JP2001276709A - Coating apparatus - Google Patents
Coating apparatusInfo
- Publication number
- JP2001276709A JP2001276709A JP2000096626A JP2000096626A JP2001276709A JP 2001276709 A JP2001276709 A JP 2001276709A JP 2000096626 A JP2000096626 A JP 2000096626A JP 2000096626 A JP2000096626 A JP 2000096626A JP 2001276709 A JP2001276709 A JP 2001276709A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- die
- substrate
- slit
- coating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種デバイス製造
時における液体の塗膜を形成する塗布装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for forming a liquid coating when manufacturing various devices.
【０００２】[0002]
【従来の技術】半導体素子やフラットパネルディスプレ
イといったデバイスの製造を行う場合、レジストやポリ
イミドをはじめとして、様々な液体の塗膜を形成するプ
ロセスが頻繁に行われている。このような塗膜はこれま
で、スピンコート法や印刷法といった手法で塗布形成さ
れており、中でもスピンコート法は簡単な機構で高精度
の均一な膜が得られることから様々な製造ラインに導入
されている。2. Description of the Related Art In the manufacture of devices such as semiconductor elements and flat panel displays, processes for forming coating films of various liquids such as resist and polyimide are frequently performed. Until now, such coatings have been applied by spin coating or printing.In particular, spin coating can be applied to various production lines because a highly accurate and uniform film can be obtained with a simple mechanism. Have been.
【０００３】しかしながらスピンコート法は、通常、滴
下した塗布液の９５％以上が塗膜を形成する基板の回転
により基板上より吹き飛ばされ、廃液となってしまい、
材料の利用効率が非常に悪い。しかも、当該方法では飛
散した塗布液が他の装置に影響しないように、基板周辺
を囲む必要があり、塗布装置全体が大がかりなものとな
ってしまう。さらに、基板のエッジ部にはビードと呼ば
れる液滴が発生し、基板端部及び裏面に塗布液が付着
し、基板搬送系やホットプレート表面を汚染し、パーテ
ィクルを発生させる。そのため、スピンコート工程終了
後にこの基板の端部及び裏面を処理するためのプロセス
や装置を用意して対応をとらなければならない場合が多
々ある。また、その結果、スループットが非常に遅い。However, in the spin coating method, usually, 95% or more of the dropped coating liquid is blown off from the substrate by the rotation of the substrate on which the coating film is formed, resulting in waste liquid.
Material utilization efficiency is very poor. In addition, in this method, it is necessary to surround the periphery of the substrate so that the scattered coating liquid does not affect other devices, and the entire coating device becomes large. Further, a droplet called a bead is generated at the edge of the substrate, and the coating liquid adheres to the edge and the back surface of the substrate, thereby contaminating the substrate transport system and the surface of the hot plate, and generating particles. For this reason, there are many cases where it is necessary to prepare a process or an apparatus for processing the edge and the back surface of the substrate after the spin coating step, and to take measures. Also, as a result, the throughput is very slow.
【０００４】スピンコート法では、上記のように種々の
問題を有していることから、該方法に代わって、ダイ
（押し出し型）を用いたダイコート法が注目を集め、既
に実用化も始まっている。Since the spin coating method has various problems as described above, a die coating method using a die (extrusion type) has attracted attention instead of the method, and practical use has already started. I have.
