JP2007085831A - Forming method of metallic electromechanical function element and functional substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metallic electromechanical function element forming method for easily forming a metallic electromechanical function element with large design flexibility and with high efficiency, a micro spring manufacturing method utilizing the forming method, a micro switch manufacturing method, and a functional substrate. <P>SOLUTION: This metallic electromechanical function element forming method is characterized by: forming a mold body made of cured resin having a recess for metal portion formation and formed by layering, on a substrate, cured resin unit layers severally molded by an optical molding method; forming a metal portion in the recess for metal portion formation by a metal portion forming means including a process for forming an electroless plating layer on an inner surface of the recess for metal portion formation in the mold body; and performing a mold body removal process for removing the cured resin that forms a mold body of an intermediate composed of the mold body and the metal portion. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for forming a metal electromechanical functional element used as a contact in a probe card, for example, and a functional substrate, and more particularly, to a method for forming a metal electromechanical functional element, basically the metal electromechanical machine. The present invention relates to a microspring manufacturing method, a microswitch manufacturing method, and a functional substrate using a method for forming a functional element.

  In recent years, as electronic and electrical devices such as mobile phones, personal computers, household electrical appliances, and in-vehicle electronic devices become more functional and have higher capacities, LSIs (large scale integration) mounted on such electronic and electrical devices have been developed. In the manufacturing process of LSI elements, MCM (Multi Chip Module), MCP (Multi Chip Package) and WLP (Wafer Level) are used in the manufacturing process of LSI elements. In order to obtain a bare chip (Bea Die) in which the quality required in these mounting technologies is guaranteed, a high-density mounting technology such as a package) and a small-volume mounting technology are used, and WLT (Wafer Level Test) and WLBI (Wafer Level Burn) -In) is required.

  Thus, since a considerably long time is required for inspecting the electrical performance and reliability of the manufactured LSI chip, the inspection cost is increased and the final product price is affected. Therefore, for the purpose of ensuring quality and reducing inspection costs, MDT (simultaneously inspecting many chips formed on the wafer at the wafer stage (the stage before making the bare chip) Multi Die Test), FWT (Full Wafer Test) for performing functional tests on all chips constituting the wafer, and WLBI (Wafer Level Burn-in) for performing burn-in tests on all chips constituting the wafer at the same time. Inspection methods have been put into practical use.

  In order to perform performance inspection by such a method, it is necessary to inspect many chips at the same time. Therefore, an inspection contact is brought into contact with each of a plurality of electrodes to be inspected on a wafer, and a power source and A probe card having a number of contacts corresponding to the number of electrodes to be inspected at the same time is required so that an input signal can be supplied and an output can be taken out from the electrode to be inspected to determine the appropriateness of the signal.

On the other hand, as a probe card for LSI chip inspection, generally, for example, a currant lever type probe card in which a metal needle made of a metal material such as tungsten is implanted, or a metal material having excellent spring characteristics such as phosphor bronze. A vertical probe card in which wires are implanted, a probe card in which spring-like needles made of a metal material such as nickel are implanted by an electroforming method (hereinafter also referred to as “spring type probe card”), polyimide A probe card (hereinafter also referred to as “printed circuit board type probe card”) made of a flexible printed circuit board having a configuration in which a wiring pattern and bumps are formed on the surface of the sheet is used (see, for example, Patent Document 1). ).
In recent years, a method of forming a probe card for LSI chip inspection by simultaneously forming many three-dimensional contacts by applying MEMS (micro electrical mechanical system) technology such as photolithography and electroforming. Has been attracting attention.

  However, as a probe card for simultaneously performing the performance inspection of all the chips constituting the wafer at the wafer stage, for example, when a wafer having a diameter of 8 inches is to be inspected, more than 10,000, specifically, Those having about 30,000 contacts are required, and when a wafer having a diameter of 12 inches is to be inspected, those having more than 20,000 contacts, specifically about 60,000 contacts However, it is difficult to accurately arrange a large number of contacts on a probe card of a commonly used form such as a currant lever type probe card, a vertical probe card, a spring type probe card, Even if it can be manufactured, the probe card itself is expensive, resulting in a high inspection cost. There is.

  In addition, a system LSI or the like requires several probe cards per product type for performance inspection, and a DRAM (Dynamic Random Access Memory) or Flash RAM requires about several tens to a hundred devices per product type. When the probe card is manufactured by applying the MEMS technology, the initial cost in the photolitho technology, the thin film formation technology, the plating technology, and the fine joining technology, etc. The problem is that it is difficult to apply this MEMS technology practically because the manufacturing cost becomes very high because the process cost is high and the manufacturing process takes a considerably long time, so it is difficult to ensure a high yield. There is.

  Specifically, for example, the following method is widely used as a method for forming the contact in the probe card for simultaneously performing the performance inspection of all the chips constituting the wafer at the wafer stage. In such a technique, there is a problem that high formation efficiency cannot be obtained because a lot of processes are required and each process is complicated.

  In the following, as shown in FIG. 32, a post portion 31 extending above the electrode portion 21A (upward in FIG. 32) and one end portion 32A (left end portion in FIG. 32) of the circuit board 20 are integrated with the post portion 31. A beam portion 32 extending in the surface direction of the circuit board 20 (left and right direction in FIG. 32), and an upward protruding portion 33 extending upward from the upper surface of the other end portion 32B (right end portion in FIG. 32) of the beam portion 32. A method for forming a metal electromechanical functional element which is a contact having a configuration comprising:

First, as shown in FIG. 33, a circuit board 20 on which a wiring pattern 21 is formed is prepared, and after the common electrode layer 101 for electrolytic plating is formed on the lower surface of this circuit board 20 (the lower surface in FIG. 33), A laminated body 102 in which a plurality of post part resist layers having post part forming through holes 102A are laminated on the upper surface (upper surface in FIG. 33) of the substrate 20 at a portion corresponding to the position of the electrode part 21A in the wiring pattern 21. As shown in FIG. 34, a nickel plating layer 103 is formed in the post portion forming through hole 102A in the laminate 102, and the surface of the nickel plating layer 103 is polished, and then the nickel plating layer 103 is formed. A beam partial forming common electrode layer 104 is formed by sputtering on the surface of this and the surface of the laminate 102.
Next, as shown in FIG. 35, a beam portion resist layer 105 having a beam portion forming through hole is formed on the beam portion forming common electrode layer 104, and light etching treatment is performed in the beam portion forming through hole. After forming an etching copper layer, a nickel plating layer and a copper plating layer (in FIG. 35, these are collectively referred to as “metal layer 106”) are formed in this order by an electrolytic plating method. After polishing the surface, a laminated body 107 is formed by laminating a plurality of upper projecting portion resist layers having upper projecting portion forming through holes, and light etching is performed in the upper projecting portion forming through holes. An etching copper layer is formed by processing, and a nickel plating layer (in FIG. 35, this nickel metal layer is formed on the etching copper layer by electrolytic plating. Together and etching the copper layer that is formed just below the key layer and the nickel plating layer shown as "metal layer 108 '.) Is formed, and polishing the surface of the nickel plating layer.
Further, after peeling the laminated body 102 composed of a plurality of post portion forming resist layers, the beam portion resist layer 105 and the plurality of upward projecting portion forming resist layers, the electroplating common electrode layer 101 and The functional element having the configuration as shown in FIG. 32 is removed from the upper surface of the circuit board 20 by removing the portion other than the portion integrated with the metal layer 106 of the beam forming common electrode layer 104 by etching. Formed on top.

Japanese Patent Laying-Open No. 2005-069712

The present invention has been made based on the above circumstances, and a first object of the present invention is to easily form a metal electromechanical functional element with a high degree of design freedom and high efficiency. Another object of the present invention is to provide a method for forming a metal electromechanical functional element that can be used.
A second object of the present invention is to provide a method of manufacturing a microspring that can be easily manufactured with a high degree of design freedom and high efficiency.
A third object of the present invention is to provide a method of manufacturing a microswitch that can be easily manufactured with high design freedom and high efficiency.
A fourth object of the present invention is to provide a functional substrate in which a microspring including a metal spring element is provided on the upper surface of the substrate.

The method for forming a metal electromechanical functional element of the present invention comprises a post portion extending upward on the upper surface of the substrate, and a beam portion extending continuously in the surface direction of the substrate integrally with the post portion, A method of forming an electromechanical functional element including a metal deformable element that is elastically deformable so that the beam portion is curved in the vertical direction,
By performing an intermediate formation process on the substrate, an intermediate body in which a post part and a beam part are formed in a mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical shaping method, and the metal in the mold body An intermediate body comprising a mold part and a metal part by forming a metal part in the metal part forming recess by means of metal part forming means including a process of forming an electroless plating layer on the inner surface of the part forming recess. Is a step of forming
Then, the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body is performed.

  In the method for forming a metal electromechanical functional element according to the present invention, the substrate is preferably a circuit board, and the post portion is preferably formed in a state of being electrically connected to an electrode portion or a wiring portion of the substrate. .

  In the method for forming a metal electromechanical functional element of the present invention, in the metal part forming means in the intermediate forming step, a plating base layer is formed on the inner surface of the metal part forming recess by electroless plating. It is preferable that the metal adhesion operation by the electrolytic plating process is repeated once or more on the plating base layer.

The method for forming a metal electromechanical functional element of the present invention includes a first post portion extending upward on the upper surface of the substrate, and extending in the direction of the surface of the substrate integrally and continuously with the first post portion. A first beam portion; a second post portion extending upward from the upper surface of the first beam portion; and a second post extending in parallel with the first beam portion integrally with the second post portion. Forming an electromechanical functional element including a metal deformable element composite that is elastically deformable so that both the first beam portion and the second beam portion are vertically curved. A way to
By performing the first intermediate formation step on the substrate, a first intermediate body is formed in which the first post portion and the first beam portion are formed in the first mold,
By performing the second intermediate formation step on the first intermediate, the second intermediate formed by forming the second post portion and the second beam portion on the second mold is obtained. Formed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed in which the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body is removed at once.

  In this method for forming a metal electromechanical functional element of the present invention, the substrate is a circuit board, and the first post portion of the first intermediate body is electrically connected to the electrode portion or the wiring portion of the substrate. It is preferable to form in the state.

The manufacturing method of the microspring of the present invention comprises a post portion extending upward on the upper surface of the substrate, and a beam portion having one end portion extending continuously in the direction of the surface of the substrate integrally with the post portion, A method of manufacturing a microspring including a metal deformable element in which the other end of the beam portion can be elastically displaced in the vertical direction,
By performing an intermediate formation process on the substrate, an intermediate body in which a post part and a beam part are formed in a mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical shaping method, and the metal in the mold body A metal part forming means that combines the process of forming an electroless plating layer on the inner surface of the recess for forming a part, forming a metal part in the recess for forming a metal part, and comprising an intermediate formed by the mold body and the metal part. A process of forming a body,
Then, the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body is performed.

  In the microspring manufacturing method of the present invention, the substrate is preferably a circuit board, and the post portion is preferably formed in a state of being electrically connected to an electrode portion or a wiring portion on the substrate.

The method for manufacturing a microspring according to the present invention includes a first post portion extending upward on the upper surface of the substrate, and a first end extending in the direction of the surface of the substrate integrally with the first post portion. A beam portion, a second post portion extending upward from the upper surface of the other end of the first beam portion, and the first beam portion with one end integrally connected to the second post portion. A microspring comprising a deformable element made of metal, the second beam portion extending in parallel, and the other end portions of the first beam portion and the second beam portion being elastically displaceable in the vertical direction A method of manufacturing comprising:
By performing the first intermediate formation step on the substrate, a first intermediate body is formed in which the first post portion and the first beam portion are formed in the first mold,
By performing the second intermediate formation step on the first intermediate, the second intermediate formed by forming the second post portion and the second beam portion on the second mold is obtained. Formed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed in which the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body is removed at once.

