JP2005026926A - Solid-state imaging apparatus and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus capable of developing in a short time at a low cost. <P>SOLUTION: In the solid-state imaging apparatus provided with: at least a solid-state imaging element including a circuit board with a solid-state imaging element mounted thereon and a lens holder for supporting a lens at a position corresponding to the solid-state imaging element; and a flexible printed circuit board for interconnecting the circuit board to an external board, a connection position alignment confirmation window with the circuit board is provided around a fixed position of the flexible printed circuit board with respect to the circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device and a manufacturing method thereof.
[0002]
[Prior art]
Small solid-state imaging devices that can be mounted on products such as digital cameras and portable terminals with cameras have been developed.
[0003]
1 is a cross-sectional view of an imaging apparatus according to the prior art, FIGS. 2A and 2B are perspective views as viewed from the imaging element mounting side and the protective glass mounting side of the imaging apparatus, and FIGS. It is sectional drawing and the perspective view which show the form which integrated the lens in the imaging device.
[0004]
In FIG. 1, 1 is an image sensor, 100 is a stud bump formed on a terminal of the image sensor 1, 2 is a peripheral signal processing IC, 3 is a substrate provided with a through hole 300, and wiring is formed on one side. It is a wiring board. Reference numeral 4 denotes a protective glass for protecting the image pickup device 1, and 5 denotes an FPC (flexible printed circuit board) which serves as a power source and signal input / output path between the image pickup apparatus and the external substrate. 6 is a sealing agent for protecting the imaging device 1 and the signal processing IC 2, 7 is an anisotropic conductive adhesive for connecting the FPC 5 and the wiring board 3, and 8 is a protection for bonding the wiring board 3 and the protective glass 4. It is a glass adhesive.
[0005]
In FIG. 3, 10 is a lens, 11 is a lens housing, and 12 is an imaging element module (imaging device). If the optical casing is formed in accordance with the outer shape of the image pickup device module as shown in FIG. 3, it can be assembled with the lens optical system with high accuracy without adjusting the optical axis and adjusting the tilt. (See Patent Document 1)
[0006]
[Patent Document 1]
JP 2000-269472 A (page 3-4, FIGS. 1 to 3)
[0007]
[Problems to be solved by the invention]
Since the imaging device is a complete product including the FPC, it has a different shape depending on the product on which the imaging device is mounted, and it takes development time to design the wiring board and FPC each time. Had to be remade. Furthermore, since production is performed each time, a large amount of time is often spent in arranging parts and managing them. The present invention aims to solve such problems.
[0008]
[Means for Solving the Problems]
A solid-state imaging module including at least a circuit board on which a solid-state imaging element is mounted; a lens holder that holds a lens at a position corresponding to the solid-state imaging element; and a flexible printed circuit board that connects the circuit board and an external board. The solid-state imaging device includes a connection position alignment confirmation window with the circuit board in the vicinity of a position where the flexible printed circuit board is fixed to the circuit board.
[0009]
A solid-state imaging module including at least a circuit board on which a solid-state imaging element is mounted; a lens holder that holds a lens at a position corresponding to the solid-state imaging element; and a flexible printed circuit board that connects the circuit board and an external board. In the method of manufacturing a solid-state imaging device, wherein a connection position alignment confirmation window with the circuit board is provided near a fixed position of the flexible printed circuit board with the circuit board. A step of assembling the lens, a step of assembling the lens into the lens holder, and a step of assembling the circuit board and the lens holder on which the solid-state imaging device is mounted, and the step of assembling the circuit board and the lens holder on which the solid-state imaging device is mounted And a step of positioning and fixing the circuit board and the flexible printed circuit board. A manufacturing method of that solid-state imaging device.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 4 is an exploded perspective view of the solid-state imaging device according to the present invention, and the components other than the main part are omitted for easy understanding. The circuit board 3 ′ on which the solid-state imaging device 1 ′ is mounted is assembled with the lens holder 11 ′. Many end portions 3'a of the wiring patterns are gathered at one end portion of the circuit board 3 '. At the end of a flexible printed circuit board (hereinafter referred to as FPC) 5 ′ connecting the circuit board 3 ′ and an external board (not shown), there are end portions 3 of numerous wiring patterns formed on the circuit board 3 ′. A plurality of wiring pattern ends 5′a are formed corresponding to “a”, and the plurality of wiring pattern ends 5′a corresponding to the plurality of wiring patterns end 3′a are anisotropically conductive. It is fixed via an adhesive 13.
[0011]
When the resolution of the solid-state imaging device 1 ′ is increased, the end portion 3′a of the wiring pattern increases. The end portion 5′a of the corresponding FPC 5 ′ wiring pattern also increases. As miniaturization of solid-state imaging devices progresses, the width of wiring pattern end portions has become as fine as 70 μm and the interval between wiring pattern end portions has become as fine as 70 μm, and further densification is required. If the alignment of the wiring pattern end portions of the circuit board 3 ′ and the FPC 5 ′ cannot be accurately performed, it is not possible to cope with a narrow pitch.
