JP2005033143A - Electronic component, its resin substrate, and manufacturing method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component achieved in miniaturization by effectively utilizing a face mounting a substrate, its resin substrate, and a method of manufacturing the electronic component. <P>SOLUTION: In such a constitution that the packaging region 24 of an electronic circuit in a dielectric printed circuit board 2 is covered with a metal shielding case 3, an end electrode 21 that is formed on the side of the dielectric printed circuit board 2 is constituted in such a manner that it does not reach a first face 2a that is a packaging face. Thereby, the first face can be efficiently used as the packaging region without requiring a region for constituting the end electrode 21 on the first face 2a. Moreover, the shielding case 3 is fixed to the dielectric printed circuit board 2 by joining or bonding a sidewall 31 to the first face 2a. Thereby, the first face can be efficiently used as the packaging region without requiring a groove or the like for engaging the shielding case 3 in the dielectric printed circuit board 2. From the above, the mounting face can be effectively utilized, so that the miniaturization of electronic components is permitted. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component having end face electrodes, a resin substrate thereof, and a method for manufacturing the electronic component, and more particularly to an electronic component used in a high-frequency circuit (RF circuit) or the like of a wireless device, a resin substrate, and an electronic component manufacturing method. .

  In recent years, along with miniaturization and high performance of electronic devices, miniaturization and high performance are also demanded for electronic components mounted thereon. For example, electronic components such as an RF circuit part in a mobile phone, a voltage controlled oscillator (VCO), a PLL (Phase Locked-Loop) module, and a front end module are extremely downsized. Due to the rapid progress, there is a strong demand for miniaturization and low profile.

  Such an electronic component has a configuration in which an electric circuit mounted on a dielectric printed wiring board is covered with an electrical shield for the purpose of radio wave radiation protection or the like (see, for example, Patent Document 1). . This configuration will be described with reference to FIG.

  FIG. 1 is a diagram showing a configuration of an electronic component 100 according to the prior art. 2A is a perspective view of the electronic component 100, and FIG. 2B is a configuration of the electronic component 100 viewed from the second surface 122 side.

  As shown in FIG. 1A, the electronic component 100 includes a dielectric printed wiring board 102 and a shield case 103. The first surface 121 of the dielectric printed wiring board 102 is a mounting surface for an electronic circuit or the like. The second surface is a surface on which external terminals and the like are disposed. In the following description, the second surface 122 is the back surface of the electronic component 100.

  The first surface of the dielectric printed wiring board 102 is covered with a shield case 103. The shield case 103 is made of a conductive shield material such as an aluminum plate or a stainless plate. Around the shield case 103, there are provided a protruding locking portion 131 and a spacer 132 for forming a space between the dielectric printed wiring board 102 and the shield case 103. Around the dielectric printed wiring board 102, a groove 123 for fixing the shield case 103 to the dielectric printed wiring board 102 by engaging with the engaging portion 131 is provided. When the locking portion 131 and the groove 123 are engaged, the spacer 132 comes into contact with the dielectric printed wiring board 102, thereby forming the space described above between the dielectric printed wiring board 102 and the shield case 103. .

  In the configuration described above, the groove 123 that is generally engaged with the locking portion 131 is provided with a hole in the multi-chamfer structure substrate, and passes through the center of the hole (however, it may not be the center). The printed wiring board 102 is formed by dividing it into pieces.

Further, in the electronic component 100 as described above, as shown in FIG. 1, on the side surface of the dielectric printed wiring board 102 for the purpose of grounding the shield case 103 and electrical connection between the front and back surfaces of the dielectric printed wiring board 102. An end face electrode 125 was provided.
JP 2000-315913 A

  However, when the semicircular groove 123 is provided in the dielectric printed wiring board 102 as described above, the groove 123 needs to be formed with a certain size so as to be engaged with the locking portion 131. The effective area of the mounting surface (first surface 121) of the body printed wiring board 102, that is, the electronic circuit mounting region 124 cannot be made larger than the first surface 121. For this reason, there existed a problem that a restriction | limiting arises in size reduction of an electronic component.

  Further, when the end face electrode 125 as shown in FIG. 1 is provided, the effective area of the mounting surface (first face 121) on the dielectric printed wiring board 102 is similar to the above by the region for forming the end face electrode 125, That is, it is impossible to make the mounting area 124 for the electronic circuit large with respect to the first surface 121, and as a result, there is a limitation on downsizing of the electronic component.

  Therefore, an object of the present invention is to provide an electronic component that has been reduced in size by effectively utilizing the mounting surface of the substrate, a resin substrate thereof, and a method for manufacturing the electronic component.

  In order to achieve the above object, the present invention provides an electronic component having a resin substrate having a first surface on which an electronic circuit is mounted as an upper surface and end surface electrodes formed on the side surface, as described in claim 1. The end surface electrode is configured to be formed in a region that does not reach the first surface from the second surface on the side opposite to the first surface. By adopting a configuration in which the end face electrode does not reach the first surface which is the mounting surface of the electronic circuit, it is not necessary to secure a region for the end face electrode on the first face, and the first face is effectively utilized. Can do. As a result, the first surface can be narrowed, and a miniaturized electronic component can be realized.

  The end face electrode according to claim 1 can be formed of a conductive metal, for example, according to claim 2.

  The end face electrode according to claim 1 is preferably plated with a metal material as described in claim 3. The exposed surface of the end face electrode may be a cut surface by dicing. In such a case, by plating the exposed surface with a metal material, connection to the outside becomes easy and connection reliability can be improved.

