JP2005050987A - Wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board that can operate normally even if there occurs any disconnection in a conduction path. <P>SOLUTION: The wiring board 1 wherein a circuit pattern is formed in an insulation substrate 11 is provided with a jumper wire 7 connected in parallel to a part of a conduction path 12 with consecutive circuit patterns. The jumper wire 7 is driven in the surface of the insulation substrate 11 or the rear surface thereof, and it is connected with a part of the conduction path 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wiring board that is mounted on an electric device by mounting an electronic component, a transformer, or the like.

  A circuit board is formed on one side of an insulating substrate made of insulating synthetic resin, etc., with a circuit pattern made of conductive paths made of thin metal foil, and the insulating substrate and the conductive path penetrate through the land provided in these conductive paths. A through hole is formed. Electronic parts and parts such as transformers are mounted by inserting their pin terminals into the through holes, and soldering the pin terminals and conductive paths to form an electric circuit. The wiring board on which the electronic components and the like are mounted is mounted in the casing of the electric device. Electrical equipment has been tested for impact resistance through drop tests and the like so that it will not be damaged by the impact it receives during transportation.

When a heavy component such as a transformer is attached to the wiring board, such as a microwave oven, the weight of the wiring board is added to prevent the conductive path of the wiring board from being cracked or disconnected by a drop test. A plurality of support bosses for supporting the portion are provided in the case of the wiring board, and solder is thickly attached to the conductive path to increase the strength of the conductive path itself.
Japanese Utility Model Publication No. 4-36208

  As described above, even if the supporting boss is provided and the strength of the conductive path is increased, the conductive path may be cracked or disconnected in the drop test. In order to solve this problem, it is conceivable to add a support boss that supports the portion where the disconnection occurs. However, there is a case where the support boss cannot be provided due to the structure.

  The present invention has been made for the purpose of solving the above-described problems, and an object of the present invention is to obtain a wiring substrate that can ensure conduction of a conductive path even if a crack or disconnection occurs in the conductive path.

  In order to achieve the above object, a wiring board according to the present invention includes a jumper line connected in parallel with a part of a continuous conductive path of a circuit pattern. The jumper wire is provided in a portion where a crack or disconnection is likely to occur in the conductive path. Thereby, even if a crack or disconnection occurs in this portion, the conduction of the conductive path is ensured by the jumper wire.

  In a preferred embodiment of the present invention, a circuit pattern is formed on the back surface of the insulating substrate, and jumper wires are driven from the surface of the insulating substrate to be connected to the conductive path. According to the above configuration, the jumper wires driven into the wiring board from the surface side can be soldered together with the pin terminals of other electrical components by flow soldering, so that the number of man-hours does not increase.

  In a preferred embodiment of the present invention, a circuit pattern is formed on the back surface of the insulating substrate, and a jumper line is driven from the back surface of the insulating substrate to be connected to the conductive path. According to the said structure, when a jumper wire cannot be driven in from the surface side, a jumper wire can be connected in parallel with a conductive path.

  In the wiring board of the present invention, a jumper wire that forms a conductive path in parallel with a part of the conductive path is connected along the conductive path of the circuit pattern. Since it flows through the jumper wire, there is no problem in the operation of the electrical equipment.

  Embodiments of a wiring board according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a longitudinal sectional view of a microwave oven power supply unit according to the first embodiment of the present invention. As shown in FIG. 2, the wiring substrate 1 has an insulating substrate 11 and a conductive path 12 made of a metal foil that forms a circuit pattern on the back surface thereof, and is a pin that opens to a land 13 provided in the conductive path 12. A terminal insertion hole 14 is formed. As shown in FIG. 1, mounting bosses 21 and 21 of the wiring board 1 and a plurality of supporting bosses 22 and 22 that support the lower surface of the wiring board 1 are formed on the upper surface of the case 2 that supports the wiring board 1. Yes. The case 2 has a container shape opened upward so as to accommodate the planar rectangular wiring board 1. The wiring board 1 is attached to the mounting bosses 21 and 21 with screws 3 and 3. On the upper surface of the wiring board 1, a high voltage generating transformer 4, a power transistor heat sink 5 (not shown), other electronic components 6 and a jumper wire 7 are attached. The pin terminal 41 of the transformer 4, each pin terminal 61 of each component 6, and the legs 71 and 72 of the jumper wire 7 are respectively inserted into the insertion holes 14 of FIG. Soldered.

