JP2004335849A - Forming method and forming apparatus of film pattern, conductive film wire, electrooptic apparatus, electronic apparatus, and contactless card medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a film pattern whereby radiation noise is reduced. <P>SOLUTION: The film pattern forming method jets out liquid drops of liquid containing a film forming component to a prescribed film forming region on a substrate to form a film pattern, and jets out liquid drops 103 of small diameters so as to bury recesses (dents) 102 of a wire 101 formed by the continuous drawing of liquid drops (standard drops) 100 with prescribed particle diameters so as to configure the smooth wire. Thus, parts with acute angles having conventionally been formed to edges for forming the wire 101 can be avoided, the wire width is uniformized and the generation of high frequency noise can be reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a conductive film wiring used for wiring of electrodes, antennas, electronic circuits, integrated circuits and the like, a method of forming a film pattern such as a silicon film pattern, and a film pattern forming apparatus. Further, the present invention relates to a conductive film wiring, an electro-optical device, an electronic device, and a non-contact card medium.
[0002]
[Prior art]
For example, a lithography method is used for manufacturing wiring used for an electronic circuit or an integrated circuit. This lithography method forms a wiring by applying a photosensitive material called a resist on a substrate on which a conductive film has been applied in advance, irradiating and developing a circuit pattern, and etching the conductive film according to the resist pattern. is there. This lithography method requires large-scale equipment such as a vacuum apparatus and complicated processes, and has a material use efficiency of only about several percent, and almost all of the material must be discarded, resulting in high manufacturing costs.
[0003]
On the other hand, a method has been proposed in which a liquid in which conductive fine particles are dispersed is pattern-coated directly on a substrate by an ink-jet method, and then heat treatment or laser irradiation is performed to convert the liquid into a conductive film pattern (Patent Document 1). . According to this method, there is an advantage that photolithography is not required, the process is greatly simplified, and the amount of raw materials used can be reduced.
[0004]
[Patent Document 1]
U.S. Pat. No. 5,132,248
[0005]
[Problems to be solved by the invention]
By the way, as shown in FIG. 13, substantially circular liquid droplets (dots) are connected in a metal wiring or the like performed in the conventional ink-jet method according to Patent Document 1, so that the solidified film pattern is a liquid crystal 101. The angle (θ) formed by the overlapping concave portions 102 becomes an acute angle (for example, 60 to 80 degrees). For this reason, there is a problem in that when a fast-operating signal is applied to a circuit board having a wiring including such an acute angle portion, a high frequency is generated as radiation noise.
Here, “radiation noise” means that an electronic device is composed of circuits and wiring, and when electrons move in each line (electricity flows), a magnetic field is generated. At this time, electromagnetic waves are generated. If the energy is large, it refers to noise of 30 to 1000 MHz, which is a frequency band that affects FM waves, TV, and radio.
[0006]
The present invention has been made in consideration of the above problems, and has been made in consideration of the above problems, to reduce a radiation noise generated in a conventional wiring, and to provide a film pattern forming method, a film pattern forming apparatus, a conductive film wiring, It is an object to provide an optical device, an electronic device, and a non-contact card medium.
[0007]
[Means for Solving the Problems]
The first film pattern forming method of the present invention is a film pattern forming method of forming a film pattern by discharging droplets of a liquid containing a film forming component to a predetermined film forming region on a substrate. In addition, a droplet having a small diameter is discharged so as to fill a concave portion of a wiring drawn with a predetermined droplet diameter.
[0008]
According to the present invention, there is no sharp portion at the edge portion forming the wiring portion, and the occurrence of high-frequency noise can be reduced.
[0009]
Further, the second method of forming a film pattern is a method of forming a film pattern by discharging a droplet composed of a liquid containing a film forming component to a predetermined film forming region on a substrate to form a film pattern. A first discharging step of discharging a plurality of droplets at predetermined intervals to the entire film forming region, and a position different from a discharging position in the first discharging step of the plurality of droplets of the entire film forming region. A second discharging step of discharging at predetermined intervals, and forming a droplet having a smaller diameter than the first discharging droplet and the second discharging droplet on a wiring formed from the first discharging droplet and the second discharging droplet. And a third discharging step of discharging so as to fill the concave portion.
[0010]
Here, the “film formation region” is a region where a film pattern is to be formed, and is mainly composed of a single or a plurality of straight lines. Further, the “entire film forming region” does not mean the entire surface of the film forming region, but means the entire region not biased only to a specific region (for example, the right half of a straight line drawn left and right) of the film forming region. means.
The term "diameter of the droplet after landing on the substrate" refers to the maximum diameter during which the discharged droplet spreads spontaneously after landing on the substrate and then contracts with drying. In other words, by "discharging at a pitch larger than the diameter of the droplet after landing on the substrate", the droplets continuously discharged are separated from each other and do not come into contact with each other even after they spread naturally after landing. Means to discharge the ink.
The “different position” means that the center position of the droplet is different, and the droplet discharged in the first step and the droplet discharged in the second step partially overlap each other, Or they do not completely overlap.
[0011]
According to the present invention, by filling the concave portion in the third step, the sharp edge portion is eliminated in the edge portion forming the wiring, the occurrence of high-frequency noise can be reduced, and the second discharging step can be performed in the first discharging step. Also in the discharging step, the liquid droplets are discharged to the film forming region on the substrate while being separated from each other.
[0012]
Further, when the concave portion is an intersection where a plurality of adjacent droplets overlap each other, there is no sharp portion, and generation of high-frequency noise from the formed wiring is reduced.
[0013]
The first ejection step has a pitch larger than the diameter of the droplet after landing on the substrate, and the second ejection step ejects a plurality of droplets in the first ejection step over the entire film formation region. The droplets are ejected to a position different from the position at a pitch larger than the diameter of the droplet after landing on the substrate.
Further, since the discharge positions are different between the first discharge step and the second discharge step, the gap between the droplets in the first discharge step can be filled by the second discharge step.
[0014]
Note that the droplets discharged in the second discharging step may partially overlap with the droplets discharged in the first discharging step. That is, since the droplets discharged in the first discharging process have been dried to some extent or completely, there is a danger that the droplets in both processes may merge with each other to form a bulge, and the droplets may be overlapped in the same process. This is because it becomes lower as compared with the case where the droplet is continuously discharged.
ADVANTAGE OF THE INVENTION According to this invention, since the danger which a bulge produces | generates is reduced, the liquid repellency of a board | substrate can be improved and the contact angle of a board | substrate and a liquid can be enlarged. Therefore, thinning and thickening of the film are possible.
[0015]
Further, since the ink-jet method is used, a film can be formed even when the substrate is not flat but has irregularities. Therefore, for example, it is also possible to form a film such as a wiring over a stepped portion.
