JP2004351349A - Die head for coating and coating apparatus and production method of die head for coating - Google Patents

Die head for coating and coating apparatus and production method of die head for coating Download PDF

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JP2004351349A
JP2004351349A JP2003153599A JP2003153599A JP2004351349A JP 2004351349 A JP2004351349 A JP 2004351349A JP 2003153599 A JP2003153599 A JP 2003153599A JP 2003153599 A JP2003153599 A JP 2003153599A JP 2004351349 A JP2004351349 A JP 2004351349A
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Japan
Prior art keywords
coating
die head
lip portion
liquid
coating die
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JP2003153599A
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JP4601918B2 (en
Inventor
Takeaki Tsuda
武明 津田
Hiroshi Yoshiba
洋 吉羽
Takashi Aoki
孝 青木
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2003153599A priority Critical patent/JP4601918B2/en
Priority to CNB038171260A priority patent/CN100430151C/en
Priority to TW092119694A priority patent/TWI277460B/en
Priority to PCT/JP2003/009204 priority patent/WO2004009248A1/en
Priority to KR1020047007007A priority patent/KR100997572B1/en
Priority to US10/494,893 priority patent/US7160390B2/en
Publication of JP2004351349A publication Critical patent/JP2004351349A/en
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Publication of JP4601918B2 publication Critical patent/JP4601918B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To suppress a membrane thickness defect area and non-uniformity of coating thickness at a start end of coating to be very small and enable to carry out high precision coating which is required at the time of manufacturing a liquid crystal color filter. <P>SOLUTION: In a die head for coating for discharging a coating liquid while moving relative to a substrate and applying the coating liquid to the substrate surface, the die head for coating is so constituted to suppress a membrane thickness defect area at a start end of coating to be very small, to suppress non-uniformity of coating thickness to be very short and to enable to carry out a high precision coating which is required at the time of manufacturing a liquid crystal color filter by applying a mirror plane grinding process on a lip part surface, making the contact angle with the coating liquid on a tip end side surface larger than that of the lip part with the coating liquid. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、ガラス板などの平板状の基板に対して、ダイヘッドを用いて塗布液を高精度で塗布する技術に関する。
【0002】
【従来の技術】
従来、液晶用カラーフィルタの製造工程において、ガラス板などの基板に対して、R、G、Bなどの着色層の形成、或いはアクリルなどの表面保護層や樹脂製のブラックマトリックス(遮光層)形成のために、液状のレジストを塗布することが行なわれている。これらのレジストの塗布に当たっては高精度塗布が必要であることから、通常、基板表面に過剰量の液滴を供給し、基板を高速回転させて薄く均一に拡げるスピン方式が用いられている。しかし、この方法では供給したレジストの大半が周囲に飛散してしまうため、レジストの消費量が多くなり、コスト高となるという問題があった。また、図9に示すように、基板2をチャック台5に保持させ、その基板2の表面に塗工用ダイヘッド1の先端を近接配置し、基板2をダイヘッド1に対して相対的に移動させながらダイヘッド1から液状のレジストを吐出し、基板表面にレジストを塗布して塗布層4を形成し、その後直ちに、基板2を高速回転させて塗布層4の厚さを均一にする方法も知られている。しかしながら、この方法では、ダイヘッドによる塗布工程と、その後のスピン工程の2工程が必要となるため、やはりコスト高となるという問題があった。そこで、これらに代わる方法として、特許文献1のようなダイヘッド1による塗布工程のみで、塗布層4の厚さを均一にする方法も知られている。ここで、液晶用カラーフィルタの製造時の仕様において、塗布層4の膜厚が均一化するまでの膜厚不良域を、塗布開始端部4aから塗布方向に5mm以内に抑えることが要求されてきている。ところが、ダイヘッド1による塗布では、膜厚不良域を塗布開始端部4aから塗布方向に5mm以内に抑えることが難しく問題となっていた。
【0003】
次に、ダイヘッド1による塗布における塗布開始端部4aでの膜厚不良域の発生原因を説明する。ダイヘッド1は、図10に示すように、塗布すべきレジスト(塗布液という)を吐出するスリット11と、スリット11の先端両側にスリット11にほぼ直角に形成されたリップ部12と、リップ部12の外側に位置し、リップ部12に対して傾斜した先端側面13とを有しており、塗布時には、リップ部12と基板2との間に塗布液の溜まり(ビード)3を形成し、そのビード3の塗布液を基板2の表面に塗布している。塗布開始時に、このスリット11から吐出される塗布液がリップ部12の塗布幅方向に移動してビード3を形成する。その形成時間が短ければ、塗布開始端部での膜厚が均一化するまでの膜厚不良域が短くなる。ところが、実際には、リップ部12表面の最終仕上における研磨に関しては、研磨機の性能ないし手作業に委ねられており、表面粗さが大きく、表面の凹凸により、リップ部12の塗布液に対する接触角が局部的に変化して、塗布液の移動を阻害する。そして、塗布液が塗布幅方向に移動しにくくなり、ビード3の形成時間が長くなると、ビード3を形成するための塗布液量(初期ビード量)を多く必要とするため、塗布開始端部にて膜厚が厚くなり、塗布開始端部での膜厚が均一化するまでの膜厚不良域が長くなってしまった。
【0004】
