JP3951792B2 - Film pattern forming method, film pattern forming apparatus, conductive film wiring, electro-optical device, electronic apparatus, and non-contact card medium - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for forming a film pattern on a substrate, and more particularly, to a technique for forming a film pattern on a substrate by discharging a liquid material as droplets from a discharge means.
[0002]
[Prior art]
As a technique for forming a film pattern on the substrate, a film made of a liquid material for the film pattern is formed on the substrate using a coating technique such as a spin coat method, and this film is formed into a desired pattern using a photolithography method. Methods of forming are known.
[0003]
[Problems to be solved by the invention]
On the other hand, in recent years, a technique has been proposed in which a liquid material is disposed at a desired position on a substrate and a film pattern is directly formed on the substrate. In this technique, the steps related to photolithography can be omitted or simplified.
[0004]
As a technique for disposing the liquid material at a desired position on the substrate, there is a method of discharging the liquid material as droplets through a nozzle provided in the discharge means. This discharge method is advantageous in that it consumes less liquid material and can easily control the amount and position of the liquid material placed on the substrate as compared with a coating technique such as spin coating.
[0005]
However, there is a problem in that it is difficult to increase the thickness of the film pattern in the technique of disposing the liquid material as droplets on the substrate. That is, if the amount of droplets disposed on the substrate is increased for the purpose of increasing the film thickness, the droplets coalesce on the substrate and are likely to spread on the substrate without increasing the film thickness.
Further, when the film pattern is a conductive film, a liquid pool (bulge) is generated due to the spread of the above-described droplets, which may cause problems such as disconnection or short circuit.
[0006]
The present invention has been made in view of the above circumstances, and provides a film pattern forming method and a forming apparatus that can increase the thickness and are less likely to cause problems such as disconnection and short circuit when used as a conductive film. For the purpose.
Another object of the present invention is to provide a conductive film wiring that is thick and advantageous for electrical conduction and is less prone to problems such as disconnection and short circuit.
Another object of the present invention is to provide an electro-optical device that is less prone to problems such as disconnection or short-circuiting of wiring portions, an electronic device using the same, and a non-contact card medium.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the film pattern forming method of the present invention includes a plurality of nozzles. In a row A method of forming a plurality of film patterns on a substrate by discharging a liquid material as droplets from an arrayed discharge unit, wherein the plurality of droplets discharged from the discharge unit are arranged in a direction in which a plurality of nozzles are arranged. The first step of arranging the liquid droplets on the substrate at a fixed distance in the orthogonal direction and the position where the droplet placement starts is shifted by a predetermined distance in the arrangement direction of the plurality of nozzles, and the droplets arranged in the first step Place the droplets so that they partially overlap, and arrange the droplets so as to fill the gaps arranged in the first step, and create multiple patterns that are continuous in the arrangement direction in which multiple nozzles are arranged The second step to be formed, the first step, and the second step are repeated, and the droplets are arranged on the droplets arranged in the first step and the second step to form a plurality of film patterns. The third step When A method for forming a film pattern, comprising:
[0008]
In the method for forming a film pattern, a step of placing droplets made of a liquid material on a substrate at a certain distance is repeated while shifting the position at which the droplet placement is started, thereby forming a desired pattern on the substrate. A film pattern having a film thickness and shape can be formed. For example, a linear continuous pattern can be formed by repeatedly disposing the droplets so as to fill the gaps between the droplets disposed on the substrate.
In each of the above repeated steps, the droplets are arranged at a certain distance, so that the next droplet does not immediately adhere to the droplet immediately after being placed on the substrate, and the droplets coalesce. Spread on the substrate. That is, in the process of repeating the above steps, even when another droplet overlaps the droplet disposed on the substrate, the droplet previously disposed on the substrate has already been dried to some extent or completely, The above-described spread of the droplet is suppressed. By suppressing the spread of the droplets, occurrence of problems such as disconnection and short circuit when the film pattern is applied to the conductive film is prevented. Further, by suppressing the spread of the droplets, it becomes easy to arrange the droplets so as to overlap each other, and it is possible to realize a thick film pattern.
Further, in the above method for forming a film pattern, when the above steps are repeated, it is only necessary to shift the position where droplets are placed, and the distance interval between the continuously placed droplets is constant. The discharge conditions of the process are almost equal to each other, and the control is simplified. In addition, since each part of the film pattern undergoes substantially the same formation process, the film can be homogenized.
