JP2005013962A - Method for screening chip component and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a sticking foreign matter and pronged products which are two big elements of a failure mode to be removed, and further enhance a rate of operation in a measuring process which is a subsequent process thereof. <P>SOLUTION: In a method for screening chip components in which chip components to be screened are fed to a screening container 20 having a screening hole capable of passing non-defective chip components on the bottom section thereof, the screening container 20 are vibrated by a vibration type part array machine 10 and the non-defective chip components are passed through the screening hole, the screening hole is provided with an upper side guide hole section, a square hole section which is continued to the upper side guide hole section and is narrow portion against the upper side guide hole section, and a lower side guide hole section continued in the downward direction of the square hole section. The screening hole is arranged so as to pass the non-defective chip components through an upper and a lower directions in a long posture, and block passing in a laterally long posture. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip component sorting method and apparatus for sorting out non-defective and defective chip components such as chip capacitors (chip fixation, media adhesion, electrode deformation, chip deformation, etc.).
[0002]
[Prior art]
The manufacturing process of a chip component, for example, a ceramic electronic component such as a multilayer ceramic capacitor includes a cutting process after the lamination process, a firing process, and a process of forming external electrodes. And many of these are heat-processed simultaneously. In the process of baking the external electrodes of the chip component, cracking or chipping of the element occurs. Some chips adhere to each other after the external electrode forming step.
[0003]
4A to 4D are examples of defective products, FIG. 4A is a view of fixing chip components to each other (occurred during the firing process or plating of external electrodes), and FIG. Attached one (occurred during plating of the external electrode), (C) is an electrode deformed product (product with horns), and (D) is a chip deformed product (cracked, chipped product). There is also a defective product in which foreign matter adheres to the element body of the chip component.
[0004]
The chip part selection process is a process necessary for selecting a good chip part from the selection target product in which these defects or deposits are mixed.
[0005]
Conventionally, there are a method using one round hole plate for dropping cracked and chipped products and a method using a round sieve jig (mesh type). Had been implemented. At the same time, the adhered products between the chips were separated by vibration.
[0006]
Moreover, there are the following Patent Document 1 and Patent Document 2 as known documents related to chip component selection.
[0007]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-100545 [Patent Document 2] Japanese Patent Application Laid-Open No. 2001-332460
Patent Document 1 is a component selection method that can reliably separate components that are attached to each other and components that are not attached, and further includes a step of selecting components that are not attached. The center position of each through-hole is passed through the upper plate with through-holes that pass vertically and the lower plate with through-holes that allow parts that have passed through the through-holes in the upper plate to pass through any posture. Arrange them so that they are offset, and leave a gap between the two plates. This gap is dimensioned so that the attached parts cannot pass. In the sorting method, by adding at least one of vibration, inclination, and rocking to the two plates, the parts are separated through the through hole. Alternatively, it has a structure that does not allow separation of things that cannot be separated.
[0009]
In Patent Document 2, the entire back surface side of the measurement tray is covered with a measurement base with no gap at the periphery, and the chip components placed in the component storage holes in this state are vacuumed via a suction tube and a suction hose. Aspirate with a pump. This prevents chip parts from falling off due to the inclination or vibration of the tray. Further, when discharging a chip component to be discharged based on the component pass / fail information, air is blown out from the nozzle toward the corresponding chip component storage hole to discharge the chip component. Therefore, chip parts that are not to be discharged are sucked out by the vacuum pump, and thus do not fall off or be erroneously discharged.
[0010]
[Problems to be solved by the invention]
The conventional method using a round hole plate (mesh type) that uses a single round hole plate to drop cracked or chipped products has variations due to human work, and because of manual work, the vibration width (amplitude) The number of vibrations varied and the standards were different. Also, secondary disasters such as cracking and chipping of good chip parts occurred. Moreover, the thing which cannot be isolate | separated remains and efficiency is bad.
[0011]
The patent document 1 aims to eliminate adhesion between chips. Even if foreign matter deposits and horn deposits can be sorted out, cracks and chips cannot be sorted out (passes along with non-defective products).
[0012]
Moreover, the said patent document 2 does not aim at the selection based on the chip component shape.
[0013]
In view of the above points, the present invention can completely remove foreign matter adhering and horn products, which are the two major elements of the failure mode, and can improve the operating rate of the next process (measurement process). An object of the present invention is to provide a chip component sorting method and apparatus.
