JP2005038945A - Method of manufacturing ceramic laminate for multilayer wiring substrate and manufacturing apparatus thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic laminate for a multilayer wiring substrate which can manufacture a high-quality laminate. <P>SOLUTION: In the method of manufacturing a ceramic laminate for a multilayer wiring substrate and a manufacturing apparatus thereof, a long composite body made of a carrier film and a ceramic green sheet is sequentially guided to a perforating station, a filling station, a printing station and a laminating station while maintaining its shape. In this method and apparatus, the composite body is sequentially transferred to each of working processes with the carrier film upward and the ceramic green sheet downward. In addition, in the printing station, the ceramic green sheet is printed from its lower side by using an electrophotographic method. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for manufacturing a ceramic laminate for a multilayer wiring board.
[0002]
[Prior art]
FIG. 2 is a cross-sectional view of a conventional ceramic laminate 90 for a multilayer wiring board manufactured by the manufacturing method of the present invention. As shown in FIG. 2, the ceramic laminate 90 is configured by laminating a plurality of ceramic green sheets 91 in which wiring patterns 92 and via holes 93 for connecting sheets are formed.
[0003]
In order to mass-produce a laminated body having such a configuration, it is necessary to automate each work process such as punching a sheet, filling a paste with a hole, printing a wiring pattern, and laminating a sheet continuously. Become. With regard to the method for realizing this automation, in Patent Document 1, a composite body in which a ceramic green sheet is formed on a long carrier film is wound around a supply reel, and the ceramic green sheet is directed upward from the supply reel. A manufacturing method and an apparatus have been proposed in which each work process is performed while being transported to another take-up reel and continuously.
[0004]
Moreover, the multilayer ceramic multilayer board generally has a different wiring pattern for each sheet. For this reason, it is not suitable as a method for mass production to use a printing method that involves manual work, such as screen printing, in which the screen needs to be changed every time the wiring pattern changes. As for this printing method, for example, as in Patent Document 2, a photoconductor for transferring a wiring pattern is arranged above a ceramic green sheet, and a wiring pattern registered in advance on the photoconductor according to the conveyance of the ceramic green sheet. In this method, an electrophotographic apparatus in which charged powder for circuit formation is attached and different wiring patterns are sequentially transferred to a sheet has been proposed.
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 04-002196 [Patent Document 2]
JP-A-11-330671 [0006]
[Problems to be solved by the invention]
However, combining the proposals of Patent Document 1 and Patent Document 2 can be a solution to mass production, but on the other hand, there may be a problem in the quality of the finished ceramic laminate. .
[0007]
First, there is a problem of poor wiring pattern transfer. Even when a long ceramic green sheet as described in Patent Document 1 is supported by a carrier film, deflection occurs due to the weight of the sheet. Further, even if a support roll for supporting both the sheet and the film is provided between the supply reel and the take-up reel between work steps, the deflection between the support rolls is reduced but not completely eliminated. In such a state where the deflection occurs, as described in Patent Document 2, when the photosensitive member for transferring from above the ceramic green sheet is brought into contact with the photosensitive member and operated for a long time, the photosensitive member and the ceramic green are used. It is conceivable that contact with the sheet becomes insufficient, resulting in transfer failure.
[0008]
The second problem is related to scattering of charged powder for circuit formation. In order to print the wiring pattern by combining the proposals of Patent Document 1 and Patent Document 2, as described above, the photoconductor is installed above the long ceramic green sheet. Therefore, inevitably, the process of attaching the charged powder for circuit formation to the photoconductor or removing the charged powder for circuit formation remaining on the photoconductor without being transferred for preparation for the next transfer is a ceramic green sheet. Will be performed above. For this reason, a small amount of scattered powder generated during attachment or removal falls onto the ceramic green sheet and adheres as it is. If they are attached between different wirings, it may be considered that wiring defects such as conduction between wirings that should not be conducted may occur when a product is produced.
[0009]
Accordingly, an object of the present invention is to provide a manufacturing method and a manufacturing apparatus of a ceramic laminate for a multilayer wiring board capable of solving the above-described problems.
[0010]
[Means for Solving the Problems]
In order to solve the technical problems described above, the present invention provides a single long composite in which a ceramic green sheet is continuously formed on a long carrier film over the longitudinal direction thereof. Continually leading to the punching station, filling station, printing station, and laminating station in order with its long form maintained and with the carrier film facing up and the ceramic green sheet facing down, A method for producing a ceramic laminate for a multilayer wiring board is provided.
[0011]
In the printing station described above, an electrophotographic method is used in which the charged powder for circuit formation is transferred from the lower side of the composite to the ceramic green sheet.
