JP2005026614A - Exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device which can perform accurate exposing by well conducting a stage position measurement corresponding to enlargement of the stage and lengthening of its moving stroke without enlarging a column. <P>SOLUTION: The exposure device includes a base plate, the column supported to the base plate to support a projection optical system via a surface plate 1, a laser interferometer provided in the column to measure relative position information in a Y-axis direction of the projection optical system PL, a laser interferometer for measuring relative position information in an X-axis direction of the projection optical system PL, and a controller for obtaining reference position information of the projection optical system PL based on measured results of the respective laser interferometers. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus that exposes a mask pattern onto a substrate.

  Microdevices such as liquid crystal display devices and semiconductor devices are manufactured by repeating a predetermined process such as film formation, exposure, and etching multiple times and laminating multiple patterns on the substrate. In the processing, an exposure apparatus that transfers a pattern formed on a mask onto a photosensitive substrate is used. The exposure apparatus includes a mask stage that supports a mask and a substrate stage that supports a substrate, and transfers the mask pattern onto the substrate via a projection optical system while sequentially moving the mask stage and the substrate stage. The exposure apparatus includes a batch exposure apparatus that simultaneously transfers the entire mask pattern onto the substrate, and a scanning exposure apparatus that continuously transfers the mask pattern onto the substrate while synchronously scanning the mask stage and the substrate stage. The two types are mainly known. Among these, when manufacturing a liquid crystal display device, a scanning exposure apparatus is mainly used from the request | requirement of the enlargement of a display area (refer patent document 1). In a scanning exposure apparatus, a plurality of projection optical systems are arranged so that adjacent projection areas are displaced by a predetermined amount in the scanning direction, and ends of adjacent projection areas overlap in a direction orthogonal to the scanning direction. There is a so-called multi-lens scanning exposure apparatus (multi-lens scanning exposure apparatus). The multi-lens scanning exposure apparatus can obtain an exposure region while maintaining good imaging characteristics.

In a conventional exposure apparatus, the plurality of projection optical systems are supported on a column (the body of the exposure apparatus) via separate supports called wings, and projection optics are used using an interferometer attached to the column. Exposure processing is performed while measuring the positions of the mask stage and substrate stage relative to the system. In addition, when performing an exposure process, it is necessary to accurately overlay an image of a pattern to be stacked next on a pattern already formed on the substrate. In the alignment process, alignment information (mark detection system) is formed on the substrate while measuring the position information of the substrate stage that supports the substrate with an interferometer, for example. Measurement is performed using the.
JP 2000-77313 A

  By the way, in order to meet the recent demand for larger substrates, it is necessary to increase the size of the stage and the length of the movement stroke. For this reason, the column supporting the projection optical system also needs to be enlarged. Further, since the interferometer for measuring the position of the stage needs to be arranged outside the moving stroke of the stage, it is necessary to enlarge the column also in this respect. However, it is difficult to manufacture such a large column integrally from the viewpoint of processing accuracy and processing limit. In addition, when the mask stage or the substrate stage is moved, the column may be slightly distorted and deformed. In particular, the projection optical system of the scanning exposure apparatus for manufacturing a liquid crystal display device is an erecting equal magnification system. In general, the mask stage and the substrate stage move in the same direction at the time of scanning exposure, so that the offset load on the column increases. For this reason, in the large column, the occurrence of the distortion becomes prominent, which causes inconveniences such as a change in the position of the pattern image projected onto the substrate by changing the attitude of the projection optical system. In addition, if the position of the stage is measured using an interferometer attached to the column due to the change in the attitude of the projection optical system, an error occurs in the measurement result, and the stage position measurement and alignment processing during exposure can be performed with high accuracy. Inconveniences that cannot be made occur and the pattern image is deteriorated.

  The present invention has been made in view of such circumstances, and does not increase the size of the column, but it can accurately measure the position of the stage while dealing with the increase in the size of the stage and the length of its moving stroke. An object of the present invention is to provide an exposure apparatus capable of performing a good exposure process.

In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 19 shown in the embodiment.
An exposure apparatus (EX) of the present invention is an exposure apparatus that exposes a pattern of a mask (M) onto a substrate (P) via a projection optical system (PL), and includes a base structure (110) and a base structure (110). ) And a support structure (100) for supporting the projection optical system (PL) via the surface plate (1), and the support structure (100), the first structure of the projection optical system (P). The first measuring device (11-15) that measures relative position information in the direction (Y) and the first measuring device (11-15) are provided separately, and the first direction (Y) of the projection optical system (PL) ) Based on the measurement results of the second measurement device (8, 9, 16-19) for measuring the relative position information in the second direction (X) intersecting with the first measurement device and the second measurement device. And a control device (CONT) for obtaining reference position information of the system (PL) That.

  According to the present invention, the first measurement device for measuring the position information of the projection optical system is provided in the support structure, and the second measurement device is provided separately from the first measurement device, for example, outside the moving stroke of the stage. The position information can be measured without increasing the size of the support structure (column). Then, by obtaining the reference position information of the projection optical system based on the measurement results of the first and second measuring devices, the stage position information with respect to the projection optical system can be measured based on the reference position information, and the substrate It is possible to correct variations in the position of the pattern image projected onto the image. Here, the second measuring device can be provided on a base structure (base plate) that supports the support structure, or on a support surface (for example, a floor surface) that supports the base structure. The support surface includes a predetermined structure separated from the support structure.

  Since the support structure that supports the projection optical system via the surface plate is supported by the base structure, and the reference position information of the projection optical system is obtained by the measurement device, the base structure and the support structure are Even if a relative position variation occurs, the stage position can be satisfactorily measured based on the obtained reference position information. Therefore, accurate exposure processing can be performed while maintaining the relative position between the stage and the projection optical system in a desired state without increasing the size of the support structure even when the substrate and the stage are increased in size.

The exposure apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing an embodiment of the exposure apparatus of the present invention.
In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M on which a pattern is formed, a substrate stage PST that supports a photosensitive substrate P, and a mask M that is supported by the mask stage MST. Illumination optical system IL for illuminating with, projection optical system PL for projecting an image of the pattern of mask M illuminated with exposure light EL onto substrate P supported by substrate stage PST, and alignment formed on substrate P An alignment system (mark detection system) AL capable of detecting marks, a focus detection system AF for detecting positional information of the mask M and the substrate P with respect to the image plane of the projection optical system PL, a projection optical system PL, an alignment system AL, and A surface plate 1 that supports the focus detection system AF, a column (support structure) 100 that supports the surface plate 1, and a base plate that supports the column 100. , A plurality of interferometers (measurement devices) 6 to 15 provided on the column 100, a plurality of interferometers (measurement devices) 16 to 19 provided on the base plate 110, and an exposure process. And a control device CONT that performs overall control of the operation. The alignment system AL and the focus detection system AF are accommodated in a housing U and unitized, and are supported by the surface plate 1 via the housing U. The base plate 110 is placed horizontally on a floor surface (support surface) 111. The column 100 includes an upper plate portion 100A and leg portions 100B extending downward from each of the four corners of the upper plate portion 100A, and is supported by the base plate 110 via the leg portions 100B. In the present embodiment, the projection optical system PL has a plurality (seven) of projection optical modules PLa to PLg, and the illumination optical system IL has a plurality (seven) corresponding to the number and arrangement of the projection optical modules. The illumination optical module is provided. In this embodiment, the substrate P is obtained by applying a photosensitive agent (photoresist) to a glass substrate.

  The exposure apparatus EX according to the present embodiment is a scanning exposure apparatus that performs scanning exposure by synchronously moving the mask M and the substrate P with respect to the projection optical system PL, and constitutes a so-called multi-lens scanning exposure apparatus. Yes. In the following description, the synchronous movement direction of the mask M and the substrate P is the X-axis direction (scanning direction), the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis direction, and the Y-axis direction. The direction orthogonal to the Z axis direction. The directions around the X, Y, and Z axes are the θX, θY, and θZ directions.

The illumination optical system IL includes a plurality of light sources, a light guide that once collects the light beams emitted from the plurality of light sources, and then uniformly distributes the light guides, and a light beam (exposure light) having a uniform illuminance distribution. ), A blind part having an opening for shaping the exposure light from the optical integrator into a slit shape, and a condenser lens that forms an image of the exposure light that has passed through the blind part on the mask M. Yes. The exposure light EL from the condenser lens illuminates a plurality of slit-shaped illumination areas of the mask M. A mercury lamp is used as the light source in the present embodiment, and the exposure light EL is a wavelength required for exposure using a wavelength selection filter (not shown), g-line (436 nm), h-line (405 nm), i-line (365 nm). ) Etc. are used. As the exposure light EL, KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), or F ₂ laser light (wavelength 157 nm) can also be used.

  Mask stage MST is provided on upper plate portion 100 </ b> A of column 100. The mask stage MST is provided in the mask holder 20 that holds the mask M, a pair of linear motors 21 and 21 that can move the mask holder 20 in the X-axis direction with a predetermined stroke on the upper plate portion 100A, and the upper plate portion 100A. And a pair of guide portions 22 and 22 for guiding the mask holder 20 moving in the X-axis direction. In FIG. 1, the −Y side linear motor 21 and the guide portion 22 are not shown. The mask holder 20 holds the mask M via a vacuum chuck. An opening 20 </ b> A through which a pattern image of the mask M passes is formed at the center of the mask holder 20. Each of the linear motors 21 is supported by a support member 23 on the upper plate portion 100A and is provided so as to extend in the X-axis direction. The linear motor 21 is provided corresponding to the stator 21A. And a mover 21B fixed on both sides in the Y-axis direction. The linear motor 21 may be a so-called moving magnet type linear motor in which the stator 21A is constituted by a coil unit (armature unit) and the mover 21B is constituted by a magnet unit, or the stator 21A is constituted by a magnet unit and the mover 21B is constituted. A so-called moving coil type linear motor may be used. Then, the mask holder 20 moves in the X-axis direction when the mover 21B is driven by electromagnetic interaction with the stator 21A. Each of the guide portions 22 guides the mask holder 20 moving in the X-axis direction, is provided so as to extend in the X-axis direction, and is fixed to the upper plate portion 100A of the column 100. Guided members 24 and 24 having concave portions that engage with the guide portions 22 are fixed to the lower portion of the mask holder 20. An air bearing which is a non-contact bearing is provided between the guided members 24 and 24 and the guide portions 22 and 22, and the mask holder 20 is supported in a non-contact manner with respect to the guide portion 22, while in the X-axis direction. Move to. Although not shown, the mask stage MST also has a moving mechanism including, for example, a voice coil motor that moves the mask holder 20 that holds the mask M in the Y-axis direction and the θZ direction. The mask holder 20 may be provided so as to be movable in the θX, θY, and Z-axis directions by a moving mechanism. The posture of the mask holder 20 can be adjusted by the linear motor and the moving mechanism. In the following description, the linear motor and the moving mechanism capable of adjusting the posture of the mask holder 20 (mask stage MST) are collectively referred to as “mask stage driving device MSTD” as appropriate.