  The end face electrode according to claim 1 can be formed of a conductive resin, for example, according to claim 4.

  The end face electrode according to claim 1 may be a metal film formed on the side surface of the groove formed from the second surface and not reaching the first surface, as in, for example, claim 5.

  The electronic component according to the present invention includes a resin substrate on which the electronic circuit is mounted on the first surface and a case that covers a region on the first surface on which the electronic circuit is mounted. The bottom surface of the side wall of the case is configured to be fixed to the first surface. Since the case covering the electronic circuit mounted on the resin substrate is fixed to the first surface which is the mounting surface of the resin substrate, it is not necessary to form a groove or the like for fixing the case to the resin substrate. The first surface can be used effectively. As a result, the first surface can be narrowed, and a miniaturized electronic component can be realized.

  The case described in claim 6 is preferably formed of a metal material as described in claim 7. By forming the case that covers the electronic circuit with a metal material, the electronic circuit can be electrically shielded, so that the electrical characteristics and noise characteristics of the electronic component can be improved.

  The case described in claim 6 is preferably electrically connected to the metal pattern formed on the first surface as described in claim 8. By electrically connecting the case to the metal pattern on the resin substrate, the case can be easily grounded via the resin substrate.

  The electronic component according to a sixth aspect includes, for example, an end surface electrode formed on a side surface of the resin substrate with the first surface as an upper surface, and the case is electrically connected to the end surface electrode. It can also be configured to be connected to. By electrically connecting the case to the end face electrode provided on the side surface of the resin substrate, the case can be easily grounded via the end face electrode.

  The electronic component according to an eighth aspect may be configured such that the case and the metal pattern are electrically connected via a conductive resin or solder, for example, as in the tenth aspect. By connecting the case and the metal pattern with solder or conductive resin, the reliability of these connections can be improved.

  The electronic component according to claim 9 may be configured such that the case and the end face electrode are electrically connected via a conductive resin or solder, for example, as described in claim 11. By connecting the case and the end face electrode with solder or conductive resin, the reliability in these connections can be improved.

  The electronic component according to claim 6 has a metal pattern formed on the first surface and at a position where at least a part of the bottom surface of the side wall of the case comes into contact with the electronic component as described in claim 12. In addition, at least a part of the bottom surface of the side wall of the case and the metal pattern may be fixed by ultrasonic welding. By fixing the case and the metal pattern by ultrasonic welding, the reliability of these connections can be improved.

  According to a sixth aspect of the present invention, for example, as in the thirteenth aspect, at least a part of the side wall of the case may be configured to contact the side surface of the resin substrate with the first surface as an upper surface. Since the side wall of the case is configured to come into contact with the side surface of the resin substrate, the lateral displacement of the case can be supported by the resin substrate, so that the mechanical stability can be improved.

  The electronic component according to claim 6 may be configured such that at least a part of the side wall of the case is fitted inside the resin substrate, as in claim 14. By adopting a configuration in which the side wall of the case is fitted inside the resin substrate, the lateral displacement of the case can be supported by the resin substrate, so that the mechanical stability can be improved.

  The electronic component according to claim 6 has a groove formed on a side surface of the resin substrate with the first surface as an upper surface, for example, and the end surface electrode is on the side surface of the groove. It can also be configured to be a formed metal film.

  The electronic component according to a fifteenth aspect may be configured such that at least a part of the side wall of the case is engaged with the groove, as in the sixteenth aspect. By engaging a part of the side wall of the case with the groove, the lateral displacement of the case can be supported by the resin substrate, so that the mechanical stability can be improved.

  The electronic component according to claim 1, 9, or 15 has an electrode formed on a second surface opposite to the first surface of the resin substrate, for example, as in claim 17, and the end surface electrode And the electrode may be electrically connected. By electrically connecting the electrode formed on the back surface and the end surface electrode with respect to the mounting surface, for example, the case can be easily grounded via the end surface electrode.

  According to another aspect of the present invention, there is provided a resin substrate having an end surface electrode formed on a side surface with a first surface on which an electronic circuit is mounted as an upper surface, wherein the end surface electrode is formed on the first surface. It is configured not to touch. By adopting a configuration in which the end face electrode does not reach the first surface which is the mounting surface of the electronic circuit, it is not necessary to secure a region for the end face electrode on the first face, and the first face is effectively utilized. Can do. As a result, the first surface can be narrowed, and a resin substrate that can realize a miniaturized electronic component can be obtained.

  The present invention is the resin substrate in which the first surface on which the electronic circuit is mounted is covered with a case as defined in claim 19, wherein at least a part of the bottom surface of the side wall of the case on the first surface is It is comprised so that it may have a metal pattern formed in the area | region to contact | abut. Since the case covering the electronic circuit mounted on the resin substrate can be fixed to the first surface which is the mounting surface of the resin substrate, it is not necessary to form a groove or the like for fixing the case to the resin substrate. The first surface can be used effectively. As a result, the first surface can be narrowed, and a resin substrate that can realize a miniaturized electronic component can be obtained.

  The present invention also provides a method for manufacturing an electronic component in which a first surface on which an electronic circuit is mounted on a resin substrate is covered with a case as defined in claim 20, wherein at least a part of the bottom surface of the side wall of the case is provided. Is fixed to the first surface. Since the case covering the electronic circuit mounted on the resin substrate is fixed on the first surface which is the mounting surface of the resin substrate, it is not necessary to form a groove or the like for fixing the case to the resin substrate. The surface can be effectively used, and as a result, the first surface can be narrowed, and a miniaturized electronic component can be manufactured.