[0010]
In the film pattern forming method, a drying process may be performed after the first step. As a result, the droplet to be arranged next and the droplet arranged in the first step do not merge and spread on the substrate.
In the method for forming a film pattern, a drying process may be performed after the second step. As a result, the liquid droplet to be arranged next and the liquid droplet arranged in the second step do not merge and spread on the substrate.
In the film pattern forming method, it is preferable that the surface of the substrate is processed to be liquid repellent with respect to the liquid material before the droplets are disposed on the substrate. Here, “liquid repellency” refers to a characteristic that shows incompatibility with a liquid material.
Thereby, the spread of the droplets arranged on the substrate can be suppressed, and the film pattern can be thickened and the shape can be stabilized.
[0011]
The film pattern forming apparatus of the present invention is an apparatus for forming a film pattern on a substrate by discharging a liquid material as droplets from a discharge means, and forming the film pattern by the above-described film pattern forming method. It is characterized by that.
In this film pattern forming apparatus, it is possible to realize a film thickness increase and to form a film pattern that is less likely to cause problems when used as a conductive film.
[0012]
The conductive film wiring of the present invention is formed by the above-described film pattern forming apparatus.
This conductive film wiring has a large film thickness and is advantageous for electric conduction, and it is difficult to cause problems such as disconnection and short circuit.
[0013]
In addition, an electro-optical device according to the present invention includes the conductive film wiring described above. Examples of the electro-optical device include a liquid crystal display device, an organic electroluminescence display device, and a plasma display device.
According to another aspect of the invention, there is provided an electronic apparatus including the above-described electro-optical device.
The non-contact card medium of the present invention is characterized in that the conductive film wiring described above is provided as an antenna circuit.
According to these inventions, defects such as disconnection and short-circuiting of the wiring portion and antenna are unlikely to occur.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, as an example of an embodiment according to the present invention, a method for forming a conductive film wiring on a substrate will be described. The wiring forming method according to the present embodiment is a method in which a liquid material for conductive film wiring is disposed on a substrate, and a conductive film pattern for wiring is formed on the substrate. It includes a heat treatment / light treatment process. Note that the liquid material is disposed by a liquid ejection method in which the liquid material is ejected as droplets via a nozzle of a liquid ejection head, a so-called inkjet method.
[0015]
Various substrates such as Si wafer, quartz glass, glass, plastic film, and metal plate can be used as the conductive film wiring substrate. Further, a substrate in which a semiconductor film, a metal film, a dielectric film, an organic film or the like is formed as a base layer on the surface of these various material substrates may be used as a substrate on which conductive film wiring is to be formed.
[0016]
In this example, a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium is used as the liquid material for the conductive film wiring. As the conductive fine particles used here, in addition to metal fine particles containing any of gold, silver, copper, palladium, and nickel, conductive polymer, superconductor fine particles, and the like are used.
These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility. Examples of the coating material that coats the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid, and the like.
The particle diameter of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, the nozzle of the liquid discharge head may be clogged. On the other hand, if it is smaller than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of organic substances in the obtained film becomes excessive.
[0017]
The liquid dispersion medium containing conductive fine particles preferably has a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa). When the vapor pressure is higher than 200 mmHg, the dispersion medium rapidly evaporates after ejection, making it difficult to form a good film.
The vapor pressure of the dispersion medium is more preferably 0.001 mmHg to 50 mmHg (about 0.133 Pa to 6650 Pa). When the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying tends to occur when droplets are ejected by the ink jet method, and stable ejection becomes difficult.
On the other hand, in the case of a dispersion medium having a vapor pressure lower than 0.001 mmHg at room temperature, drying is slow and the dispersion medium tends to remain in the film, and a high-quality conductive film can be obtained after heat and / or light treatment in the subsequent process. Hateful.
[0018]
The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. In addition to water, alcohols such as methanol, ethanol, propanol and butanol, n-heptane , N-octane, decane, toluene, xylene, cyclone, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene and other hydrocarbon compounds, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether , Diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether Ether compounds such as p- dioxane, propylene carbonate, .gamma.-butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, may be mentioned polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred from the viewpoints of fine particle dispersibility, dispersion stability, and ease of application to the inkjet method, and more preferred dispersion media. Can include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more.