  In the microspring manufacturing method of the present invention, the substrate is a circuit board, and the first post portion of the first intermediate body is formed in a state of being electrically connected to the electrode portion or the wiring portion of the substrate. It is preferable.

The microswitch manufacturing method of the present invention includes a post portion extending upward on the upper surface of a substrate, a beam portion having one end portion continuously extending integrally with the post portion, and extending toward the surface of the substrate. A method of manufacturing a microswitch that includes a downwardly protruding portion that protrudes downward from the lower surface of the other end, and the other end of the beam portion is fitted with a metal deformable element that is elastically displaceable in the vertical direction. There,
By performing the intermediate formation process on the substrate, an intermediate formed by forming the post part, the downward projecting part and the beam part in the mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method, and the metal part in the mold body A metal part is formed in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the forming recess, and an intermediate body composed of the mold body and the metal part is formed. A process of forming,
Then, the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body is performed.

  In the microswitch of the present invention, the substrate is a circuit board, the post portion is formed in a state of being electrically connected to the electrode portion or the wiring portion of the substrate, and the downward projecting portion is the switch on the substrate. It is preferable that the contact portion is formed in a state of facing and spaced above the contact point portion.

  The functional substrate of the present invention includes a central post portion extending upward on the upper surface of the substrate, a lower beam portion extending integrally with the central post portion and extending in the surface direction of the substrate, and both ends of the lower beam portion. Two end post portions projecting upward from the upper surface of the upper portion, and an upper beam portion having both end portions integrally connected to the upper surface of the two end post portions, and the lower beam portion and the upper beam portion are A microspring including a metal spring element that is elastically deformable so as to bend in the vertical direction is provided.

The functional substrate according to the present invention is a micro substrate in which a plurality of metal spring elements each having a central post portion extending upward and a rectangular frame body portion connected thereto are integrally stacked on the upper surface of the substrate. A spring,
The rectangular frame-like body portion of each metal spring element includes a lower beam portion extending in the surface direction of the substrate, two end post portions projecting upward from the upper surfaces of both end portions of the lower beam portion, and the two end portions. It consists of an upper side beam part in which both end portions are integrally connected to the upper surface of the post part, and can be elastically deformed so that the lower side beam part and the upper side beam part are curved in the vertical direction,
Each metal spring element is characterized in that the lower beam portion is integrally continuous with the central post portion.

The microspring manufacturing method of the present invention includes a central post portion extending upward on the upper surface of a substrate, a lower beam portion extending integrally with the central post portion toward the surface of the substrate, and both ends of the lower beam portion. Two end post portions projecting upward from the upper surface of the upper portion, and an upper beam portion having both ends integrally connected to the upper surface of the two end post portions, and the lower beam portion and the upper beam portion are vertically oriented. A method of forming a microspring comprising a metal spring element that is elastically deformable to curve
A first intermediate forming step of forming a first intermediate body in which a central post portion and a lower side beam portion are formed in a first mold; and two end post portions and an upper side beam portion are second A metal deformable frame-shaped part forming operation comprising a second intermediate forming step for forming a second intermediate formed on the mold is performed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed in which the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body is removed at once.

  In the microspring manufacturing method of the present invention, the substrate is preferably a circuit board, and the central post portion is preferably formed in a state of being electrically connected to an electrode portion or a wiring portion on the substrate.

In the microspring manufacturing method according to the present invention, a plurality of metal spring elements each including a central post portion extending upward and a rectangular frame-like body portion connected thereto are integrally stacked on the upper surface of the substrate. A microspring
The rectangular frame-like body portion of each metal spring element includes a lower beam portion extending in the surface direction of the substrate, two end post portions projecting upward from the upper surfaces of both end portions of the lower beam portion, and the two end portions. The upper part of the upper part of the post part is composed of an upper side beam part, and the lower side beam part and the upper side beam part can be elastically deformed so as to bend in the vertical direction. A method of manufacturing a microspring in which a lower beam portion is integrally continuous with a portion,
A first intermediate forming step of forming a first intermediate body in which a central post portion and a lower side beam portion are formed in a first mold; and two end post portions and an upper side beam portion are second The metal variable shape frame-shaped part forming operation consisting of the second intermediate forming step for forming the second intermediate formed on the mold is repeatedly performed,
Each of the first intermediate formation step and the second intermediate formation step in each metal deformable frame-shaped portion forming operation was formed by laminating cured resin unit layers each molded by an optical shaping method. The metal part forming means includes a process of forming a mold made of a cured resin having a metal part forming recess and forming an electroless plating layer on the inner surface of the metal part forming recess in the mold. Forming a metal part in the recess for forming a metal part to form an intermediate body composed of a mold and a metal part;
Thereafter, a mold body that collectively removes the cured resin that forms the first mold body in the first intermediate body and the second mold body in the second intermediate body in all metal deformable frame-shaped portion forming operations. A removal process is performed.

  In the microspring manufacturing method of the present invention, the substrate is a circuit board, and in the first intermediate forming step of the first metal variable frame-shaped portion forming operation, the central post portion is an electrode portion on the substrate or It is preferably formed in a state of being electrically connected to the wiring portion.

The method for forming a metal electromechanical functional element according to the present invention includes a step of forming an electroless plating layer in a recess for forming a metal part of a mold formed on a substrate by stereolithography. This is a method for obtaining a metal electromechanical functional element made of this metal part by removing the photo-curing resin constituting the mold in the intermediate after forming the intermediate formed with the part. According to the modeling method, a mold body for molding a metal part having a three-dimensional shape such as an overhang shape or a bridge shape is selectively irradiated to an uncured layer made of a liquid photocurable resin. The cured resin unit layer of a desired shape is limited by irradiating light in a controlled state easily by the method of laminating the cured resin unit layer formed by irradiating And a plurality of cured resin unit layers can be stacked without positional alignment error, so that a mold body for molding a metal part can be formed with high degree of design freedom, high accuracy, and high accuracy. It can be formed efficiently and easily.
Therefore, according to the method for forming a metal electromechanical functional element of the present invention, a highly accurate metal electromechanical functional element can be easily formed with high design freedom and high efficiency.

  According to such a method for forming a metal electromechanical functional element, contacts in a probe card can be formed, and in particular, the multiple contacts in a probe card having a configuration including an extremely large number of contacts. They can be simultaneously formed by an easy method without requiring extremely large manufacturing costs.

  Since the microspring manufacturing method of the present invention is a technique for obtaining a microspring by basically using the above-described method for forming a metal electromechanical functional element, the microspring has a high degree of design freedom. In addition, it can be easily manufactured with high efficiency.

  In addition, the microswitch manufacturing method of the present invention is basically a technique for obtaining a microswitch by using the above-described method for forming a metal electromechanical functional element. And can be easily manufactured with high efficiency.

  The functional substrate of the present invention is obtained from the fact that a spring element having a three-dimensional structure can be easily formed by the above-described microspring manufacturing method, and a metal spring element is formed on the upper surface of the substrate. It has a three-dimensional shape that is provided with a microspring including

Hereinafter, the present invention will be described in detail.
The metal electromechanical functional element forming method of the present invention is a method for forming the following electromechanical functional elements (1) and (2).

(1) A post part extending upward on the upper surface of the substrate and a beam part extending integrally with the post part and extending in the surface direction of the substrate are elastic so that the beam part bends in the vertical direction. An electromechanical functional element including a metal deformable element that can be deformed (hereinafter also referred to as “specific functional element”).
(2) On the upper surface of the substrate, a first post portion extending upward, a first beam portion extending continuously toward the surface of the substrate integrally with the first post portion, and the first beam A second post portion extending upward from the upper surface of the portion; and a second beam portion extending continuously in parallel with the first beam portion and integrally with the second post portion. The electromechanical functional element (hereinafter also referred to as “specific composite functional element”) including a metal deformable element composite that is elastically deformable so that both of the second beam portions are curved in the vertical direction.

In the method of forming the specific function element, an intermediate body is formed on the substrate by performing an intermediate body forming step, and then an intermediate body formed by forming the post portion and the beam portion in the mold body is formed. A mold body removing process for removing the cured resin forming the mold body is performed.
In the method of forming the specific composite functional element, the first post portion and the first beam portion are formed in the first mold by performing the first intermediate forming step on the substrate. The first intermediate body is formed, and the second intermediate body forming step is performed on the first intermediate body, so that the second post portion and the second beam portion become the second mold body. A mold in which the formed second intermediate body is formed, and thereafter the first mold body in the first intermediate body and the cured resin forming the second mold body in the second intermediate body are collectively removed. A body removal process is performed.

Here, the beam portion may be any one that is curved in the vertical direction and can be elastically deformed, but the spring constant when the amount of displacement is 30 μm (hereinafter also referred to as “specific spring constant”). Preferably has an elastic property of 470 to 500 N / m.
In addition, the beam portion may be made of one kind of metal material, but a configuration in which a plurality (two or three kinds) of metal layers made of different kinds of metal materials are laminated (hereinafter referred to as “lamination”). It is also preferable that it is also referred to as “structure”. By making the beam portion have a laminated structure, the elastic properties of the beam portion can be controlled by selecting the metal material constituting the metal layer in the laminated structure, and high elastic properties can be obtained. May be possible. In particular, in the case of a laminated structure (two-layer structure) made of two kinds of metal materials, a bimetallic effect is expected, so there is a possibility that the pressing force when used under high temperature conditions can be improved. is there.

  The substrate on which the metal electromechanical functional element is formed is preferably a circuit board on which a wiring pattern including an electrode portion and a wiring portion is formed. On such a circuit substrate, a metal electromechanical machine is provided. The functional element is formed in an electrically connected state on the electrode portion of the circuit board.

  The intermediate body forming step is also referred to as a mold body (hereinafter also referred to as “resin mold body”) made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers molded by an optical modeling method. And a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the resin mold obtained in the mold forming process. This is a process comprising a metal part forming process in which a metal part is formed in the metal part forming recess to form an intermediate made of a resin mold and a metal part.

  In the mold forming process, a resin mold is formed by an optical modeling method. This optical modeling method is used for forming a resin mold to be modeled on an uncured layer (n) made of a liquid photocurable resin. A cured resin unit layer (n) is formed by selectively irradiating light based on the slice shape data (n), and a new photocurable resin is supplied onto the cured resin unit layer (n). A cured layer (n-10) is formed, and the uncured layer (n-11) is selectively irradiated with light based on the slice shape data (n-11) to thereby form a cured resin unit layer (n-10). This is a method of forming a resin mold made of a laminate of cured resin unit layers by repeating the step 1).

As a stereolithography apparatus used for stereolithography, a filler is blended in a liquid photocurable resin in order to obtain excellent heat resistance and physical performance (reinforcing effect) in the resin mold to be formed. A photocurable resin composition (hereinafter also simply referred to as “composition”) is used as a material for a resin mold. For example, as shown in FIG. 1, a fixed base 10 having vertical struts 10 </ b> A and fixed to the fixed base 10. A container 11 made of a light-impermeable material such as stainless steel for containing the composition R, a light source device 12 for selectively irradiating the liquid surface of the composition R, and a vertical support And a support stage 13 for supporting the laminated body H of the cured resin unit layer provided so as to be movable up and down along 10A. The laminated body H is lowered by lowering the support stage 13 from the state shown in FIG. On the top surface of the composition R Supplied, it is used having a configuration to form an uncured layer of thickness corresponding to the descent amount of the support stage 13.
In FIG. 1, 15 is a squeegee mechanism for smoothing the liquid surface of the composition R, that is, the upper surface of the uncured layer, and 16 is a circulation pump 16A, a liquid suction side pipe 16B, and a liquid discharge side pipe 16C. Thus, among the compositions R stored in the storage container 11, the composition located near the bottom surface of the storage container 11 (below the storage container 11 in FIG. 1) is near the liquid level (of the storage container 11 in FIG. 1). Circulated means for transferring the upper part), and 17 comprises, for example, a personal computer, calculates a slice shape data group based on CAD data of the resin mold, and based on each of these slice shape data, Control means for controlling the operations of the light source device 12, the support stage 13, the squeegee mechanism 15, and the circulation means 16.