  As described above, according to the present invention, it is possible to provide an electronic component that is downsized by effectively utilizing the mounting surface of the substrate, a resin substrate thereof, and a method for manufacturing the electronic component.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  First, Embodiment 1 according to the present invention will be described in detail with reference to the drawings. FIG. 2 is a diagram showing the configuration of the electronic component 1A according to this embodiment. 2A shows a perspective view of the electronic component 1A, and FIG. 2B shows a configuration of the second surface 2b of the electronic component 1A, that is, the back surface.

  As shown in FIG. 2, the electronic component 1 </ b> A has a configuration in which the first surface 2 a of the electronic circuit in the dielectric printed wiring board 2 is covered with a shield case 3 for the purpose of electrical shielding of the electronic circuit. In the following description, in the dielectric printed wiring board 2, the first surface 2a, which is the mounting surface of the electronic circuit, is the upper surface (or front surface), and the second surface 2b opposite to this is the lower surface (or back surface). The other surface is the side surface.

  The dielectric printed wiring board 2 is a board made of an insulating resin such as an epoxy resin, a phenol resin, a polyfunctional aromatic polymer, or a PPE polymer. However, other insulating substrate materials such as fluorine resin, bismuthimide / triazine resin, polyphenylene ether, polyimide resin, glass epoxy, glass cloth, ceramics, aluminum ceramics, or silicon can be applied. is there. The dielectric printed wiring board 2 is made of a single layer or a laminate of the material substrate as described above.

  The shield case 3 can be made of an alloy such as copper / nickel (CuNi), for example. However, other than this, for example, a metal material such as an aluminum material, a stainless material, a copper material, an iron material, or a conductive resin can be used.

  The shield case 3 and the dielectric printed wiring board 2 are fabricated so that the sizes along the first surface 2a (second surface 2b) are substantially the same. The side surface 31 of the shield case 3 on the side of the dielectric printed wiring board 2 is in contact with the first surface 2 a and functions as a spacer for forming a space between the shield case 3 and the dielectric printed wiring board 2. Is formed. The space formed between the dielectric printed wiring board 2 and the shield case 3 is an area that can accommodate electronic components.

  The side wall 31 is preferably configured to be as thin as possible (thin as viewed from the center of the first surface 2a) while ensuring the necessary strength. Further, it is preferable that the side wall 31 is disposed at the end of the first surface 2 a when the shield case 3 is brought into contact with the dielectric printed wiring board 2. Thereby, reduction of the mounting area 24 can be prevented to the maximum.

  For reference, a mounting area 124 according to the prior art is shown in the configuration of FIG. As is apparent from a comparison between the mounting area 24 and the mounting area 124 in FIG. 2B, the first surface 2a can be effectively used according to this embodiment, and the mounting area 24 can be widened.

  A mounting pattern 23 is formed in a region where the side wall 31 is in contact with the dielectric printed wiring board 2. The attachment pattern 23 is a metal pattern formed of an alloy such as copper / nickel (CuNi), for example. However, other than this, for example, aluminum (Al), copper (Cu), gold (Au), molybdenum (Mo), tungsten (W), tantalum (Ta), chromium (Cr), titanium (Ti), platinum ( It can also be formed using a metal material such as Pt), ruthenium (Ru), or rhodium (Rh). The attachment pattern 23 is preferably formed of the same material as the wiring and electrodes formed on the mounting region 24. As a result, the attachment pattern 23 can be formed simultaneously with the formation of the wirings and electrodes, and the manufacturing process can be prevented from becoming complicated. Moreover, it is preferable that the attachment pattern 23 is formed of a conductive material that can be easily joined to the material from which the shield case 3 is manufactured. Considering these, for example, when the shield case 3 is made of an aluminum material or a stainless steel material, the attachment pattern 23 and the wirings and electrodes are formed of a material mainly composed of copper, for example. This makes it possible to easily join the shield case 3 and the dielectric printed wiring board 2 while preventing complication of the manufacturing process. In addition, by using a conductive material for joining or bonding the shield case 3 and the dielectric printed wiring board 2, the shield case 3 can be easily grounded via the wiring in the dielectric printed wiring board 2. .

  As shown in FIG. 1A, one or more end face electrodes 21 are formed on at least one side surface of the dielectric printed wiring board 2. The end face electrode 21 according to the present embodiment is formed only in a region from between the first face 2a and the second face 2b to the second face 2b. That is, the end face electrode 21 extends from the second surface 2b side of the dielectric printed wiring board 2 to the extent that it does not reach the first surface 2a that is the mounting surface of the electronic component. By forming the end face electrode so as not to reach the mounting surface, it is possible to secure a large effective area for mounting an electronic circuit on the mounting surface.

  The end face electrode 21 can be formed of an alloy such as copper / nickel (CuNi), for example. However, for example, aluminum (Al), copper (Cu), gold (Au), molybdenum (Mo), tungsten (W), tantalum (Ta), chromium (Cr), titanium (Ti), platinum (Pt) ), Ruthenium (Ru) or rhodium (Rh).

  On the second surface 2b (back surface) of the dielectric printed wiring board 2, electrodes 22 functioning as external terminals electrically connected to a circuit board or the like are formed. The end surface electrode 21 may be in contact with the electrode 22 on the back surface of the dielectric printed wiring board 2. That is, the end face electrode 21 may be electrically connected to the electrode 22. However, each of the end face electrodes and the electrodes 22 is not necessarily configured in a one-to-one relationship, and may be modified in various ways as necessary.