[0019]
The dispersoid concentration in the case where the conductive fine particles are dispersed in the dispersion medium is 1% by mass or more and 80% by mass or less, and can be adjusted according to the desired film thickness of the conductive film. If it exceeds 80% by mass, aggregation tends to occur and it is difficult to obtain a uniform film.
[0020]
The surface tension of the conductive fine particle dispersion is preferably in the range of 0.02 N / m to 0.07 N / m. When the liquid is ejected by the ink jet method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition to the nozzle surface increases, and thus flight bending tends to occur, exceeding 0.07 N / m. Since the shape of the meniscus at the nozzle tip is not stable, it becomes difficult to control the discharge amount and the discharge timing.
[0021]
In order to adjust the surface tension, a small amount of a surface tension modifier such as a fluorine-based, silicone-based, or nonionic-based material may be added to the above-described dispersion within a range that does not unduly decrease the contact angle with the substrate. The nonionic surface tension modifier improves the wettability of the liquid to the substrate, improves the leveling property of the film, and helps prevent the occurrence of fine irregularities in the film.
The dispersion liquid may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.
[0022]
The viscosity of the dispersion is preferably 1 mPa · s to 50 mPa · s. When discharging by the inkjet method, if the viscosity is less than 1 mPa · s, the nozzle periphery is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the nozzle hole is clogged frequently. Therefore, it becomes difficult to smoothly discharge droplets.
[0023]
(Surface treatment process)
In the surface treatment step, the surface of the substrate on which the conductive film wiring is formed is processed to be liquid repellent with respect to the liquid material. Specifically, the surface treatment is performed so that a predetermined contact angle with respect to the liquid material containing conductive fine particles is 60 [deg] or more, preferably 90 [deg] or more and 110 [deg] or less.
As a method for controlling the liquid repellency (wetting property) of the surface, for example, a method of forming a self-assembled film on the surface of the substrate, a plasma treatment method, or the like can be employed.
[0024]
In the self-assembled film forming method, a self-assembled film made of an organic molecular film or the like is formed on the surface of a substrate on which conductive film wiring is to be formed.
The organic molecular film for treating the substrate surface has a functional group that can bind to the substrate and a functional group that modifies the surface properties of the substrate, such as a lyophilic group or a liquid repellent group, on the opposite side (controls the surface energy). And a carbon straight chain or a partially branched carbon chain connecting these functional groups, and is bonded to a substrate and self-assembles to form a molecular film, for example, a monomolecular film.
[0025]
Here, the self-assembled film is composed of a binding functional group capable of reacting with constituent atoms such as a base layer such as a substrate and other linear molecules, and has extremely high orientation due to the interaction of the linear molecules. It is a film formed by orienting a compound. Since this self-assembled film is formed by orienting single molecules, the film thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, uniform and excellent liquid repellency and lyophilicity can be imparted to the surface of the film.
[0026]
By using, for example, fluoroalkylsilane as the compound having high orientation, each compound is oriented so that the fluoroalkyl group is located on the surface of the film, and a self-assembled film is formed. Liquid repellency is imparted.
[0027]
Examples of compounds that form a self-assembled film include heptadecafluoro-1,1,2,2 tetrahydrodecyltriethoxysilane, heptadecafluoro-1,1,2,2 tetrahydrodecyltrimethoxysilane, heptadecafluoro-1 , 1,2,2 tetrahydrodecyltrichlorosilane, tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, tridecafluoro-1 , 1,2,2 tetrahydrooctyltrichlorosilane, trifluoropropyltrimethoxysilane, and other fluoroalkylsilanes (hereinafter referred to as “FAS”). In use, one compound may be used alone, or two or more compounds may be used in combination. Note that by using FAS, adhesion to the substrate and good liquid repellency can be obtained.
[0028]
FAS generally has the structural formula RnSiX _(4-n) It is represented by Here, n represents an integer of 1 to 3, and X is a hydrolyzable group such as a methoxy group, an ethoxy group, or a halogen atom. R is a fluoroalkyl group, and (CF _Three ) (CF ₂ ) X (CH ₂ ) Y (where x represents an integer from 0 to 10 and y represents an integer from 0 to 4), and when a plurality of R or X are bonded to Si, R or Each X may be the same or different. The hydrolyzable group represented by X forms silanol by hydrolysis, reacts with the hydroxyl group of the base such as the substrate (glass, silicon), etc., and bonds to the substrate with a siloxane bond. On the other hand, R is on the surface (CF _Three ), Etc., the base surface of the substrate or the like is modified to a surface that does not get wet (surface energy is low).