【０００５】ダイコート法に用いる塗布装置は、塗布液
の吐出部であるダイに、少なくとも２枚のブレードを対
向配置して形成したスリットを有し、このスリットから
塗布液を基板上に押し出して塗膜を形成するものであ
る。図３にその一例の断面図を示す。図中、１は塗膜を
形成する基板、２ａ，２ｂはブレード、４は塗布液、６
ａ，６ｂはブレードの外壁側面部である。ダイの先端を
基板に近づける際に、その距離は数十μｍ〜数百μｍレ
ベルで精密に制御され、スリットから塗布液を押し出す
と同時に、ダイ或いは基板を平行移動させることによ
り、該基板上に塗膜を形成する。従って、スピンコート
法に比べると、塗布液のほとんどを基板上に塗布するこ
とができ、飛散もないため無駄が少なく、ダイを基板に
対して相対的に平行移動させるだけで塗膜を形成できる
ことから、スループットが非常に良い。[0005] The coating apparatus used in the die coating method has a slit formed by arranging at least two blades facing each other on a die, which is a coating liquid discharge section, and extrudes the coating liquid onto the substrate from this slit to perform coating. It forms a film. FIG. 3 shows a cross-sectional view of one example. In the figure, 1 is a substrate for forming a coating film, 2a and 2b are blades, 4 is a coating solution, 6
Reference numerals a and 6b denote side walls of the outer wall of the blade. When the tip of the die is brought close to the substrate, the distance is precisely controlled at the level of several tens of μm to several hundred μm, and simultaneously with pushing out the coating liquid from the slit and moving the die or the substrate in parallel, the Form a coating. Therefore, compared with the spin coating method, most of the coating liquid can be applied onto the substrate, and there is no scattering because there is no scattering, and the coating film can be formed only by moving the die relatively parallel to the substrate. Therefore, the throughput is very good.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、ダイコ
ート法においては、塗布開始時にダイの先端部において
ブレード２ａ，２ｂの外壁側面部６ａ，６ｂに塗布液４
が回り込んで多量に付着し、ダイと基板１間の数十μｍ
〜数百μｍのギャップに均一な塗膜を形成することが難
しい。そのため、スリットより吐出された塗布液４を均
一に且つ効率よく基板１上に塗布できなくなり、塗布開
始時に液溜まりを形成し、膜厚が極端に厚くなる（設定
膜厚の２倍以上）場合があり、実際に膜として利用でき
ない無効領域が発生する。また、ビードの発生による筋
ムラを塗膜全体に引き起こすことがあるといった問題も
抱えている。However, in the die coating method, when the coating is started, the coating liquid 4 is applied to the outer wall side surfaces 6a and 6b of the blades 2a and 2b at the tip of the die.
Wrap around and adhere in large quantities, several tens of μm between die and substrate 1
It is difficult to form a uniform coating film in a gap of up to several hundred μm. Therefore, the coating liquid 4 discharged from the slit cannot be uniformly and efficiently coated on the substrate 1, and a liquid pool is formed at the start of coating, and the film thickness becomes extremely large (more than twice the set film thickness). And an invalid area that cannot be actually used as a film is generated. There is also a problem that stripe unevenness due to the generation of beads may be caused on the entire coating film.
【０００７】これらの問題を解決するために、スリット
幅の均一性を上げたり、ダイを基板に近づけるスピード
と塗布液の吐出タイミングの最適化を図るなど、プロセ
ス最適化がなされているが、容易には解消できない。To solve these problems, process optimization has been performed, for example, by increasing the uniformity of the slit width, optimizing the speed of bringing the die closer to the substrate and optimizing the ejection timing of the coating solution. Can not be resolved.
【０００８】本発明の課題は、上記問題を解決し、塗布
液の塗布ムラの発生を抑制し、均一な膜厚の塗膜を再現
性良く塗布しうる塗布装置を提供することにある。具体
的には、ダイの先端部への塗布液の付着を制御して、ダ
イより吐出した塗布液を効率よく且つ均一に基板に供給
して塗膜を形成する塗布装置を構成することにある。An object of the present invention is to solve the above problems and to provide a coating apparatus capable of suppressing the occurrence of coating unevenness of a coating liquid and coating a coating film having a uniform thickness with good reproducibility. Specifically, it is an object of the present invention to provide a coating apparatus that controls the adhesion of a coating liquid to the tip of a die and efficiently and uniformly supplies the coating liquid discharged from the die to a substrate to form a coating film. .
