JP2004349601A - Method and device for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount an electronic component efficiently on a division substrate when inventory of a specific electronic component is limited to 'the designated number'. <P>SOLUTION: The presence or absence of a bad mark M marked in each substrate part of a division substrate 6 is detected by a detection sensor 57. The number of non-defective substrate parts obtained by detection result of the detection sensor 57 is counted by a counter 58 for the number of substrate parts. If the number of non-defective substrate parts attains to the prescribed number, it is treated as defective even if detection result shows non-defective. When detection of each substrate part of the division substrate 6 by the detection sensor is finished, the electronic component 5 is mounted only on a non-defective substrate part and mounting operation after the total number of non-defective substrate parts whereon the electronic component 5 is mounted attains to the prescribed number is controlled to be stopped by a CPU 42. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a split board.
[0002]
[Prior art]
An electronic component mounting apparatus for mounting an electronic component on a split board is disclosed in, for example, JP-A-2001-77596. In these electronic component mounting apparatuses, the presence or absence of a bad mark (meaning it is defective) attached to each split board portion on the split board is detected. Control is performed so that the electronic component is not mounted on the board portion.
[0003]
[Patent Document]
JP 2001-77596 A
[Problems to be solved by the invention]
However, as described above, the presence or absence of a bad mark attached to each split board portion on the split board is detected, and if there is a bad mark, control is performed so that no electronic components are mounted on the split board portion. That is, only the determination of the mounting of the electronic component on the split board portion is made by detecting the bad mark.
[0005]
For this reason, when the stock of the specific electronic component is limited to the “specified number”, the mounting operation on the split board is completed at the stage when the specified number of electronic components are mounted. Therefore, a split board portion on which only other electronic components other than the specific electronic component are mounted occurs, and the split board portion on which the specified number of specific electronic components are mounted is established as a completed product, but other split board portions are formed. The substrate portion is an unfinished product, and there has been a problem that all electronic components mounted up to that point become useless.
[0006]
Therefore, an object of the present invention is to mount electronic components without waste on a split board when the stock of a specific electronic component is limited to a “specified number”.
[0007]
[Means for Solving the Problems]
Therefore, a first invention is an electronic component mounting apparatus for mounting an electronic component on a good board portion of a split board, a detection sensor for detecting presence or absence of a defective mark attached to each board portion of the split board, A counter that counts the number of non-defective boards based on the detection result of the detection sensor, and mounts the electronic components only on the non-defective boards when the detection sensor completes the detection of each board portion of the split board and removes the electronic components. A control device is provided for controlling the subsequent mounting operation to be stopped when the total number of mounted non-defective substrates reaches a predetermined number.
[0008]
According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component on a good board portion of a split board, a detection sensor for detecting presence or absence of a defective mark attached to each board portion of the split board, A counter for counting the number of non-defective boards based on the detection result of the sensor, a processing device for processing the detected results as non-defective even if the total number of non-defective boards reaches a predetermined number; When the detection of each board part is completed, the electronic parts are mounted only on the non-defective board parts, and the subsequent mounting operation is stopped when the total number of non-defective board parts with the mounted electronic parts reaches a predetermined number. And a control device for controlling.
[0009]
According to a third aspect of the present invention, in the electronic component mounting method for mounting an electronic component on a good board portion of a split board, the presence or absence of a defective mark on each board portion of the split board is detected by a detection sensor. The number of non-defective boards based on the detection result of the detection sensor is counted by a counter, and when the detection sensor has completed the detection of each board part of the split board, the electronic components are mounted on the non-defective boards only and the electronic components are mounted. When the total number of non-defective substrates reaches a predetermined number, the subsequent mounting operation is controlled so that the control device stops.
