JP2005049323A - Manufacturing method and inspection method for probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a probe card, and to widen it to have a wide area, in the probe card brought into face-contacting with a fine circuit board when inspecting the minute circuit board formed in a semiconductor wafer, a liquid crystal display panel, a solar cell or the like, and used for conducting a plurality of electric contacts at the same time. <P>SOLUTION: In this method wherein a plurality of fine through holes are formed in a thin film, a conductive substance is filled in the holes, and wherein one portion of the conductive substance is manufactured to be protruded from a surface of the thin film, the conductive substance is metal plating, a metal plating-resistant resist is formed at least on one face of the thin film, the thin film and the metal plating-resistant resist are worked to provide fine through holes at the same time, the conductive substance is filled thereafter in the through holes, and the metal plating-resistant resist is removed to provide the conductive substance of a prescribed shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a probe card used for making a surface contact with a circuit board and simultaneously making a plurality of electrical contacts when inspecting a fine electrical circuit formed on a semiconductor wafer, a liquid crystal display panel, a solar cell or the like. In particular, the present invention relates to a manufacturing method and an inspection method of the probe card.

  In recent years, efforts have been actively made to achieve high accuracy, high speed, and large area in order to increase the functionality of devices and the cost thereof. For example, an electric circuit pattern formed on a semiconductor wafer is miniaturized and the diameter of the wafer is increasing. Therefore, the electrical contact portion in the operation inspection of the electrical circuit is required to further reduce the pitch between contacts and increase the number of simultaneous contacts.

  Below, the manufacturing method (patent document 1) of the conventional probe card is demonstrated.

In FIG. 6, a hole is drilled in the polyimide film to form a rivet-like metal protrusion larger than the through-hole diameter. Such a rivet-shaped convex electrode can be said to be a general shape formed by metal plating as disclosed in Patent Document 2.
However, since the rivet-shaped convex electrode is formed by metal plating, it is difficult to control the shape. In particular, the control of the diameter of the rivet portion is extremely difficult because the influence from all the factors of hole machining accuracy, shape, surface roughness, and chamfered shape of the polyimide film is very large.

  In the evaluation by the applicant of the present application, when 1000 rivet-shaped electrodes are formed with a target of 100 μm in diameter, the electrode is finished with φ100 ± 10 μm for the above reason. When the number of convex electrodes is more than this, there is a possibility of further variation. Moreover, the rivet-shaped convex electrode is not a clean semicircle but a crushed shape (FIG. 7). When using a probe card, contact the surface of the circuit board and make multiple electrical contacts at the same time, so the diameter of the convex electrode, which is the contact part, is not uniform, and it is not a clean hemisphere If the dimension of the contact part on the other side is increased more than necessary, and further the pressing force is increased, there is a problem that a predetermined contact cannot be made unless the process is performed. In addition, there is a great problem of cost increase due to a decrease in the yield of the probe card.

  Moreover, since the linear expansion coefficient of the polyimide resin used as a thin film is generally 16 ppm / ° C., when it is used at a size of 100 mm and a temperature increase of 100 ° C., it simply expands by 16 μm. Since the contact portion must be connected regardless of temperature changes, the contact size of the mating side must be further increased. In consideration of the thermal expansion, the positional accuracy is about ± 8 μm, and in order to absorb the diameter error of the convex electrode, the required size of the mating contact including the safety factor has to be formed with φ150 μm. As the diameter of semiconductor wafers increases, the positional accuracy error becomes even larger, and an increase in useless contact area becomes a problem.

Furthermore, there is a problem that it is impossible to cope with the narrowing of the pitch of the semiconductor circuit. This time, the restriction that the pitch distance cannot be made 150 μm or less is required for circuit design, and wasteful labor is required.
JP-A-8-235935 Japanese Patent No. 2828410

  In view of the above-described conventional problems, the present invention realizes a narrow pitch between contacts and an increase in the number of simultaneous contacts in order to inspect a fine electric circuit formed on a semiconductor wafer, a liquid crystal display panel, a solar cell or the like. An object of the present invention is to provide a probe card manufacturing method and an inspection method that can be used.

  The probe card manufacturing method according to the first invention of the present application is a probe card for inspecting the electrical characteristics of a circuit board, wherein a plurality of fine through-holes are formed in a thin film, and the holes are filled with a conductive material and the conductive A method in which a part of the material is manufactured to be convex from the surface of the thin film, the conductive material is metal plating, a metal plating resist is formed on at least one surface of the thin film, and the thin film and the metal resistance After the plating resist is processed into fine through holes at the same time, the conductive material is filled in the through holes, and the metal plating resist is further removed to obtain a predetermined shape of the conductive material.

