JP2005039052A - Flex-rigid wiring board and installation method thereof - Google Patents

Flex-rigid wiring board and installation method thereof Download PDF

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JP2005039052A
JP2005039052A JP2003274469A JP2003274469A JP2005039052A JP 2005039052 A JP2005039052 A JP 2005039052A JP 2003274469 A JP2003274469 A JP 2003274469A JP 2003274469 A JP2003274469 A JP 2003274469A JP 2005039052 A JP2005039052 A JP 2005039052A
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wiring board
rigid wiring
flexible
flex
rigid
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JP4189808B2 (en
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Tomoyuki Tanaka
智幸 田中
Shigeki Koide
茂樹 小出
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flex-rigid wiring board the flexible performance of a flexible wiring board of which is excellent and an installation method thereof. <P>SOLUTION: The flex-rigid wiring board A is configured to include a flexible wiring board 1 wherein a prescribed conductor path 12 is formed to at least one of front and rear sides of an insulation film 11 with flexibility, and a rigid wiring board 4 wherein the flexible wiring board 1 is sandwiched between first and second hard boards 41, 42 and fixed via an adhesive 3. A step difference 43 is provided to at least part of the circumferential edge of the rigid wiring board 4, and the flexible wiring board 1 is extracted from a region wherein the step difference 43 is formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を第1の硬質基板と第2の硬質基板との間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板及びその配設方法に関するものである。   A flexible wiring board having a predetermined conductive path formed on at least one surface of the front and back surfaces of the flexible insulating film, and sandwiching the flexible wiring board between the first hard substrate and the second hard substrate The present invention relates to a flex-rigid wiring board comprising a rigid wiring board fixed through an adhesive, and a method for arranging the same.

携帯電話や携帯端末あるいは空調制御機器の遠隔操作装置(リモコン)等の電子機器は、近年小型化が要求されており、前記電子機器におけるチップ部品を含む電子部品を安定した状態で配設するとともに、限られた配設空間内に前記電子部品による回路構成を有効的に配設する回路基板が望まれている。このような回路基板としては、フレックスリジット配線板が提案されており、例えば特許文献1及び特許文献2に開示されている。
特開平5−275814号公報 特開平6−177490号公報
In recent years, electronic devices such as mobile phones, portable terminals, and remote control devices (remote controllers) for air conditioning control devices have been required to be miniaturized, and electronic components including chip components in the electronic devices are arranged in a stable state. Therefore, there is a demand for a circuit board that effectively arranges a circuit configuration of the electronic component in a limited arrangement space. As such a circuit board, a flex-rigid wiring board has been proposed, and disclosed in, for example, Patent Document 1 and Patent Document 2.
JP-A-5-275814 JP-A-6-177490

このフレックスリジット配線板Aは、図3から図5に示すように、可撓性を有する絶縁フィルム11に所定の導電路12が形成されたフレキシブル配線板1と、フレキシブル配線板1を第1の硬質基板21と第2の硬質基板22との間に挟み込むとともに、例えばポリイミド系接着剤3を介して固定してなるリジット配線板2とを備えている。尚、フレックスリジット配線板Aは、図中において、フレキシブル配線板1の両端にリジット配線板2を備える構成である。このようなフレックスリジット配線板Aは、リジット配線板2に電子部品(図示しない)を安定的に配設するとともに、図4及び図5に示すようにフレキシブル配線板1を折り曲げることによってリジット配線板2を積層状態に引き回すことが可能となる。   As shown in FIGS. 3 to 5, the flex-rigid wiring board A includes a flexible wiring board 1 in which a predetermined conductive path 12 is formed in a flexible insulating film 11, and the flexible wiring board 1 as a first. A rigid wiring board 2 is provided which is sandwiched between the hard substrate 21 and the second hard substrate 22 and fixed via, for example, a polyimide-based adhesive 3. The flex rigid wiring board A has a configuration in which rigid wiring boards 2 are provided at both ends of the flexible wiring board 1 in the drawing. Such a flex-rigid wiring board A stably arranges electronic components (not shown) on the rigid wiring board 2 and bends the flexible wiring board 1 as shown in FIGS. 2 can be routed in a stacked state.

