KR102438382B1 - Method for fabricating substrate - Google Patents

Abstract

A method of manufacturing a substrate is provided. The method of manufacturing a substrate includes aligning a substrate including a photoresist coating film on a stage and exposing the photoresist coating film to light using an optic head to form a coating film pattern, wherein the substrate is placed on the stage Aligning comprises: a first interferometer on the stage disposed to face a first face of the substrate, a second interferometer on the stage disposed to face a second face adjacent to the first face of the substrate; and aligning the substrate using a third interferometer measuring displacement of the optic head, wherein the second interferometer measures an angle formed by the second surface of the substrate from a reference plane.

Description

Substrate manufacturing method {Method for fabricating substrate}

The present invention relates to a method of manufacturing a substrate.

In manufacturing a semiconductor device and a display device, an exposure process is a process of forming a fine pattern on a substrate, and is one of important processes closely related to the performance of the semiconductor device and the display device. In the exposure process, patterning is generally performed by placing a mask having a specific pattern shape on a photo-resist and then exposing the mask. However, recently, a maskless lithography apparatus has been developed that performs patterning by directly irradiating spot beams having pattern information on a substrate without using a mask. In such an exposure apparatus, as the substrate becomes larger and the pattern becomes more precise, the precision thereof becomes very important. In this case, in order to increase the accuracy of the exposure apparatus, the accuracy of exposure is important, but it is also important to accurately measure the position of the substrate. The position of the substrate is measured using an interferometer, but the accuracy may be lowered depending on the environmental condition of the chamber.

An object of the present invention is to provide a method of manufacturing a substrate, including a method of aligning the substrate by measuring an offset between a plurality of interferometers and an inclined angle of the substrate.

Another object to be solved by the present invention is to provide a method of manufacturing a substrate, including a method of aligning the substrate by measuring the tilt angle of the substrate and the displacement of the optic head using a plurality of interferometers.

The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In one embodiment of the method for manufacturing a substrate according to the technical idea of the present invention for solving the above problems, a substrate including a photoresist coating film is aligned on a stage, and the photoresist coating film is formed using an optic head. Comprising exposing to form a coating film pattern, aligning the substrate on the stage, a first interferometer on the stage disposed to face the first surface of the substrate, adjacent to the first surface of the substrate and aligning the substrate using a second interferometer on the stage disposed to face a second surface and a third interferometer for measuring displacement of the optic head, wherein the second interferometer moves from the reference surface to the second interferometer. An angle formed by the second surface of the substrate is measured.

In some embodiments according to the inventive concept, aligning the substrate may include: the first interferometer and a fourth interferometer on the stage separated from the first interferometer and disposed to face the first surface of the substrate may include using

In some embodiments according to the inventive concept, aligning the substrate using the first interferometer and the fourth interferometer includes the first interferometer and the first surface of the substrate using the first interferometer. measure a first distance between, measure a second distance between the fourth interferometer and the first surface of the substrate using the fourth interferometer, and measure an offset between the first interferometer and the fourth interferometer ( offset) and using the measured values of the first and second distances.

In some embodiments according to the inventive concept, using the offset between the first interferometer and the fourth interferometer and the measured values of the first and second distances, the first interferometer measures the first distance transmits a value to the fourth interferometer, the fourth interferometer transmits a difference value between the measured value of the second distance and the measured value of the first distance to a controller, the controller comprising: the first interferometer and the second interferometer and calculating a correction value of the substrate using the offset between the four interferometers and the difference value.

In some embodiments according to the inventive concept, aligning the substrate using the first interferometer and the fourth interferometer includes the first interferometer and the first surface of the substrate using the first interferometer. measuring a first distance between the first distance and measuring a second distance between the fourth interferometer and the first surface of the substrate using the fourth interferometer, the measured value of the first distance and the second distance It may include comparing the measurements.

In some embodiments according to the inventive concept, aligning the substrate may include the second interferometer and a fifth interferometer on the stage separated from the second interferometer and disposed to face the second surface of the substrate. may include using

In some embodiments according to the inventive concept, aligning the substrate using the second interferometer and the fifth interferometer includes the second interferometer and the second surface of the substrate using the second interferometer. measuring a third distance between, measuring a fourth distance between the fifth interferometer and the second surface of the substrate using the fifth interferometer, and measuring the distance between the second interferometer and the fifth interferometer and , using the measured value of the third distance and the measured value of the fourth distance.