[0012]
In the present invention, connection position alignment confirmation windows 5′b and 5′c with respect to the circuit board are provided in the vicinity of the position where the FPC is fixed to the circuit board. An anisotropic conductive adhesive 13 is interposed between the confirmation windows 5'b and 5'c and the wiring pattern end 3'a of the circuit board 3 '. Since the wiring pattern end 3′a of the substrate 3 ′ can be seen through, accurate alignment is possible.
[0013]
In FIG. 4, two confirmation windows 5′b and 5′c are formed, but a single confirmation window connected may be used. In addition, although two patterns can be seen in one window, the size in which one pattern can be seen may be used. Further, it is not necessary to have a square shape, and any shape may be used as long as the purpose of confirming the wiring of the circuit board and the wiring of the FPC can be achieved and the handling of the FPC is not hindered.
[0014]
Since the entire window portion is bonded and fixed to the circuit board 3 ′ via the anisotropic conductive adhesive 13, the strength after fixing has no problem.
[0015]
FIG. 5 is a block diagram showing manufacturing steps of the solid-state imaging device according to the present invention. The process of mounting the solid-state imaging device on the circuit board and the process of incorporating the lens into the lens holder are separate operations, and there is no pre- and post-process. Next, it is a step of assembling a circuit board on which the solid-state imaging device is mounted and a lens holder. At this time, the circuit board and the FPC are not fixed.
A feature of the method of manufacturing the solid-state imaging device according to the present invention is that the step of positioning and fixing the circuit board and the FPC after the step of assembling the circuit board and the lens holder on which the solid-state imaging element is mounted.
[0016]
As described above, small-sized imaging devices have been used in many products such as digital cameras and portable information terminals, and each time they are designed according to the product. According to this, a so-called solid-state imaging module unit in which a circuit board on which a solid-state imaging element is mounted and a lens holder are assembled can be used in common, and only the FPC needs to be designed for each product.
[0017]
【The invention's effect】
According to the first aspect of the present invention, accurate positioning can be performed regardless of the type of circuit board (for example, a transparent substrate or an opaque substrate) to which the FPC is fixed.
[0018]
According to the second aspect of the present invention, since the solid-state imaging module unit can be used in common, the solid-state imaging module can be batch-produced regardless of many types of products, and parts arrangement and management thereof are simplified. In addition, the development of a solid-state imaging device including an FPC can be performed in a short period of time, and the manufacturing period can be shortened.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a conventional image pickup apparatus. FIG. 2 is a perspective view of the image pickup apparatus according to the prior art as viewed from the image pickup element mounting side and the protective glass mounting side. FIG. 4 is an exploded perspective view of a solid-state imaging device according to the present invention. FIG. 5 is a block diagram illustrating a manufacturing process of the solid-state imaging device according to the present invention.
1 Image sensor 1 'Solid-state image sensor 2 Signal processing IC
3 Wiring board 3 'Circuit board 3'a Wiring pattern edge part 4 Protective glass 5 FPC
5 'FPC
5'a Wiring pattern edge 5'b Confirmation window 5'c Confirmation window 6 Sealant 7 Anisotropic conductive adhesive 8 Protective glass adhesive 10 Lens 11 Lens housing 11 'Lens holder 12 Image sensor module 13 Anisotropic Conductive adhesive 100 Stud bump 300 Through hole

Claims (2)

at least,
A circuit board on which a solid-state image sensor is mounted;
A solid-state imaging module comprising a lens holder that holds a lens at a position corresponding to the solid-state imaging device;
In a solid-state imaging device comprising a flexible printed circuit board for connecting the circuit board and an external board,
A solid-state imaging device, wherein a connection position alignment confirmation window with the circuit board is provided in the vicinity of a position where the flexible printed circuit board is fixed to the circuit board. at least,
A circuit board on which a solid-state image sensor is mounted;
A solid-state imaging module comprising a lens holder that holds a lens at a position corresponding to the solid-state imaging device;
A solid-state imaging device comprising: a flexible printed circuit board that connects the circuit board and an external board; and a connection alignment confirmation window with the circuit board is provided near a fixed position of the flexible printed circuit board with the circuit board. In the manufacturing method of the device,
at least,
Mounting a solid-state imaging device on a circuit board;
Incorporating the lens into the lens holder;
Assembling a circuit board and a lens holder on which the solid-state imaging device is mounted;
A method for manufacturing a solid-state imaging device, comprising: a step of positioning and fixing the circuit board and the flexible printed circuit board after the step of assembling the circuit board and the lens holder on which the solid-state imaging element is mounted.

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