  The electrode 22 can be formed of an alloy such as copper / nickel (CuNi), for example. However, other than this, for example, aluminum (Al), copper (Cu), gold (Au), molybdenum (Mo), tungsten (W), tantalum (Ta), chromium (Cr), titanium (Ti), platinum ( It can also be formed using a metal material such as Pt), ruthenium (Ru), or rhodium (Rh). For example, when the electrode 22 is formed of copper foil or the like, it may be plated with gold or the like. Thereby, the reliability in the connection with the outside can be improved.

  2 will be described with reference to FIG. 3A. As shown in FIG. 3A, the end face electrode 21 is electrically connected to the electrode 26 formed on the mounting region 24 via the wiring 25 provided inside the dielectric printed wiring board 2. For example, a terminal of an electronic circuit mounted in the mounting region 24 is connected to the electrode 26. In addition, the end face electrode 21 is electrically connected to the shield case 3 via, for example, a via wiring 27 and an attachment pattern 23 provided in the dielectric printed wiring board 2. As a result, the shield case 3 can be grounded via the electrode 22.

  However, in the above configuration, the mounting pattern 23 is used for joining the shield case 3 and the dielectric printed wiring board 2, but other than this, for example, as shown in FIG. The shield case 3 and the dielectric printed wiring board 2 may be bonded using an adhesive material 23a such as.

  Further, in this embodiment, the end face electrode 21 may be coated with a metal film 21a by plating using a metal material such as gold as shown in FIG. 3C, for example. The metal film 21 a may reach the side surface of the electrode 22 on the back surface of the dielectric printed wiring board 2. Thereby, the reliability of the electrical connection between the end face electrode 21 and the electrode 22 can be enhanced. Moreover, the end surface electrode 21 may be a cut surface by dicing, as will be described later in the manufacturing method. Even in such a case, the reliability of the connection with the outside can be improved by metal plating the exposed surface of the end face electrode 21. FIG. 3C shows an enlarged view of the end face electrode 21 and the metal film 21a in the dielectric printed wiring board 2. FIG.

  Next, a method for manufacturing the electronic component 1A having the above configuration will be described in detail with reference to the drawings.

  First, a method for manufacturing the dielectric printed wiring board 2 having the end face electrode 21 as described above will be described with reference to FIGS. In the manufacturing process of the dielectric printed wiring board 2, as shown in FIG. 4A, one or more holes 41 are formed in the substrate 40 that is a flat plate of a dielectric material. The holes 41 are arranged on a cutting line (90 in FIG. 5) when the dielectric printed wiring board 2 is separated. That is, the region that hits the hole 41 during separation is separated.

  Next, as shown in FIG. 4B, the hole 41 formed as described above is filled with a metal material 42 to be the end face electrode 21. Thereby, when the dielectric printed wiring board 2 is separated into pieces, the metal material 42 filled in the holes 41 is also separated, and the metal material 42 is exposed on the side surface of the dielectric printed wiring board 2. The exposed metal material 42 functions as the end face electrode 21.

  Thereafter, as shown in FIG. 4C, the substrate 40 and the substrate 50 which is a flat plate of a dielectric material are bonded together. That is, the dielectric printed wiring board 2 according to the present embodiment is constituted by a laminated body in which the boards 40 and 50 are laminated. In addition, it is preferable that the attachment pattern 23 is formed in advance on the substrate 50. In addition, it is preferable that a metal pattern such as the electrode 26 and the wiring 25 is formed in advance. As a result, metal patterns such as the attachment pattern 23, the wiring 25, and the electrode 26 can be collectively formed on the plurality of dielectric printed wiring boards 2, and the manufacturing process can be simplified.

  Thus, when the laminated body of the board | substrate 40 and the board | substrate 50 is produced d, as shown to Fig.5 (a) and (b), this is cut along the cutting line 90 using a dicing blade (rotary cutting blade) etc. FIG. The dielectric printed wiring board 2 is separated into pieces by cutting. Note that the electrode 22 may be formed on the surface of the substrate 40 opposite to the substrate 50 in a stage before cutting.

  Next, a method for manufacturing the shield case 3 having the side wall 31 as described above will be described with reference to FIG. In the manufacturing process of the shield case 3, as shown in FIG. 6A, the first member 62 and the side wall 31 that form the upper surface of the shield case 3 by cutting out a substrate 60 that is a flat plate of a conductor material into a predetermined pattern. The substrate 61 is produced in a state where the second member 63 to be processed into a single plane is developed.

  Next, as shown in FIG. 6B, the second member 63 in the cut-out substrate 61 is pressed and processed to form a third member 64. At this time, the thickness of the third member is the thickness of the side wall 31. The length of the third member 64 starting from the first member 62 is the length of the side wall 31, that is, the height of the space formed between the shield case 3 and the dielectric printed wiring board 2.

  Thereafter, as shown in FIG. 6C, the shield member 3 is manufactured by bending the third member 64 in the direction perpendicular to the first member 62.