  FIG. 2 is a schematic perspective view showing the surface plate 1 supporting the projection optical modules PLa to PLg, and FIG. 3 is a plan view. As shown in FIGS. 2 and 3, the projection optical system PL includes a plurality of projection optical modules PLa to PLg, and these projection optical modules PLa to PLg are supported by the surface plate 1. Among the plurality of projection optical modules PLa to PLg constituting the projection optical system PL, the projection optical modules PLa, PLc, PLe, and PLg are arranged side by side in the Y axis direction, and the projection optical modules PLb, PLd, and PLf are in the Y axis direction. They are arranged side by side. Further, the projection optical modules PLa, PLc, PLe, and PLg arranged in the Y-axis direction and the projection optical modules PLb, PLd, and PLf arranged in the Y-axis direction are arranged so as to face each other in the X-axis direction. It is arranged in a staggered pattern. That is, each of the projection optical modules PLa to PLg arranged in a staggered manner is arranged by displacing adjacent projection optical modules (for example, projection optical modules PLa and PLb, PLb and PLc) by a predetermined amount in the Y-axis direction. ing. The field stop of each of the projection optical modules PLa to PLg has a trapezoidal shape, for example, and is set so that the total aperture width of the field stop in the scanning direction is always equal. Therefore, since the joint portions of the adjacent projection optical modules PLa to PLg are exposed in an overlapping manner, there is an advantage that the optical aberration and exposure illuminance of the projection optical system change smoothly.

  The surface plate 1 is kinematically supported via the support part 2 with respect to the upper plate part 100A of the column (support structure) 100. Here, an opening 100C is provided in the central portion of the upper plate portion 100A, and the surface plate 1 is supported on the peripheral portion of the opening 100C in the upper plate portion 100A. And the lower part of projection optical module PLa-PLg is arrange | positioned at the opening part 100C.

  The support portion 2 includes a V-groove member 4 having a V-shaped inner surface 3, and a spherical member 5 having a spherical surface in contact with the V-shaped inner surface 3 of the V-groove member 4. Each is provided. The V-groove member 4 is fixed to the upper plate portion 100 </ b> A of the column 100. A spherical concave portion in which the spherical member 5 can be disposed is formed on the lower surface of the surface plate 1, and the inner surface of the spherical concave portion of the surface plate 1 and the spherical surface of the spherical member 5 are in contact with each other. The spherical member 5 is placed on the V-shaped inner surface 3 of the V-groove member 4, and the surface of the spherical member 5 slides in the direction of the V-shaped ridge line La (see arrow y in FIG. 3) with respect to the V-shaped inner surface 3. It is possible to move. Each of the V-groove members 4 is arranged such that a plurality of the extended lines of the V-shaped ridge line La of the V-groove member 4 intersect each other at a substantially central portion O in the XY direction of the projection optical modules PLa to PLg. .

  The surface plate 1 is in a state of being placed on the spherical member 5 via the spherical concave portion, and the inner surface of the spherical concave portion and the surface of the spherical member 5 are slidable. Since these surfaces are slidable, for example, when the column 100 is slightly deformed, the influence of the deformation of the column 100 on the surface plate 1 is suppressed by sliding these surfaces. Note that a low friction material film such as diamond-like carbon may be coated on each of the V-shaped inner surface 3 of the V-groove member 4, the surface of the spherical member 5, and the spherical concave portion of the surface plate 1. As a result, the static friction coefficient of each surface is reduced, for example, the stress generated when the columns 100 are slightly deformed and the surfaces slide is suppressed, and the influence of the deformation of the columns 100 on the surface plate 1 is improved. Can be suppressed.

  The surface plate 1 is made of, for example, a metal matrix composite material (MMC: Metal Matrix Composites). The metal matrix composite material is a composite material in which a metal is used as a matrix material and a ceramic reinforcing material is composited therein. Here, a material containing aluminum as a metal is used. An opening 1A is formed at the center of the surface plate 1, and the optical path of the exposure light EL of each of the projection optical modules PLa to PLg is secured by this opening 1A. Here, the surface plate 1 is formed in a hexagonal shape (home base shape) that is symmetrical in plan view, and four projection optical modules PLa, PLc, PLe, and PLg arranged in the Y-axis direction are the width of the surface plate 1. The three projection optical modules PLb, PLd, and PLf arranged in the Y-axis direction are supported by the narrow portion of the surface plate 1. That is, the shape of the surface plate 1 is set according to the number of the plurality of projection optical modules arranged side by side, and the material used is within a range in which sufficient strength can be obtained to support the projection optical modules PLa to PLg. Minimized.

  Each of the projection optical modules PLa to PLg includes a lens barrel PK and a plurality of optical elements (lenses) arranged inside the lens barrel PK. A housing U containing the alignment system AL and the focus detection system AF is disposed between the −X side projection optical modules PLa, PLc, PLe, and PLg and the + X side projection optical modules PLb, PLd, and PLf. ing. The projection optical system PL, the alignment system AL, and the housing U that houses the focus detection system AF are configured to change the posture integrally with the surface plate 1. Since the surface plate 1 is kinematically supported with respect to the column 100 and is formed of the above-described material, it hardly deforms (is not distorted) even when the posture is changed.

  Each of the projection optical modules PLa to PLg is independently connected to the surface plate 1 and is separable. Thereby, it becomes possible to increase / decrease the projection optical module in units of modules, and in that case, it is possible to easily attach / remove the projection optical module to / from the surface plate 1. Further, since each of the projection optical modules PLa to PLg can be connected to and separated from the surface plate 1 independently of each other, a predetermined reference position (for example, the center position of the opening 1A) of the surface plate 1 can be obtained. Each of the projection optical modules PLa to PLg can be arbitrarily set with respect to each other.

  FIG. 4 is a schematic perspective view of the substrate stage PST. The substrate stage PST is provided on the base plate 110. The substrate stage PST is provided on the substrate holder 30 that holds the substrate P, the guide stage 35 that supports the substrate holder 30 in a movable manner while guiding the substrate holder 30 in the Y-axis direction, and the substrate stage 30 is supported in the Y-axis direction. A linear motor 36 that moves to the base plate 110, a pair of linear motors 31 and 31 that can move the substrate holder 30 together with the guide stage 35 in the X-axis direction with a predetermined stroke on the base plate 110, and the base plate 110. A pair of guide portions 32 and 32 for guiding the moving guide stage 35 (and the substrate holder 30) are provided. The substrate holder 30 holds the substrate P via a vacuum chuck. Each of the linear motors 31 is supported by a support member 33 on the base plate 110 and is provided so as to extend in the X-axis direction, and is provided corresponding to the stator 31A. And a mover 31B fixed to both ends in the direction. The linear motor 31 may be a so-called moving magnet type linear motor in which the stator 31A is constituted by a coil unit (armature unit) and the mover 31B is constituted by a magnet unit, or the stator 31A is constituted by a magnet unit and the mover 31B is constituted. A so-called moving coil type linear motor may be used. Then, the substrate holder 30 moves in the X axis direction together with the guide stage 35 by driving the mover 31B by electromagnetic interaction with the stator 31A. Each of the guide portions 32 guides the guide stage 35 and the substrate holder 30 that move in the X-axis direction, is provided so as to extend in the X-axis direction, and is fixed to the base plate 110. Guided members 34 and 34 having recesses that engage with the guide portion 32 are fixed to the lower portion of the guide stage 35. An air bearing 34A, which is a non-contact bearing, is provided between the guided members 34, 34 and the guide portions 32, 32. Move in the direction. Similarly, the linear motor 36 also has a stator 36 A provided on the guide stage 35 and a mover 36 B provided on the substrate holder 30, and the substrate holder 30 is driven by the linear motor 36 to guide the stage 35. It moves in the Y-axis direction while being guided by. Further, the guide stage 35 can be rotated and moved also in the θZ direction by adjusting the respective driving of the linear motors 31 and 31. Accordingly, the linear motors 31 and 31 enable the substrate holder 30 to move in the X axis direction and the θZ direction almost integrally with the guide stage 35. Further, the substrate stage PST also has a moving mechanism for moving the substrate holder 30 in the Z-axis direction, θX and θY directions. The posture of the substrate holder 30 can be adjusted by the linear motor and the moving mechanism. In the following description, the linear motor and the moving mechanism capable of adjusting the posture of the substrate holder 30 (substrate stage PST) are collectively referred to as “substrate stage driving device PSTD” as appropriate.

  FIG. 5 is a configuration diagram of the projection optical module PLf. Although the projection optical module PLf will be described below, the other projection optical modules PLa, PLb, PLc, PLd, PLe, and PLg have the same configuration as the projection optical module PLf. The projection optical module PLf includes a shift adjustment mechanism 40 that shifts the pattern of the mask M on the substrate P, two pairs of catadioptric optical systems 41 and 42, and the Z axis of the image plane of the projection optical module (projection optical system). An image plane adjustment mechanism 43 that adjusts the position and inclination of the direction, a field stop (not shown), and a scaling adjustment mechanism 44 that adjusts the magnification of the pattern of the mask M on the substrate P are provided. The light beam that has passed through the mask M enters the shift adjustment mechanism 40. The shift adjustment mechanism 40 includes a pair of parallel flat glass plates that can rotate in the θY and θX directions, respectively. The image of the pattern of the mask M on the substrate P shifts in the X-axis direction when one parallel plane glass plate rotates in the θY direction, and the other parallel plane glass plate rotates on the substrate P by rotating in the θX direction. The pattern image of the mask M is shifted in the Y-axis direction. The light beam that has passed through the shift adjustment mechanism 40 enters the first set of catadioptric optical system 41. The catadioptric optical system 41 forms an intermediate image of the pattern of the mask M, and includes a right-angle prism 45A, a lens 46, and a concave mirror 47. The right-angle prism 45A is rotatably provided in the θZ direction, and the image of the pattern of the mask M on the substrate P rotates in the θZ direction by rotating. That is, the right-angle prism 45A has a function as a rotation adjustment mechanism. At the intermediate image position of the pattern formed by the catadioptric optical system 41, a field stop (not shown) for setting a projection area on the substrate P is arranged. For example, the projection area on the substrate P is set in a trapezoidal shape. To do. Further, an image plane adjustment mechanism 43 is provided in the vicinity of the field stop (in the vicinity of the position where the intermediate image is formed by the catadioptric optical system 41), in other words, at a position almost conjugate to the mask M and the substrate P. Yes. The image plane adjustment mechanism 43 includes a pair of wedge-shaped optical members. When the other wedge-shaped optical member slides relative to one wedge-shaped optical member, the image plane position of the projection optical module PLf moves in the Z-axis direction, and the other wedge-shaped optical member moves to the other wedge-shaped optical member. As the optical member rotates in the θZ direction, the image plane of the projection optical module PLf is inclined. The light beam that has passed through the field stop and image plane adjustment mechanism 43 enters the second catadioptric optical system 42. Similar to the catadioptric optical system 41, the catadioptric optical system 42 includes a right-angle prism 45B, a lens 48, and a concave mirror 49 as a rotation adjusting mechanism. The light beam emitted from the catadioptric optical system 42 passes through the scaling adjustment mechanism 44 and forms an image of the pattern of the mask M on the substrate P at an erecting equal magnification. The scaling adjustment mechanism 44 adjusts the magnification (scaling) of the pattern image of the mask M, for example, by moving the lens in the Z-axis direction.

