JP2005048101A - Epoxy resin composition for casting and electrical/electronic component apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in a coil impregnating property without lowering workability and storage stability of a main agent of an epoxy resin. <P>SOLUTION: The epoxy resin composition for casting comprises a main agent component containing (A) an epoxy resin, (B) silica, (C) aluminum hydroxide and (D) a salt of an unsaturated polyaminoamide with an acidic polyester and a curing agent component containing (E) an acid anhydride curing agent and (F) a curing accelerator. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an epoxy resin composition for casting and an electric / electronic component device cast by the epoxy resin composition, and in particular, excellent storage stability of a main agent, heat resistance of a cured product, and coil impregnation. The present invention relates to an epoxy resin composition for casting having good properties and an electric / electronic component device cast by the epoxy resin composition.

  Conventionally, electrical / electronic parts using coils have been made to be able to operate stably by impregnating an epoxy resin and curing it to protect it from an external atmosphere and mechanical shock.

At this time, as the epoxy resin composition, a two-component composition comprising a main ingredient component containing an epoxy resin and an inorganic filler and a curing agent component containing an acid anhydride is used. The inorganic filler used in the above has a problem of easily precipitating in the main component of the epoxy resin and lowering the storage stability. In order to solve this, the mixing ratio of the main component and the curing agent is set to be approximately equivalent in weight. What is performed (for example, refer to Patent Document 1), and what contains fine particles of aluminum hydroxide are known.
JP 2001-261940 A

  However, since these all use aluminum hydroxide and the decomposition temperature of the aluminum hydroxide powder is as low as about 160 ° C., it is difficult to provide the high heat resistance required for recent electric / electronic component devices. In addition, there is a problem that impregnation of the coil is impaired when a large amount is filled.

  Therefore, the present invention aims to provide an epoxy resin composition in which the storage stability of the epoxy resin main ingredient is not lowered, the resin composition is excellent in coil impregnation, and the cured product is excellent in heat resistance. To do.

  The casting epoxy resin composition of the present invention comprises (A) an epoxy resin, (B) silica, and (C) a main ingredient component containing calcium carbonate powder having an average particle size of 0.5 to 4.0 μm, It is characterized by comprising a curing agent component containing (D) an acid anhydride curing agent and (E) a curing accelerator.

  Hereinafter, the present invention will be described in detail.

  The (A) epoxy resin composition used in the present invention is generally used without being limited by molecular weight, molecular structure, etc., as long as it has two or more epoxy groups in one molecule. Examples thereof include bisphenol type, novolak type, biphenol type aromatic epoxy resins, cycloaliphatic derivatives and the like, and alicyclic epoxy resins obtained by epoxidation. They can be used in combination.

  As (B) silica used in the present invention, any silica that is usually used as a filler such as crystalline silica and fused silica can be used without particular limitation. For example, crystallite A-1, crystallite AA. , Fulexex E-1 (above, manufactured by Tatsumori Co., Ltd., trade name), FB48, FB74 (above, produced by Electrochemical Co., Ltd., trade name), and the like. These may be used alone or in combination. Can do.

  This silica is preferably contained in the range of 100 to 250 parts by mass with respect to 100 parts by mass of the (A) epoxy resin. If the amount is less than 100 parts by mass, the strength decreases. As a result, the workability decreases.

  The calcium carbonate powder (C) used in the present invention has an average particle size of 0.5 to 4.0 μm, preferably 0.5 to 2.0 μm, and an average particle size of less than 0.5 μm. In this case, the impregnation property is impaired, and if it exceeds 4.0 μm, the storage stability is impaired.

  Examples of the calcium carbonate powder include Softon 2200 (trade name, manufactured by Bihoku Powder Chemical Co., Ltd.).

  It is preferable that the compounding quantity of this calcium carbonate powder is 5-20 mass parts with respect to 100 mass parts of epoxy resins. When the amount is less than 5 parts by mass, the storage stability of the main ingredient is inferior.