[0016]
In the present invention, it is preferable that a pitch in the second ejection step is substantially the same as a pitch in the first ejection step. Thereby, the process can be simplified and the working efficiency can be improved.
However, it is not an absolute requirement that the pitch in the second ejection step be substantially the same as the pitch in the first ejection step. For example, it is possible to make the pitch in the second ejection step approximately twice or half the pitch in the first ejection step.
[0017]
In the present invention, it is preferable that a pitch in the first discharge step is twice or less a diameter of a droplet after landing on the substrate. In this case, since a continuous linear film pattern can be formed only by the first ejection step and the second ejection step, the steps can be simplified and the working efficiency can be improved.
If the pitch in the first ejection step exceeds twice the diameter of the droplet after landing on the substrate, another ejection step is performed one or more times after the second ejection step. Thereby, a continuous linear film pattern can be formed.
[0018]
In the present invention, it is preferable that the pitch in the first discharge step is at least 10 μm larger than the diameter of the droplet after landing on the substrate. Accordingly, even if an error in the landing position of the droplet is taken into account, it is possible to surely perform the discharging so that the continuously discharged droplets are separated from each other and do not come into contact with each other.
[0019]
In the present invention, the method may further include, after the second discharging step, a fourth discharging step of discharging a plurality of droplets of the liquid over the entire film formation region at a smaller pitch than the pitch in the first discharging step. preferable.
The liquid droplets ejected in the first ejection step and the second ejection step are completely or partially dried to have lyophilicity, so that the liquid ejected in the fourth ejection step is easily adapted. Therefore, according to the present invention, it is easy to keep the droplet discharged in the fourth discharging step in the film formation region. Therefore, the pitch in the fourth ejection step can be ejected at a smaller pitch than the pitch in the first ejection step, and the film thickness can be efficiently increased.
[0020]
In particular, it is preferable that the pitch in the fourth discharge step is equal to or less than the diameter of the droplet after landing on the substrate. That is, it is preferable that the droplets in the fourth ejection step have a pitch such that they contact each other after landing. This makes it possible to efficiently increase the thickness of the film.
[0021]
Note that the fourth discharge step is preferably performed after the droplets from the first discharge step and the second discharge step are dried as much as possible, but it is not necessary to wait until the droplets are completely dried. If drying has progressed to some extent, if not completely, the risk of droplets from different discharge steps coalescing with each other and causing a bulge is lower than when continuously discharging droplets that overlap in the same process. Because it becomes.
In addition, the fourth discharge step is performed by performing a first discharge step and a second discharge step, or by performing another discharge step at least once after the first discharge step and the second discharge step, thereby forming a continuous linear shape. It is preferable to perform the process after the film pattern is formed. This makes it easier to keep the droplets ejected in the fourth ejection step in the film formation region.
Further, it is preferable that the fourth ejection step is performed not only once but also a plurality of times. Thereby, a further increase in the film thickness can be achieved.
[0022]
The present invention can be suitably applied when the film forming component contains conductive fine particles. According to the present invention, it is possible to form a conductive film wiring which has a large film thickness, is advantageous for electric conduction, hardly causes defects such as disconnection and short circuit, and can be formed finely.
In this case, it is preferable to include a step of converting the film forming component into a conductive film by heat treatment or light treatment. Thereby, the conductivity of the conductive fine particles can be expressed, and a film having conductivity can be obtained. This heat treatment or light treatment may be performed each time after each discharge step, or may be performed at once after all discharge steps are completed.
The present invention can be suitably used for forming a silicon film pattern, forming an insulating film pattern of polyimide or the like, forming a resist film pattern, and the like.
[0023]
In particular, in the case of a resist film pattern, for example, a resist film pattern is formed on a substrate provided with a conductive layer such as a copper foil, the copper foil remaining after the resin is cured is removed, and then the resist is peeled off. What should I do?
[0024]
Further, the film pattern forming apparatus of the present invention is a film pattern forming apparatus for forming a film pattern by discharging a liquid containing a film forming component to a predetermined film forming region on a substrate by an inkjet method, A film pattern is formed by the film pattern forming method according to any of the above inventions.
According to the present invention, an apparatus for forming a film pattern that efficiently achieves a thick film with a simple process, satisfies the demand for thinner wires, and does not cause problems such as disconnection or short circuit when formed into a conductive film. be able to.
[0025]
The present invention can be suitably applied when the film forming component contains conductive fine particles. According to the present invention, it is possible to form a conductive film wiring which has a large film thickness, is advantageous for electric conduction, hardly causes defects such as disconnection and short circuit, and can be formed finely.
In this case, it is preferable to provide a heat treatment unit or a light treatment unit for converting the film forming component into a conductive film. Thereby, the conductivity of the conductive fine particles can be expressed, and a film having conductivity can be obtained.
[0026]
Further, the conductive film wiring of the present invention is formed by the method of forming a film pattern according to any one of the above-mentioned inventions.
ADVANTAGE OF THE INVENTION According to this invention, it is a film thickness, it is advantageous to electric conduction, it is hard to produce a defect, such as a disconnection or a short circuit, and can also be set as the conductive film wiring which can be formed finely.
[0027]
Further, an electro-optical device according to the present invention includes the conductive film wiring according to the present invention. Examples of the electro-optical device according to the invention include a liquid crystal display device, an organic electroluminescence display device, and a plasma display device.
Further, an electronic apparatus according to the present invention includes the electro-optical device according to the present invention.
Further, a non-contact type card medium according to the present invention includes the conductive film wiring according to the present invention as an antenna circuit.
According to these inventions, it is possible to provide an electro-optical device which is less likely to cause a failure such as disconnection or short circuit of a wiring portion or an antenna, and which can be reduced in size and thickness, an electronic apparatus using the same, and a non-contact type card medium. can do.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the contents of the present invention will be described in detail with reference to embodiments of the present invention, but the present invention is not limited thereto.
[0029]
1 and 2 are schematic diagrams of a drawing pattern according to the first embodiment. 3 to 7 are schematic diagrams of a drawing pattern according to the second embodiment, and FIG. 8 is a schematic diagram of a film forming apparatus according to the third embodiment. FIG. 9 is a plan view on a first substrate of a liquid crystal device according to the fourth embodiment. FIG. 10 is an exploded perspective view of the plasma display device according to the fifth embodiment. 11A and 11B show an electronic device according to a sixth embodiment, in which FIG. 11A shows an example of a mobile phone including the liquid crystal display device of the fourth embodiment, and FIG. 11B shows a liquid crystal display of the fourth embodiment. FIG. 3C is a diagram illustrating an example of a portable information processing device including the device, and FIG. 4C is a diagram illustrating an example of a wristwatch-type electronic device including the liquid crystal display device of the fourth embodiment. FIG. 12 is an exploded perspective view of the non-contact type card medium according to the seventh embodiment.