[0014]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, a chip component sorting method according to the invention of claim 1 of the present application is to supply a sorted chip component to a sorting container having a sorting hole at the bottom through which a good chip component can pass. When applying vibration to the container and passing a good chip part through the sorting hole,
The selection hole includes an upper guide hole portion, a rectangular hole portion that is continuous with the upper guide hole portion and becomes a constricted portion with respect to the upper guide hole portion, and a lower guide hole portion that extends below the rectangular hole portion. Prepared,
The sorting hole is characterized in that the non-defective chip component passes through in a vertically long posture, but prevents passage in a horizontally long posture.
[0016]
The chip component sorting method according to the invention of claim 2 of the present application is characterized in that, in claim 1, the upper guide hole has a tapered hole that widens upward.
[0017]
The chip part selection method according to the invention of claim 3 of the present application is the chip part selection method according to claim 1 or 2, wherein the dimension in the width direction of the non-defective chip part is W and the length of one side of the rectangular hole part is X. The side X is set to be slightly larger than the dimension W in the width direction.
[0018]
The chip component sorting method according to the invention of claim 4 is the non-defective product storage container according to claim 1, 2 or 3, wherein the non-defective product storage container has a defective product passage hole at the bottom through which a defective product smaller than the non-defective chip component can pass. It is characterized by being placed at a position below the sorting container and applying vibration.
[0019]
The chip component sorting apparatus according to the invention of claim 5 includes a sorting container having a sorting hole at the bottom through which a good chip component can pass, supply means for supplying the sorted chip component to the sorting container, and the sorting container. Vibration generating means for applying vibration to
The selection hole includes an upper guide hole portion, a rectangular hole portion that is continuous with the upper guide hole portion and becomes a constricted portion with respect to the upper guide hole portion, and a lower guide hole portion that extends below the rectangular hole portion. It is characterized by having.
[0020]
The chip part sorting device according to the invention of claim 6 of the present application is the chip part sorting apparatus according to claim 5, further comprising: a non-defective product storage container having a defective product passage hole at a bottom portion through which a defective product smaller than the non-defective chip component can pass. In preparation for the lower position, the vibration generating means applies vibration to the non-defective product storage container.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a chip component selection method and apparatus according to the present invention will be described below with reference to the drawings.
[0022]
FIG. 1 is a front view showing an overall configuration of an apparatus used in an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 shows configurations of a sorting container, a non-defective product storage container, and a defective product storage container.
[0023]
In these drawings, reference numeral 1 denotes a pedestal, on which a mounting base 2 is fixedly supported via legs 3. A hopper mounting table 5 is mounted on the mounting table 2 via a vibration generator 4 as first vibration generating means, and a hopper 6 and a supply chute 7 are fixed on the hopper mounting table 5. The hopper 6 accommodates chip parts to be sorted (various defective products are mixed in non-defective products).
[0024]
A vibration type parts aligner 10 as second vibration generating means is installed adjacent to the gantry 1, and a sorting container 20, a non-defective product storage container 30, and a defective product storage container 40 are arranged on the vibration base 11 in order from the top. Are stacked in this order. These containers 20, 30, and 40 are fixed in the vibration table 11 by being pressed by a pressing air cylinder 50 as a container pressing means in a multi-stage stacked state. In the released state of the holding air cylinder 50, the containers 20, 30, and 40 can be detached from the vibration table 11.
[0025]
The to-be-sorted chip components supplied from the hopper 6 by the vibration of the vibration generator 4 fall on the chute 7 and are supplied into the sorting container 20 through the chute 7. When the vibration from the vibration generator 4 is applied to the chute 7, the chute 7 functions as a linear feeder, and the sorted chip components on the chute 7 are moved forward and dropped into the sorting container 20. The hopper 6 and the chute 7 are means for supplying the chip components to be sorted to the sorting container 20.
[0026]
A shutter 35 and a discharge chute 36 for taking out non-defective chip parts to the outside are arranged on one side surface of the non-defective product storage container 30. A non-defective receiving container 55 is placed on the gantry 1 in order to receive non-defective chip parts falling from the discharge chute 36.
[0027]
A controller 60 is installed on the gantry 1 for controlling the operation of the vibration generator 4. A start switch 15 is provided on the operation side of the vibration type parts aligner 10. When the start switch 15 is turned on, the operations of the vibration generator 4 and the vibration parts aligner 10 are started, and the operation is stopped by a timer. . The vibration generator 4 applies vibration so that the chute 7 functions as a linear feeder. Further, as shown in the figure, the vibration type parts aligner 10 repeats at least one operation of applying vibrations with the vibration table 11 as the lower shoulder and applying vibrations as the lower left shoulder.
