JP2005050240A - Non-contact ic tag, and method for manufacturing non-contact ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag which can stably be used even under a high temperature environment. <P>SOLUTION: This non-contact IC tag 10 is configured by storing an inlet 1 formed by arranging at least an IC chip and an antenna on a film-shaped base material in a main body block 12. The main body block 12 has a recessed part 13 formed on the back face, and the inlet 1 is stored in the recessed part 13, and the back part of the inlet 1 is closed by an embedded block 14 shaped corresponding to the recessed part 13. The internal air of the non-contact IC tag 10 is excluded by pushing the embedded block 14 from the back part of the inlet 1 into the recessed part 13 to close the back part of the inlet 1. Therefore, it is possible to suppress internal residual air more efficiently than a conventional manner. Also, even when a little residual air may be expanded under high temperature, any structurally weak portion which used to exist in a conventional manner can be eliminated, and any problem such as damage can be prevented from being generated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a non-contact IC tag. More specifically, the present invention relates to a contactless IC tag having a structure suitable for use in a high temperature environment.

  In recent years, non-contact IC tags have been widely used. Non-contact IC tags are also called RF-ID tags or wireless tags, and are widely used in fields such as management in product manufacturing processes, product data management, and prepaid cards. This non-contact IC tag is a module that incorporates an IC chip and antenna that incorporate a memory and a communication control circuit. The non-contact IC tag includes, for example, an inlet in which an IC chip and an antenna are arranged on a resin film, and the inlet is accommodated in a case according to the application, so that it has various outer shapes.

  The structure of the non-contact IC tag is disclosed in Patent Document 1, for example. However, in this patent document 1, an antenna coil wound around a core member and a semiconductor chip disposed (a portion corresponding to the above-described inlet) is referred to as an RFID tag. This Patent Document 1 discloses a preferred RFID tag arrangement structure when a cylindrical antenna coil is used. And in patent document 1, the structural example which embeds the RFID tag illustrated with the resin agent in the opening part provided in the front side of the container in FIGS. 7-9 attached to this literature is shown. As shown in Patent Document 1, a structure in which an opening or a recess is provided on the front side of a container that accommodates an RFID tag is generally employed.

  By the way, non-contact IC tags have been widely used in the field of food management and the like. Non-contact IC tags used for food management are exposed to high temperatures together with trays to be managed. In order to protect the inlet containing the IC from high temperatures, the non-contact IC tag is configured to accommodate the inlet in a resin block, for example. Also for this type of non-contact IC tag, conventionally, a structure in which an inlet is accommodated in a recess provided from the front side is generally employed. FIG. 4 is a diagram showing an example of the structure of a non-contact IC tag. 4A is a plan view of the non-contact IC tag 100, and FIG. 4B is an exploded view taken along the line BB in FIG. In the non-contact IC tag 100, the inlet 1 is housed in a block that forms the outer shape of the IC tag. As described above, the inlet 1 is provided with an IC chip and an antenna incorporating a memory and a communication control circuit.

  The non-contact IC tag 100 includes a block main body 110 and an upper plate 120. A concave portion 112 for accommodating the inlet 1 is formed in the upper portion of the block main body 110. The inlet 1 is accommodated in the recess 112 together with the adhesive, and the top thereof is sealed with the upper plate 120, whereby the non-contact IC tag 100 is integrally formed. The non-contact IC tag 100 produced in this way is set in, for example, a food tray, a container, a wagon or the like and used for management of food containers. In FIG. 4, the lower side of the paper surface is a set surface of the non-contact IC tag 100, that is, a surface to be attached to a food tray or the like.

  By the way, many food trays and containers to which the non-contact IC tag 100 is attached are made of metal. Therefore, in order to facilitate communication between the non-contact IC tag 100 and the external read / write device, it is desirable that the inlet 1 is disposed at a position separated from the sticking surface (back surface) by a certain distance or more. In addition, it is necessary to consider the miniaturization of the entire contactless IC tag 100. Therefore, as shown in FIG. 4, the inlet 1 is arranged near the surface of the non-contact IC tag 100 and has a structure in which the upper part is sealed with a relatively thin upper plate 120.

