【０００１】
【発明の属する技術分野】
本発明は、電子機器の放熱装置に関する。
【０００２】
【従来の技術】
周知の様に電子機器においては、半導体素子、抵抗素子、トランス等の多様な素子を内蔵しており、発熱量が大きな素子については、放熱を促進するための手段を設けて、素子の温度上昇を抑え、素子の破壊を防止している。例えば、放熱フィンを基板上に設け、素子を放熱フィンに接触させて、素子の熱を放熱フィンにより放熱させ、素子の温度上昇を抑えている。
【０００３】
【発明が解決しようとする課題】
しかしながら、素子の熱を放熱フィン等により放熱させると、電子機器内部の温度が上昇するため、素子の温度上昇を良好に抑えることができず、また他の素子の温度が上昇してしまった。
【０００４】
このため、冷却ファンを電子機器に設けて、電子機器内部を換気することもあるが、この場合は、コストの上昇を招く。また、電子機器が小型化される程、冷却ファンを設けることが困難になった。
【０００５】
また、放熱フィン等を大型化することも考えられるが、放熱フィンが大型化される程、その重量が嵩み、振動や衝撃等が発生したときに、放熱フィンを設けた基板が割れる等の故障が生じ易くなり、また放熱フィンの占有スペースが広くなって、電子機器が大型化してしまった。
【０００６】
そこで、本発明は、上記従来の問題点に鑑みてなされたものであり、電子機器内部の温度上昇を伴わずに、電子機器内蔵の素子の温度上昇を良好に抑えることができ、電子機器の大型化を招かず、基板等に負担を与えず、コストの上昇を抑えることが可能な電子機器の放熱装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
上記課題を解決するために、本発明は、電子機器内で発生した熱を吸収する熱伝導部材と、電子機器の本体筐体の外壁面に展着された外側放熱板とを備え、熱伝導部材の熱を該熱伝導部材から外側放熱板へと伝導させている。
【０００８】
この様な構成の本発明によれば、電子機器内蔵の素子の熱を熱伝導部材に吸収させ、熱伝導部材の熱を外側放熱板へと伝導させ、この熱を外側放熱板により放熱させることができる。これにより、電子機器内部の温度上昇を伴わずに、素子の温度上昇を良好に抑えることができる。また、外側放熱板を電子機器の本体筐体の外壁面に展着していることから、外側放熱板の格別な占有スペースを必用とせず、電子機器の大型化を招かずに済み、基板等に負担を与えず、コストの上昇を抑えることができる。
【０００９】
また、本発明においては、複数の外側放熱板を本体筐体のそれぞれの外壁面に展着し、熱伝導部材の熱を該熱伝導部材から各外側放熱板へと伝導させている。
【００１０】
この様に複数の外側放熱板を本体筐体のそれぞれの外壁面に展着すれば、冷却効率が高くなる。また、各外側放熱板により電子機器内部がシールドされる。
【００１１】
更に、本発明においては、熱伝導部材と外側放熱板を相互に連結固定することにより、熱伝導部材から外側放熱板への熱伝導路を形成している。
【００１２】
外側放熱板を電子機器の本体筐体の外壁面に展着していることから、熱伝導部材と外側放熱板を相互に連結固定すれば、熱伝導部材及び該熱伝導部材が設けられた基板を本体筐体の外壁に強固に固定することができる。
【００１３】
また、本発明においては、外側放熱板の外側面に、複数の孔を有する外装板を展着している。
【００１４】
外装板を外側放熱板の外側面に展着すれば、電子機器の外観が好ましくなる。また、利用者が外側放熱板に直接触れることがないので、外側放熱板が加熱されても、利用者が火傷を負わずに済む。また、複数の孔を外装板に設けているので、外側放熱板の熱が外装板の各孔を通じて放熱される。
【００１５】
更に、本発明においては、複数の熱伝導部材及び該各熱伝導部材間に介在する絶縁部材を設け、各熱伝導部材の熱を該各熱伝導部材間で絶縁部材を通じて伝導させ、各熱伝導部材の熱を該各熱伝導部材のいずれかから外側放熱板へと伝導させている。
【００１６】
