JP2004342740A - Method of forming film, method of forming interconnect line, method of manufacturing electro-optical device, electro-optical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a film pattern on a substrate in which a thin film of fine and thin line can be formed conveniently while preventing or suppressing aggregation of patterning material particles. <P>SOLUTION: The method of forming a thin film is characterised by including a step S3 for ejecting (dripping) a liquid drop containing a film material onto a substrate using a liquid drop ejector, and a step S4 for imparting a vibration to the substrate onto which the liquid drop is dripped in order to prevent or suppress aggregation of particles contained in the liquid drop. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is applicable to forming a film of a predetermined pattern such as a conductive film wiring used for wiring of an electrode, an antenna, an electronic circuit, an integrated circuit, a silicon film pattern, and a ferroelectric film pattern. The present invention relates to a suitable film forming method, a wiring forming method using the forming method, an electro-optical device manufacturing method using the wiring forming method, and an electro-optical device and an electronic apparatus.
[0002]
[Prior art]
As a method for forming a wiring used for an electronic circuit or an integrated circuit, for example, a lithography method is known. The lithography method forms a wiring by applying a photosensitive material called a resist on a substrate on which a conductive film has been applied in advance, irradiating and developing a circuit pattern, and etching the conductive film according to the resist pattern. It is. The lithography method requires large-scale equipment such as a vacuum apparatus and complicated steps, has a material use efficiency of about several percent, and has to dispose most of the material, resulting in high manufacturing costs. Therefore, as a process replacing the lithography method, a method of directly patterning a liquid containing a material for pattern formation on a base material by an ink jet method is disclosed in, for example, Patent Document 1.
[0003]
[Patent Document 1]
JP-A-11-274671
[0004]
[Problems to be solved by the invention]
The technique disclosed in the above-mentioned Patent Document 1 is to form a wiring pattern by discharging a liquid material containing a material for pattern formation from an ink jet head onto a substrate, thereby arranging the material on the substrate which is a pattern formation surface. It is considered to be a technology that can cope with small-lot multi-type production.
By the way, in recent years, the density of circuits constituting a device has been increasingly increased, and for example, further miniaturization and thinning of wiring patterns have been required.
However, when such a fine wiring pattern is to be formed by the method disclosed in Patent Document 1, it is difficult to sufficiently obtain the accuracy of the wiring width, and the width is smaller than the diameter of the droplet to be discharged. When a line width is required, for example, there is a problem that it is extremely difficult to cope with the problem. In particular, when the material for pattern formation is included in the liquid as particles as described above, the particles may partially aggregate after the discharge of the liquid, which may cause a reduction in performance such as conductivity of the wiring pattern. is there.
[0005]
The present invention has been made in view of the above circumstances, and is a method capable of easily forming a thin, fine and fine line film when forming a film pattern on a substrate. It is an object of the present invention to provide a method for forming a film that can be accurately formed by a simple method and that can prevent or suppress agglomeration of material particles for pattern formation and contribute to improving the performance of the film. I do.
In addition, the present invention provides a wiring forming method particularly suitable for forming a fine and highly reliable wiring pattern, and a method for manufacturing an electro-optical device using the wiring forming method, and a highly reliable electro-optical device and an electronic device. The purpose is to provide equipment.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, a film forming method according to the present invention is a film forming method for forming a film on a substrate, wherein a droplet including a film material is dropped on the substrate by using a droplet discharge device. And a vibration step of applying vibration to the substrate on which the droplet has been dropped to prevent or suppress aggregation of particles contained in the dropped droplet.
[0007]
According to such a film forming method, the vibration process prevents or suppresses the aggregation of particles in the formed film, and prevents the film thickness from being uneven due to the aggregation of the particles and the line width from being uneven. It becomes possible. In addition, based on the prevention or suppression of the aggregation of the particles, the performance of the formed film is reduced, for example, the physical strength of the film is reduced, or the properties of the film are made non-uniform (the properties differ depending on the position of the film. ) Can be prevented or suppressed, and it is possible to easily form a thin film which is fine, fine and easy to design desired properties.
