JP2005005505A - Multilayered wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To be able to respond to an increase in signal transmission speed within a substrate and to an increase in capacity. <P>SOLUTION: A multilayered wiring board 11 has such a structure that many insulation layers 12 formed of a thermoplastic resin material with a wiring pattern 13 are stacked, with an optical electric circuit 16 embedded within the insulation layers 12. The optical electric circuit 16 is composed of a light emitting device 17, a photo detector 18, and an optical fiber 19 for connecting these components. In manufacturing the multilayered wiring board 11, a thermoplastic resin sheet 21 which will become the insulation layer 12 is formed with the wiring pattern 13 to fabricate a substrate 20. Several such substrates 20 are stacked up and down, with the components 17, 18, and 19 constituting the optical electric circuit 16 being positioned between the substrates 20, and thereafter heat press is carried out. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer wiring board configured by providing a plurality of insulating layers provided with wiring patterns in a laminated state, and a method for manufacturing the same.
[0002]
[Prior art]
In general, in a multilayer wiring board, the connection between mounted elements is realized by a conductor pattern provided in each layer and an interlayer connection portion connecting the layers. The present applicant has developed a manufacturing method in which a sheet made of a thermoplastic resin is used instead of a conventional thermosetting resin such as an epoxy resin as a material constituting the insulating layer of this type of multilayer wiring board. Have been filed earlier (see, for example, Patent Document 1).
[0003]
In this manufacturing method, as schematically shown in FIG. 6, a copper foil is patterned on the surface of a thermoplastic resin sheet 1 serving as an insulating layer to provide a conductor pattern 2, and a via hole 1 a formed in the sheet 1. A step of filling the inside with the conductive paste 3 to form the substrate 4 is executed (a). Then, by laminating a large number of the base materials 4 and hot-pressing them together, the base materials 4 (sheets 1) are fused together, and the conductive paste 3 is cured. A multilayer wiring board 7 having the conductor pattern 2 and the interlayer connection 6 is obtained (b).
[0004]
In addition, there exists the following patent document 2 as another prior art relevant to this invention. In Patent Document 2, in a printed wiring board used for optical communication, an optical connector is attached to an end of the printed wiring board, and a photoelectric conversion element is attached to an opening formed in the printed wiring board. It has been shown that by adopting a configuration that embeds the optical fiber cable that connects between them in the printed wiring board, the mounting range of other components mounted on the printed wiring board is expanded, and damage to the optical fiber cable is prevented. .
[0005]
[Patent Document 1]
JP-A-2002-246718 [0006]
[Patent Document 2]
JP-A-1-292886
[Problems to be solved by the invention]
By the way, in recent years, the functions realized by the multilayer wiring board 7 as described above have become very sophisticated, and the mounted elements can be high-performance CPUs operating at several hundred MHz to several GHz, A large amount of information such as a large-capacity memory is being input / output at high speed. As a result, bus lines and signal lines that connect these elements are also required to have multiple bits, good transmission characteristics, low loss, low noise, etc. There are also ideas about materials and materials.
[0008]
However, in the case where metal wiring is used for the wiring pattern (conductor pattern 2 and interlayer connection portion 6) as in the multilayer wiring board 7 described above, (1) signal delay due to parasitic components such as capacitance between wirings, (2) There are problems such as rounding of signal waveform due to the same factor, (3) loss due to wiring resistance, (4) limit of the number of parallel wirings, and (5) crosstalk between wirings, which cannot be fundamentally solved. . That is, as long as the metal wiring is employed, there is a limit to the speeding up of signal transmission and the increase in capacity, and it is predicted that the board will not be able to cope with the higher performance of the element.
[0009]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a multilayer wiring board capable of dealing with high-speed signal transmission and large capacity in the board, and a method for manufacturing the same.
[0010]
[Means for Solving the Problems]
The multilayer wiring board of the present invention is characterized in that a photoelectric circuit electrically connected to a wiring pattern is provided in a form embedded in an insulating layer (invention of claim 1). According to this, since signal transmission between elements mounted on the substrate can be performed by optical signals, signal transmission can be performed stably at high speed and with low noise. As a result, it is possible to cope with an increase in signal transmission speed and capacity in the substrate. Further, since the photoelectric circuit is embedded in the insulating layer, the surface of the substrate can be effectively used for component mounting or the like, in other words, the substrate can be miniaturized.