また、ダイヘッド1による塗布では、下記するように、塗布層4にすじ41や段むら42を生じ、塗布厚のむらを許容範囲内に抑えることができない。ここで、ダイヘッド1による塗布における塗布厚のむらの発生原因を説明する。図10において、塗布中、ビード3が安定し、一定の形状を保っておれば、すなわち、ビード3の最外部の液がダイヘッド1から離れる点A、Bが、ダイヘッド1のリップ部12と先端側面13との境界線(エッジ部)上に保持されておれば、塗布層4の厚さむらはほとんど発生しない。ところが、実際には、ビード3の最外部の液がダイヘッド1から離れる点A、Bが、ダイヘッド1のエッジ部に保持されず、矢印Cで示すようにリップ部12から先端側面13に回り込み、先端側面13上を移動するとか、矢印Dで示すように、リップ部12で移動することが多く、ビード3が不安定に変化することが多い。そして、点A、Bの移動がダイヘッド1の幅方向に局部的に生じると、基板の移動方向に延びるすじ41(図9参照)を生じ、全幅に渡って全体的に生じると、基板の横方向に延びる段むら42を生じていた。
【0005】
そこで、ビード3の最外部の液がダイヘッド1から離れる点A、Bを一定位置に保持してビード3を安定させるため、図11に示すように、リップ部12の外側の端部に鋭角状のエッジ18を形成したダイヘッド1Aが知られている。しかしながら、この構成のダイヘッド1Aは、図10に示すダイヘッド1に比べては、ビード3を或る程度安定させることができるが、ビード3の最外部の液がダイヘッド1Aから離れる点A、Bの不安定な移動を十分には抑制できず、このため、すじや段むらは多少減る程度であって、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことはできなかった。
【0006】
【特許文献1】
特許第3201195号公報
【0007】
【発明が解決しようとする課題】
本発明はかかる状況に鑑みてなされたもので、塗布開始端部での膜厚不良域および塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供することを課題とする。
【0008】
【課題を解決するための手段】
上記課題は下記の本発明によって解決される。すなわち、
本発明の請求項1に係る塗工用ダイヘッドは、基板に対して相対的に移動しながら塗布液を吐出し、前記基板表面に塗布する塗工用ダイヘッドであって、塗布液を吐出するスリットと、前記スリットの先端両側に前記スリットにほぼ直角に形成されたリップ部と、前記リップ部の外側に位置し、前記リップ部に対して傾斜した先端側面とを有する塗工用ダイヘッドにおいて、前記リップ部の表面粗さをRmax0.3S以下としたものである。本発明によれば、前記リップ部の表面粗さが小さくなり、前記リップ部の塗布液に対する接触角の局部的な変化が小さくなることで、塗布液が塗布幅方向に移動し易くなり、ビードの形成時間を短くすることができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供する。
【0009】
また本発明の請求項2に係る塗工用ダイヘッドは、請求項1に係る塗工用ダイヘッドにおいて、前記リップ部の表面に鏡面研削加工を施したものである。
【0010】
また本発明の請求項3に係る塗工用ダイヘッドは、請求項2に係る塗工用ダイヘッドにおいて、前記鏡面研削加工が電解インプロセスドレッシング研削加工(ELID研削加工)としたものである。
【0011】
また本発明の請求項4に係る塗工用ダイヘッドは、請求項1から3のいずれか1項に係る塗工用ダイヘッドにおいて、前期先端側面の塗布液に対する接触角を、前記リップ部の塗布液に対する接触角よりも大きくしたものである。本発明によれば、ビードの最外部の液がダイヘッドから離れる点を、先端側面とリップ部との境界線であるエッジ部に保持することができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供する。
【0012】
また本発明の請求項5に係る塗工用ダイヘッドは、請求項4に係る塗工用ダイヘッドにおいて、前期先端側面にフッ素樹脂を1〜10%含有した無電解ニッケルメッキ処理を施したものである。
【0013】
また本発明の請求項6に係る塗工用ダイヘッドは、請求項1から5に係る塗工用ダイヘッドにおいて、前記先端側面の表面粗さとリップ部の表面粗さとを互いに異ならせたものである。本発明によれば、ビードの最外部の液がダイヘッドから離れる点を、先端側面とリップ部との境界線であるエッジ部に保持することができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供する。
【0014】
また本発明の請求項7に係る塗工用ダイヘッドは、請求項1から6のいずれかに係る塗工用ダイヘッドにおいて、前記先端側面とリップ部との境界線の真直度及び前記スリットに対する平行度を、2μm/m以下としたものである。本発明によれば、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制すると共に、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供する。
【0015】
また本発明の請求項8に係る塗工用ダイヘッドは、請求項4から7のいずれかに係る塗工用ダイヘッドにおいて、前記先端側面及びリップ部の境界領域における接触角の大きい領域と小さい領域との境界線と、前記先端側面とリップ部との境界線とのずれを、2μm以下としたものである。本発明によれば、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドを提供する。
【0016】
また本発明の請求項9に係る塗工装置は、請求項1から8のいずれかに係る塗工用ダイヘッドと、前記塗工用ダイヘッドが吐出する塗布液を基板表面に塗布するよう、前記塗工用ダイヘッドの先端を前記基板に近接させた状態で前記塗工用ダイヘッドと基板とを相対的に移動させる手段とを備えたものである。本発明によれば、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗布開始端部での膜厚不良域を極めて短く抑制すると共に、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工装置を提供する。
【0017】
また本発明の請求項10に係る塗工用ダイヘッドの製造方法は、基板に対して相対的に移動しながら塗布液を吐出し、前記基板表面に塗布する塗工用ダイヘッドであって、塗布液を吐出するスリットと、前記スリットの先端両側に前記スリットにほぼ直角に形成されたリップ部と、前記リップ部の外側に位置し、前記リップ部に対して傾斜した先端側面とを有する塗工用ダイヘッドの製造方法において、前記リップ部の表面粗さをRmax0.3S以下としたものである。本発明によれば、前記リップ部の表面粗さが小さくなり、前記リップ部の塗布液に対する接触角の局部的な変化が小さくなることで、塗布液が塗布幅方向に移動し易くなり、ビードの形成時間を短くすることができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことを可能とする塗工用ダイヘッドの製造方法を提供する。
【0018】
また本発明の請求項11に係る塗工用ダイヘッドの製造方法は、請求項10に係る塗工用ダイヘッドの製造方法において、前記リップ部の表面に鏡面研削加工を施したものである。
【0019】
なお、本発明の塗工用ダイヘッド並びに塗工装置は、液晶用カラーフィルタ製造用途以外の塗布に用いても良いことは言うまでもない。
【0020】
【発明の実施の形態】
以下、図面を参照して、本発明の実施の形態について、さらに詳しく説明する。
図1は、本発明の一実施の形態に係る塗工用ダイヘッド1を示す概略斜視図及びその一部の拡大断面図である。図2はそのダイヘッド1の先端部を拡大して示す概略斜視図である。
【0021】
この実施形態のダイヘッド1も従来のものと同様に、塗布すべき塗布液を吐出するスリット11と、その先端両側に前記スリット11にほぼ直角に形成されたリップ部12と、その外側に位置し、リップ部12に対して傾斜した先端側面13とを有している。このダイヘッド1は、全体がステンレス鋼によって形成されている。リップ部12の幅dは、通常0.03mm〜0.1mm程度に設定されている。また、リップ部12は、ダイヘッド1の母材をそのまま露出させた形態であり、表面の研磨方法としてELID研削加工にて、表面粗さRmax0.05S以下で仕上げている。ここで、表面粗さRmaxはJIS B0601に準拠し、対象面全域における最大高さと定義する。なお、その測定方法としては、JIS B0601に準拠した蝕針式測定方法とする。一方、先端側面13は、その上に塗布液に対して濡れ性の悪い材料をメッキ或いはコーティングして表面層14を形成している。従って、先端側面13は、塗布液に対して濡れ性の悪い(接触角の大きい)表面となっている。ここで、表面層14の形成には、フッ素樹脂を1〜10%含有した無電解ニッケルメッキ処理を施している。塗布液として、液晶用カラーフィルタの製造に用いる液状のレジストを用いる場合、リップ部12の塗布液に対する接触角が7〜10度程度であり、表面層14の形成にフッ素樹脂を1〜10%含有した無電解ニッケルメッキ処理を施すと、接触角が55度程度となり、40度以上の差を確保できる。フッ素樹脂の含有率が10%以内であれば、母材そのものの硬度(ロックウェル硬さHRC45〜55)と同程度であり、リップ部12の表面の耐磨耗性を維持できる。なお、フッ素樹脂の含有率が1%より少ないと、リップ部12の塗布液に対する接触角が小さくなる。また、フッ素樹脂の含有率が10%より多いと、リップ部12の表面の耐磨耗性を維持できなくなる。なお、表面層14を形成する領域は、少なくとも、塗布時に塗布液が回り込む恐れのある領域とすればよい。