[0008]
In the film forming method of the present invention, the substrate vibration step may be performed simultaneously with the dropping of the droplets or after the droplets are dropped. The above effect can be achieved even if the vibration is performed at any timing. However, if the substrate is vibrated simultaneously with the dropping, the dropping position may be shifted. In this case, it is preferable to perform the substrate vibration, but from the viewpoint of improving the manufacturing efficiency, it is preferable to perform the dropping and the substrate vibration in the same step. Note that as the vibration performed on the substrate, for example, a fine vibration such as an ultrasonic vibration is preferable.
[0009]
In the dropping step, while a plurality of droplets are ejected by scanning the ejection head of the droplet ejection device in one direction, the scanning in the one direction is performed a plurality of times. Can drop new droplets between droplets dropped by the head scanning before the nth time. In this case, since the scanning in one direction is performed a plurality of times (that is, the overcoating is performed), it is easy to form a continuous film in the one direction, and in the (n + 1) th and subsequent head scanning, the nth scanning is performed. Since a new droplet is dropped between droplets dropped by one of the previous head scans, a film that is continuous in the scanning direction is more easily formed. Moreover, in the present invention, the substrate is vibrated after or simultaneously with the dropping of the droplet, so that not only the occurrence of discontinuous regions of the formed film is avoided, but also the aggregation of particles contained in the droplet is prevented. It is possible to form a more reliable film that is prevented or suppressed. Further, by vibrating such a substrate, it is possible to form a continuous and uniform film without repeating coating repeatedly.
In the present invention, “in the head scanning after the (n + 1) -th time, a new droplet is dropped between droplets dropped by any one of the head scanning before the n-th time” means that at least the head scanning after the (n + 1) -th time Means that the ejection is performed in a non-identical ejection pattern with the ejection pattern of the droplet dropped by any one of the head scans before the n-th time, and This means dropping new droplets of crab.
[0010]
Prior to the dropping step, a step of performing a lyophilic treatment on a region on the substrate where a film is formed (film forming region) may be included. By such a lyophilic treatment, it is possible to suitably spread the droplets dropped into the film formation region in the region, and to further ensure uniform film formation in the region by applying vibration. It becomes possible. Also, even if the droplet is ejected out of alignment with the film forming region, the vibration is applied to move the droplet to the region where the lyophilic treatment was performed, and a film as designed can be formed. The “film formation region” in the present invention refers to a region where a film pattern is to be formed, and is mainly composed of a single or a plurality of straight lines and curves.
[0011]
Further, prior to the dropping step, a step of forming a partition wall portion on the substrate so as to surround a region where a film is formed can be included. In this case, the partition allows the liquid material to be prevented or suppressed from entering the region other than the film forming region, and the desired film pattern can be formed more reliably, and particularly in the vibration step. It is possible to reliably prevent problems such as the liquid material breaking the pattern.
[0012]
Further, in the film forming method of the present invention, after forming the partition, the surface of the partition is subjected to lyophobic treatment, while the lyophilic treatment is performed on the bottom surface of the groove formed by the partition. be able to. In this case, adhesion of the liquid material (droplets) to the surface of the partition is prevented, and a film is more reliably formed on the lyophilic processing region (bottom of the groove) formed on the substrate surrounded by the partition. It is possible to form a film having a pattern corresponding to the partition wall shape.
[0013]
Next, the film forming method of the present invention can be suitably used for forming a silicon film pattern, forming an insulating film pattern such as polyimide, forming a resist film pattern, etc., and is particularly suitable for forming a wiring pattern of a conductive film. ing.
That is, the wiring forming method of the present invention is characterized in that the above-mentioned film forming method is used, and in the dropping step, while dropping a droplet containing a conductive material as the film material, Vibration for preventing or suppressing aggregation of the conductive material particles contained in the dropped droplet is applied to the substrate on which the droplet is dropped. That is, in the above-mentioned film forming method, fine conductive film patterns (wiring patterns) can be suitably formed by including particles of the conductive material as film forming components of the liquid material. In addition, according to the method of the present invention, vibration is applied to prevent agglomeration of particles, so that a discontinuous region of the film is less likely to occur, and thus disconnection, short circuit, or local increase in resistance is prevented or suppressed. And good conductivity can be ensured. Note that as the conductive material, various metallic conductive materials can be used, and specifically, a material containing an organic silver compound can be used.