この場合は、各熱伝導部材の熱が絶縁部材を介して伝導される。そして、各熱伝導部材の熱は、該各熱伝導部材のいずれかから外側放熱板へと伝導され、外側放熱板により放熱される。
【００１７】
【発明の実施の形態】
以下、本発明の実施形態を添付図面を参照して詳細に説明する。
【００１８】
図１は、本発明の放熱装置の第１実施形態を適用した電子機器を示す断面図である。この電子機器１１は、例えば交流商用電源に接続され、交流電圧を直流電圧に変換して、この直流電圧を出力供給するＡＣアダプタである。
【００１９】
この電子機器１１では、半導体素子１２等を基板１３上に搭載し、金属性の熱伝導部材１４を基板１３に固定し、半導体素子１２を熱伝導部材１４に接触させている。
【００２０】
そして、基板１３を下筐体１５ａの内側に配置し、熱伝導部材１４の下側部１４ａを下筐体１５ａの開口部１５ｂに位置決めしている。
【００２１】
下筐体１５ａの外壁面には、凹所１５ｃを設けており、この凹所１５ｃに金属製の外側放熱板１６を貼り付けている。下筐体１５ａの開口部１５ｂでは、熱伝導部材１４の下側部１４ａと外側放熱板１６が相互に接触している。
【００２２】
更に、下筐体１５ａに上筐体１５ｄを被せ、ビス１７を外側放熱板１６の孔１６ａ、熱伝導部材１４の孔１４ｂ、基板１３の孔１３ａ、及び熱伝導部材１４の孔１４ｃに通して、ビス１７を上筐体１５ｄのネジ孔１５ｅにねじ込み、本体筐体１５を組み立てている。このとき、熱伝導部材１４の下側部１４ａと外側放熱板１６が相互に圧接し合う。また、下筐体１５ａ、上筐体１５ｄ、熱伝導部材１４、及び基板１３が一体化されて、基板１３が強固に固定される。
【００２３】
この様な構成の電子機器１１において、半導体素子１２が発熱すると、半導体素子１２の熱が熱伝導部材１４に吸収される。そして、この熱は、熱伝導部材１４から外側放熱板１６へと伝導され、外側放熱板１６から放熱される。このため、電子機器１１内部の温度上昇を伴わずに、半導体素子１２の温度上昇を良好に抑えることができる。また、外側放熱板１６を本体筐体１５の外壁面に貼り付けていることから、外側放熱板１６の格別な占有スペースを必用とせず、電子機器１１の大型化を招かずに済み、基板１３等に負担を与えず、コストの上昇を抑えることができる。
【００２４】
図２は、本発明の放熱装置の第２実施形態を適用した電子機器を示す断面図である。この電子機器２１も、例えばＡＣアダプタである。
【００２５】
この電子機器２１では、第１及び第２半導体素子２２、２３等を基板２４上に搭載し、金属性の第１及び第２熱伝導部材２５、２６を基板２４に固定し、第１及び第２半導体素子２２、２３を第１及び第２熱伝導部材２５、２６にそれぞれ接触させている。また、絶縁部材２７を第１及び第２熱伝導部材２５、２６に接着している。
【００２６】
そして、基板２４を下筐体２８ａの内側に配置し、第１熱伝導部材２５の下側部２５ａを下筐体２８ａの開口部２８ｂに位置決めしている。
【００２７】
下筐体２８ａの外壁面には、凹所２８ｃを設けており、この凹所２８ｃに金属製の第１外側放熱板３１を貼り付け、その上に外装板３２を貼り付けている。外装板３２には、多数の小孔３２ａを設けている。下筐体２８ａの開口部２８ｂでは、第１熱伝導部材２５の下側部２５ａと第１外側放熱板３１が相互に接触している。
【００２８】
更に、下筐体２８ａに上筐体２８ｄを被せ、第１熱伝導部材２５の上側部２５ｂを上筐体２８ｄの開口部２８ｅに位置決めしている。
【００２９】
上筐体２８ｄの外壁面には、凹所２８ｆを設けており、この凹所２８ｆに金属製の第２外側放熱板３３を貼り付けて、第２外側放熱板３３の凸部３３ａを上筐体２８ｄの開口部２８ｅに嵌め込み、第２外側放熱板３３上に外装板３４を貼り付けている。外装板３４には、多数の小孔３４ａを設けている。上筐体２８ｄの開口部２８ｅでは、第１熱伝導部材２５の上側部２５ｂと第２外側放熱板３３の凸部３３ａが相互に接触している。
【００３０】