Japanese Patent Laid-Open No. 2002-183695

  However, the non-contact IC tag 100 when used for food management or the like is attached to a food tray, a container, a wagon or the like, and is subjected to a sterilization process such as high-temperature steam together with these. When manufacturing the non-contact IC tag 100, the upper plate 120 is closed from above so that air does not enter, and the inlet 1 is sealed. However, in reality, air may remain in a portion where the inlet 1 is sealed. If air remains in this way, when the non-contact IC tag 100 is placed at a high temperature, it becomes a large bubble and acts to peel off the upper plate 120. If the upper plate 120 is peeled off from the block main body 110, the IC chip in the inlet comes into contact with the steam and the non-contact IC tag 100 loses its function.

  Accordingly, an object of the present invention is to solve the above-described conventional problems and provide a non-contact IC tag that can be adapted to use in a high temperature environment.

  The above object is a non-contact IC tag in which an inlet having at least an IC chip and an antenna arranged on a film-like base material is housed in a main body block, and the main body block has a recess formed on the back surface. The inlet can be accommodated therein, and the back portion of the inlet can be achieved by a non-contact IC tag sealed with an embedding block having a shape corresponding to the recess. In the present invention, the main body block of the non-contact IC tag has a recess formed on the back surface to be attached or mounted, and the inlet is accommodated in the recess. The non-contact IC tag can be manufactured in a state in which the air in the recess is excluded by sealing the embedded block while being pushed into the recess from the back of the inlet. Therefore, the air remaining inside can be reduced as compared with the conventional case. Even if air remains slightly and expands to form bubbles at a high temperature, there is no structurally weak portion as in the prior art, so that problems such as breakage do not occur. Therefore, a non-contact IC tag that can be used with confidence even in a high temperature environment can be provided.

  The inlet is preferably sealed with an adhesive. With such a structure, a structure in which air is more reliably excluded from the inside of the recess can be obtained. Further, it is desirable that further unevenness is formed on the surface of the embedded block. If such a structure is adopted, even if air remains and expands to a high temperature, these can be taken into the concavo-convex portion, so that problems that occur in a high temperature environment can be reliably suppressed.

  According to the present invention, there is provided a method of manufacturing a non-contact IC tag in which an inlet having at least an IC chip and an antenna arranged on a film-like substrate is housed in a main body block, in a recess formed on the back surface of the main body block. And a method of manufacturing a non-contact IC tag in which the inlet is inserted and an embedded block having a shape corresponding to the recess is pushed from the back of the inlet and sealed. According to the present invention, it is possible to manufacture a non-contact IC tag so that air in the recess does not remain. It is more preferable that the main body block is arranged so that the concave portion is opened upward, the inlet is inserted together with an adhesive, and the embedded block is pushed in.

  As described above, according to the present invention, a non-contact IC tag that can be used stably even in a high temperature environment can be provided.

  The best mode of the present invention will be described with reference to the drawings. 1 and 2 are views showing a non-contact IC tag 10 according to an embodiment. 1A is a plan view of the non-contact IC tag 10, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. FIG. 2 is a view showing a preferred manufacturing process example of the non-contact IC tag 10. The non-contact IC tag 10 will be described with reference to these drawings.

  In FIG. 1, the non-contact IC tag 10 has an external shape composed of a main body block 12 and an embedded block 14. The embedded block 14 is preferably formed of the same material as the main body block 12. These can be formed of, for example, an acrylic resin, a heat-resistant vinyl chloride resin, a foamed vinyl chloride resin, or the like. The main body block 12 has a recess 13 formed on the back surface (lower side in FIG. 1). The recessed portion 13 is sealed with an embedded block 14 having a shape corresponding to the recessed portion 13. In more detail, the recessed part 13 is formed in the shape carved from the back side to near the front surface. Inlet 1 is sealed together with an adhesive in this front side space, and embedded block 14 is inserted into recess 13 from the back side of inlet 1 leaving this space. The inlet 1 has the same structure as that of the prior art, and at least an IC chip and an antenna are arranged on a resin film base material, and has a function of communicating with an external reader / writer device (not shown).