【0022】
図2に示すように、先端側面13に形成する表面層14は、リップ部12と表面層14との境界線に一致する位置まで正確に形成されている。更に、リップ部12と先端側面13の表面層14との境界線15は直線状に形成されると共に、その境界線15の真直度及びスリット11に対する平行度は、2μm/m以下となるように作られている。ここで、表面層14を、リップ部12と表面層14との境界線に一致する位置まで正確に形成し、且つ境界線15の真直度及びスリット11に対する平行度を2μm/m以下とするには、図3(a)に示すように、ダイヘッド1の先端側面13のみならず、リップ部12にもメッキ、コーティング等によって表面層14を形成し、その後、図3(b)に示すように、リップ部12を研磨して、その部分の表面層14を除去し、且つ境界線15を所望の真直度となるようにすればよい。なお、境界線15の真直度は、JIS B0601に準拠した蝕針式測定方法により測定する。
【0023】
このダイヘッド1を用いて塗布を行うには、図4に示すように、チャック台(図示せず)に保持された基板2の表面にダイヘッド1の先端を近接配置し、基板2をダイヘッド1に対して移動させながらダイヘッド1から塗布液を吐出し、リップ部12と基板2との間にビード3を形成し、そのビード3の塗布液を基板2の表面に塗布する。ここで、図5はダイヘッド1から塗布液が吐出している状態を示す概略斜視図である。図5(b)に示すように、ダイヘッド1のリップ部12の表面を従来の遊離砥粒にて研磨した場合には、表面粗さが大きくなり、リップ部12の塗布液に対する接触角の局部的な変化が大きくなるので、塗布液が塗布幅方向に移動しにくくなり、ビード3aの形成時間が長くなる。このため、図6(a)に示すように、ビード3aを形成するための塗布液量(初期ビード量)が多くなり、基板2上に形成される塗布層は、塗工開始端部での膜厚が厚く、塗工開始端部での膜厚が均一化するまでの膜厚不良域が長くなる。そこで、図5(c)に示すように、ダイヘッド1のリップ部12の表面をELID研削加工にて研磨することにより、表面粗さが小さくなる。従って、リップ部12の塗布液に対する接触角の局部的な変化が小さくなるので、塗布液が塗布幅方向に移動し易くなり、ビード3bの形成時間を短くすることができる。このため、図6(b)に示すように、ビード3bを形成するための初期ビード量を極めて少なく抑制し、基板2上に形成される塗布層4には、塗工開始端部での膜厚が均一化するまでの膜厚不良域が極めて短い(例えば、5mm以内の)塗布層4を形成できる。このため、液晶用カラーフィルタの製造におけるレジスト塗布に用いることにより、液晶用カラーフィルタの製造時に要求される塗布精度(例えば、塗工開始端部での膜厚不良域が5mm以内)の塗工を行うことができる。
【0024】
なお、ELID研削加工にて研磨することによる表面粗さはRmax0.2S以下であり、リップ部12に鏡面性を持たせ、リップ部12の塗布液に対する接触角の局部的な変化を小さくさせ、塗布液を塗布幅方向に移動し易くし、ビード3の形成時間を短くする上では、表面粗さをRmax0.1Sとするのが好ましく、更には表面粗さをRmax0.05Sとするのがより好ましい。
【0025】
また、ダイヘッド1の先端側面13を、ビード3が接触しているリップ部12よりも、塗布液に対する接触角が大きくなるように、従って塗布液に対する濡れ性が悪くなるようにしているので、塗布中、ビード3の最外部の液がダイヘッドから離れる点A、Bは、濡れ性の良いリップ部12と濡れ性の悪い先端側面13との境界線であるエッジ部に保持され、ほとんど変動しない。このため、塗布中、ビード3が安定しており、基板2上に形成される塗布層4には、従来生じていたすじや段むらがほとんど発生せず、極めて厚さむらの小さい(例えば、厚さの±1.5%以内の)塗布層4を形成できる。このため、液晶用カラーフィルタの製造におけるレジスト塗布に用いることにより、液晶用カラーフィルタの製造時に要求される塗布精度(例えば、厚さむらが厚さの±1.5%以内)の塗工を行うことができる。
【0026】
なお、上記した実施の形態では、ダイヘッド1のリップ部12は母材のままの表面とし、先端側面13に塗布液に対する濡れ性の悪い(接触角の大きい)表面層14をメッキ、コーティング等の表面処理により形成し、リップ部12よりも接触角を大きくなるようにしているが、本発明はリップ部12及び先端側面13の接触角を変更する方法として、この構成に限らない。例えば、図7に示すように、リップ部12を形成する部分と先端側面13を形成する部分とを別部材で形成し、その表面材質を異ならせることや、または、図8に示すように、全体を同一材料で構成するが、リップ部12の表面粗さを大きくして塗布液に対して濡れ易くし(接触角を小さくし)、先端側面13の表面粗さを小さくして塗布液に対して濡れにくく(接触角を大きく)して、表面粗さを異ならせることによっても、先端側面13の接触角を、リップ部12の接触角よりも大きくできる。なお、リップ部12及び先端側面13の接触角を変更するには、リップ部12及び先端側面13の表面材質を異ならせることと、表面粗さを異ならせることを適宜組み合わせる方法を採用しても良い。
【0027】
【発明の効果】
以上のようであるから、本発明の請求項1から3に係る塗工用ダイヘッドよれば、リップ部の表面粗さが小さくなり、リップ部の塗布液に対する接触角の局部的な変化が小さくなることで、塗布液が塗布幅方向に移動し易くなり、ビードの形成時間を短くすることができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことができる。
また本発明の請求項4から6および請求項8に係る塗工用ダイヘッドによれば、ビードの最外部の液がダイヘッドから離れる点を、先端側面とリップ部との境界線であるエッジ部に保持することができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことができる。
また本発明の請求項7に係る塗工用ダイヘッドによれば、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制すると共に、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことができる。
また本発明の請求項9に係る塗工装置によれば、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制すると共に、塗布厚のむらを極めて小さく抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことができる。
本発明の請求項10および11に係る塗工用ダイヘッドの製造方法によれば、リップ部の表面粗さが小さくなり、リップ部の塗布液に対する接触角の局部的な変化が小さくなることで、塗布液が塗布幅方向に移動し易くなり、ビードの形成時間を短くすることができる。したがって、液晶用カラーフィルタ製造におけるレジスト塗布に用いることにより、塗工開始端部での膜厚不良域を極めて短く抑制し、液晶用カラーフィルタの製造時に要求されるような高精度塗布を行うことができる。
【図面の簡単な説明】
【図1】本発明の一実施の形態に係る塗工用ダイヘッドの概略斜視図及びその一部の拡大断面図
【図2】図1に示すダイヘッドの先端部を拡大して示す概略斜視図
【図3】(a)、(b)は図1に示すダイヘッドの製造工程を説明する概略斜視図
【図4】図1のダイヘッドで基板表面に塗布する状態を示す概略断面図
【図5】(a)はダイヘッドから塗布液が吐出している状態を示す概略斜視図、(b)はリップ部表面を遊離砥粒にて研磨した場合のリップ部表面の拡大断面図、(c)はリップ部表面をELID研削加工にて研磨した場合のリップ部表面の拡大断面図
【図6】(a)はリップ部表面を遊離砥粒にて研磨した場合に形成される初期ビードを示す概略断面図、(b)はリップ部表面をELID研削加工にて研磨した場合に形成される初期ビードを示す概略断面図
【図7】本発明の他の実施の形態に係るダイヘッドの先端部の概略斜視図
【図8】本発明の更に他の実施の形態に係るダイヘッドの先端部の概略斜視図
【図9】従来のダイヘッドで基板表面に塗布する状態を示す概略斜視図
【図10】従来のダイヘッドで基板表面に塗布する状態を示す概略断面図
【図11】従来の他のダイヘッドで基板表面に塗布する状態を示す概略断面図
【符号の説明】
1 ダイヘッド
2 基板
3 ビード
4 塗布層
5 チャック台
11 スリット
12 リップ部
13 先端側面
14 表面層
15 境界線