かかるフレックスリジット配線板Aは、フレキシブル配線板1が引き出されているリジット基板2の端部2aにおいて、第1の硬質配線板21,フレキシブル配線板1及び第2の硬質基板22を接着するための接着剤3からなるフィレット状の余剰接着剤3aが製造工程上で発生し、この余剰接着剤3aを含む接着剤3とフレキシブル配線板1との密着性が良好であることから、フレキシブル配線板1がリジット配線板2の端部2a部分で所定方向に折り曲げられた状態で所定の振動が繰り返し付与されると、伸び方向にある余剰接着剤3aの形成部分(図4では第1の硬質基板21の端部2aに形成される余剰接着剤3a)に応力がかかり、余剰接着剤3aとともにフレキシブル配線板1に亀裂が生じてフレキシブル配線板1の導電路12を切断してしまうといった問題点を有している。   The flex rigid wiring board A is used for bonding the first hard wiring board 21, the flexible wiring board 1, and the second hard board 22 at the end 2a of the rigid board 2 from which the flexible wiring board 1 is drawn. Since the fillet-like surplus adhesive 3a made of the adhesive 3 is generated in the manufacturing process and the adhesiveness between the adhesive 3 containing the surplus adhesive 3a and the flexible wiring board 1 is good, the flexible wiring board 1 When a predetermined vibration is repeatedly applied in a state where the end portion 2a of the rigid wiring board 2 is bent in a predetermined direction, a portion where the excess adhesive 3a is formed in the extending direction (the first hard substrate 21 in FIG. 4). Stress is applied to the surplus adhesive 3 a) formed on the end portion 2 a, and a crack is generated in the flexible wiring board 1 together with the surplus adhesive 3 a, and the conductive path 12 of the flexible wiring board 1. Has a problem that results in cleavage.

そこで、本発明は、前述した問題点に着目してなされたものであり、繰り返し振動が付与される厳しい環境下に配設される場合であっても、フレキシブル配線板の曲げ部分において亀裂の発生を抑制し、前記フレキシブル配線板の屈曲性に優れるフレックスリジット配線板及びその配設方法を提供するものである。   Therefore, the present invention has been made paying attention to the above-mentioned problems, and even when it is disposed in a severe environment where repeated vibration is applied, cracks are generated in the bent portion of the flexible wiring board. The present invention provides a flex-rigid wiring board that is excellent in the flexibility of the flexible wiring board and a method for arranging the same.

本発明は、前述した課題を解決するため、請求項1に記載したフレックスリジット配線板は、可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を第1の硬質基板と第2の硬質基板との間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板であって、前記リジット配線板の周縁に段差部を設け、前記段差部の形成領域から前記フレキシブル配線板が引き出されてなるものである。   In order to solve the above-mentioned problems, the present invention provides a flexible wiring board in which a predetermined conductive path is formed on at least one of the front and back surfaces of a flexible insulating film. A rigid wiring board comprising: a flexible wiring board sandwiched between a first hard board and a second hard board and fixed via an adhesive; and A step portion is provided at the periphery of the rigid wiring board, and the flexible wiring board is drawn out from a region where the step portion is formed.

また、請求項2に記載したフレックスリジット配線板は、請求項1に記載のフレックスリジット配線板において、一方の硬質基板の端部を、他方の硬質基板の端部から奥まった状態に配設することで前記段差部を構成してなるものである。   The flex-rigid wiring board according to claim 2 is the flex-rigid wiring board according to claim 1, wherein the end of one hard board is disposed in a state of being recessed from the end of the other hard board. Thus, the step portion is configured.

また、請求項3に記載したフレックスリジット配線板は、請求項2に記載したフレックス配線板において、前記段差部から引き出される前記フレキシブル配線板は、奥まった状態にない突出端部を有する硬質基板の配設方向に向けて折り曲げられてなるものである。   According to a third aspect of the present invention, there is provided the flexible wiring board according to the second aspect, wherein the flexible wiring board drawn out from the step portion has a protruding end portion that is not recessed. It is bent toward the installation direction.