  The probe card manufacturing method of the second invention of the present application is a probe card for inspecting the electrical characteristics of a circuit board, wherein a plurality of fine through holes are formed in a thin film, and the holes are filled with a conductive material; This is a method for manufacturing a part of the conductive material so that it is convex from the surface of the thin film. A resist is formed on at least one surface of the thin film, and after the thin film and the resist are simultaneously processed through fine through holes, The through hole is filled by embedding a material paste, and the resist is further removed to obtain a predetermined shape of the conductive material.

  The method for manufacturing a probe card according to the third invention of the present application is a probe card for inspecting the electrical characteristics of a circuit board, wherein a plurality of fine through holes are formed in a thin film, and the holes are filled with a conductive material; This is a method for manufacturing a part of the conductive material so that it is convex from the surface of the thin film, and the contact area in the cross-sectional area parallel to the cylindrical contact surface that is convex from the surface of the thin film Is smaller than the cross-sectional area of the fine hole.

  The probe card inspection method according to the fourth aspect of the present invention is a probe card inspection method in which a surface contact is made with a circuit board and a plurality of electrical contacts are made simultaneously. It is characterized by being 1.4 times or less of the area of one contact part of the card.

  Furthermore, the probe card inspection method according to the fifth aspect of the present invention is a probe card inspection method in which a surface contact is made with a circuit board and a plurality of electrical contacts are made simultaneously. It is 100 μm or less.

  According to the present invention, in order to inspect a fine electric circuit formed on a semiconductor wafer, a liquid crystal display panel, a solar cell, or the like, it is possible to reduce the pitch between contacts and increase the number of simultaneous contacts.

  As described above, according to the present invention, it is possible to cope with an increase in the number of electrical contact portions, a narrow pitch between contacts, and a large area when performing an operation test on an electrical circuit formed on a recent semiconductor wafer. Become.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIG.

  In a polyimide resin 1 having a thickness of 30 μm and a copper thin film 20 having a thickness of 10 μm formed by wet etching, a nickel-resistant resist 2 is first attached. Here, the same resist as the polyimide resin 1 having a thickness of 30 μm is used as an anti-plating resist, and is bonded using an ultraviolet curing adhesive (FIG. 1A).

  Next, fine holes with an opening diameter of 50 μm are formed in the anti-plating resist 2 from the opposite surface of the copper thin film with an excimer laser. At this time, the polyimide resin 1 penetrates and the copper thin film 20 does not penetrate. By forming the polyimide resin 1 and the anti-plating resist 2 with the same material, there is a merit that the conditions for processing fine holes with a laser can be easily obtained.

  After the laser processing, cleaning for removing smear is performed (not shown), and nickel is then filled into the fine holes by nickel plating (FIG. 1B). Under the plating conditions, the phosphorus concentration as an additive is increased during the initial growth of 30 μm, and the phosphorus concentration is decreased during the latter 30 μm growth. Thereby, the first 30 μm can improve the corrosion resistance than the latter half.

  Next, the adhesive loses adhesive strength by being irradiated with ultraviolet rays, and the plating resist 2 can be peeled off from the polyimide resin 1. As a result, a convex conductive material is formed. Further, masking is performed on portions other than the convex portion, and the tip portion is gradually thinned by being immersed in a peroxide solution. Here, by changing the plating process conditions in the middle, it becomes possible to make the tip portion having low corrosion resistance into a desired shape by further etching (FIG. 1C).

  This inventor performed the process which narrows a front-end | tip part to 20 micrometers. As a result, the contact area can be reduced, so that the contact area on the counterpart side can be set small. Further, since the contact area is small, it was confirmed that a plurality of electrical contacts can be made simultaneously even if the pressing force when contacting the circuit board is small.

  Furthermore, as compared with the rivet shape, the plating growth filling the columnar shape is very easy to control the shape in the plating method. From this, the yield of convex electrode formation could be greatly improved.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG.

  In a polyimide resin 51 having a thickness of 30 μm, a nickel-resistant resist 52 is first attached. Here, the same resist as the polyimide resin 51 having a thickness of 30 μm is used as an anti-plating resist and is bonded using an ultraviolet curable adhesive (FIG. 2A).

  Next, fine hole penetration processing with an opening diameter of 30 μm of the polyimide resin 51 is performed with an excimer laser. At this time, the diameter of the opening hole on the plating-resistant resist 52 side was adjusted to 20 μm. Therefore, although the shape of the through hole is tapered, there is an advantage that the conditions can be easily obtained by configuring the polyimide resin 51 and the plating resist 52 with the same material (FIG. 2B). After the laser processing, cleaning for removing smear is performed (not shown), and nickel is filled in the fine holes by nickel plating.