[0010]
According to a fourth aspect of the present invention, in the electronic component mounting method for mounting an electronic component on a good board portion of a split board, the presence or absence of a defective mark attached to each board portion of the split board is detected by a detection sensor. The number of non-defective boards based on the detection result of the sensor is counted by a counter, and when the total number of non-defective boards reaches a predetermined number, even the non-defective result is treated as a defective, and each of the boards of the split board by the detection sensor When the detection of the part is completed, the electronic component is mounted only on the non-defective substrate part, and the control device stops the subsequent mounting operation when the total number of non-defective substrate parts having mounted the electronic part reaches the predetermined number. It is characterized by controlling.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2, reference numeral 1 denotes a Y table that moves in the Y direction by driving a Y-axis motor 2, and 3 denotes a Y table that moves in the X direction on the Y table 1 by driving an X-axis motor 4. As a result, it is an XY table that moves in the XY directions, and a split board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as an electronic component or a component) is mounted is fixedly mounted on a positioning and fixing means (not shown). The split board 6 includes a plurality of split board sections 6A, 6B,... On which a plurality of types of electronic components are mounted in a repetitive pattern.
[0012]
Reference numeral 7 denotes a supply table on which a number of component supply units 8 for supplying the electronic components 5 are provided. Reference numeral 9 denotes a supply table drive motor, which rotates the ball screw 10 so that the supply table 7 is guided by the linear guide 12 through a nut 11 fitted with the ball screw 10 and fixed to the supply table 7, and X Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. A mounting head 15 having a plurality of suction nozzles 14 is arranged at an outer edge of the table 13 at equal intervals in accordance with a pitch at which the nozzle 14 rotates intermittently.
[0013]
The stop position (the position indicated by the black circle in the upper part of FIG. 1) of the mounting head 15 where the suction nozzle 14 stops the intermittent rotation of the rotary table 13 to suck and take out the electronic component 5 from the component supply unit 8 is the suction station I. In addition, when the mounting head 15 is lowered at the suction station I, the suction nozzle 14 suctions and takes out the electronic component 5.
[0014]
Reference numeral II denotes a recognition station in which the mounting head 15 sucking the electronic component 5 stops due to the intermittent rotation of the rotary table 13, an image of the electronic component 5 is taken by the component recognition camera 16, and the displacement of the electronic component 5 with respect to the suction nozzle 14. Is recognized.
[0015]
Reference numeral III denotes a mounting station at which the mounting head 15 stops in order to mount the electronic component 5 sucked and held by the suction nozzle 14 on the split board 6 (a position indicated by a black circle in FIG. 1). The electronic component 5 is mounted on the split board 6 stopped at a predetermined position by the movement of the XY table 3 due to the lowering of the electronic component 5.
[0016]
Reference numeral 18 denotes a power line for transmitting a current from a drive circuit 41 stored in a rotary table 13 for driving a θ-axis motor 40 composed of a pulse motor for rotating the suction nozzle 14 provided on the mounting head 15 by θ. , A power line for transmitting current to the vacuum valve and a cable including electric wires for transmitting and flowing current to other current driving loads, and are connected to each mounting head 15. A vacuum tube 19 communicates with a vacuum source (not shown) for sucking the electronic component 5 from the suction nozzle 14. The mounting head 15 is attached to a linear guide 22 via a head block 21, and is vertically movable with respect to the rotary table 13.
[0017]
The component supply unit 8 includes a tape reel 34 on which a carrier tape (not shown) for supplying electronic components is wound, a tape feeding device 30 that feeds the carrier tape from the tape reel 34 by one pitch, and a cover for the carrier tape. And a take-up reel 31 for winding the tape. The carrier tape is composed of a tape main body in which electronic components are accommodated in component accommodating recesses formed at an equal pitch and a large number of sprocket holes are formed in side portions, and a cover tape.
[0018]
Numeral 32 is a tape feed drive lever which moves up and down to move the drive lever 33 of the tape feeder 30 up and down, and is driven in synchronization with the rotary table 13 to move the tape feed drive lever 32 up and down. The carrier tape wound in the tape reel 34 is intermittently fed, and the electronic components 5 stored in the storage recesses of the tape are supplied to the suction position of the suction nozzle 14, and the cover tape is placed immediately before the suction position. The electronic component 5 is configured to be sucked and taken out by the suction nozzle 14 that is separated and descends.