[0029]
A self-assembled film made of an organic molecular film or the like is formed on a substrate when the above raw material compound and the substrate are placed in the same sealed container and left at room temperature for about 2 to 3 days. Further, by holding the entire sealed container at 100 ° C., it is formed on the substrate in about 3 hours. What has been described above is the formation method from the gas phase, but the self-assembled film can also be formed from the liquid phase. For example, the self-assembled film can be obtained on the substrate by immersing the substrate in a solution containing the raw material compound, washing and drying.
Note that before the self-assembled film is formed, it is desirable to perform pretreatment by irradiating the substrate surface with ultraviolet light or washing with a solvent.
[0030]
In the plasma processing method, the substrate is irradiated with plasma under normal pressure or vacuum. Various types of gas used for the plasma treatment can be selected in consideration of the surface material of the substrate on which the conductive film wiring is to be formed. Examples of the processing gas include tetrafluoromethane, perfluorohexane, perfluorodecane, and the like.
[0031]
In addition, the process which processes the surface of a board | substrate to liquid repellency can also be performed by sticking to the board | substrate surface the film which has desired liquid repellency, for example, the polyimide film etc. which were tetrafluoroethylene processed. Moreover, you may use a polyimide film as a board | substrate as it is.
In addition, when the substrate surface has a liquid repellency higher than a desired liquid repellency, a treatment for making the substrate surface lyophilic by irradiating ultraviolet light of 170 to 400 nm or exposing the substrate to an ozone atmosphere. Go and control the surface condition.
[0032]
(Material placement process)
FIGS. 1A to 1C show an example of a procedure when a linear conductive film pattern is formed on a substrate as an example of a method for disposing a liquid material on the substrate.
In the material arranging step, the liquid material is ejected as droplets from the liquid ejection head 10, and the droplets are arranged on the substrate 11 at a certain distance (pitch). Then, the conductive film pattern is formed on the substrate 11 by repeating the droplet placement operation. The details will be described below.
[0033]
First, as shown in FIG. 1A, droplets L1 ejected from the liquid ejection head 10 are arranged on the substrate 11 with a certain interval so that the droplets L1 do not contact each other on the substrate 11. To do. That is, the droplets L1 are sequentially disposed on the substrate 11 at a pitch P1 larger than the diameter of the droplets L1 immediately after being disposed on the substrate 11.
[0034]
After disposing the droplets L1 on the substrate 11, a drying process is performed as necessary in order to remove the dispersion medium. The drying process may be performed using lamp annealing in addition to a general heating process using a heating means such as a hot plate or an electric furnace. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used. These light sources generally have a power output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient.
At this time, not only the removal of the dispersion medium but also the degree of heating and light irradiation may be increased until the dispersion is converted into a conductive film. However, since conversion of the conductive film may be performed collectively in the heat treatment / light treatment process after the arrangement of all the liquid materials is completed, it is sufficient in this step that the dispersion medium can be removed to some extent. For example, in the case of heat treatment, heating at about 100 ° C. is usually performed for several minutes.
Also, the drying process can proceed simultaneously with the discharge of the liquid material. For example, by previously heating the substrate or using a dispersion medium having a low boiling point along with cooling of the liquid discharge head, drying of the droplet can proceed immediately after the droplet is placed on the substrate. it can.
[0035]
Next, as shown in FIG. 1B, the above-described droplet placement operation is repeated. That is, as in the previous time shown in FIG. 1A, the liquid material is ejected from the liquid ejection head 10 as droplets L2, and the droplets L2 are arranged on the substrate 11 at regular intervals. At this time, the distance interval between the droplets L2 is the same as the previous time (pitch P2 = P1), and the droplets L2 do not contact each other. Further, the position at which the placement of the droplet L2 is started is shifted by a predetermined distance S1 from the position at which the previous droplet L1 is placed. That is, the center position of the previous droplet L1 disposed on the substrate 11 and the center position of the current droplet L2 are in a positional relationship separated by the distance S1. In this embodiment, the distance to be shifted (shift amount S1) is narrower than the pitches P1 and P2 (S1 <P1 = P2), and the droplet L2 next to the droplet L1 previously disposed on the substrate 11 is used. Are partly overlapped.