  When the dielectric printed wiring board 2 and the shield case 3 are manufactured as described above, an electronic circuit is mounted on the mounting area 24 and then the mounting area 24 is covered with the shield case 3 as shown in FIGS. (See FIG. 7). At this time, as described above, the shield case 3 may be bonded by the attachment pattern 23 or may be bonded by an adhesive material 23a such as solder or conductive resin. However, when the attachment pattern 23 is used, as shown in FIG. 7, after the shield case 3 and the attachment pattern 23 are brought into contact with each other, an ultrasonic wave is applied to this portion, so that the contact portion (particularly the attachment pattern 23 is attached). ) Should be melted temporarily. Thereby, the joint strength between the shield case 3 and the dielectric printed wiring board 2 can be increased. This method is also called ultrasonic welding.

  In the above configuration, the shield case 3 is joined to the dielectric printed wiring board 2 at a plurality of locations. However, the present invention is not limited to this, and the shield case 3 and the dielectric case can be joined by joining at least one location. It is possible to join the body printed wiring board 2 with sufficient strength.

  By configuring as described above, according to the present embodiment, the configuration for attaching the shield case 3 to the dielectric printed wiring board 2 can reduce the reduction of the mounting region 24 on the dielectric printed wiring board 2, More effective area can be secured. Further, by adopting a configuration in which the end face electrode 21 does not reach the mounting surface, similarly, the reduction of the mounting region 24 on the dielectric printed wiring board 2 can be reduced, and a larger effective area can be secured.

  In addition, since the shield case 3 and the dielectric printed wiring board 2 are joined or bonded using the mounting pattern 23 or an adhesive material 23a such as solder or conductive resin, both can be easily connected with a simple configuration. It becomes possible to fix, and it becomes possible to simplify a manufacturing process. This also makes it possible to reduce manufacturing costs. Further, since the shield case 3 can be securely fixed to the dielectric printed wiring board 2, it is possible to reliably obtain a shielding effect and improve the yield of the electronic component 1A.

  The electronic component 1A according to the present embodiment is preferably applied to an RF circuit unit, a voltage controlled oscillator (VCO), a PLL (Phase Locked-Loop) module, a front end module, etc. in a mobile phone. . However, the present invention is not limited to this, and it can be realized by reducing the size by applying it to various electronic components.

  The first embodiment described above is merely one of the best modes for carrying out the present invention, and the present invention can be implemented with various modifications without departing from the spirit thereof.

  Next, a second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 8 is a diagram showing a configuration of the electronic component 1B according to the present embodiment. 8A shows a perspective view of the electronic component 1B, and FIG. 8B shows a configuration of the second surface 2b of the electronic component 1B, that is, the back surface. FIG. 9A shows a BB cross-sectional structure in FIG. However, in the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 8 and 9, the electronic component 1 </ b> B has a configuration in which a first surface 2 a on which an electronic circuit is mounted on a dielectric printed wiring board 2 is covered with a shield case 3 </ b> B for the purpose of electrical shielding. In the following description, as in the first embodiment, in the dielectric printed wiring board 2, the first surface 2a that is the mounting surface of the electronic circuit is defined as the upper surface (or surface), and the second surface 2b opposite to the first surface 2a. Is the lower surface (or back surface) and the other surface is the side surface.

  In this configuration, the shield case 3B is formed such that the inner side of at least one side wall 31 is in contact with the side surface of the dielectric printed wiring board 2 as compared with the shield case 3 according to the first embodiment (FIG. 8A). And the side wall 31B in (b). In order to realize this, the side wall 31B is longer than the side wall 31 in the direction perpendicular to the first surface 2a. At this time, the side wall 31B and the end face electrode 21 may be in contact with each other, that is, electrically connected. Thereby, the shield case 3B can be easily grounded.

  Moreover, it is preferable that the side wall 31B is provided in the side surface which the shield case 3B opposes. As a result, the dielectric printed wiring board 2 can be held between the opposing side walls 31B, and the mechanical stability can be improved. When the dielectric printed wiring board 2 is sandwiched between the side walls 31B, the length between the opposing side walls 31B is longer than the length of the dielectric printed wiring board 2 by the thickness of the two side walls 31B. There is a need to. However, the side wall 31B is not limited to the opposite side surface, and may be formed on any side surface.

  Other configurations are the same as those of the electronic component 1A shown in FIGS. 2 and 3, and thus the description thereof is omitted here.

  The side wall 31B and the dielectric printed wiring board 2 or the end face electrode 21 thereof may be bonded using a conductive adhesive material 23B such as solder or conductive resin or an insulating adhesive material. Thereby, the mechanical stability between the shield case 3B and the dielectric printed wiring board 2 and the reliability of the electrical connection between the end face electrode 21 and the shield case 3B can be further improved.

  With the configuration described above, according to the present embodiment, the mounting area on the dielectric printed wiring board 2 can be obtained by the configuration for attaching the shield case 3B to the dielectric printed wiring board 2 as in the first embodiment. The reduction of 24 can be reduced, and a larger effective area can be secured. Further, by adopting a configuration in which the end face electrode 21 does not reach the mounting surface, similarly, the reduction of the mounting region 24 on the dielectric printed wiring board 2 can be reduced, and a larger effective area can be secured. Furthermore, both can be easily fixed with a simple configuration, and the manufacturing process can be simplified. This also makes it possible to reduce manufacturing costs. Furthermore, since the shield case 3B can be securely fixed to the dielectric printed wiring board 2, it is possible to reliably obtain a shielding effect and improve the yield of the electronic component 1B. In particular, when the side wall 31B is in contact with the side surface of the dielectric printed wiring board 2, the mechanical stability thereof can be further improved.

  Since other configurations and manufacturing methods are the same as those in the first embodiment, the description thereof is omitted here. However, Example 2 described above is only one of the best modes for carrying out the present invention, and the present invention can be implemented with various modifications without departing from the gist thereof.