【０００９】[0009]
【課題を解決するための手段】本発明は、少なくとも２
枚のブレードにより形成されたスリットを有するダイを
備え、該スリットより塗布液を押し出すと同時に、該ダ
イの下方に配置した基板を該ダイに対して相対的に平行
移動させることにより、該基板上に上記塗布液からなる
塗膜を形成する塗布装置であって、上記ブレードの先端
部近傍の外壁側面部が塗布液との接触角が５０°以上と
なるように表面処理されていることを特徴とする塗布装
置である。SUMMARY OF THE INVENTION The present invention provides at least two
A die having a slit formed by a single blade, and simultaneously extruding a coating liquid through the slit, and simultaneously moving a substrate disposed below the die relative to the die, thereby forming a substrate on the substrate. A coating apparatus for forming a coating film comprising the coating liquid, wherein a side surface of an outer wall near a tip of the blade is surface-treated so that a contact angle with the coating liquid is 50 ° or more. Is a coating device.
【００１０】上記本発明は、上記スリット先端部の塗布
液との接触角が３０°以下であること、上記表面処理が
塗布液との接触角が５０°以上の樹脂被覆、特にアモル
ファスフッ素樹脂被覆であること、上記ブレード先端部
が、スリットに直交する方向の幅が０．２〜１．０ｍｍ
の基板に対して平行な平面部を有すること、特に、該平
面部の塗布液との接触角が３０°以下であること、上記
２枚のブレードの外壁側面部が、先端部でなす角度が４
５〜９０°であること、を好ましい態様として含むもの
である。[0010] The present invention provides a resin coating, wherein the contact angle with the coating liquid at the tip of the slit is 30 ° or less, and wherein the surface treatment has a contact angle with the coating liquid of 50 ° or more, especially an amorphous fluororesin coating. The width of the blade tip in the direction perpendicular to the slit is 0.2 to 1.0 mm.
Having a plane portion parallel to the substrate, in particular, the contact angle of the plane portion with the coating liquid is 30 ° or less, and the angle formed by the outer wall side surface portions of the two blades at the tip portions is 4
5 to 90 ° as a preferred embodiment.
【００１１】[0011]
【発明の実施の形態】図１に本発明の塗布装置の一実施
形態のダイ先端部の断面模式図を示す。図中、１は塗膜
を形成する基板、２ａ，２ｂはブレードでスリットを介
して互いに対向配置されている。３ａ，３ｂはブレード
の外壁側面部の表面処理として形成された、塗布液４と
の接触角が５０°以上の樹脂被覆層である。FIG. 1 is a schematic cross-sectional view of a tip portion of a die according to an embodiment of a coating apparatus of the present invention. In the drawing, reference numeral 1 denotes a substrate on which a coating film is formed, and 2a and 2b are arranged to face each other via a slit with a blade. Reference numerals 3a and 3b denote resin coating layers formed as a surface treatment on the outer wall side surface of the blade and having a contact angle with the coating liquid 4 of 50 ° or more.
【００１２】本発明の塗布装置においては、ブレード２
ａ，２ｂの先端部近傍の外壁側面部の塗布液４との接触
角が５０°以上になるように表面処理されていることか
ら、該側面部では塗布液４がはじかれ、該側面部に回り
込む塗布液４の量が低減され、多量に付着することが防
止される。その結果、スリットより吐出された塗布液４
のほとんどがダイ先端部と基板１間に形成される液滴に
供給されるため、吐出された塗布液４が全て塗膜の形成
に使用される。さらに、ダイ先端部と基板間の液滴形成
が迅速に行われるため、塗布開始時の液溜まりやビード
の発生を大幅に軽減することができる。In the coating apparatus of the present invention, the blade 2
Since the surface treatment is performed so that the contact angle with the coating liquid 4 on the side wall of the outer wall in the vicinity of the tips of a and 2b becomes 50 ° or more, the coating liquid 4 is repelled on the side, and The amount of the coating liquid 4 flowing around is reduced, and a large amount of the coating liquid 4 is prevented from adhering. As a result, the coating liquid 4 discharged from the slit
Is supplied to droplets formed between the tip of the die and the substrate 1, so that the discharged coating liquid 4 is all used for forming a coating film. Further, since the droplet formation between the die tip and the substrate is performed quickly, the occurrence of liquid pools and beads at the start of coating can be greatly reduced.
