JP2005051072A - Method of manufacturing ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component by which delamination, cracks, and mounting nonconformity can be reduced. <P>SOLUTION: A group Q of electrodes is formed by aligning square electrodes 61 on a ceramic dielectric layer 51 with prescribed intervals. Then an auxiliary dielectric layer 65 which fills up the spaces between the electrodes 61 and the surroundings of the group Q of electrodes is formed. The auxiliary dielectric layer 65 has grooves 66 composed of non-printed sections in the spaces G1 between the electrodes 61 and the surroundings of the group Q. The grooves 66 are obliquely extended outward from the corner sections of the electrodes 61. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component.

  As a ceramic electronic component, for example, a multilayer ceramic capacitor is known. Multilayer ceramic capacitors are extremely demanded for miniaturization and large capacity, and in order to meet these demands, the thickness of the dielectric layer per layer is reduced to increase the number of layers. For example, recent multilayer ceramic capacitors have a dielectric layer thickness of 2 to 10 μm or less, and the number of stacked layers has reached several hundred layers.

  As a method for manufacturing a multilayer ceramic capacitor, for example, a ceramic coating is applied on a sheet-like flexible support to form an unfired ceramic dielectric layer, and an electrode group is formed on the ceramic dielectric layer. After the formation, the ceramic dielectric layer is cut for each electrode group, and the green sheets obtained by cutting are sequentially laminated to form a laminated structure, and the laminated structure is shredded to form a green chip. A manufacturing method is known in which a green chip is manufactured, a terminal electrode is formed, and a finished multilayer ceramic capacitor is obtained.

  However, when the number of layers reaches as many as 100 to 500 layers, the level difference due to the electrode cannot be ignored, and in the completed capacitor, the level difference between the margin part of the ceramic dielectric only and the part where the electrode and dielectric are laminated As a result, deformation such as bending occurs in the completed capacitor. When such a deformation occurs, a large problem such as a mounter adsorption error occurring when the board is mounted and a tombstone phenomenon appearing when the solder is melted are caused.

  As means for solving the above-mentioned problem, for example, in Patent Document 1, a ceramic dielectric layer is formed on a sheet-like flexible support, and an electrode group including an electrode group is formed on the ceramic dielectric layer. After the ceramic dielectric layer on which the electrode group is formed is hot-pressed with a mold having a flat surface, the ceramic dielectric layer is cut into each electrode group, and the green sheets obtained by cutting are sequentially formed. A manufacturing method for forming a laminated structure by laminating is disclosed.

  In this manufacturing method, the surface of the ceramic dielectric layer on which the electrode group is formed is hot-pressed with a mold having a flat surface, so that the portion where the electrode is formed and the electrode are not formed on the green sheet. The recessed part produced between parts is reduced. For this reason, poor adhesion between the stacked green sheets is reduced, and delamination that occurs during firing is reduced.

  However, the manufacturing method disclosed in Patent Document 1 has a problem that the manufacturing process becomes complicated because it is necessary to perform hot pressing with a mold each time an electrode group is formed.

  In addition, even when heat pressing is performed with a mold, it is extremely difficult to completely flatten the surface of the green sheet on which the electrode group is formed. Will remain. The slight concave portions remaining on the surface of the green sheet are accumulated as the green sheets are laminated, and a large concave portion is generated in the uppermost green sheet.

  For this reason, even when the manufacturing method disclosed in Patent Document 1 is used, there has been a problem that delamination tends to occur during firing as the number of layers increases as the number of layers increases.

  Moreover, when the recessed part has arisen on the surface of a green sheet, when pressing, baking, etc., stress concentrates on a recessed part. For this reason, in the vicinity of the concave portion, there is a problem that the electrode is bent and the product characteristics are deteriorated.

  Further, when the concave portion is formed on the surface of the green sheet, there is a problem that short circuit failure or breakdown voltage failure is likely to occur and the product yield is lowered.