  In the optical modeling apparatus, as a control mechanism for selectively irradiating the light emitted from the light source device 12 to the liquid surface of the composition R, the composition R is moved by moving the light emitted from the light source device 12 itself. Any one of a radiant light movement method for moving the light irradiation position on the liquid surface or a stage movement method for moving the light irradiation position on the liquid surface of the composition R by moving the flat stage 13 can be used. For example, in the case where a plurality of metal electromechanical functional elements are formed on the upper surface of a substrate having a diameter of 8 inches or more, control of the stage moving method is performed from the viewpoint of light irradiation accuracy and resolution. It is preferable to use a mechanism.

  In such an optical modeling apparatus, the light source device 12 is provided with a light source unit composed of a semiconductor laser device or an ultraviolet lamp, has a line width resolution of 10 μm or more, and is adjusted by transmittance control or radiated light intensity control. It is preferable to use one having a characteristic that the cured depth is within 100 μm.

Examples of the photocurable resin that is a resin component constituting the composition R include modified polyurethane (meth) acrylate, oligoester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, photosensitive polyimide, and aminoalkyd. , Epoxy compounds, vinyl ethers, oxetanes, spiro orthoester compounds, monomers and oligomers such as vinyl ether-maleic acid and thiol-ene, and these can be used alone or in combination of two or more.
Furthermore, the composition R may contain a photopolymerization initiator that decomposes when irradiated with light to generate radicals or cations, and an additive for improving storage stability and other characteristics. .

  Examples of the filler constituting the composition R include powdery and fibrous inorganic fillers, and specifically include glass powder, silica powder, alumina, alumina hydrate, magnesium oxide, and hydroxide. Magnesium, barium sulfate, calcium sulfate, calcium carbonate, magnesium carbonate, silicate mineral, diatomaceous earth, silica sand, quartzite powder, titanium oxide, aluminum powder, bronze, zinc powder, silver powder, lead powder, gold powder, silver powder, glass fiber Potassium titanate whiskers, carbon whiskers, sapphire whiskers, beryllia whiskers, boron carbide whiskers, silicon carbide whiskers, silicon nitride whiskers, and the like can be used. Here, the average particle diameter and the average fiber length of the filler are usually 1 to 50 μm. The mixing ratio of the inorganic filler in the composition R is, for example, 100 to 140 parts by volume with respect to 100 parts by volume of the mixture of the photocurable resin and the photopolymerization initiator.

  As the composition of the composition R, for example, as a photocurable resin, “SA-1002” (manufactured by Mitsubishi Chemical Corporation) 50 parts by weight, “FA-513A” (manufactured by Kadari Kasei Co., Ltd.) 25 parts by weight 25 parts by weight of N-vinylpyrrolidone; 0.25 parts by weight of “Irgacure 651” (manufactured by Ciba Geigy) as a photopolymerization initiator; 0.1 parts by weight of p-methoxyphenol as a stabilizer As an inorganic filler, a material obtained by dispersing and mixing 160 volume parts of glass beads “GB045ZC” (manufactured by Toshiba Ballotini Co., Ltd.) can be exemplified.

  According to the optical modeling apparatus configured as described above, by inputting CAD data of the resin mold to be modeled to the control means 17, the control means 17 can obtain slice shape data at equal intervals in the height direction of the resin mold. The support stage 13 which calculated the group and received the control signal from the control means 17 descends until the stage surface 13A is positioned at a depth level corresponding to one layer from the liquid surface of the composition R. The composition R is supplied onto the stage surface 13A to form an uncured layer (first layer). Next, when the squeegee mechanism 15 that receives the control signal from the control means 17 is actuated to smooth the liquid surface of the composition R and make the thickness of the uncured layer (first layer) uniform, the control means Based on the slice shape data (first layer data) calculated by the step 17, the light from the light source device 12 is selectively irradiated to the uncured layer (first layer), and the light irradiated portion is light. Cured by polymerization, a cured resin unit layer (first layer) is formed. After that, the support stage 13 that has received the control signal from the control means 17 is further lowered by one layer, and the composition R is supplied onto the cured resin unit layer (first layer), and the uncured layer (second layer). Is formed, and the liquid level of the composition R is smoothed by the squeegee mechanism 15 that receives the control signal from the control means 17, and the thickness of the uncured layer (second layer) is made uniform by the control means 17. Based on the calculated slice shape data (second layer data), light from the light source device 12 is selectively irradiated to the uncured layer (second layer), and a portion irradiated with light is photopolymerized. Cured to form a cured resin unit layer (second layer). Thus, the resin mold body which consists of a laminated body of a cured resin unit layer is modeled by repeating formation of a non-hardened layer, smoothing of a liquid level, and formation of a cured resin unit layer.

  In this stereolithography apparatus, the composition R is circulated by the circulating means 16 (near the bottom surface) while the resin mold body is being shaped by the stereolithography or as a pre-process for starting the shaping operation. Of the composition R present in the vicinity of the liquid surface) of the composition R accommodated in the container 11 is located near the bottom surface where the dispersion ratio of the filler tends to increase over time. The composition is transferred from the opening 11A to the outside of the container 11, moved through the liquid suction side pipe 16B, the circulation pump 16A and the liquid discharge side pipe 16C, and transferred from the opening 11B into the container 11 so that the vicinity of the bottom surface The composition (filler highly dispersed state) that was present in the liquid was mixed with the composition that was present near the liquid surface.

  In the metal part forming process, the metal part is formed by the metal part forming means including the process of forming the electroless plating layer by the electroless plating method. As the metal part forming means, the metal part forming of the resin mold is performed. By a plating process (hereinafter also referred to as “specific plating process”) in which a plating base layer which is an electroless plating layer is formed on the inner surface of the recess by electroless plating, and a plating layer is further formed on the plating base layer. It is preferable to use a method of forming a metal part in the recess for forming a metal part by repeating the metal adhesion operation one or more times.

  Here, in the specific plating process related to the metal adhesion operation, either an electroplating method or an electroless plating method can be used. However, when the electroplating method is used, the plating deposition rate is high, and thus plating is performed. The time can be shortened, and the plating process can be performed under relatively low temperature conditions, so that there is an advantage that restrictions on the mold body are reduced. In addition, when the electroless plating method is used In this case, when a new intermediate formation step is performed on an intermediate including a metal part formed by the metal part forming means, a process for flattening the surface of the metal part is performed. The advantage is that there is no need to do so.

  As a specific example of the structure of the metal part formed by the specific plating process in the metal part forming means, for example, a structure comprising a nickel layer formed by an electroless plating method and a copper layer formed by an electrolytic plating method However, it is preferable to use a nickel layer formed by an electroless plating method and a nickel layer formed by an electrolytic plating method.

  Further, as the metal part forming means, a nickel plating layer or a copper plating layer is formed on the inner surface of the metal part forming recess by an electroless plating method, and this is used as a common electrode. A technique of forming a nickel plating layer on the plating layer by electrolytic plating can also be used. According to this method, since the time required for forming the metal layer can be reduced, a metal electromechanical functional element is formed with high efficiency particularly when it is necessary to form a metal layer having a large thickness. be able to.

  In the metal part forming means, the number of repetitions of the metal attaching operation constituting the specific plating step may be one or more, and is appropriately selected depending on the shape of the metal part to be formed, etc. Preferably there is.

  In the mold body removing process, the resin mold body constituting the intermediate body composed of the resin mold body and the metal part obtained in the intermediate body forming process is removed by the mold body removing process. For example, a method of removing the resin mold by dissolving the resin mold, a method of removing the resin mold by ashing, or the like can be used.

  As a solvent for dissolving the resin mold, for example, secondary methyl sulfide (DMS), tetramethylammonium hydroxide (TMAH), potassium hydroxide (KOH), sodium hydroxide (NaOH) and the like can be used.

  Specific examples of the electromechanical functional element formed by the method for forming an electromechanical functional element as described above include those having the following configurations (1) to (3).

(1) On the upper surface of the substrate, there is provided a post portion extending upward, and a beam portion having one end portion extending integrally with the post portion and extending toward the surface of the substrate, and the other end portion of the beam portion is A microspring including a metal deformable element that is elastically displaceable in the vertical direction (hereinafter also referred to as “specific cantilever spring”).
(2) A post portion extending upward on the upper surface of the substrate, a beam portion having one end integrally extending continuously with the post portion, and extending from the lower surface of the other end of the beam portion. A micro-switch (hereinafter, also referred to as a “specific switch”) including a metal deformable element that includes a downward projecting portion projecting to the other end, and the other end of the beam portion can be elastically displaced in the vertical direction.
(3) A central post portion extending upward on the upper surface of the substrate, a lower beam portion extending integrally with the central post portion toward the surface of the substrate, and upper surfaces of both end portions of the lower beam portion, respectively. An end post part protruding upward and an upper side beam part having both ends integrally connected to the upper surface of each of these two end post parts are elastic so that the lower side beam part and the upper side beam part bend in the vertical direction. Micro-spring (hereinafter also referred to as “specific hollow spring”) that combines metallic spring elements that can be deformed mechanically

  Hereinafter, each of the manufacturing method of a specific cantilever spring, the manufacturing method of a specific switch, and the manufacturing method of a specific hollow spring is demonstrated in detail using figures.

[Production method of specific cantilever spring]
FIG. 2 is an explanatory view showing an example of the configuration of a specific cantilever spring manufactured by the method for manufacturing a microspring of the present invention.
The specific cantilever spring extends on the upper surface (the upper surface in FIG. 2) of the circuit board 20 on which the wiring pattern 21 is formed, above the electrode portion 21A in the wiring pattern 21 (upward in FIG. 2). A columnar post portion 31 formed in a state of being electrically connected to 21A, and one end portion (left end portion in FIG. 2) 32A are integrally continuous with the post portion 31, and the surface direction of the circuit board 20 (FIG. 2). The other end portion (right end portion in FIG. 2) 32B of the beam portion 32 can be elastically displaced in the vertical direction (vertical direction in FIG. 2). It has a metal deformable element, and is provided with a columnar upward projecting portion 33 projecting upward from the upper surface of the other end 32B of the beam portion 32.

  As a specific example of the specific cantilever spring, the post portion 31 has a length of 40 μm, a width of 30 μm and a height of 100 μm, the beam portion 32 has a total length of 300 μm, a width of 30 μm and a thickness of 20 μm, and the upward projecting portion 33 has a diameter of 20 μm. The height L is 80 μm, and the distance L1 from the end of the post portion 31 to the center of the upward projecting portion 33 is 250 μm. A plurality of specific cantilever springs having a shape are arranged in a center pad at an arrangement pitch of 80 μm.

  The specific cantilever spring having such a configuration is obtained by performing an intermediate body forming process on the circuit board 20 to form an intermediate body in which the post portion 31, the beam portion 32, and the upper protruding portion 33 are formed in the resin mold. It is manufactured by performing the mold body removal process which removes the cured resin which forms and then forms the resin mold body in the obtained intermediate body.

  Hereinafter, the manufacturing method of the specific cantilever spring will be specifically described with reference to the drawings.