  The shift adjustment mechanism 40, the rotation adjustment mechanisms 45A and 45B, the scaling adjustment mechanism 44, and the image plane adjustment mechanism 43 constitute an image formation characteristic adjustment device that adjusts the optical characteristics (image formation characteristics) of the projection optical module PLf. . The imaging characteristic adjusting device may be a mechanism that adjusts the internal pressure by sealing between some optical elements (lenses).

  FIG. 6 is a schematic diagram showing the arrangement of the alignment system AL and the focus detection system AF housed in the housing U. The alignment system AL is an off-axis type alignment system housed in a housing U different from the projection optical system PL, and includes a plurality of mark detection systems AL1 that can detect alignment marks formed on the substrate P. AL6 is provided. The plurality of mark detection systems AL1 to AL6 are provided side by side in the Y-axis direction so as to face the substrate P. The focus detection system AF faces the substrate P, and faces a plurality of substrate side focus detection systems 50 (50a to 50g) that detect the position of the substrate P in the Z-axis direction, and the mask M. A plurality of mask side focus detection systems 52 (52a to 52d) for detecting positions in the axial direction are provided. A plurality of substrate-side focus detection systems 50 and mask-side focus detection systems 52 are also arranged side by side in the Y-axis direction.

  FIG. 7 is a diagram illustrating the relationship between the alignment system AL and the substrate-side focus detection system 50 and the alignment marks m1 to m6 formed on the substrate P. The substrate P is provided with a plurality of alignment marks m1 to m6 used for alignment processing. On the substrate P, six alignment marks m1 to m6 arranged in the Y-axis direction are formed at six positions in the X-axis direction at intervals, and a total of 36 alignment marks are formed. The mark detection systems AL1 to AL6 are provided corresponding to the alignment marks m1 to m6 arranged on the substrate P in the Y-axis direction. The mark detection systems AL1 to AL6 can detect the alignment marks m1 to m6 at the same time while facing the alignment marks m1 to m6. In the example shown in FIG. 7, nine pattern formation regions (shot regions, exposure regions) PA1 to PA9 are formed on the substrate P. Among the plurality of alignment marks m1 to m6 aligned in the Y-axis direction, alignment is performed. The marks m1 and m2 are disposed in the pattern formation regions PA3, PA6, and PA9, the alignment marks m3 and m4 are disposed in the pattern formation regions PA2, PA5, and PA8, and the alignment marks m5 and m6 are disposed in the pattern formation regions PA1, PA4, and PA7. The intervals between the alignment marks m1 to m6 are set in advance so as to be arranged.

  Among the plurality of substrate-side focus detection systems 50a to 50g, the focus detection systems 50a, 50b, 50d, 50f, and 50g are arranged at predetermined intervals in the Y-axis direction, and the focus detection systems 50c and 50e are arranged on the Y-axis. They are arranged side by side at a predetermined interval in the direction. These two rows of focus detection systems 50a, 50b, 50d, 50f, and 50g and the focus detection systems 50c and 50e are arranged so as to sandwich the alignment system AL (AL1 to AL6). The detection results of the substrate-side focus detection systems 50a to 50g are output to the control device CONT, and the control device CONT obtains the position of the substrate P in the Z-axis direction based on the detection results of the substrate-side focus detection systems 50a to 50g. . Further, since the substrate-side focus detection systems 50a to 50g are two-dimensionally arranged in the X-axis and Y-axis directions, the control device CONT is based on the detection results of the plurality of substrate-side focus detection systems 50a to 50g. The posture of the substrate P in the θX direction and the θY direction can be obtained. The control device CONT drives the substrate stage drive device PSTD based on the obtained position in the Z-axis direction and the posture in the θX and θY directions, adjusts the position of the substrate P in the Z-axis direction (focus adjustment), and θX. , The posture adjustment (leveling adjustment) in the θY axis direction is performed. Similarly, the control device CONT can perform focus adjustment and leveling adjustment of the mask M based on the detection results of the plurality of mask side focus detection systems 52a to 52d.

  FIG. 8 is a schematic configuration diagram showing the substrate side focus detection system 50a. The other substrate side focus detection systems 50b to 50g and the mask side focus detection systems 52a to 52d have the same configuration as the focus detection system 50a. As shown in FIG. 8, the focus detection system 50 a passes through a light source 53 composed of an LED that emits detection light, a light transmission lens system 54 that receives detection light emitted from the light source 53, and a light transmission lens system 54. The reflected light from the mirror 55 that guides the detected light to the detection target substrate P (or mask M) from the tilt direction and the detection light irradiated through the mirror 55 on the substrate P (or mask M) is a light receiving lens system. Mirror 56 guided to 57 and an image sensor (CCD) 58 for receiving the light passing through the light receiving lens system 57 are provided. The light transmission lens system 54 shapes the detection light into a slit shape, for example, and then irradiates the substrate P. Here, when the position in the Z-axis direction of the substrate P to be detected is displaced by ΔZ, the slit-shaped detection light emitted from the tilt direction displaces the imaging position in the X-axis direction of the image sensor 58 by ΔX. The imaging signal of the imaging device 58 is output to the control device CONT, and the control device CONT obtains the displacement amount ΔZ of the substrate P in the Z-axis direction based on the displacement amount ΔX of the imaging position with respect to the reference position. If an angle formed by a line perpendicular to the substrate P and a light ray incident from the focus detection system is β, 2 × ΔZ × sin β is a lateral shift with respect to the imaging element 58 of the focus detection system, and thus the optical system of the focus detection system When the magnification of N is N, if the shift amount on the image sensor 58 is γ, γ = 2 × ΔZ × sin β × N.

  In the focus detection system 50a (50b to 50g, 52a to 52d), the light source 53, the light transmission lens system 54, and the mirror 55 constitute a light transmission system of the focus detection system, and the mirror 56, the light receiving lens system 57, The image sensor 58 constitutes a light receiving system of a focus detection system. The light source 53 may be provided in each of the plurality of focus detection systems 50a to 50g (52a to 52d), or the light emitted from one light source 53 is branched by a plurality of light guides (optical fibers). A configuration may be adopted in which a plurality of branched lights are supplied to each of a plurality of focus detection systems. Further, it is desirable that the detection light is also non-photosensitive to the photoresist on the substrate P, and a filter that cuts light of a specific wavelength out of the light emitted from the light source 53 is provided between the light source 53 and the substrate P. It is good also as a structure provided on an optical path in between. The image sensor 58 may be configured by a cylindrical lens and a one-dimensional line sensor arranged so as to compress the non-measurement direction of the slit light on the substrate P. Further, the light from the halogen lamp may be converted into a non-photosensitive wavelength by a filter and guided by a fiber in consideration of the coherence of the photoresist.

  FIG. 9 is a schematic configuration diagram of the mark detection system AL1. The other mark detection systems AL2 to AL6 have the same configuration as the mark detection system AL1. As shown in FIG. 9, the mark detection system AL1 includes an alignment light source 61 that includes a halogen lamp that emits alignment detection light, and a light guide 62 that includes an optical fiber that guides the detection light emitted from the light source 61 to the relay lens 63. And the half mirror 64 provided on the downstream side of the optical path of the relay lens 63, and the detection light that is provided between the half mirror 64 and the substrate P (alignment marks m1 to m6) that is a detection target and has passed through the half mirror 64. The objective lens 65 for irradiating the substrate P on the substrate P, the deflection mirror 66 for guiding the reflected light of the irradiated detection light on the substrate P (alignment mark) through the half mirror 64, and the reflected light from the deflection mirror 66 The beam splitter 67 that branches and the low magnification at which one of the two beams branched by the beam splitter 67 enters. And Raimento light receiving system 68, the other light beam and a high magnification the alignment light receiving system 69 which enters. The low-magnification alignment light receiving system 68 includes a low-magnification lens system 68A and a low-magnification imaging device (CCD) 68B, and can measure a wide area on the substrate P with a predetermined accuracy. The high-magnification alignment light receiving system 69 includes a high-magnification lens system 69A and a high-magnification imaging device (CCD) 69B, and can measure a narrow region of the substrate P with high accuracy. The low magnification alignment light receiving system 68A and the high magnification alignment light receiving system 68B are arranged coaxially. The reflected light of the irradiated alignment detection light on the substrate P (alignment marks m1 to m6) is received by the low magnification alignment light receiving system 68 and the high magnification alignment light receiving system 69, respectively.

  The low-magnification alignment light receiving system 68 detects the position information of the alignment mark m1 (m2 to m6) with rough accuracy based on light information from a wide area of the substrate P irradiated with the alignment detection light. I do. On the other hand, the high-magnification alignment light receiving system 69 detects fine positional information of the alignment mark m1 (m2 to m6) with high accuracy based on optical information from a narrow region of the substrate P irradiated with the alignment detection light. Process. Each of the low-magnification alignment light-receiving system 68 and the high-magnification alignment light-receiving system 69 outputs a light-receiving signal to the control device CONT, and the control device CONT performs image processing based on the light-receiving signals of the alignment light-receiving systems 68 and 69, and performs mark processing. Ask for information. Here, the control device CONT refers to the search alignment processing result by the low magnification alignment light receiving system 68 and performs the fine alignment processing by the high magnification alignment light receiving system 69.

  When the mark position information is obtained by the mark detection system AL1 (AL2 to AL6), the mark position is obtained from the edge information of the mark by image processing. A pattern matching method may be used as a method for obtaining the mark position. That is, the control device CONT is connected to a storage device (not shown) that stores the template image, and obtains the coordinates of the pattern (position in the moving coordinate system of the stage) that matches the template by pattern matching. The control unit CONT uses this coordinate value to determine the amount of deviation that has occurred at the time of joint exposure or overlay exposure, and gives the correction parameter to the substrate stage drive unit PSTD at the next and subsequent exposures, thereby aligning accuracy. To increase.