[0011]
In this case, the photoelectric circuit can be configured to include a photoelectric conversion element electrically connected to the wiring pattern and an optical fiber connected to the photoelectric conversion element (invention of claim 2). Thereby, for example, an electrical signal of an element mounted on a substrate is converted into an optical signal by a photoelectric conversion element (light emitting element), the optical signal is transmitted through an optical fiber as a waveguide, and another photoelectric conversion element ( The signal can be transmitted through an optical transmission path that is converted again into an electrical signal by the light receiving element).
[0012]
At this time, if the photoelectric circuit further includes an optical function element (the invention of claim 3), a variety of photoelectric circuits (optical transmission path) such as a flexible optical transmission path can be formed. In addition to this, the degree of freedom of arrangement of components of the photoelectric circuit is increased, and advantages such as improved positioning and assembling can be obtained. Examples of the optical functional element include a mirror, a half mirror, a lens, a prism, a diffraction grating, an optical switch, an optical isolator, a polarizing plate, and a liquid crystal module.
[0013]
Further, the photoelectric conversion element may be provided with a wavelength multiplexer or a demultiplexer (invention of claim 4), whereby the optical signal transmission can be multiplexed and the configuration becomes complicated ( A large amount of data can be transmitted in parallel while suppressing an increase in the number of optical fibers.
[0014]
And the manufacturing method of the multilayer wiring board of the present invention includes a base material forming step of forming a base material by providing a wiring pattern on a sheet made of a thermoplastic resin and constituting an insulating layer, and a lamination in which a large number of the base materials are stacked. A process and a hot pressing process that integrates by heating and pressing the laminated substrates together, and in the lamination process, the components constituting the photoelectric circuit are arranged in a positioning state between the substrates Accordingly, the photoelectric circuit electrically connected to the wiring pattern is provided in a form embedded in the insulating layer (invention of claim 5).
[0015]
According to this, when laminating a plurality of base materials mainly composed of a sheet of thermoplastic resin, the process is particularly complicated by arranging the components of the photoelectric circuit between the base materials in a positioned state. In addition, it is possible to easily manufacture a multilayer wiring board provided with a photoelectric circuit embedded in an insulating layer. In addition, by using such a manufacturing method, for example, several tens of layers of a multi-layer substrate can be manufactured at a time, and the productivity is greatly improved, and the dimensional accuracy compared with the case of using a thermosetting resin. Therefore, it is possible to obtain great merits such as high recyclability.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Several embodiments embodying the present invention will be described below with reference to FIGS.
(1) First Embodiment First, a first embodiment of the present invention (corresponding to claims 1, 2, and 5) will be described with reference to FIGS.
[0017]
FIG. 1B schematically shows a multilayer wiring board 11 according to this embodiment. The multilayer wiring board 11 is formed by laminating a large number of insulating layers 12 made of a thermoplastic resin material, which will be described later, and each of the insulating layers 12 is provided with a wiring pattern 13. The wiring pattern 13 is made of, for example, copper foil and includes a surface conductor pattern 14 provided on the surface (upper surface) of the insulating layer 12 and an interlayer connection portion 15 that electrically connects the surface conductor patterns 14 between the layers up and down. Yes. In FIG. 1, for the sake of convenience, the insulating layer 12 is shown in a simplified form of only two layers, but in actuality, the number of layers of the insulating layer 12 is, for example, a multi-layer of ten to several dozen layers. can do.
[0018]
A photoelectric circuit 16 is embedded in the insulating layer 12. As shown in FIG. 1A, in this embodiment, the photoelectric circuit 16 includes a light emitting element 17 and a light receiving element 18 as a pair of photoelectric conversion elements provided on the left and right sides in the figure, and It comprises an optical fiber 19 as a waveguide extending in the left-right direction and connecting between them. In FIG. 1, for convenience, the thickness of the light emitting element 17, the light receiving element 18, and the optical fiber 19 is smaller than the thickness of one layer of the insulating layer 12, but extends across a plurality of layers of the insulating layer 12. It can also be provided.
[0019]
At this time, the light emitting element 17 and the light receiving element 18 are electrically connected to the wiring pattern 13 (interlayer connection portion 15) in the insulating layer 12, respectively. Although not shown, necessary electronic components such as a high-performance CPU and a large-capacity memory are mounted on the surface of the multilayer wiring board 11 (the surface on which the surface conductor pattern 14 is exposed). Thus, a predetermined electronic circuit including the photoelectric circuit 16 is configured.