[0030]
[First Embodiment]
The method for forming a film pattern according to the present embodiment is a method for forming a film pattern by discharging droplets composed of a liquid containing a film forming component to a predetermined film forming region on a substrate to form a film pattern. A droplet 103 having a small diameter is discharged so as to fill a concave portion (recess portion) 102 of a wiring 101 which is continuously drawn with a droplet (standard droplet) 100 having a predetermined particle size (FIG. )) To form a smooth wiring (FIG. 1B).
[0031]
As a result, as shown in FIG. 1B, the edge portion where the wiring 101 is formed does not have a sharp portion as in the related art, the line width is made uniform, and the generation of high-frequency noise can be reduced.
[0032]
Here, the liquid diameter of the standard droplet 100 can be appropriately set according to the wiring pattern to be drawn, but is preferably, for example, 20 to 60 μm. Further, it is preferable that the liquid diameter of the small diameter droplet 103 is about half or less of the standard droplet. Therefore, for example, when the liquid diameter of the standard droplet 100 is 50 μm, the diameter of the small-diameter droplet is preferably 20 to 25 μm. For example, when the liquid diameter of the standard droplet 100 is 20 μm, The droplet diameter is preferably about 10 μm.
In addition, the discharge amount of the small diameter droplet may be about half of the standard droplet. For example, when the standard droplet is 10 pl, the small diameter droplet may be 5 pl or less.
At this time, the line that forms the center of the standard droplet 100 and the line that forms the center of the small-diameter droplet 103 are shifted in parallel.
Note that the droplets may be ejected by a single head ejecting droplets of a plurality of sizes, or by having a plurality of heads and ejecting droplets of different sizes. Either of the standard droplet and the small diameter droplet may be formed first.
Further, it is preferable to discharge the small-diameter droplets after the solvent of the standard droplets is volatilized to be in a semi-dry state.
[0033]
FIG. 2 shows an example of a standard droplet ejection pattern. The ejection pattern is as shown in FIG. 2A, when the standard droplets 100 overlap, as shown in FIG. 2B, when the standard droplets 100 are in contact with each other, or as shown in FIG. There is a case where the standard droplet 1001 does not touch, but the droplet 103 having a smaller diameter than the standard droplet that fills the concave portion 102 formed by the adjacent droplets is dropped. The portion is eliminated, and the occurrence of high frequency noise can be reduced.
In the case shown in FIG. 2A, the overlapping portion of the adjacent standard droplet 100 slightly rises.
In the case shown in FIG. 2B or FIG. 2C, the diameter of the small-diameter droplet can be increased by separating the standard droplet 100.
[0034]
In addition, the droplets are adapted by the wettability of the solvent. For example, as a result of contact between the small-diameter droplet 103 filling the concave portion 102 and the standard droplet 100, the intersection angle (α) further increases, and the acute angle increases. There will be no part present.
[0035]
[Second embodiment]
As a second embodiment, a specific wiring forming method of the film pattern forming method of the present invention will be described. The wiring forming method according to the present embodiment includes a surface treatment step, a discharge step, and a heat treatment / light treatment step. The inner discharge step includes a dispersion liquid preparation step, a first discharge step, a second discharge step, a third discharge step, and a fourth step. Hereinafter, each step will be described.
[0036]
(Surface treatment process)
As the substrate on which the conductive film wiring is to be formed, various substrates such as a Si wafer, ceramics, glass, plastic film, and metal plate can be used. Further, a substrate on which a conductive film wiring is to be formed using a substrate in which a semiconductor film, a metal film, a dielectric film, an organic film, or the like is formed as a base layer on the surface of these various material substrates may be used.
The surface of the substrate on which the conductive film wiring is to be formed is adjusted so that a predetermined contact angle with a liquid containing conductive fine particles is 60 [deg] or more, preferably 90 [deg] or more and 110 [deg] or less. What is necessary is just to perform a process.
In order to control the liquid repellency (wettability) of the surface as described above, various surface treatment methods described below can be adopted.
[0037]
As one of the surface treatment methods, there is a method of forming a self-assembled film made of an organic molecular film or the like on the surface of a substrate on which a conductive film wiring is to be formed.
The organic molecular film for treating the substrate surface has a functional group that can bind to the substrate and a functional group that modifies the surface properties of the substrate (controls the surface energy) such as a lyophilic group or a lyophobic group on the opposite side. And a carbon chain connecting these functional groups, which is a linear or partially branched carbon chain, is bonded to a substrate and self-organized to form a molecular film, for example, a monomolecular film.
[0038]
The self-assembled film is composed of a bonding functional group capable of reacting with constituent atoms such as a base layer such as a substrate and other linear molecules, and a compound having extremely high orientation is formed by the interaction of the linear molecules. This is a film formed by the above. Since the self-assembled film is formed by orienting single molecules, the thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, it is possible to impart uniform and excellent lyophobicity and lyophilicity to the surface of the film.
[0039]
As a compound having the above high orientation, for example, when fluoroalkylsilane is used, a self-assembled film is formed by orienting each compound such that a fluoroalkyl group is located on the surface of the film. Liquid repellency is imparted to the surface of the substrate.
[0040]
Compounds that form such a self-assembled film include heptadecafluoro-1,1,2,2 tetrahydrodecyltriethoxysilane, heptadecafluoro-1,1,2,2 tetrahydrodecyltrimethoxysilane, heptadeca Fluoro-1,1,2,2 tetrahydrodecyltrichlorosilane, tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, trideca Examples thereof include fluoroalkylsilanes (hereinafter, referred to as “FAS”) such as fluoro-1,1,2,2 tetrahydrooctyltrichlorosilane and trifluoropropyltrimethoxysilane. In use, it is preferable to use one compound alone, but it is not limited even if two or more compounds are used in combination as long as the intended purpose of the present invention is not impaired. Further, in the present invention, it is preferable to use the FAS as a compound for forming the self-assembled film in order to impart adhesion to a substrate and good liquid repellency.
[0041]
FAS generally has the structural formula RnSiX _(4-n) Is represented by Here, n represents an integer of 1 to 3, and X is a hydrolyzable group such as a methoxy group, an ethoxy group, and a halogen atom. R is a fluoroalkyl group, and (CF ₃ ) (CF ₂ ) X (CH ₂ ) Y (where x represents an integer of 0 or more and 10 or less, and y represents an integer of 0 or more and 4 or less), and when a plurality of R or X is bonded to Si, R or X may be all the same or different. The hydrolyzable group represented by X forms silanol by hydrolysis, reacts with the hydroxyl group of the base such as a substrate (glass, silicon) or the like, and binds to the substrate by a siloxane bond. On the other hand, since R has a fluoro group such as (CF3) on the surface, it modifies the surface of a base such as a substrate into a surface that does not wet (low surface energy).
