JP2005050968A - Electric circuit component and its producing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high density electric circuit or a component having a high density three-dimensional electric circuit, and to provide its producing process. <P>SOLUTION: The process for producing an electric circuit component comprises steps (a) for forming a nonconductive trench structure on a substrate by curing UV-curing resin at a desired position on the substrate, (b) for forming a coating of solution containing a plating medium entirely on the surface of the substrate having the trench structure, (c) for depositing the metallic catalyst in the solution containing a plating medium on the bottom face of the trench by irradiating the bottom part of the coating existing on the bottom of the trench with light, (d) for removing the coating, and (e) for depositing a conductive substance, by plating, in the opening of the trench structure at the position where the metallic catalyst is precipitated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component having a high-density electric circuit or a high-density three-dimensional electric circuit and a method for manufacturing the same.
[0002]
[Prior art]
There is known an optical modeling method in which a three-dimensional structure is manufactured by moving a light irradiation position in a photocurable resin solution along a predetermined pattern (see Patent Document 1). In this method, a light-cured resin is cured to form a cured portion and an uncured liquid portion which are solidified by light irradiation, and the uncured liquid portion is removed to remove a three-dimensional structure. Can be obtained. Furthermore, the accuracy of the optical modeling method can be further increased by performing the two-photon absorption optical modeling method instead of the one-photon absorption optical modeling method using ultraviolet rays (see Patent Document 2).
[0003]
A method of providing an electric circuit on a three-dimensional structure obtained by such an optical shaping method is also known (see Patent Document 3). In the method of Patent Document 3, an electric circuit is formed by plating the surface of a three-dimensional structure obtained by stereolithography, applying a resist, and performing etching. However, in this method, the electrical circuit is only provided on the surface of the structure. In general, in order to form a three-dimensional electric circuit, the electric circuit must be connected in the thickness direction, and drilling and embedding metal pins in a non-conductive structure existing between the upper and lower electric circuits. This process is required.
[0004]
[Patent Document 1]
JP 56-144478 A [Patent Document 2]
Japanese Patent Publication No. 63-40650 [Patent Document 3]
Japanese Patent Laid-Open No. 10-12995
[Problems to be solved by the invention]
An object of the present invention is to provide a component having a high-density electric circuit or a high-density three-dimensional electric circuit and a method for manufacturing the same.
[0006]
[Means for Solving the Problems]
The present invention is based on the fact that an electrical circuit can be formed by applying a feature of stereolithography to form a groove structure on a substrate and depositing a conductive material in the groove by plating.
[0007]
The present invention provides a method of manufacturing an electrical circuit component, the method comprising:
(A) a step of curing a photocurable resin at a desired position on the substrate by stereolithography to form a non-conductive groove structure on the substrate;
(B) forming a coating film of a plating catalyst-containing solution on the entire surface of the substrate having the groove structure;
(C) depositing a metal catalyst in the plating catalyst-containing solution on the bottom surface of the groove by irradiating the bottom of the coat film existing on the bottom surface of the groove with light;
(D) a step of removing the coating film; and (e) a step of depositing a conductive substance in the opening of the groove structure at a position where the metal catalyst is deposited by a plating method;
including.
[0008]
In a preferred embodiment, the method further includes a step of repeating the steps (a) to (e) a predetermined number of times.
[0009]
In a more preferred embodiment, the light for depositing the metal catalyst in the step (c) is a femtosecond laser.
[0010]
In a more preferred embodiment, a femtosecond laser is used in the stereolithography.
[0011]
In a more preferred embodiment, the plating is electroless plating.
[0012]
The present invention also provides an electric circuit component manufactured by any of the methods described above.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
The method for producing an electric circuit component of the present invention includes the following steps:
(A) a step of curing a photocurable resin at a desired position on the substrate by stereolithography to form a non-conductive groove structure on the substrate;
(B) forming a coating film of a plating catalyst-containing solution on the entire surface of the substrate having the groove structure;
(C) depositing a metal catalyst in the plating catalyst-containing solution on the bottom surface of the groove by irradiating the bottom of the coat film existing on the bottom surface of the groove with light;
(D) a step of removing the coating film; and (e) a step of depositing a conductive substance in the opening of the groove structure at a position where the metal catalyst is deposited by a plating method;
including.
[0014]
Hereinafter, the manufacturing method of the electric circuit component of this invention is demonstrated in order of a process.
[0015]
First, in the step (a), the photocurable resin is cured at a desired position on the substrate by stereolithography to form a nonconductive groove structure on the substrate.
[0016]
In the present invention, the substrate is a member constituting an electric circuit component and means a member for forming an electric circuit on the surface thereof, and its shape is not particularly limited. A conductive material or a non-conductive material may be used, or they may be mixed. For example, an electrode or an electric circuit may be formed on the surface in advance.