そして、ビス３５を第１外側放熱板３１の孔３１ａ、第１熱伝導部材２５の孔２５ｃ、基板２４の孔２４ａ、及び第１熱伝導部材２５の孔２５ｄに通して、ビス３５を第２外側放熱板３３のネジ孔３３ｂにねじ込み、本体筐体２８を組み立てている。このとき、第１熱伝導部材２５の下側部２５ａと第１外側放熱板３１が相互に圧接し合い、第１熱伝導部材２５の上側部２５ｂと第２外側放熱板３３の凸部３３ａが相互に圧接し合う。また、下筐体２８ａ、上筐体２８ｄ、第１熱伝導部材２５、及び基板２４が一体化されて、基板２４が強固に固定される。
【００３１】
この様な構成の電子機器２１において、第１半導体素子２２の熱は、第１熱伝導部材２５に吸収されて、第１熱伝導部材２５から第１及び第２外側放熱板３１、３３へと伝導され、第１及び第２外側放熱板３１、３３から各外装板３２、３４の多数の小孔３２ａ、３４ａを通じて放熱される。また、第２半導体素子２３の熱は、第２熱伝導部材２６に吸収されて、第２熱伝導部材２６から絶縁部材２７を通じて第１熱伝導部材２５へと伝導され、更に第１熱伝導部材２５から第１及び第２外側放熱板３１、３３へと伝導され、第１及び第２外側放熱板３１、３３から各外装板３２、３４の多数の小孔３２ａ、３４ａを通じて放熱される。このため、電子機器２１内部の温度上昇を伴わずに、第１及び第２半導体素子２２、２３の温度上昇を良好に抑えることができる。また、第１及び第２外側放熱板３１、３３を本体筐体２８の外壁面に貼り付けていることから、該各外側放熱板の格別な占有スペースを必用とせず、電子機器２１の大型化を招かずに済み、基板２４等に負担を与えず、コストの上昇を抑えることができる。
【００３２】
更に、金属製の第１及び第２外側放熱板３１、３３間に電子機器２１の基板２４を挟み込む構造であるため、第１及び第２外側放熱板３１、３３により基板２４をシールドすることができる。
【００３３】
また、多数の小孔を有するそれぞれの外装板３２、３４を第１及び第２外側放熱板３１、３３に貼り付けているため、利用者が第１及び第２外側放熱板３１、３３に直接触れることはなく、第１及び第２外側放熱板３１、３３が加熱されても、利用者が火傷することはない。また、第１及び第２外側放熱板３１、３３の熱は、各外装板３２、３４の多数の小孔３２ａ、３４ａを通じて良好に放熱される。
【００３４】
尚、本発明は、上記各実施形態に限定されるものではなく、多様に変形することができる。例えば、熱伝導部材及び外側放熱板の個数を増やしても構わない。また、半導体素子ばかりではなく、他の各種素子を熱伝導部材に接触させても良い。更に、本発明は、ＡＣアダプタだけではなく、他の種類の電子機器にも適用することができる。
【００３５】
【発明の効果】
以上説明した様に本発明によれば、電子機器内蔵の素子の熱を熱伝導部材に吸収させ、熱伝導部材の熱を外側放熱板へと伝導させ、この熱を外側放熱板により放熱させることができる。これにより、電子機器内部の温度上昇を伴わずに、素子の温度上昇を良好に抑えることができる。また、外側放熱板を電子機器の本体筐体の外壁面に展着していることから、外側放熱板の格別な占有スペースを必用とせず、電子機器の大型化を招かずに済み、基板等に負担を与えず、コストの上昇を抑えることができる。
【図面の簡単な説明】
【図１】本発明の放熱装置の第１実施形態を適用した電子機器を示す断面図である。
【図２】本発明の放熱装置の第２実施形態を適用した電子機器を示す断面図である。
【符号の説明】
１１、２１ 電子機器
１２ 半導体素子
１３、２４ 基板
１４ 熱伝導部材
１５ 本体筐体
１６ 外側放熱板
１７、３５ ビス
２２ 第１半導体素子
２３ 第２半導体素子
２５ 第１熱伝導部材
２６ 第２熱伝導部材
２７ 絶縁部材
２８ 本体筐体
３１ 第１外側放熱板
３２、３４ 外装板
３３ 第２外側放熱板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation device for electronic equipment.