In some embodiments according to the technical spirit of the present invention, the use of the interval between the second interferometer and the fifth interferometer and the measured values of the third and fourth distances includes the measured value of the third distance and the second interferometer. 4 transmits a difference value between the measured distance values to a controller, and the controller uses the distance between the second interferometer and the fifth interferometer and the difference value to determine whether the second surface of the substrate from the reference plane is It may include calculating the angle formed.

In some embodiments according to the inventive concept, aligning the substrate includes the third interferometer disposed to face a third surface of the optical head, and a fourth surface adjacent to the third surface of the optical head. It may include using a sixth interferometer disposed to face the .

In some embodiments according to the inventive concept, aligning the substrate using the third interferometer and the sixth interferometer includes the third interferometer and the third of the optic head using the third interferometer. measuring a fifth distance between the surfaces, measuring a sixth distance between the sixth interferometer and the fourth surface of the optic head using the sixth interferometer, and measuring the fifth distance and the sixth distance comparing the measured values of the distance, measuring the displacement of the optic head, and using the displacement of the optic head.

Another embodiment of the method for manufacturing a substrate according to the technical idea of the present invention for solving the above problems is to align a substrate including a photoresist coating film on a stage, and use an optic head to prepare the photoresist coating film Comprising exposing to form a coating film pattern, aligning the substrate on the stage, first and second interferometers on the stage disposed separately from each other so as to face the first surface of the substrate, and the second of the substrate and aligning the substrate using third and fourth interferometers on the stage disposed separately from each other so as to face a second surface adjacent to the first surface, wherein the third and fourth interferometers are configured to move the substrate from a reference plane. Measuring an angle formed by the second surface, the second interferometer uses the offset between the first interferometer and the second interferometer and the measurement results of the third and fourth interferometers to position the substrate measure

In some embodiments according to the inventive concept, aligning the substrate includes using a fifth interferometer disposed to face the third surface of the optical head, and the fifth interferometer and the third of the optical head Measuring a first distance between the surfaces, and using a sixth interferometer disposed to face a fourth surface adjacent to the third surface of the optic head, between the sixth interferometer and the fourth surface of the optic head The method may further include measuring a second distance, comparing the measured value of the first distance with the measured value of the second distance, measuring the displacement of the optic head, and using the displacement of the optic head.

In some embodiments according to the technical spirit of the present invention, aligning the substrate may include reflecting the beam irradiated from the first interferometer to a first reflecting plate disposed on the first surface of the substrate, thereby forming the first interferometer and Measuring a third distance between the first reflecting plates, reflecting the beam irradiated from the second interferometer to the first reflecting plate, measuring a fourth distance between the second interferometer and the first reflecting plate, and 3 The beam irradiated from the interferometer is reflected by a second reflector disposed on the second surface of the substrate to measure a fifth distance between the third interferometer and the second reflector, and the beam irradiated from the fourth interferometer is reflected by a third reflector disposed on the second surface of the substrate to measure a sixth distance between the fourth interferometer and the third reflector.

In some embodiments according to the inventive concept, aligning the substrate using the first interferometer and the second interferometer includes an offset between the first interferometer and the second interferometer, and the fourth distance. The method may include using a value obtained by adding a difference value between the measured value and the measured value of the third distance.

In some embodiments according to the inventive concept, aligning the substrate using the third interferometer and the fourth interferometer may include a difference value between the measured value of the fifth distance and the measured value of the sixth distance. and calculating an angle formed by the second surface of the substrate from the reference plane using a distance between the third interferometer and the fourth interferometer.

Other specific details of the invention are included in the detailed description and drawings.

1 is a perspective view of an exposure apparatus used in a method of manufacturing a substrate according to some embodiments according to the inventive concept;
2 and 3 are diagrams illustrating an operation of loading a substrate into an exposure apparatus used in a method of manufacturing a substrate according to some embodiments according to the inventive concept.
4 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the technical idea of the present invention.
FIG. 5 is an enlarged view illustrating a plurality of interferometers and a substrate arranged in the Y-axis direction of FIG. 3 .
6 is a flowchart sequentially illustrating a method of calculating a correction value in an X-axis direction of a substrate in an exposure process used in a method of manufacturing a substrate according to an exemplary embodiment of the present invention.
FIG. 7 is an enlarged view illustrating a plurality of interferometers and a substrate disposed on the X-axis of FIG. 3 on an enlarged scale.
8 is a flowchart sequentially illustrating a method of calculating an inclination angle of a substrate from a reference plane in an exposure process used in a method of manufacturing a substrate according to an embodiment of the present invention.
9 is a diagram illustrating an optical head of an exposure apparatus used in a method of manufacturing a substrate according to some embodiments of the inventive concept.
10 is a flowchart sequentially illustrating a method of calculating a displacement of an optical head in an exposure process used in a method of manufacturing a substrate according to an embodiment of the present invention.
11 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment of the present invention.
12 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment according to the technical idea of the present invention.
13 is a block diagram of an electronic system including a substrate formed by using a method for manufacturing a substrate according to some embodiments according to the inventive concept.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Sizes and relative sizes of components indicated in the drawings may be exaggerated for clarity of description. Like reference numerals refer to like elements throughout.