【００１３】本発明において、ブレード２ａ，２ｂの外
壁側面部の塗布液４との接触角を５０°以上とする表面
処理としては、図１に示すように、塗布液４との接触角
が５０°以上の樹脂被覆層３ａ，３ｂを付設する方法が
挙げられるが、特にこの方法に限定されるものではな
い。具体的には、フッ素を含有する表面処理が好まし
く、アモルファスフッ素樹脂を被覆して樹脂被覆層３
ａ，３ｂを形成することが好ましい。In the present invention, as the surface treatment for making the contact angle with the coating liquid 4 on the outer wall side surfaces of the blades 2a and 2b 50 ° or more, as shown in FIG. The method of providing the resin coating layers 3a and 3b of more than ° may be mentioned, but it is not particularly limited to this method. Specifically, a surface treatment containing fluorine is preferable, and the resin coating layer 3 is formed by coating an amorphous fluorine resin.
Preferably, a and 3b are formed.
【００１４】また、本発明においては、スリット先端部
の塗布液４との接触角を３０°以下とすることにより、
ブレード２ａ，２ｂの外壁側面部の塗布液４との接触角
との差を大きくして、より該側面部への塗布液４の回り
込みを抑えることができる。スリットの先端部の塗布液
４との接触角を３０°以下にする具体的な手段として
は、ブレード２ａ，２ｂ自体を塗布液４との接触角が３
０°以下の素材で構成したり、或いは、ダイの構成前に
スリットを形成するブレード２ａ，２ｂ内壁側面部に適
宜表面処理を施せばよい。In the present invention, the contact angle of the tip of the slit with the coating liquid 4 is set to 30 ° or less,
By increasing the difference between the contact angles of the outer wall side surfaces of the blades 2a and 2b with the coating liquid 4, it is possible to further suppress the coating liquid 4 from flowing to the side surface portions. As a specific means for reducing the contact angle of the tip of the slit with the coating liquid 4 to 30 ° or less, the contact angle of the blades 2a and 2b itself with the coating liquid 4 is 3 degrees.
It may be made of a material having a temperature of 0 ° or less, or may be appropriately subjected to surface treatment on the side surfaces of the inner walls of the blades 2a and 2b which form the slits before forming the die.
【００１５】さらに、上記本発明の効果を得る上で、２
枚のブレードの外壁側面部が先端部でなす角度が４５〜
９０°であることが好ましい。また、ブレード先端部が
スリットに直交する方向の幅が０．２〜１．０ｍｍの基
板に対して平行な平面部を有することも好ましく選択さ
れる。当該構成のダイ先端部の断面模式図を図２に示
す。図中、図１と同じ部材には同じ符号を付した。ま
た、５ａ，５ｂは平面部である。当該平面部は、上記ス
リット同様、塗布液４との接触角を３０°以下にするこ
とにより、より高い本発明の効果を得ることができる。Further, in order to obtain the effect of the present invention, 2
The angle formed by the outer wall side of the blade at the tip is 45 to 45
Preferably it is 90 °. It is also preferable that the blade tip has a plane portion parallel to the substrate having a width of 0.2 to 1.0 mm in a direction perpendicular to the slit. FIG. 2 is a schematic cross-sectional view of the die tip portion having the above configuration. In the drawing, the same members as those in FIG. 1 are denoted by the same reference numerals. 5a and 5b are plane portions. As in the case of the slit, the flat portion can achieve a higher effect of the present invention by setting the contact angle with the coating liquid 4 to 30 ° or less.