[0014]
Next, a method for manufacturing an electro-optical device according to the present invention includes a wiring forming step using the above-described wiring forming method. According to such a method, it is possible to provide an electro-optical device provided with fine wiring with few conductive defects, and an electronic device including the electro-optical device becomes very reliable. In addition, as the electro-optical device of the present invention, for example, a liquid crystal display device, an organic electroluminescence display device, a plasma display device and the like can be exemplified.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments according to the present invention will be described.
[First Embodiment]
As a first embodiment, a wiring forming method which is an example of the film forming method of the present invention will be described. As shown in FIG. 1, the wiring forming method according to the present embodiment includes a surface treatment step S1, a dispersion (liquid) preparation step S2, a discharge (drop) step S3, a vibration step S4, and a drying step S5. It is comprised including. Hereinafter, each step will be described.
[0016]
(Surface treatment step S1)
As the substrate S on which the conductive film wiring is to be formed, various substrates such as a Si wafer, quartz glass, glass, plastic film, and metal plate can be used. A substrate in which a semiconductor film, a metal film, a dielectric film, an organic film, or the like is formed as a base layer on the surface of each of these various material substrates may be used as a substrate on which conductive film wiring is to be formed. The surface of the substrate S on which the conductive film wiring is to be formed preferably has lyophilic property with respect to a dispersion (liquid) containing conductive fine particles described later in a region where the conductive film wiring is formed, It is preferable that a region where the conductive film wiring is not formed has liquid repellency to the dispersion (liquid material).
In order to control the surface wettability, various surface treatment methods described below can be employed.
[0017]
As one of the surface treatment methods, there is a method of forming a self-assembled film made of an organic molecular film or the like on the surface of a substrate on which a conductive film wiring is to be formed.
The organic molecular film for treating the substrate surface has a functional group that can bind to the substrate and a functional group that modifies the surface properties of the substrate (controls the surface energy) such as a lyophilic group or a lyophobic group on the opposite side. And a carbon chain connecting these functional groups, which is a linear or partially branched carbon chain, is bonded to a substrate and self-organized to form a molecular film, for example, a monomolecular film.
[0018]
The self-assembled film is composed of a bonding functional group capable of reacting with constituent atoms such as a base layer such as a substrate, and other linear molecules, and orienting a compound having extremely high orientation by the interaction of the linear molecules. This is a film formed by the above. Since the self-assembled film is formed by orienting single molecules, the film thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, it is possible to impart uniform and excellent lyophobicity and lyophilicity to the surface of the film.
[0019]
When, for example, fluoroalkylsilane (hereinafter referred to as “FAS”) is used as the compound having high orientation, each compound is oriented so that the fluoroalkyl group is located on the surface of the film, and the self-organization is performed. Since the oxide film is formed, uniform liquid repellency is imparted to the surface of the film.
FAS generally has the structural formula RnSiX _(4-n) Is represented by Here, n represents an integer of 1 to 3, and X is a hydrolyzable group such as a methoxy group, an ethoxy group, and a halogen atom. R is a fluoroalkyl group, and (CF ₃ ) (CF ₂ ) X (CH ₂ ) _y (Where x represents an integer of 0 or more and 10 or less, and y represents an integer of 0 or more and 4 or less), and when a plurality of R or X is bonded to Si, R or X is Each may be the same or different. The hydrolyzable group represented by X forms silanol by hydrolysis, reacts with the hydroxyl group of the base such as a substrate (glass, silicon) or the like, and binds to the substrate by a siloxane bond. On the other hand, R ₃ ), The surface of the base such as the substrate is modified into a non-wetting (low surface energy) surface.
[0020]
In the present embodiment, after lyophilicity is imparted to the entire surface of the substrate S by oxygen plasma processing, lyophobic treatment is performed by FAS on a region on the substrate where no conductive film wiring is formed. A region where no wiring is formed (a region where a wiring pattern is not formed) shows liquid repellency to the dispersion (liquid), and a region where the conductive film wiring is to be formed shows lyophilicity to the dispersion (liquid). It will be. Note that the lyophilic treatment by oxygen plasma or the like on the entire surface of the substrate S is not essential, and the formation of the conductive film wiring is performed only by selectively imparting the liquid repellency to the region where the conductive film wiring is not formed by the above FAS. It is also possible to make the scheduled area lyophilic relative to the dispersion (liquid). In the present embodiment, the region where the conductive film wiring is to be formed can be formed as a pattern having a line width of about 10 μm, for example.