また、請求項4に記載したフレックスリジット配線板の配設方法は、可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を2枚の硬質基板間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板の配設方法であって、一方の硬質基板の端部を、他方の硬質基板の端部から奥まった状態にすることで段差部を構成し、前記段差部から前記フレキシブル配線板を引き出すとともに、奥まった状態にない突出端部を有する硬質基板の配設方向に向けて前記フレキシブル配線板を折り曲げて配設してなるものである。   According to a fourth aspect of the present invention, there is provided a flexible rigid wiring board comprising: a flexible wiring board in which a predetermined conductive path is formed on at least one of the front and back surfaces of a flexible insulating film; and the flexible wiring board. A rigid wiring board comprising a rigid wiring board sandwiched between two hard boards and fixed with an adhesive, wherein the end of one hard board is connected to the other A stepped portion is formed by being recessed from the end of the hard substrate, and the flexible wiring board is pulled out from the stepped portion and directed toward the arrangement direction of the hard substrate having a protruding end that is not recessed. The flexible wiring board is bent and disposed.

本発明は、可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を第1の硬質基板と第2の硬質基板との間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板及びその配設方法に関し、フレキシブル配線板の曲げ部分において亀裂の発生を抑制し、前記フレキシブル配線板の屈曲性に優れるフレックスリジット配線板及びその配設方法を提供することが可能となる。   The present invention provides a flexible wiring board in which a predetermined conductive path is formed on at least one surface of the front and back surfaces of a flexible insulating film, and the flexible wiring board is composed of a first hard substrate and a second hard substrate. The present invention relates to a flex-rigid wiring board having a rigid wiring board sandwiched between and fixed via an adhesive, and a method for arranging the same, and suppresses the occurrence of cracks in a bent portion of the flexible wiring board, and the flexible wiring It is possible to provide a flex-rigid wiring board excellent in the flexibility of the board and a method for arranging the same.

以下、添付図面に基づいて本発明の実施形態を説明するが、従来例と同一もしくは相当個所には同一符号を付して、その詳細な説明は省く。   Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the same reference numerals are given to the same or corresponding portions as in the conventional example, and detailed description thereof will be omitted.

図1は、本発明の主要部であるフレックスリジット配線板Aの要部拡大断面図である。フレックスリジット配線板Aは、フレキシブル配線板1と、リジット配線板4とから構成されている。   FIG. 1 is an enlarged cross-sectional view of a main part of a flex-rigid wiring board A which is a main part of the present invention. The flex-rigid wiring board A is composed of a flexible wiring board 1 and a rigid wiring board 4.

フレキシブル配線板1は、可撓性を有する絶縁フィルム11に所定の導電路12が形成されてなるものであり(図3参照)、後で詳述するリジット配線板4に電気的に導通が図られた状態にて接続されている。尚、絶縁フィルム11としては、ポリイミド、エポキシ樹脂、フッ素樹脂、ポリフェニレンオキサイド等の有機質フィルムが挙げられる。   The flexible wiring board 1 is formed by forming a predetermined conductive path 12 in a flexible insulating film 11 (see FIG. 3), and is electrically connected to a rigid wiring board 4 described in detail later. Connected in the connected state. Examples of the insulating film 11 include organic films such as polyimide, epoxy resin, fluororesin, and polyphenylene oxide.

リジット配線板4は、第1,第2の硬質基板41,42間にフレキシブル配線板1を接着剤3を介して狭持し、フレキシブル配線板1を接続固定している。第1,第2の硬質基板41,42は、紙フェノール樹脂やガラス繊維入り樹脂等の非可撓性の硬質板に所定の配線パターン(図示しない)を形成したものである。リジット配線板4は、第1の硬質基板(一方の硬質基板)41の端部41aを、第2の硬質基板(他方の硬質基板)42の端部42aに対して奥まった状態に位置させることで段差部43を構成している。   The rigid wiring board 4 holds the flexible wiring board 1 between the first and second hard substrates 41 and 42 with an adhesive 3 therebetween, and connects and fixes the flexible wiring board 1. The first and second hard substrates 41 and 42 are obtained by forming a predetermined wiring pattern (not shown) on a non-flexible hard plate such as paper phenol resin or resin containing glass fiber. The rigid wiring board 4 positions the end portion 41a of the first hard substrate (one hard substrate) 41 in a state of being recessed with respect to the end portion 42a of the second hard substrate (the other hard substrate) 42. The step 43 is constituted by the above.