  In the mark detection system AL1 (AL2 to AL6), the light source 61, the light guide 62, and the relay lens system 63 constitute a light transmission system of an alignment system, which includes a beam splitter 67, a low magnification alignment light receiving system 68, and a high The magnification alignment light receiving system 69 constitutes a light receiving system of the alignment system. The light source 61 may be provided in each of the plurality of alignment systems AL1 to AL6. The light emitted from one light source 61 is branched by a plurality of ride guides (optical fibers) 62, and the plurality of branched lights. May be supplied to each of the mark detection systems AL1 to AL6. The alignment detection light is preferably non-photosensitive to the photoresist on the substrate P, and a filter that cuts light of a specific wavelength out of the light emitted from the light source 61 formed of a halogen lamp is used as a light source. It is good also as a structure provided on the optical path between 61 and the board | substrate P. FIG.

  FIG. 10 is a schematic configuration diagram of a laser interference system SYS that measures the position of the mask holder 20 (mask stage MST). In FIG. 10, X moving mirrors 70 and 71 made of corner cubes are provided at positions on the upper surface of the mask holder 20 that are aligned in the Y-axis direction with the opening 20 </ b> A interposed therebetween. A Y movable mirror 72 extending in the X-axis direction is provided on the −Y side edge of the lower surface of the mask holder 20. Laser interferometers 6 and 7 are provided side by side in the Y-axis direction at positions facing the X moving mirrors 70 and 71, respectively. A laser interferometer 11 is provided at a position facing the Y moving mirror 72. The laser interferometers 6, 7, and 11 are provided on the upper surface of the upper plate portion 100A of the column 100 (see FIG. 1).

  Reflecting mirrors (reference mirrors) 73 and 74 are attached to the surface plate 1 side by side in the Y-axis direction. The reflecting mirror 73 is provided at a position facing the laser interferometer 8 (8A, 8B), and the reflecting mirror 74 is provided at a position facing the laser interferometer 9 (9A, 9B). A reflecting mirror (reference mirror) 75 is provided on the upper side of the −Y side surface of the housing U that holds the alignment system (mark detection system) AL. A laser interferometer 12 A (12) is provided at a position facing the reflecting mirror 75. The laser interferometer 12A is provided on the upper plate portion 100A of the column 100 (see FIG. 1).

  Of the two laser interferometers 6 and 7 arranged in the Y-axis direction, the + Y-side laser interferometer 6 irradiates the X moving mirror 70 with a measurement beam (measurement light) 70A, and the −Y-side laser interferometer. 7 irradiates the X moving mirror 71 with a length measuring beam 71A. Reflected light from the X moving mirrors 70 and 71 based on the irradiated measurement beams 70A and 71A is received by the light receiving portions of the laser interferometers 6 and 7, respectively. The laser interferometers 6 and 7 measure the positions (coordinates) of the X movable mirrors 70 and 71 with reference to the column 100 based on the optical path length measurement results of the length measuring beams 70A and 71A. Here, reference mirrors corresponding to the laser interferometers 6 and 7 are provided at predetermined positions of the column 100. The measurement results of the laser interferometers 6 and 7 are output to the control device CONT. Since the laser interferometers 6 and 7 and their reference mirrors are supported by the column 100, and the X moving mirrors 70 and 71 are supported by the mask holder 20 (mask stage MST), the control device CONT includes the laser interferometers 6 and 7. Based on the measurement result, the position of the mask holder 20 with respect to the column 100 in the X-axis direction can be obtained.

  Furthermore, the control device CONT can determine the position of the mask holder 20 in the θZ direction with respect to the column 100 based on the measurement results of the laser interferometers 6 and 7 arranged in the Y-axis direction.

  The laser interferometers 8A and 8B irradiate the reflecting mirror 73 with two length measuring beams 73A and 73B arranged in the Z-axis direction, respectively. The measurement results of the laser interferometers 8A and 8B are output to the control device CONT. Since the reference mirrors corresponding to the laser interferometers 8A and 8B are provided at predetermined positions of the column 100 and the reflecting mirror 73 is supported by the surface plate 1, the control device CONT measures each of the laser interferometers 8A and 8B. Based on the result, the orientation of the surface plate 1 in the θY direction with respect to the column 100 can be obtained.

  The laser interferometers 9A and 9B irradiate two length measuring beams 74A and 74B arranged in the Z-axis direction on the reflecting mirror 74, respectively. The measurement results of the laser interferometers 9A and 9B are output to the control device CONT. Since the reference mirrors corresponding to the laser interferometers 9A and 9B are provided at predetermined positions of the column 100 and the reflecting mirror 74 is supported by the surface plate 1, the control device CONT measures each of the laser interferometers 9A and 9B. Based on the result, the orientation of the surface plate 1 in the θY direction with respect to the column 100 can be obtained.

  Further, the control device CONT can determine the position of the surface plate 1 in the θZ direction with respect to the column 100 based on the measurement results of the laser interferometers 8 and 9 arranged in the Y-axis direction. Further, the control device CONT can obtain the position of the surface plate 1 in the X-axis direction with respect to the column 100 based on the measurement results of the laser interferometers 8 and 9.

  In the present embodiment, the attachment positions of the laser interferometers 8 and 9 and the reflecting mirrors 73 and 74 are set so that the optical path lengths of the length measuring beams 73A, 73B, 74A, and 74B are substantially the same. In addition, the four measuring beams 73A, 73B, 74A, and 74B can more accurately determine the swing (posture information) of the surface plate 1 caused by the distortion of the column 100.

  The laser interferometer 11 irradiates the Y moving mirror 72 with a length measuring beam 72A. Reflected light from the Y moving mirror 72 based on the irradiated measurement beam is received by the light receiving unit of the laser interferometer 11. The laser interferometer 11 measures the position (coordinates) of the Y movable mirror 72 with reference to the column 100 based on the optical path length measurement result of the length measuring beam 72A. The measurement result of the laser interferometer 11 is output to the control device CONT. Since the laser interferometer 11 and the corresponding reference mirror are provided at predetermined positions of the column 100 and the Y moving mirror 72 is provided on the mask holder 20 (mask stage MST), the control device CONT measures the laser interferometer 11. Based on the result, the position of the mask holder 20 with respect to the column 100 in the Y-axis direction is obtained.

  FIG. 11 is a schematic configuration diagram of a laser interference system SYS that measures the position of the substrate holder 30 (substrate stage PST). In FIG. 11, an X moving mirror 82 extending in the Y axis direction is provided at the −X side edge of the substrate holder 30, and a Y moving mirror 83 extending in the X axis direction at the −Y side edge of the substrate holder 30. Is provided. Three laser interferometers 16, 17, and 18 are provided side by side in the Y-axis direction at positions facing the X moving mirror 82. Further, three laser interferometers 13, 14, 15 are provided side by side in the X-axis direction at a position facing the Y moving mirror 83. The laser interferometers 16, 17, and 18 are provided on the base plate 110 and are arranged outside the column 100 (see FIG. 1). On the other hand, the laser interferometers 13, 14, and 15 are provided so as to hang down from the upper plate portion 100A of the column 100 (see FIG. 1). Further, another laser interferometer 12 (12A, 12B) is provided between the laser interferometer 11 and the laser interferometer 14.

  Reflector mirrors (reference mirrors) 77, 78, and 79 are provided on the −X side surface of the barrel PK of the projection optical module, and reference mirrors 80 and 81 are provided on the −Y side surface. A reflecting mirror (reference mirror) 76 is provided below the −X side surface of the housing U that holds the alignment system (mark detection system) AL, and the housing U is arranged on the −Y side surface in the Z-axis direction. The configuration includes two reflecting mirrors 75 and 76. The reference mirror 77 is provided at a position facing the laser interferometer 16 on the + Y side among the three laser interferometers 16, 17, 18 arranged in the Y-axis direction on the base plate 110, and the reflecting mirror 78 is disposed at the center of the laser interferometer 16. The reference mirror 79 is provided at a position facing the laser interferometer 18 on the -Y side. The reference mirror 80 is provided at a position facing the laser interferometer 13 on the −X side among the three laser interferometers 13, 14, 15 arranged in the X-axis direction in the upper plate portion 100 </ b> A of the column 100. Is provided at a position facing the central laser interferometer 12 (and 14), and the reference mirror 81 is provided at a position facing the laser interferometer 15 on the + X side.

  The laser interferometer 16 irradiates the X moving mirror 82 with the measurement beam 82A and irradiates the reference mirror 77 with the reference beam 77A. The laser interferometer 17 irradiates the reflector 78 with beams 78A and 78B. Here, the beams 78A and 78B are applied to the reference mirror 78 so as to be aligned in the Z-axis direction. The laser interferometer 18 irradiates the X moving mirror 82 with the measurement beam 82B and irradiates the reference mirror 79 with the reference beam 79A. Reflected light from the X moving mirror 82 and the reference mirrors 77 and 79 based on the irradiated measurement beam and reference beam is received by the light receiving portions of the laser interferometers 16 and 18, and the laser interferometers 16 and 18 interfere with these lights. Then, the amount of change in the optical path length of the measuring beam with reference to the optical path length of the reference beam, and thus the position (coordinates) of the X moving mirror 82 with reference to the reference mirrors 77 and 79 are measured. The measurement results of the laser interferometers 16 and 18 are output to the control device CONT. Here, since the reference mirrors 77 and 79 are supported by the lens barrel PK (and consequently the surface plate 1) of the projection optical system PL, and the X moving mirror 82 is supported by the substrate holder 30 (substrate stage PST), the control device CONT. Determines the position of the substrate holder 30 with respect to the surface plate 1 in the X-axis direction based on the measurement results of the laser interferometers 16 and 18. Further, by providing reference mirrors corresponding to the laser interferometers 16 and 18 at predetermined positions of the base plate 110, the control device CONT measures the positions of the surface plate 1 in the X-axis direction and the θZ direction with respect to the base plate 110. Can do.

  Furthermore, the control device CONT can obtain the position of the substrate holder 30 in the θZ direction with respect to the surface plate 1 based on the measurement results of the laser interferometers 16 and 18 arranged in the Y-axis direction.

  The laser interferometer 17 irradiates the reflecting mirror 78 with two beams 78A and 78B arranged in the Z-axis direction. The measurement result of the laser interferometer 17 is output to the control device CONT, which controls θY of the projection optical modules PLa to PLg supported on the surface plate 1 based on the optical path length measurement results of the beams 78A and 78B. The orientation in the direction, and thus the orientation of the surface plate 1 in the θY direction can be obtained. Further, by providing a reference mirror corresponding to the laser interferometer 17 at a predetermined position of the base plate 110, the control device CONT can measure the position of the surface plate 1 in the X-axis direction with respect to the base plate 110. Furthermore, by providing a plurality of laser interferometers 17 arranged in the Y-axis direction, the control device CONT can obtain the position of the surface plate 1 in the θZ direction with respect to the base plate 110.