When an element is referred to as “connected to” or “coupled to” with another element, it means that it is directly connected or coupled to another element, or with the other element intervening. including all cases. On the other hand, when one element is referred to as “directly connected to” or “directly coupled to” with another element, it indicates that another element is not interposed therebetween. Like reference numerals refer to like elements throughout. “And/or” includes each and every combination of one or more of the recited items.

Reference to an element or layer “on” or “on” another element or layer includes not only directly on the other element or layer, but also with intervening other layers or other elements. include all On the other hand, reference to an element "directly on" or "directly on" indicates that no intervening element or layer is interposed.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe a correlation between an element or components and other elements or components. The spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings. For example, when an element shown in the figures is turned over, an element described as "beneath" or "beneath" another element may be placed "above" the other element. Accordingly, the exemplary term “below” may include both directions below and above. The device may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular also includes the plural, unless specifically stated otherwise in the phrase. As used herein, “comprises” and/or “comprising” does not exclude the presence or addition of one or more other components in addition to the stated components.

Although the first, second, etc. are used to describe various elements or elements, these elements or elements are not limited by these terms, of course. These terms are only used to distinguish one element or component from another. Accordingly, it goes without saying that the first element or component mentioned below may be the second element or component within the spirit of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

The substrate manufacturing process may include processes of forming a photoresist coating film on the substrate, loading the substrate into the exposure apparatus, and then aligning the substrate to the interior of the exposure apparatus.

In addition, the substrate manufacturing process may include processes of exposing a photoresist coating layer formed on a substrate aligned inside an exposure apparatus to form a coating layer pattern, and etching the substrate using the coating layer pattern.

The method for aligning a substrate according to the inventive concept may be used when aligning the substrate inside the exposure apparatus after the substrate is inserted into the exposure apparatus during a substrate manufacturing process. However, the technical spirit of the present invention is not limited thereto.

Hereinafter, an exposure apparatus used in a method of manufacturing a substrate according to some embodiments according to the inventive concept will be described with reference to FIG. 1 .

1 is a perspective view of an exposure apparatus used in a method of manufacturing a substrate according to some embodiments according to the inventive concept;

Referring to FIG. 1 , the substrate 120 exposed by the exposure apparatus 10 includes a first reflecting plate 121 , a second reflecting plate 122 , and a third reflecting plate 123 .

The substrate 120 may be disposed on the stage 110 . The substrate 120 may move in the first direction Y on the stage 110 to be loaded under the optic head 170 . The substrate 120 may be exposed by a beam irradiated from the optic head 170 .

The substrate 120 may be a semiconductor substrate. The substrate 120 may be, for example, bulk silicon. Alternatively, the substrate 120 may be a silicon substrate, or may include other materials such as silicon germanium, indium antimonide, lead telluride, indium arsenide, indium phosphide, gallium arsenide, or gallium antimonide. . Alternatively, the substrate 120 may be an epitaxial layer disposed on a base substrate.

Also, the substrate 120 may be used for manufacturing a flat panel display (FPD). The flat panel display may include, for example, a liquid crystal display (LCD), a plasma display panel (PDP), a light emitting diode (LED), an organic light emitting device (OLED), a field emission display (FED), and the like.

The first reflection plate 121 may be disposed to extend in the first direction Y on the first surface of the substrate 120 . The first reflector 121 may reflect the beams irradiated from the first and second interferometers 141 and 142 .

The second reflection plate 122 may be disposed to extend in the second direction (X) on a second surface adjacent to the first surface of the substrate 120 . The second reflector 122 may reflect the beam irradiated from the third interferometer 151 .

The third reflection plate 123 may extend in the second direction X on the second surface of the substrate 120 and may be disposed to be spaced apart from the second reflection plate 123 . However, the technical spirit of the present invention is not limited thereto. That is, in some other embodiments, the second reflecting plate 122 and the third reflecting plate 123 may be connected. The third reflector 123 may reflect the beam irradiated from the fourth interferometer 152 .