[0028]
FIG. 3A shows a structure in which the sorting container 20, the non-defective product storage container 30, and the defective product storage container 40 are stacked in order from the top, and each container 20, 30, 40 configures a bottom plate and a side surface part constituting the bottom part, respectively. It is the structure which combined the square frame of the figure (B).
[0029]
As shown in FIG. 3C, the sorting container 20 has a configuration in which a bottom portion obtained by superimposing three bottom plates 21, 22, and 23 and a side portion of the square frame 24 are combined by screwing or the like. The upper bottom plate 21 is formed with a number of upper guide holes in the vertical direction, each of which is composed of a tapered hole 21a that spreads upward and a first round hole 21b having a constant diameter that continues downward. Further, the intermediate bottom plate 22 is formed with a rectangular hole portion 22a shown in FIG. 3 (D) following the first round hole portion 21b so as to form a narrowed portion.
[0030]
The opening angle of the tapered hole portion 21a for facilitating the drawing of the chip component is 90 ° or less, preferably about 60 °. Further, the square hole portion 22a of the intermediate bottom plate 22 needs to have high dimensional accuracy, and may be manufactured by etching using, for example, an electroformed material (Ni). In the lower bottom plate 23, a number of lower guide hole portions are formed in the vertical direction. The lower guide hole portions are second circular hole portions 23a having a constant diameter that follow the rectangular hole portion 22a. These upper guide hole, square hole 22a, and lower guide hole constitute a sorting hole in the sorting container 20.
[0031]
As shown in FIG. 4E, the longitudinal dimension of a good chip component CIP is L, the width dimension is W, and the thickness dimension is T. When the diameters of the first and second round hole portions 21b and 23a are φ1 and φ2, the length of one side of the rectangular hole portion 22a is X, and the length of the other side orthogonal to the side is Y. The diameters φ1 and φ2 are smaller than the longitudinal dimension L, and larger than the diagonal length D of the square composed of the width dimension W and the thickness dimension T. However, the clearance with respect to the non-defective chip component CIP to be passed is preferably 10% or less. In other words, the diameters φ1 and φ2 are preferably larger than the diagonal length D (shown in FIG. 4E) and not more than 1.1 times the diagonal length D.
[0032]
The side X is smaller than the diameters φ1 and φ2 and slightly larger than the width direction dimension W. However, the clearance with respect to the width of the good chip component to be passed is preferably 5% or less (in other words, 1.05 times or less of the width direction dimension W is preferable).
[0033]
The side Y is smaller than the diameters φ1 and φ2 and slightly larger than the dimension T in the thickness direction. However, the clearance with respect to the thickness of the non-defective chip component to be passed is preferably 5% or less (in other words, 1.05 times or less the thickness direction dimension T is preferable).
[0034]
If the clearance for the sides X and Y exceeds 5%, the function of preventing the media adhesion defective product shown in FIG. 4B and the electrode deformed product shown in FIG. There's a problem.
[0035]
In addition, in a very small chip part, for example, 1005 type (length 1 mm, width 0.5 mm, thickness 0.5 mm) and 0603 type (length 0.6 mm, width 0.3 mm, thickness 0.3 mm), the width and thickness are In this case, the side X = Y of the rectangular hole 22a.
[0036]
Note that the thickness of the upper and lower bottom plates 21 and 23 is larger than that of the intermediate bottom plate 22, and the non-defective chip part CIP taken in from the tapered hole portion 21a that spreads upward is long in the vertical direction. It is set so that it enters the first round hole portion 21b, passes through the rectangular hole portion 22a, is guided by the second round hole portion 23a and falls.
[0037]
The non-defective product storage container 30 placed on the lower side of the sorting container 20 is a defective product (crack, missing product, waste generated during sorting) smaller than the good chip part CIP as shown in FIG. ) Is formed by combining a bottom portion made of a bottom plate 31 in which many defective product passage holes 33 are formed and a side surface portion of the square frame 32 by screwing or the like. As shown in FIG. 3E, the defective product passage hole 33 is a round hole having a constant diameter and is set slightly larger than the width W or the thickness T of the non-defective chip component CIP. Less than D. In other words, the non-defective chip component CIP does not have to pass even if it has a vertically long posture.
[0038]
The defective product storage container 40 arranged to be overlapped on the lower side of the good product storage container 30 has a configuration in which a bottom portion made of a bottom plate 41 without holes and a side surface portion of a square frame 42 are combined by screwing or the like. A defective product (a crack, a missing product, or a residue generated during sorting) that has dropped through the defective product passage hole 33 at the bottom of the good product storage container 30 is accommodated.