<Intermediate formation process>
(Post body and beam part mold forming process)
As shown in FIG. 3, a circuit board 20 having a wiring pattern 21 formed on the upper surface thereof is prepared. As shown in FIG. 4, an electrode portion 21A in the wiring pattern 21 is formed on the upper surface of the circuit board 20 by stereolithography. As shown in FIG. 5, a post part forming cured resin unit layer (hereinafter also referred to as “post part resin unit layer”) 47A having post part through-holes 48A is formed at a part corresponding to the position of the post part. Further, a plurality of (four layers in the illustrated example) post part resin unit layers 47B to 47E are laminated on the post part resin unit layer 47A. Further, as shown in FIG. A cured resin unit layer for forming a beam portion (hereinafter also referred to as a “beam portion resin unit layer”) having a beam portion through hole 48B communicating with the post portion through hole 48A on the partial resin unit layer 47E. By stacking 47F, a metal portion for forming the post portion 31 and the beam portion 32, which includes a plurality of post portion through-holes 48A and beam portion through-holes 48B, is formed. A resin mold part (hereinafter, also referred to as “first resin mold part”) 41 having a recess part (hereinafter also referred to as “first recess part”) 41A is formed.

Each of the post part resin unit layers 47A to 47E and the beam part resin unit layer 47F constituting the first resin mold part 41 preferably has a thickness with an aspect ratio of 3 or less. In particular, it is preferable that the aspect ratio is 0.5 to 2.0.
By making the thickness of each of the cured resin unit layers constituting the first resin mold body portion 41 such that the aspect ratio is 3 or less, the through holes in each cured resin unit layer can be surely formed into a straight wall shape. Therefore, the specific cantilever spring finally obtained can have high accuracy.
Hereinafter, in the manufacturing method of the specific cantilever spring, the same applies to the thickness of the cured resin unit layer described later.

(First metal part formation process)
As shown in FIG. 7, after performing a surface degreasing process on the inner surface of the first recess portion 41A of the obtained first resin mold portion 41, a nickel plating base layer 45A is formed by an electroless plating method, Further, the first metal layer formed by laminating the copper plating layer 45B so as to cover the nickel plating base layer 45A by repeating the metal adhesion operation to the nickel plating base layer 45A at least once (in this example, once). 45 is formed.
In the example of this figure, the first recess portion 41A is not completely filled and filled with the first metal layer 45, and a plurality of post portion through holes 48A and beam portion through holes are not provided. A hollow 45C is formed in the central portion of the region where 48B is overlapped.

Here, as the surface degreasing treatment, for example, a method such as an alkali surface treatment or an acid surface treatment can be used.
By applying such a surface degreasing process to the inner surface of the first recess portion 41A, a high adhesion strength with the nickel plating base layer 45A can be obtained on the inner surface of the first recess portion 41A.
As a specific example of the surface degreasing treatment, after performing alkaline degreasing treatment for 5 minutes at a temperature of 50 ° C., surface treatment with sulfuric acid and a surfactant for 2 minutes at room temperature, and concentration for 2 minutes at room temperature. A method of performing a surface treatment with 10% sulfuric acid in this order, further performing a pre-dip treatment for 6 minutes at room temperature, and then performing an accelerator treatment for 5 minutes at room temperature.

(Process for forming the upper protrusion part)
As shown in FIG. 8, the surface roughening treatment is performed for the purpose of flattening the surface of the first metal layer 45 formed on the inner surface of the first recess portion 41A of the first resin mold portion 41. After performing the above process, on the surface of the first resin mold part 41 and the first metal layer 45, an upper projecting portion through-hole is formed on one end portion (right end portion in FIG. 8) of the first metal layer 45 by stereolithography. 48C, and a cured resin unit layer for forming an upper protruding portion (hereinafter referred to as “upper protruding portion resin”) having a post portion forming through hole 48D in a portion corresponding to the formation position of the depression 45C in the first metal layer 45. It is also referred to as a “unit layer.”) 47G to 47J are formed in this order and stacked to form an upper protruding portion 33 including a plurality (four in the illustrated example) of the upper protruding portion through holes 48C. Recessed part for metal part formation Hereinafter, also referred to as “second recess portion”) 43A and a resin mold portion portion (hereinafter referred to as “opening 43B”) including a plurality of (four in the example of FIG. 4) post portion forming through holes 48D communicating with the recess 45C. , Also referred to as “second resin mold part”) 43.

Here, as the surface roughening treatment, for example, a mechanical treatment such as polishing treatment or a chemical treatment such as acid light etching treatment can be used.
By applying such surface roughening treatment to the surface of the first metal layer 45, a high adhesion strength with the upper protruding portion cured resin unit layer 47G is obtained on the surface of the first metal layer 45. Can do.
As a specific example of the surface roughening treatment, a surface treatment with sulfuric acid and a surfactant for 2 minutes at room temperature, and a surface treatment with 10% concentration sulfuric acid for 2 minutes at room temperature are performed in this order. A method of performing a drying process after performing a cleaning process is mentioned.

(Second metal part formation process)
As shown in FIG. 9, after washing away the uncured resin present in the recess 45C, the second recess 43A of the obtained second resin mold portion 43 and the metal surface region on the inner surface of the recess 45C. After performing a light etching process to form an etched copper layer, the second metal portion 46 made of a nickel plating layer is formed by filling each of the second recess portion 43A and the recess 45C by electrolytic plating, thereby On the upper surface of the circuit board 20, a resin mold body composed of the first resin mold body portion 41 and the second resin mold body portion 43, and a first recess portion 41 A and a second recess portion 43 A in the resin mold body. An intermediate body 40 is formed which is constituted by a metal portion made of the first metal layer 45 and the second metal layer 46 formed in the metal portion forming recess.
In the example of this figure, the tip end surface of the portion of the formed intermediate body 40 which is the upper projecting portion 33 of the metal portion is polished and thereby flattened.

<Mold body removal process>
The intermediate body 40 obtained in the intermediate body forming step is subjected to a mold body removing process, and the cured resin constituting the resin mold body is removed from the intermediate body 40 to expose the metal portion, thereby showing in FIG. A specific cantilever spring having such a configuration is formed on the upper surface of the circuit board 20.

According to such a method for manufacturing a specific cantilever spring, in the intermediate body forming step, an intermediate formed by forming a metal portion in a recess for forming a metal portion of a resin mold formed on the circuit board 20 by an optical modeling method. After forming the body 40, in the mold body removing step, by removing the cured resin constituting the resin mold body in the intermediate body 40, a specific cantilever spring made of the metal portion is obtained. Compared to the conventionally used technique as shown in 35, since many processes are not required and each process is not complicated, a specific cantilever spring is easily manufactured with high efficiency. be able to.
Moreover, in this specific cantilever spring manufacturing method, a resin mold is formed by laminating a plurality of cured resin unit layers based on CAD data of a resin mold to be modeled, using an optical modeling method for forming a resin mold. Since the body is formed, it is possible to form a resin mold having a large aspect ratio without causing harmful effects, and for example, a surface on which a cured resin unit layer is to be formed (specifically, the circuit board 20 The cured resin unit layer having a desired shape without being restricted by the shape of the upper surface of the resin or the upper surface of the cured resin unit layer to be formed immediately below the cured resin unit layer and the flatness of the surface Can be formed with high accuracy, and a plurality of cured resin unit layers can be stacked without positional alignment errors, so that a mold body for molding a metal part can be obtained. With a degree of freedom deal of design, it can be easily formed with high precision and high efficiency,
Therefore, according to the manufacturing method of the specific cantilever spring, the specific cantilever spring can be easily formed with high design freedom and high efficiency.

  Further, in the method for manufacturing the specific cantilever spring, the specific cantilever spring to be formed is formed by integrally combining the first metal layer 45 and the second metal layer 46. In the partial formation process, since the light etching process is performed on the surface of the first metal layer 45, excellent adhesion between the first metal layer 45 and the second metal layer 46 can be obtained. In practice, the specific cantilever spring having the structure shown in FIG. 2 is manufactured by the above-described manufacturing method, the specific spring constant in the beam portion of the specific cantilever spring obtained is confirmed, and then 1.25 kg is applied to the beam portion. When the specific spring constant was confirmed again after performing a displacement operation of displacing with a displacement amount of 30 μm by applying a load of 10 μm, the same value as the value of the specific spring constant immediately after manufacture was obtained.

  Furthermore, according to the manufacturing method of the specific cantilever spring of the present invention, the first post portion extending upward on the upper surface of the substrate and the one end portion of the substrate are integrally continuous with the first post portion. A first beam portion extending in the surface direction, a second post portion extending upward from the upper surface of the other end portion of the first beam portion, and one end portion thereof integrally and continuously with the second post portion. A metal variable shape comprising a second beam portion extending in parallel with the first beam portion, and the other end portions of the first beam portion and the second beam portion are both elastically displaceable in the vertical direction. A specific cantilever spring (hereinafter, also referred to as “specific cantilever composite spring”) having an element (metal deformable element composite) can be manufactured.

FIG. 10 is an explanatory view showing another example of the configuration of the specific cantilever spring manufactured by the method of manufacturing a microspring of the present invention, specifically, the configuration of the specific cantilever composite spring.
The specific cantilever composite spring extends on the upper surface (upper surface in FIG. 10) of the circuit board 20 on which the wiring pattern 21 is formed, above the electrode portion 21A (upward in FIG. 10) of the wiring pattern 21. A box-like first post portion 34 formed in a state of being electrically connected to the portion 21A, and one end portion (left end portion in FIG. 10) 35A are integrally connected to the first post portion 34, and the circuit A rectangular rod-shaped first beam portion 35 extending in the surface direction (left-right direction in FIG. 10) of the substrate 20 and the other end portion (right end portion in FIG. 10) 35B of the first beam portion 35 extend upward. A column-shaped second post portion 36 and a rectangular rod shape whose one end portion (right end portion in FIG. 10) 37A extends integrally with the second post portion 36 and in parallel with the first beam portion 35. The second beam portion 37, a columnar third post portion 38 extending upward from the upper surface of the other end portion (left end portion in FIG. 10) 37B of the second beam portion 37, and one end portion (in FIG. 10) The left end portion 39A includes a rectangular beam-like third beam portion 39 that extends integrally with the third post portion 38 and extends in parallel with the second beam portion 37, and the other end of the first beam portion 35. The other end portion 37B of the portion 35B and the second beam portion 37 and the other end portion (the right end portion in FIG. 10) 39B of the third beam portion 39 are both elastically displaced in the vertical direction (vertical direction in FIG. 10). It has a deformable metal element that is possible, and has a configuration in which a cylindrical upper protruding portion 39C protruding upward from the upper surface of the other end portion 39B of the third beam portion 39 is provided.

  In the specific cantilever composite spring having such a configuration, the first post portion 34 and the first beam portion 35 are formed in the first resin mold by performing the first intermediate forming step on the circuit board 20. The second post portion 36 and the second beam portion 37 are formed in the first intermediate body by performing a second intermediate forming step on the first intermediate body. Forming a second intermediate formed in the second resin mold, and performing a third intermediate forming step on the second intermediate, whereby the third post portion 38 and the third intermediate The beam portion 39 is formed in the third resin mold to form a third intermediate, and further, a fourth intermediate forming step is performed on the third intermediate so that the upper protruding portion 39C is formed. Forming a fourth intermediate formed in the fourth resin mold, After that, the obtained first resin mold in the first intermediate, second resin mold in the second intermediate, third resin mold in the third intermediate, and fourth intermediate The mold resin is manufactured by performing a mold body removing process for collectively removing the cured resin forming the fourth resin mold body.