  As another conventional technique, Patent Documents 2 to 4 disclose techniques for absorbing a step by printing or applying a dielectric on a portion where an electrode is not printed.

However, in the capacitor having the number of stacked layers ranging from 100 to 500 layers, the thickness of the dielectric per layer is reduced, the number of stacked layers is increased, and the number of electrodes is increased. When applied, there arises a new problem that the organic component contained in the internal dielectric and the organic component contained in the electrode are difficult to escape. That is, according to the prior art disclosed in Patent Documents 2 to 4, since the dielectric is formed without gaps around the electrodes, the step is eliminated, but the residual solvent in the green chip or the binder in the binder removal step When the gas is vaporized and extracted, it becomes difficult for the gas to escape, resulting in a new problem of delamination and cracking.
JP-A-6-168840 (page 2-3, FIG. 1) JP 2001-126951 A JP 2002-43164 A JP 2001-358036 A

  The subject of this invention is providing the manufacturing method of the ceramic electronic component which can suppress generation | occurrence | production of the delamination and a crack in a binder removal process.

  Another object of the present invention is to provide a method for manufacturing a ceramic electronic component capable of avoiding deterioration of product characteristics.

  Still another object of the present invention is to provide a method for manufacturing a ceramic electronic component capable of avoiding a decrease in product yield.

  In order to solve the above-described problems, in the method of manufacturing a ceramic electronic component according to the present invention, a plurality of electrodes are aligned at a predetermined interval on a ceramic dielectric layer formed on a flexible support. Formed electrode groups. The electrode has a quadrangular shape. Next, an auxiliary dielectric layer is printed in the interval and around the electrode group. The auxiliary dielectric layer has a groove formed by a non-printing portion, and the groove extends obliquely outward from the corner of the electrode.

  In the method for manufacturing a ceramic electronic component according to the present invention, an electrode group in which a plurality of rectangular electrodes are arranged at predetermined intervals on a ceramic dielectric layer formed on a flexible support is formed. Then, since the step of printing the auxiliary dielectric layer within the interval and around the electrode group is included, the step around the electrode can be eliminated by the auxiliary dielectric layer. For this reason, poor adhesion between the stacked green sheets is reduced, and delamination that occurs during firing is reduced.

  The auxiliary dielectric layer has a groove formed by a non-printing portion, and the groove extends obliquely outward from the corner of the electrode. That is, when printing the auxiliary dielectric layer for eliminating the step around the electrode, the entire periphery of the electrode is not covered with the auxiliary dielectric layer, but the non-printed part is left partially, Grooves are formed. According to such a configuration, the groove due to the non-printing portion functions as a path for extracting the organic solvent and the vaporized gas of the binder to the outside in the binder removal process of the green chip. Generation of lamination and cracks can be suppressed. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  Even if there is a groove due to a non-printing part, the density difference between the part printed with the auxiliary dielectric layer and the non-printing part not printed with the auxiliary dielectric layer is adjusted continuously in the pressing process. Therefore, there is an effect that a clear step cannot be made in appearance and gas is easily released. The width of the groove is preferably in the range of 5 μm to 100 μm.

  As a more specific method for manufacturing a ceramic electronic component, an electrode group in which a plurality of rectangular electrodes are arranged at predetermined intervals on a ceramic dielectric layer formed on a flexible support is provided. Form. Next, an auxiliary dielectric layer is printed in the interval and around the electrode group. The auxiliary dielectric layer has a groove formed by a non-printing portion, and the groove extends obliquely outward from the corner of the electrode.

  Thereafter, the ceramic dielectric layer having the electrode group is peeled from the flexible support for each of the electrode groups, and then the plurality of peeled ceramic dielectric layers are laminated and pressure-bonded. Then, it is subdivided for each electrode. Thereby, a green chip is obtained.