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for applying a coating liquid with high accuracy to a flat substrate such as a glass plate using a die head.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a manufacturing process of a color filter for liquid crystal, a colored layer such as R, G, B is formed on a substrate such as a glass plate, or a surface protective layer such as acrylic or a black matrix (light shielding layer) made of resin is formed. For this reason, a liquid resist is applied. Since high-precision coating is required for applying these resists, a spin method is generally used in which an excessive amount of droplets is supplied to the substrate surface, and the substrate is rotated at a high speed to spread the resist thinly and uniformly. However, in this method, most of the supplied resist is scattered around, so that there is a problem that the consumption of the resist increases and the cost increases. As shown in FIG. 9, the substrate 2 is held on the chuck table 5, the tip of the coating die head 1 is arranged close to the surface of the substrate 2, and the substrate 2 is relatively moved with respect to the die head 1. A method is also known in which a liquid resist is discharged from the die head 1 while applying the resist on the substrate surface to form a coating layer 4, and immediately thereafter, the substrate 2 is rotated at a high speed to make the thickness of the coating layer 4 uniform. ing. However, this method requires two steps of a coating step using a die head and a subsequent spinning step, so that there is a problem that the cost is also high. Therefore, as an alternative to these methods, a method of making the thickness of the coating layer 4 uniform only by the coating process using the die head 1 as in Patent Document 1 is known. Here, in the specifications at the time of manufacturing the color filter for liquid crystal, it is required that the defective film thickness region until the film thickness of the coating layer 4 becomes uniform is kept within 5 mm from the coating start end 4a in the coating direction. ing. However, in the application by the die head 1, it has been difficult to suppress the film thickness defect area within 5 mm in the application direction from the application start end 4a.
[0003]
Next, the cause of the occurrence of the film thickness defect area at the coating start end 4a in the coating by the die head 1 will be described. As shown in FIG. 10, the die head 1 includes a slit 11 for discharging a resist to be applied (referred to as a coating liquid), a lip portion 12 formed on both ends of the slit 11 at a substantially right angle to the slit 11, and a lip portion 12. And has a tip side surface 13 inclined with respect to the lip portion 12, and forms a pool (bead) 3 of the coating liquid between the lip portion 12 and the substrate 2 at the time of coating. The coating solution of the bead 3 is applied to the surface of the substrate 2. At the start of coating, the coating liquid discharged from the slit 11 moves in the coating width direction of the lip portion 12 to form a bead 3. If the formation time is short, the film thickness defect area until the film thickness at the coating start end portion becomes uniform becomes short. However, in actuality, the polishing of the surface of the lip portion 12 in the final finish is left to the performance or manual work of the polishing machine, and the surface roughness is large, and the lip portion 12 comes into contact with the coating liquid due to the unevenness of the surface. The corners change locally and hinder the movement of the coating solution. Then, it becomes difficult for the coating liquid to move in the coating width direction, and when the formation time of the beads 3 becomes long, a large amount of coating liquid (initial bead amount) for forming the beads 3 is required. As a result, the thickness of the film was poor, and the film thickness defect area before the film thickness became uniform at the coating start end became long.