[0020]
Here, a manufacturing method according to this embodiment for manufacturing the multilayer wiring board 11 having the above-described configuration will be described. In manufacturing the multilayer wiring board 11, a base material forming step for forming the base material 20 as shown in FIG. 2 is first performed. As shown in FIG. 2 (e), the base material 20 is provided with a wiring pattern 13 on a sheet (film) 21 made of a crystal transition type thermoplastic resin that constitutes each insulating layer 12 of the multilayer wiring board 11. Composed.
[0021]
At this time, the wiring pattern 13 provided on the sheet 21 forms the necessary surface conductor pattern 14 on the surface of the sheet 21 and the via holes 21a formed in the important points of the sheet 21 (see FIG. 2C). ) Is filled with a conductive paste 22. The conductive paste 22 in the via hole 21a becomes the interlayer connection portion 15 later.
[0022]
The sheet 21 is made of, for example, a material containing 35 to 65% by weight of polyetheretherketone (PEEK) resin and 35 to 65% by weight of polyetherimide (PEI) resin (trade name “PAL-CLAD”), A rectangular shape corresponding to the size (shape) of the multilayer wiring board 11 having a thickness of, for example, 25 to 75 microns is formed. As shown in FIG. 3, this resin material becomes soft at, for example, around 200 ° C., but becomes hard at a lower temperature or higher temperature (dissolves at a higher temperature (about 400 ° C.)). Further, when the temperature is lowered from a high temperature, it remains hard even at around 200 ° C.
[0023]
FIG. 2 shows a procedure for manufacturing the base material 20. First, as shown to (a), the process which forms the surface conductor pattern 14 by etching with respect to the conductor foil affixed on the surface (upper surface) of the sheet | seat 21 in this case, for example, the copper foil 23 of thickness 18 microns is performed. Is done. As shown in (b), after the surface conductor pattern 14 is formed, a protective film 24 made of, for example, polyethylene naphthalate (PEN) is attached to the back surface (lower surface) of the sheet 21.
[0024]
Next, as shown in (c), a step of forming a bottomed via hole 21a having the surface conductor pattern 14 as a bottom surface at the main part of the sheet 21 is performed, for example, by irradiation with a carbon dioxide laser from the protective film 24 side. . In this case, a hole is not formed in the surface conductor pattern 14 by adjusting the output of the carbon dioxide laser and the irradiation time. In addition to the carbon dioxide laser, an excimer laser or the like can be used for forming the via hole 21a. In addition, mechanical processing such as drilling is possible, but laser processing is desirable for making fine holes.
[0025]
Subsequently, as shown in (d), a step of filling the via hole 21a with the conductive paste 22 is performed. The conductive paste 22 is a paste formed by adding a binder resin or an organic solvent to metal particles such as copper, silver, tin, etc., and is printed in the via hole 21a by screen printing using a metal mask, for example. Filled. After filling with the conductive paste 22, the protective film 24 is peeled off from the sheet 21 as shown in FIG.
[0026]
Now, when the base material 20 for constituting each layer of the multilayer wiring board 11 is formed as described above, next, the plurality of base materials 20 are formed according to the final form of the multilayer wiring board 11. A stacking process for stacking up and down is performed. In this laminating step, as shown in FIG. 1A, a large number (two for convenience in the figure) of base materials 20 are stacked one above the other. In addition, the components constituting the photoelectric circuit 16, that is, the light emitting element 17, the light receiving element 18, and the optical fiber 19 are arranged in a positioning state.
[0027]
At this time, although not shown in detail, the optical fiber 19 is subjected to terminal treatment at both ends, and both ends are inserted into coupling holes formed in the holders of the light emitting element 17 and the light receiving element 18. It can also be made to be combined in a state. The light emitting element 17 and the light receiving element 18 are aligned so that their electrode terminals are in contact with the interlayer connection 15.
[0028]
Further, although not shown in the drawings, a film made of, for example, polyethylene naphthalate (PEN) is formed on the upper surface (exposed surface of the surface conductor pattern 13) of the base material 20 constituting the uppermost layer in FIG. The cover layer which consists of is arranged. As this cover layer, for example, one having an elastic modulus of 1 to 1000 MPa is used. Depending on the thickness of the components constituting the optoelectric circuit 16, the base material 20 (sheet 21) may be provided with a notch hole in advance at a position where these components are arranged.