【００１６】本発明の塗布装置においては、上記本発明
の好ましい態様を適宜選択することによって、ダイ先端
部に形成される液滴量を従来の１／５程度まで低減する
ことが可能である。In the coating apparatus of the present invention, by appropriately selecting the preferred embodiment of the present invention, it is possible to reduce the amount of droplets formed at the tip of the die to about 1/5 of the conventional one.
【００１７】[0017]
【実施例】図１に示す構成のダイを備えた塗布装置を構
成し、ガラス基板（厚さ１．１ｍｍ、塗膜形成面を研磨
処理）上に塗膜を形成した。用いたダイはＳＵＳ３０３
製で、その外壁側面部の研磨面にはアモルファスフッ素
樹脂（旭硝子社製「サイトップ」）を厚さ２μｍで被覆
した。比較例として、当該被覆を行わない図３の構成の
ダイを備えた塗布装置を用意した。また、塗布液として
はフォトレジスト（東京応化社製「ＯＦＰＲ８００」）
を固形分濃度１３〜１４重量％に調製した溶液を用い
た。ＳＵＳ３０３研磨面の表面エネルギーの各項は、そ
れぞれ分散項が３３．９×１０-3Ｎ／ｍ、極性項が０．
５２×１０-3Ｎ／ｍ、水素結合項が０Ｎ／ｍであり、塗
布液との接触角は３６．８°であった。また、上記アモ
ルファスフッ素樹脂の表面エネルギーの各項は、それぞ
れ分散項が１９．８×１０-3Ｎ／ｍ、極性項が４．１４
×１０-3Ｎ／ｍ、水素結合項が０Ｎ／ｍであり、塗布液
との接触角は５２．８°の撥水性の高い樹脂であった。EXAMPLE A coating apparatus provided with a die having the structure shown in FIG. 1 was constructed, and a coating film was formed on a glass substrate (thickness: 1.1 mm, the coating surface was polished). The die used was SUS303
The polished surface of the side wall of the outer wall was coated with an amorphous fluororesin ("CYTOP" manufactured by Asahi Glass Co., Ltd.) to a thickness of 2 μm. As a comparative example, a coating apparatus provided with a die having the configuration shown in FIG. 3 and not performing the coating was prepared. The coating liquid is a photoresist (“OFPR800” manufactured by Tokyo Ohkasha).
Was prepared to a solid concentration of 13 to 14% by weight. Each of the terms of the surface energy of the SUS303 polished surface has a dispersion term of 33.9 × 10 −3 N / m and a polar term of 0.3.
52 × 10 −3 N / m, the hydrogen bonding term was 0 N / m, and the contact angle with the coating solution was 36.8 °. The surface energy of the amorphous fluororesin has a dispersion term of 19.8 × 10 −3 N / m and a polar term of 4.14.
× 10 −3 N / m, the hydrogen bond term was 0 N / m, and the contact angle with the coating solution was 52.8 °, which was a highly water-repellent resin.
【００１８】上記塗布装置を用いて、上記フォトレジス
ト溶液をキュア後の膜厚が２μｍとなるように塗膜を形
成した。その結果、実施例のアモルファスフッ素樹脂を
被覆したダイを用いた塗布装置では、塗布開始時に液溜
まりやビードの発生がなく、塗布開始位置から均一で高
品位な塗膜が形成された。一方、比較例の塗布装置で
は、基板を移動させて塗布を開始するまでに、ブレード
の外壁側面部にフォトレジスト溶液が回り込み、多量の
溶液がダイ先端部に付着して大きな液滴が形成された。
そのため、該液滴が基板と接触した時点で大きな液溜ま
りとビードが発生し、塗布開始位置において塗膜の幅が
スリットの幅よりも１０〜２０ｍｍ程度大きくなり、キ
ュア後の膜厚が１０μｍ以上の端部が厚い塗膜が形成さ
れた。また、塗膜全体に筋ムラが発生していた。Using the above-mentioned coating apparatus, a coating film was formed so that the thickness of the photoresist solution after curing was 2 μm. As a result, in the coating apparatus using the die coated with the amorphous fluororesin of the example, no liquid pool or bead was generated at the start of coating, and a uniform and high-quality coating film was formed from the coating start position. On the other hand, in the coating apparatus of the comparative example, by the time the substrate is moved and the coating is started, the photoresist solution wraps around the outer wall side surface of the blade, and a large amount of the solution adheres to the tip of the die to form large droplets. Was.