[0004]
Further, in the application by the die head 1, as described below, streaks 41 and step unevenness 42 occur in the application layer 4, and the unevenness of the application thickness cannot be suppressed within an allowable range. Here, the cause of the occurrence of unevenness in the coating thickness in the coating by the die head 1 will be described. In FIG. 10, if the bead 3 is stable and has a constant shape during coating, that is, points A and B where the outermost liquid of the bead 3 separates from the die head 1 are located at the lip 12 and the tip of the die head 1. If it is held on the boundary line (edge portion) with the side surface 13, the thickness unevenness of the coating layer 4 hardly occurs. However, actually, the points A and B at which the outermost liquid of the bead 3 separates from the die head 1 are not held at the edge of the die head 1 but wrap around from the lip 12 to the tip side surface 13 as shown by an arrow C, In many cases, the beads 3 move on the tip side surface 13 or move at the lip portion 12 as shown by the arrow D, and the beads 3 often change in an unstable manner. When the movement of the points A and B occurs locally in the width direction of the die head 1, a streak 41 (see FIG. 9) extending in the movement direction of the substrate is generated. Step unevenness 42 extending in the direction was generated.
[0005]
Therefore, in order to stabilize the bead 3 by keeping the points A and B at which the outermost liquid of the bead 3 separates from the die head 1 and stabilize the bead 3, as shown in FIG. A die head 1A in which an edge 18 is formed is known. However, the die head 1A having this configuration can stabilize the bead 3 to some extent as compared with the die head 1 shown in FIG. 10, but the points A and B at which the outermost liquid of the bead 3 is separated from the die head 1A. Unstable movement cannot be sufficiently suppressed, and therefore stripes and step unevenness are reduced to some extent, and high-precision coating required at the time of manufacturing a color filter for liquid crystal cannot be performed.
[0006]
[Patent Document 1]
Patent No. 3201195 gazette
[Problems to be solved by the invention]
The present invention has been made in view of such a situation, and suppresses a film thickness defect area and a coating thickness unevenness at a coating start end portion to be extremely small, and performs high-precision coating as required when manufacturing a liquid crystal color filter. An object of the present invention is to provide a coating die head capable of performing the above.
[0008]
[Means for Solving the Problems]
The above object is achieved by the present invention described below. That is,
A coating die head according to claim 1 of the present invention is a coating die head that discharges a coating liquid while relatively moving with respect to a substrate, and applies the coating liquid to the substrate surface, wherein the slit discharges the coating liquid. And a coating die head having a lip portion formed substantially at right angles to the slit on both ends of the slit, and a tip side surface located outside the lip portion and inclined with respect to the lip portion. The lip has a surface roughness of Rmax 0.3 S or less. According to the present invention, the surface roughness of the lip portion is reduced, and the local change in the contact angle of the lip portion with the coating liquid is reduced, so that the coating liquid is easily moved in the coating width direction, and the bead is formed. Can be shortened. Therefore, by using it for resist coating in the production of color filters for liquid crystals, it is possible to suppress the film thickness defect area at the coating start end extremely short, and to perform high-precision coating as required when producing color filters for liquid crystals. Provided is a coating die head that enables the following.
[0009]
A coating die head according to a second aspect of the present invention is the coating die head according to the first aspect, wherein the surface of the lip portion is mirror-finished.
[0010]
The coating die head according to a third aspect of the present invention is the coating die head according to the second aspect, wherein the mirror surface grinding is an electrolytic in-process dressing grinding (ELID grinding).
[0011]
The coating die head according to a fourth aspect of the present invention is the coating die head according to any one of the first to third aspects, wherein the contact angle with respect to the coating liquid on the front end side surface is determined by the coating liquid on the lip portion. Is larger than the contact angle with respect to. ADVANTAGE OF THE INVENTION According to this invention, the point which the outermost liquid of a bead separates from a die head can be hold | maintained at the edge part which is the boundary line of a front-end | tip side surface and a lip part. Therefore, the coating die head can be used for resist coating in the production of a liquid crystal color filter, thereby suppressing the unevenness of the coating thickness to be extremely small and performing high-precision coating as required in the production of a liquid crystal color filter. I will provide a.
[0012]
The coating die head according to claim 5 of the present invention is the coating die head according to claim 4, wherein the front end side surface is subjected to electroless nickel plating containing 1 to 10% of a fluororesin. .
[0013]
A coating die head according to a sixth aspect of the present invention is the coating die head according to the first to fifth aspects, wherein the surface roughness of the front end side surface and the surface roughness of the lip portion are different from each other. ADVANTAGE OF THE INVENTION According to this invention, the point which the outermost liquid of a bead separates from a die head can be hold | maintained at the edge part which is the boundary line of a front-end | tip side surface and a lip part. Therefore, the coating die head can be used for resist coating in the production of a liquid crystal color filter, thereby suppressing the unevenness of the coating thickness to be extremely small and performing high-precision coating as required in the production of a liquid crystal color filter. I will provide a.
[0014]
The coating die head according to claim 7 of the present invention is the coating die head according to any one of claims 1 to 6, wherein the straightness of the boundary between the tip side surface and the lip portion and the parallelism with respect to the slit. Is set to 2 μm / m or less. According to the present invention, by using the resist coating in the production of a liquid crystal color filter, the thickness defect area at the coating start end can be extremely short, and the coating thickness unevenness can be extremely small. Provided is a coating die head capable of performing high-precision coating required at the time of manufacturing.
[0015]
The coating die head according to claim 8 of the present invention is the coating die head according to any one of claims 4 to 7, wherein a large contact angle region and a small contact angle region in the boundary region between the tip side surface and the lip portion. And the boundary between the tip side surface and the lip portion is set to 2 μm or less. ADVANTAGE OF THE INVENTION According to this invention, the unevenness | coating thickness of application | coating is suppressed very small by using it for the resist coating in liquid crystal color filter manufacture, and it becomes possible to perform the highly precise coating required at the time of manufacture of a liquid crystal color filter. Provide a die head for coating.