  Next, by applying ultraviolet rays, the adhesive loses adhesive strength, and the plating resist 52 can be peeled off from the polyimide resin 51. Since the taper is formed, the plating remains on the polyimide resin 51 side. As a result, a convex conductive material is formed.

  A copper thin film 20 having a thickness of 10 μm is formed on the opposite side of the surface of the polyimide resin 51 where the convex conductive material is formed by vapor deposition / wet etching (FIG. 2C). From the above, the same effects as those of the first embodiment described above can be obtained.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG.

  The screen mask 63 is for forming a hole having a diameter of 50 μm. A screen mask 63 is overlaid on the base 62, and a liquefied polyimide 64 is applied and leveled (FIG. 3A). When the liquefied polyimide 64 has a predetermined hardness by heat curing, the base 62 and the screen mask 63 are peeled off to form a polyimide resin 61 having a through hole φ50 μm (FIG. 3B). Next, a resist is applied, a hole having a diameter of 30 μm is formed by exposure processing at the same position as the through hole, and nickel is filled in the fine hole portion by nickel plating (FIG. 3C).

  By removing the resist, a convex conductive material is formed. A copper thin film 20 having a thickness of 10 μm is formed on the opposite side of the surface of the polyimide resin 64 where the convex conductive material is formed by vapor deposition and wet etching.

  From the above, the same effects as those of the first embodiment described above can be obtained.

(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to FIG.

  In a polyimide resin 51 having a thickness of 30 μm, a nickel-resistant resist 52 is first attached. Here, the same resist as the polyimide resin 51 having a thickness of 30 μm is used as an anti-plating resist and is bonded using an acrylic anti-plating adhesive material. Further, a conductive plate 70 for growing nickel plating is also adhered (FIG. 4A).

  Next, fine hole penetration processing with an opening diameter of 30 μm of the polyimide resin 51 is performed with an excimer laser. At this time, the diameter of the opening hole on the plating-resistant resist 52 side was adjusted to 20 μm. Therefore, although the shape of the through-hole is tapered, there is an advantage that the conditions can be easily obtained by configuring the polyimide resin 51 and the anti-plating resist 52 with the same material (FIG. 4B). After the laser processing, cleaning for removing smear is performed (not shown), and nickel is filled in the fine holes by nickel plating. At this time, a rivet-like electrode is formed on the opposite side of the copper thin film 20 using the characteristics of nickel plating.

  Next, the anti-plating resist 52 and the conductive plate 70 are peeled off from the polyimide resin 51, whereby a convex conductive material is formed (FIG. 4C).

  In the present embodiment, since the electrodes on the opposite side to the convex electrode that contacts the circuit board to be processed can be collectively processed, the process can be shortened, and further, there is an effect that mutual displacement is eliminated. Since the opposite electrode is usually in electrical contact with an anisotropic conductive rubber or the like, a predetermined operation can be obtained without any problems even if there is an error in the shape and dimension during the nickel plating formation described above. From the above, the same effects as those of the first embodiment described above can be obtained.

(Fifth embodiment)
A fifth embodiment of the present invention will be described with reference to FIG.

  First, a resist 52 is attached to a polyimide resin 51 having a thickness of 30 μm. Here, the resist is the same as the polyimide resin 51 having a thickness of 30 μm, and is adhered using an acrylic anti-plating adhesive material. Further, in order to maintain the strength of the film, a plate 80 is also bonded to the resist 52 side. Further, a dry film resist 81 having a thickness of 10 μm is formed on the polyimide resin 51 side (FIG. 5A).

  Next, fine hole penetration processing with an opening diameter of 30 μm of the polyimide resin 51 is performed with an excimer laser. At this time, the diameter of the opening hole on the resist 52 side was adjusted to 20 μm. Therefore, although the shape of the through hole is tapered, there is an advantage that the conditions can be easily obtained by configuring the polyimide resin 51 and the resist 52 with the same material. After laser processing, cleaning for removing smear is performed (not shown). Next, desired patterning is performed on the dry film resist 81 by exposure or laser processing. Next, a silver paste is filled in the fine holes by screen printing. At the same time, an electrode is formed on the portion patterned on the dry film resist 81 (FIG. 5B).

  Next, the resist 52, the conductive plate 70, and the dry film resist 81 are peeled off from the polyimide resin 51, whereby a convex conductive material is formed (FIG. 5C).

  Compared with the fourth embodiment, this embodiment is a production method that suppresses costs because it does not require an advanced plating technique by a method of manufacturing a convex electrode by screen printing. Since the others are the same as those in the fourth embodiment, the same effects as those in the first embodiment can be obtained.

