JP2004511108A5 - - Google Patents

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Publication number
JP2004511108A5
JP2004511108A5 JP2002534038A JP2002534038A JP2004511108A5 JP 2004511108 A5 JP2004511108 A5 JP 2004511108A5 JP 2002534038 A JP2002534038 A JP 2002534038A JP 2002534038 A JP2002534038 A JP 2002534038A JP 2004511108 A5 JP2004511108 A5 JP 2004511108A5
Authority
JP
Japan
Prior art keywords
polishing pad
region
filler
light
matrix polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002534038A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004511108A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/029398 external-priority patent/WO2002030617A1/en
Publication of JP2004511108A publication Critical patent/JP2004511108A/ja
Publication of JP2004511108A5 publication Critical patent/JP2004511108A5/ja
Pending legal-status Critical Current

Links

JP2002534038A 2000-10-06 2001-09-20 充填材入り透光性領域を含む研磨パッド Pending JP2004511108A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23886200P 2000-10-06 2000-10-06
PCT/US2001/029398 WO2002030617A1 (en) 2000-10-06 2001-09-20 Polishing pad comprising a filled translucent region

Publications (2)

Publication Number Publication Date
JP2004511108A JP2004511108A (ja) 2004-04-08
JP2004511108A5 true JP2004511108A5 (enExample) 2005-04-28

Family

ID=22899630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002534038A Pending JP2004511108A (ja) 2000-10-06 2001-09-20 充填材入り透光性領域を含む研磨パッド

Country Status (7)

Country Link
US (1) US6537134B2 (enExample)
EP (1) EP1324858A1 (enExample)
JP (1) JP2004511108A (enExample)
CN (1) CN1468162A (enExample)
AU (1) AU2001291143A1 (enExample)
TW (1) TW531467B (enExample)
WO (1) WO2002030617A1 (enExample)

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US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
WO2002070200A1 (en) * 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US7059936B2 (en) * 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
US20070294090A1 (en) * 2006-06-20 2007-12-20 Xerox Corporation Automated repair analysis using a bundled rule-based system
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US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad

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