[0019]
The take-up reel 31 for winding the cover tape is also driven by a tape feed drive lever 32 (not shown) in synchronization with the rotary table 13, similarly to the tape feed device 30.
[0020]
Next, a control block diagram will be described with reference to FIG. 3. For convenience, only one θ-axis motor 40 provided for each mounting head 15 is illustrated and described below. Reference numeral 42 denotes a CPU as a control unit for integrally controlling the operation of the mounting apparatus 1 relating to the mounting of electronic components; 43, a RAM (random access memory) as a storage device; and 44, a ROM (read only memory). It is. Then, based on the data stored in the RAM 43, the CPU 42 controls the driving sources via the interface 45 for the operation relating to the component mounting operation of the electronic component mounting apparatus in accordance with the program stored in the ROM 44.
[0021]
That is, the CPU 42 drives the X-axis motor 4 via the drive circuit 46, drives the Y-axis motor 2 via the drive circuit 47, and drives the θ-axis motor 40 via the drive circuit 41. Further, the drive of the supply stand drive motor 9 is controlled via a drive circuit 48.
[0022]
The RAM 43 stores the mounting position and mounting direction (angle) in the X direction and the Y direction in the split board 6 for each mounting order of the electronic components and Fdr. No. (arrangement number of each component supply unit 8) information, mounting data such as component arrangement data, and the like are stored.
[0023]
The split board 6 is a printed board on which electronic components are mounted in a repetitive pattern, and the component placement data indicates where the component supply unit 8 that stores the electronic components 5 is located on the supply table 7. Things.
[0024]
Reference numeral 49 denotes a component recognition processing unit connected to the CPU 42 via an interface 45. The recognition processing unit 49 performs recognition processing of an image captured and captured by the component recognition camera 16, and the CPU 42 performs processing. The result is sent. That is, the CPU 42 outputs an instruction to the component recognition processing unit 49 to perform recognition processing (calculation of a displacement amount, etc.) on the image captured by the component recognition camera 16, and receives the recognition processing result from the recognition processing unit 49. Things.
[0025]
That is, when the positional deviation amount is grasped by the recognition processing of the component recognition processing unit 49, the result is sent to the CPU 42, and the CPU 42 drives the XY table 3 in the Y direction by driving the Y-axis motor 2 to move the X-axis motor 4 By rotating the suction nozzle 14 by θ by the θ-axis motor 40 by moving the suction nozzle 14 by θ, the rotation angle position around the X, Y directions and the vertical axis is corrected.
[0026]
50 is a keyboard as input means connected to the CPU 42 via a keyboard driver 51 and an interface 45, and 52 is a monitor for displaying images such as recognition component images. Note that input means such as a touch panel may be used instead of the keyboard 50 as the input means.
[0027]
Reference numeral 55 denotes a start key for starting the automatic operation of mounting the electronic components, reference numeral 56 denotes a stop key for stopping the automatic operation, and reference numeral 57 denotes a bad mark provided on the mounting device in an immovable state and attached to each board portion of the split board 6. A detection sensor 58 for detecting the presence or absence of M (meaning it is a defective product). Reference numeral 58 denotes the number of substrate portions which are not provided with the bad mark M by the detection of the detection sensor 57, that is, which are determined to be non-defective. Reference numeral 59 denotes a board number counter for counting. When the content of the counter 58 reaches a specified number of board parts (preset and stored in the RAM 43 by operating the keyboard 50 constituting the setting device), a predetermined value 59 is set. For example, a notification device, such as a display lamp or a buzzer, for notifying the worker at the time.