かかるフレックスリジット配線板1及びフレックスリジット配線板1の配設方法としては、第1の硬質基板41の端部41aを、第2の硬質基板42の端部42aから奥まった状態に位置させることで段差部43を構成し、この段差部43からフレキシブル配線板1を引き出すとともに、奥まった状態にない突出端部42aを有する第2の硬質基板42の配設方向に向けてフレキシブル配線板1を折り曲げて配設するものである。   As a method for arranging the flex-rigid wiring board 1 and the flex-rigid wiring board 1, the end portion 41a of the first hard substrate 41 is positioned in a state of being recessed from the end portion 42a of the second hard substrate 42. The stepped portion 43 is formed, the flexible wiring board 1 is pulled out from the stepped portion 43, and the flexible wiring board 1 is bent toward the arrangement direction of the second hard substrate 42 having the protruding end portion 42a that is not recessed. Are arranged.

従って、フレキシブル配線板1は、フレキシブル配線板1の曲げ方向に設けられる段差部43の突出端部42aの存在によって、フィレット状の余剰接着剤3aが付着している個所からフレキシブル配線板1が湾曲する個所までの距離を確保することでフレキシブル配線板1の曲げに伴う引っ張り方向の応力を緩和させることができ、フレキシブル配線板1の亀裂の発生を抑制し、フレキシブル配線板1の屈曲性に優れるフレックスリジット配線板A及びその配設方法を得ることができる。   Therefore, the flexible wiring board 1 is bent from the portion where the fillet-like surplus adhesive 3a is adhered due to the presence of the protruding end portion 42a of the stepped portion 43 provided in the bending direction of the flexible wiring board 1. By securing the distance to the place to be done, the stress in the tensile direction accompanying the bending of the flexible wiring board 1 can be relaxed, the occurrence of cracks in the flexible wiring board 1 is suppressed, and the flexibility of the flexible wiring board 1 is excellent. The flex-rigid wiring board A and the arrangement method thereof can be obtained.

また、フレックスリジット配線板Aは、第1の硬質基板41の端部41aを、第2の硬質基板42の端部42aから奥まった状態にすることで段差部43を構成するものであり、リジット配線板2の形成時において、各々の硬質基板41,42の各端部41a,42aをあえて不揃いにするだけで段差部43を得ることができるため、リジット配線板4の形成工程を煩雑にすることなく段差部43を得ることが可能となる。   Further, the flex-rigid wiring board A constitutes a stepped portion 43 by making the end portion 41a of the first hard substrate 41 recessed from the end portion 42a of the second hard substrate 42. When forming the wiring board 2, the stepped portion 43 can be obtained simply by making the end portions 41 a and 42 a of the respective hard substrates 41 and 42 uneven, making the formation process of the rigid wiring board 4 complicated. The stepped portion 43 can be obtained without any problem.

図2は、本発明の他の実施形態を示すものである。前述した実施形態及び従来例と同一もしくは相当個所には同一符号を付してその詳細な説明は省く。   FIG. 2 shows another embodiment of the present invention. The same or corresponding portions as those of the above-described embodiment and the conventional example are denoted by the same reference numerals, and detailed description thereof is omitted.