[0021]
(Dispersion liquid preparation step S2)
Next, a dispersion (liquid) containing conductive fine particles to be discharged onto the substrate after the surface treatment will be described.
As the liquid containing the conductive fine particles, a dispersion in which the conductive fine particles are dispersed in a dispersion medium is used. Examples of the conductive fine particles used herein include metal fine particles containing any of gold, silver, copper, palladium, and nickel, and organic metal compound substances such as organic silver compounds, conductive polymers, and fine particles such as superconductors. Is mentioned.
[0022]
The conductive fine particles may be used by coating the surface with an organic substance or the like in order to improve dispersibility. Examples of the coating material for coating the surface of the conductive fine particles include organic solvents such as xylene and toluene, and citric acid. The particle diameter of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. If the thickness is larger than 0.1 μm, nozzle clogging is likely to occur, and it becomes difficult to perform ejection by an inkjet method described later. On the other hand, if it is smaller than 5 nm, the volume ratio of the coating material to the conductive fine particles becomes large, and the ratio of the organic substance in the obtained film becomes excessive.
[0023]
As a dispersion medium suitable for the conductive fine particles, those having a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa) are preferable. If the vapor pressure is higher than 200 mmHg, the dispersion medium will rapidly evaporate after discharge, making it difficult to form a good film. Further, the vapor pressure of the dispersion medium is more preferably 0.001 mmHg or more and 50 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). If the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying is likely to occur when droplets are ejected by an inkjet method described later, and stable ejection becomes difficult. On the other hand, in the case of a dispersion medium having a vapor pressure of less than 0.001 mmHg at room temperature, drying is delayed, and the dispersion medium is likely to remain in the film, and it is difficult to obtain a high-quality conductive film after drying.
[0024]
The dispersoid concentration when the conductive fine particles are dispersed in a dispersion medium is, for example, about 1% by mass to 80% by mass, and can be adjusted according to a desired thickness of the conductive film. If it exceeds 80% by mass, aggregation tends to occur, and it is difficult to obtain a uniform film.
The viscosity of the dispersion after dispersing the conductive fine particles is preferably 1 mPa · s or more and 50 mPa · s or less. When the ink is ejected by an ink-jet method described later, if the viscosity is smaller than 1 mPa · s, the peripheral portion of the nozzle of the ink-jet device used is easily contaminated by the outflow of ink. This is because the frequency of clogging at the nozzle hole becomes high, and it becomes difficult to discharge the droplet smoothly.
[0025]
(Ejection step S3)
Next, the prepared dispersion liquid of the conductive fine particles is patterned and discharged by an inkjet method. This discharge step was performed using an ink jet device (droplet discharge device) 300 as shown in FIG.
[0026]
FIG. 6 is a perspective view illustrating a schematic configuration of the inkjet device 30. The ink jet device 30 includes a base 31, a substrate moving unit 32, a head moving unit 33, an ink jet head (head) 34, an ink (liquid) supply unit 35, and the like. The base 31 is provided with the substrate moving means 32 and the head moving means 33 thereon.
[0027]
The substrate moving means 32 is provided on the base 31 and has a guide rail 36 arranged along the Y-axis direction. The substrate moving means 32 is configured to move the slider 37 along the guide rail 36 by, for example, a linear motor. The slider 37 is provided with a motor (not shown) for the θ-axis. This motor is, for example, a direct drive motor, and its rotor (not shown) is fixed to the table 39. Under such a configuration, when power is supplied to the motor, the rotor and the table 39 rotate in the θ direction, and the table 39 is indexed (rotated).
[0028]
The table 39 positions and holds the substrate S (corresponding to the lower substrate 10). That is, the table 39 has a known suction holding means (not shown), and the substrate S is suction-held on the table 39 by operating the suction holding means. The substrate S is accurately positioned and held at a predetermined position on the table 39 by positioning pins (not shown) of the table 39. The table 39 is provided with a discard area 41 for the ink jet head 34 to discard or test-strike ink (liquid composition). The discard area 41 is formed extending in the X-axis direction, and is provided on the rear end side of the table 39. Further, the table 39 is provided with an ultrasonic oscillator 49 for slightly vibrating the substrate S held on the table 39.
