JP2004500692A5 - - Google Patents
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- Publication number
- JP2004500692A5 JP2004500692A5 JP2000512246A JP2000512246A JP2004500692A5 JP 2004500692 A5 JP2004500692 A5 JP 2004500692A5 JP 2000512246 A JP2000512246 A JP 2000512246A JP 2000512246 A JP2000512246 A JP 2000512246A JP 2004500692 A5 JP2004500692 A5 JP 2004500692A5
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- transfer device
- core material
- binder
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011162 core material Substances 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- -1 copper-tungsten Chemical compound 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium(0) Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000374 eutectic mixture Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5958697P | 1997-09-19 | 1997-09-19 | |
| US09/154,253 US6131651A (en) | 1998-09-16 | 1998-09-16 | Flexible heat transfer device and method |
| PCT/US1998/019601 WO1999014805A1 (en) | 1997-09-19 | 1998-09-21 | Flexible heat transfer device and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004500692A JP2004500692A (ja) | 2004-01-08 |
| JP2004500692A5 true JP2004500692A5 (de) | 2005-10-27 |
| JP4051402B2 JP4051402B2 (ja) | 2008-02-27 |
Family
ID=30447824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000512246A Expired - Lifetime JP4051402B2 (ja) | 1997-09-19 | 1998-09-21 | 可撓性を有する伝熱装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4051402B2 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
| US8085531B2 (en) * | 2009-07-14 | 2011-12-27 | Specialty Minerals (Michigan) Inc. | Anisotropic thermal conduction element and manufacturing method |
| JP5361852B2 (ja) * | 2010-12-17 | 2013-12-04 | 株式会社カネカ | フィルム状グラファイトとその製造方法 |
| US10347559B2 (en) * | 2011-03-16 | 2019-07-09 | Momentive Performance Materials Inc. | High thermal conductivity/low coefficient of thermal expansion composites |
| JP5938577B2 (ja) * | 2012-04-19 | 2016-06-22 | パナソニックＩｐマネジメント株式会社 | 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体 |
| JP2016198937A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社デンソー | 炭素材料層含有複合材料および熱交換器 |
| JP6738193B2 (ja) * | 2016-05-09 | 2020-08-12 | 昭和電工株式会社 | 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース |
| KR101743022B1 (ko) | 2016-10-31 | 2017-06-02 | 신화인터텍 주식회사 | 방열 시트 및 그 제조 방법 |
-
1998
- 1998-09-21 JP JP2000512246A patent/JP4051402B2/ja not_active Expired - Lifetime
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