  Next, a third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 10 is a diagram showing a configuration of an electronic component 1C according to the present embodiment. The perspective view and the rear view of the electronic component 1C are the same as those of the electronic component 1B according to the second embodiment shown in FIG. 8, but the shield case 3B is replaced with the shield case 3C. Description is omitted. In the present embodiment, the same components as those in the first or second embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 10, the shield case 3C of the electronic component 1C according to the present embodiment has a configuration in which the tip of the side wall 31B of the shield case 3B according to the second embodiment is bent in a U shape and embedded in the dielectric printed wiring board 2. (Side wall 31C in FIG. 10).

  This configuration can be realized by processing the side wall 31B, bending it into a U-shape, and providing a groove on the corresponding side surface portion of the dielectric printed wiring board 2. By adopting such a configuration, in this embodiment, the mechanical stability between the shield case 3C and the dielectric printed wiring board 2 can be further improved.

  With the configuration as described above, according to the present embodiment, the dielectric printed wiring board 2 is configured by attaching the shield case 3C to the dielectric printed wiring board 2 as in the first and second embodiments. It is possible to reduce the reduction of the mounting area 24 above, and to secure a larger effective area. Further, by adopting a configuration in which the end face electrode 21 does not reach the mounting surface, similarly, the reduction of the mounting region 24 on the dielectric printed wiring board 2 can be reduced, and a larger effective area can be secured. Furthermore, both can be easily fixed with a simple configuration, and the manufacturing process can be simplified. This also makes it possible to reduce manufacturing costs. Furthermore, since the shield case 3C can be securely fixed to the dielectric printed wiring board 2, it is possible to reliably obtain a shielding effect and improve the yield of the electronic component 1C. In particular, the mechanical stability can be further improved by adopting a configuration in which the tip of the side wall 31C is embedded in the side surface of the dielectric printed wiring board 2.

  Since other configurations and manufacturing methods are the same as those in the first embodiment or the second embodiment, description thereof is omitted here. However, Example 3 described above is only one of the best modes for carrying out the present invention, and the present invention can be implemented with various modifications without departing from the gist thereof.

  Next, a fourth embodiment according to the present invention will be described in detail with reference to the drawings. FIG. 11 is a diagram illustrating a configuration of an electronic component 1D according to the present embodiment. 11A shows a perspective view of the electronic component 1D, and FIG. 11B shows a configuration of the second surface 2b, that is, the back surface of the electronic component 1D. FIG. 12 shows a DD cross-sectional structure in FIG. However, in this embodiment, the same components as those in Embodiments 1 to 3 are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 11 and 12, the electronic component 1D has a configuration in which the first surface 2a on which the electronic circuit is mounted on the dielectric printed wiring board 2 is covered with a shield case 3D for the purpose of electrical shielding. . In the following description, as in the first embodiment, in the dielectric printed wiring board 2, the first surface 2a that is the mounting surface of the electronic circuit is defined as the upper surface (or surface), and the second surface 2b opposite to the first surface 2a. Is the lower surface (or back surface) and the other surface is the side surface.

  In this configuration, the shield case 3D has a tip of at least one side wall (referred to as 31D) from the first surface 2a side to the side surface of the dielectric printed wiring board 2, similarly to the shield case 3B according to the second embodiment. It has a fitted configuration. The side wall 31D that fits is longer than the side wall 31 that does not fit. That is, the side wall 31 </ b> D is longer than the side wall 31, and the difference in length is embedded in the dielectric printed wiring board 2. At this time, the side wall 31D and the end face electrode 21 may be in contact with each other, that is, electrically connected. As a result, the shield case 3D can be easily grounded.

  With the configuration as described above, according to the present embodiment, the dielectric printed wiring board 2 is configured by attaching the shield case 3D to the dielectric printed wiring board 2 as in the first to third embodiments. It is possible to reduce the reduction of the mounting area 24 above, and to secure a larger effective area. Further, by adopting a configuration in which the end face electrode 21 does not reach the mounting surface, similarly, the reduction of the mounting region 24 on the dielectric printed wiring board 2 can be reduced, and a larger effective area can be secured. Furthermore, both can be easily fixed with a simple configuration, and the manufacturing process can be simplified. This also makes it possible to reduce manufacturing costs. Furthermore, since the shield case 3D can be securely fixed to the dielectric printed wiring board 2, a shield effect can be obtained with certainty, and the yield of the electronic component 1D can be improved. In particular, when the side wall 31D is fitted to the side surface of the dielectric printed wiring board 2 from the upper surface side, the mechanical stability can be further improved.

  Since other configurations and manufacturing methods are the same as those in the first to third embodiments, the description thereof is omitted here. However, the fourth embodiment described above is only one of the best modes for carrying out the present invention, and the present invention can be implemented with various modifications without departing from the gist thereof.

  Next, a fifth embodiment according to the present invention will be described in detail with reference to the drawings. FIG. 13 is a diagram showing a configuration of an electronic component 1E according to this embodiment. 13A shows a perspective view of the electronic component 1E, and FIG. 13B shows a configuration of the second surface 2b of the electronic component 1E, that is, the back surface. FIG. 14 shows an EE cross-sectional structure in FIG. However, in this embodiment, the same components as those in Embodiments 1 to 4 are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 13 and 14, the electronic component 1 </ b> E has a configuration in which the first surface 2 a for mounting the electronic circuit on the dielectric printed wiring board 2 is covered with a shield case 3 </ b> E for the purpose of electrical shielding. . In the following description, as in the first embodiment, in the dielectric printed wiring board 2, the first surface 2a that is the mounting surface of the electronic circuit is defined as the upper surface (or surface), and the second surface 2b opposite to the first surface 2a. Is the lower surface (or back surface) and the other surface is the side surface.