[0029]
The head moving means 33 includes a pair of stands 33a, 33a erected on the rear side of the base 31, and a traveling path 33b provided on the stands 33a, 33a. They are arranged along the axial direction, that is, the direction perpendicular to the Y-axis direction of the substrate moving means 32. The traveling path 33b is formed with a holding plate 33c passed between the gantry 33a, 33a and a pair of guide rails 33d, 33d provided on the holding plate 33c. A slider 42 for holding the inkjet head 34 in the length direction of 33d is movably held. The slider 42 travels on the guide rails 33d, 33d by operation of a linear motor (not shown) or the like, thereby moving the inkjet head 34 in the X-axis direction.
[0030]
Motors 43, 44, 45, 46 as swing positioning means are connected to the inkjet head 34. When the motor 43 is operated, the ink jet head 34 moves up and down along the Z axis, and positioning on the Z axis is possible. The Z axis is a direction (vertical direction) orthogonal to the X axis and the Y axis. When the motor 44 is operated, the ink jet head 34 swings along the direction β in FIG. 6 and can be positioned. When the motor 45 is operated, the ink jet head 34 swings in the γ direction and the positioning is performed. When the motor 46 is operated, the ink jet head 34 swings in the α direction and can be positioned.
[0031]
As described above, the inkjet head 34 can be positioned by linearly moving in the Z-axis direction on the slider 42, and can swing and position along α, β, and γ. Therefore, the position or posture of the ink ejection surface of the inkjet head 34 with respect to the substrate S on the table 39 side can be accurately controlled.
[0032]
Here, as shown in FIG. 7A, the inkjet head 34 includes a nozzle plate 112 made of, for example, stainless steel and a vibration plate 113, and both are joined via a partition member (reservoir plate) 114. A plurality of spaces 115 and a liquid pool 116 are formed between the nozzle plate 112 and the vibration plate 113 by a partition member 114. Each space 115 and the inside of the liquid pool 116 are filled with ink (corresponding to the above-mentioned dispersion liquid), and each space 115 and the liquid pool 116 communicate with each other via a supply port 117. A plurality of nozzle holes 118 for ejecting ink (dispersion liquid) from the space 115 are formed in the nozzle plate 112 in a line. On the other hand, a hole 119 for supplying ink to the liquid reservoir 116 is formed in the diaphragm 113.
[0033]
In addition, a piezoelectric element (piezo element) 120 is bonded to the surface of the diaphragm 113 opposite to the surface facing the space 115 as shown in FIG. 7B. The piezoelectric element 120 is located between the pair of electrodes 121, and is configured to bend so as to protrude outward when energized. The diaphragm 113 to which the piezoelectric element 120 is bonded under such a configuration is configured to bend outward simultaneously with the piezoelectric element 120, thereby reducing the volume of the space 115. It is increasing. Therefore, ink corresponding to the increased volume in the space 115 flows from the liquid pool 116 through the supply port 117. When the current supply to the piezoelectric element 120 is released from such a state, both the piezoelectric element 120 and the diaphragm 113 return to their original shapes. Therefore, since the space 115 also returns to the original volume, the pressure of the ink inside the space 115 increases, and the ink droplet 122 is ejected from the nozzle hole 118 toward the substrate S. The ink jet system of the ink jet head 34 may be a system other than the piezo jet type using the piezoelectric element 120 described above.
[0034]
Returning to FIG. 6, the ink supply means 35 includes an ink supply source 47 for supplying ink to the inkjet head 34, and an ink supply tube 48 for sending ink from the ink supply source 47 to the inkjet head 34. . That is, a method is adopted in which the ink is temporarily stored in an ink supply source 47 made of a container made of stainless steel or the like, and the ink is supplied to the head from the ink supply source 47 by an ink supply tube 48.
[0035]
In the case of the present embodiment, the surface of the substrate S on which ink is to be dropped is subjected to the surface treatment as described above, and the ink is ejected along the lyophilic region of the substrate S. . Then, at the time of ejection, the same area of the substrate S is scanned by the inkjet head 34 a plurality of times to perform so-called multi-coating.