[0016]
A coating apparatus according to a ninth aspect of the present invention provides the coating die head according to any one of the first to eighth aspects, and the coating die head configured to apply the coating liquid discharged from the coating die head to a substrate surface. Means for relatively moving the coating die head and the substrate with the tip of the processing die head being close to the substrate. According to the present invention, by using the resist coating in the production of a liquid crystal color filter, the film thickness defect area at the coating start end is extremely short, and the coating thickness unevenness is extremely small. Provided is a coating apparatus capable of performing high-precision coating required during manufacturing.
[0017]
A method of manufacturing a coating die head according to claim 10 of the present invention is a coating die head that discharges a coating liquid while relatively moving with respect to a substrate, and applies the coating liquid to the surface of the substrate. And a lip portion formed substantially at right angles to the slit on both sides of the tip of the slit, and a tip side surface located outside the lip portion and inclined with respect to the lip portion. In the method for manufacturing a die head, the surface roughness of the lip portion is set to Rmax 0.3S or less. According to the present invention, the surface roughness of the lip portion is reduced, and the local change in the contact angle of the lip portion with the coating liquid is reduced, so that the coating liquid is easily moved in the coating width direction, and the bead is formed. Can be shortened. Therefore, by using it for resist coating in the production of color filters for liquid crystals, it is possible to suppress the film thickness defect area at the coating start end extremely short, and to perform high-precision coating as required when producing color filters for liquid crystals. Provided is a method of manufacturing a coating die head which enables the following.
[0018]
According to a method of manufacturing a coating die head according to claim 11 of the present invention, in the method of manufacturing a coating die head according to claim 10, the surface of the lip portion is subjected to mirror polishing.
[0019]
It goes without saying that the coating die head and the coating apparatus of the present invention may be used for coating other than the purpose of manufacturing color filters for liquid crystals.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a schematic perspective view showing a coating die head 1 according to one embodiment of the present invention, and an enlarged sectional view of a part thereof. FIG. 2 is a schematic perspective view showing the tip end of the die head 1 in an enlarged manner.
[0021]
Similarly to the conventional die head, the die head 1 of this embodiment also has a slit 11 for discharging a coating liquid to be applied, lip portions 12 formed on both ends of the die at substantially right angles to the slit 11, and a lip portion 12 located outside the slit. , And a tip side surface 13 inclined with respect to the lip portion 12. The die head 1 is entirely formed of stainless steel. The width d of the lip portion 12 is usually set to about 0.03 mm to 0.1 mm. The lip portion 12 has a form in which the base material of the die head 1 is exposed as it is, and is finished with a surface roughness Rmax of 0.05 S or less by ELID grinding as a surface polishing method. Here, the surface roughness Rmax conforms to JIS B0601, and is defined as the maximum height in the entire target surface. The measuring method is a stylus measuring method based on JIS B0601. On the other hand, the front side surface 13 has a surface layer 14 formed by plating or coating a material having poor wettability with respect to the application liquid. Therefore, the front end side surface 13 is a surface having poor wettability (large contact angle) with respect to the coating liquid. Here, the surface layer 14 is formed by electroless nickel plating containing 1 to 10% of a fluororesin. When a liquid resist used in the production of a liquid crystal color filter is used as the coating liquid, the contact angle of the lip portion 12 with the coating liquid is about 7 to 10 degrees, and the formation of the surface layer 14 is performed using a fluororesin of 1 to 10%. When the contained electroless nickel plating treatment is performed, the contact angle becomes about 55 degrees, and a difference of 40 degrees or more can be secured. When the content of the fluororesin is within 10%, the hardness of the base material itself (Rockwell hardness HRC 45 to 55) is almost the same, and the wear resistance of the surface of the lip portion 12 can be maintained. If the content of the fluororesin is less than 1%, the contact angle of the lip portion 12 with respect to the coating liquid becomes small. On the other hand, if the content of the fluororesin is more than 10%, the wear resistance of the surface of the lip portion 12 cannot be maintained. Note that the region where the surface layer 14 is formed may be at least a region where the coating liquid may flow around at the time of coating.
[0022]
As shown in FIG. 2, the surface layer 14 formed on the tip side surface 13 is accurately formed up to a position corresponding to the boundary between the lip portion 12 and the surface layer 14. Further, a boundary 15 between the lip portion 12 and the surface layer 14 of the tip side surface 13 is formed linearly, and the straightness of the boundary 15 and the parallelism with respect to the slit 11 are set to 2 μm / m or less. Are made. Here, the surface layer 14 is accurately formed up to a position coincident with the boundary between the lip portion 12 and the surface layer 14, and the straightness of the boundary 15 and the parallelism to the slit 11 are set to 2 μm / m or less. As shown in FIG. 3A, the surface layer 14 is formed not only on the tip side surface 13 of the die head 1 but also on the lip portion 12 by plating, coating, or the like, and then, as shown in FIG. Then, the lip portion 12 may be polished to remove the surface layer 14 at that portion, and the boundary 15 may have a desired straightness. Note that the straightness of the boundary 15 is measured by a stylus-type measuring method based on JIS B0601.
[0023]
In order to perform coating using the die head 1, as shown in FIG. 4, the tip of the die head 1 is arranged close to the surface of the substrate 2 held on a chuck table (not shown), and the substrate 2 is placed on the die head 1. The coating liquid is discharged from the die head 1 while being moved, a bead 3 is formed between the lip portion 12 and the substrate 2, and the coating liquid of the bead 3 is applied to the surface of the substrate 2. Here, FIG. 5 is a schematic perspective view showing a state in which the coating liquid is being discharged from the die head 1. As shown in FIG. 5B, when the surface of the lip portion 12 of the die head 1 is polished with conventional loose abrasive grains, the surface roughness becomes large, and the local contact angle of the lip portion 12 with the coating liquid is increased. Therefore, the coating liquid hardly moves in the coating width direction, and the formation time of the bead 3a becomes longer. For this reason, as shown in FIG. 6A, the amount of the coating liquid (initial bead amount) for forming the beads 3a increases, and the coating layer formed on the substrate 2 is at the coating start end. The film thickness is large, and the defective film thickness region until the film thickness at the coating start end portion becomes uniform becomes long. Thus, as shown in FIG. 5C, the surface of the lip portion 12 of the die head 1 is polished by ELID grinding to reduce the surface roughness. Therefore, since the local change of the contact angle of the lip portion 12 with the coating liquid is reduced, the coating liquid is easily moved in the coating width direction, and the time for forming the beads 3b can be shortened. For this reason, as shown in FIG. 6B, the initial bead amount for forming the bead 3b is suppressed to an extremely small amount, and the coating layer 4 formed on the substrate 2 has a film at the coating start end. It is possible to form the coating layer 4 having an extremely short (for example, within 5 mm) film thickness defective area until the thickness becomes uniform. For this reason, by using the resist coating in the production of the color filter for liquid crystal, the coating with the coating accuracy required in the production of the color filter for liquid crystal (for example, the film thickness defect area at the coating start end is within 5 mm). It can be performed.