  In this non-contact IC tag 10, as shown in FIG. 1, the inlet 1 is disposed on the front side of the main body block 12. Therefore, since it is structurally strengthened, even if air remains and foams at a high temperature, a force is not generated in a predetermined portion and cracks or the like do not occur as in the conventional case. Furthermore, with reference to FIG. 2, the preferable manufacturing process of this non-contact IC tag 10 is demonstrated.

  As shown in FIG. 2A, the main body block 12 is disposed with the concave portion 13 facing upward. Then, the inlet 1 is inserted into the recess 13 together with an appropriate amount of the adhesive 15. Then, as shown in FIG. 2B, the embedded block 14 is gradually pushed into the recess 13 from above. Since the concave portion 13 faces upward, the air is pushed away as the embedded block 14 enters the concave portion 13 and is removed from the inside. Further, when the embedding block 14 advances into the recess 13, a state in which the adhesive 15 is pushed out is formed. As a result, the adhesive 15 enters between the main body block 12 and the embedding block 14, and a state in which air is reliably pushed out from the recess 13 is formed. Therefore, finally, as shown in FIG. 2C, the air (Air) is almost completely expelled from the inside of the recess 13, and the inlet 1 is sealed in the adhesive 15.

  The non-contact IC tag 10 that can be manufactured as described above has a structure that can significantly reduce the air remaining in the interior with the inlet sealed, as compared with the conventional non-contact IC tag. Moreover, even if there is residual air, the amount of the air that acts as bubbles is reduced. In particular, the non-contact IC tag 10 can be used stably in a high-temperature environment because there is no structurally weak portion that can be peeled off as in the prior art.

  FIG. 3 is a diagram showing an improved example of the embedded block 14 of the non-contact IC tag 10. A mesh-like groove 17 is formed on the surface of the embedding block 14 shown in FIG. A plurality of small holes 18 are formed on the surface of the embedded block 14 shown in FIG. In addition, although the groove | channel 17 and the hole 18 which were shown by FIG. 3 (A) and (B) are expressed typically large so that it may be easy to confirm, they may be fine. When the embedding block 14 having irregularities on the surface is used as described above, even if the air remaining after the embedding block 14 is pushed into the recess 13 is bubbled at a high temperature, the air bubbles are taken into the grooves 17 and the holes 18. Therefore, the stress that induces fracture can be more reliably suppressed. Therefore, by using the embedded block 14 subjected to the surface processing in this way, a non-contact IC tag suitable for use in a higher temperature environment can be obtained.

  The preferred embodiment of the present invention has been described in detail above. However, the present invention is not limited to the specific embodiment, and various modifications can be made within the scope of the gist of the present invention described in the claims. Deformation / change is possible.

It is the figure shown about the non-contact IC tag of embodiment, FIG. 1 (A) is a top view of a non-contact IC tag, and the same (B) is sectional drawing in the AA arrow in (A). It is the figure which showed the preferable example of a manufacturing process of the non-contact IC tag shown in FIG. It is the figure which was the figure which showed the example of improvement of the embedding block used for a non-contact IC tag. It is the figure which showed an example of the structure of the conventional non-contact IC tag.

Explanation of symbols

1 Inlet 10 Non-contact IC Tag 12 Body Block 13 Recess 14 Embedded Block 15 Adhesive

Claims (5)

A non-contact IC tag in which an inlet in which at least an IC chip and an antenna are arranged on a film-like substrate is housed in a main body block,
The non-contact IC tag, wherein the main body block includes a recess formed on a back surface, the inlet is accommodated in the recess, and a back portion of the inlet is sealed with an embedded block having a shape corresponding to the recess. . The non-contact IC tag according to claim 1, wherein the inlet is sealed with an adhesive. The contactless IC tag according to claim 1, wherein the surface of the embedded block is further provided with irregularities. A method of manufacturing a non-contact IC tag in which an inlet in which at least an IC chip and an antenna are arranged on a film-like substrate is housed in a main body block,
A method of manufacturing a non-contact IC tag, wherein the inlet is inserted into a recess formed on the back surface of the main body block, and an embedded block having a shape corresponding to the recess is pushed from the back of the inlet and sealed. 5. The non-contact IC according to claim 4, wherein the main body block is arranged so that the concave portion is opened upward, the inlet is inserted together with an adhesive, and the embedded block is pushed in. Tag manufacturing method.

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