本発明の他の実施形態が前述した実施形態と異なる点は、リジット配線板からのフレキシブル配線板の引き出し方向が2方向である点である。即ち、フレックスリジット配線板Aは、第1の硬質基板51と第2の硬質基板52とによってフレキシブル配線板1を接着剤3を介して挟持してなるリジット配線板5の両端部に第1,第2の段差部53,54を設けることに特徴を有するものである。第1の段差部53は、第1の硬質基板51の一方の端部51aを、第2の硬質基板52の一方の端部52aから奥まった状態にすることで構成され、また第2の段差部54は、第2の硬質基板52の他方の端部52bを、第1の硬質基板51の他方の端部51bから奥まった状態にすることで構成される。従ってフレキシブル配線板1の折り曲げ方向は、第1の段差部53では第2の硬質基板52側に折り曲げられ、また第2の段差部54では第1の硬質基板51側に折り曲げられることになる。   Another embodiment of the present invention is different from the above-described embodiment in that the flexible wiring board is pulled out from the rigid wiring board in two directions. That is, the flex rigid wiring board A has first and second ends of the rigid wiring board 5 in which the flexible wiring board 1 is sandwiched between the first hard substrate 51 and the second hard substrate 52 via the adhesive 3. It is characterized by providing the second step portions 53 and 54. The first step portion 53 is configured by setting one end portion 51a of the first hard substrate 51 to be recessed from the one end portion 52a of the second hard substrate 52, and the second step portion 53a. The part 54 is configured by setting the other end 52 b of the second hard substrate 52 to be recessed from the other end 51 b of the first hard substrate 51. Therefore, the bending direction of the flexible wiring board 1 is bent toward the second hard substrate 52 at the first step portion 53, and is bent toward the first hard substrate 51 at the second step portion 54.

前述の他の実施形態で示したフレックスリジット配線板Aは、前述の実施形態と同様の効果が得られる。   The flex-rigid wiring board A shown in the other embodiments described above can achieve the same effects as those of the previous embodiments.

尚、本発明の各実施形態におけるフレックスリジット配線板Aは、フレキシブル配線板1の両端にリジット配線板2を備える構成、あるいは、リジット配線板5の両端部からフレキシブル配線板1が引き出される構成であったが、本発明におけるフレックスリジット配線板の構成にあっては、例えば第1,第2,第3のリジット配線板を備え、各リジット配線板間をフレキシブル配線板によって接続される構成であっても良く、本発明のフレックスリジット配線板の構成は、前述した構成に限定されるものではない。   In addition, the flex-rigid wiring board A in each embodiment of the present invention has a configuration in which the rigid wiring board 2 is provided at both ends of the flexible wiring board 1 or a configuration in which the flexible wiring board 1 is drawn out from both ends of the rigid wiring board 5. However, the configuration of the flex-rigid wiring board according to the present invention includes, for example, first, second, and third rigid wiring boards, and the rigid wiring boards are connected by a flexible wiring board. The configuration of the flex-rigid wiring board of the present invention is not limited to the configuration described above.

本発明は、携帯電話や携帯端末、あるいは空調制御機器の遠隔操作装置等の電子機器、あるいは船舶や自動車等の電子測定機器等の電子部品実装を行うためのフレックスリジット配線板に優れた効果を発するものである。   INDUSTRIAL APPLICABILITY The present invention has an excellent effect on a flex-rigid wiring board for mounting electronic parts such as an electronic device such as a mobile phone, a mobile terminal, a remote control device for an air conditioning control device, or an electronic measuring device such as a ship or an automobile It is something that is emitted.

本発明の実施形態のフレックスリジット配線板の要部拡大断面図。The principal part expanded sectional view of the flex-rigid wiring board of embodiment of this invention. 本発明の他の実施形態のフレックスリジット配線板の要部拡大断面図。The principal part expanded sectional view of the flex-rigid wiring board of other embodiment of this invention. 従来のフレックスリジット配線板を示す斜視図。The perspective view which shows the conventional flex rigid wiring board. 同上従来のフレックスリジット配線板の要部拡大断面図。The principal part expanded sectional view of the conventional flexible rigid wiring board same as the above. 同上従来のフレックスリジット配線板の側面図。The side view of the conventional flexible rigid wiring board same as the above.