[0024]
The surface roughness by polishing by ELID grinding is not more than Rmax 0.2 S, and the lip portion 12 has a mirror surface, and the local change of the contact angle of the lip portion 12 with the coating liquid is reduced. In order to facilitate the movement of the coating liquid in the coating width direction and to shorten the formation time of the beads 3, the surface roughness is preferably set to Rmax0.1S, and more preferably the surface roughness is set to Rmax0.05S. preferable.
[0025]
Further, the tip side surface 13 of the die head 1 is formed so that the contact angle with the coating liquid is larger than the lip portion 12 with which the bead 3 is in contact, and thus the wettability with the coating liquid is worse. In the middle, points A and B at which the outermost liquid of the bead 3 is separated from the die head are held at an edge portion which is a boundary between the lip portion 12 having good wettability and the tip side surface 13 having poor wettability, and hardly fluctuate. For this reason, during the coating, the beads 3 are stable, and the coating layer 4 formed on the substrate 2 has almost no streak or step unevenness which has occurred conventionally, and has extremely small thickness unevenness (for example, The coating layer 4 (within ± 1.5% of the thickness) can be formed. For this reason, by using the resist coating in the production of the color filter for liquid crystal, it is possible to perform the application with the application accuracy (for example, the thickness unevenness is within ± 1.5% of the thickness) required in the production of the color filter for liquid crystal. It can be carried out.
[0026]
In the above-described embodiment, the lip portion 12 of the die head 1 is the surface of the base material as it is, and the front side surface 13 is coated with a surface layer 14 having poor wettability (large contact angle) with respect to the coating liquid by plating, coating, or the like. Although it is formed by surface treatment so that the contact angle is larger than that of the lip portion 12, the present invention is not limited to this configuration as a method of changing the contact angle between the lip portion 12 and the tip side surface 13. For example, as shown in FIG. 7, the portion forming the lip portion 12 and the portion forming the tip side surface 13 are formed by different members, and the surface materials thereof are made different, or as shown in FIG. Although the whole is made of the same material, the surface roughness of the lip portion 12 is increased to make it easier to wet the coating liquid (reduce the contact angle), and the surface roughness of the tip side surface 13 is reduced to reduce the coating liquid. The contact angle of the tip side surface 13 can also be made larger than the contact angle of the lip portion 12 by making the surface hard to wet (increase the contact angle) and varying the surface roughness. In order to change the contact angle between the lip portion 12 and the tip side surface 13, a method of appropriately combining a different surface material of the lip portion 12 and the tip side surface 13 with a different surface roughness may be employed. good.
[0027]
【The invention's effect】
As described above, according to the coating die head according to claims 1 to 3 of the present invention, the surface roughness of the lip portion is reduced, and the local change in the contact angle of the lip portion with the coating liquid is reduced. This makes it easier for the coating liquid to move in the coating width direction, thereby shortening the bead forming time. Therefore, by using it for resist coating in the production of color filters for liquid crystals, it is possible to suppress the film thickness defect area at the coating start end extremely short, and to perform high-precision coating as required when producing color filters for liquid crystals. Can be.
According to the coating die head according to claims 4 to 6 and claim 8 of the present invention, the point at which the outermost liquid of the bead separates from the die head is located at the edge portion which is the boundary between the tip side surface and the lip portion. Can be held. Therefore, by using it for resist coating in the production of a liquid crystal color filter, the unevenness of the applied thickness can be suppressed to a very small level, and high-precision coating as required in the production of a liquid crystal color filter can be performed.
Further, according to the coating die head according to claim 7 of the present invention, by using the resist coating in the production of the color filter for liquid crystal, the film thickness defect area at the coating start end can be suppressed extremely short, and the coating thickness can be reduced. Unevenness can be suppressed to a very small degree, and high-precision coating required at the time of manufacturing a liquid crystal color filter can be performed.
Further, according to the coating apparatus according to the ninth aspect of the present invention, by using the resist coating in the production of a color filter for a liquid crystal, the defective film area at the coating start end can be suppressed to be extremely short, and the coating thickness can be made uneven. Can be suppressed to a very small value, and high-precision coating as required at the time of manufacturing a color filter for liquid crystal can be performed.