[0029]
Subsequently, the process of carrying out the hot press of the above-mentioned laminated body collectively is performed. In this hot pressing step, the laminate is set in a vacuum press machine, and is pressed up and down at a pressure of 0.1 to 10 MPa while being heated to 200 to 350 ° C., for example. At this time, the sheet 21 constituting each of the base materials 20 changes in elastic modulus with respect to the temperature as shown in FIG. 3, so that the sheet 21 is pressed in a state where the sheet 21 is once softened by heat. As a result, they are fused to each other and then crystallized (cured) to be integrated. At the same time, the conductive paste 22 in the via hole 21a is cured to form the interlayer connection 15. After this hot pressing step, the cover layer is removed.
[0030]
Thus, as shown in FIG. 1B, the light emitting element 17 and the light receiving element 18 are electrically connected to the wiring pattern 13 and insulated between them with the optical fiber 19 therebetween. Thus, the multilayer wiring substrate 11 having the photoelectric circuit 16 embedded therein is configured. As described above, necessary electronic components such as a high-performance CPU and a large-capacity memory are mounted on the surface of the multilayer wiring board 11.
[0031]
In the multilayer wiring board 11 of the present embodiment configured as described above, signal transmission between mounted electronic components can be performed by an optical signal using the photoelectric circuit 16. In this case, an electric signal of a certain electronic component is converted into an optical signal by the light emitting element 17, the optical signal is transmitted through the optical fiber 19, and the signal is transmitted through an optical transmission path that is converted again into an electric signal by the light receiving element 18. can do.
[0032]
Therefore, unlike the conventional case where an electric signal is transmitted only by metal wiring, (1) signal delay due to parasitic components such as capacitance between wirings, (2) signal waveform rounding due to the same factor, (3) Problems such as loss due to wiring resistance, (4) limit of the number of parallel wirings, and (5) crosstalk between wirings can be solved, and signal transmission can be performed stably at high speed with low noise. As a result, according to the present embodiment, it is possible to cope with an increase in signal transmission speed and capacity in the multilayer wiring board 11. Further, since the photoelectric circuit 16 is embedded in the insulating layer 12, the surface of the multilayer wiring board 11 can be effectively used for component mounting or the like. In other words, the multilayer wiring board 11 can be miniaturized. It is something that can be done.
[0033]
And according to the manufacturing method of the multilayer wiring board 11 of a present Example, when laminating | stacking the base material 20 which made the sheet | seat 21 of a thermoplastic resin the main body, the photoelectric circuit 16 is provided in the predetermined position between the base materials 20. The multilayer wiring board provided with the configuration in which the photoelectric circuit 16 is embedded in the insulating layer 12 simultaneously with the electrical wiring without arranging the components 17 to 19 and performing hot pressing, without particularly complicating the process. 11 can be manufactured easily. In addition, by using such a manufacturing method, for example, several tens of layers of the multilayer wiring board 11 can be manufactured collectively, and the productivity is greatly improved, and compared with the case where a thermosetting resin or ceramic is used. Therefore, it is possible to obtain great merits such as high dimensional accuracy and excellent recyclability.
[0034]
(2) Other Embodiments FIG. 4 shows a second embodiment (corresponding to claim 3) of the present invention. In the second and third embodiments described below, the configuration of the base material 20 and each manufacturing process of the multilayer wiring board are the same as those in the first embodiment. Portions common to the examples are denoted by the same reference numerals, new illustrations and detailed descriptions are omitted, and only different points will be described below.
[0035]
That is, as shown in FIG. 4B, the multilayer wiring board 31 according to the second embodiment of the present invention has a plurality of insulating layers provided with wiring patterns 13 (surface conductor patterns 14 and interlayer connection portions 15). 12 and a photoelectric circuit 32 is embedded in the insulating layer 12.
[0036]
As shown in FIG. 4A, in this embodiment, the photoelectric circuit 32 includes a light emitting element 17 as a photoelectric conversion element provided on the left side in the drawing, and one end (left end) connected to the light emitting element 17. In the figure, the optical fiber 19 extends rightward, a 45 ° mirror 33 as an optical functional element, and a light receiving element 34 as a photoelectric conversion element. The other end (right end) of the optical fiber 19 is connected to the 45 ° mirror 33, and the light receiving element 34 is arranged to overlap the lower surface side of the 45 ° mirror 33.