The exposure apparatus 10 includes a stage 110 , a first interferometer 141 , a second interferometer 142 , a third interferometer 151 , a fourth interferometer 152 , an optical head 170 , and a connection unit 171 . include

The stage 110 may support the substrate 120 disposed on the stage 110 . In addition, the stage 110 may move the substrate 120 to be positioned under the optic head.

The first interferometer 141 may be disposed on the stage 110 to face the first surface of the substrate 120 . The first interferometer 141 may irradiate a beam to the first reflector 121 . The beam irradiated from the first interferometer 141 may be reflected by the first reflector 121 , and the first interferometer 141 may be formed with the first interferometer 141 and the first interferometer 141 using the beam reflected by the first reflector 121 . A distance between the first reflecting plates 121 may be measured.

The second interferometer 142 may be disposed on the stage 110 to face the first surface of the substrate 120 and to be spaced apart from the first interferometer 141 in the first direction (Y). The second interferometer 142 may irradiate a beam to the first reflector 121 . The beam irradiated from the second interferometer 142 may be reflected by the first reflector 121 , and the second interferometer 142 may be coupled to the second interferometer 142 using the beam reflected by the first reflector 121 . A distance between the first reflecting plates 121 may be measured.

However, the technical spirit of the present invention is not limited thereto. That is, in some other embodiments, the beams irradiated from the first and second interferometers 141 and 142 may be reflected on the substrate 120 , and the first and second interferometers 141 and 142 are the substrate 120 . The distance to the substrate 120 may be measured using the beam reflected from the .

Also, in some other embodiments, three or more interferometers may be disposed on the stage 110 to face the first surface of the substrate 120 .

The third interferometer 151 may be disposed on the stage 110 to face the second surface of the substrate 120 . The third interferometer 151 may irradiate a beam to the second reflector 122 . The beam irradiated from the third interferometer 151 may be reflected by the second reflector 122 , and the third interferometer 151 is coupled to the third interferometer 151 using the beam reflected by the second reflector 122 . A distance between the second reflectors 122 may be measured.

The fourth interferometer 152 may be disposed on the stage 110 to face the second surface of the substrate 120 and to be spaced apart from the third interferometer 151 in the second direction (X). The fourth interferometer 152 may irradiate a beam to the third reflector 123 . The beam irradiated from the fourth interferometer 152 may be reflected by the third reflector 123 , and the fourth interferometer 152 may be configured to perform a beam with the fourth interferometer 152 and the fourth interferometer 152 using the beam reflected by the third reflector 123 . A distance between the third reflecting plates 123 may be measured.

However, the technical spirit of the present invention is not limited thereto. That is, in some other embodiments, the beams irradiated from the third and fourth interferometers 151 and 152 may be reflected on the substrate 120 , and the third and fourth interferometers 151 and 152 are the substrate 120 . The distance to the substrate 120 may be measured using the beam reflected from the .

Also, in some other embodiments, three or more interferometers may be disposed on the stage 110 to face the second surface of the substrate 120 .

The optical head 170 may be connected to the connection part 171 and disposed on the stage 110 . However, the position of the optic head 170 is not limited.

The optic head 170 may irradiate a beam to the substrate 120 positioned under the optic head 170 to expose the photoresist coating layer formed on the substrate 120 .

The connection part 171 may connect the optical head 170 and the stage 110 . The connection part 171 may fix the optic head 170 on the stage 110 .

Hereinafter, an operation of loading a substrate into an exposure apparatus used in a method for manufacturing a substrate according to some embodiments according to the inventive concept will be described with reference to FIGS. 2 and 3 .

2 and 3 are diagrams illustrating an operation of loading a substrate into an exposure apparatus used in a method of manufacturing a substrate according to some embodiments according to the inventive concept.

Referring to FIG. 2 , when the substrate 120 is loaded on the stage 110 in the first direction Y to face the first interferometer 141 , the first interferometer 141 is the first reflector 121 . The distance between the first interferometer 141 and the first reflector 121 may be measured by irradiating the beam.

When the substrate 120 is further loaded on the stage 110 in the first direction (Y) to face the first and second interferometers 141 and 142 , the position of the substrate 120 is the position of the substrate 120 at the stage. It may be changed in the second direction (X) compared to the position initially loaded on (110).

In the process in which the substrate 120 is loaded on the stage 110 , the position of the substrate 120 is changed depending on the speed at which the substrate 120 is loaded on the stage 110 and the speed at which the substrate 120 is loaded on the stage 110 . It may be affected by the slope when it is first loaded into .