  In this configuration, the end face electrode 21E of the dielectric printed circuit board 2 is formed from the second surface 2b (back surface) side of the dielectric printed circuit board 2, and a metal is formed on the side surface of the groove 21e that does not penetrate the dielectric printed circuit board 2. It is formed by plating with material. At this time, in particular, the end face electrode 21E that is not electrically connected to the shield case 3E is preferably formed such that the bottom surface of the groove 21e is not plated (except for the extension of the plated portion provided on the side surface).

  As a metal material for plating the side surface of the groove 21e, for example, an alloy such as copper / nickel (CuNi) can be used. However, other than this, for example, aluminum (Al), copper (Cu), gold (Au), molybdenum (Mo), tungsten (W), tantalum (Ta), chromium (Cr), titanium (Ti), platinum ( Pt), ruthenium (Ru), rhodium (Rh), or the like can be used.

  Further, the shield case 3E is configured such that, for example, the tip of the side wall 31E is bent in a U-shape, and this portion is engaged with the bottom surface of the groove 21e, similarly to the shield case 3 in the third embodiment. Thereby, in a present Example, the mechanical stability of the shield case 3E and the dielectric printed wiring board 2 can further be improved.

  Next, a method for manufacturing the electronic component 1E having the above configuration will be described in detail with reference to the drawings.

  First, a method for manufacturing the dielectric printed wiring board 2 having the end face electrode 21E as described above will be described with reference to FIGS. However, the same components as those in the manufacturing method according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the manufacturing process of the dielectric printed wiring board 2 according to the present embodiment, as shown in FIG. 15A, one or more grooves 71 are formed in the substrate 70 which is a flat plate of a dielectric material. The grooves 71 have a depth that does not penetrate the substrate 70 and are arranged on a cutting line (90 in FIG. 16) when the dielectric printed wiring board 2 is separated. That is, the region that hits the groove 71 during separation is separated.

  Next, as shown in FIG. 15B, the side wall of the groove 71 formed as above is plated using a metal material to form a metal film 72. Thus, when the dielectric printed wiring board 2 is separated into pieces, the metal film 72 is also separated, and the metal film 72 is exposed on the side surface of the dielectric printed wiring board 2. The exposed metal film 72 functions as the end face electrode 21E. However, instead of plating, a material such as a conductive resin may be applied to the side surface of the groove 71. As described above, the dielectric printed wiring board 2 according to the present embodiment can be configured by a laminate of substrates of dielectric materials. In addition, it is preferable that the attachment pattern 23 is formed in advance on the substrate 70. In addition, it is preferable that a metal pattern such as the electrode 26 and the wiring 25 is formed in advance. As a result, metal patterns such as the attachment pattern 23, the wiring 25, and the electrode 26 can be collectively formed on the plurality of dielectric printed wiring boards 2, and the manufacturing process can be simplified.

  When the substrate 70 in which the side surface of the groove 71 is metal-plated in this way is produced, as shown in FIGS. 16A and 16B, this is cut along the cutting line 90 using a dicing blade (rotary cutting blade) party. The dielectric printed wiring board 2 is separated into pieces by cutting. Note that the electrode 22 may be formed on the surface of the substrate 70 on the opening side of the groove 21e before the cutting.

  The shield case 3E according to the present embodiment can be applied with a manufacturing method substantially the same as the manufacturing method described in the first embodiment. However, when forming the side wall 31E, a two-step process, that is, a step of bending it into a U-shape is required.

  When the dielectric printed wiring board 2 and the shield case 3E are manufactured as described above, after the electronic circuit is mounted on the mounting region 24, as shown in FIGS. 13 and 14, the mounting region 24 is then replaced with the shield case 3E. cover. At this time, similarly to the first embodiment, the shield case 3E may be joined by the attachment pattern 23 or may be adhered by an adhesive material 23a such as solder or conductive resin. Further, when the attachment pattern 23 is used, these may be fixed by ultrasonic welding.

  With the configuration as described above, according to the present embodiment, the dielectric printed wiring board 2 is configured by attaching the shield case 3E to the dielectric printed wiring board 2 as in the first to fourth embodiments. It is possible to reduce the reduction of the mounting area 24 above, and to secure a larger effective area. Further, by adopting a configuration in which the end face electrode 21 does not reach the mounting surface, similarly, the reduction of the mounting region 24 on the dielectric printed wiring board 2 can be reduced, and a larger effective area can be secured. Furthermore, both can be easily fixed with a simple configuration, and the manufacturing process can be simplified. This also makes it possible to reduce manufacturing costs. Furthermore, since the shield case 3E can be securely fixed to the dielectric printed wiring board 2, it is possible to reliably obtain a shielding effect and improve the yield of the electronic component 1E. In particular, the mechanical stability can be further improved by adopting a configuration in which the tip of the side wall 31E is engaged with the groove 21e formed in the dielectric printed wiring board 2.

  Since other configurations and manufacturing methods are the same as those in the first to fourth embodiments, the description thereof is omitted here. However, the fifth embodiment described above is only one of the best modes for carrying out the present invention, and the present invention can be implemented with various modifications without departing from the gist thereof.