[0037]
At this time, the light receiving portion of the light receiving element 34 is provided on the upper surface side in the figure, and the 45 ° mirror 33 bends the optical signal transmitted through the optical fiber 19 by 90 ° downward and inputs it to the light receiving element 34. It is like that. Needless to say, the light emitting element 17 and the light receiving element 34 are electrically connected to the wiring pattern 13 (interlayer connection portion 15) in the insulating layer 12, respectively.
[0038]
In manufacturing the multilayer wiring board 31 configured as described above, a plurality of base materials 20 are laminated as shown in FIG. 4A after a base material forming step for forming the base material 20. Although the lamination process is executed, the components constituting the photoelectric circuit 32, that is, the light emitting element 17, the optical fiber 19, the 45 ° mirror 33, and the light receiving element 34 are positioned at predetermined positions between the base materials 20. It is arranged with. Then, a multilayer press substrate 31 having a photoelectric circuit 32 embedded in the insulating layer 12 as shown in FIG. Is constructed.
[0039]
In the multilayer wiring board 31 of the second embodiment, as in the multilayer wiring board 11 of the first embodiment, signal transmission between the mounted electronic components is performed by an optical signal using the photoelectric circuit 32. Since it can be performed, the signal transmission can be stably performed at high speed and with low noise, unlike the conventional case where the electrical signal is transmitted only by the metal wiring. As a result, it is possible to cope with an increase in signal transmission speed and capacity in the multilayer wiring board 31, and a reduction in the size of the multilayer wiring board 31 can be achieved.
[0040]
In this embodiment, since the photoelectric circuit 32 is configured to include the optical functional element (45 ° mirror 33), the variety of photoelectric circuits 32 (optical transmission path) such as a flexible optical transmission path is provided. At the same time, the degree of freedom of arrangement of the components of the photoelectric circuit 32 is increased, and advantages such as improved positioning and assembling can be obtained.
[0041]
In the present embodiment, by providing the 45 ° mirror 33, a general-purpose light receiving element 34 (having a light receiving portion in the surface direction of the element) can be used, and the cost can be reduced. The effect that alignment becomes easy is acquired. In addition to the mirror 33, a half mirror, a lens, a prism, a diffraction grating, an optical switch, an optical isolator, a polarizing plate, a liquid crystal module, and the like can be used as the optical functional element.
[0042]
FIG. 5 schematically shows the configuration of a multilayer wiring board 41 according to a third embodiment (corresponding to claim 4) of the present invention. The multilayer wiring board 41 is configured by laminating a plurality of insulating layers 12 provided with wiring patterns 13 (surface conductor patterns 14 and interlayer connection portions 15), and in the insulating layer 12, a photoelectric circuit 42. Are provided in an embedded form. In this embodiment, the photoelectric circuit 42 includes a wavelength multiplexer (WDM) 43 and a duplexer 44.
[0043]
That is, the wavelength multiplexer 43 is provided extending in the front-rear direction at the left side portion in the figure in the multilayer wiring board 41, and on the left side thereof is a plurality of optical signals (four in the figure for convenience) for outputting slightly different wavelengths. The light emitting element 45, which is a photoelectric conversion element), is provided side by side. One end portion (left end portion) of one optical fiber 46 is connected to the wavelength multiplexer 43 on the front side in the figure.
[0044]
The duplexer 44 is provided to extend in the left-right direction at a portion on the right-hand side in the drawing in the multilayer wiring board 41, and a light receiving element 47 as a photoelectric conversion element is provided on the lower surface side thereof. The other end (right end) of the optical fiber 46 is connected to the duplexer 44. Although not shown, the light receiving element 47 includes a plurality of (in this case, four) light receiving portions 47a arranged side by side.
[0045]
Although not shown or described in detail, the wavelength multiplexer 43 is formed of, for example, a half mirror, and multiplexes optical signals of different wavelengths output from the light emitting elements 45 and outputs the multiplexed signals to the optical fiber 46. It has become.
[0046]
The demultiplexer 44 is, for example, a filter type, and demultiplexes the optical signal (wavelength multiplexed signal) input through the optical fiber 46 by selectively transmitting or reflecting depending on the wavelength, The light receiving element 47 is guided to each light receiving portion 47a. Of course, each of the light emitting element 45 and the light receiving element 47 is electrically connected to the wiring pattern 13 (interlayer connection portion 15) in the insulating layer 12, respectively.