For example, when the speed at which the substrate 120 is loaded onto the stage 110 increases, the position variation of the substrate 120 may increase. In addition, when the slope when the substrate 120 is initially loaded on the stage 110 increases, the position variation of the substrate 120 may increase.

Referring to FIG. 3 , while the substrate 120 is loaded on the stage 110 in the first direction Y than shown in FIG. 2 , the position of the substrate 120 may be changed in the second direction X. can

In this case, the distance between the first interferometer 141 and the first reflector 121 may be different from the distance between the second interferometer 142 and the first reflector 121 . Also, the distance between the third interferometer 151 and the second reflector 122 may be different from the distance between the fourth interferometer 152 and the third reflector 123 .

In FIG. 3 , the distance between the first interferometer 141 and the first reflector 121 is smaller than the distance between the second interferometer 142 and the first reflector 121 , and the third interferometer 151 and the second reflector 121 . A case in which the distance between 122 is smaller than the distance between the fourth interferometer 152 and the third reflector 123 is illustrated.

Hereinafter, a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the technical concept of the present invention will be described with reference to FIGS. 1, 3 and 4 .

4 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the technical idea of the present invention.

1, 3, and 4, when the position of the substrate 120 is changed as shown in FIG. 3 while the substrate 120 is loaded on the stage 110, for a precise exposure process The substrate 120 should be aligned to a desired position.

The method 100 for aligning the substrate 120 according to an embodiment according to the technical concept of the present invention includes a distance between a first interferometer 141 and a first reflector 121 and a second interferometer 142 and Using the distance between the first reflector 121 and the offset between the first interferometer 141 and the second interferometer 142 , the position of the substrate 120 is changed in the second direction (X). A correction value may be calculated (S110).

The distance between the third interferometer 151 and the second reflector 122 , the distance between the fourth interferometer 152 and the third reflector 123 , and the third interferometer 151 and the fourth interferometer 152 . Using the interval of , the angle at which the substrate 120 is inclined with respect to the reference plane P may be calculated (S120).

The controller 180 may calculate a displacement value of the optical head 170 when the optical head 170 is physically twisted or a displacement occurs due to a change in position ( S130 ).

The controller 180 combines the correction value of the substrate 120 in the second direction X, the inclination angle of the substrate 120 from the reference plane P, and the displacement of the optical head 170 to combine the substrate 120 ) can be calculated (S140).

The controller 180 may align the substrate 120 to a desired position on the stage 110 by using the correction value of the substrate 120 ( S150 ).

Hereinafter, a method of calculating a correction value in the X-axis direction of a substrate in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the technical concept of the present invention will be described with reference to FIGS. 3, 5 and 6 . do.

FIG. 5 is an enlarged view illustrating a plurality of interferometers and a substrate arranged in the Y-axis direction of FIG. 3 . 6 is a flowchart sequentially illustrating a method of calculating a correction value in an X-axis direction of a substrate in an exposure process used in a method of manufacturing a substrate according to an exemplary embodiment of the present invention.

3, 5 and 6 , the first interferometer 141 may irradiate a beam to the first reflector 121 , and the first interferometer 141 is a beam reflected by the first reflector 121 . may be received to measure a first distance L1 between the first interferometer 141 and the first reflector 121 ( S210 ).

The second interferometer 142 may irradiate a beam to the first reflector 121 , and the second interferometer 142 may receive the beam reflected by the first reflector 121 to form the second interferometer 142 and the first A second distance L2 between the reflectors 121 may be measured ( S220 ).

The first interferometer 141 may transmit the measured value of the first distance L1 to the second interferometer 142 ( S230 ). The second interferometer 142 may calculate a difference value L8 between the measured value of the first distance L1 and the measured value of the second distance L2 .

The second interferometer 142 may transmit the difference value L8 between the measured value of the first distance L1 and the measured value of the second distance L2 to the controller 180 ( S240 ).

The controller 180 may measure the offset L7 between the first interferometer 141 and the second interferometer 142 ( S250 ). Specifically, the controller 180 compares the distance between the first surface of the stage 110 and the first interferometer 141 with the distance between the first surface of the stage 110 and the second interferometer 142 to offset the offset. (L7) can be measured.

The controller 180 includes a first interferometer 141 and a difference value L8 between the measured value of the first distance L1 and the measured value of the first distance L1 and the second distance L2. A correction value in the X-axis direction of the substrate 120 may be calculated using the offset L7 between the second interferometers 142 ( S260 ).

