JP2004533091A5 - - Google Patents
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- Publication number
- JP2004533091A5 JP2004533091A5 JP2002580346A JP2002580346A JP2004533091A5 JP 2004533091 A5 JP2004533091 A5 JP 2004533091A5 JP 2002580346 A JP2002580346 A JP 2002580346A JP 2002580346 A JP2002580346 A JP 2002580346A JP 2004533091 A5 JP2004533091 A5 JP 2004533091A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- finely divided
- dispersed
- inorganic binders
- divided particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 10
- 239000002245 particle Substances 0.000 claims 9
- 239000011230 binding agent Substances 0.000 claims 8
- 239000007788 liquid Substances 0.000 claims 8
- 229910052797 bismuth Inorganic materials 0.000 claims 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 5
- 229910017052 cobalt Inorganic materials 0.000 claims 5
- 239000010941 cobalt Substances 0.000 claims 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 5
- 229910052742 iron Inorganic materials 0.000 claims 5
- 229910052759 nickel Inorganic materials 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 150000002739 metals Chemical class 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- 239000007787 solid Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000010348 incorporation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0108888.9A GB0108888D0 (en) | 2001-04-09 | 2001-04-09 | Conductor composition IV |
| PCT/US2002/010504 WO2002082467A1 (en) | 2001-04-09 | 2002-04-04 | Conductor compositions and the use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004533091A JP2004533091A (ja) | 2004-10-28 |
| JP2004533091A5 true JP2004533091A5 (https=) | 2005-08-18 |
| JP4252315B2 JP4252315B2 (ja) | 2009-04-08 |
Family
ID=9912548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002580346A Expired - Fee Related JP4252315B2 (ja) | 2001-04-09 | 2002-04-04 | 導体組成物およびその使用 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1377985B1 (https=) |
| JP (1) | JP4252315B2 (https=) |
| KR (1) | KR100668548B1 (https=) |
| CN (1) | CN1307650C (https=) |
| DE (1) | DE60229367D1 (https=) |
| GB (1) | GB0108888D0 (https=) |
| TW (1) | TWI317526B (https=) |
| WO (1) | WO2002082467A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0307547D0 (en) | 2003-04-01 | 2003-05-07 | Du Pont | Conductor composition V |
| KR101207363B1 (ko) * | 2009-03-04 | 2012-12-04 | 엘에스전선 주식회사 | 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물 |
| KR101246750B1 (ko) * | 2009-03-27 | 2013-03-26 | 엘에스전선 주식회사 | 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물 |
| TW201115592A (en) * | 2009-06-19 | 2011-05-01 | Du Pont | Glass compositions used in conductors for photovoltaic cells |
| JP2014201683A (ja) * | 2013-04-05 | 2014-10-27 | ｎ−ｔｅｃｈ株式会社 | 融雪塗料およびこれを利用した施工方法、融雪システム |
| KR102805717B1 (ko) * | 2020-01-08 | 2025-05-13 | 나믹스 가부시끼가이샤 | 저항체 페이스트, 소성체 및 전기 제품 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IE52134B1 (en) * | 1980-07-31 | 1987-07-08 | Du Pont | Thick film conductor compositions |
| US4510179A (en) * | 1981-08-18 | 1985-04-09 | Matsushita Electric Industrial Co., Ltd. | Electrode on heat-resisting and isolating substrate and the manufacturing process for it |
| JPH08134388A (ja) * | 1994-11-14 | 1996-05-28 | Matsushita Electric Ind Co Ltd | 導電性インキ |
| JP2001028290A (ja) * | 1999-05-07 | 2001-01-30 | Ibiden Co Ltd | ホットプレート及び導体ペースト |
-
2001
- 2001-04-09 GB GBGB0108888.9A patent/GB0108888D0/en not_active Ceased
-
2002
- 2002-04-04 DE DE60229367T patent/DE60229367D1/de not_active Expired - Lifetime
- 2002-04-04 CN CNB028076281A patent/CN1307650C/zh not_active Expired - Fee Related
- 2002-04-04 KR KR1020037013230A patent/KR100668548B1/ko not_active Expired - Fee Related
- 2002-04-04 EP EP02717762A patent/EP1377985B1/en not_active Expired - Lifetime
- 2002-04-04 WO PCT/US2002/010504 patent/WO2002082467A1/en not_active Ceased
- 2002-04-04 JP JP2002580346A patent/JP4252315B2/ja not_active Expired - Fee Related
- 2002-04-09 TW TW091107085A patent/TWI317526B/zh not_active IP Right Cessation
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