  Specifically, as shown in FIG. 11, first, in the same manner as the post part and beam part mold forming process in the intermediate forming process in the method for manufacturing the specific cantilever spring according to FIG. A first resin mold body having a first metal portion forming recess 51B for forming the first post portion 34 and the first beam portion 35 on the upper surface (in the illustrated example, six layers of hardening). 2A is formed, and the specific cantilever spring according to FIG. 2 is placed in the first metal part forming recess 51B of the first resin mold 51A as shown in FIG. In the same manner as the first metal part forming step of the intermediate forming step in the manufacturing method of the above, a first metal layer 51C composed of a nickel plating base layer and a copper plating layer is formed, whereby the first resin mold body 51A is formed. And this first resin The first intermediate 51 composed of a metal part made of a first metal layer 51C formed on the first metal portion forming a recess 51B is formed in the body 51A.

  Next, as shown in FIG. 13, after surface roughening treatment is performed on the surface of the first metal layer 51C in the obtained first intermediate 51, on the first intermediate 51, In order to form the second post portion 36 and the second beam portion 37 by the same method as the post portion and beam portion mold forming step in the intermediate body forming step in the method of manufacturing the specific cantilever spring according to FIG. The second resin mold body 52A (a laminated body made up of five cured resin unit layers in the example of the figure) 52A having the second metal part forming recess 52B is formed, and as shown in FIG. In the second metal part forming recess 52B of the second resin mold 52A, in the same manner as the first metal part forming process of the intermediate body forming process in the method of manufacturing the specific cantilever spring according to FIG. Nickel plating base layer and copper plating The second metal layer 52C is formed, whereby the second resin mold body 52A and the second metal part formation recess 52B in the second resin mold body 52A are formed. A second intermediate 52 formed by the metal portion made of the metal layer 52C is formed.

  And after performing the surface roughening process with respect to the surface of the 2nd metal layer 52C in the obtained 2nd intermediate body 52, as shown in Drawing 15, on the 2nd intermediate body 52 concerned, In order to form the third post portion 38 and the third beam portion 39 by the same method as the post portion and beam portion mold forming step in the intermediate forming step in the method of manufacturing the specific cantilever spring according to FIG. The third resin mold body 53A (a laminated body made up of five cured resin unit layers in the example of the figure) 53A having the third metal part forming recess 53B is formed, and as shown in FIG. In the third metal part forming recess 53B of the third resin mold 53A, in the same manner as the first metal part forming process of the intermediate body forming process in the method of manufacturing the specific cantilever spring according to FIG. Nickel plating base layer and copper plating The third metal layer 53C is formed, whereby the third resin mold body 53A and the third metal part formation recess 53B in the third resin mold body 53A are formed. A third intermediate 53 constituted by the metal portion made of the metal layer 53C is formed.

  Furthermore, as shown in FIG. 17, after performing the surface roughening process on the surface of the third metal layer 53C in the obtained third intermediate 53, on the third intermediate 53, The fourth metal portion forming recess 54B for forming the upper protruding portion 39C by the same method as the upper protruding portion mold forming process of the intermediate forming step in the method of manufacturing the specific cantilever spring according to FIG. 54A (laminated body composed of two cured resin unit layers in the example shown in the figure) 54A is formed, and as shown in FIG. 18, the fourth resin mold 54A of the fourth resin mold 54A In the metal part forming recess 53B, in the same manner as the second metal part forming process of the intermediate forming process in the method for manufacturing the specific cantilever spring according to FIG. The metal layer 54C is formed. Accordingly, the fourth resin mold body 54A and the metal portion formed of the fourth metal layer 54C formed in the fourth metal portion formation recess 54B in the fourth resin mold body 54A are provided. 4 intermediate 54 is formed.

  Thereafter, the first intermediate 51 and the second intermediate obtained in each of the first intermediate formation step, the second intermediate formation step, the third intermediate formation step, and the fourth intermediate formation step. A mold body removing process is performed on the body 52, the third intermediate body 53, and the fourth intermediate body 54, and the cured resin constituting the resin mold body is collectively removed from these intermediate bodies. A specific cantilever composite spring having the configuration shown in FIG. 6 is formed on the upper surface of the circuit board 20.

As mentioned above, although the manufacturing method of the specific cantilever spring of this invention was demonstrated, the manufacturing method of the specific cantilever spring of this invention is not limited to this, A various change can be added.
For example, in the method of manufacturing the specific cantilever spring shown in FIG. 2, in order to form the upward protruding portion 33, the first metal layer having the first metal layer having the depression 45C in the first recess portion is formed. A resist layer having an upper protruding portion through hole and a post portion forming through hole is formed on the surface of the resin mold portion by a resist method, and plating is applied to the upper protruding portion through hole and the depression in the resist layer. The technique used can be used.
In addition, also in the manufacturing method of the specific cantilever composite spring shown in FIG.

Further, in order to form the upward projecting portion, it is not limited to forming a metal layer made of a nickel layer by an electrolytic plating method. For example, a nickel-boron layer, a nickel-phosphorus layer, a nickel-cobalt layer, and nickel-iron It is also possible to form a metal layer made of a layer or a surface layer in which a carbon differential powder is mixed on a nickel layer (hereinafter also referred to as “carbon powder-containing layer”). The upper protruding portion made of these metal layers has excellent hardness, and the upper protruding portion as a contact member has excellent durability and contact properties. Since the coefficient is reduced, more excellent durability can be obtained, and in the case of the layer composed of the carbon powder-containing layer, the oxidation suppressing ability can be obtained, so that the excellent contact property can be obtained.
Specifically, the hardness obtained in the upward projecting portion made of these metal layers is HV 300 to 600 for the nickel layer, and HV 600 to 900 for the nickel-boron layer, and nickel. -The thing consisting of a phosphorus layer is HV600-900, the thing consisting of a nickel-cobalt layer is HV700-1200, the thing consisting of a nickel-iron layer is HV700-1200, and the thing consisting of a carbon powder containing layer is HV600-1000.

[Manufacturing method of specific switch]
FIG. 19 is an explanatory diagram showing an example of the configuration of a specific switch manufactured by the method for manufacturing a microswitch of the present invention.
This specific switch extends on the upper surface (upper surface in FIG. 19) of the circuit board 20 on which the wiring pattern 21 is formed, above the electrode portion 21A in the wiring pattern 21 (upward in FIG. 19), and on the electrode portion 21A. A columnar post portion 71 formed in an electrically connected state and one end portion (left end portion in FIG. 19) 72A are integrally connected to the post portion 71 in the surface direction (left and right in FIG. 19). A cylindrical rod-shaped beam portion 72 that extends in the direction (direction) and a lower end (lower surface in FIG. 2) 72B of the other end portion (right end portion in FIG. 19) of the beam portion 72 downward (downward in FIG. 19). A metal deformable element including a downward projecting portion 73 and having the other end 72B of the beam portion 72 elastically displaceable in the vertical direction (vertical direction in FIG. 19). Those having.
This specific switch is provided so that the downward projecting portion 73 is located in a state of being opposed to and spaced above the electrode portion 21B which is the contact portion for the switch in the wiring pattern 21 of the circuit board 20. Reference numeral 73 denotes a state in which the beam portion 72 is electrically connected to the electrode portion 2B when the beam portion 72 is displaced downward.

  As a specific example of the specific switch, the post portion 71 has a length of 40 μm, a width of 30 μm and a height of 100 μm, the beam portion 72 has a total length of 300 μm, a width of 30 μm and a thickness of 20 μm, and a downward projecting portion 73 has a diameter of 20 μm. The height is 80 μm, and the distance L2 from the end of the post portion 71 to the center of the downward projecting portion 73 is 250 μm. A plurality of specific cantilever springs having a shape are arranged in a center pad at an arrangement pitch of 80 μm.

  The specific switch having such a configuration forms an intermediate body in which the post part 71, the beam part 72, and the downward projecting part 73 are formed in the resin mold by performing the intermediate body forming process on the circuit board 20. Then, it is manufactured by performing the mold body removal process which removes the cured resin which forms the resin mold body in the obtained intermediate body.

  Hereinafter, a specific switch manufacturing method will be described with reference to the drawings.

<Intermediate formation process>
As shown in FIG. 20, a circuit board 20 having a wiring pattern 21 formed on its upper surface is prepared, and on the upper surface of this circuit board 20, it corresponds to the arrangement position of the electrode portion 21A in the wiring pattern 21 by stereolithography. A post part forming cured resin unit layer (hereinafter also referred to as “post part resin unit layer”) 78A having post part through holes 79A in the part is formed, and as shown in FIG. On the resin unit layer 78A, a post portion through-hole 79A is formed, and a post portion having a downward projecting portion through-hole 79B in a portion corresponding to the arrangement position of the electrode portion 21B in the wiring pattern 21 and a downward projecting portion formation. A cured resin unit layer (hereinafter also referred to as “downward protruding portion resin unit layer”) 78B is laminated, and as shown in FIG. A cured resin unit layer for forming a beam portion (hereinafter referred to as a “beam portion resin unit layer”) having a beam portion through hole 79C communicating with the post portion through hole 79A and the downward projecting portion through hole 79B on the unit layer 78B. 78C is laminated to form a post portion 71 comprising a plurality (two in the example shown) of post portion through holes 79A, downward projecting portion through holes 79B, and beam portion through holes 79C. Then, a resin mold 75 made of a cured resin having a metal part forming recess 75A for forming the downward projecting part 73 and the beam part 72 is formed.

Here, each of the post portion resin unit layer 78A, the downward projecting portion resin unit layer 78B, and the beam portion resin unit layer 78C constituting the resin mold 75 has a thickness with an aspect ratio of 3 or less. It is preferable that it has a thickness with an aspect ratio of 0.5 to 2.0.
By setting the thickness of each cured resin unit layer constituting the resin mold 75 to a size with an aspect ratio of 3 or less, the through-holes in each cured resin unit layer can be surely formed into a straight wall shape. The specific switch finally obtained can have high accuracy.

(Metal part forming process)
As shown in FIG. 23, after the surface degreasing treatment is performed on the inner surface of the metal part forming recess 75A of the obtained resin mold 75, a nickel plating base layer 77A is formed by an electroless plating method. By repeating the metal adhesion operation on the nickel plating base layer 77A one or more times (in this example, once), a metal layer 77 formed by laminating the copper plating layer 77B so as to cover the nickel plating base layer 77A is formed. Thus, on the upper surface of the circuit board 20, a resin mold 75 made of a cured resin and a metal portion made of the metal layer 77 formed in the metal portion forming recess 75 A in the resin mold 75 are configured. Intermediate 74 is formed.

Here, as the surface degreasing treatment, for example, a method such as an alkali surface treatment or an acid surface treatment can be used.
By applying such a surface degreasing process to the inner surface of the metal part forming recess 75A, a high adhesion strength with the nickel plating base layer 77A can be obtained on the inner surface of the metal part forming recess 75A.
As a specific example of the surface degreasing treatment, after performing alkaline degreasing treatment for 5 minutes at a temperature of 50 ° C., surface treatment with sulfuric acid and a surfactant for 2 minutes at room temperature, and concentration for 2 minutes at room temperature. A method of performing surface treatment with 10% sulfuric acid in this order, further performing a pre-dip treatment for 6 minutes at room temperature, and then performing an accelerator-cool treatment for 5 minutes at room temperature.

<Mold body removal process>
The intermediate body 74 obtained in the intermediate body forming step is subjected to a mold body removing process, and the cured resin constituting the resin mold body 75 is removed from the intermediate body 74 to expose the metal portion. A specific switch having the configuration as shown is formed on the upper surface of the circuit board 20.