[0036]
FIGS. 2 and 3 are a schematic plan view (a) and a schematic cross-sectional view (b) showing the vicinity of a region H of the substrate S that has been subjected to the lyophilic treatment. First, as shown in FIG. 2, in the present embodiment, in the first ejection step, the ink I1 is dropped on the lyophilic region H at predetermined intervals (approximately 60 μm pitch), and then shown in FIG. As described above, in the second ejection step, the ink I2 is dropped between the already ejected inks I1 and I1 (between the adjacent droplets I1 and I1 in the lyophilic region H). As described above, by performing the ejection in a plurality of steps, it is possible to form a continuous ink droplet without unevenness in the lyophilic region H which is the conductive film forming region.
[0037]
(Vibration step S4)
Subsequent to the ejection step, a vibration step is performed. This vibration step is performed in order to form a conductive film having a uniform thickness in the lyophilic region H (see FIG. 3) of the substrate S by applying a slight vibration to the substrate S from which the ink has been discharged. . Specifically, ultrasonic vibration is applied to the substrate S by the ultrasonic oscillator 49 provided on the table 39 of the ink jet device 30 shown in FIG.
[0038]
The vibration in this case is also performed in the X-axis direction, the Y-axis direction, and the Z-axis direction shown in FIG. 6, and by applying the vibration to the substrate S in this manner, the vibration shown in FIG. As shown in FIG. 4, such inks I1 and I2 are uniformly diffused in the lyophilic region H to eliminate irregularities on the surface, and have a more uniform film thickness and few discontinuous portions. M can be formed. In addition, the ink that has been dropped on the lyophobic region G (see FIG. 4) around the lyophilic region H can also be attracted to the lyophilic region H by the above-described vibration.
[0039]
In particular, in the present embodiment, the conductive material particles are contained in the ink, and the vibration causes the conductive material particles to be evenly diffused in the conductive film M. Therefore, the conductive film wiring formed by the method of the present embodiment can be a wiring having a uniform thickness, few discontinuous portions, and few disconnections and short circuits.
[0040]
In the main vibration step, the amplitude and frequency of the vibration applied to the substrate S may be any amplitude and frequency that can move the ink and the conductive material particles contained in the ink. Further, the vibration generating device is not limited to the ultrasonic oscillator 49, and for example, a device using a piezo element, a device using mechanical driving, or the like can be used.
[0041]
Further, in the present embodiment, the substrate vibration step is performed after the ink is discharged. However, the discharge step and the vibration step can be performed simultaneously. That is, a conductive film having a uniform film thickness and a small number of discontinuous portions can also be formed by discharging ink while applying micro-vibration to the substrate S.
[0042]
(Drying step S5)
After performing ink ejection and substrate vibration, a drying process is performed as necessary to remove the dispersion medium. The drying process can be performed by lamp annealing, for example, in addition to a process using a normal hot plate or an electric furnace for heating the substrate S. Usually, heating at about 100 ° C. may be performed for several minutes.
[0043]
Through the above steps, a conductive wiring as a predetermined film pattern is formed. In this case, the wiring can be thinned, the film thickness can be made uniform, and the edge shape can be improved. Therefore, according to the method of the present embodiment, it is possible to form a fine conductive film wiring which is excellent in electric conductivity, hardly causes defects such as disconnection and short circuit, and the like.
[0044]
[Second embodiment]
As a second embodiment, a different embodiment of a wiring forming method which is an example of the film forming method of the present invention will be described. As shown in FIG. 5, the wiring forming method according to the present embodiment includes a bank forming step S11, a surface treatment step S12, a dispersion (liquid) preparation step S13, a discharge vibration step S14, and a drying step S15. It is comprised including. Hereinafter, each step will be described. However, in the second embodiment, the dispersion liquid (liquid) preparation step S13 and the drying step S15 employ the same method as that in the first embodiment, and a description thereof will be omitted.