Therefore, when the droplet comes into contact with the substrate, a large liquid pool and a bead are generated, and the width of the coating film is about 10 to 20 mm larger than the width of the slit at the coating start position, and the film thickness after curing is 10 μm or more. A thick coating film was formed at the end of the film. In addition, stripe unevenness occurred throughout the coating film.
【００１９】[0019]
【発明の効果】以上説明したように、本発明の塗布装置
においては、ダイコート法による塗膜の形成において、
ダイ先端部における余分な塗布液の付着が低減されてい
るため、塗布開始位置における液溜まりやビードの発
生、筋ムラの発生が防止され、全体に均一で高品位な塗
膜を容易に得ることができる。よって、得られた塗膜全
体を有効に用いることができ、該塗膜を利用して、より
安価で高品位なデバイスの大量生産が可能となる。As described above, in the coating apparatus of the present invention, in the formation of a coating film by the die coating method,
Since the adhesion of excess coating liquid at the tip of the die is reduced, it is possible to prevent the formation of liquid pools, beads, and streaks at the coating start position, and to easily obtain a uniform and high-quality coating film as a whole. Can be. Therefore, the entire obtained coating film can be used effectively, and mass production of cheaper and higher-quality devices becomes possible by using the coating film.
【図１】本発明の塗布装置の一実施形態のダイ先端部の
構成を示す断面模式図である。FIG. 1 is a schematic cross-sectional view showing a configuration of a die tip portion of an embodiment of a coating apparatus of the present invention.
【図２】本発明の塗布装置の他の実施形態のダイ先端部
の構成を示す断面模式図である。FIG. 2 is a schematic cross-sectional view showing a configuration of a die tip portion of another embodiment of the coating apparatus of the present invention.
【図３】従来の塗布装置のダイ先端部の構成を示す断面
模式図である。FIG. 3 is a schematic cross-sectional view showing a configuration of a die tip portion of a conventional coating apparatus.
１ 基板 ２ａ，２ｂ ブレード ３ａ，３ｂ 樹脂被覆層 ４ 塗布液 ５ａ，５ｂ 平面部 ６ａ，６ｂ 外壁側面部 DESCRIPTION OF SYMBOLS 1 Substrate 2a, 2b Blade 3a, 3b Resin coating layer 4 Coating liquid 5a, 5b Plane part 6a, 6b Side surface of outer wall
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小寺 泰人 東京都大田区下丸子３丁目30番２号 キヤ ノン株式会社内 Ｆターム(参考） 2H025 AA00 AB16 AB17 EA04 4F041 AA02 AA06 AB02 BA05 BA12 BA17 BA57 CA02 CA23 5F046 JA02 JA27 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yasuto Kodera 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2H025 AA00 AB16 AB17 EA04 4F041 AA02 AA06 AB02 BA05 BA12 BA17 BA57 CA02 CA23 5F046 JA02 JA27
Claims (7)
れたスリットを有するダイを備え、該スリットより塗布
液を押し出すと同時に、該ダイの下方に配置した基板を
該ダイに対して相対的に平行移動させることにより、該
基板上に上記塗布液からなる塗膜を形成する塗布装置で
あって、上記ブレードの先端部近傍の外壁側面部が塗布
液との接触角が５０°以上となるように表面処理されて
いることを特徴とする塗布装置。1. A die having a slit formed by at least two blades, wherein a coating liquid is extruded from the slit, and at the same time, a substrate disposed below the die is translated relative to the die. A coating apparatus for forming a coating film comprising the coating liquid on the substrate by causing the outer wall side surface near the tip of the blade to have a contact angle with the coating liquid of 50 ° or more. A coating device characterized by being processed.