  The laser interferometer 13 irradiates the Y moving mirror 83 with the length measurement beam 83A and irradiates the reference mirror 80 with the reference beam 80A. The laser interferometer 14 irradiates the Y moving mirror 83 with the length measuring beam 83B and irradiates the reflecting mirror 76 with the reference beam 76B. The laser interferometer 15 can irradiate the Y moving mirror 83 with the length measuring beam 83C and irradiate the reference mirror 81 with the reference beam 81A. Here, the three laser interferometers 13, 14, 15 are provided side by side in the X-axis direction, so that when the position of the substrate holder 30 in the Y-axis direction is measured, the X of the substrate holder 30 that scans and moves is measured. The position can be detected by switching the laser interferometer to be used according to the position in the axial direction. In FIG. 11, the length measuring beams 83A and 83B emitted from the laser interferometers 13 and 14 are irradiated to the Y moving mirror 83, and the length measuring beam 83C emitted from the laser interferometer 15 is irradiated to the Y moving mirror 83. The absence is shown. Reflected light from the Y moving mirror 83 and the reference mirrors 80, 76, 81 based on the irradiated measurement beam and reference beam is received by the light receiving portions of the laser interferometers 13, 14, 15, and the laser interferometers 13, 14, 15 interferes with these lights, and indicates the amount of change in the optical path length of the measuring beam based on the optical path length of the reference beam, and the position (coordinates) of the Y movable mirror 83 based on the reference mirrors 80, 76, 81. measure. The measurement results of the laser interferometers 13, 14, and 15 are output to the control device CONT. Here, since the reference mirrors 80, 76, 81 are supported by the lens barrel PK or the housing U (and consequently the surface plate 1), and the Y moving mirror 83 is supported by the substrate holder 30, the control device CONT uses the laser interferometer 13. , 14 and 15, the position of the substrate holder 30 with respect to the surface plate 1 in the Y-axis direction is obtained.

  Further, the control device CONT can obtain the position of the substrate holder 30 in the θZ direction with respect to the surface plate 1 based on the measurement results of the laser interferometers 13, 14, 15 arranged in the X-axis direction.

  Laser interferometers 12A and 12B provided on the −Y side of housing U irradiate beams 75B and 76A to reflecting mirrors 75 and 76 arranged in the Z-axis direction, respectively. At this time, the laser interferometers 12 </ b> A and 12 </ b> B and the corresponding reference mirror are provided at predetermined positions of the column 100. The measurement results of the laser interferometers 12A and 12B are output to the control device CONT. The control device CONT is a housing supported on the surface plate 1 based on the optical path length measurement results of the beams 75B and 76A arranged in the Z-axis direction. The posture of U (alignment system AL) in the θX direction, that is, the posture of the surface plate 1 with respect to the column 100 in the θX direction can be obtained.

  Further, the control device CONT can determine the position of the surface plate 1 in the Y-axis direction with respect to the column 100 based on the optical path length measurement results of the beams 75A and 76A emitted from the laser interferometers 12A and 12B.

  In the present embodiment, the attachment positions of the laser interferometer 12 and the reference mirrors 75 and 76 are set so that the optical path lengths of the measuring beams 75A and 76A are substantially the same.

  By the way, in this embodiment, movable mirrors 84 and 85 made of, for example, corner cubes are attached to the movable elements 31B and 31B (or the vicinity thereof) of the linear motors 31 and 31 that move the substrate holder 30 in the X-axis direction, respectively. ing. Laser interferometers 19A and 19B are provided at positions facing the movable mirrors 84 and 85 on the base plate 110, respectively. The laser interferometers 19A and 19B irradiate the movable mirrors 84 and 85 with the measurement beams 84A and 85A, and based on the reflected light, the positions of the movable mirrors 84 and 85 in the X-axis direction, and hence the position of the movable element 31B. It can be measured. The control device CONT controls the driving of the linear motor 31 (substrate stage driving device PSTD) based on the measurement results of the laser interferometers 19A and 19B. By controlling the driving of the linear motor 31 based on the measurement results of the laser interferometers 19A and 19B, for example, compared to the case of controlling the driving of the linear motor 31 based on the measurement results of the laser interferometers 16 and 18. The movement of the stage can be controlled with high accuracy. That is, since the linear motor 31 and the movable mirror 82 of the substrate holder 30 are separated in the Z-axis direction, for example, when the substrate holder 30 moves in the X-axis direction while pitching (moving slightly in the θY direction), the pitching is performed. When the control device CONT drives the linear motor 31 based on the measurement result of the laser interferometer 16, the substrate holder 30 is moved to, for example, the substrate holder 30. There is a possibility that it cannot move well, such as being unable to move at high speed. That is, in this case, since the moving mirror 82 as the measurement position is separated from the linear motor 31 as the driving unit, an Abbe error occurs and affects the stage movement. Accordingly, the movable mirrors 84 and 85 are attached in the vicinity of the movable element 31B of the linear motor 31 that is the driving unit, and the movable mirrors 84 and 85 are irradiated with the measuring beams 84A and 85A from the laser interferometers 19A and 19B. By controlling the driving of the linear motor 31 based on the obtained position measurement result, the substrate holder 30 can be driven in a state where the influence of mechanical vibration such as pitching is suppressed. Further, by performing stage drive control based on the measurement results of the laser interferometers 19A and 19B, it is possible to improve controllability when the mask holder 20 is moved following the substrate holder 30 (synchronized movement), for example. In addition, as an attachment position of the movable mirrors 84 and 85, the longitudinal direction (X-axis direction) substantially center part of the needle | mover 31B is preferable.

  Similarly, although not shown, a movable mirror made of, for example, a corner cube is also attached to a substantially central portion in the longitudinal direction of the mover 36B (or its vicinity) of the linear motor 36 that moves the substrate holder 30 in the Y-axis direction. On the base plate 110, a laser interferometer (not shown) that irradiates a measurement beam is provided at a position facing the movable mirror. The drive control of the linear motor 36 is also performed based on the measurement result of the laser interferometer. Instead of providing the laser interferometer at a position facing the movable mirror attached to the mover 36B, the length measurement beams from the laser interferometers 19A and 19B provided on the base plate 110 are attached to the guide portion 32, for example. The movable mirror may be irradiated with a bent mirror. Further, for example, a linear encoder or the like may be used for position measurement of the movers 31B and 36B without using the laser interferometer. Thus, the position measurement of the substrate holder 20 with respect to the base plate 110 in the X-axis direction, the Y-axis direction, and the θZ direction can be performed.

  The stage position measurement results of the laser interferometers 16, 18, 13, 14, 15 and the like obtained by irradiating the movable mirrors 82 and 83 with the measurement beam are used for monitoring the stage position, for example. Alternatively, the stage position measurement result can be used for fine adjustment of the stage drive. That is, when the controller CONT drives the linear motor 31 based on the stage position measurement result using the movable mirror 84 (85) provided in the vicinity of the linear motor 31 (substrate stage driving device PSTD), the controller CONT The driving of the linear motor 31 can be corrected based on the stage position measurement information using the movable mirror 82 provided in the above. Alternatively, in this case, the control device CONT uses the movable mirror 84 (85) provided near the linear motor 31 based on the stage position measurement information using the movable mirror 82 provided on the substrate holder 30. The measurement result may be corrected, and the linear motor 31 may be driven based on the corrected stage position information.

FIG. 12 is a schematic diagram showing a state in which the projection optical system PL (the surface plate 1) is changed in posture (inclined). As shown in FIG. 12, when the projection optical system PL changes its posture in the θY direction, the position of the pattern image on the substrate P of the mask M via the projection optical system PL changes. For example, when the distance between the mask M and the substrate P is L and the inclination angle of the projection optical system PL is φ, the positional deviation amount Δ _P = L × φ of the pattern image on the substrate P. The control device CONT obtains a correction amount for correcting the positional deviation of the pattern image on the substrate P accompanying the inclination of the projection optical system PL, and determines the positions of the mask holder 20 and the substrate holder 30 based on the obtained correction amount. to correct. Therefore, first, the control device CONT obtains the tilt angle φ of the projection optical system PL by the laser interferometer 17. Thereby, position information of the projection optical system PL with respect to the base plate 110, in other words, position information of the base plate 110 with respect to the projection optical system PL is obtained. Then, the control device CONT uses the laser interferometers (third measurement devices) 16 and 18 to determine the position information of the substrate holder 30 relative to the base plate 110 and the position information of the base plate 110 based on the projection optical system PL ( Based on the tilt position information of the projection optical system PL with respect to the base plate 110, the position of the substrate holder 30 with respect to the projection optical system PL (position of the pattern image of the projection optical system PL) at this time is obtained. Then, the control device CONT obtains a correction amount for correcting the positional deviation amount of the pattern image, and adjusts the position of the substrate holder 30 based on the obtained correction amount. Here, the position adjustment of the substrate holder 30 may be configured to correct the driving amount of the substrate stage driving device PSTD, or may be configured to correct the measurement results of the laser interferometers (third measuring devices) 16 and 18.

  Similarly, the control device CONT obtains the position (posture change amount, inclination angle) of the projection optical system PL with respect to the column 100 based on the measurement results of the laser interferometers 8 and 9, and takes the measurement results of the laser interferometer 17 into account. Then, the position measurement result of the mask holder 20 with respect to the column 100 by the laser interferometers (third measurement devices) 6 and 7 is corrected. The position adjustment of the mask holder 20 may be configured to correct the driving amount of the mask stage driving device MSTD.

  As described above, in this embodiment, using each laser interferometer (measuring device), the position of the mask holder 20 with respect to the column 100, the position of the surface plate 1 with respect to the column 100, the position of the substrate holder 30 with respect to the surface plate 1, Further, the posture of the surface plate 1 with respect to the base plate 110 can be obtained. Since the projection optical system PL, the housing U housing the alignment system AL, and the focus detection system AF are supported by the surface plate 1 and integrally change their posture, the control unit CONT is based on the measurement results of these laser interferometers. Thus, the relative position information of the projection optical system PL with respect to the column 100 and the relative position information of the projection optical system PL with respect to the base plate 110 can be obtained. Then, the control device CONT can obtain the reference position information of the projection optical system PL based on the obtained relative position information. In other words, the position information of the column 100 with respect to the reference position of the projection optical system PL and the position information of the base plate 110 with respect to the projection optical system PL can be obtained. By doing so, even when the laser interferometer is arranged on each of different supports (support structure and base structure), the mask holder 20 and the substrate holder 30 for the projection optical system PL on the basis of the projection optical system PL. Position information can be obtained.

  Position information regarding the X axis direction of the mask holder 20 with respect to the column 100 is measured by the laser interferometers 6 and 7, and position information regarding the X axis direction of the projection optical system PL with respect to the column 100 is measured with the laser interferometer (first measuring device) 8, 9, the control device CONT can obtain relative position information regarding the X-axis direction of the mask holder 20 with respect to the projection optical system PL based on these measurement results. Similarly, the position information regarding the Y-axis direction of the mask holder 20 with respect to the column 100 is measured by the laser interferometer 11, and the position regarding the Y-axis direction (first direction) of the projection optical system PL with respect to the column 100 is measured with a laser interferometer. (1 measuring device) 12, the control device CONT can obtain relative position information regarding the Y-axis direction of the mask holder 20 with respect to the projection optical system PL based on these measurement results.