  Next, the green chip is subjected to a binder removal process. In the binder removal step, the groove formed by the non-printed portion functions as a passage for extracting the organic solvent and the vaporized gas of the binder to the outside, and therefore, delamination and cracks can be suppressed in the binder removal step. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  As another specific method for manufacturing a ceramic electronic component, a plurality of rectangular electrodes are provided at predetermined intervals on a first ceramic dielectric layer formed on a first flexible support. An aligned first electrode group is formed. Also in this case, the electrode has a quadrangular shape. Next, an auxiliary dielectric layer is printed in the interval and around the first electrode group. The auxiliary dielectric layer has a groove formed by a non-printing portion, and the groove extends obliquely outward from the corner of the electrode.

  Next, the first ceramic dielectric layer is peeled from the first flexible support for each of the first electrode groups to produce a first green sheet.

  On the other hand, separately from the above step, a plurality of electrodes are aligned on the second ceramic dielectric layer formed on the second flexible support with a predetermined interval, and the second Next, the second ceramic dielectric layer having the second electrode group is peeled off from the second flexible support for each of the second electrode groups. To produce a second green sheet.

  Then, the first green sheet and the second green sheet are laminated and pressure-bonded, and then subdivided for each electrode. Thereby, a green chip is obtained. The combination order and the number of the first green sheets and the second green sheets can be determined in consideration of the total number of stacked sheets, the thickness of the green sheets themselves, and the like.

  Next, the green chip is subjected to a binder removal process. In the green chip debinding process, the groove due to the non-printing part will function as a path for extracting the organic solvent and the vaporized gas of the binder to the outside. obtain. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  Other features of the present invention and the operational effects thereof will be described in more detail by way of examples with reference to the accompanying drawings.

  FIGS. 1-18 is a figure which shows each process in the manufacturing method of the ceramic electronic component based on this invention.

First, as shown in FIG. 1 and FIG. 2, a ceramic dielectric 17a having a thickness t1 is applied by applying a ceramic coating 17a on one surface of a flexible flexible support 19 using an extrusion-type coating head 10. Layer 51 is formed. The ceramic dielectric layer 1 is dried by passing it through a dryer (not shown). As the ceramic paint 17a, a known material such as BaTiO ₃ can be used. The flexible support 19 travels in the direction indicated by reference numeral F1 between a supply roll and a take-up roll (not shown).

  The flexible support 19 is preferably subjected to a peeling treatment on the surface on which the ceramic dielectric layer 51 is formed. The peeling process can be performed by, for example, thinly coating a peeling film made of Si or the like on one surface of the flexible support 19. By performing such a peeling process, the ceramic dielectric layer 51 can be easily peeled from the flexible support 19.

  The extrusion-type application head 10 includes a ceramic paint discharge slit 46 and a ceramic paint pool 49. Such extrusion type coating heads are known. When this extrusion type coating head 10 is used, it is possible to obtain a uniform ceramic coating layer having very good surface accuracy and little variation in thickness.

  Next, as shown in FIGS. 3 to 5, an electrode group Q in which a plurality of electrodes 61 are aligned with a predetermined gap G <b> 1 is formed on one surface of the dried ceramic dielectric layer 51. 3 is a diagram showing a step after the step shown in FIG. 2, FIG. 4 is a plan view showing an electrode arrangement state obtained by the step shown in FIG. 3, and FIG. 5 is an electrode arrangement state shown in FIG. It is a plane which expands and shows.

  3 to 5, the electrode 61 and the electrode group Q can be formed by means such as screen printing or gravure transfer. The electrode 61 is made of an electrode material mainly composed of nickel, copper, or the like. In the illustrated embodiment, each of the electrodes 61 has a quadrangular shape, and is formed in m rows and n columns inside each of the electrode groups Q. The electrode group Q is formed at a distance in the longitudinal direction X of the flexible support 19 by one plate making. Each of the electrodes 61 may be arranged so that the even-numbered columns and the odd-numbered columns are different from each other by half of the pitch between the electrodes, which is different from the illustration.