According to the method for manufacturing a coating die head according to claims 10 and 11 of the present invention, the surface roughness of the lip portion is reduced, and the local change in the contact angle of the lip portion with the coating liquid is reduced. The coating liquid easily moves in the coating width direction, and the bead forming time can be shortened. Therefore, by using it for resist coating in the production of color filters for liquid crystals, it is possible to suppress the film thickness defect area at the coating start end extremely short, and to perform high-precision coating as required when producing color filters for liquid crystals. Can be.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a coating die head according to an embodiment of the present invention and an enlarged cross-sectional view of a part thereof. FIG. 2 is a schematic perspective view showing a tip end of the die head shown in FIG. FIGS. 3 (a) and 3 (b) are schematic perspective views illustrating a manufacturing process of the die head shown in FIG. 1; FIG. 4 is a schematic cross-sectional view showing a state where the die head of FIG. 1 is applied to a substrate surface; a) is a schematic perspective view showing a state in which a coating liquid is discharged from a die head, (b) is an enlarged cross-sectional view of the lip surface when the lip surface is polished with loose abrasive grains, and (c) is a lip portion. FIG. 6 (a) is a schematic cross-sectional view showing an initial bead formed when the surface of the lip is polished with free abrasive grains when the surface is polished by ELID grinding; (B) is formed when the lip surface is polished by ELID grinding. FIG. 7 is a schematic perspective view of a tip of a die head according to another embodiment of the present invention. FIG. 8 is a schematic perspective view of a tip of a die head according to still another embodiment of the present invention. FIG. 9 is a schematic perspective view showing a state where a conventional die head is applied to a substrate surface. FIG. 10 is a schematic sectional view showing a state where a conventional die head is applied to a substrate surface. FIG. 11 is another conventional die head. Schematic cross-sectional view showing the state of application on the substrate surface with [Description of reference numerals]
Reference Signs List 1 die head 2 substrate 3 bead 4 coating layer 5 chuck base 11 slit 12 lip portion 13 tip side surface 14 surface layer 15 boundary line

Claims (11)

基板に対して相対的に移動しながら塗布液を吐出し、前記基板表面に塗布する塗工用ダイヘッドであって、塗布液を吐出するスリットと、前記スリットの先端両側に前記スリットにほぼ直角に形成されたリップ部と、前記リップ部の外側に位置し、前記リップ部に対して傾斜した先端側面とを有する塗工用ダイヘッドにおいて、前記リップ部の表面粗さをRmax0.3S以下としたことを特徴とする塗工用ダイヘッド。A coating die head for discharging a coating liquid while moving relative to a substrate, and coating the substrate surface with a slit for discharging the coating liquid, and on both sides of a tip of the slit at a substantially right angle to the slit. In the coating die head having the formed lip portion and the tip side surface located outside the lip portion and inclined with respect to the lip portion, the lip portion has a surface roughness of Rmax 0.3 S or less. A coating die head characterized by the following. 前記リップ部の表面に鏡面研削加工を施したことを特徴とする請求項1記載の塗工用ダイヘッド。2. The coating die head according to claim 1, wherein a surface of the lip is mirror-finished. 前記鏡面研削加工が電解インプロセスドレッシング研削加工であることを特徴とする請求項2記載の塗工用ダイヘッド。3. The coating die head according to claim 2, wherein said mirror surface grinding is electrolytic in-process dressing grinding. 前記先端側面の塗布液に対する接触角を、前記リップ部の塗布液に対する接触角よりも大きくしたことを特徴とする請求項1から3のいずれか1項記載の塗工用ダイヘッド。The coating die head according to any one of claims 1 to 3, wherein a contact angle of the tip side surface with respect to the coating liquid is larger than a contact angle of the lip portion with the coating liquid. 前記先端側面にフッ素樹脂を1〜10%含有した無電解ニッケルメッキ処理を施したことを特徴とする請求項4記載の塗工用ダイヘッド。5. The coating die head according to claim 4, wherein an electroless nickel plating process containing 1 to 10% of a fluororesin is applied to the side surface of the tip. 前記先端側面の表面粗さとリップ部の表面粗さとを互いに異ならせていることを特徴とする請求項4記載の塗工用ダイヘッド。5. The coating die head according to claim 4, wherein a surface roughness of the tip side surface and a surface roughness of the lip portion are different from each other. 前記先端側面とリップ部との境界線の真直度及び前記スリットに対する平行度を、2μm/m以下としたことを特徴とする請求項1から6のいずれか1項記載の塗工用ダイヘッド。The coating die head according to any one of claims 1 to 6, wherein the straightness of a boundary between the tip side surface and the lip portion and the parallelism with respect to the slit are set to 2 µm / m or less. 前記先端側面及びリップ部の境界領域における接触角の大きい領域と小さい領域との境界線と、前記先端側面とリップ部との境界線とのずれを、2μm以下としたことを特徴とする請求項4から7のいずれか1項記載の塗工用ダイヘッド。The deviation between the boundary between the region where the contact angle is large and the region where the contact angle is small in the boundary region between the tip side surface and the lip portion and the boundary line between the tip side surface and the lip portion are 2 μm or less. 8. The coating die head according to any one of items 4 to 7. 請求項1から8のいずれか1項記載の塗工用ダイヘッドと、前記塗工用ダイヘッドが吐出する塗布液を基板表面に塗布するよう、前記塗工用ダイヘッドの先端を前記基板に近接させた状態で前記塗工用ダイヘッドと基板とを相対的に移動させる手段とを備えた塗工装置。The coating die head according to any one of claims 1 to 8, and a tip of the coating die head is brought close to the substrate so as to apply a coating liquid discharged from the coating die head to a substrate surface. Means for relatively moving the coating die head and the substrate in a state. 基板に対して相対的に移動しながら塗布液を吐出し、前記基板表面に塗布する塗工用ダイヘッドであって、塗布液を吐出するスリットと、前記スリットの先端両側に前記スリットにほぼ直角に形成されたリップ部と、前記リップ部の外側に位置し、前記リップ部に対して傾斜した先端側面とを有する塗工用ダイヘッドにおいて、前記リップ部の表面粗さをRmax0.3S以下とした塗工用ダイヘッドの製造方法。A coating die head for discharging a coating liquid while moving relative to a substrate, and coating the substrate surface with a slit for discharging the coating liquid, and on both sides of a tip of the slit at a substantially right angle to the slit. In a coating die head having a formed lip portion and a tip side surface located outside the lip portion and inclined with respect to the lip portion, the coating lip portion has a surface roughness of Rmax 0.3 S or less. Manufacturing method of die head for construction. 前記リップ部の表面に鏡面研削加工を施したことを特徴とする請求項10記載の塗工用ダイヘッドの製造方法。The method of manufacturing a coating die head according to claim 10, wherein the surface of the lip portion is mirror-finished.
JP2003153599A 2002-07-18 2003-05-30 COATING DIE HEAD, COATING DEVICE, AND METHOD FOR PRODUCING COATING DIE HEAD Expired - Fee Related JP4601918B2 (en)

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JP2003153599A JP4601918B2 (en) 2003-05-30 2003-05-30 COATING DIE HEAD, COATING DEVICE, AND METHOD FOR PRODUCING COATING DIE HEAD
CNB038171260A CN100430151C (en) 2002-07-18 2003-07-18 Die head coating, coating device, and method of manufacturing die head for coating
TW092119694A TWI277460B (en) 2002-07-18 2003-07-18 Die head for painting, painting device, and method of manufacturing die head for painting
PCT/JP2003/009204 WO2004009248A1 (en) 2002-07-18 2003-07-18 Die head for coating, coating device, and method of manufacturing die head for coating
KR1020047007007A KR100997572B1 (en) 2002-07-18 2003-07-18 Die head for coating, coating device
US10/494,893 US7160390B2 (en) 2002-07-18 2003-07-18 Die head coating, coating device, and method of manufacturing die head for coating

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