According to such a specific switch manufacturing method, in the intermediate body forming step, the metal portion made of the metal layer 77 in the metal portion forming recess 75A of the resin mold body 75 formed on the circuit board 20 by the optical modeling method. After the intermediate body 74 is formed, in the mold body removing step, by removing the cured resin constituting the resin mold body 75 in the intermediate body 74, a specific switch made of the metal portion is obtained. Compared to a conventionally used technique, many processes are not required, and each process is not complicated. Therefore, the specific switch can be easily manufactured with high efficiency.
Further, in this specific switch manufacturing method, the resin mold 75 is formed by using an optical modeling method and laminating a plurality of cured resin unit layers based on CAD data of the resin mold 75 to be modeled. Since the body 75 is formed, it is possible to form a resin mold having a large aspect ratio without causing harmful effects, and for example, a surface on which a cured resin unit layer is to be formed (specifically, a circuit board) 20 and a cured resin unit having a desired shape without being restricted by the shape of the upper surface of the cured resin unit layer to be formed or the upper surface of the cured resin unit layer to be formed) The layer can be formed with high accuracy, and a plurality of cured resin unit layers can be stacked without positional alignment errors, so that a gold having an overhang shape can be obtained. The resin mold body 75 for forming the portion, with the flexibility of a large design, can be easily formed with high precision and high efficiency.
Therefore, according to the manufacturing method of the specific switch, the specific switch can be easily formed with high design freedom and high efficiency.

[Method for producing specific hollow spring]
FIG. 24 is an explanatory diagram showing an example of the configuration of a specific hollow spring manufactured by the method for manufacturing a microspring of the present invention.
The specific hollow spring extends on the upper surface (upper surface in FIG. 24) of the circuit board 20 on which the wiring pattern 21 is formed, above the electrode portion 21A (upward in FIG. 24) of the wiring pattern 21, and this electrode portion 21A. A columnar central post portion 81 formed in a state of being electrically connected to the rectangular shape, and a rectangular portion that extends integrally with the central post portion 81 and extends in the surface direction of the circuit board 20 (left and right direction in FIG. 24). Two columnar end post portions 83A and 83B projecting upward from the upper surfaces of the rod-like lower side beam portion 82 and both ends 82A and 82B of the lower side beam portion 82, and these two end posts A rectangular bar-shaped upper side beam portion 84 in which both end portions 84A and 84B are integrally connected to the upper surface of the portions 83A and 83B, respectively, The beam portion 82 and the upper beam portion 84 have a metal spring element that is elastically deformable in the vertical direction (vertical direction in FIG. 24), and protrudes upward from the upper surface of the central portion of the upper beam portion 84. A cylindrical upward projecting portion 85 is provided.
In this specific hollow spring, the lower beam portion 82, the two end post portions 83A and 83B, and the upper beam portion 84 are integrally connected to the central post portion 81 at the center of the lower beam portion 82. The rectangular frame body portion 86 is formed.

  As a specific example of the specific hollow spring, the central post portion 81 has a length of 40 μm, a width of 30 μm, and a height of 80 μm, the lower side beam portion 82 has a total length of 300 μm, a width of 30 μm, and a thickness of 20 μm. Each of 83B is 40 μm in length, 30 μm in width, 80 μm in height, the lower side beam portion 82 has a total length of 300 μm, a width of 30 μm and a thickness of 20 μm, and an upper protruding portion 85 has a diameter of 20 μm and a height of 80 μm. When used as a contact for a probe card, for example, a plurality of specific hollow springs having the same shape are arranged in a center pad with an arrangement pitch of 80 μm.

  The specific hollow spring having such a configuration is obtained by performing the first intermediate forming process on the circuit board 20 to form the center post portion 81 and the lower beam portion 82 in the first resin mold. 1 intermediate body is formed, and the second intermediate body forming step is performed on the first intermediate body, whereby the two end post portions 83A and 83B and the upper side beam portion 84 become the second resin mold. By forming a second intermediate formed in the body and further performing a third intermediate forming step on the second intermediate, an upper protruding portion 85 is formed in the third resin mold. Forming a third intermediate, and then, a first resin mold in the first intermediate, a second resin mold in the second intermediate, and a third resin in the third intermediate Remove the cured resin that forms each of the molds at once It is those prepared by carrying out the body removal process.

  Hereinafter, the manufacturing method of a specific hollow spring is concretely demonstrated using figures.

<First intermediate forming step>
(Mold formation process)
As shown in FIG. 25, a circuit board 20 having a wiring pattern 21 formed on the upper surface thereof is prepared, and on the upper surface of the circuit board 20, it corresponds to the arrangement position of the electrode portion 21A in the wiring pattern 21 by stereolithography. A cured resin unit layer for forming a central post portion (hereinafter also referred to as “resin unit layer for central post portion”) 97A and 97B having a through hole 98A for the central post portion in the portion is formed and laminated in this order. A cured resin unit layer for forming a lower side beam part (hereinafter referred to as “for lower side beam part”) having a lower side beam part through hole 98B communicating with the central post part through hole 98A on the upper central post part resin unit layer 97B. It is also referred to as “resin unit layer.” By laminating 97C, a plurality of (two in the example in the figure) central post portion through-holes 98A and lower beam portion through-holes are provided. Consisting 98B, to form the first resin mold body 91A having a first metal portion forming recess 91B for forming a central post portion 81 and a lower beam portion 82.

Here, each of the central post portion resin unit layers 97A and 97B and the lower beam portion resin unit layer 97C constituting the first resin mold 91A has a thickness with an aspect ratio of 3 or less. In particular, it is preferable to have a thickness with an aspect ratio of 0.5 to 2.0.
By making the thickness of each of the cured resin unit layers constituting the first resin mold 91 </ b> A such that the aspect ratio is 3 or less, the through-holes in each cured resin unit layer can be surely formed into a straight wall shape. Therefore, the specific hollow spring finally obtained can have high accuracy.
Hereinafter, in the method for manufacturing the specific hollow spring, the same applies to the thickness of the cured resin unit layer described later.

(Metal part formation process)
As shown in FIG. 26, after the surface degreasing treatment is performed on the inner surface of the first metal part forming recess 91B of the obtained first resin mold 91A, a nickel plating base layer is formed by an electroless plating method. The first metal layer 91C is formed by repeating the metal adhesion operation on the nickel plating base layer one or more times (in this example, once), and by laminating the copper plating layer so as to cover the nickel plating base layer. The first resin mold body 91A and the first metal part forming recess 91B formed in the first resin mold body 91A on the upper surface of the circuit board 20 are formed. A first intermediate 91 composed of a metal portion made of the metal layer 91C is formed.

Here, as the surface degreasing treatment, for example, a method such as an alkali surface treatment or an acid surface treatment can be used.
By applying such surface degreasing treatment to the inner surface of the first metal part forming recess 91B, the inner surface of the first metal part forming recess 91B has a large adhesion strength with the nickel plating base layer. Obtainable.
As a specific example of the surface degreasing treatment, after performing alkaline degreasing treatment for 5 minutes at a temperature of 50 ° C., surface treatment with sulfuric acid and a surfactant for 2 minutes at room temperature, and concentration for 2 minutes at room temperature. A method of performing a surface treatment with 10% sulfuric acid in this order, further performing a pre-dip treatment for 6 minutes at room temperature, and then performing an accelerator treatment for 5 minutes at room temperature.
Hereinafter, the same applies to the surface degreasing treatment performed in other steps in the method of manufacturing the specific hollow spring.

<Second intermediate forming step>
(Mold formation process)
As shown in FIG. 27, surface roughening treatment is performed for the purpose of flattening the surface of the first metal layer 91C in the first intermediate 91 obtained in the first intermediate forming step. After the end portion, the end post portion having end post portion through holes 98C, 98C in portions corresponding to both ends of the first metal layer 91C by stereolithography on the first intermediate 91. Formed cured resin unit layers (hereinafter also referred to as “end post portion resin unit layers”) 97D and 97E are formed in this order and laminated, and the uppermost end post portion resin unit layer 97E is formed. A cured resin unit layer for forming an upper side beam portion (hereinafter also referred to as “resin unit layer for upper side beam portion”) having two through holes 98C for upper side beam portions communicating with the two end post portion through holes 98C and 98C. .) To stack 97F Thus, the end post portions 83A and 83B and the upper side beam portion 84, each including a plurality of end post portion through holes 98C and upper side beam portion through holes 98D (a total of four in the illustrated example), are formed. A second resin mold 92A having a second metal part forming recess 92B is formed.

Here, as the surface roughening treatment, for example, a mechanical treatment such as polishing treatment or a chemical treatment such as acid light etching treatment can be used.
By applying such a surface roughening treatment to the surface of the first metal layer 91C, the surface of the first metal layer 91C has a high adhesion strength to the end post portion cured resin unit layer 97D. Can be obtained.
As a specific example of the surface roughening treatment, a surface treatment with sulfuric acid and a surfactant for 2 minutes at room temperature, and a surface treatment with 10% concentration sulfuric acid for 2 minutes at room temperature are performed in this order. A method of performing a drying process after performing a cleaning process is mentioned.
The same applies to the surface roughening treatment performed in other steps in the method of manufacturing the specific hollow spring.

(Metal part formation process)
As shown in FIG. 28, after the surface degreasing treatment is performed on the inner surface of the second metal part forming recess 92B of the obtained second resin mold 92A, a nickel plating base layer is formed by an electroless plating method. The second metal layer 92C is formed by repeating the metal adhesion operation on the nickel plating base layer one or more times (in this example, once) and laminating the copper plating layer so as to cover the nickel plating base layer. Are formed on the first intermediate body 91, and a second resin mold body 92A made of a cured resin, and a second second metal part forming recess 92B in the second resin mold body 92A. A second intermediate 92 constituted by a metal portion made of the second metal layer 92C formed therein is formed.

<Third intermediate formation step>
(Mold formation process)
As shown in FIG. 29, surface roughening treatment is performed for the purpose of flattening the surface of the second metal layer 92C in the second intermediate 92 obtained in the second intermediate formation step. After that, on the second intermediate body 92, a cured resin for forming an upper protruding portion having an upper protruding portion through hole 98E in a portion corresponding to the upper portion of the central portion of the second metal layer 92C by an optical modeling method. Unit layers (hereinafter also referred to as “upward projecting portion resin unit layers”) 97G and 97H are formed in this order and stacked to form a plurality (two in the illustrated example) of upper projecting portion through holes 98E. A third resin mold body 93A having a third metal portion forming recess 93B for forming the upward projecting portion 85 is formed.

(Metal part formation process)
As shown in FIG. 30, after the surface degreasing treatment is performed on the inner surface of the third metal part forming recess 93B of the obtained third resin mold 93A, a nickel plating base layer is formed by an electroless plating method. Further, the metal adhesion operation is repeated once or more (in this example, once) on the nickel plating base layer, and a third metal layer 93C is formed by laminating a copper plating layer so as to cover the nickel plating base layer. The third resin mold 93A and the third metal part forming recess 93B in the third resin mold 93A are formed on the second intermediate body 92 by forming the third resin mold 93A. A third intermediate body 93 constituted by a metal portion made of the metal layer 93C is formed.

<Mold body removal process>
The first intermediate 91, the second intermediate 92, and the third intermediate 93 obtained in the first intermediate formation step, the second intermediate formation step, and the third intermediate formation step, respectively. A specific hollow spring having a structure as shown in FIG. 24 is obtained by performing mold body removal processing, removing the cured resin constituting the resin mold body from each of these intermediates and exposing the metal portion. It is formed on the upper surface of the circuit board 20.