  Next, as shown in FIGS. 6 and 7, an auxiliary dielectric layer 65 is printed around the electrode 61. The auxiliary dielectric layer 65 can be formed using, for example, the printing machine 9. The auxiliary dielectric layer 65 is formed so as to fill a step around the electrode 61 formed on the ceramic dielectric layer 51. The auxiliary dielectric layer 65 may have the same thickness as the electrode 61 or may run on the end of the electrode 61. The auxiliary dielectric layer 65 is preferably made of a material whose shrinkage rate during firing is equal to the shrinkage rate during firing of the electrode 61. The auxiliary dielectric layer 65 is preferably made of a material that can be integrated with the ceramic dielectric layer 51 after firing.

  As described above, since the step of printing the auxiliary dielectric layer 65 around the electrode 61 is included, the step around the electrode 61 can be eliminated by the auxiliary dielectric layer 65.

  In the present invention, as a characteristic configuration, as shown in FIGS. 7 to 10, the auxiliary dielectric layer 65 has a groove 66 formed by a non-printing portion. Around the groove 66 is an auxiliary dielectric layer 65. The groove 66 extends obliquely outward from the corner of the electrode 61. In the illustrated embodiment, when attention is paid to the middle row, the groove 66 has a shape extending like a square from the four corners of the electrode 61 located in the middle row toward the corner of the electrode 61 in the row adjacent to the left and right. . More specifically, among the four corners of the electrode 61 located in the intermediate row, in the figure, the lower two corners face the two upper corners of the electrode 61 included in the left and right adjacent rows, and the upper corner From the two corners, it goes to the two lower corners of the electrode 61 included in the left and right adjacent rows.

  As described above, in the present invention, when the auxiliary dielectric layer 65 for eliminating the step is printed around the electrode 61, the entire periphery of the electrode 61 is not covered with the auxiliary dielectric layer 65 but partially. Since the non-printing portion is left and the groove 66 is formed by the non-printing portion, the groove 66 by the non-printing portion is used as a path for extracting the organic solvent and the vaporized gas of the binder to the outside in the binder removal processing step of the green chip. Will work. For this reason, generation | occurrence | production of the delamination and crack in a binder removal process can be suppressed. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  Even if there is a groove 66 due to the non-printing portion, the density difference between the portion where the auxiliary dielectric layer 65 is printed and the non-printing portion where the auxiliary dielectric layer 65 is not printed changes continuously in the pressing process. Therefore, there is an effect that a clear level difference cannot be made in appearance and gas is easily released. The width of the groove 66 is preferably in the range of 5 μm to 100 μm.

  Next, the content of the present invention will be described more specifically with reference to a manufacturing method including a binder removal step.

  After the steps shown in FIGS. 1 to 10, the ceramic dielectric layer 51 having the electrode group Q is peeled off from the flexible support 19 for each of the electrode groups Q. FIG. 11 shows a plan view of the ceramic dielectric layer obtained through the above-described peeling step. Since the ceramic dielectric layer after peeling is in the form of a sheet, this is referred to as a green sheet.

  Next, as shown in FIG. 12, a plurality of peeled (r) green sheets Q <b> 1 to Qr are stacked on a stacking table 71. In the actual laminating process, a ceramic dielectric layer 52 serving as a protective layer is placed on the laminating table 71, green sheets Q1 to Qr are laminated on the ceramic dielectric layer 52, and the uppermost green sheet is further laminated. A protective layer 53 is also laminated on Qr. The protective layers 52 and 53 are usually composed of a plurality of layers.

  In the illustrated embodiment, in the green sheets Q1 to Qr, the electrode 61 and the auxiliary dielectric layer 65 are formed by screen printing or gravure transfer using the same plate making. 13, even-numbered green sheets Q1, Q3,. . . And odd-numbered green sheets Q2, Q4,. . . Are stacked with an offset ΔOFF that is only half the pitch between the electrodes.