Specifically, the correction value L7 + L8 in the X-axis direction of the substrate 120 includes a difference value L8 between the measured value of the first distance L1 and the measured value of the second distance L2 and the first It is the sum of the offset L7 between the interferometer 141 and the second interferometer 142 .

Hereinafter, a method of calculating an inclination angle of a substrate from a reference plane in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the technical concept of the present invention will be described with reference to FIGS. 3, 7 and 8 . .

FIG. 7 is an enlarged view illustrating a plurality of interferometers and a substrate disposed on the X-axis of FIG. 3 on an enlarged scale. 8 is a flowchart sequentially illustrating a method of calculating an inclination angle of a substrate from a reference plane in an exposure process used in a method of manufacturing a substrate according to an embodiment of the present invention.

3, 7, and 8 , the third interferometer 151 may irradiate a beam to the second reflector 122 , and the third interferometer 151 is a beam reflected by the second reflector 122 . may be received to measure the third distance L3 between the third interferometer 151 and the second reflector 122 ( S310 ).

The fourth interferometer 152 may irradiate a beam to the third reflector 123 , and the fourth interferometer 152 receives the beam reflected by the third reflector 123 to form the fourth interferometer 152 and the third A fourth distance L4 between the reflectors 123 may be measured ( S320 ).

The controller 180 may measure the distance L10 between the third interferometer 151 and the fourth interferometer 152 ( S330 ). The controller 180 may calculate a difference value L9 between the measured value of the third distance L3 and the measured value of the fourth distance L4 .

The controller 180 controls the distance L10 between the third interferometer 151 and the fourth interferometer 152 and the difference value L9 between the measured value of the third distance L3 and the measured value of the fourth distance L4. ), the inclined angle θ of the substrate 120 from the reference plane P may be calculated ( S340 ).

Specifically, the controller 180 may calculate the inclination angle θ of the substrate 120 from the reference plane P using the following formula.

tan θ = L9 / L10

Hereinafter, a method of calculating the displacement of an optical head in an exposure process used in a method of manufacturing a substrate according to an embodiment according to the inventive concept will be described with reference to FIGS. 3, 9 and 10 .

9 is a diagram illustrating an optical head of an exposure apparatus used in a method of manufacturing a substrate according to some embodiments of the inventive concept. 10 is a flowchart sequentially illustrating a method of calculating a displacement of an optical head in an exposure process used in a method of manufacturing a substrate according to an embodiment of the present invention.

3, 9 and 10 , the fifth interferometer 161 may irradiate a beam to the first surface of the optical head 170 , and the fifth interferometer 161 is the second interferometer of the optical head 170 . A fifth distance L5 between the fifth interferometer 161 and the first surface of the optic head 170 may be measured by receiving the beam reflected on the first surface (S410).

The sixth interferometer 162 may irradiate a beam to a second surface adjacent to the first surface of the optic head 170 , and the sixth interferometer 162 receives the beam reflected on the second surface of the optic head 170 . Upon reception, the sixth distance L6 between the sixth interferometer 162 and the second surface of the optic head 170 may be measured ( S420 ).

Although the fifth and sixth interferometers 161 and 162 are illustrated in FIG. 9 as including two interferometers, respectively, the technical spirit of the present invention is not limited thereto. That is, in some other embodiments, the fifth and sixth interferometers 161 and 162 may each include one interferometer. In still some other embodiments, the fifth and sixth interferometers 161 and 162 may each include three or more interferometers.

The controller 180 may calculate the displacement of the optical head 170 using the measured value of the fifth distance L5 and the measured value of the sixth distance L6 ( S430 ). The displacement of the optic head 170 may occur due to a physical twist of the optic head 170 or a change in position.

The substrate alignment method 100 used in the substrate manufacturing method according to an embodiment according to the technical idea of the present invention is the correction value in the X-axis direction of the above-described substrate 120 and the substrate 120 from the reference plane P ) and the displacement of the optic head 170 may be used to align the substrate 120 on the stage 110 .

The method 100 for aligning the substrate uses the first and second interferometers 141 and 142 spaced apart in the first direction (Y), and when the substrate 120 is loaded onto the stage 110 , the second A correction value that changes in the direction (X) can be efficiently measured.

In addition, by measuring the offset between the first interferometer 141 and the second interferometer 142, the error in the position of the first interferometer 141 and the second interferometer 142 can be corrected, and the There is an advantage of correcting a positional error occurring in the optical head 170 by measuring the displacement.

Hereinafter, a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment according to the technical spirit of the present invention will be described with reference to FIG. 11 . Differences from the embodiment of FIG. 4 will be mainly described.