[0042]
A self-assembled film composed of an organic molecular film or the like is formed on a substrate when the above-mentioned raw material compound and the substrate are placed in the same closed container and left at room temperature for about 2 to 3 days. In addition, by maintaining the whole closed container at 100 ° C., it is formed on the substrate in about 3 hours. The method described above is a formation method from a gas phase, but a self-assembled film can also be formed from a liquid phase. For example, a self-assembled film can be obtained on a substrate by immersing the substrate in a solution containing a raw material compound, washing and drying.
Before forming the self-assembled film, it is preferable to perform a pretreatment by irradiating the substrate surface with ultraviolet light or washing with a solvent.
[0043]
As another method of surface treatment, there is a method of irradiating plasma under normal pressure or under vacuum. The kind of gas used for the plasma treatment can be variously selected in consideration of the surface material of the substrate on which the conductive film wiring is to be formed.
For example, methane tetrafluoride, perfluorohexane, perfluorodecane, or the like can be used as the processing gas.
[0044]
The surface treatment can also be performed by attaching a film having a desired liquid repellency, for example, a polyimide film processed with tetrafluoroethylene to the substrate surface. Note that the polyimide film may be used as it is as the substrate.
In addition, when the substrate surface has a liquid repellency higher than a desired liquid repellency, a method of lyophilizing the substrate includes a method of irradiating ultraviolet light of 170 to 400 nm or a method of exposing the substrate to an ozone atmosphere. .
[0045]
(Dispersion liquid preparation step)
Next, the liquid containing the conductive fine particles discharged onto the substrate after the surface treatment will be described.
As the liquid containing conductive fine particles, a dispersion in which conductive fine particles are dispersed in a dispersion medium is used. The conductive fine particles used here include metal fine particles containing any of gold, silver, copper, palladium, and nickel, as well as conductive polymer and superconductor fine particles.
These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility.
The particle diameter of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. If the thickness is larger than 0.1 μm, clogging of the nozzle is likely to occur, and it becomes difficult to perform ejection by the inkjet method. On the other hand, if it is smaller than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic substance in the obtained film becomes excessive.
[0046]
The liquid dispersion medium containing the conductive fine particles preferably has a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa). If the vapor pressure is higher than 200 mmHg, the dispersion medium will rapidly evaporate after discharge, making it difficult to form a good film.
Further, the vapor pressure of the dispersion medium is more preferably 0.001 mmHg or more and 50 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). If the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying is likely to occur when discharging droplets by the inkjet method, and stable discharge becomes difficult.
On the other hand, in the case of a dispersion medium having a vapor pressure of less than 0.001 mmHg at room temperature, drying becomes slow and the dispersion medium tends to remain in the film, so that a high-quality conductive film can be obtained after heat and / or light treatment in a later step. Hateful.
[0047]
The dispersion medium to be used is not particularly limited as long as it can disperse the above-mentioned conductive fine particles and does not cause aggregation, but in addition to water, alcohols such as methanol, ethanol, propanol and butanol, n- Hydrocarbon compounds such as heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl Ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ate Le, p- ether compounds such as dioxane, propylene carbonate, .gamma.-butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, may be mentioned polar compounds such as cyclohexanone. Among these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred in terms of the dispersibility of the fine particles and the stability of the dispersion, and the ease of application to the ink jet method. May include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more.
[0048]
The dispersoid concentration when the conductive fine particles are dispersed in a dispersion medium is 1% by mass or more and 80% by mass or less, and can be adjusted according to a desired film thickness of the conductive film. If it exceeds 80% by mass, aggregation tends to occur, and it is difficult to obtain a uniform film.
[0049]
Surface tension of the dispersion liquid of the conductive particles is preferably within the scope of the following 0.02 N / m or more 0.07 N / m. When the surface tension is less than 0.02 N / m when the liquid is ejected by the ink jet method, the ink composition has increased wettability to the nozzle surface, so that flight bending is likely to occur, and the surface tension exceeds 0.07 N / m. This is because the shape of the meniscus at the tip of the nozzle is not stable, and it becomes difficult to control the discharge amount and the discharge timing.
[0050]
In order to adjust the surface tension, a slight amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based one can be added to the above-mentioned dispersion liquid as long as the contact angle with the substrate is not unduly reduced. The nonionic surface tension adjuster improves the wettability of the liquid to the substrate, improves the leveling property of the film, and helps to prevent the occurrence of bumping of the coating film and the occurrence of yuzu skin.
The dispersion may contain an organic compound such as an alcohol, an ether, an ester, or a ketone, if necessary.
[0051]
The dispersion preferably has a viscosity of 1 mPa · s or more and 50 mPa · s or less. When ejected by the inkjet method, if the viscosity is less than 1 mPa · s, the peripheral portion of the nozzle is easily contaminated by the outflow of ink, and if the viscosity is greater than 50 mPa · s, the frequency of clogging in the nozzle hole is high. This is because it becomes difficult to discharge droplets smoothly.
[0052]
(First discharge step)
In the present embodiment, a case where the wiring formation region is a straight line will be described. First, the droplet L of the above dispersion liquid ₁ Is discharged from the inkjet head H and dropped on the wiring formation region on the substrate W. As shown in FIG. ₁ Is the droplet L ₁ Are ejected at a pitch larger than the diameter after landing on the substrate W. That is, the droplet L ₁ Are ejected at regular intervals so that they do not touch each other on the substrate W.
[0053]
Droplet L ₁ Is discharged to the entire wiring formation region, and then a drying process is performed as necessary to remove the dispersion medium. The drying process can be performed by lamp annealing, for example, in addition to a process using a normal hot plate for heating the substrate W or an electric furnace. The light source of the light used for lamp annealing is not particularly limited, but may be an infrared lamp, a xenon lamp, a YAG laser, an argon laser, a carbon dioxide laser, an excimer laser such as XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, or the like. Can be used as a light source. These light sources generally have an output of 10 W or more and 5000 W or less, but in this embodiment, a range of 100 W or more and 1000 W or less is sufficient.
[0054]
In this case, the degree of heating or light irradiation may be increased until the dispersion liquid is converted into a conductive film as well as the removal of the dispersion medium. However, the conversion of the conductive film may be performed in a heat treatment / light treatment step after all the discharge steps are completed. Therefore, in the first discharge step, it is sufficient if the dispersion medium can be removed to some extent. Therefore, in the case of heat treatment, it is usually sufficient to perform heating at about 100 ° C. for several minutes.
In addition, the drying process can be performed simultaneously in parallel with the ejection. For example, by discharging onto the heated substrate W or by cooling the inkjet head H and using a dispersion medium having a low boiling point, drying can proceed immediately after the substrate W lands.
After drying, the droplet L ₁ Is a dry film S ₁ It becomes. As shown in FIG. ₁ Is significantly reduced by the removal of the dispersion medium, the viscosity also increases, and the wiring is easily fixed at a predetermined position in the wiring formation region.