  The (D) acid anhydride cured product used in the present invention can be used without particular limitation as long as it has an acid anhydride group in the molecule, such as hexahydrophthalic anhydride, tetrahydrophthalic anhydride, Examples thereof include methyltetrahydrophthalic anhydride, and these can be used alone or in admixture of two or more.

  The acid anhydride curing agent is preferably 80 to 110 parts by mass with respect to 100 parts by mass of (A) epoxy resin.

  The (E) curing accelerator used in the present invention can be used without particular limitation as long as it has an action of promoting the reaction between the epoxy resin and the curing agent. For example, 2-ethyl-4-methyl Imidazole, 2-phenylimidazole, imidazole compounds such as 2-phenyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), benzyldimethyl And tertiary amines such as amine (BDMA).

  As this hardening accelerator, it is preferable that it is 0.3-5.0 mass parts with respect to 100 mass parts of (A) epoxy resins.

  In addition to the components described above, a coupling agent, a leveling agent, an antifoaming agent, a pigment, and the like are added to and blended with the epoxy resin composition used in the present invention within a range not inhibiting the curing of the present invention. These can also be used alone or in admixture of two or more.

  The epoxy resin composition of the present invention is cured by first mixing (A) an epoxy resin, (B) silica, and (C) a main component containing calcium carbonate, and then (D) an acid anhydride curing agent. (E) It can carry out easily by adding the hardening | curing agent component containing a hardening accelerator and mixing uniformly.

  The electric / electronic component device of the present invention is characterized by being cast by the casting epoxy resin composition of the present invention. To obtain the electric / electronic component device, an electric device such as a coil is used. -For an electronic component, the epoxy resin composition of the present invention may be produced by casting and curing according to a conventional method for a two-component epoxy resin.

  As described above, the epoxy resin composition of the present invention can preserve the main agent in a smaller amount than aluminum hydroxide by adding calcium carbonate powder having an average particle size of 0.5 to 4.0 μm to the main component. The stability can be sufficiently maintained, and as a result, the coil has excellent properties for impregnation.

  Furthermore, since the epoxy resin composition of the present invention uses calcium carbonate as an inorganic filler, the cured product of the epoxy resin has excellent heat resistance.

  Hereinafter, the present invention will be described based on examples.

(Example 1)
Bisphenol A diglycidyl ether type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 828) 100 parts by mass, silica (manufactured by Tatsumori Co., Ltd., trade name: Crystallite AA) 190 parts by mass, average particle size 1.0 μm 10 parts by weight of calcium carbonate (Bihoku Powder Chemical Co., Ltd., trade name: Softon 2200), 0.1 part by weight of an antifoaming agent (trade name: TSA720, manufactured by Toshiba Silicone Co., Ltd., manufactured by Nihon Unicar) , Trade name: A-187) 0.5 parts by mass was vacuum kneaded at 130 ° C. for 1 hour to obtain a main component.
Further, 100 parts by mass of methyltetrahydrophthalic anhydride and 1.8 parts by mass of 2-ethyl-4-methylimidazole as a curing accelerator were mixed to obtain a curing agent component.
These main component and curing agent component were uniformly mixed to obtain an epoxy resin composition.

(Example 2)
Bisphenol A diglycidyl ether type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 828) 100 parts by mass, silica (manufactured by Tatsumori Co., Ltd., trade name: Furex E-1) 175 parts by mass, average particle size 1 1.0 μm calcium carbonate (Bihoku Powder Chemical Co., Ltd., trade name: Softon 2200) 5 parts by mass, defoaming agent (Toshiba Silicone Co., Ltd., trade name: TSA720) 0.1 parts by mass, silane coupling agent (Nihon Unicar) Product name: A-187) 0.5 parts by mass was vacuum kneaded at 130 ° C. for 1 hour to obtain a main component.
Further, 100 parts by mass of methyltetrahydrophthalic anhydride and 2.0 parts by mass of benzyldimethylamine as a curing accelerator were mixed to obtain a curing agent component.
These main component and curing agent component were uniformly mixed to obtain an epoxy resin composition.