  Next, as shown in FIG. 14, the protective layer 52, the green sheets Q <b> 1 to Qr and the protective layer 53 that are stacked on the stacking table 71 are pressed P <b> 1 by a press 72 and pressed. The pressure bonding process is performed while heating. In the present invention, when the auxiliary dielectric layer 65 for eliminating the step is printed around the electrode 61, the groove 66 by the non-printing portion is formed. Therefore, the groove 66 by the non-printing portion is compressed by the compressed air. It will function as a way to pull out the outside. For this reason, it can deaerate at the time of pressure compression.

  Thereafter, as shown in FIG. 15, the laminate of the protective layer 52, the green sheets Q <b> 1 to Qr and the protective layer 53 is subdivided for each electrode using a cutting tool 8 rotating in the direction of arrow A. To do. The subdivisions C1 to C11 are performed at the middle part of the groove 66 between the electrodes 61-61.

  16 is an enlarged cross-sectional view of the green chip obtained through the subdivision step shown in FIG. 15, and FIG. 17 is a plan view of the green chip shown in FIG. 16 with the protective layer 53 removed. The green chip has a structure in which a laminated structure of a ceramic dielectric layer 51, an electrode 611, a ceramic dielectric layer 51, and an electrode 612 is repeated between the protective layer 52 and the protective layer 53 by a predetermined number.

  One end of the odd-numbered electrode 611 appears on the same end face, and one end of the even-numbered electrode 612 appears on the end face opposite to one end of the electrode 611. The other end of the odd-numbered electrode 611 is closed by the auxiliary dielectric layer 65 between the ceramic dielectric layers 51-51.

  As apparent from FIG. 17, in the even-numbered electrode 612, a groove 66 is formed in the auxiliary dielectric layer 65, and the groove 66 extends from the two corners of the other end of the electrode 612 in the figure. , Obliquely upward and obliquely downward, and open to the outside. The other end of the odd-numbered electrode 611 is also closed by the auxiliary dielectric layer 65 between the ceramic dielectric layers 51-51. In the auxiliary dielectric layer 65, a groove 66 indicated by a dotted line in FIG. 17 is formed, and the groove 66 extends obliquely upward and downward in the figure from two corners of the other end of the electrode 611. Open to the outside.

  Next, the above-described green chip is subjected to a binder removal process. In the binder removal process of the green chip, the groove 66 formed by the non-printing portion functions as a passage for extracting the organic solvent contained in the ceramic dielectric layer 51 and the electrodes 611 and 612 and the vaporized gas of the binder to the outside. Therefore, it is possible to suppress the occurrence of delamination and cracks in the binder removal step. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  18 is a front sectional view of the green chip after the binder removal step, and FIG. 19 is a right side view of the green chip shown in FIG. As shown in the drawing, a green chip in which electrodes 611 and 612 are alternately arranged inside the ceramic dielectric 50 is obtained. Thereafter, the green chip is subjected to a firing process. Then, after firing, end electrodes are formed, and a multilayer ceramic capacitor is obtained.

  As another concrete manufacturing method of the ceramic electronic component according to the present invention, the first green sheet obtained through the manufacturing process shown in FIGS. 1 to 10 and the manufacturing process different from this were obtained. It is also possible to laminate the second green sheet. This point will be described with reference to FIGS.

  First, FIG. 20 shows a case where the first green sheets Q11 and Q12 and the second green sheets Q21 and Q22 are alternately stacked. The number of alternate laminations of the first green sheets Q11 and Q12 and the second green sheets Q21 and Q22 is arbitrary.

  The first green sheets Q11 and Q12 are obtained through the manufacturing steps shown in FIGS. In order to distinguish the second green sheets Q21 and Q22 from each other, the first green sheets Q11 and Q12 are obtained by naming the flexible support, the ceramic dielectric layer, the electrode, and the electrode group with “first”. Is manufactured through the following steps.