  Further, the position of the substrate holder 30 with respect to the projection optical system PL in the X-axis direction is measured by the laser interferometers 16 and 18 provided on the base plate 110, and the laser interferometers 13, 14 and 15 provided on the column 100 are used. Then, position information regarding the Y-axis direction of the substrate holder 30 with respect to the projection optical system PL is measured. In addition, position information regarding the θY direction and the X-axis direction of the projection optical system PL with respect to the base plate 110 is measured by a laser interferometer (second measurement device) 17 provided on the base plate 110.

  Further, for example, the attitude of the projection optical system PL with respect to the base plate 110 is measured by the laser interferometer 17, and the attitude of the projection optical system PL with respect to the column 100 is measured by the laser interferometers 8, 9 and the like. Based on the result, the relative position information of the column 100 with respect to the base plate 110 can be obtained. Then, the position of the pattern image projected onto the substrate holder 30 (substrate P) with respect to the base plate 110 can be obtained, and the position information of the mask holder 20 with respect to the base plate 110 can be obtained.

  Then, the control device CONT can determine the attitude of the surface plate 1 that supports the projection optical system PL and the housing U housing the alignment system AL and the focus detection system AF by the laser interferometer. The reference position information of the alignment system AL and the focus detection system AF including the projection optical system PL supported by the surface plate 1 can be obtained on the basis of the posture.

  Before performing the exposure process, the control device CONT uses the alignment system AL to detect the alignment marks m1 to m6 formed on the substrate P, and performs an alignment process for aligning the substrate P at a predetermined position. Also in this case, the detection result of the alignment system AL can be corrected based on the reference position information of the surface plate 1 (alignment system AL), and the alignment process can be performed based on the corrected result. By doing so, the alignment accuracy can be improved.

  During exposure, the column 100 may be distorted and deformed by the movement of the mask holder 20 and the substrate holder 30. However, since the projection optical modules PLa to PLg are supported by the single platen 1, the influence of the deformation of the column 100 on the projection optical modules PLa to PLg is affected by the platen 1 supported kinematically by the column 100. Blocked. Further, since each of the projection optical modules PLa to PLg is supported by one surface plate 1, the relative position of each other is not changed. Since the surface plate 1 is kinematically supported by the support portion 2 with respect to the column 100, the kinematic support structure absorbs this deformation even if the column 100 or the surface plate 1 itself is thermally deformed. The influence on the imaging characteristics of the projection optical system PL can be suppressed.

  In the above embodiment, the laser interferometers (second measuring devices) 16, 17, and 18 are provided on the base plate 110, but may be a floor surface (support surface) 111 that supports the base plate 110. Here, the support surface includes a predetermined structure separated (independent) from the column 100.

  In the present embodiment, the tilt in the θY direction of the projection optical system PL with respect to the base plate 110 is measured using the laser interferometer 17, but the tilt in the θX direction is not measured. This is because the scanning direction of the stage is the X-axis direction, and the direction in which the projection optical system PL rotates (posture change) due to this stage movement or the like is mainly the θY direction. Accordingly, for example, if the exposure apparatus EX (stage movement stroke) is expanded in the Y-axis direction and the projection optical system PL is also rotated in the θX direction, the base plate 110 is placed on the base plate 110 (or the floor surface 111). A laser interferometer that measures the change in the orientation of the projection optical system PL in the θX direction can be provided. Alternatively, a configuration in which the laser interferometer that measures the attitude change in the θY direction of the projection optical system PL is omitted and only the laser interferometer that measures the attitude change in the θX direction may be provided.

  That is, the direction measured by the laser interferometer (first measuring device) provided in the column 100 is the X-axis direction parallel to the synchronous movement direction (scanning direction) between the mask M and the substrate P and the Y-axis orthogonal thereto. Any of the directions may be used, and accordingly, the direction measured by the laser interferometer (second measuring device) provided on the base plate 110 may be either the X-axis direction or the Y-axis direction.

  In this embodiment, in the laser interferometer that irradiates the movable mirrors 70, 71, 72 and the reflecting mirrors 73, 74, 75, 76 of the mask holder 20, a corresponding reference mirror is provided in the column 100. Based on the measurement results of these laser interferometers, the control device CONT obtains the position information of the mask holder 20 relative to the column 100 and the position information of the surface plate 1 respectively, and based on these position information, the surface plate 1 (projection optical system PL) and the relative position of the mask holder 20 are obtained. By doing so, controllability (responsiveness) to the mask holder 20 can be enhanced. That is, for example, a light beam emitted from a light source of a laser interferometer is split into a length measuring beam and a reference beam by a beam splitter, the length measuring beam is irradiated onto a moving mirror on the mask holder 20, and the reference beam is placed on the surface plate 1. However, since the vibration acting on the reference mirrors 73 and 74 provided on the surface plate 1 has many high frequency components, the reference irradiated to the reference mirrors 73 and 74 is considered. If drive control of the mask stage MST (mask holder 20) is to be performed based on stage position measurement based on the light reception result of the beam, the control value may also include a high-frequency component, making control difficult. Therefore, in the present embodiment, the movable mirrors 70 and 71 on the mask holder 20 and the reference mirrors 73 and 74 on the surface plate 1 are respectively irradiated with beams, and the reflected light of the beams irradiated to the reference mirrors 73 and 74 is reflected. Is received by the laser interferometers 8 and 9, and the received light signal is corrected by filtering so as to extract only the low frequency component, and the position information of the stage is obtained based on the corrected received light signal. By controlling the drive of the stage based on the result, the stage drive control can be performed in a state where the high frequency component of the vibration acting on the surface plate 1 is removed, and high responsiveness (controllability) can be obtained.

  In this embodiment, the laser interferometers 15 and 18 provided on the base plate 110 measure the position information of the substrate holder 30, but may be configured to measure the position of the mask holder 20.

  When assembling the exposure apparatus EX having the above-described configuration, the optical characteristics of the projection optical modules PLa to PLg are adjusted by the imaging characteristic adjustment apparatus before the projection optical modules PLa to PLg are attached to the surface plate 1. Adjusted. When the adjustment of the optical characteristics of the projection optical modules PLa to PLg is completed, each of the projection optical modules PLa to PLg is attached to the surface plate 1 while being positioned with respect to the reference position of the surface plate 1.

  Hereinafter, an embodiment of a laser interferometer constituting a part of the measuring apparatus according to the present invention will be described. FIG. 13 is a schematic configuration diagram of a laser interference system SYS including the above interferometers (6 to 9, 11 to 19). The laser interference system SYS is disposed at a predetermined position on the optical path between the light source 120 and a light beam branching unit 121 including a half mirror that branches the light beam emitted from the light source 120 and the interferometer. And a beam expander (enlarging means) 122 that expands the luminous flux. The light source 120 is composed of a Zeeman laser device that can emit light beams having two different frequencies. The light beam emitted from the light source 120 is further branched into a plurality of light beams corresponding to a plurality of interferometers (measurement axes) by a plurality of light beam branching sections 121, and each interference is made via a reflection mirror 123 and the like arranged at a predetermined position. Distributed to the total. In the present embodiment, one light source 120 is provided, and a light beam emitted from the light source 120 is branched to each of a plurality of interferometers using a light beam branching unit 121. Thereby, apparatus cost can be suppressed compared with the structure which provides a light source regarding each of several interferometer. Further, the influence on exposure accuracy can be reduced by reducing the number of light sources 120 serving as heat sources.

  FIG. 14 is a schematic configuration diagram of the interferometer 13. Other interferometers have the same configuration as the interferometer 13 shown in FIG. A light beam emitted from the light source 120 and passed through the beam expander 122, the light beam branching unit 121, and the reflection mirror 123 enters the interferometer 13. The interferometer 13 includes a polarizing beam splitter (dividing unit) 124 that divides a light beam incident through the reflecting mirror 123 into a length measuring beam 83A and a reference beam 80A, a polarizing beam splitter 124, and a movable mirror (measuring light reflecting unit). ) 83 and a λ / 4 plate 125 (125A, 125B) through which the measuring beam 83A from the polarizing beam splitter 124 passes, and the polarizing beam splitter 124 and the reference mirror (reference light reflecting portion) 80 A λ / 4 plate 126 (126A, 126B) that is disposed between and passing through the reference beam 80A from the polarization beam splitter 124 via the reflection mirror 127, and is measured by the movable mirror 83 and reflected by the polarization beam splitter 124. Each of the beam 83A and the reference beam 80A reflected by the reference mirror 80 and passing through the polarization beam splitter 124 is incident. A corner cube 128, a light receiving unit 130 that receives the combined light (interference light) of the reflected light of the length measuring beam 83A and the reflected light of the reference beam 80A combined by the polarizing beam splitter (combining unit) 124, and a polarizing beam splitter 124 and a light receiving unit 130, and a limiting unit (restricting unit) 129 that combines an optical element such as a diaphragm and a pickup lens that limits a light beam incident on the light receiving unit 130. The beam expander 122 is disposed between the light source 120 and the polarization beam splitter 124.

  Here, a plurality of light receiving units 130 are provided corresponding to each of the plurality of interferometers (measurement axes) 6 to 9 and 11 to 19, and the sensitivity characteristics with respect to the light beams of the plurality of light receiving units 130 are different from each other. Yes.

  A light beam incident on the polarization beam splitter 124 from the light source 120 via the beam expander 122 is split into a length measuring beam 83A and a reference beam 80A. Of these, the length measuring beam 83A passes through the λ / 4 plate 125A and is then irradiated onto the movable mirror 83. By passing through the λ / 4 plate 125A, the linearly polarized length measuring beam 83A is converted into circularly polarized light and then irradiated onto the movable mirror 83. The reflected light of the length measuring beam 83A irradiated on the movable mirror 83 again passes through the λ / 4 plate 125A, then enters the polarization beam splitter 124, and is transmitted to the corner cube 128. The length measurement beam 83A via the corner cube 128 is incident on the polarization beam splitter 124 again, passes through the λ / 4 plate 125B, and is irradiated on the movable mirror 83. The reflected light passes through the λ / 4 plate 125B again and then enters the polarization beam splitter 124. On the other hand, the reference beam 80A emitted from the polarization beam splitter 124 passes through the λ / 4 plate 126A via the reflection mirror 127 and is then irradiated on the reference mirror 80. The reference beam 80A is irradiated onto the reference mirror 80 by circularly polarized light, and the reflected light again passes through the λ / 4 plate 126A, then enters the polarization beam splitter 124, and is transmitted to the corner cube 128. The reference beam 80A via the corner cube 128 again enters the polarization beam splitter 124, passes through the λ / 4 plate 126B, and is irradiated on the reference mirror 80. The reflected light again passes through the λ / 4 plate 126B and then enters the polarization beam splitter 124. The length measurement beam 83A that has passed through the λ / 4 plate 125B and the reference beam 80A that has passed through the λ / 4 plate 126B are combined by the polarization beam splitter 124, and the combined light flux is limited by the limiting unit 129, and then the light receiving unit 130. Is received. As described above, the interferometer 13 of the present embodiment is configured by a so-called double-path interferometer that irradiates a length measuring beam (reference beam) to the moving mirror (reference mirror) twice, and the moving mirror 83 is tilted. Even in this case, the traveling direction of the reflected light of the length measuring beam from the movable mirror 83 is not changed.