[0012]
Further, at the laminating station, the ceramic green sheet is cut into the size of the laminated body, and the ceramic green sheet with the laminated body-sized cut is placed on the holding plate arranged on the lower side of the composite body. Alternatively, it is temporarily fixed on a laminate size ceramic green sheet stacked on a holding plate, and the laminate size ceramic green sheet is peeled off from the carrier film and laminated.
[0013]
The present invention also provides an apparatus for carrying out the method as described above.
[0014]
This apparatus maintains a long form of a long composite body in which ceramic green sheets are continuously formed in the longitudinal direction on a long carrier film, and the carrier film faces upward. A supply source for supplying the ceramic green sheet facing downward; a drilling station for forming a through hole in the ceramic green sheet including the carrier film for the composite drawn from the supply source; For the composite that has passed through the station, a charging station for filling the through hole with the conductive paste from the carrier film side, and for the composite that has passed through the filling station, the charged powder for circuit formation is applied using electrophotography. , Passed through the printing station, and the printing station to transfer the ceramic green sheet from below the composite For the composite of the scale, the ceramic green sheet is cut into the size of the laminate, and the ceramic green sheet with the cut in the size of the laminate is placed on the holding plate placed under the composite Or a laminating station for temporarily laminating the laminate-sized ceramic green sheets stacked on a holding plate and separating the laminate-sized ceramic green sheets from the carrier film. .
[0015]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an illustrative view showing one embodiment of an apparatus for producing a ceramic laminate for a multilayer wiring board according to the present invention.
[0016]
First, the manufacturing apparatus 1 for a ceramic laminate for a multilayer wiring board includes a supply reel 10 whose source is a long composite 13 including a ceramic green sheet 11 formed on a long carrier film 12. The composite 13 drawn from the supply reel 10 is guided to a subsequent station with the ceramic green sheet 11 facing downward and the carrier film 12 facing upward. It is desirable that the tension of the composite 13 pulled out from the supply reel 10 is controlled and the position in the width direction is controlled.
[0017]
The composite 13 is first guided to the drilling station 20.
[0018]
In the drilling station 20, a through-hole 22 serving as a via hole is provided at a predetermined position of the ceramic green sheet 11 including the carrier film 12 from above the composite 13 by the laser beam 21. At this time, burrs and scraps generated from the ceramic green sheet 11 may be scattered above the through-holes 22, but according to the present invention, the composite 13 is conveyed with the carrier film 12 facing upward, Falls on and adheres to the carrier film 12 and does not adhere to the ceramic green sheet 11 and degrade the quality of the product.
[0019]
The composite 13 is then led to the filling station 30.
[0020]
In the filling station 30, an operation of filling the formed through hole 22 with the conductive paste 31 is performed. The method is performed by first depositing the conductive paste 31 on the carrier film 12 and embedding the conductive paste 31 with the squeegee 32 while sucking the through hole 22 from the ceramic green sheet 11 side under negative pressure. Since the filling process is performed from the carrier film 12 side, the excess conductive paste 31 does not adhere to the ceramic green sheet 11 and the quality of the ceramic green sheet 11 is not deteriorated.
[0021]
The composite 13 is then led to the printing station 40.
[0022]
In the printing station 40, the entire surface of the photosensitive member 43 is negatively charged by the charger 42 with respect to the photosensitive member 43 rotating in the same direction as the traveling direction of the composite 13, and then the laser beam 45 is irradiated to the wiring. The charge at the surface position corresponding to the pattern is erased, and then the charged powder 41 for circuit formation that has been negatively charged in advance is attached to the uncharged surface position. The operation of transferring the powder 41 to the ceramic green sheet 11 conveyed according to the rotation of the photoconductor 43 and forming the wiring circuit layer 44 is sequentially performed. After the transfer, the wiring circuit layer 44 is neutralized so as not to be an obstructive factor for the pressure bonding at the next stacking station 50.
[0023]
This operation uses a general mechanism of electrophotography, but in the present invention, this transfer is performed from below the composite 13. When the electrophotographic method is used, as described in the prior art, an unintended scattered powder of the charge powder 41 for circuit formation may be generated, but the series of operations described above from the lower side of the composite 13. As a result, unintentional scattered matter does not adhere to the ceramic green sheet 11, and the quality of the wiring circuit layer 44 is not deteriorated.
[0024]
In addition, since the photosensitive member 43 to be transferred is disposed below the composite 13, even if the composite 13 is bent, the contact surface between the ceramic green sheet 11 and the photosensitive member 43 does not deviate and the circuit is formed. The possibility of causing transfer failure of the chargeable powder 41 is reduced. Therefore, this is also effective in that the quality of the wiring circuit layer 44 is not deteriorated.
[0025]
The composite 13 is then guided to the lamination station 50.