[0002]
[Prior art]
As is well known, electronic devices incorporate various elements such as semiconductor elements, resistance elements, transformers, etc. For elements that generate a large amount of heat, a means for promoting heat dissipation is provided to increase the temperature of the elements. Suppresses the destruction of the device. For example, a radiation fin is provided on the substrate, the element is brought into contact with the radiation fin, and the heat of the element is radiated by the radiation fin, thereby suppressing an increase in the temperature of the element.
[0003]
[Problems to be solved by the invention]
However, if the heat of the element is dissipated by the radiation fins or the like, the temperature inside the electronic device rises, so that the temperature rise of the element cannot be satisfactorily suppressed, and the temperature of other elements rises.
[0004]
For this reason, a cooling fan may be provided in the electronic device to ventilate the inside of the electronic device, but in this case, the cost increases. In addition, as electronic devices are miniaturized, it has become difficult to provide a cooling fan.
[0005]
In addition, it is conceivable to increase the size of the radiating fins, but the larger the size of the radiating fins, the larger the weight, and when vibration or impact occurs, the substrate provided with the radiating fins breaks. Failures are likely to occur, and the space occupied by the radiating fins is widened, resulting in an increase in the size of the electronic device.
[0006]
Therefore, the present invention has been made in view of the above-described conventional problems, and it is possible to satisfactorily suppress an increase in temperature of an element incorporated in an electronic device without accompanying an increase in temperature inside the electronic device. An object of the present invention is to provide a heat dissipating device for an electronic device that does not increase in size, imposes a burden on a substrate, and can suppress an increase in cost.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention includes a heat conductive member that absorbs heat generated in an electronic device, and an outer heat radiating plate that is spread on the outer wall surface of the main body of the electronic device. The heat of the member is conducted from the heat conducting member to the outer heat radiating plate.
[0008]
According to the present invention having such a configuration, the heat conduction member absorbs the heat of the element built in the electronic device, the heat of the heat conduction member is conducted to the outer heat radiating plate, and the heat is radiated by the outer heat radiating plate. Can do. Thereby, the temperature rise of an element can be suppressed favorably, without accompanying the temperature rise inside an electronic device. In addition, since the outer heat sink is spread on the outer wall surface of the main body casing of the electronic device, a special occupation space for the outer heat sink is not required, and the size of the electronic device is not increased. The increase in cost can be suppressed without burdening the user.
[0009]
In the present invention, a plurality of outer heat radiating plates are spread on the respective outer wall surfaces of the main body housing, and the heat of the heat conducting member is conducted from the heat conducting member to each outer heat radiating plate.
[0010]
In this way, if a plurality of outer heat radiating plates are spread on the respective outer wall surfaces of the main body housing, the cooling efficiency is increased. In addition, the inside of the electronic device is shielded by each outer heat sink.
[0011]
Furthermore, in the present invention, the heat conduction path from the heat conduction member to the outer heat radiation plate is formed by connecting and fixing the heat conduction member and the outer heat radiation plate to each other.
[0012]
Since the outer heat radiating plate is spread on the outer wall surface of the main body casing of the electronic device, if the heat conducting member and the outer heat radiating plate are connected and fixed to each other, the heat conducting member and the substrate provided with the heat conducting member are provided. Can be firmly fixed to the outer wall of the main body casing.
[0013]
In the present invention, an exterior plate having a plurality of holes is spread on the outer surface of the outer heat radiating plate.
[0014]
If the exterior plate is spread on the outer surface of the outer heat radiating plate, the appearance of the electronic device becomes preferable. Further, since the user does not directly touch the outer heat radiating plate, even if the outer heat radiating plate is heated, the user is not burned. Further, since the plurality of holes are provided in the exterior plate, the heat of the outer heat radiating plate is radiated through each hole of the exterior plate.
[0015]
Furthermore, in the present invention, a plurality of heat conducting members and an insulating member interposed between the heat conducting members are provided, and heat of each heat conducting member is conducted between the heat conducting members through the insulating member, and each heat conducting member is provided. The heat of the member is conducted from any one of the heat conducting members to the outer heat radiating plate.