  FIG. 15 is a schematic diagram of a double-pass interferometer. In FIG. 15, only the length measuring beam 83A irradiated to the movable mirror 83 is shown, and the λ / 4 plate and the like are omitted. In FIG. 15, the light beam emitted from the light source 120 is incident on the polarization beam splitter 124 via the beam expander 122 and the reflection mirror 123. The length measurement beam 83A is reflected by the reflecting surface of the polarizing beam splitter 124 and then irradiated on the reflecting surface of the moving mirror 83. The reflected light is reflected on the reflecting surface of the moving mirror 83 via the polarizing beam splitter 124 and the corner cube 128. After being irradiated twice, the light receiving unit 130 receives the light. At this time, when there is no tilt of the reflecting surface of the movable mirror 83 (when the angle with respect to the X axis is 0 degree), the length measuring beam 83A travels as indicated by the broken line in FIG. The emitted light beam traveling toward the light receiving unit 130 is parallel to the incident light beam incident on the polarization beam splitter 124. On the other hand, when the reflecting surface of the movable mirror 83 is inclined by the angle θ, the length measuring beam travels as indicated by a one-dot chain line 83A ′ in FIG. 15, but in this case as well, the emitted light beam from the polarization beam splitter 124 is , Parallel to the incident light beam. That is, the traveling directions of the emitted light beams are the same when the reflecting surface of the movable mirror 83 is inclined and when it is not. Therefore, as shown in the schematic diagram of FIG. 16, when the movable mirror 83 is irradiated with the length measuring beam 83 </ b> A once, if the movable mirror 83 is tilted, the reflected light is reflected with respect to the state without the tilt. Although the traveling direction changes and the light receiving unit 130 does not receive the light, as described with reference to FIG. 15, according to the double path interferometer, even if the movable mirror 83 is tilted, the reflected light is received by the light receiving unit 130. Can receive light.

  The double-path interferometer is an interferometer that irradiates a long measuring mirror 72, 82, 83 or the like with a measurement beam, or a reference mirror 75, 76 for detecting the inclination of the surface plate 1 (housing U, barrel PK). , 78, etc. are employed in an interferometer that irradiates a reference beam. Thereby, even if the movable mirror (reference mirror) is tilted, position measurement (attitude measurement) can be performed based on the reflected light from the movable mirror. The movable mirrors 70 and 71 for measuring the position of the mask holder 20 in the X-axis direction and the reference mirrors 73 and 74 provided on the surface plate 1 are configured by a corner cube. Since the incident light and its reflected light are parallel, they are received by the light receiving portion of the interferometer.

  By the way, in FIG. 15, when the tilt angle of the movable mirror 83 is θ and the distance between the apex of the corner cube 128 and the movable mirror 83 is D, the emitted light beam 83 </ b> A is irradiated to the light receiving unit 130 when the movable mirror 83 is not tilted. The irradiation position with respect to the light receiving unit 130 of the emitted light beam 83A ′ when there is an inclination with respect to the position moves by a distance (movement amount) Δ = 4 × D × θ. For example, if the distance D is 2500 mm, the rotation amount of the movable mirror 83 in the θZ direction is ± 200 μrad, and the rotation amount in the θX direction is ± 400 μrad, the distance Δ is about 4.47 mm at the maximum. If the diameter of the light beam after being emitted from the light source 120 is about 5 mm, there is a possibility that the light beam is not received well by the light receiving unit 130 and the stage position cannot be measured. That is, as shown in the schematic diagram of FIG. 17A, when the movement amount Δ is large with respect to the detection region 130 </ b> A of the light receiving unit 130, the light flux having the diameter H is not incident. Therefore, as shown in FIG. 17B, by expanding the diameter of the light beam emitted from the light source 120 by the beam expander 122, the movable mirror 83 tilts and the optical path of the light beam with respect to the light receiving unit 130 moves ( Even if it is shifted), the light beam is received by the light receiving unit 130.

  At this time, the beam expander 122 expands the light beam according to the movement amount Δ (= 4 × D × θ) of the length measuring beam 83A reflected by the moving mirror 83 accompanying the change (tilt) of the moving mirror 83. To change. As a result, even when the movable mirror 83 is tilted, the light beam can be more reliably received by the light receiving unit 130. For example, when the tilt angle θ of the movable mirror 83 is large (when the movement amount Δ is large), the beam expander 122 increases the magnification, and when the tilt angle θ is small, the magnification is decreased. In this case, the movement amount Δ of the light beam with respect to the light receiving unit 130 can be obtained in advance by, for example, experiments, and the magnification of the beam expander 122 can be set based on the obtained movement amount Δ. Then, the beam expander 122 expands the light beam 83 </ b> A so that the light beam (emitted light beam) moves with respect to the light receiving unit 130 in accordance with the inclination of the movable mirror 83, thereby causing the light beam to reach the light receiving unit 130. 83A can be incident.

  As the light beam expands by the beam expander 122, the illuminance (the amount of light per unit area when irradiated on a predetermined surface) decreases. Therefore, the magnification of the beam expander 122 is set so that the received light quantity does not become a predetermined value (allowable value) or less even if the optical path of the light beam with respect to the light receiving unit 130 moves and a part of the light path deviates from the light receiving unit 130. It is preferable to keep it small. Therefore, the magnification of the beam expander 122 is set according to the amount of movement Δ of the light beam 83A reflected by the moving mirror 83 with respect to the light receiving unit 130 and the sensitivity characteristic of the light receiving unit 130 with respect to the light beam 83A. For example, when the sensitivity of the light receiving unit 130 is high, by increasing the magnification of the beam expander 122, the light beam can be incident on the light receiving unit 130 even when the movement amount Δ is large. In this case, the illuminance (light intensity) of the light beam decreases as the magnification of the beam expander 122 is increased, but the sensitivity of the light receiving unit 130 is high, so that the interferometer 13 is based on the light reception result of the light receiving unit 130. Accurate position measurement can be performed.

  By the way, as shown in FIG. 13, the light beam emitted from the light source 120 is split into two light beams by the light beam branching unit 121, and then enters each of the two beam expanders 122A and 122B. The light beam that has passed through the panda 122A is sent to interferometers 6 to 9 and 16 to 19 that mainly measure the positions in the X-axis direction of the mask stage MST and the substrate stage PST, and the light beam that has passed through the other beam expander 122B is mainly used. Is sent to interferometers 11 to 15 that measure the position in the Y-axis direction. At this time, since the magnification of the beam expander 122B is set to be larger than the magnification of the beam expander 122A, the amount of movement Δ of the light beam relative to the light receiving unit 130 accompanying the posture change of the long movable mirrors 72, 83, etc. Even if it is large, the light receiving unit 130 of the interferometers 11 to 15 can receive the light beam more reliably.

  Further, as shown in the schematic diagram of FIG. 18, the interferometer performs position measurement based on the light component (overlapping light component) of the overlapping region where the length measurement beam and the reference beam overlap (synthesize). When the mirror 83 is tilted and the length measurement beam is moved, the overlapping area is reduced, and the light amount of the overlapping light component received by the light receiving unit 130 is reduced, which causes a disadvantage that accurate position measurement cannot be performed. Further, the non-overlapping light components other than the overlapping region (non-overlapping region) are noise components for the interferometer (light receiving unit 130), and the overlapping light component and the non-overlapping light component increase as the ratio of the non-overlapping light component to the overlapping light component increases. In this case, the interferometer may not be able to perform accurate position measurement.

  Therefore, by arranging a limiting unit 129 for limiting the light beam incident on the light receiving unit 130 on the front side of the light path with respect to the light receiving unit 130, the light beam is received by the light receiving unit 130 in a state where noise components (non-overlapping light components) are removed. Can be made incident. As a result, the contrast between the overlapping light component and the non-overlapping light component is improved, and the interferometer can accurately perform position measurement.

  The magnitude of the overlapping light component changes according to the amount of movement Δ of the light beam with respect to the light receiving unit 130 accompanying the change in the attitude of the movable mirror 83. Therefore, the limiting unit 129 can remove the noise component while maintaining the light amount of the light beam incident on the light receiving unit 130 by limiting the light beam incident on the light receiving unit 130 according to the movement amount Δ of the light beam. . In general, since a laser light source has a Gaussian distribution, it is necessary to consider this distribution for the detailed light amount.

  In the above embodiment, the limiting unit 129 is configured between the polarization beam splitter 124 as a combining unit and the light receiving unit 130, but the moving mirror (measurement light reflecting unit) 83, the light receiving unit 130, and the like. What is necessary is just to be arrange | positioned between. For example, the limiting unit 129 may be provided between the movable mirror 83 and the polarization beam splitter 124. As a result, the diameter of the light beam expanded by the beam expander 122 and reflected by the movable mirror 83 can be limited before the light beam is incident on the light receiving unit 130, so that noise components with respect to the light receiving unit 130 can be removed. On the other hand, when the limiting unit 129 including the stop is disposed between the movable mirror 83 and the polarization beam splitter 124, the phase of the light component diffracted by the stop may change. At this time, if the length measurement beam including the light component whose phase has changed and the reference beam are combined by the polarization beam splitter 124 and position measurement is performed based on the combined light, a position measurement error may occur. Therefore, as shown in FIG. 14, by arranging the limiting unit 129 between the polarization beam splitter 124 and the light receiving unit 130, the phase of both the length measurement beam and the reference beam via the polarization beam splitter 124 can be reduced. Since it changes in the same way, it is possible to prevent the occurrence of a position measurement error due to the phase difference between the length measurement beam and the reference beam.

  The restricting unit 129 can make the light incident on the light receiving unit 130 enter the light receiving unit 130 in a state where noise components are sufficiently removed by making the diameter of the light beam smaller than at least the diameter of the reference beam. Here, the limiting unit 129 is configured to be limited by the outer diameter (effective diameter) of the pickup lens for condensing light, but a mechanical aperture may be disposed.

  As described above, the light receiving unit 130 is provided in each interferometer (measurement axis), but has different sensitivity characteristics with respect to the light flux. Although all the light receiving units 130 have high sensitivity, there is an advantage that the power of the light source 120 can be reduced. However, the high sensitivity light receiving unit 130 is expensive and causes an increase in apparatus cost, and also has an effect of noise. Easy to receive. Therefore, for example, a highly sensitive light receiving unit 130 is used for an interferometer or the like used for position measurement in the scanning direction (X-axis direction) of a stage having a large moving stroke and a high moving speed, and the light receiving unit 130 of another interferometer. For example, an inexpensive light receiving unit 130 may be used. Then, it is preferable to optimally set the light amount branching ratio of each of the plurality of light beam branching units 121 so that each light receiving unit 130 is irradiated with a light beam having a light amount equal to or higher than the sensitivity of the light receiving unit 130.