(Comparative Example 1)
100 parts by mass of bisphenol A diglycidyl ether type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 828), 190 parts by mass of silica (manufactured by Tatsumori Co., Ltd., trade name: Crystallite AA), aluminum hydroxide (Showa Denko) Product name: H42I) 10 parts by mass, defoaming agent (trade name: TSA720, manufactured by Toshiba Silicone Co., Ltd.) 0.1 part by mass, silane coupling agent (product name: A-187, manufactured by Nihon Unicar Company) 0 0.5 part by mass was vacuum kneaded at 80 ° C. for 1 hour to obtain a main component.
Further, 100 parts by mass of methyltetrahydrophthalic anhydride and 1.8 parts by mass of 2-ethyl-4-methylimidazole as a curing accelerator were mixed to obtain a curing agent component.
These main component and curing agent component were uniformly mixed to obtain an epoxy resin composition.

(Comparative Example 2)
Bisphenol A diglycidyl ether type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 828) 100 parts by mass, silica (manufactured by Tatsumori Co., Ltd., trade name: Furex E-1) 130 parts by mass, aluminum hydroxide ( Showa Denko Co., Ltd., trade name: H42I) 50 parts by mass, antifoaming agent (Toshiba Silicone Corp., trade name: TSA720) 0.1 part by mass, silane coupling agent (Nihon Unicar Co., Ltd., trade name: A-187) ) 0.5 parts by mass was vacuum kneaded at 130 ° C. for 1 hour to obtain a main component.
Further, 100 parts by mass of methyltetrahydrophthalic anhydride and 2.0 parts by mass of benzyldimethylamine as a curing accelerator were mixed to obtain a curing agent component.
These main component and curing agent component were uniformly mixed to obtain an epoxy resin composition.

(Test example)
The epoxy resin compositions obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were cured by heating, and the coil impregnation property, the storage stability of the main agent, and the heat resistance of the cured product were evaluated. The results are shown in Table 1. It was.

＊１：硬化物の切断面を顕微鏡で観察して求めた。
＊２：１Ｌ丸缶に、得られた主剤を１．２ｋｇ入れ、１００℃で２時間放置した後、水酸化アルミニウムの沈降充填堆積の高さを測定した。測定は金尺を入れ、その侵入量により測定したものである。
＊３：ＴＧ−ＤＴＡ 熱分析装置（セイコーインスツルメンツ社製）により３００℃における重量減少率を測定した。

* 1: Determined by observing the cut surface of the cured product with a microscope.
* 2: 1.2 kg of the obtained main agent was put in a 1 L round can and left at 100 ° C. for 2 hours, and then the height of sedimentation filling deposition of aluminum hydroxide was measured. The measurement was performed by inserting a metal scale and measuring the amount of penetration.
* 3: The weight loss rate at 300 ° C. was measured with a TG-DTA thermal analyzer (manufactured by Seiko Instruments Inc.).

  From this result, the epoxy resin composition of the present invention is an epoxy resin composition excellent in coil impregnation without reducing the storage stability of the epoxy resin main component, and the cured product has excellent heat resistance. It was confirmed that there was.

Claims (3)

(A) an epoxy resin, (B) silica, and (C) a main ingredient component containing calcium carbonate powder having an average particle size of 0.5 to 4.0 μm,
A casting epoxy resin composition comprising: (D) a curing agent component containing an acid anhydride curing agent and (E) a curing accelerator.   100 parts by weight of the (A) epoxy resin, 100 to 250 parts by weight of the silica (B), 5 to 15 parts by weight of the (C) calcium carbonate, 80 to 110 parts by weight of the (D) acid anhydride curing agent. The epoxy resin composition for casting according to claim 1, wherein the (E) curing accelerator is 0.3 to 5.0 parts by mass.   An electrical / electronic component device cast by the casting epoxy resin composition according to claim 1 or 2.