[0045]
(Bank forming step S11)
In the second embodiment, prior to the substrate surface treatment, a bank (partition) is formed so as to surround a film formation region on the substrate. Specifically, an organic photosensitive material such as an acrylic resin or a polyimide resin is applied on the entire surface of the substrate S on which the film is to be formed, and then, if necessary, using a resist technique, and further using a photolithography technique and an etching technique. By patterning, a bank having a depth of about 2 μm was formed using the film formation region as a groove. It is preferable that the bank formed in this manner has a tapered shape in which the width on the upper side is small and the width on the bottom side is large, since the ink easily flows into the groove.
[0046]
After forming such a bank, there is a possibility that a residue of the photosensitive material remains on the bottom surface of the bank groove. Therefore, a step of removing the residue by oxygen plasma treatment or irradiation with ultraviolet light of 254 nm or 172 nm was performed.
[0047]
(Surface treatment step S12)
Next, a lyophobic treatment is performed on the formed bank to make the surface lyophobic. As the lyophobic treatment, for example, a plasma treatment method (CF ₄ (Plasma processing method) is employed. CF ₄ The plasma processing conditions include, for example, a plasma power of 100 to 800 kW, a flow rate of methane tetrafluoride of 50 to 100 ml / min, a transfer speed of the substrate to the plasma discharge electrode of 0.5 to 1020 mm / sec, and a substrate temperature of 70 to 90 ° C. It is said. The processing gas is not limited to tetrafluoromethane (carbon tetrafluoride), and other fluorocarbon-based gases can be used.
[0048]
By performing such a lyophobic treatment, the banks are introduced with a fluorine group into the resin constituting the banks, thereby imparting lyophobic properties, and the groove portions exhibit relatively lyophilic properties. The bank may be made of a material having water repellency (for example, a resin material having a fluorine group), so that the water repellent treatment may be omitted.
[0049]
(Dispersion liquid preparation step S13)
In the dispersion liquid preparation step, the same preparation method as in the first embodiment was adopted.
[0050]
(Discharge vibration process)
After preparing the dispersion liquid (ink), the ink is ejected using the ink jet device 30 shown in FIG. 6 as in the first embodiment. In the second embodiment, the substrate S is vibrated relative to the substrate S. And discharge is performed.
In the first embodiment, the substrate S is vibrated after the ink is discharged. In this case, since no vibration is applied at the time of ink ejection, the landing position is stabilized. On the other hand, when ink is ejected simultaneously with the vibration of the substrate S as in the second embodiment, the number of steps is reduced, which leads to an improvement in manufacturing efficiency. The detailed method related to ejection and the detailed method related to vibration are the same as in the first embodiment.
[0051]
(Drying step S5)
After performing the ejection and the vibration, a drying process is performed as necessary to remove the dispersion medium. The drying process can be performed by lamp annealing, for example, in addition to a process using a normal hot plate or an electric furnace for heating the substrate S. Usually, heating at about 100 ° C. may be performed for several minutes.
[0052]
Through the above steps, a conductive wiring as a predetermined film pattern is formed. As in the first embodiment, the wiring in this case achieves thinning, has a uniform film thickness, and has a good edge shape. Therefore, according to the method of the present embodiment, it is possible to form a fine conductive film wiring which is excellent in electric conductivity, hardly causes defects such as disconnection and short circuit, and the like.
[0053]
[Third embodiment]
As a third embodiment, a liquid crystal device as an example of the electro-optical device according to the invention will be described. FIG. 8 shows a planar layout of signal electrodes and the like on the first substrate of the liquid crystal device according to the present embodiment. The liquid crystal device according to the present embodiment includes a first substrate, a second substrate (not shown) provided with scanning electrodes and the like, and a liquid crystal (not shown) sealed between the first substrate and the second substrate. It is roughly constituted from.
[0054]
As shown in FIG. 8, a plurality of signal electrodes 310 are provided in a pixel area 303 on the first substrate 300 in a multiplex matrix. In particular, each signal electrode 310 is composed of a plurality of pixel electrode portions 310a provided for each pixel and signal wiring portions 310b connecting these in a multiplex matrix, and extends in the Y direction. ing.
[0055]
Reference numeral 350 denotes a liquid crystal drive circuit having a one-chip structure. The liquid crystal drive circuit 350 is connected to one end (lower side in the figure) of the signal wiring portions 310b via first wiring lines 331. Reference numerals 340... Indicate upper and lower conductive terminals. The upper and lower conductive terminals 340 are connected to terminals provided on a second substrate (not shown) by upper and lower conductive members 341. Further, the upper and lower conductive terminals 340 and the liquid crystal drive circuit 350 are connected via the second wiring 332.