[0036]
When the droplet L2 is placed on the substrate 11, the current droplet L2 and the previous droplet L1 are in contact with each other, but since the previous droplet L1 has already been completely or partially removed, It is rare that they merge and spread on the substrate 11.
In FIG. 1B, the position where the droplet L2 starts to be placed is the same side as the previous time (left side shown in FIG. 1B), but the opposite side (right side shown in FIG. 1B). It is good. In this case, the distance of relative movement between the liquid discharge head 10 and the substrate 11 can be reduced.
In addition, after the droplet L2 is placed on the substrate 11, a drying process is performed as necessary in order to remove the dispersion medium as in the previous case. In this case, not only the dispersion medium but also the degree of heating and light irradiation can be increased until the dispersion liquid is converted into a conductive film, but it is sufficient if the dispersion medium can be removed to some extent.
[0037]
Thereafter, as shown in FIG. 1C, the above-described droplet placement operation is repeated a plurality of times. At each time, the distance interval (pitch Pn) between the droplets Ln to be arranged is the same as the distance of the first time (pitch Pn = P1), and is always constant. Therefore, the droplets Ln immediately after being arranged on the substrate 11 do not contact each other, and the droplets are prevented from being combined and spreading on the substrate 11. In addition, since the surface of the substrate 11 is processed to be liquid repellent in advance, the spread of the droplets disposed on the substrate 11 is also suppressed from this point. As a result, the droplets are arranged one above the other so that the thickness of the liquid material arranged on the substrate 11 increases.
[0038]
Further, in FIG. 1C, when the droplet placement operation is repeated a plurality of times, the position at which the placement of the droplet Ln is started is shifted by a predetermined distance from the position at which the previous droplet is placed each time. By repeating this droplet placement operation, the gaps between the droplets placed on the substrate 11 are filled, and a linear continuous pattern is formed. Note that the film pattern formed on the substrate is always formed by droplet arrangement with the same pitch, and the entire structure has undergone almost the same formation process, so that the structure is uniform.
[0039]
2 and 3 show an example of a film pattern formed on the substrate 11. In the example of FIGS. 2 and 3, a plurality of nozzles 30 are arranged in a line in the liquid ejection head 10, and at least one nozzle (in this example, three nozzles) of the plurality of nozzles 30 is selectively used. The liquid material is discharged toward the substrate 11.
[0040]
In the example shown in FIG. 2, when the arrangement operation of the droplet Ln is repeated, the position where the arrangement of the droplet Ln is started is shifted in a direction orthogonal to the arrangement direction of the plurality of nozzles 30. That is, as shown in FIG. 2A, the droplets Ln are arranged on the substrate 11 at a predetermined pitch P, and as shown in FIG. 2B, in a direction orthogonal to the arrangement direction of the nozzles 30. The placement operation of the droplet Ln is repeated while shifting the start point by a predetermined distance S. As a result, a continuous pattern is formed on the substrate 11 in a direction orthogonal to the arrangement direction of the plurality of nozzles 30.
In this case, three linear patterns are formed by simultaneously discharging liquid materials from three nozzles of the plurality of nozzles 30 of the liquid discharge head 10.
[0041]
In the example shown in FIG. 3, when the arrangement operation of the droplet Ln is repeated, the position where the arrangement of the droplet Ln is started is shifted in parallel with the arrangement direction of the plurality of nozzles 30. That is, as shown in FIG. 3A, the droplets Ln are arranged on the substrate 11 at a predetermined pitch P, and as shown in FIG. 3B, the start point is parallel to the arrangement direction of the nozzles 30. The operation of arranging the droplets Ln is repeated while shifting by a predetermined distance S. As a result, a continuous pattern in the arrangement direction of the plurality of nozzles 30 is formed on the substrate 11.
In this case, a plurality of linear patterns are formed according to the number of droplets arranged at each predetermined pitch P.
[0042]
Note that by forming a plurality of linear patterns shown in FIGS. 2 and 3 so as to overlap each other, it is possible to form a film of a liquid material in a planar shape on a substrate.