[0055]
(Second ejection step)
Next, the droplet L of the dispersion liquid ₂ Is discharged from the inkjet head H and dropped on the wiring formation region on the substrate W. Note that the droplet L ₂ Is the droplet L ₁ Are the same dispersion liquid droplets and have the same volume. As shown in FIG. ₂ Is the droplet L ₁ And droplet L ₁ And dropped almost at the center. That is, the droplet L ₂ And droplet L ₁ Are the same, and the droplet L ₂ Are also ejected at a pitch larger than the diameter after landing on the substrate W. Therefore, the droplet L ₂ Are not in contact with each other on the substrate W.
At this time, the droplet L ₂ And dried film S ₁ Contact the dry film S ₁ Since the dispersion medium has already been completely or partially removed, they do not attract each other to cause a bulge.
In FIG. 4A, the droplet L ₂ Start position of the droplet L ₁ Although the drawing is performed from the left side in the drawing, the dropping may be started from the opposite direction (the right side in the drawing). In this case, the first ejection step and the second ejection step can be performed by making one reciprocation of the relative movement between the inkjet head H and the substrate W.
[0056]
Droplet L ₂ Is discharged to the entire wiring formation region, and then, in order to remove the dispersion medium, a drying process is performed, if necessary, as in the first discharging step. In this case, not only the removal of the dispersion medium but also the degree of heating and light irradiation may be increased until the dispersion liquid is converted into a conductive film, but it is sufficient if the dispersion medium can be removed to some extent. The fact that the drying process can proceed simultaneously in parallel with the ejection is the same as in the first ejection step.
After drying, the droplet L ₂ Is a dry film S ₂ It becomes. As shown in FIG. ₂ Is significantly reduced by the removal of the dispersion medium, the viscosity also increases, and the wiring is easily fixed at a predetermined position in the wiring formation region.
Thereby, the dried film S ₁ And dried film S ₂ And a continuous dry film pattern is formed.
[0057]
Here, the ejection positions in the first ejection step and the second ejection step will be described in more detail with reference to the plan view of FIG.
As shown in FIG. ₁ Pitch P ₁ Is the droplet L ₁ Diameter R after landing on substrate W ₁ Larger, droplet L ₁ Is the interval d ₁ (D ₁ = P ₁ -R ₁ ). The droplet L ₂ Pitch P ₂ Is the droplet L ₂ Diameter R after landing on substrate W ₂ Larger, droplet L ₂ Is the interval d ₂ (D ₂ = P ₂ -R ₂ ). Here, the droplet L ₁ And droplet L ₂ Are equalized, and approximately R ₁ = R ₂ In the second discharge step, the lyophilic property of the dried film S1 is higher than that of the substrate W, so that R ₂ Is R ₁ Is slightly larger in the length direction as compared with. Also, pitch P ₁ And pitch P ₂ And is approximately equal to d ₁ = D ₂ , But R ₂ Is R ₁ Is slightly larger in the length direction than ₂ Is d ₁ It is slightly smaller than.
Also, d ₁ Is preferably 10 μm or more. As a result, the error in the landing position of the droplet and the R ₂ However, even if it is taken into consideration that the droplets become slightly larger, it is possible to reliably discharge droplets that are successively discharged so as not to be separated from each other.
[0058]
(Third ejection step)
Next, the droplet L of the dispersion liquid ₃ Is discharged from the inkjet head H to dry the film S in the wiring formation region on the substrate W. ₁ And droplet drying film S ₂ Is dropped on the concave portion that intersects with. As a result, as shown in FIG. ₃ Fills the concave portion and prevents formation of an acute angle portion in the wiring, thereby reducing the generation of radiation noise.
[0059]
(Fourth ejection step)
Next, the droplet L of the dispersion liquid ₄ Is discharged from the inkjet head H to dry the film S in the wiring formation region on the substrate W. ₁ And droplet drying film S ₂ Drop on top. Note that the droplet L ₄ Also droplet L ₁ And droplet L ₂ Are the same dispersion liquid droplets and have the same volume. As shown in FIG. ₄ Pitch P ₄ Is the pitch P ₁ And pitch P ₂ Smaller and droplet L ₄ Diameter R after landing on substrate W ₄ Less than. Therefore, the droplet L ₄ Overlap each other on the substrate W.
At this time, the droplet L ₄ Is landed on the dry film S ₁ And dried film S ₂ But the dry film S ₁ And dried film S ₂ Since the dispersion medium has already been completely or partially removed, these dry films and droplets L ₄ Do not attract each other and cause a bulge.
The droplet L ₄ Overlap with each other, but the wiring formation region is the dry film S ₁ And dried film S ₂ Droplet L ₄ Does not deviate from the wiring formation region and flow out of the wiring formation region having a contact angle of 60 [deg] or more, preferably 90 [deg] or more. Therefore, the droplet L ₄ Easily stays in the wiring forming region, does not attract each other to form a bulge, and the line width does not increase.
Note that the droplet L ₄ And droplet L ₄ Overlap with d ₄ Is R ₄ It is preferably set to 20 to 50% of the above. Thereby, the film thickness can be effectively increased, and it is possible to prevent the liquid amount from being excessive and overflowing outside the wiring formation region.
[0060]
Droplet L ₄ Can be repeated a plurality of times. Thus, a wiring having a desired film thickness can be obtained.
In this case, in order to remove the dispersion medium after each discharging step, a drying process is performed as necessary, similarly to the first discharging step and the second discharging step. In this case, not only the removal of the dispersion medium but also the degree of heating and light irradiation may be increased until the dispersion liquid is converted into a conductive film, but it is sufficient if the dispersion medium can be removed to some extent. The fact that the drying process can proceed simultaneously in parallel with the ejection is the same as in the first ejection step and the second ejection step.
After drying, the droplet L ₄ Is a dry film S ₄ (Not shown). Dry film S ₄ Is significantly reduced by the removal of the dispersion medium, the viscosity also increases, and the wiring is easily fixed at a predetermined position in the wiring formation region. Therefore, a plurality of droplets L ₄ Is repeated over the entire wiring formation region, the droplets between the steps do not attract each other and a bulge does not occur.
Further, since the portion where the droplet is dropped first is lyophilic, the droplet L ₄ Does not flow out of the wiring formation region. Therefore, the droplet L ₄ Is easily retained in the wiring formation region even if it is repeatedly ejected, does not attract each other to form a bulge, and the line width does not increase.
Through the above steps, a dried film layer having a desired thickness can be formed while maintaining a line width substantially equal to the diameter of a droplet.
[0061]
(Heat treatment / light treatment process)
It is necessary to completely remove the dispersion medium from the dried film after the discharge step in order to improve the electrical contact between the fine particles. When the surface of the conductive fine particles is coated with a coating material such as an organic substance in order to improve dispersibility, it is necessary to remove the coating material. Therefore, the substrate after the discharging step is subjected to heat treatment and / or light treatment.