  First, a first electrode group Q in which a plurality of first electrodes 61 are arranged at a predetermined interval on a first ceramic dielectric layer 51 formed on a first flexible support 19. Next, an auxiliary dielectric layer 65 is printed around the first electrode 61. The auxiliary dielectric layer 65 has a groove 66 formed by a non-printing portion, and the groove 66 extends obliquely outward from the corner of the electrode 61.

  Next, the first ceramic dielectric layer 51 is peeled from the first flexible support 19 for each of the first electrode groups Q to manufacture a first green sheet.

  The second green sheets Q21 and Q22 are obtained in a process different from the processes of the first green sheets Q11 and Q12. First, a plurality of second electrodes (61) are placed on the second ceramic dielectric layer (51) formed on the second flexible support (19) with a predetermined gap (G1). Are spaced apart to form a second electrode group (Q), and then a second ceramic dielectric layer (51) is formed for each second electrode group (Q) with a second flexible group. The second green sheet is manufactured by peeling from the conductive support (19).

  Thereafter, as shown in FIG. 20, the first green sheets Q11 and Q12 and the second green sheets Q21 and Q22 are alternately stacked and pressure-bonded, and then subdivided for each electrode. The lamination pressure bonding and subdivision process is as described with reference to FIGS.

  A green chip is obtained through the above steps. In this green chip debinding process, the groove 66 formed by the non-printing portion of the first green sheets Q11 and Q12 functions as a path for extracting the organic solvent and the vaporized gas of the binder to the outside. Generation of delamination and cracks in the process can be suppressed. Therefore, it is possible to avoid a decrease in product characteristics and a decrease in product yield.

  FIG. 21 shows an example in which a laminated combination of one first green sheet Q11 and two second green sheets Q21 and Q22 is repeated as many times as necessary.

The number of combinations and the number of repetitions of the first green sheets Q11 and Q12 and the second green sheets Q21 and Q22 are not limited to the examples shown in FIGS. 20 and 21 show only one example.
Experiment The thickness of the ceramic dielectric layer 51 per layer is set to 3.0 μm, the electrode 61 is printed on the ceramic dielectric layer 51, and then the same material system as the ceramic dielectric layer 51 is formed around the electrode 61. The auxiliary dielectric layer 65 was formed by screen printing. The auxiliary dielectric layer 65 was formed so that the width of the groove 66 was 5, 50, 100, 150 μm. The grooves 66 were formed in the longitudinal direction X and the width direction Y in the manner shown in FIGS.

  300 layers of the green sheets thus obtained were laminated and subjected to a pressure bonding and cutting process to obtain a green chip having an outer plane shape of 2.0 mm × 1.2 mm. The green chip was subjected to a binder removal step at 270 ° C. and further baked at 1250 ° C. Then, the internal structural defect resulting from delamination was observed about 50 pieces, and the presence or absence of the crack was confirmed about 1000 pieces. The presence or absence of cracks was confirmed by appearance observation. Moreover, the swelling of the product was confirmed with a microscope. Furthermore, about 100,000 pieces, the mounting test was done by Matsushita Electric Industrial Co., Ltd. MV2V, and the occurrence probability of the defect was confirmed. The results are shown in Table 1.

  As shown in Table 1, if the groove width is in the range of 5 μm to 100 μm, none of delamination, cracks and mounting defects occurs. When there was no groove, delamination occurred in 3 out of 50 and cracks occurred in 21 out of 1000. When the groove width was 150 μm, no delamination and cracks were observed, but a mounting failure was observed in 1 in 100,000. In the absence of the auxiliary dielectric layer, no delamination and cracks were observed, but mounting defects were recognized in 16 out of 100,000.

  From the results of Table 1, it can be seen that when the groove width is in the range of 5 μm to 100 μm, it is possible to eliminate defects during mounting due to deformation of the chip capacitor and to suppress structural defects such as delamination and cracks.