  Moreover, although silver paste was used in this embodiment, if it has electroconductivity and Vickers hardness Hv100 or more, it will not be restrict | limited to silver paste. Alternatively, a method of covering the surface with nickel plating or the like and ensuring the hardness may be used. Since the plating in this case is a surface coating, it is needless to say that it is technically easy even when compared with the previously described embedded plating.

  In addition, by using any of these first to fifth embodiments, a circuit board contact portion, which is an object to be measured, is used in an electrical characteristic inspection in which a plurality of electrical contacts are simultaneously made in surface contact with a circuit board. With a diameter of φ100 μm, stable electrical contact was realized, and the yield of probe cards compatible with 300 mm wafers could be improved.

  In addition, it was confirmed that the adjacent pitch of the circuit board contact portion, which is the object to be measured, can be narrowed to 80 μm. Furthermore, it is possible up to 30 μm by sharpening the tip of the contact portion.

  In the embodiment described above, a polyimide resin is used for the thin film resin film, but the present invention is not limited thereto. Another advantage of the present invention is that by using the present invention, a low-cost resin having a large linear expansion coefficient can be selected.

  The probe card manufacturing method and inspection method of the present invention relate to a probe card for making surface contact with a circuit board and simultaneously making a plurality of electrical contacts, and are particularly applicable to semiconductor wafers, liquid crystal display panels, solar cells, and the like.

Schematic showing the first embodiment of the present invention Schematic showing the second embodiment of the present invention Schematic showing the third embodiment of the present invention Schematic showing the fourth embodiment of the present invention Schematic showing the fifth embodiment of the present invention Schematic diagram showing a prior art electrical contact Schematic diagram showing a prior art electrical contact

Explanation of symbols

1 Polyimide resin 2 Nickel-resistant plating resist 20 Copper thin film

Claims (10)

A probe card for inspecting the electrical characteristics of a circuit board. A plurality of fine through-holes are formed in a thin film, the hole is filled with a conductive material, and part of the conductive material is convex from the surface of the thin film. A method of manufacturing so that
The conductive material is metal plating, a metal-resistant plating resist is formed on at least one surface of the thin film, the thin film film and the metal-resistant plating resist are simultaneously processed through fine through holes, the conductive material is filled into the through holes, and further, A method of manufacturing a probe card, wherein the conductive material obtains a predetermined shape by removing the metal plating resist. 2. The method of manufacturing a probe card according to claim 1, wherein the metal plating resist is the same material as the thin film. 2. The method of manufacturing a probe card according to claim 1, wherein the metal plating resist and the thin film are adhered with an ultraviolet curing adhesive. A probe card for inspecting the electrical characteristics of a circuit board. A plurality of fine through-holes are formed in a thin film, the holes are filled with a conductive material, and part of the conductive material is convex from the surface of the thin film. A method of manufacturing so that
A resist is formed on at least one surface of the thin film, and the thin film and the resist are simultaneously processed through fine through holes, and then the through holes are filled by embedding a conductive material paste, and further, the resist is removed to obtain a predetermined conductive material. A method for producing a probe card, characterized by obtaining a shape. A probe card for inspecting the electrical characteristics of a circuit board. A plurality of fine through-holes are formed in a thin film, the holes are filled with a conductive material, and part of the conductive material is convex from the surface of the thin film. A method of manufacturing so that
A probe card manufacturing method characterized in that, in a cross-sectional area in a direction parallel to a cylindrical contact surface that is convex from the surface of a thin film, the area to be contacted is smaller than the cross-sectional area of a fine hole. A probe card for inspecting the electrical characteristics of a circuit board. A plurality of fine through-holes are formed in a thin film, the hole is filled with a conductive material, and part of the conductive material is convex from the surface of the thin film. A method of manufacturing so that
A method for manufacturing a probe card, wherein the composition of the conductive material is composed of at least two kinds. 7. The method of manufacturing a probe card according to claim 6, wherein the conductive material is formed by metal plating or paste embedding. A probe card for inspecting the electrical characteristics of a circuit board. A plurality of fine through-holes are formed in a thin film, the holes are filled with a conductive material, and part of the conductive material is convex from the surface of the thin film. A method for manufacturing a probe card, characterized in that a thin film is formed by a screen printing method so that a fine through hole is formed from the beginning. In an inspection method of a probe card that makes surface contact with a circuit board and simultaneously makes a plurality of electrical contacts, the area of one circuit board contact portion that is an object to be inspected is 1.4 times or less than the area of one contact portion of the probe card. A method for inspecting a probe card, characterized in that In a probe card inspection method in which a plurality of electrical contacts are simultaneously made in surface contact with a circuit board, the adjacent minimum pitch of circuit board contact portions as inspection objects is 100 μm or less. .

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