[0039]
Although not shown in detail, an opening that can be opened and closed by the shutter 35 is provided in a part of the side surface portion of the good product storage container 30.
[0040]
Next, the overall operation of this embodiment will be described.
[0041]
First, the sorting container 20, the non-defective product storage container 30, and the defective product storage container 40 are placed in order from the top on the vibration table 11 of the vibration type part aligner 10, and the holding air cylinder 50 as a container pressing means is used. Press down and fix to the vibration table 11. Initially, each container 20, 30, 40 is empty.
[0042]
Next, the vibration generator 4 is operated by the controller 60 to vibrate the hopper 6 and the supply chute 7 for a predetermined time to drop an appropriate amount of the chip components to be sorted onto the sorting container 20.
[0043]
When an appropriate amount of chip components to be sorted is collected in the sorting container 20, the start switch 15 of the vibration type parts aligner 10 is operated, and a sorting operation is performed by a timer operation for a predetermined time. That is, the shaking table 11 is vibrated while swinging left and right (repeating the state of falling from the right shoulder to the left shoulder), and swinging motion and vibration are applied to the containers 20, 30, and 40.
[0044]
The non-defective chip component CIP in the sorting container 20 can pass through the sorting hole at the bottom. In other words, the upper guide hole portion is inclined and supported by the taper surface of the tapered hole portion 21a, and the non-defective chip component CIP enters the first round hole portion 21b in a posture in which the longitudinal direction is directed in the vertical direction to become a constricted portion. It passes through the rectangular hole 22a in its posture, and the second round hole 23a serving as the lower guide hole is smoothly dropped and collected in the non-defective product storage container 30.
[0045]
Chip-attached products, media-attached products, and electrode deformed products (with horns) are defective products whose width or thickness is excessive compared to non-defective products, so they pass through the rectangular hole 22a, which is the narrowed portion of the sorting hole. It is not possible to fall into the good product storage container 30.
[0046]
Since the cracked and chipped defective product has a smaller size than the non-defective product, it passes through the sorting hole. Therefore, the non-defective product storage container 30 is mixed with cracks, chipped defective products, and waste at the time of sorting in addition to the non-defective chip parts CIP.
[0047]
Therefore, many defective product passage holes 33 are formed in the bottom of the non-defective product storage container 30, and the defective product passage holes 33 cannot pass non-defective chip parts. The waste falls into the defective product storage container 40 through the defective product passage hole 33 and accumulates there. Therefore, finally, only the non-defective chip parts remain in the non-defective product storage container 30.
[0048]
When the sorting operation by the timer operation for a predetermined time is completed, the shaking table 11 stops in a state of lowering the right side of FIG. 1 and opens the shutter 35 to open the non-defective product receiving container through the discharge chute 36 from the opening of the non-defective storage container 30. At 55, good chip parts are discharged.
[0049]
According to this embodiment, the following effects can be obtained.
[0050]
(1) At the bottom of the sorting container 20 to which an appropriate amount of non-defective chip parts are supplied, an upper guide hole, and a rectangular hole 22a that follows the upper guide hole and becomes a constricted portion with respect to the upper guide hole. By forming a large number of sorting holes having a lower guide hole portion that follows the rectangular hole portion 22a, non-defective chip parts pass in a vertically long posture, but block in a laterally long posture. Like to do. Since one side of the rectangular hole portion 22a is set slightly larger than the width direction dimension W (or thickness direction dimension T) of a good chip part, the width or thickness of chips having a width or thickness larger than that of the good chip part can be reduced. Adhered products, media-adhered products, and electrode deformed products (with horns) can be prevented from entering the non-defective product storage container 30. In particular, there is an effect that foreign matter adhesion and horn products which are two major elements of the failure mode can be completely removed.
[0051]
(2) Since the upper guide hole portion that forms the uppermost portion of the sorting hole has a tapered hole portion 21a that spreads upward on the opening side, the sorting chip component in the sorting container 20 can be effectively sorted. Can be drawn into.
[0052]
(3) The square hole portion 22a is formed with high precision by etching using the bottom plate 31 as an electroformed material, thereby providing a minimum clearance with respect to the width direction dimension W (or thickness direction dimension T) of a good chip part. (5% or less) to improve sorting accuracy.
[0053]
(4) A non-defective product storage container 30 is disposed below the sorting container 20, and a defective product passage hole 33 through which a crack or chipping defect smaller than the non-defective chip component can pass at the bottom of the non-defective product storage container 30. By forming a large number, it is possible to drop cracks, chipped defective products and wastes from the non-defective storage container 30, and finally it is possible to leave only non-defective chip parts in the non-defective storage container 30. It is. Thus, it is possible to improve work efficiency by simultaneously performing multi-stage sorting.
