JP2004504951A5 - - Google Patents

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Publication number
JP2004504951A5
JP2004504951A5 JP2002516816A JP2002516816A JP2004504951A5 JP 2004504951 A5 JP2004504951 A5 JP 2004504951A5 JP 2002516816 A JP2002516816 A JP 2002516816A JP 2002516816 A JP2002516816 A JP 2002516816A JP 2004504951 A5 JP2004504951 A5 JP 2004504951A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002516816A
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JP2004504951A (ja
Filing date
Publication date
Priority claimed from US09/629,684 external-priority patent/US6630367B1/en
Application filed filed Critical
Publication of JP2004504951A publication Critical patent/JP2004504951A/ja
Publication of JP2004504951A5 publication Critical patent/JP2004504951A5/ja
Pending legal-status Critical Current

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JP2002516816A 2000-08-01 2001-07-27 マイクロ・エレクトロ・メカニカル・センサ及びその製造方法 Pending JP2004504951A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/629,684 US6630367B1 (en) 2000-08-01 2000-08-01 Single crystal dual wafer, tunneling sensor and a method of making same
PCT/US2001/023797 WO2002011188A2 (en) 2000-08-01 2001-07-27 A mem sensor and a method of making same

Publications (2)

Publication Number Publication Date
JP2004504951A JP2004504951A (ja) 2004-02-19
JP2004504951A5 true JP2004504951A5 (ja) 2008-09-11

Family

ID=24524052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002516816A Pending JP2004504951A (ja) 2000-08-01 2001-07-27 マイクロ・エレクトロ・メカニカル・センサ及びその製造方法

Country Status (6)

Country Link
US (2) US6630367B1 (ja)
EP (1) EP1305640A2 (ja)
JP (1) JP2004504951A (ja)
AU (1) AU2001278067A1 (ja)
TW (1) TW504488B (ja)
WO (1) WO2002011188A2 (ja)

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US7068417B2 (en) * 2004-07-28 2006-06-27 Miradia Inc. Method and apparatus for a reflective spatial light modulator with a flexible pedestal
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US7298539B2 (en) * 2005-06-01 2007-11-20 Miradia Inc. Co-planar surface and torsion device mirror structure and method of manufacture for optical displays
US7202989B2 (en) 2005-06-01 2007-04-10 Miradia Inc. Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate
US7184195B2 (en) 2005-06-15 2007-02-27 Miradia Inc. Method and structure reducing parasitic influences of deflection devices in an integrated spatial light modulator
US7190508B2 (en) 2005-06-15 2007-03-13 Miradia Inc. Method and structure of patterning landing pad structures for spatial light modulators
US7382513B2 (en) * 2005-10-13 2008-06-03 Miradia Inc. Spatial light modulator with multi-layer landing structures
US7502158B2 (en) 2005-10-13 2009-03-10 Miradia Inc. Method and structure for high fill factor spatial light modulator with integrated spacer layer
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US8916407B1 (en) 2012-03-29 2014-12-23 Sitime Corporation MEMS device and method of manufacturing same
US10160638B2 (en) * 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US9038269B2 (en) * 2013-04-02 2015-05-26 Xerox Corporation Printhead with nanotips for nanoscale printing and manufacturing
US10145739B2 (en) 2014-04-03 2018-12-04 Oto Photonics Inc. Waveguide sheet, fabrication method thereof and spectrometer using the same
US11078075B2 (en) * 2015-12-31 2021-08-03 Taiwan Semiconductor Manufacturing Company Ltd. Packaging method and associated packaging structure
US10850976B2 (en) * 2018-09-21 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method of making ohmic contact on low doped bulk silicon for optical alignment

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