[0062]
The heat treatment and / or light treatment is generally performed in the air, but may be performed in an atmosphere of an inert gas such as nitrogen, argon, or helium, if necessary. The processing temperature of the heat treatment and / or light treatment includes the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as the dispersibility and oxidizing property of the fine particles, the presence and amount of the coating material, and the It is appropriately determined in consideration of the heat resistance temperature and the like.
For example, in order to remove a coating material composed of an organic substance, it is necessary to bake at about 300 ° C. In the case where a substrate such as a plastic substrate is used, it is preferable to perform the heating at room temperature or higher and 100 ° C. or lower.
[0063]
The heat treatment and / or light treatment can be performed by lamp annealing in addition to the usual treatment using a hot plate or an electric furnace. The light source of the light used for lamp annealing is not particularly limited, but may be an infrared lamp, a xenon lamp, a YAG laser, an argon laser, a carbon dioxide laser, an excimer laser such as XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, or the like. Can be used as a light source. These light sources generally have an output of 10 W or more and 5000 W or less, but in this embodiment, a range of 100 W or more and 1000 W or less is sufficient.
By the above steps, the dried film after the discharging step is converted into a conductive film by securing the electrical contact between the fine particles.
[0064]
The conductive film formed according to this embodiment can be formed on a substrate of one droplet of the dispersion liquid with a width substantially equal to the diameter after landing. Further, by repeating the fourth ejection step, it is possible to obtain a desired film thickness while maintaining this line width. That is, according to the present embodiment, thinning and thickening can be achieved without causing a bulge.
Therefore, according to the present embodiment, the conductive film having a large film thickness is advantageous for electric conduction, is less likely to cause a failure such as disconnection or short circuit, can be formed into a fine conductive film wiring, and can reduce radiation noise. It is a wiring to be designed.
[0065]
Also, by using a resist for the discharge liquid, forming wiring with a resist on the copper foil formed on the substrate, then curing the resist, removing the copper foil by etching, and then peeling the resist , A copper wiring can be formed.
Also in this case, similarly to the above, in the third discharge step, a small-diameter droplet is discharged so as to fill the concave portion of the wiring, and the formation of an acute angle portion on the wiring is eliminated, thereby reducing or eliminating radiation noise. Can be planned.
[0066]
[Third embodiment]
As a third embodiment, as an example of a film pattern forming apparatus of the present invention, a wiring forming apparatus for performing the wiring forming method of the first embodiment will be described.
FIG. 8 is a schematic perspective view of the wiring forming apparatus according to the present embodiment. As shown in FIG. 8, the wiring forming apparatus 10 includes an inkjet head group 1, an X direction guide shaft 2 for driving the inkjet head group 1 in the X direction, and an X direction drive motor for rotating the X direction guide shaft 2. 3 is provided.
Further, a mounting table 4 for mounting the substrate W, a Y-direction guide shaft 5 for driving the mounting table 4 in the Y direction, and a Y-direction drive motor 6 for rotating the Y-direction guide shaft 5 are provided. I have.
The X-direction guide shaft 2 and the Y-direction guide shaft 5 each have a base 7 fixed at a predetermined position, and a control device 8 is provided below the base 7.
Further, a cleaning mechanism 14 and a heater 15 are provided.
[0067]
The inkjet head group 1 includes a plurality of inkjet heads that discharge a dispersion liquid containing conductive fine particles from nozzles (discharge ports) and apply the dispersion liquid to a substrate at predetermined intervals. Then, the dispersion liquid can be individually discharged from each of the plurality of inkjet heads according to the discharge voltage supplied from the control device 8.
The inkjet head group 1 is fixed to an X-direction guide shaft 2, and an X-direction drive motor 3 is connected to the X-direction guide shaft 2. The X-direction drive motor 3 is a stepping motor or the like, and is configured to rotate the X-direction guide shaft 2 when a drive pulse signal in the X-axis direction is supplied from the control device. When the X-direction guide shaft 2 is rotated, the inkjet head group 1 moves in the X-axis direction with respect to the base 7.
[0068]
The mounting table 4 is for mounting the substrate W to which the dispersion liquid is applied by the wiring forming apparatus 10, and includes a mechanism for fixing the substrate W at a reference position.
The mounting table 4 is fixed to a Y-direction guide shaft 5, and Y-direction drive motors 6 and 16 are connected to the Y-direction guide shaft 5. The Y-direction drive motors 6 and 16 are stepping motors and the like, and rotate the Y-direction guide shaft 5 when a Y-axis drive pulse signal is supplied from the control device. When the Y-direction guide shaft 5 is rotated, the mounting table 4 moves in the Y-axis direction with respect to the base 7.
[0069]
The cleaning mechanism 14 has a mechanism for cleaning the inkjet head group 1. The cleaning mechanism 14 is moved along the Y-direction guide shaft 5 by a Y-direction drive motor 16. The movement of the cleaning mechanism 14 is also controlled by the control device.
[0070]
Here, the heater 15 is means for heat-treating the substrate W by lamp annealing, and performs heat treatment for evaporating and drying the liquid discharged onto the substrate and converting the liquid into a conductive film. The turning on and off of the power of the heater 15 is also controlled by the control device.
[0071]
In the wiring forming apparatus 10 of the present embodiment, in order to discharge the dispersion liquid to a predetermined wiring forming area, a predetermined driving pulse signal is supplied from the control device to the X-direction driving motor 3 and / or the Y-direction driving motor 6. By moving the inkjet head group 1 and / or the mounting table 4, the inkjet head group 1 and the substrate W (the mounting table 4) are relatively moved. Then, during this relative movement, an ejection voltage is supplied from the control device to a predetermined inkjet head in the inkjet head group 1 to cause the inkjet head to eject the dispersion.
[0072]
In the wiring forming apparatus 10 of the present embodiment, the ejection amount of droplets from each head of the inkjet head group 1 can be adjusted by the magnitude of the ejection drive waveform supplied from the control device.
Further, the pitch of the droplets ejected to the substrate W is determined by the relative moving speed between the inkjet head group 1 and the substrate W (mounting table 4) and the ejection frequency (frequency of supply of ejection voltage) from the inkjet head group 1. You.
Further, a nozzle for discharging a small-diameter droplet in the third discharging step is provided.
[0073]
In the present embodiment, in the first discharge step and the second discharge step, the dispersion liquid is discharged at the same pitch to the same wiring formation region. However, the discharge start position of the second discharge step is as shown in FIG. It is set between the first and second drops in the first ejection step, or between the first and second drops from the end.
In the third ejection step, the dispersion liquid is ejected from the small-diameter nozzles of the inkjet head group to the concave portion at the intersection of the droplet in the first step and the droplet in the second step.