According to such a manufacturing method of the specific hollow spring, in the first intermediate body forming step, the second intermediate body forming step, and the third intermediate body forming step, each is formed on the circuit board 20 by stereolithography. After forming the first intermediate body 91, the second intermediate body 92, and the third intermediate body 93, in which the metal portion is formed in the recess for forming the metal portion of the formed resin mold body in this order, the mold body is removed. In the process, the specific hollow made of the metal portion is removed by collectively removing the cured resin constituting the resin mold in each of the first intermediate 91, the second intermediate 92, and the third intermediate 93. Since a spring is obtained, a specific hollow spring can be easily manufactured with high efficiency because a large amount of processing is not required and the individual processing is not complicated as compared with a conventionally used method. Can
Further, in the manufacturing method of the specific hollow spring, the first resin mold body 91A, the second resin mold body 92A, and the third resin mold body 93A are formed by using an optical modeling method to form the first resin mold body 91A. Since the resin mold body is formed by laminating a plurality of cured resin unit layers based on the CAD data of the resin mold body 91A, the second resin mold body 92A, and the third resin mold body 93A, respectively. A resin mold having a large aspect ratio can be formed without accompanying, for example, a surface on which a cured resin unit layer is to be formed (specifically, an upper surface of a circuit board or a cured resin unit layer to be formed) The cured resin unit layer having a desired shape can be formed with high accuracy without being limited by the shape of the upper surface of the cured resin unit layer that is positioned immediately below the surface of the substrate and the flatness of the surface. In addition, since a plurality of cured resin unit layers can be laminated without positional alignment errors, a resin mold for forming a metal part having a bridge shape can be provided with high accuracy and a large degree of freedom in design. It can be easily formed with high efficiency.
Therefore, according to the manufacturing method of the specific hollow spring, the hollow spring can be easily formed with high design freedom and high efficiency.

  Further, in this specific hollow spring manufacturing method, the specific hollow spring to be formed is formed by integrally combining the first metal layer 91C, the second metal layer 92C, and the third metal layer 93C. However, since each surface of the first metal layer 91C and the second metal layer 92C is subjected to the light etching process in each metal portion forming process, the first metal layer 91C and the second metal layer 91C Excellent adhesion can be obtained between the metal layer 92C and the second metal layer 92C and the third metal layer 93C.

  Furthermore, according to such a method for manufacturing a specific hollow spring, since a spring element having a three-dimensional structure can be easily formed, a microspring including a metal spring element is provided on the upper surface of the substrate. The functional substrate of the present invention as shown in FIG. 24 having a three-dimensional shape can be manufactured.

  Furthermore, according to the manufacturing method of the specific hollow spring of the present invention, on the upper surface of the substrate, the central post portion extending upward, the rectangular frame portion, specifically, the central post portion integrally and continuously. A lower beam portion extending in the surface direction of the substrate, an end post portion extending upward from the upper surface of both ends of the lower beam portion, and an upper beam having both ends integrally connected to the upper surfaces of these two end post portions. It is also possible to manufacture a specific hollow spring (hereinafter, also referred to as “specific hollow composite spring”) having a configuration in which a plurality of metal spring elements composed of portions are integrally stacked.

FIG. 31 is an explanatory view showing another example of the configuration of the specific hollow spring manufactured by the method for manufacturing the specific hollow spring of the present invention, specifically, the configuration of the specific hollow composite spring.
This specific hollow composite spring has a configuration in which two metal spring elements having the same shape are integrally stacked, and the upper surface of the circuit board 20 on which the wiring pattern 21 is formed (the upper surface in FIG. 31). ) And a central post portion 81 which is formed above the electrode portion 21A in the wiring pattern 21 (upward in FIG. 31) and is electrically connected to the electrode portion 21A, and the central post portion 81 In addition, a first metal spring element comprising a rectangular frame-like body portion (hereinafter also referred to as “first rectangular frame-like body portion”) 86 connected integrally at the central portion of the lower beam portion 82, and A central post portion 81 projecting upward from the central portion of the upper surface of the central portion of the upper side beam portion 84 constituting the first rectangular frame portion 86 of one metal spring element, and the central post portion From a second metal spring element comprising a rectangular frame portion (hereinafter also referred to as “second rectangular frame portion”) 89 integrally connected to the portion 81 at the central portion of the lower beam portion 82. Thus, an upper projecting portion 85 projecting upward from the upper surface of the central portion of the upper beam portion 84 constituting the second rectangular frame portion 89 of the second metal spring element is provided.
In the example of this figure, each of the first rectangular frame-shaped body portion 86 and the second rectangular frame-shaped body portion 89 has the same configuration as the rectangular frame-shaped body portion 86 in the specific hollow spring shown in FIG. I have it.

  The second composite microspring having such a configuration is a metal deformable frame-shaped portion comprising a first intermediate formation step and a second intermediate formation step in the method for manufacturing the specific hollow spring according to FIG. After repeating the forming operation and performing this metal deformable frame-shaped part forming operation twice in total, this step is followed by the third intermediate forming step in the method for manufacturing the specific hollow spring according to FIG. By forming a composite of an intermediate composed of a resin mold and a metal part, and then collectively setting the cured resin that forms the resin mold in the intermediate formed in all these intermediate formation steps It is manufactured by performing a mold body removing process to be removed.

As mentioned above, although the manufacturing method of the specific hollow spring of this invention was demonstrated, the manufacturing method of the specific hollow spring of this invention is not limited to this, A various change can be added.
For example, in the method of manufacturing the specific hollow spring shown in FIG. 24, in order to form the upper protruding portion 85, a resist layer having a through hole for the upper protruding portion is formed on the surface of the second intermediate by a resist method. In addition, it is possible to use a technique in which a plating method is applied to the upward projecting portion through hole in the resist layer.
In addition, also in the manufacturing method of the specific hollow composite spring shown in FIG. 31, the upward projecting portion 85 can be formed by the same method.

Further, in order to form the upward projecting portion, it is not limited to forming a metal layer made of a nickel layer by an electrolytic plating method. For example, a nickel-boron layer, a nickel-phosphorus layer, a nickel-cobalt layer, and nickel-iron It is also possible to form a metal layer comprising a layer or a carbon powder-containing layer in which a surface layer in which carbon differential powder is mixed on the nickel layer is formed. The upper protruding portion made of these metal layers has excellent hardness, and the upper protruding portion as a contact member has excellent durability and contact properties. Since the coefficient is reduced, more excellent durability can be obtained, and in the case of the layer composed of the carbon powder-containing layer, the oxidation suppressing ability can be obtained, so that the excellent contact property can be obtained.
Specifically, the hardness obtained in the upward projecting portion made of these metal layers is HV 300 to 600 for the nickel layer, and HV 600 to 900 for the nickel-boron layer, and nickel. -The thing consisting of a phosphorus layer is HV600-900, the thing consisting of a nickel-cobalt layer is HV700-1200, the thing consisting of a nickel-iron layer is HV700-1200, and the thing consisting of a carbon powder containing layer is HV600-1000.

  According to the manufacturing method of the present invention as described above, the contacts in the probe card can be formed. In particular, the probe card having a very large number of contacts, specifically a diameter of 8 inches or more. A large number of contacts in a probe card suitably used for performance inspection of a plurality of LSI chips formed on a wafer having a thickness can be simultaneously formed by an easy method without requiring extremely large manufacturing costs. .

It is explanatory drawing which shows an example of a structure of the optical modeling apparatus used for the formation method of the metallic electromechanical functional element of this invention. It is explanatory drawing which shows an example of a structure of the specific cantilever spring produced by the manufacturing method of the microspring of this invention. It is explanatory drawing which shows an example of a structure of the circuit board used for the manufacturing method of the specific cantilever spring of FIG. It is explanatory drawing which shows the state in which the cured resin unit layer was formed on the circuit board of FIG. It is explanatory drawing which shows the state in which the several cured resin unit layer was formed on the cured resin unit layer of FIG. It is explanatory drawing which shows the structure of the 1st resin mold part which concerns on the manufacturing method of the cantilever spring of FIG. It is explanatory drawing which shows the state by which the 1st metal layer was formed in the 1st recessed part in the 1st resin mold body part of FIG. It is explanatory drawing which shows the state in which the 2nd resin mold body part was formed on the 1st resin mold body part of the state in which the 1st metal layer was formed in the 1st recessed part of FIG. It is explanatory drawing which shows the structure of the intermediate body which concerns on the manufacturing method of the cantilever spring of FIG. It is explanatory drawing which shows the other example of a structure of the specific cantilever spring produced by the manufacturing method of the microspring of this invention. It is explanatory drawing which shows the structure of the 1st resin type body which concerns on the manufacturing method of the specific cantilever compound spring of FIG. It is explanatory drawing which shows the structure of the 1st intermediate body which concerns on the manufacturing method of the specific cantilever compound spring of FIG. It is explanatory drawing which shows the state by which the 2nd resin mold body was formed on the 1st intermediate body of FIG. It is explanatory drawing which shows the state in which the 2nd intermediate body was formed on the 1st intermediate body of FIG. It is explanatory drawing which shows the state in which the 3rd resin mold body was formed on the 2nd intermediate body of FIG. It is explanatory drawing which shows the state in which the 3rd intermediate body was formed on the 2nd intermediate body of FIG. It is explanatory drawing which shows the state by which the 4th resin type body was formed on the 3rd intermediate body of FIG. It is explanatory drawing which shows the state in which the 4th intermediate body was formed on the 3rd intermediate body of FIG. It is explanatory drawing which shows an example of a structure of the specific microswitch produced by the manufacturing method of the microswitch of this invention. It is explanatory drawing which shows the state by which the cured resin unit layer was formed on the circuit board based on the manufacturing method of the specific microswitch of FIG. It is explanatory drawing which shows the state in which the cured resin unit layer was further formed on the cured resin unit layer of FIG. It is explanatory drawing which shows the structure of the resin type body which concerns on the manufacturing method of the specific microswitch of FIG. It is explanatory drawing which shows the structure of the intermediate body which concerns on the manufacturing method of the specific microswitch of FIG. It is explanatory drawing which shows an example of a structure of the specific hollow spring produced by the manufacturing method of the microspring of this invention. It is explanatory drawing which shows the structure of the 1st resin type body which concerns on the manufacturing method of the specific hollow spring of FIG. It is explanatory drawing which shows the structure of the 1st intermediate body which concerns on the manufacturing method of the specific hollow spring of FIG. It is explanatory drawing which shows the state in which the 2nd resin mold body was formed on the 1st intermediate body of FIG. It is explanatory drawing which shows the state in which the 2nd intermediate body was formed on the 1st intermediate body of FIG. It is explanatory drawing which shows the state in which the 3rd resin type body was formed on the 2nd intermediate body of FIG. It is explanatory drawing which shows the state in which the 3rd intermediate body was formed on the 2nd intermediate body of FIG. It is explanatory drawing which shows the other example of a structure of the specific hollow spring produced by the manufacturing method of the microspring of this invention. It is explanatory drawing which shows an example of a structure of metal electromechanical functional elements. FIG. 33 is an explanatory diagram showing a manufacturing process of the electromechanical functional device of FIG. 32. It is explanatory drawing which shows the manufacturing process which concerns after the manufacturing process shown in FIG. It is explanatory drawing which shows the manufacturing process which concerns after the manufacturing process shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Fixed base 10A Vertical support | pillar 11 Container 11A, 11B Opening 12 Light source device 13 Support stage 13A Stage surface 15 Squeegee mechanism 16 Circulation means 16A Circulation pump 16B Liquid suction side piping 16C Liquid discharge side piping 17 Control means 20 Circuit board 21 Wiring pattern 21A, 21B Electrode portion 31 Post portion 32 Beam portion 32A One end portion 32B Other end portion 33 Upper protruding portion 34 First post portion 35 First beam portion 35A One end portion 35B Other end portion 36 Second post portion 37 Second Beam part 37A One end part 37B Other end part 38 Third post part 39 Third beam part 39A One end part 39B The other end part 39C Upper projecting part 40 Intermediate body 41 Resin mold part (first resin mold part)
41A Recessed part for forming a metal part (first recessed part)
43 Resin mold part (second resin mold part)
43A Recessed part for forming a metal part (second recessed part)
43B Opening 45 First metal layer 45A Nickel plating base layer 45B Copper plating layer 45C Depression 46 Second metal layers 47A to 47J Cured resin unit layer 48A Post portion through hole 48B Beam portion through hole 48C Upper protruding portion through hole 48D Post Partial formation through hole 51 First intermediate body 51A First resin mold body 51B First metal partial formation recess 51C First metal layer 52 Second intermediate body 52A Second resin mold body 52B Second Metal part forming recess 52C second metal layer 53 third intermediate 53A third resin mold 53B third metal part forming recess 53C third metal layer 54 fourth intermediate 54A second 4 resin mold body 54B fourth metal part forming part 54C fourth metal layer 71 post part 72 beam part 72A one end part 72B other end part 73 downward projecting part 74 intermediate body 75 resin mold body 75A Metal part forming recess 77 Metal layer 77A Nickel plated base layer 77B Plated copper layers 78A to 78C Cured resin unit layer 79A Post part through hole 79B Downward projecting part through hole 79C Beam part through hole 81 Central post part 82 Lower side Beam part 82A, 82B End part 83A, 83B End post part 84 Upper side beam part 84A, 84B End part 85 Upper protruding part 86, 89 Rectangular frame part 91 First intermediate body 91A First resin mold 91B First 1st metal part forming recess 91C 1st metal layer 92 2nd intermediate body 92A 2nd resin mold 92B 2nd metal part forming recess 92C 2nd metal layer 93 3rd intermediate body 93A Third resin mold body 93B Third metal portion forming recess 93C Third metal layers 97A to 97H Cured resin unit layer 98A Center post portion through hole 98B Lower side beam part through hole 98C End post part through hole 98D Upper side beam part through hole 98E Upper protruding part through hole 101 Electrolytic plating common electrode layers 102, 107 Laminate 102A Post part forming through hole 103 Nickel plating Layer 104 Common electrode layer for beam portion formation 105 Resist layer for beam portion 106, 108 Metal layer