  As shown in FIGS. 2 and 3, the jumper wire 7 is a conductive wire formed in a U-shape, and its two leg portions 71 and 72 are formed on one continuous conductive path 12 of a circuit pattern. It is driven into the insertion holes 14 a and 14 b and soldered to the conductive path 12. Thus, the conductive path 12 and the jumper wire 7 are connected in parallel between the two insertion holes 14a and 14b. A part of the conductive path 12 to which the jumper wires 7 are connected in parallel is a part where the conductive path 12 may be cracked or disconnected in a drop test or the like.

  The support bosses 22 and 22 shown in FIG. 1 are arranged at a position for supporting a heavy load portion of the wiring board 1, but are supported at the best position because of the relationship with the positions of the pin terminals 41 and 61. Since the boss 22 cannot be provided, the conductive path 12 may be cracked or disconnected in the drop test. If the jumper wire 7 is connected in parallel with the conductive path 12 so as to include this portion as in the present embodiment, even if a crack or breakage occurs in the conductive path 12, the jumper wire 7 ensures energization. No problem occurs in the operation of the electric circuit. The jumper wire driven into the wiring board from the surface side can be soldered simultaneously by the flow soldering together with the pin terminals of other electrical components, so that the number of man-hours does not increase.

  FIG. 4 is an enlarged side view showing a mounted state of the jumper wire 7 of the second embodiment. In the second embodiment, the leg portions 71 and 72 of the jumper wire 7 are driven into the insertion holes 14 a and 14 b from the back side of the wiring board 1 on which the conductive path 12 is formed, and soldered to the conductive path 12. According to this configuration, even when the jumper wire 7 cannot be arranged on the surface side of the wiring board 1, the jumper wire 7 can be attached, and the same effect as in the first embodiment can be obtained.

  FIG. 5 is an enlarged side view showing a mounted state of the jumper wire 7 of the third embodiment. In the third embodiment, the leg portions 71 and 72 of the jumper wire 7 are formed in a crank shape bent at 90 degrees in the opening direction, and the bent portions 71 a and 72 a are formed on the conductive path 12 on the back side of the wiring board 1. Soldered to. According to this configuration, even when the jumper wire 7 cannot be driven into the wiring board 1 as in the second embodiment, the jumper wire 7 can be attached, and the same effect as in the first embodiment can be obtained.

It is a longitudinal cross-sectional view of the microwave oven power supply part which concerns on 1st Embodiment of this invention. It is the expanded perspective view which shows the attachment state of the jumper wire of 1st Embodiment. It is the expanded side view which shows the attachment state of the jumper wire of 1st Embodiment. It is the expanded side view which shows the attachment state of the jumper wire of 2nd Embodiment of this invention. It is the expanded side view which shows the attachment state of the jumper wire of 3rd Embodiment of this invention.

Explanation of symbols

1 Wiring board 11 Insulating board 12 Conductive path (circuit pattern)
14a, 14b ... Insertion hole 2 Case 21 Mounting boss 22 Support boss 7 Jumper wire 71, 72 Leg of jumper wire

Claims (3)

A wiring board having a circuit pattern formed on an insulating board,
A wiring board comprising jumper wires connected in parallel with a part of a continuous conductive path of the circuit pattern.   2. The wiring board according to claim 1, wherein a circuit pattern is formed on the back surface of the insulating substrate, and the jumper wire is driven from the front surface of the insulating substrate to be connected to the conductive path. 2. The wiring board according to claim 1, wherein a circuit pattern is formed on the back surface of the insulating substrate, and the jumper wires are driven from the back surface of the insulating substrate to be connected to the conductive path.

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