11 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment of the present invention.

Referring to FIG. 11 , a method 200 for aligning a substrate according to another embodiment according to the inventive concept is different from the method 100 for aligning a substrate, a third interferometer 151 and a fourth interferometer 152 . ) is not used to calculate the inclination angle θ of the substrate 120 from the reference plane P.

Specifically, the controller 180 may calculate a correction value in which the position of the substrate 120 is changed in the second direction X using the first interferometer 141 and the second interferometer 142 (S510), Next, the controller 180 corrects the substrate 120 facing the second interferometer 142 by the correction value in the second direction (X) of the substrate 120 based on the measured value of the first interferometer 141 by correcting the reference plane ( The angle θ of the substrate 120 tilted from P) may be corrected.

Subsequently, the controller 180 may calculate a displacement value of the optical head 170 ( S520 ), and the controller 180 determines the correction value of the substrate 120 in the second direction (X) and the optical head 170 . A correction value of the substrate 120 may be calculated using the displacement value of ( S530 ).

The controller 180 may align the substrate 120 to a desired position on the stage 110 by using the correction value of the substrate 120 ( S540 ).

Hereinafter, a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment according to the technical concept of the present invention will be described with reference to FIG. 12 . Differences from the embodiment of FIG. 4 will be mainly described.

12 is a flowchart sequentially illustrating a method of aligning a substrate in an exposure process used in a method of manufacturing a substrate according to another embodiment according to the technical idea of the present invention.

Referring to FIG. 12 , a method 300 for aligning a substrate according to another embodiment according to the inventive concept is different from the method 100 for aligning a substrate, a third interferometer 151 and a fourth interferometer 152 . ) is not used to calculate the inclination angle θ of the substrate 120 from the reference plane P.

Specifically, the controller 180 may calculate a correction value in which the position of the substrate 120 is changed in the second direction X using the first interferometer 141 and the second interferometer 142 (S610), Next, the controller 180 may calculate a correction value in which the position of the substrate 120 is changed in the first direction Y using the third interferometer 151 and the fourth interferometer 152 ( S620 ).

The controller 180 uses the correction value of the substrate 120 in the second direction (X) and the correction value of the substrate 120 in the first direction (Y) of the substrate 120 from the reference plane P. The inclined angle θ may be corrected.

Subsequently, the controller 180 may calculate a displacement value of the optic head 170 ( S630 ), and the controller 180 calculates the correction value of the substrate 120 in the second direction (X) and the displacement of the substrate 120 . The correction value of the substrate 120 may be calculated using the correction value in the first direction Y and the displacement value of the optical head 170 ( S640 ).

The controller 180 may align the substrate 120 to a desired position on the stage 110 using the correction value of the substrate 120 ( S650 ).

Hereinafter, an electronic system including a substrate formed using a substrate manufacturing method according to some embodiments according to the inventive concept will be described with reference to FIG. 13 .

13 is a block diagram of an electronic system including a substrate formed by using a method for manufacturing a substrate according to some embodiments according to the inventive concept.

Referring to FIG. 13 , an electronic system 1100 according to an embodiment of the present invention includes a controller 1110, an input/output device 1120, I/O, a memory device 1130, a memory device, an interface 1140, and a bus ( 1150, bus).

The controller 1110 , the input/output device 1120 , the memory device 1130 , and/or the interface 1140 may be coupled to each other through the bus 1150 . The bus 1150 corresponds to a path through which data is moved.

The controller 1110 may include at least one of a microprocessor, a digital signal processor, a microcontroller, and logic devices capable of performing functions similar thereto.

The input/output device 1120 may include a keypad, a keyboard, and a display device. The storage device 1130 may store data and/or instructions.

The interface 1140 may perform a function of transmitting data to or receiving data from a communication network. The interface 1140 may be in a wired or wireless form. For example, the interface 1140 may include an antenna or a wired/wireless transceiver. In addition, the electronic system 1100 may further include a high-speed DRAM and/or SRAM as an operation memory for improving the operation of the controller 1110 .

The substrate manufactured according to embodiments of the present invention may be provided in the memory device 1130 , or may be provided as a part of the controller 1110 , the input/output device 1120 , I/O, and the like.

The electronic system 1100 includes a personal digital assistant (PDA), a portable computer, a web tablet, a wireless phone, a mobile phone, and a digital music player (digital). music player), a memory card, or any electronic product capable of transmitting and/or receiving information in a wireless environment.