[0026]
In the laminating station 50, first, a cut 52 is provided on the ceramic green sheet 11 to be conveyed using a die 51 at the dimension position of the laminated body size. If the notch 52 does not cut the carrier film 12 and the ceramic green sheet 11 is completely cut, then the carrier film 12 can be easily peeled off.
[0027]
Next, the holding plate is sandwiched between the holding plate 54 and the holding plate 53 heated to about 50 ° C. with a pressure of about 40 to 50 MPa for 1 to 5 seconds. Then, an operation of peeling the film from the carrier film 12 is performed by lowering the holding plate 54 downward.
After peeling, the ceramic green sheets 11 stacked on the holding plate 54 are neutralized. This series of operations is repeated a desired number of times, and a desired number of laminate-sized ceramic green sheets 11 are stacked on the holding plate 54 to produce a multilayer laminate 55 for a multilayer wiring board.
[0028]
Next, the carrier film 12 from which the ceramic green sheet 11 has been peeled is wound around the take-up reel 60.
[0029]
Although not within the scope of the present invention, the produced multilayer ceramic substrate 55 for a multilayer wiring board is transferred to another process, and undergoes main pressure bonding, firing, plating treatment, solder treatment, element component mounting treatment, and the like. Thus, a multilayer wiring board is completed.
[0030]
【The invention's effect】
As described above, one long composite in which ceramic green sheets are continuously formed in the longitudinal direction on a long carrier film is prepared, and the long composite is converted into a long form. For multi-layer wiring boards that are continuously guided to the drilling station, filling station, electrophotographic printing station, and laminating station with the carrier film facing upward and the ceramic green sheet facing downward By using the method and apparatus for producing a ceramic laminate, a high-quality ceramic laminate for a multilayer wiring board can be produced.
[Brief description of the drawings]
FIG. 1 is an illustrative view showing one embodiment of an apparatus for producing a ceramic laminate for a multilayer wiring board according to the present invention.
FIG. 2 is a cross-sectional view of a conventional ceramic laminate for a multilayer wiring board manufactured by the manufacturing method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Manufacturing apparatus 10 of the ceramic laminated body for multilayer wiring boards ... Supply reel 11 ... Ceramic green sheet 12 ... Carrier film 20 ... Drilling station 21 ... Laser beam 22 ... Through-hole 30 ... Filling station 31 ... Conductive paste 32 ... Squeegee 40 ... Printing station 41 ... Circuit forming charged powder 42 ... Charger 43 ... Photoconductor 44 ... Wiring circuit layer 45 ... Laser beam 50 ... Laminating station 51 ... Mold 52 ... Cut 53 ... Holding plate 54 ... Holding plate 60 ... Take-up reel 90 ... Ceramic laminate 91 ... Ceramic green sheet 92 ... Wiring pattern 93 ... Via hole

Claims (2)

Preparing a single long composite in which ceramic green sheets are continuously formed on the long carrier film over its longitudinal direction, and sequentially maintaining the composite while maintaining its long form; A method of manufacturing a ceramic laminate for a multilayer wiring board that leads continuously to a drilling station, a filling station, a printing station, and a lamination station,
The composite is continuously guided with the carrier film facing up and the ceramic green sheet facing down,
In the printing station, using the electrophotographic method in which the charged powder for circuit formation is transferred from the lower side of the composite to the ceramic green sheet,
In the laminating station, the ceramic green sheet is cut into the dimensions of the laminate size,
A ceramic green sheet having a cut in the laminate size is placed on a holding plate disposed on the lower side of the composite, or a laminate-sized ceramic green sheet stacked on the holding plate. Temporarily fix it on top
A method for producing a ceramic laminate for a multilayer wiring board, comprising laminating the laminate-sized ceramic green sheet from the carrier film. One long composite body in which ceramic green sheets are continuously formed in the longitudinal direction on a long carrier film is maintained in the long form, and the carrier film is on the upper side, and the ceramic A supply source that supplies the green sheet facing downward;
A drilling station for forming a through hole in the ceramic green sheet including the carrier film for the composite drawn from the supply source;
A filling station that fills the through-hole with a conductive paste from the carrier film side for the composite that has passed through the drilling station;
A printing station that transfers the charged powder for forming a circuit to the ceramic green sheet from the lower side of the composite using electrophotography with respect to the composite that has passed through the filling station;
For the composite that has passed through the printing station, the ceramic green sheet is cut into a laminate size dimension,
A ceramic green sheet having a cut in the laminate size is placed on a holding plate disposed on the lower side of the composite, or a laminate-sized ceramic green sheet stacked on the holding plate. Temporarily fix it on top
An apparatus for producing a ceramic laminate for a multilayer wiring board, comprising: a laminating station for separating and laminating the ceramic green sheets of the laminate size from the carrier film.

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