[0047]
In manufacturing the multilayer wiring board 41 configured as described above, in the laminating process of laminating a large number of base materials 20, as shown in FIG. The components 43 to 47 constituting the photoelectric circuit 42 are arranged in a positioning state, and the step of hot pressing the laminate is performed, whereby the photoelectric circuit 42 is changed as shown in FIG. A multilayer wiring board 41 provided in a form embedded in the insulating layer 12 is configured.
[0048]
In the multilayer wiring board 41 of the third embodiment, as in the multilayer wiring board 11 of the first embodiment, signal transmission between the mounted electronic components is performed using an optical circuit 42. Therefore, unlike the conventional case where the electrical signal is transmitted only by the metal wiring, the signal transmission can be stably performed at high speed and with low noise. As a result, it is possible to cope with an increase in signal transmission speed and capacity in the multilayer wiring board 41, and the multilayer wiring board 41 can be reduced in size.
[0049]
In this embodiment, since the optoelectric circuit 42 includes the wavelength multiplexer 43 and the demultiplexer 44, it is possible to multiplex the transmission of the optical signal and to make the configuration complicated (the optical fiber 46). It is possible to transmit a large amount of data in parallel while suppressing an increase in the number of signals, and further increase the speed and capacity of signal transmission.
[0050]
In the above embodiment, a mixture of PEEK resin and PEI resin is used as the crystal transition type thermoplastic resin constituting the insulating layer (base sheet). However, the PEEK resin alone or the PEI resin alone is used. Furthermore, it is also possible to employ those obtained by adding fillers to them, LCP resin (liquid crystal polymer), or the like. In addition, the present invention is not limited to the above-described embodiments. For example, the configuration of the photoelectric circuit can be variously modified, and the insulating layer of the multilayer wiring board of the present invention can be changed. Is not necessarily limited to those made of a thermoplastic resin, and can be implemented with appropriate modifications within a range not departing from the gist.
[Brief description of the drawings]
FIG. 1 shows a first embodiment of the present invention, and is a longitudinal sectional front view schematically showing a state (a) at the time of stacking base materials and a completed multilayer wiring board (b). FIG. 3 is a diagram for explaining a forming process. FIG. 3 is a diagram showing a relationship between a temperature change and an elastic modulus of a thermoplastic resin material. FIG. 4 is a diagram corresponding to FIG. 1 showing a second embodiment of the present invention. FIG. 6 shows a third embodiment of the present invention, and is a schematic plan view (a) showing a state of multilayer wiring board being stacked and a schematic longitudinal front view (b) of the multilayer wiring board.
FIG. 6 is a view corresponding to FIG. 1 showing a conventional example.
In the drawing, 11, 31, 41 are multilayer wiring boards, 12 is an insulating layer, 13 is a wiring pattern, 16, 32, 42 are photoelectric circuits, 17, 45 are light emitting elements (photoelectric conversion elements), 18, 34, 47. Is a light receiving element (photoelectric conversion element), 19 and 46 are optical fibers, 20 is a base material, 21 is a sheet, 33 is a mirror (optical functional element), 43 is a wavelength multiplexer, and 44 is a demultiplexer.

Claims (5)

A multilayer wiring board configured to have a plurality of insulating layers provided with wiring patterns in a laminated state,
A multilayer wiring board comprising a photoelectric circuit electrically connected to the wiring pattern in a form embedded in the insulating layer. 2. The multilayer wiring board according to claim 1, wherein the photoelectric circuit includes a photoelectric conversion element electrically connected to the wiring pattern and an optical fiber connected to the photoelectric conversion element. 3. The multilayer wiring board according to claim 2, wherein the photoelectric circuit further includes an optical functional element. 4. The multilayer wiring board according to claim 2, wherein the photoelectric conversion element includes a wavelength multiplexer and / or a duplexer. A method for producing the multilayer wiring board according to claim 1, comprising:
A base material forming step of forming a base material by providing the wiring pattern on a sheet made of a thermoplastic resin and constituting the insulating layer;
A laminating step of laminating a large number of the base materials;
Including a hot press step of integrating the stacked base materials by heating and pressurizing them together,
In the laminating step, the photoelectric circuit electrically connected to the wiring pattern is embedded in the insulating layer by arranging the components constituting the photoelectric circuit between the base materials in a positioning state. A method of manufacturing a multilayer wiring board, characterized in that the multilayer wiring board is provided in a different form.

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