[0016]
In this case, the heat of each heat conducting member is conducted through the insulating member. The heat of each heat conducting member is conducted from any one of the heat conducting members to the outer heat radiating plate and is radiated by the outer heat radiating plate.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0018]
FIG. 1 is a cross-sectional view showing an electronic apparatus to which a first embodiment of a heat dissipation device of the present invention is applied. The electronic device 11 is an AC adapter that is connected to, for example, an AC commercial power supply, converts an AC voltage into a DC voltage, and supplies the DC voltage.
[0019]
In the electronic device 11, the semiconductor element 12 or the like is mounted on the substrate 13, the metallic heat conductive member 14 is fixed to the substrate 13, and the semiconductor element 12 is in contact with the heat conductive member 14.
[0020]
And the board | substrate 13 is arrange | positioned inside the lower housing | casing 15a, and the lower part 14a of the heat conductive member 14 is positioned in the opening part 15b of the lower housing | casing 15a.
[0021]
A recess 15c is provided on the outer wall surface of the lower housing 15a, and a metal outer heat dissipation plate 16 is attached to the recess 15c. In the opening 15b of the lower housing 15a, the lower portion 14a of the heat conducting member 14 and the outer heat radiating plate 16 are in contact with each other.
[0022]
Further, the upper housing 15d is covered with the lower housing 15a, and the screw 17 is passed through the hole 16a of the outer heat radiation plate 16, the hole 14b of the heat conducting member 14, the hole 13a of the substrate 13, and the hole 14c of the heat conducting member 14. The screws 17 are screwed into the screw holes 15e of the upper housing 15d, and the main body housing 15 is assembled. At this time, the lower portion 14a of the heat conducting member 14 and the outer heat radiating plate 16 are pressed against each other. Further, the lower housing 15a, the upper housing 15d, the heat conducting member 14, and the substrate 13 are integrated, and the substrate 13 is firmly fixed.
[0023]
In the electronic device 11 having such a configuration, when the semiconductor element 12 generates heat, the heat of the semiconductor element 12 is absorbed by the heat conducting member 14. This heat is conducted from the heat conducting member 14 to the outer heat radiating plate 16 and is radiated from the outer heat radiating plate 16. For this reason, the temperature rise of the semiconductor element 12 can be satisfactorily suppressed without increasing the temperature inside the electronic device 11. Further, since the outer heat radiating plate 16 is affixed to the outer wall surface of the main housing 15, a special occupied space for the outer heat radiating plate 16 is not required, and the electronic device 11 is not increased in size. The increase in cost can be suppressed without giving a burden to the above.
[0024]
FIG. 2 is a cross-sectional view showing an electronic apparatus to which the second embodiment of the heat dissipation device of the present invention is applied. The electronic device 21 is also an AC adapter, for example.
[0025]
In this electronic device 21, the first and second semiconductor elements 22, 23 and the like are mounted on the substrate 24, the metallic first and second heat conducting members 25, 26 are fixed to the substrate 24, and the first and first 2 The semiconductor elements 22 and 23 are brought into contact with the first and second heat conducting members 25 and 26, respectively. Further, the insulating member 27 is bonded to the first and second heat conducting members 25 and 26.
[0026]
And the board | substrate 24 is arrange | positioned inside the lower housing | casing 28a, and the lower side part 25a of the 1st heat conductive member 25 is positioned in the opening part 28b of the lower housing | casing 28a.
[0027]
A recess 28c is provided on the outer wall surface of the lower housing 28a, and a metal first outer heat dissipation plate 31 is attached to the recess 28c, and an exterior plate 32 is attached thereon. The exterior plate 32 is provided with a large number of small holes 32a. In the opening 28b of the lower housing 28a, the lower portion 25a of the first heat conducting member 25 and the first outer heat radiating plate 31 are in contact with each other.
[0028]
Further, the upper housing 28d is covered with the lower housing 28a, and the upper portion 25b of the first heat conducting member 25 is positioned in the opening 28e of the upper housing 28d.
[0029]
A recess 28f is provided on the outer wall surface of the upper housing 28d, and a metal second outer heat dissipation plate 33 is attached to the recess 28f so that the convex portion 33a of the second outer heat dissipation plate 33 is attached to the upper casing. It fits in the opening 28e of the body 28d, and the exterior board 34 is affixed on the 2nd outer side heat sink 33. FIG. The exterior plate 34 is provided with a large number of small holes 34a. In the opening 28e of the upper housing 28d, the upper portion 25b of the first heat conducting member 25 and the convex portion 33a of the second outer heat radiating plate 33 are in contact with each other.