It is a figure which shows the structure of the electronic component 100 by a prior art, (a) is the perspective view, (b) is the back view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of 1 A of electronic components by Example 1 of this invention, (a) is the perspective view, (b) is the back view. (A) is a figure which shows the AA cross-section in FIG. 2, (b) is a figure which shows the other example of the AA cross-section in FIG. 2, (c) is the dielectric printed wiring board 2 It is a figure which shows the enlarged view of the end surface electrode 21 and the metal film 21a in FIG. It is a figure for demonstrating the manufacturing method of the dielectric printed wiring board 2 by Example 1 of this invention (1). It is a figure for demonstrating the manufacturing method of the dielectric printed wiring board 2 by Example 1 of this invention (2). It is a figure for demonstrating the manufacturing method of the shield case 3 by Example 1 of this invention. It is a figure which shows the ultrasonic welding performed when the mounting area | region 24 is covered with the shield case 3 in Example 1 of this invention. It is a figure which shows the structure of the electronic component 1B by Example 2 of this invention, (a) is the perspective view, (b) is the back view. (A) is a figure which shows the BB cross-section in FIG. 8, (b) is a figure which shows the other example of the BB cross-section in FIG. It is a figure which shows the cross-section (equivalent to a BB cross section) of the electronic component 1C by Example 3 of this invention. It is a figure which shows the structure of electronic component 1D by Example 4 of this invention, (a) is the perspective view, (b) is the back view. It is a figure which shows DD sectional structure in FIG. It is a figure which shows the structure of the electronic component 1E by Example 5 of this invention, (a) is the perspective view, (b) is the back view. It is a figure which shows the EE cross-section in FIG. It is a figure for demonstrating the manufacturing method of the dielectric printed wiring board 2 by Example 5 of this invention (1). It is a figure for demonstrating the manufacturing method of the dielectric printed wiring board 2 by Example 5 of this invention (2).

Explanation of symbols

1A, 1B, 1C, 1D, 1E Electronic component 2 Dielectric printed wiring board 2a First surface 2b Second surface 3, 3B, 3C, 3D, 3E Shield case 21, 21E End surface electrode 21a, 72 Metal film 21e, 71 Groove 22, 26 Electrode 23 Mounting pattern 23a, 23B Adhesive material 24 Mounting area 25 Wiring 27 Via wiring 31, 31B, 31C, 31D, 31E Side wall 40, 50, 60, 61, 70 Substrate 41 Hole 42 Metal material 62 First member 63 Second member 64 Third member 90 Cutting line

Claims (20)

An electronic component having a resin substrate in which an end surface electrode is formed on a side surface with a first surface on which an electronic circuit is mounted as an upper surface,
2. The electronic component according to claim 1, wherein the end surface electrode is formed in a region that does not reach the first surface from a second surface opposite to the first surface on the side surface.   The electronic component according to claim 1, wherein the end face electrode is made of a conductive metal.   The electronic component according to claim 1, wherein the end face electrode is plated with a metal material.   The electronic component according to claim 1, wherein the end face electrode is made of a conductive resin.   2. The electronic component according to claim 1, wherein the end face electrode is a metal film formed on the side surface of the groove formed from the second surface and not reaching the first surface. A resin substrate on which the electronic circuit is mounted on the first surface;
A case covering an area where the electronic circuit is mounted on the first surface;
An electronic component, wherein at least a part of the bottom surface of the side wall of the case is fixed to the first surface.   7. The electronic component according to claim 6, wherein the case is made of a metal material.   The electronic component according to claim 6, wherein the case is electrically connected to a metal pattern formed on the first surface. Having an end surface electrode formed on a side surface of the resin substrate with the first surface as an upper surface;
The electronic part according to claim 6, wherein the case is electrically connected to the end face electrode.   9. The electronic component according to claim 8, wherein the case and the metal pattern are electrically connected through a conductive resin or solder.   The electronic component according to claim 9, wherein the case and the end surface electrode are electrically connected via a conductive resin or solder. A metal pattern formed on the first surface at a position where at least a part of a bottom surface of the side wall of the case comes into contact;
The electronic component according to claim 6, wherein at least a part of a bottom surface of the side wall of the case and the metal pattern are fixed by ultrasonic welding.   The electronic component according to claim 6, wherein at least a part of the side wall of the case is in contact with a side surface of the resin substrate with the first surface as an upper surface.   The electronic component according to claim 6, wherein at least a part of the side wall of the case is fitted into the resin substrate. A groove formed on a side surface of the resin substrate with the first surface as an upper surface;
The electronic component according to claim 6, wherein the end face electrode is a metal film formed on a side surface of the groove.   The electronic component according to claim 15, wherein at least a part of the side wall of the case is engaged with the groove. An electrode formed on a second surface opposite to the first surface of the resin substrate;
The electronic component according to claim 1, wherein the end face electrode and the electrode are electrically connected. A resin substrate having an end surface electrode formed on a side surface with the first surface on which an electronic circuit is mounted as an upper surface;
The resin substrate, wherein the end surface electrode is not in contact with the first surface. The first surface on which the electronic circuit is mounted is a resin substrate covered with a case,
A resin substrate comprising a metal pattern formed in a region where at least a part of the bottom surface of the side wall of the case on the first surface contacts. A method of manufacturing an electronic component in which a first surface on which an electronic circuit on a resin substrate is mounted is covered with a case,
A method of manufacturing an electronic component comprising a step of fixing at least a part of a bottom surface of a side wall of the case to the first surface.

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