In the fourth ejection step, the dispersion liquid is ejected to the same wiring forming region as the first ejection step and the second ejection step from substantially the same position as the first ejection step or from the end. It is narrower than the process and the second ejection process.
[0074]
According to the wiring forming apparatus 10 of the present embodiment, it is possible to form a single droplet of the dispersion liquid on the substrate with a width substantially equal to the diameter after landing. Further, by repeating the fourth ejection step, it is possible to obtain a desired film thickness while maintaining this line width. That is, according to the present embodiment, thinning and thickening can be achieved without causing a bulge.
Therefore, according to the present embodiment, it is possible to form a conductive film wiring which has a large film thickness, is advantageous for electric conduction, hardly causes defects such as disconnection or short circuit, can be formed finely, and has reduced radiation noise.
[0075]
[Fourth embodiment]
As a fourth embodiment, a liquid crystal device as an example of the electro-optical device according to the invention will be described. FIG. 9 shows a planar layout of signal electrodes and the like on the first substrate of the liquid crystal device according to the present embodiment. The liquid crystal device according to the present embodiment includes a first substrate, a second substrate (not shown) provided with scanning electrodes and the like, and a liquid crystal (not shown) sealed between the first substrate and the second substrate. )).
[0076]
As shown in FIG. 9, a plurality of signal electrodes 310 are provided in a pixel area 303 on the first substrate 300 in a multiplex matrix. In particular, each signal electrode 310 is composed of a plurality of pixel electrode portions 310a provided for each pixel and signal wiring portions 310b connecting these in a multiplex matrix, and extends in the Y direction. ing.
Reference numeral 350 denotes a liquid crystal drive circuit having a one-chip structure. The liquid crystal drive circuit 350 is connected to one end (lower side in the drawing) of the signal wiring portions 310b via first wiring lines 331.
Reference numerals 340... Indicate upper and lower conductive terminals, and the upper and lower conductive terminals 340 are connected to terminals provided on a second substrate (not shown) by upper and lower conductive members 341. Further, the upper and lower conductive terminals 340 and the liquid crystal drive circuit 350 are connected via the second wiring 332.
[0077]
In the present embodiment, the signal wiring portions 310b provided on the first substrate 300, the first wiring 331, and the second wiring 332 are each formed by using the wiring forming apparatus according to the second embodiment. It is formed by the wiring forming method according to the first embodiment.
According to the liquid crystal device of the present embodiment, a failure such as disconnection or short circuit of each of the wirings does not easily occur, radiation noise can be reduced, and furthermore, a liquid crystal device that can be reduced in size and thickness can be provided.
[0078]
[Fifth Embodiment]
As a fifth embodiment, a plasma display device which is an example of the electro-optical device according to the invention will be described. FIG. 10 is an exploded perspective view of the plasma display device 500 of the present embodiment.
The plasma display device 500 according to this embodiment is roughly composed of a glass substrate 501 and a glass substrate 502 arranged to face each other, and a discharge display unit 510 formed between them.
The discharge display unit 510 is formed by assembling a plurality of discharge chambers 516, and among the plurality of discharge chambers 516, a red discharge chamber 516 (R), a green discharge chamber 516 (G), and a blue discharge chamber 516 (B). The two discharge chambers 516 are arranged in pairs so as to form one pixel.
Address electrodes 511 are formed in stripes at predetermined intervals on the upper surface of the (glass) substrate 501, and a dielectric layer 519 is formed so as to cover the address electrodes 511 and the upper surface of the substrate 501. Partition walls 515 are formed on the address electrodes 519 between the address electrodes 511 and 511 and along the address electrodes 511. The partition 515 is also partitioned at predetermined intervals in the longitudinal direction at predetermined intervals in a direction orthogonal to the address electrodes 511 (not shown), and is basically adjacent to the left and right sides of the address electrodes 511 in the width direction. A rectangular region is formed which is partitioned by the partition and a partition extending in a direction orthogonal to the address electrode 511. A discharge chamber 516 is formed so as to correspond to the rectangular region. One pixel is composed of three pairs. In addition, a phosphor 517 is arranged inside a rectangular area defined by the partition 515. The phosphor 517 emits any one of red, green, and blue fluorescent light. A red phosphor 517 (R) is provided at the bottom of the red discharge chamber 516 (R), and a bottom of the green discharge chamber 516 (G). , A green phosphor 517 (G) is arranged, and a blue phosphor 517 (B) is arranged at the bottom of the blue discharge chamber 516 (B).
[0079]
Next, on the glass substrate 502 side, a plurality of display electrodes 512 are formed at predetermined intervals in a stripe shape in a direction orthogonal to the address electrodes 511, and a dielectric layer 513 is formed to cover them. A protective film 514 made of MgO or the like is formed.
Then, the substrate 501 and the substrate 2 of the glass substrate 502 are bonded to each other with the address electrodes 511 and the display electrodes 512 facing each other so as to be orthogonal to each other, and formed on the substrate 501, the partition 515, and the glass substrate 502 side. A discharge chamber 516 is formed by evacuating a space surrounded by the protective film 514 and filling a rare gas. The display electrodes 512 formed on the glass substrate 502 side are formed so as to be arranged two by two for each discharge chamber 516.
The address electrode 511 and the display electrode 512 are connected to an AC power supply (not shown), and when the electrodes are energized, the phosphor 517 is excited and emits light in the discharge display unit 510 at a required position, thereby enabling color display. ing.
[0080]
In the present embodiment, the address electrodes 511 and the display electrodes 512 are each formed by the wiring forming method according to the first embodiment using the wiring forming apparatus according to the second embodiment.
According to the liquid crystal device of the present embodiment, it is possible to provide a plasma display device in which defects such as disconnection and short circuit of each electrode hardly occur, radiation noise is reduced, and furthermore, the size and thickness can be reduced. .
[0081]
[Sixth embodiment]
As a sixth embodiment, a specific example of the electronic device of the invention will be described.
FIG. 11A is a perspective view illustrating an example of a mobile phone. In FIG. 11A, reference numeral 600 denotes a mobile phone main body, and reference numeral 601 denotes a liquid crystal display unit including the liquid crystal device according to the fourth embodiment.
FIG. 11B is a perspective view illustrating an example of a portable information processing device such as a word processor or a personal computer. 11B, reference numeral 700 denotes an information processing device, 701 denotes an input unit such as a keyboard, 703 denotes an information processing unit main body, and 702 denotes a liquid crystal display unit provided with the liquid crystal device of the fourth embodiment.
FIG. 11C is a perspective view illustrating an example of a wristwatch-type electronic device. In FIG. 11C, reference numeral 800 denotes a watch main body, and reference numeral 801 denotes a liquid crystal display unit including the liquid crystal device according to the fourth embodiment.