  Here, the signal intensity (light intensity) S0 incident on the light receiving unit 130 when the moving mirror 83 is not inclined, and the light reception when the moving mirror 83 is tilted and the light beam moves a distance Δ relative to the light receiving unit 130. The ratio (= S1 / S0) to the signal intensity S1 incident on the unit 130 is H1, and the light quantity branching ratio when the light beam emitted from the light source 120 is branched to a plurality of measurement axes (interferometers) is H2. It is preferable to set the light quantity branching ratio H2 according to the signal intensity ratio H1 and the sensitivity ratio H3, where the sensitivity ratio between the light receiving sections 130 is H3.

  For simplicity, consider interferometers 6-12 that measure the position of mask holder 20 shown in FIG. The movable mirror 72 that is a measurement target of the interferometer 11 is a long movable mirror, and the light beam incident on the light receiving unit 130 of the interferometer 11 moves as the posture of the movable mirror 72 changes. The signal intensity ratio H1 in the light receiving unit 130 of the interferometer 11 is set to 0.8, for example. On the other hand, the movable mirror and the reference mirror on the mask holder 20 and the surface plate 1 are formed by, for example, a corner cube, and the reflected light of the light beam irradiated to these is directed to the light receiving unit 130 of the interferometers 6, 7, and 12. Do not move. Further, the light receiving units 130 of the interferometers 6 and 7 that measure the position of the mask holder 20 in the scanning direction are 10 times more sensitive than the light receiving units 130 of the other interferometers 11 and 12. That is, the sensitivity ratio H3 between the light receiving unit 130 of the interferometers 6 and 7 and the interferometers 11 and 12 is 10. In this case, when the light beam emitted from the light source 120 is branched to each of the interferometers 6, 7, 11, and 12 using the light beam branching unit 121, the amount of light supplied to the interferometers 6 and 7 is R 1 and the interferometer. When the light quantity supplied to 11 is R2 and the light quantity supplied to the interferometer 12 is R3, by setting each light beam branching portion so that R1: R2: R3 = 1: 8: 10, Each of the light receiving sections 130 of the interferometers 6, 7, 11, and 12 can receive a light beam (measurement beam) satisfactorily. In practice, for example, the light quantity branching ratio is determined in consideration of the reflectance and transmittance of the optical element on each optical path. For example, in the case of a highly sensitive light receiving element, there is a characteristic that it is vulnerable to noise. When the safety factor is estimated 5 times, R1: R2: R3 = 5: 8: 10 is set.

Further, when the number of measurement axes is m (where m is an integer of 7 or more) and the number of light beam branching portions arranged on each measurement axis is n, ⁿ satisfies the condition of 2 ⁿ ≧ m. It is preferably set to a minimum value. For example, when the measurement axis is branched into 10 axes and the light flux from the light source 120 is equally distributed to each measurement axis (interferometer), if the light flux branching part 121 is arranged in series, the branching ratio of the first light flux branching part 121 Is set to 0.1: 0.9, and the branching ratio of the second beam splitter 121 needs to be set to 0.1: 0.8. However, the branching ratio of each light beam branching portion varies due to a manufacturing error or the like. For example, when the manufacturing error is ± 5%, the branching ratio of the first light beam branching portion 121 may be 0.05: 0.95 or 0.15: 0.85. The variation in the amount of light branched to each axis increases. On the other hand, the closer the branching ratio in each axis is to 1: 1, the smaller the variation in the amount of light branched to each axis. Therefore, by providing the light beam branching portion so as to satisfy the above formula, it is possible to suppress the variation in the amount of light branched to each axis. For example, when the number m of measurement axes is 10, n = 4. That is, when the light beam emitted from the light source 120 is branched into 10 axes, the light beam can be favorably branched by arranging up to four light beam branching portions 121 with respect to one axis.

  The exposure apparatus EX in the above embodiment is a so-called multi-lens scan type exposure apparatus having a plurality of adjacent projection optical modules PLa to PLg. However, the exposure apparatus EX may be a scanning type exposure apparatus having one projection optical system. The present invention can be applied. Furthermore, the exposure apparatus EX of the present embodiment is also applied to a step-and-repeat type exposure apparatus that exposes the pattern of the mask M while the mask M and the substrate P are stationary, and sequentially moves the substrate P stepwise. be able to.

  The application of the exposure apparatus EX is not limited to a liquid crystal exposure apparatus that exposes a liquid crystal display element pattern on a square glass plate. For example, to manufacture an exposure apparatus for semiconductor manufacturing or a thin film magnetic head. The present invention can be widely applied to other exposure apparatuses.

  When a linear motor is used for the substrate stage PST and the mask stage MST, either an air levitation type using an air bearing or a magnetic levitation type using a Lorentz force or a reactance force may be used. The stage may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  When a planar motor is used as the stage drive device, either the magnet unit or the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is provided on the moving surface side (base) of the stage. Good.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. The reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224.

  The exposure apparatus according to the present embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 19, the semiconductor device includes a step 201 for designing the function and performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a substrate (wafer, glass plate) as a base material of the device. ) Manufacturing step 203, substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic perspective view which shows one Embodiment of the exposure apparatus of this invention. It is a perspective view which shows the projection optical system, mark detection system, and focus detection system which were supported by the surface plate. FIG. 3 is a plan view of FIG. 2 viewed from above. It is a perspective view which shows a substrate stage. It is a schematic block diagram which shows the projection optical system supported by the surface plate. It is a schematic diagram which shows arrangement | positioning of the mark detection system and focus detection system which were accommodated in the housing. It is a top view which shows the relationship between a mark detection system and the board | substrate supported by the substrate stage. It is a schematic block diagram of a focus detection system. It is a schematic block diagram of a mark detection system. It is a perspective view which shows the relationship between a mask holder, a surface plate, and an interferometer. It is a perspective view which shows the relationship between a substrate holder, a surface plate, and an interferometer. It is a schematic diagram for demonstrating the state which the attitude | position of a projection optical system is changing. It is a schematic perspective view which shows the whole structure of an interference system. It is a schematic perspective view which shows an interferometer. It is a schematic diagram which shows the optical path of the light beam of a double pass interferometer. It is a schematic diagram which shows a mode that the optical path of the light beam of an interferometer changes with the inclination of a moving mirror. It is a schematic diagram for demonstrating the effect | action of an expansion means. It is a schematic diagram for demonstrating the effect | action of a limiting means. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Surface plate, 2 ... Support part, 6, 7, 8A, 8B, 9, 11, 12A, 12B, 13-18, 19A, 19B ... Interferometer (1st-3rd measuring device), 20 ... Mask holder (Mask stage), 30 ... substrate holder (substrate stage), 50, 52 ... focus detection system, 70, 71, 82, 83 ... moving mirror (measurement light reflecting part), 73-81 ... reference mirror (reference light reflecting part) ), 100 ... Column (support structure), 110 ... Base plate (base structure), 120 ... Light source, 122 ... Beam expander (expansion means), 124 ... Polarizing beam splitter (dividing part, combining part), 129 ... Restriction Part (limitation means), 130 ... light receiving part, AF ... focus detection system, AL (AL1 to AL6) ... alignment system (mark detection system), CONT ... control device, EX ... exposure device, M ... mask, m1-m6 Alignment marks, MST ... mask stage, P ... substrate, PL ... projection optical system, PLa~PLg ... projection optical module, PST ... substrate stage, SYS ... interfered system (first to third measurement device)

Claims (15)

In an exposure apparatus that exposes a mask pattern onto a substrate via a projection optical system,
A base structure;
A support structure supported by the base structure and supporting the projection optical system via a surface plate;
A first measuring device that is provided on the support structure and measures relative position information of the projection optical system in a first direction;
A second measuring device that is provided separately from the first measuring device and measures relative position information in a second direction intersecting the first direction of the projection optical system;
An exposure apparatus comprising: a control device that obtains reference position information of the projection optical system based on measurement results of the first and second measurement devices.   The exposure apparatus according to claim 1, wherein the second measurement apparatus is provided on the base structure. A support surface for supporting the base structure;
The exposure apparatus according to claim 1, wherein the second measurement apparatus is supported by the support surface. A mask stage for supporting the mask;
A substrate stage for supporting the substrate;
A third measuring device that measures relative position information of at least one of the mask stage and the substrate stage with respect to the base structure;
The exposure apparatus according to claim 1, wherein the control device corrects a measurement result of the third measurement device based on reference position information of the projection optical system.   The exposure apparatus according to claim 1, wherein the third measuring apparatus is provided on the support structure.   The exposure apparatus according to claim 1, wherein the third measurement apparatus is provided in the base structure.   The first direction measured by the first measuring device is substantially parallel or substantially orthogonal to a direction in which the mask and the substrate are exposed while being synchronously moved in a predetermined scanning direction. The exposure apparatus according to claim 6. A plurality of mark detection systems capable of detecting alignment marks formed on the substrate;
The exposure apparatus according to claim 1, wherein the plurality of mark detection systems are supported on the surface plate together with the projection optical system.   The exposure apparatus according to claim 1, wherein each of the first, second, and third measurement apparatuses includes an interferometer. The interferometer includes a light source,
A splitting unit that splits a light beam emitted from the light source into measurement light and reference light;
A measurement light reflector that reflects the measurement light;
A reference light reflecting portion for reflecting the reference light;
A combining unit that combines the measurement light reflected by the measurement light reflection unit and the reference light reflected by the reference light reflection unit;
A light receiving portion for receiving the combined luminous flux;
The exposure apparatus according to claim 9, further comprising a limiting unit that limits a light beam incident on the light receiving unit.   The exposure apparatus according to claim 10, wherein the limiting unit is disposed between the measurement light reflecting unit and the light receiving unit, or between the combining unit and the light receiving unit.   12. The exposure apparatus according to claim 10, wherein the limiting means makes the diameter of the light beam incident on the light receiving portion smaller than the diameter of the reference light. The light beam emitted from the light source is branched into a plurality of light beams corresponding to a plurality of measurement axes,
The exposure apparatus according to claim 10, wherein a plurality of the light receiving units are provided corresponding to the plurality of measurement axes.   The exposure apparatus according to any one of claims 10 to 13, wherein an enlargement unit that enlarges a light beam is provided between the light source and the dividing unit. When the number of the measurement axes is m (where m is an integer of 7 or more) and the number of light beam branching portions arranged on each of the measurement axes is n, n is
2 ⁿ ≧ m
14. The exposure apparatus according to claim 13, wherein the exposure apparatus is set to a minimum value satisfying the following condition.

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