[0017]
The photocurable resin used in the optical modeling method is not particularly limited as long as it is non-conductive. Examples thereof include AZ CTP-100 (manufactured by Clariant Japan Co., Ltd.) and ACR10 (manufactured by Toyo Gosei Co., Ltd.).
[0018]
The light irradiated to the photocurable resin in the optical modeling method is not particularly limited as long as it has a wavelength and an energy level necessary for curing the resin. Since the photocurable resin generally has a large absorption at the ultraviolet wavelength, for example, the ultraviolet ray is condensed and irradiated. In order to increase the processing accuracy of stereolithography, it is preferable to use a laser. For example, as a laser in which a curing reaction of a photocurable resin is induced by absorption of one photon, a He—Cd laser, an Ar ion laser, a YAG laser, and an excimer laser can be given. Examples of the laser in which the curing reaction of the photocurable resin is induced by the multiphoton absorption phenomenon include a femtosecond laser (for example, a Ti-doped Al ₂ O ₃ laser). It is more preferable to use a femtosecond laser in that a point smaller than the beam spot can be cured by a multiphoton process by focused irradiation.
[0019]
By such an optical modeling method, a groove structure is formed with a photo-curable resin so that a position where an electric circuit is to be formed on the substrate becomes a groove. In the step of forming the groove structure, since the photocurable resin is cured at a desired position on the substrate, this position cannot be a groove. Therefore, the “desired position on the substrate” means a subsequent step. The part where the electric circuit is not formed is intended. When forming the groove structure, the substrate may be irradiated with light in a state of being immersed in a photocurable resin solution. Alternatively, the groove depth can be reduced by thinly coating a photocurable resin on the substrate by spin coating or the like. The depth and width of the groove are appropriately determined according to the purpose, and are usually 5 to 100 μm and 0.05 to 5 μm, respectively.
[0020]
Next, in step (b), a coating film of a plating catalyst-containing solution is formed on the entire surface of the substrate having the groove structure.
[0021]
Here, the plating catalyst-containing solution refers to a solution for applying a plating catalyst. Examples of the plating catalyst-containing solution include a metal ion-containing solution and a metal complex solution, and a solution containing Pd, Pt or the like as a catalyst can be used. Preferably, an activation solution used in a two-component method of electroless plating is used. More preferably, a photosensitive catalyst-containing solution can be used.
[0022]
In this step (b), the plating catalyst-containing solution is thinly applied to the entire surface of the groove structure on the substrate formed in the step (a) to form a coat film. The method of applying is not particularly limited. Usually, in electroless plating, the substrate surface is etched as a pretreatment for applying a catalyst. However, in the present invention, it is not always necessary to etch.
[0023]
Next, in step (c), the metal catalyst in the plating catalyst-containing solution is deposited on the bottom of the groove by irradiating light to the bottom of the coat film existing on the bottom of the groove.
[0024]
The light used in this step may be any light as long as it has energy capable of precipitating metal and can accurately irradiate the bottom of the groove, and may be the same as the light used in the stereolithography of the above step (a). May be different. In view of irradiation accuracy, it is preferable to use a femtosecond laser.
[0025]
Next, in the step (d), the coat film is removed. In the step (c), the metal catalyst is deposited on the bottom of the groove by light irradiation, while the coat film remains in a liquid state on the substrate. Therefore, the coat film is removed by washing with water, for example.
[0026]
Next, in the step (e), a conductive material is deposited on the opening of the groove where the metal catalyst is deposited by plating.
[0027]
The plating method in this step may be an electroless plating method or an electrolytic plating method subsequent to the electroless plating method. The electroless plating method is preferable in that there are few steps. The conductive substance to deposit is a metal, Preferably, copper, silver, gold | metal | money, platinum, nickel etc. are mentioned. The plating method is performed under the conditions normally performed by those skilled in the art. Typically, the entire substrate is immersed in a plating solution containing these metals, and the metal is deposited in the groove from the bottom to the opening.
[0028]
In this way, an electric circuit made of a conductive material is formed in the groove of the groove structure on the substrate, and an electric circuit component is obtained. Since the electric circuit component of the present invention can be processed by a laser, a high-density electric circuit can be formed.
[0029]
Furthermore, a three-dimensional electric circuit can be manufactured by repeating the cycle from the steps (a) to (e). That is, when the cycle from the step (a) to the step (e) is performed using the electric circuit component formed in the first cycle from the step (a) to the step (e) as a substrate, it is formed in the first cycle. A new electric circuit can be formed on the electric circuit. Usually, the electrical circuit is formed in a pattern different from that formed in the previous cycle. By repeating this cycle several times, an electric circuit component having an electric circuit with a three-dimensionally complicated structure can be manufactured.