Since the electronic devices shown in FIGS. 11A to 11C are provided with the liquid crystal device of the above embodiment, defects such as disconnection or short circuit of the wiring hardly occur, and furthermore, miniaturization and thinning are achieved. It becomes possible.
Although the electronic device of the present embodiment includes a liquid crystal device, the electronic device may include another electro-optical device such as an organic electroluminescence display device and a plasma display device.
[0082]
[Seventh embodiment]
As a seventh embodiment, an embodiment of the non-contact type card medium of the present invention will be described. As shown in FIG. 12, the non-contact card medium 400 according to the present embodiment includes a non-contact card medium 400 according to the present embodiment in which a semiconductor integrated circuit chip 408 An antenna circuit 412 is built in, and at least one of power supply and data exchange is performed with an external transceiver (not shown) by electromagnetic wave or capacitive coupling.
[0083]
In the present embodiment, the antenna circuit 412 is formed by the wiring forming method according to the first embodiment using the wiring forming apparatus according to the second embodiment.
According to the non-contact card medium of the present embodiment, the antenna circuit 412 hardly suffers from a defect such as disconnection or short-circuit, reduces radiation noise, and can be reduced in size and thickness. It can be.
[0084]
Electronic devices to which the liquid crystal display panel according to the present invention can be applied include, in addition to the personal computer and mobile phone shown in FIG. 11, a liquid crystal television, a viewfinder type / monitor direct-view type video tape recorder, and a car navigation system. Examples include an apparatus, a pager, an electronic organizer, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a digital still camera, and are not particularly limited to the above three examples.
[0085]
Further, in the above-described embodiments, the case where the present invention is applied to a liquid crystal device as an electro-optical device has been described. However, the present invention is not limited to this. , Plasma display device, FED (field emission display) device, LED (light emitting diode) display device, electrophoretic display device, thin TV, thin television using liquid crystal shutter, etc., device using digital micromirror device (DMD) And other various electro-optical devices.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a drawing pattern according to a first embodiment.
FIG. 2 is a schematic diagram of another drawing pattern according to the first embodiment.
FIG. 3 is a schematic diagram of a drawing pattern according to a second embodiment.
FIG. 4 is a schematic diagram of a drawing pattern according to a second embodiment.
FIG. 5 is a schematic diagram of a drawing pattern according to a second embodiment.
FIG. 6 is a schematic diagram of a drawing pattern according to a second embodiment.
FIG. 7 is a schematic diagram of a drawing pattern according to a second embodiment.
FIG. 8 is a schematic view of a film forming apparatus according to a third embodiment.
FIG. 9 is a plan view on a first substrate of a liquid crystal device according to a fourth embodiment.
FIG. 10 is an exploded perspective view of a plasma display device according to a fifth embodiment.
FIGS. 11A and 11B are diagrams illustrating an electronic apparatus according to a sixth embodiment, in which FIG. 11A illustrates an example of a mobile phone including the liquid crystal display device according to the fourth embodiment, and FIG. 11B illustrates a liquid crystal according to the fourth embodiment; FIG. 3C is a diagram illustrating an example of a portable information processing device including a display device, and FIG. 4C is a diagram illustrating an example of a wristwatch-type electronic device including a liquid crystal display device according to a fourth embodiment.
FIG. 12 is an exploded perspective view of a non-contact type card medium according to a seventh embodiment.
FIG. 13 is a schematic view showing a state of a conventional droplet.
[Explanation of symbols]
L ₁ ~ L ₄ ... Droplets, S ₁ ~ S ₂ ... Dry film, H ... Inkjet head, W ... Substrate, 10 ... Wiring forming device, 1 ... Inkjet head group, 4 ... Placement table, 15 ... Heater, 100 ..Standard droplets, 101 wiring, 102 concave portions, 103 small droplets

Claims (17)

A method for forming a film pattern, comprising forming a film pattern by discharging droplets made of a liquid containing a film forming component onto a predetermined film forming region on a substrate,
A method for forming a film pattern, comprising: discharging droplets having a small diameter so as to fill a concave portion of a wiring drawn with a predetermined droplet diameter. A method for forming a film pattern, comprising forming a film pattern by discharging droplets made of a liquid containing a film forming component onto a predetermined film forming region on a substrate,
A first discharging step of discharging a plurality of droplets at predetermined intervals over the entire film formation region;
A second ejection step of ejecting a plurality of droplets at predetermined intervals to a position different from the ejection position in the first ejection step in the entire film formation region;
A third discharging step of discharging a droplet having a smaller diameter than the first discharging droplet and the second discharging droplet so as to fill a concave portion of a wiring formed by the first discharging droplet and the second discharging droplet; A method for forming a film pattern, comprising: In claim 1 or 2,
A method of forming a film pattern, wherein the concave portion of the wiring is an intersection where a plurality of adjacent droplets overlap. In claim 3,
The first ejection step has a pitch larger than the diameter of the droplet after landing on the substrate,
The second discharging step discharges a plurality of droplets at a pitch larger than the diameter of the droplets after landing on the substrate at a position different from the discharging position in the first discharging step over the entire film formation region. A method for forming a film pattern, comprising: In claim 3 or 4,
A method of forming a film pattern, wherein a pitch in the second ejection step is substantially the same as a pitch in the first ejection step. In any one of claims 3 to 5,
A film discharging step of discharging a plurality of droplets of the liquid at a pitch smaller than the pitch in the first discharging step over the entire film forming region after the second discharging step. The method of forming the pattern. In claim 6,
A pitch in the fourth discharging step is equal to or less than a diameter of the droplet after landing on the substrate. In any one of claims 1 to 7,
A method for forming a film pattern, wherein the film forming component contains conductive fine particles. In claim 8,
A method for forming a film pattern, comprising a step of converting the film forming component into a conductive film by heat treatment or light treatment. In any one of claims 1 to 7,
The film forming component is a resist, a film pattern of the resist is formed on a substrate provided with a conductive layer, the conductive layer remaining after the resin is cured is removed, and then the resist is removed. Method of forming a film pattern. A film pattern forming apparatus for forming a film pattern by discharging a liquid containing a film forming component to a predetermined film forming region on a substrate by an inkjet method,
An apparatus for forming a film pattern, comprising forming a film pattern by the method for forming a film pattern according to claim 1. In claim 11,
An apparatus for forming a film pattern, wherein the film forming component is conductive fine particles. In claim 12,
An apparatus for forming a film pattern, comprising: a heat treatment unit or a light treatment unit that converts a liquid discharged onto the substrate into a conductive film. A conductive film wiring formed by the method of forming a film pattern according to claim 1. An electro-optical device comprising the conductive film wiring according to claim 14. An electronic apparatus comprising the electro-optical device according to claim 15. A non-contact type card medium comprising the conductive film wiring according to claim 14 as an antenna circuit.

Images