Claims (17)

It consists of a post part that extends upward on the upper surface of the substrate and a beam part that extends integrally with the post part and extends in the surface direction of the substrate, and the beam part can be elastically deformed so as to bend in the vertical direction. A method of forming an electromechanical functional element comprising a metal deformable element, comprising:
By performing an intermediate formation process on the substrate, an intermediate body in which a post part and a beam part are formed in a mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical shaping method, and the metal in the mold body An intermediate body comprising a mold part and a metal part by forming a metal part in the metal part forming recess by means of metal part forming means including a process of forming an electroless plating layer on the inner surface of the part forming recess. Is a step of forming
Then, the metal body electromechanical functional element formation method characterized by performing the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body.   2. The metal electromechanical functional element according to claim 1, wherein the substrate is a circuit substrate, and the post portion is formed in a state of being electrically connected to an electrode portion or a wiring portion of the substrate. Method.   In the metal part forming means in the intermediate forming process, a plating base layer is formed on the inner surface of the metal part forming recess by an electroless plating method, and a metal attaching operation by the electrolytic plating process is performed once on the plating base layer. It repeats above, The formation method of the metal electromechanical functional elements of Claim 1 or Claim 2 characterized by the above-mentioned. A first post portion extending upward on the upper surface of the substrate, a first beam portion extending integrally with the first post portion toward the surface of the substrate, and an upper surface of the first beam portion A second post portion extending upward from the second post portion, and a second beam portion extending continuously in parallel with the first beam portion, the first beam portion and the second beam portion. A method of forming an electromechanical functional element including a metal deformable element composite that can be elastically deformed so that both of the beam portions are curved in the vertical direction,
By performing the first intermediate formation step on the substrate, a first intermediate body is formed in which the first post portion and the first beam portion are formed in the first mold,
By performing the second intermediate formation step on the first intermediate, the second intermediate formed by forming the second post portion and the second beam portion on the second mold is obtained. Formed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed to collectively remove the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body. Method for forming electromechanical functional element.   The substrate is a circuit board, and the first post portion of the first intermediate body is formed in a state of being electrically connected to an electrode portion or a wiring portion of the substrate. A method for forming a metal electromechanical functional element. On the upper surface of the substrate, there is provided a post portion extending upward, and a beam portion whose one end portion is integrally continuous with the post portion and extends in the surface direction of the substrate, and the other end portion of the beam portion is in the vertical direction. A method of manufacturing a microspring comprising a metal deformable element that is elastically displaceable, comprising:
By performing an intermediate formation process on the substrate, an intermediate body in which a post part and a beam part are formed in a mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical shaping method, and the metal in the mold body A metal part forming means that combines the process of forming an electroless plating layer on the inner surface of the recess for forming a part, forming a metal part in the recess for forming a metal part, and comprising an intermediate formed by the mold body and the metal part. A process of forming a body,
Then, the manufacturing method of the microspring characterized by performing the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body.   7. The method of manufacturing a microspring according to claim 6, wherein the substrate is a circuit substrate, and the post portion is formed in a state of being electrically connected to an electrode portion or a wiring portion in the substrate. A first post portion extending upward on the upper surface of the substrate; a first beam portion having one end extending integrally with the first post portion and extending toward the surface of the substrate; and the first beam A second post portion extending upward from the upper surface of the other end portion of the portion, and a second beam portion having one end portion integrally connected to the second post portion and extending in parallel with the first beam portion. A method of manufacturing a microspring including a metal deformable element in which the other end portions of the first beam portion and the second beam portion are both elastically displaceable in the vertical direction,
By performing the first intermediate formation step on the substrate, a first intermediate body is formed in which the first post portion and the first beam portion are formed in the first mold,
By performing the second intermediate formation step on the first intermediate, the second intermediate formed by forming the second post portion and the second beam portion on the second mold is obtained. Formed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed to collectively remove the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body. Manufacturing method.   9. The substrate according to claim 8, wherein the substrate is a circuit substrate, and the first post portion of the first intermediate body is formed in a state of being electrically connected to an electrode portion or a wiring portion of the substrate. Manufacturing method of microspring. A post portion extending upward on the upper surface of the substrate, a beam portion having one end integrally extending continuously with the post portion and extending toward the surface of the substrate, and projecting downward from the lower surface of the other end of the beam portion A method of manufacturing a microswitch that combines a metal deformable element consisting of a downward projecting portion, the other end of the beam portion being elastically displaceable in the vertical direction,
By performing the intermediate formation process on the substrate, an intermediate formed by forming the post part, the downward projecting part and the beam part in the mold is formed,
The intermediate body forming step forms a mold body made of a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method, and the metal part in the mold body A metal part is formed in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the forming recess, and an intermediate body composed of the mold body and the metal part is formed. A process of forming,
Then, the manufacturing method of the microswitch characterized by performing the mold body removal process which removes the cured resin which forms the mold body in the obtained intermediate body.   The board is a circuit board, and the post part is formed in a state of being electrically connected to the electrode part or the wiring part in the board, and the downward projecting part is spaced above the switch contact part in the board. The method of manufacturing a microswitch according to claim 10, wherein the microswitch is formed in an opposed state.   A central post portion extending upward on the upper surface of the substrate, a lower beam portion extending integrally with the central post portion toward the surface of the substrate, and projecting upward from the upper surfaces of both ends of the lower beam portion. Elastically so that the lower side beam part and the upper side beam part are curved in the vertical direction. A functional substrate comprising a microspring including a metal spring element that is deformable. On the upper surface of the substrate, there is provided a microspring in which a plurality of metal spring elements composed of a central post portion extending upward and a rectangular frame-like body portion connected thereto are integrally stacked,
The rectangular frame-like body portion of each metal spring element includes a lower beam portion extending in the surface direction of the substrate, two end post portions projecting upward from the upper surfaces of both end portions of the lower beam portion, and the two end portions. It consists of an upper side beam part in which both end portions are integrally connected to the upper surface of the post part, and can be elastically deformed so that the lower side beam part and the upper side beam part are curved in the vertical direction,
A functional substrate characterized in that, in each metal spring element, a lower beam portion is integrally continuous with a central post portion. A central post portion extending upward on the upper surface of the substrate, a lower beam portion extending integrally with the central post portion toward the surface of the substrate, and protruding upward from upper surfaces of both ends of the lower beam portion 2 It consists of one end post part and an upper side beam part in which both ends are integrally connected to the upper surface of the two end post parts, and the lower side beam part and the upper side beam part can be elastically deformed so as to bend in the vertical direction. A method of forming a microspring comprising a metal spring element comprising:
A first intermediate forming step of forming a first intermediate body in which a central post portion and a lower side beam portion are formed in a first mold; and two end post portions and an upper side beam portion are second A metal deformable frame-shaped part forming operation comprising a second intermediate forming step for forming a second intermediate formed on the mold is performed,
Each of the first intermediate formation step and the second intermediate formation step is a cured resin having a recess for forming a metal part, which is formed by laminating cured resin unit layers each molded by an optical modeling method. And forming a metal part in the metal part forming recess by a metal part forming means including a process of forming an electroless plating layer on the inner surface of the metal part forming recess in the mold body. And forming an intermediate body composed of a mold body and a metal part,
Thereafter, a mold body removing process is performed to collectively remove the cured resin forming the first mold body in the first intermediate body and the second mold body in the second intermediate body. Manufacturing method.   15. The method of manufacturing a microspring according to claim 14, wherein the substrate is a circuit substrate, and the central post portion is formed in a state of being electrically connected to an electrode portion or a wiring portion in the substrate. On the upper surface of the substrate, there is provided a microspring in which a plurality of metal spring elements composed of a central post portion extending upward and a rectangular frame-like body portion connected thereto are integrally stacked,
The rectangular frame-like body portion of each metal spring element includes a lower beam portion extending in the surface direction of the substrate, two end post portions projecting upward from the upper surfaces of both end portions of the lower beam portion, and the two end portions. The upper part of the upper part of the post part is composed of an upper side beam part, and the lower side beam part and the upper side beam part can be elastically deformed so as to bend in the vertical direction. A method of manufacturing a microspring in which a lower beam portion is integrally continuous with a portion,
A first intermediate forming step of forming a first intermediate body in which a central post portion and a lower side beam portion are formed in a first mold; and two end post portions and an upper side beam portion are second The metal variable shape frame-shaped part forming operation consisting of the second intermediate forming step for forming the second intermediate formed on the mold is repeatedly performed,
Each of the first intermediate formation step and the second intermediate formation step in each metal deformable frame-shaped portion forming operation was formed by laminating cured resin unit layers each molded by an optical shaping method. The metal part forming means includes a process of forming a mold made of a cured resin having a metal part forming recess and forming an electroless plating layer on the inner surface of the metal part forming recess in the mold. Forming a metal part in the recess for forming a metal part to form an intermediate body composed of a mold and a metal part;
Thereafter, a mold body that collectively removes the cured resin that forms the first mold body in the first intermediate body and the second mold body in the second intermediate body in all metal deformable frame-shaped portion forming operations. A method for manufacturing a microspring, characterized in that a removal process is performed. The substrate is a circuit board, and the central post portion is formed in a state of being electrically connected to the electrode portion or the wiring portion of the substrate in the first intermediate forming step of the first metal variable frame-shaped portion forming operation. The method of manufacturing a microspring according to claim 16, wherein:

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