling current supply to the light-emitting element has a multi-gate structure.
前記信号線駆動回路はアナログスイッチを含むことを特徴とする発光装置。 In any one of Claims 1 to 12 ,
The light-emitting device, wherein the signal line driver circuit includes an analog switch.
前記セミアモルファス半導体は、0.5〜20nmの結晶粒を含むことを特徴とする発光装置。 In any one of Claims 1 thru / or Claim 13 ,
The light emitting device, wherein the semi-amorphous semiconductor includes crystal grains of 0.5 to 20 nm.
前記セミアモルファス半導体は、水素又はハロゲンを1原子%以上含むことを特徴とする発光装置。 In any one of Claims 1 thru | or 14 ,
The light-emitting device, wherein the semi-amorphous semiconductor contains 1 atom% or more of hydrogen or halogen.
前記セミアモルファス半導体は、珪化物気体をグロー放電分解することにより形成されたものであることを特徴とする発光装置。 In any one of Claims 1 to 15 ,
The semi-amorphous semiconductor is formed by glow discharge decomposition of a silicide gas.
前記セミアモルファス半導体は、水素、ヘリウム、アルゴン、クリプトン及びネオンから選ばれた一種又は複数のガスで希釈した珪化物気体を用いて形成されたものであることを特徴とする発光装置。 In any one of Claims 1 thru | or 16 ,
The light-emitting device, wherein the semi-amorphous semiconductor is formed using a silicide gas diluted with one or more gases selected from hydrogen, helium, argon, krypton, and neon.
前記セミアモルファス半導体は、炭化物気体又はゲルマニウム化気体を混入させた珪化物気体を用いて形成されたものであることを特徴とする発光装置。 In any one of Claims 1 thru | or 17 ,
The light emitting device, wherein the semi-amorphous semiconductor is formed using a silicide gas mixed with a carbide gas or a germanium gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004185758A JP4112527B2 (en) | 2003-07-14 | 2004-06-24 | Method for manufacturing light emitting device of system on panel type |
Applications Claiming Priority (2)
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JP2003273872 | 2003-07-14 | ||
JP2004185758A JP4112527B2 (en) | 2003-07-14 | 2004-06-24 | Method for manufacturing light emitting device of system on panel type |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007241214A Division JP4906106B2 (en) | 2003-07-14 | 2007-09-18 | Light emitting device |
Publications (3)
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JP2005051211A JP2005051211A (en) | 2005-02-24 |
JP2005051211A5 true JP2005051211A5 (en) | 2007-08-09 |
JP4112527B2 JP4112527B2 (en) | 2008-07-02 |
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JP2004185758A Active JP4112527B2 (en) | 2003-07-14 | 2004-06-24 | Method for manufacturing light emitting device of system on panel type |
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4748954B2 (en) * | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | Liquid crystal display |
EP1995787A3 (en) | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method therof |
KR101277606B1 (en) * | 2006-03-22 | 2013-06-21 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
US7897971B2 (en) * | 2007-07-26 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR101446251B1 (en) * | 2007-08-07 | 2014-10-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and electronic device having the display device, and method for manufacturing thereof |
JP5395384B2 (en) * | 2007-09-07 | 2014-01-22 | 株式会社半導体エネルギー研究所 | Method for manufacturing thin film transistor |
TWI371223B (en) * | 2008-02-20 | 2012-08-21 | Chimei Innolux Corp | Organic light emitting display device and fabrications thereof and electronic device |
JP5525778B2 (en) * | 2008-08-08 | 2014-06-18 | 株式会社半導体エネルギー研究所 | Semiconductor device |
US8283667B2 (en) * | 2008-09-05 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
WO2010032425A1 (en) | 2008-09-16 | 2010-03-25 | シャープ株式会社 | Semiconductor element |
JP5711463B2 (en) * | 2009-01-16 | 2015-04-30 | 株式会社半導体エネルギー研究所 | Thin film transistor |
WO2012035984A1 (en) * | 2010-09-15 | 2012-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
JP5982147B2 (en) * | 2011-04-01 | 2016-08-31 | 株式会社半導体エネルギー研究所 | Light emitting device |
KR20210068638A (en) | 2014-10-28 | 2021-06-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Light-emitting device |
Family Cites Families (10)
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JPS61104671A (en) * | 1984-10-29 | 1986-05-22 | Sharp Corp | Field effect transistor |
JPH03222370A (en) * | 1990-01-26 | 1991-10-01 | Mitsubishi Electric Corp | Thin film transistor |
JPH03233431A (en) * | 1990-02-09 | 1991-10-17 | Hitachi Ltd | Liquid crystal display panel |
JP3054187B2 (en) * | 1990-11-09 | 2000-06-19 | 株式会社半導体エネルギー研究所 | Method for manufacturing insulated gate semiconductor device |
JP2997737B2 (en) * | 1990-12-25 | 2000-01-11 | 株式会社半導体エネルギー研究所 | Liquid crystal display |
JPH07131030A (en) * | 1993-11-05 | 1995-05-19 | Sony Corp | Thin film semiconductor device for display and fabrication thereof |
JPH10256554A (en) * | 1997-03-13 | 1998-09-25 | Toshiba Corp | Thin film transistor and manufacture thereof |
JPH1197705A (en) * | 1997-09-23 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | Semiconductor integrated circuit |
JPH1197706A (en) * | 1997-09-23 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacture of the same |
JP4393662B2 (en) * | 2000-03-17 | 2010-01-06 | 株式会社半導体エネルギー研究所 | Method for manufacturing liquid crystal display device |
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