JP2004522598A5 - - Google Patents

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Publication number
JP2004522598A5
JP2004522598A5 JP2002564089A JP2002564089A JP2004522598A5 JP 2004522598 A5 JP2004522598 A5 JP 2004522598A5 JP 2002564089 A JP2002564089 A JP 2002564089A JP 2002564089 A JP2002564089 A JP 2002564089A JP 2004522598 A5 JP2004522598 A5 JP 2004522598A5
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JP
Japan
Prior art keywords
discharge path
abrasive disc
end point
main body
point detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002564089A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004522598A (ja
JP4369122B2 (ja
Filing date
Publication date
Priority claimed from US09/788,082 external-priority patent/US6623331B2/en
Application filed filed Critical
Publication of JP2004522598A publication Critical patent/JP2004522598A/ja
Publication of JP2004522598A5 publication Critical patent/JP2004522598A5/ja
Application granted granted Critical
Publication of JP4369122B2 publication Critical patent/JP4369122B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002564089A 2001-02-16 2002-02-05 研磨パッド及び研磨パッド製造方法 Expired - Fee Related JP4369122B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/788,082 US6623331B2 (en) 2001-02-16 2001-02-16 Polishing disk with end-point detection port
PCT/US2002/004587 WO2002064315A1 (en) 2001-02-16 2002-02-05 Polishing disk with end-point detection port

Publications (3)

Publication Number Publication Date
JP2004522598A JP2004522598A (ja) 2004-07-29
JP2004522598A5 true JP2004522598A5 (enExample) 2005-12-22
JP4369122B2 JP4369122B2 (ja) 2009-11-18

Family

ID=25143403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002564089A Expired - Fee Related JP4369122B2 (ja) 2001-02-16 2002-02-05 研磨パッド及び研磨パッド製造方法

Country Status (8)

Country Link
US (1) US6623331B2 (enExample)
EP (1) EP1368157B1 (enExample)
JP (1) JP4369122B2 (enExample)
CN (1) CN100503168C (enExample)
AU (1) AU2002306506A1 (enExample)
DE (1) DE60201515T2 (enExample)
TW (1) TWI222389B (enExample)
WO (1) WO2002064315A1 (enExample)

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US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
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US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102441839B (zh) * 2011-11-11 2014-06-04 上海华力微电子有限公司 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法
US20140120802A1 (en) * 2012-10-31 2014-05-01 Wayne O. Duescher Abrasive platen wafer surface optical monitoring system
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
JP7162465B2 (ja) 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法

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