[0056]
In the present embodiment, the signal wiring portions 310b provided on the first substrate 300, the first wiring 331, and the second wiring 332 correspond to the first embodiment or the second embodiment, respectively. It is formed using a wiring forming method.
That is, the liquid crystal device according to the present embodiment is manufactured by a manufacturing method including the above-described wiring forming method, and it is difficult for defects such as disconnection or short-circuit of each of the wirings to occur. A possible liquid crystal device can be obtained.
[0057]
[Fourth embodiment]
Next, a specific example of an electronic apparatus including the liquid crystal device described in the above embodiment will be described. FIG. 9 is a perspective view showing an example of a mobile phone. In FIG. 9, reference numeral 500 indicates a mobile phone main body, and reference numeral 501 indicates a liquid crystal display unit including the liquid crystal device of the above embodiment. As described above, each of the electronic devices illustrated in FIG. 9 includes the liquid crystal device of the above-described embodiment, and thus has an excellent display quality. Although the electronic apparatus of the present embodiment includes a liquid crystal device, it includes other electro-optical devices such as an organic electroluminescence display device and a plasma display device manufactured by a manufacturing method employing the above-described wiring forming method. Electronic equipment.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a wiring forming method according to a first embodiment.
FIGS. 2A and 2B are a schematic plan view and a schematic sectional view specifically illustrating an ink discharge mode. FIGS.
3A and 3B are a schematic plan view and a schematic sectional view specifically illustrating a discharge mode, following FIG.
FIGS. 4A and 4B are a schematic plan view and a schematic cross-sectional view illustrating a specific form of ink formation after a vibration step.
FIG. 5 is an explanatory view illustrating a wiring forming method according to a second embodiment.
FIG. 6 is a perspective view illustrating a configuration of a droplet discharge device.
FIG. 7 is a perspective view and a sectional view of a main part of FIG. 6;
FIG. 8 is a plan view on a first substrate of a liquid crystal device according to a third embodiment.
FIG. 9 is an exemplary perspective view showing an example of an electronic apparatus according to a fourth embodiment;
[Explanation of symbols]
H: lyophilic region (film forming region), M: conductive film, 30: inkjet device, 49: ultrasonic oscillator

Claims (11)

A film forming method for forming a film on a substrate,
A dropping step of dropping a droplet containing a film material on the substrate using a droplet discharge device,
A vibration step of applying vibration for preventing or suppressing agglomeration of particles contained in the dropped droplets on the substrate on which the droplets are dropped,
A film forming method comprising: The method according to claim 1, wherein the substrate vibration step is performed simultaneously with the dropping of the droplets or after the droplets are dropped. In the dropping step, while a plurality of droplets are ejected by scanning the ejection head of the droplet ejection device in one direction, the scanning in the one direction is performed a plurality of times. 3. The method according to claim 1, wherein a droplet is dropped between droplets dropped by any one of the head scans before the n-th scan. 4. The method according to claim 1, further comprising: performing a lyophilic treatment on a region of the substrate on which a film is to be formed, before the dropping step. 5. 5. The method according to claim 1, further comprising: forming a partition on the substrate so as to surround a region where a film is to be formed, before the dropping step. 6. . The film forming method according to claim 5, wherein, after forming the partition, a liquid-repellent treatment is performed on a surface of the partition, and a lyophilic treatment is performed on a bottom surface of a groove formed by the partition. . A wiring forming method using the film forming method according to claim 1, wherein:
In the dropping step, while dropping a droplet containing a conductive material as the film material,
In the vibration step, a vibration is applied to the substrate on which the droplet has been dropped so as to prevent or suppress aggregation of the conductive material particles contained in the dropped droplet. 8. The method according to claim 7, wherein a material containing an organic silver compound is used as the conductive material. A method for manufacturing an electro-optical device, comprising a wiring forming step using the wiring forming method according to claim 7. An electro-optical device obtained by the manufacturing method according to claim 9. An electronic apparatus comprising the electro-optical device according to claim 10.

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