[0030]
Then, the screw 35 is passed through the hole 31a of the first outer heat radiation plate 31, the hole 25c of the first heat conducting member 25, the hole 24a of the substrate 24, and the hole 25d of the first heat conducting member 25, and the screw 35 is passed through the second The main body housing 28 is assembled by screwing into the screw holes 33 b of the outer heat radiation plate 33. At this time, the lower portion 25a of the first heat conducting member 25 and the first outer heat radiating plate 31 are pressed against each other, and the upper portion 25b of the first heat conducting member 25 and the convex portion 33a of the second outer heat radiating plate 33 are formed. They are in pressure contact with each other. Further, the lower casing 28a, the upper casing 28d, the first heat conducting member 25, and the substrate 24 are integrated, and the substrate 24 is firmly fixed.
[0031]
In the electronic device 21 having such a configuration, the heat of the first semiconductor element 22 is absorbed by the first heat conducting member 25 and is transferred from the first heat conducting member 25 to the first and second outer heat radiating plates 31 and 33. The heat is conducted and radiated from the first and second outer heat radiating plates 31 and 33 through the numerous small holes 32a and 34a of the respective exterior plates 32 and 34. The heat of the second semiconductor element 23 is absorbed by the second heat conducting member 26 and is conducted from the second heat conducting member 26 to the first heat conducting member 25 through the insulating member 27, and further to the first heat conducting member. 25 is conducted to the first and second outer heat radiating plates 31 and 33 and is radiated from the first and second outer heat radiating plates 31 and 33 through the numerous small holes 32a and 34a of the respective exterior plates 32 and 34. For this reason, the temperature rise of the first and second semiconductor elements 22 and 23 can be satisfactorily suppressed without increasing the temperature inside the electronic device 21. In addition, since the first and second outer heat radiation plates 31 and 33 are attached to the outer wall surface of the main body housing 28, a special occupation space for each outer heat radiation plate is not required, and the electronic device 21 is increased in size. Without incurring a burden on the substrate 24 and the like, and an increase in cost can be suppressed.
[0032]
Further, since the substrate 24 of the electronic device 21 is sandwiched between the metal first and second outer radiator plates 31 and 33, the substrate 24 can be shielded by the first and second outer radiator plates 31 and 33. it can.
[0033]
In addition, since the respective exterior plates 32 and 34 having a large number of small holes are attached to the first and second outer heat radiation plates 31 and 33, the user directly attaches to the first and second outer heat radiation plates 31 and 33. Even if the first and second outer radiator plates 31 and 33 are heated, the user is not burned. Further, the heat of the first and second outer heat radiating plates 31 and 33 is well radiated through the numerous small holes 32 a and 34 a of the respective exterior plates 32 and 34.
[0034]
In addition, this invention is not limited to said each embodiment, It can deform | transform variously. For example, you may increase the number of a heat conductive member and an outer side heat sink. In addition to the semiconductor element, other various elements may be brought into contact with the heat conducting member. Furthermore, the present invention can be applied not only to an AC adapter but also to other types of electronic devices.
[0035]
【The invention's effect】
As described above, according to the present invention, the heat of the element built in the electronic device is absorbed by the heat conducting member, the heat of the heat conducting member is conducted to the outer heat radiating plate, and this heat is radiated by the outer heat radiating plate. Can do. Thereby, the temperature rise of an element can be suppressed favorably, without accompanying the temperature rise inside an electronic device. In addition, since the outer heat sink is spread on the outer wall surface of the main body casing of the electronic device, a special occupation space for the outer heat sink is not required, and the size of the electronic device is not increased. The increase in cost can be suppressed without burdening the user.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an electronic apparatus to which a first embodiment of a heat dissipation device of the present invention is applied.
FIG. 2 is a cross-sectional view showing an electronic apparatus to which a second embodiment of a heat dissipation device of the present invention is applied.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11, 21 Electronic device 12 Semiconductor element 13, 24 Board | substrate 14 Heat conductive member 15 Main body housing | casing 16 Outer heat sink 17, 35 Screw 22 1st semiconductor element 23 2nd semiconductor element 25 1st heat conductive member 26 2nd heat conductive member 27 Insulating member 28 Main body casing 31 First outer heat radiation plate 32, 34 Exterior plate 33 Second outer heat radiation plate