It is a figure which shows the process included in the manufacturing method of a ceramic electronic component. It is a top view which shows the ceramic dielectric material layer obtained by the process of FIG. It is a figure which shows the process after the process shown in FIG. It is a top view which shows the electrode arrangement | positioning state obtained by the process shown in FIG. 5 is an enlarged plan view showing an electrode arrangement state shown in FIG. It is a figure which shows the process after the process shown in FIGS. FIG. 7 is a plan view showing a state of an auxiliary dielectric layer obtained by the process shown in FIG. 6. FIG. 7 is a partially enlarged plan view of FIG. 6. FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. FIG. 10 is an enlarged cross-sectional view taken along line 10-10 in FIG. It is a front view which shows the process after the process shown in FIGS. FIG. 12 is a front view showing a step after the step shown in FIG. 11. It is a figure which shows the green sheet lamination | stacking state in the lamination process of FIG. FIG. 14 is a front view showing a step after the step shown in FIGS. 12 and 13. It is front sectional drawing which shows the process after the process shown in FIG. FIG. 16 is a cross-sectional view of a green chip obtained through the process shown in FIG. 15. FIG. 17 is a plan view of the green chip shown in FIG. 16 with the protective layer 53 removed. FIG. 18 is a cross-sectional view after firing the green chip shown in FIGS. 16 and 17. FIG. 19 is a right side view of the green chip shown in FIG. 18. It is a figure which shows another lamination state of the green sheet in a lamination process. It is a figure which shows another lamination state of the green sheet in a lamination process.

Explanation of symbols

51 Ceramic Dielectric Layer 61 Electrode 65 Auxiliary Dielectric Layer 66 Groove Q Electrode Group

Claims (4)

A method for manufacturing a ceramic electronic component, comprising:
On the ceramic dielectric layer formed on the flexible support, an electrode group in which a plurality of rectangular electrodes are aligned with a predetermined interval is formed.
Next, printing an auxiliary dielectric layer in the interval and around the electrode group, the auxiliary dielectric layer having a groove by a non-printing portion, and the groove from the corner of the electrode A method of manufacturing a ceramic electronic component extending obliquely outward.   2. The method of manufacturing a ceramic electronic component according to claim 1, wherein the width of the groove is in a range of 5 [mu] m to 100 [mu] m. A method for manufacturing a ceramic electronic component, comprising:
On the ceramic dielectric layer formed on the flexible support, an electrode group in which a plurality of rectangular electrodes are aligned with a predetermined interval is formed.
Next, an auxiliary dielectric layer is printed in the interval and around the electrode group, and the auxiliary dielectric layer has a groove due to a non-printing portion, and the groove is obliquely outward from the corner of the electrode. Extending to
The ceramic dielectric layer is peeled from the flexible support for each electrode group to produce a green sheet,
Next, a plurality of green sheets obtained by peeling are laminated and pressure-bonded,
Then, the manufacturing method of the ceramic electronic component including the step which subdivides for every said electrode. A method for manufacturing a ceramic electronic component, comprising:
On the first ceramic dielectric layer formed on the first flexible support, a first electrode group in which a plurality of rectangular electrodes are arranged at a predetermined interval is formed.
Next, an auxiliary dielectric layer is printed in the interval and around the first electrode group, and the auxiliary dielectric layer has a groove due to a non-printing portion, and the groove is formed from a corner of the electrode. Extending diagonally outwards,
Peeling the first ceramic dielectric layer from the first flexible support for each of the first electrode groups to produce a first green sheet;
On the other hand, separately from the above steps, a plurality of second electrodes are arranged at predetermined intervals on a second ceramic dielectric layer formed on the second flexible support. Forming a second electrode group;
Next, the second ceramic dielectric layer having the second electrode group is peeled off from the second flexible support for each of the second electrode groups to form a second green sheet. Manufacture and
Next, the first green sheet and the second green sheet are laminated and pressure-bonded,
Then, the manufacturing method of the ceramic electronic component including the step which subdivides for every said electrode.

Images