が３０°以下である請求項１に記載の塗布装置。2. The coating apparatus according to claim 1, wherein a contact angle of the tip of the slit with a coating liquid is 30 ° or less.
布液との接触角が５０°以上の樹脂被覆である請求項１
または２に記載の塗布装置。3. The surface treatment of the side wall portion of the outer wall of the blade is a resin coating having a contact angle with the coating liquid of 50 ° or more.
Or the coating device according to 2.
被覆である請求項３に記載の塗布装置。4. The coating apparatus according to claim 3, wherein the surface treatment is an amorphous fluororesin coating.
する方向の幅が０．２〜１．０ｍｍの基板に対して平行
な平面部を有する請求項１〜４に記載の塗布装置。5. The coating apparatus according to claim 1, wherein the blade tip has a flat portion parallel to a substrate having a width of 0.2 to 1.0 mm in a direction perpendicular to the slit.
の接触角が３０°以下である請求項５に記載の塗布装
置。6. The coating apparatus according to claim 5, wherein a contact angle of the flat part of the blade tip with a coating liquid is 30 ° or less.
端部でなす角度が４５〜９０°である請求項１〜６のい
ずれかに記載の塗布装置。7. The coating apparatus according to claim 1, wherein an angle formed between the outer wall side surface portions of the two blades at the tip portions is 45 to 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000096626A JP2001276709A (en) | 2000-03-31 | 2000-03-31 | Coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000096626A JP2001276709A (en) | 2000-03-31 | 2000-03-31 | Coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001276709A true JP2001276709A (en) | 2001-10-09 |
Family
ID=18611364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000096626A Withdrawn JP2001276709A (en) | 2000-03-31 | 2000-03-31 | Coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001276709A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004009248A1 (en) * | 2002-07-18 | 2004-01-29 | Dai Nippon Printing Co., Ltd. | Die head for coating, coating device, and method of manufacturing die head for coating |
| JP2004351349A (en) * | 2003-05-30 | 2004-12-16 | Dainippon Printing Co Ltd | Die head for coating and coating apparatus and production method of die head for coating |
| US7255896B2 (en) | 2003-05-21 | 2007-08-14 | Konica Minolta Medical & Graphic, Inc. | Producing method for die coater and coating apparatus |
| JP2011131116A (en) * | 2009-12-22 | 2011-07-07 | Konica Minolta Holdings Inc | Coating method and organic electroluminescence element |
-
2000
- 2000-03-31 JP JP2000096626A patent/JP2001276709A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004009248A1 (en) * | 2002-07-18 | 2004-01-29 | Dai Nippon Printing Co., Ltd. | Die head for coating, coating device, and method of manufacturing die head for coating |
| US7160390B2 (en) | 2002-07-18 | 2007-01-09 | Dai Nippon Printing Co. Ltd | Die head coating, coating device, and method of manufacturing die head for coating |
| CN100430151C (en) * | 2002-07-18 | 2008-11-05 | 大日本印刷株式会社 | Die head coating, coating device, and method of manufacturing die head for coating |
| US7255896B2 (en) | 2003-05-21 | 2007-08-14 | Konica Minolta Medical & Graphic, Inc. | Producing method for die coater and coating apparatus |
| JP2004351349A (en) * | 2003-05-30 | 2004-12-16 | Dainippon Printing Co Ltd | Die head for coating and coating apparatus and production method of die head for coating |
| JP4601918B2 (en) * | 2003-05-30 | 2010-12-22 | 大日本印刷株式会社 | COATING DIE HEAD, COATING DEVICE, AND METHOD FOR PRODUCING COATING DIE HEAD |
| JP2011131116A (en) * | 2009-12-22 | 2011-07-07 | Konica Minolta Holdings Inc | Coating method and organic electroluminescence element |
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