Although embodiments according to the technical idea of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but may be manufactured in a variety of different forms, and is common in the technical field to which the present invention pertains. Those skilled in the art will understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Stage: 110 Board: 120
First interferometer: 141 Second interferometer: 142
Third interferometer: 151 Fourth interferometer: 152
5th interferometer: 161 6th interferometer: 162
Optical Head: 170 Controller: 180

Claims (10)

Aligning the substrate including the photoresist coating film on the stage,
Comprising exposing the photoresist coating film using an optic head to form a coating film pattern,
Aligning the substrate on the stage comprises:
A first interferometer on the stage disposed to face the first surface of the substrate, a second interferometer on the stage disposed to face a second surface adjacent to the first surface of the substrate, and displacement of the optic head aligning the substrate using a third interferometer to measure displacement;
The second interferometer measures the angle formed by the second surface of the substrate from the reference plane,
Aligning the substrate,
using the first interferometer and a fourth interferometer on the stage separated from the first interferometer and disposed to face the first surface of the substrate,
Aligning the substrate using the first interferometer and the fourth interferometer,
measuring a first distance between the first interferometer and the first surface of the substrate using the first interferometer;
measuring a second distance between the fourth interferometer and the first surface of the substrate using the fourth interferometer;
and using measurements of the first and second distances and an offset between the first interferometer and the fourth interferometer. delete delete The method of claim 1,
Using the offset between the first interferometer and the fourth interferometer and the measurements of the first and second distances comprises:
The first interferometer transmits the measured value of the first distance to the fourth interferometer,
the fourth interferometer transmits a difference value between the measured value of the second distance and the measured value of the first distance to the controller;
and wherein the controller calculates a correction value of the substrate using an offset between the first interferometer and the fourth interferometer and the difference value. The method of claim 1,
Aligning the substrate,
and using the second interferometer and a fifth interferometer on the stage separated from the second interferometer and disposed to face the second surface of the substrate. 6. The method of claim 5,
Aligning the substrate using the second interferometer and the fifth interferometer,
measuring a third distance between the second interferometer and the second surface of the substrate using the second interferometer;
measuring a fourth distance between the fifth interferometer and the second surface of the substrate using the fifth interferometer;
and using the distance between the second interferometer and the fifth interferometer, and the measured value of the third distance and the measured value of the fourth distance. 7. The method of claim 6,
Using the measurements of the distance between the second interferometer and the fifth interferometer, and the third and fourth distances,
transmitting a difference value between the measured value of the third distance and the measured value of the fourth distance to the controller;
and wherein the controller calculates an angle formed by the second surface of the substrate from the reference plane by using the distance between the second interferometer and the fifth interferometer and the difference value. Aligning the substrate including the photoresist coating film on the stage,
Comprising exposing the photoresist coating film using an optic head to form a coating film pattern,
Aligning the substrate on the stage comprises:
The first and second interferometers on the stage are separated from each other to face the first surface of the substrate, and the third interferometer on the stage is separated from each other to face a second surface adjacent to the first surface of the substrate. and aligning the substrate using a fourth interferometer,
The third and fourth interferometers measure the angle formed by the second surface of the substrate from the reference plane,
The second interferometer is a substrate manufacturing method for measuring the position of the substrate using an offset between the first interferometer and the second interferometer and the measurement results of the third and fourth interferometers. 9. The method of claim 8,
Aligning the substrate,
measuring a first distance between the fifth interferometer and the third surface of the optic head by using a fifth interferometer disposed to face the third surface of the optic head;
measuring a second distance between the sixth interferometer and the fourth surface of the optic head by using a sixth interferometer disposed to face a fourth surface adjacent to the third surface of the optic head;
measuring the displacement of the optic head by comparing the measured value of the first distance and the measured value of the second distance;
The method of manufacturing a substrate further comprising using displacement of the optic head. 9. The method of claim 8,
Aligning the substrate,
By reflecting the beam irradiated from the first interferometer to a first reflecting plate disposed on the first surface of the substrate, measuring a third distance between the first interferometer and the first reflecting plate,
By reflecting the beam irradiated from the second interferometer to the first reflecting plate, measuring a fourth distance between the second interferometer and the first reflecting plate,
By reflecting the beam irradiated from the third interferometer to a second reflecting plate disposed on the second surface of the substrate, measuring a fifth distance between the third interferometer and the second reflecting plate,
and reflecting the beam irradiated from the fourth interferometer to a third reflecting plate disposed on the second surface of the substrate, and measuring a sixth distance between the fourth interferometer and the third reflecting plate.

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