[0028]
The above configuration will be described with reference to the flowchart shown in FIG. First, when the start key 55 is operated by the operator, the production operation for the split board 6 is started, and the split board 6 which is a split board having 20 board portions is placed on the XY table 3 by the upstream device. The split substrate 6 is conveyed and positioned and fixed by the positioning means.
[0029]
Since the detection of the bad mark M attached to the split board 6 has not been completed, the XY table 3 is moved to the bad mark detection coordinates of the board section 6A of the split board 6, and then the bad mark is added to the board section 6A. The detection sensor 57 detects whether or not M is added, and when it is determined that the board portion is a good board portion, the board number counter 58 is incremented by “1”, and the contents (“1”) of the board number counter 58 and the board portion designation The CPU 42 compares the number with the number to determine whether the number has reached the designated number.
[0030]
In this case, since the specified number is, for example, “5000” (stored in the RAM 43 in advance) from the stock relationship of the specific electronic component 5, it has not reached yet, so that the substrate 6 A is produced as a non-defective substrate. The XY table 3 is moved to the bad mark detection coordinates of the substrate section 6B since the internal processing is executed so that the detection of the bad mark M is not completed. The detection sensor 57 detects whether or not it is attached, and if it is determined that the board portion is a good board portion, the number of board portion counter 58 is incremented by “1”, and the contents (“2”) of the board portion counter 58 and the designated number of board portions are determined. Is determined by the CPU 42 to determine whether or not the number has reached the specified number. Since the number has not reached, the internal processing is executed so as to produce the substrate unit 6B as a non-defective substrate unit. Detection of bad mark M is carried out to completion.
[0031]
Then, when the detection of the bad mark M is completed, the mounting operation of the electronic component 5 to the non-defective substrate is started. That is, when the tape feed drive lever 32 is lowered by being driven in synchronization with the rotary table 13, the drive lever 33 of the tape feeding device 30 is lowered to intermittently feed the carrier tape wound in the tape reel 34. Then, the electronic component 5 housed in the housing recess of the tape is supplied to the suction position of the suction nozzle 14, the cover tape is peeled off immediately before the suction position and is sucked and taken out by the suction nozzle 14 descending, The take-up reel 31 is also driven to take up the cover tape.
[0032]
When the mounting head 15 stops at the suction station I due to intermittent rotation of the rotary table 13 via an index mechanism (not shown), the supply table 7 is moved by driving the supply table drive motor 9 and the electronic components to be supplied. The component supply unit 8 for housing the suction head 5 is stopped at the suction position of the suction nozzle 14 of the mounting head 15 of the suction station I, and the electronic component 5 is taken out when the suction nozzle 14 descends.
[0033]
Next, the rotary table 13 rotates intermittently, and the mounting head 15 holding the electronic component 5 moves to the next station, stops, and further rotates to move to the recognition station II.
[0034]
Next, an image of the electronic component 5 sucked by the suction nozzle 14 is taken by the component recognition camera 16, and the image thereof is subjected to recognition processing by the component recognition processing unit 49, and the displacement of the component 5 with respect to the suction nozzle 14 is recognized. .
[0035]
Next, when the recognition is completed, the CPU 42 calculates an angle amount by adding the amount to be corrected based on the recognition result to the mounting angle data of the mounting data. The rotary table 13 intermittently rotates to reach the mounting station III in parallel with the rotation of the θ-axis motor 40 so as to reach this angle, and reaches the mounting station III. Is mounted on the split board 6 positioned at the coordinate position indicated by.
[0036]
When the electronic components 5 are mounted on all the non-defective board portions of the split board 6 in this way, the split board 6 is moved to a downstream device (not shown). Then, the CPU 42 compares the contents of the board number counter 58 (for example, “18” when the number of defective boards in the split board 6 is two) and the designated number of board parts (“5000”). It is confirmed whether or not the specified number has been reached, and since the specified number has not been reached, the mounting operation of the electronic component is also performed on the next split board 6.