符号の説明Explanation of symbols

A フレックスリジット配線板
1 フレキシブル配線板
11 絶縁フィルム
12 導電路
4,5 リジット配線板
41,51 第1の硬質基板(一方の硬質基板)
42,52 第2の硬質基板(他方の硬質基板)
3 接着剤
3a 余剰接着剤
41a,51a 端部
51a,52a 端部
A Flex-rigid wiring board 1 Flexible wiring board 11 Insulating film 12 Conductive path 4, 5 Rigid wiring boards 41 and 51 First hard board (one hard board)
42, 52 Second hard substrate (the other hard substrate)
3 Adhesive 3a Excess adhesive 41a, 51a End
51a, 52a end

Claims (4)

可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を第1の硬質基板と第2の硬質基板との間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板であって、
前記リジット配線板の周縁に段差部を設け、前記段差部の形成領域から前記フレキシブル配線板が引き出されてなることを特徴とするフレックスリジット配線板。
A flexible wiring board in which a predetermined conductive path is formed on at least one of the front and back surfaces of the insulating film having flexibility, and the flexible wiring board is sandwiched between the first hard board and the second hard board. A rigid wiring board comprising a rigid wiring board fixed via an adhesive,
A flex-rigid wiring board, wherein a stepped portion is provided at a periphery of the rigid wiring board, and the flexible wiring board is drawn out from a region where the stepped portion is formed.
一方の硬質基板の端部を、他方の硬質基板の端部から奥まった状態に配設することで前記段差部を構成してなることを特徴とする請求項1に記載のフレックスリジット配線板。 The flex-rigid wiring board according to claim 1, wherein the step portion is configured by disposing an end portion of one hard substrate in a state of being recessed from an end portion of the other hard substrate. 前記段差部から引き出される前記フレキシブル配線板は、奥まった状態にない突出端部を有する硬質基板の配設方向に向けて折り曲げられてなることを特徴とする請求項2に記載のフレックスリジット配線板。 The flex-rigid wiring board according to claim 2, wherein the flexible wiring board drawn out from the stepped portion is bent toward the arrangement direction of the hard substrate having a protruding end portion that is not recessed. . 可撓性を有する絶縁フィルムの表裏の少なくとも一方の面に所定の導電路が形成されたフレキシブル配線板と、前記フレキシブル配線板を2枚の硬質基板間に挟み込むとともに接着剤を介して固定してなるリジット配線板と、を備えてなるフレックスリジット配線板の配設方法であって、
一方の硬質基板の端部を、他方の硬質基板の端部から奥まった状態にすることで段差部を構成し、前記段差部から前記フレキシブル配線板を引き出すとともに、奥まった状態にない突出端部を有する硬質基板の配設方向に向けて前記フレキシブル配線板を折り曲げて配設してなることを特徴とするフレックスリジット配線板の配設方法。
A flexible wiring board in which a predetermined conductive path is formed on at least one surface of the front and back surfaces of a flexible insulating film, and the flexible wiring board is sandwiched between two hard substrates and fixed with an adhesive. A rigid wiring board comprising: a flex rigid wiring board comprising:
A stepped portion is formed by making the end of one hard substrate recessed from the end of the other hard substrate, the flexible wiring board is pulled out from the stepped portion, and the protruding end that is not recessed A flexible rigid wiring board arrangement method, wherein the flexible wiring board is bent and arranged in the arrangement direction of a hard substrate having a surface.
JP2003274469A 2003-07-15 2003-07-15 Flex-rigid wiring board installation method Expired - Fee Related JP4189808B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009290193A (en) * 2008-04-28 2009-12-10 Cmk Corp Rigid flexible multilayer printed wiring board and its production method
JP2020150016A (en) * 2019-03-11 2020-09-17 日本シイエムケイ株式会社 Rigid flex multilayer printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009290193A (en) * 2008-04-28 2009-12-10 Cmk Corp Rigid flexible multilayer printed wiring board and its production method
JP2020150016A (en) * 2019-03-11 2020-09-17 日本シイエムケイ株式会社 Rigid flex multilayer printed wiring board
JP7311985B2 (en) 2019-03-11 2023-07-20 日本シイエムケイ株式会社 Rigid-flex multilayer printed wiring board

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