[0030]
Hereinafter, the method of the present invention will be described more specifically with reference to the drawings. However, the drawings are only examples, and the present invention is not limited to the drawings.
[0031]
As shown in (a1) -1 of FIG. 1, in this example, the planar electrode 20 is provided on the substrate 10 in advance. A photocurable resin solution 30 is coated on the substrate 10 provided with the planar electrode 20 as shown in (a1) -2 of FIG. Next, the femtosecond laser 90 is condensed and irradiated through the lens 92 while being scanned in the direction of the arrow, for example, and the photocurable resin is cured at a desired position on the substrate to form the photocurable resin molded body 40. ((A1) -3 in FIG. 1). Next, the uncured photocurable resin solution 30 is removed to obtain a substrate having a groove structure made of the photocurable resin molded body 40 ((a1) -4 in FIG. 1). The process shown in FIG. 1 corresponds to the optical modeling process (a) in the method of the present invention.
[0032]
Next, as shown in FIG. 2B1, a coating film 50 of a plating catalyst-containing solution is formed on the entire surface of the substrate having a groove structure. By irradiating, for example, a femtosecond laser 90 to the bottom of the coating film 50 existing on the bottom surface of the groove, the metal catalyst 60 in the plating catalyst-containing solution is deposited on the bottom surface of the groove (FIG. 2 (c1)). ). After deposition of the metal catalyst 60, the coat film 50 is removed to obtain a substrate having the catalyst on the bottom surface of the groove (FIG. 2 (d1)). Next, this substrate is immersed in an electroless plating solution, and a conductive material 70 is deposited in the groove to form an electric circuit (FIG. 2 (e1)). In this way, the electric circuit component 100 in which the electric circuit made of the conductive material 70 is formed in the groove of the groove structure on the substrate 10 is obtained.
[0033]
Further, as shown in (a2) of FIG. 3, the electrical circuit component 100 (FIG. 2 (e1)) obtained in the first cycle is used as a substrate, and photocuring is performed by the stereolithography of the step (a2). A groove structure made of the conductive resin molded body 40 is formed. Next, a coating film 50 of a plating catalyst-containing solution is formed, and a metal catalyst 60 is deposited by the femtosecond laser 90 (FIG. 3 (c2)). After removing the coating film 50, the conductive material 70 is deposited by dipping in an electroless plating solution, and an electric circuit component 100 ′ having a three-dimensional electric circuit is obtained (FIG. 3 (e2)). Similarly, a more complicated electric circuit can be formed by repeating from the stereolithography step (a) to the electroless plating step (e) (FIGS. 3A3 and 3E3).
[0034]
【The invention's effect】
According to the present invention, an electric circuit component having a three-dimensional complicated electric circuit can be manufactured without drilling or the like. In addition, since the width and depth of a circuit to be formed can be accurately adjusted using a laser or the like, an extremely fine three-dimensional electrical circuit can be formed. Therefore, it is possible to manufacture an electric circuit component having a high-density three-dimensional electric circuit.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic cross-sectional view of an electric circuit component for explaining a procedure of an optical modeling method that is step (a) of the method for manufacturing the electric circuit component of the present invention.
FIG. 2 is a schematic cross-sectional view of an electric circuit component for explaining steps (b) to (e) of the method for manufacturing the electric circuit component of the present invention.
FIG. 3 is a schematic cross-sectional view of an electric circuit component showing a process of repeatedly manufacturing the electric circuit component from steps (a) to (e) of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Planar electrode 30 Photocurable resin solution 40 Photocurable resin molding 50 Coated film 60 of plating catalyst containing solution Metal catalyst 70 Conductive substance 90 Femtosecond laser 92 Lens 100 Electric circuit component 100 on which an electric circuit is formed '' Electrical circuit component with 3D electrical circuit

Claims (6)

An electrical circuit component manufacturing method comprising the following steps:
(A) a step of curing a photocurable resin at a desired position on the substrate by stereolithography to form a non-conductive groove structure on the substrate;
(B) forming a coating film of a plating catalyst-containing solution on the entire surface of the substrate having the groove structure;
(C) depositing a metal catalyst in the plating catalyst-containing solution on the bottom surface of the groove by irradiating the bottom of the coat film existing on the bottom surface of the groove with light;
(D) a step of removing the coating film; and (e) a step of depositing a conductive substance in the opening of the groove structure at a position where the metal catalyst is deposited by a plating method;
Including a method. The method according to claim 1, further comprising the step of repeating the step (a) to the step (e) a predetermined number of times. The method according to claim 1 or 2, wherein the light for depositing the metal catalyst in the step (c) is a femtosecond laser. The method according to any one of claims 1 to 3, wherein a femtosecond laser is used in the stereolithography. The method according to claim 1, wherein the plating is electroless plating. An electric circuit component manufactured by the method according to claim 1.

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