[0037]
Then, as described above, the mounting of the electronic components on the non-defective substrate portion of the split substrate 6 is performed. However, the detection of the bad mark M of the certain substrate portion on the certain split substrate 6 results in the specified number of substrate portions ("5000"). When it reaches, for example, when it arrives at the fifth of the split substrates 6, the CPU 42 executes internal processing as a defective substrate even after the sixth substrate as a non-defective substrate. When the detection of the bad mark M on the split board 6 is completed and all the electronic components 5 are mounted on the non-defective board section of the split board 6, that is, when the electronic components 5 are mounted on the five non-defective board sections. The split substrate 6 is moved to a downstream device (not shown) (without mounting the remaining 13 of the 18 non-defective products). Then, the CPU 42 compares the content (for example, "5013") of the board number counter 58 with the designated number of board parts ("5000"), and confirms whether the designated number has been reached. The CPU 42 controls the notification device 59 to display a warning indicating that the specified number of substrates has been reached, and to stop production (operation for mounting electronic components).
[0038]
Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited to the above-described various embodiments without departing from the spirit thereof. It is intended to cover alternatives, modifications or variations.
[0039]
【The invention's effect】
As described above, according to the present invention, when the stock of a specific electronic component is limited to the “specified number”, the electronic component can be mounted on the split board without waste.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting device.
FIG. 2 is a partially broken side view of the electronic component mounting apparatus.
FIG. 3 is a control block diagram.
FIG. 4 is a diagram showing a flowchart.
FIG. 5 is a view showing a split substrate.
[Explanation of symbols]
60% board 42 CPU
43 RAM
57 Detection sensor 58 Substrate number counter

Claims (4)

In an electronic component mounting apparatus for mounting an electronic component on a good board portion of a split board, a detection sensor for detecting the presence or absence of a defective mark attached to each board portion of the split board, and a non-defective product based on a detection result of the detection sensor A counter that counts the number of board parts, and when the detection sensor completes the detection of each board part of the split board, the electronic parts are mounted only on non-defective board parts and the total number of non-defective board parts with the mounted electronic parts is A control device for controlling the subsequent mounting operation to be stopped when the predetermined number is reached. In an electronic component mounting apparatus for mounting an electronic component on a good board portion of a split board, a detection sensor for detecting the presence or absence of a defective mark attached to each board portion of the split board, and a non-defective product based on a detection result of the detection sensor A counter that counts the number of board parts of the same, a processing device that, when the total number of non-defective boards reaches a predetermined number, processes the detected result as a defective product even if it is a non-defective product, and detects each board part of the split substrate by the detection sensor A control device that controls the electronic component to be mounted only on the non-defective substrate part when the completion is completed and the subsequent mounting operation is stopped when the total number of non-defective substrate parts on which the electronic component is mounted reaches a predetermined number. An electronic component mounting device, characterized by being provided. In the electronic component mounting method for mounting an electronic component on a good board portion of a split board, a presence or absence of a defective mark attached to each board portion of the split board is detected by a detection sensor, and a non-defective product based on a detection result of the detection sensor The number of board parts is counted by a counter, and when detection of each board part of the split board by the detection sensor is completed, electronic parts are mounted only on non-defective board parts, and the total number of non-defective board parts mounted with electronic parts is An electronic component mounting method, characterized in that the control device stops the subsequent mounting operation when the predetermined number is reached. In the electronic component mounting method for mounting an electronic component on a good board portion of a split board, a presence or absence of a defective mark attached to each board portion of the split board is detected by a detection sensor, and a non-defective product based on a detection result of the detection sensor The number of board parts is counted by a counter, and when the total number of non-defective board parts reaches a predetermined number, the detection result is treated as a defective even a non-defective one, and the detection of the respective substrate parts of the split board by the detection sensor is completed. In the case where the electronic component is mounted only on the non-defective substrate part, the control device stops the subsequent mounting operation when the total number of non-defective substrate parts on which the electronic component is mounted reaches a predetermined number. Electronic component mounting method.

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