[0054]
(5) From the above, it is possible to improve the equipment operation rate (reduction of the number of equipment stoppages and stoppage time) in the measurement process of the subsequent process.
[0055]
In addition, of the sorting holes at the bottom of the sorting container, instead of the round holes 21b and 23a, it is possible on the principle of operation to use a square hole through which a good chip component can pass in a posture in which the longitudinal direction is directed vertically. However, considering the ease of processing, round holes are easier to manufacture except for the square hole portion 22a forming the constricted portion. In addition, the defective product passage hole at the bottom of the good product storage container may be a square hole that does not allow a good product chip part to pass through instead of the round hole. Also in this case, the workability is better for round holes.
[0056]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.
[0057]
【The invention's effect】
As described above, according to the present invention, it is possible to completely remove foreign matter adhering and horn products, which are the two major elements of failure modes in chip parts such as ceramic electronic parts, and in turn the next process (measurement process). It is possible to improve the operating rate.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of a chip parts selection method and apparatus according to the present invention.
FIG. 2 is a plan view of the embodiment of the present invention.
FIG. 3 shows a configuration of a sorting container, a non-defective product storage container, a defective product storage container, a sorting hole and the like used in the embodiment, and (A) is a cross section of a structure in which the sorting container, the non-defective product storage container and the defective product storage container are stacked. (B) is a perspective view of the shape of the square frame forming the side surface of the container, (C) is a longitudinal sectional view of a large number of sorting holes formed in the bottom of the sorting container, and (D) is a narrowed portion of the sorting hole. The top view of a square hole part, (E) is a longitudinal cross-sectional view of the inferior goods passage hole formed many in the non-defective product storage container bottom part.
FIGS. 4A and 4B are an example of a defective chip part and an example of a non-defective chip part. FIGS. 4A to 4D are explanatory views showing defective parts, respectively, and FIG. 4E is a perspective view of the non-defective chip part. .
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 2 Mounting base 3 Leg part 4 Vibration generator 5 Hopper mounting base 6 Hopper 7 Supply chute 10 Vibrating parts alignment machine 11 Vibrating base 20 Sorting container 21, 22, 23, 31, 41 Bottom plate 21a Tapered hole 21b 1st Round hole portion 22a Square hole portion 23a Second round hole portions 24, 32, 42 Square frame 30 Non-defective product storage container 33 Defective product passage hole 35 Shutter 36 Discharge chute 40 Defective product storage container 50 Holding air cylinder 55 Non-defective product receiving container 60 controller

Claims (6)

Chip part sorting method for supplying a chip part to be sorted to a sorting container having a sorting hole through which a good chip part can pass at the bottom, and applying vibration to the sorting container so that the good chip part passes through the sorting hole. Because
The selection hole includes an upper guide hole portion, a rectangular hole portion that is continuous with the upper guide hole portion and becomes a constricted portion with respect to the upper guide hole portion, and a lower guide hole portion that extends below the rectangular hole portion. Prepared,
2. The chip part selection method according to claim 1, wherein the non-defective chip part passes through the sorting hole in a vertically long posture but is prevented from passing in a laterally long attitude. The chip part selection method according to claim 1, wherein the upper guide hole has a tapered hole extending upward. 3. The side X is set to be slightly larger than the width direction W when the width direction dimension of the non-defective chip component is W and the length of one side of the rectangular hole portion is X. 3. The chip part selection method as described. The chip component according to claim 1, 2 or 3, wherein a non-defective product storage container having a defective product passage hole at a bottom portion through which a defective product smaller than the good product chip component can pass is arranged at a position below the sorting container to apply vibration. Sorting method. A sorting container having a sorting hole through which a good chip part can pass at the bottom, a supply means for supplying the sorting chip part to the sorting container, and a vibration generating means for applying vibration to the sorting container,
The selection hole includes an upper guide hole portion, a rectangular hole portion that is continuous with the upper guide hole portion and becomes a constricted portion with respect to the upper guide hole portion, and a lower guide hole portion that extends below the rectangular hole portion. A chip component sorting apparatus comprising: A non-defective product storage container having a defective product passage hole at a bottom portion through which a defective product smaller than the non-defective chip component can pass is provided at a lower position of the sorting container, and the vibration generating means applies vibration to the good product storage container. Item 6. The chip component sorting device according to Item 5.

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