JP2004363176A5 - - Google Patents
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- Publication number
- JP2004363176A5 JP2004363176A5 JP2003156847A JP2003156847A JP2004363176A5 JP 2004363176 A5 JP2004363176 A5 JP 2004363176A5 JP 2003156847 A JP2003156847 A JP 2003156847A JP 2003156847 A JP2003156847 A JP 2003156847A JP 2004363176 A5 JP2004363176 A5 JP 2004363176A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003156847A JP3994923B2 (ja) | 2003-06-02 | 2003-06-02 | 半導体装置の製造方法 |
| US10/853,285 US7390733B2 (en) | 2003-06-02 | 2004-05-26 | Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003156847A JP3994923B2 (ja) | 2003-06-02 | 2003-06-02 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004363176A JP2004363176A (ja) | 2004-12-24 |
| JP2004363176A5 true JP2004363176A5 (ja) | 2005-11-04 |
| JP3994923B2 JP3994923B2 (ja) | 2007-10-24 |
Family
ID=33562183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003156847A Expired - Fee Related JP3994923B2 (ja) | 2003-06-02 | 2003-06-02 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7390733B2 (ja) |
| JP (1) | JP3994923B2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2928491A1 (fr) * | 2008-03-06 | 2009-09-11 | Commissariat Energie Atomique | Procede et dispositif de fabrication d'un assemblage d'au moins deux puces microelectroniques |
| JP2010040875A (ja) * | 2008-08-06 | 2010-02-18 | Sharp Corp | 半導体集積回路、プローブカード及び半導体集積回路の試験方法 |
| US8766439B2 (en) * | 2009-12-10 | 2014-07-01 | International Business Machines Corporation | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360036A (ja) | 1989-07-27 | 1991-03-15 | Oki Electric Ind Co Ltd | バンプの形成方法 |
| AU6015596A (en) | 1995-06-13 | 1997-01-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, wiring board for mounting semiconducto r and method of production of semiconductor device |
| JPH10308415A (ja) | 1997-03-06 | 1998-11-17 | Toshiba Corp | 電極、電子部品、電子装置および電子部品の実装方法 |
| JPH11312711A (ja) * | 1998-04-30 | 1999-11-09 | Murata Mfg Co Ltd | 電子部品の接続方法 |
| JP2002261111A (ja) * | 2001-03-06 | 2002-09-13 | Texas Instr Japan Ltd | 半導体装置及びバンプ形成方法 |
| JP3872319B2 (ja) * | 2001-08-21 | 2007-01-24 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
| JP4047065B2 (ja) | 2002-05-17 | 2008-02-13 | 株式会社タムラ製作所 | 半導体装置用パット電極部の形成方法 |
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2003
- 2003-06-02 JP JP2003156847A patent/JP3994923B2/ja not_active Expired - Fee Related
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2004
- 2004-05-26 US US10/853,285 patent/US7390733B2/en not_active Expired - Fee Related