Further, the amount (shift amount) of shifting the start point of the droplet arrangement and the direction of shifting (shift direction) are not limited to the above-described example. For example, when the droplet placement operation is repeated, the position where the droplet placement is started may be shifted obliquely with respect to the arrangement direction of the plurality of nozzles 30. In this case, it is possible to form a pattern that is obliquely continuous with respect to the arrangement direction of the plurality of nozzles 30.
[0043]
As described above, in this example, film patterns having various shapes can be formed by appropriately setting the nozzle to be used, the arrangement pitch of the droplets, the shift distance (shift amount) of the start point, the shift direction (shift direction), and the like. It can be formed on a substrate.
Further, a film pattern having a better shape can be formed by appropriately controlling the combination of the parameters of the amount of droplets, the arrangement pitch of the droplets, and the wettability of the surface of the substrate.
Further, in this example, when the droplet placement operation is repeated, the position where the droplet placement is started is merely shifted, and the pitch between the continuously placed droplets is constant. For this reason, the discharge conditions at the time of each placement operation are substantially equal to each other, and there is an advantage that the control can be simplified. In addition, although the discharge conditions at the time of each arrangement | positioning operation | movement are substantially equal, control can be simplified, However, You may change the pitch of droplets for every repetition.
[0044]
(Heat treatment / light treatment process)
In the heat treatment / light treatment step, the dispersion medium or coating material contained in the droplets disposed on the substrate is removed. That is, the liquid material for forming a conductive film disposed on the substrate needs to completely remove the dispersion medium in order to improve electrical contact between the fine particles. Further, when a coating material such as an organic material is coated on the surface of the conductive fine particles in order to improve dispersibility, it is also necessary to remove this coating material.
[0045]
The heat treatment and / or light treatment is usually performed in the air, but may be performed in an inert gas atmosphere such as nitrogen, argon, or helium as necessary. The treatment temperature of heat treatment and / or light treatment depends on the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as fine particle dispersibility and oxidation, the presence and amount of coating material, It is determined appropriately in consideration of the heat resistant temperature.
For example, in order to remove the coating material made of organic matter, it is necessary to bake at about 300 ° C. Moreover, when using a board | substrate, such as a plastics, it is preferable to carry out at room temperature or more and 100 degrees C or less.
[0046]
The heat treatment and / or light treatment may be performed using lamp annealing in addition to general heat treatment using a heating means such as a hot plate or an electric furnace. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used. These light sources generally have a power output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient.
By the heat treatment and / or light treatment, electrical contact between the fine particles is ensured and converted into a conductive film.
[0047]
Since the conductive film formed according to this embodiment is formed by stacking liquid material droplets on the substrate without spreading on the substrate, the film thickness can be increased. Further, it is possible to form a linear pattern with a width substantially equal to the diameter of the droplets arranged on the substrate, and thinning can also be realized.
[0048]
Next, as an example of the film pattern forming apparatus of the present invention, a wiring forming apparatus for carrying out the above wiring forming method will be described.
FIG. 4 is a schematic perspective view of the wiring forming apparatus according to the present embodiment. As shown in FIG. 4, the wiring forming apparatus 100 includes a liquid ejection head 10, an X direction guide shaft 2 for driving the liquid ejection head 10 in the X direction, an X direction drive motor 3 for rotating the X direction guide shaft 2, A mounting table 4 for mounting the substrate 11, a Y-direction guide shaft 5 for driving the mounting table 4 in the Y direction, a Y-direction drive motor 6 for rotating the Y-direction guide shaft 5, a cleaning mechanism unit 14, and a heater 15 , And a control device 8 or the like for comprehensively controlling them. Each of the X direction guide shaft 2 and the Y direction guide shaft 5 is fixed on the base 7.
[0049]
The liquid discharge head 10 discharges a liquid material made of a dispersion containing conductive fine particles from a nozzle (discharge port), and is fixed to the X-direction guide shaft 2. The X direction drive motor 3 is a stepping motor or the like, and rotates the X direction guide shaft 2 when a drive pulse signal in the X axis direction is supplied from the control device 8. By the rotation of the X direction guide shaft 2, the liquid discharge head 10 moves in the X axis direction with respect to the base 7. The liquid ejection head 10 is supported so as to be movable in the respective directions around the X axis, the Y axis, and the axis orthogonal to the XY plane, and the angle can be adjusted.
[0050]
As the liquid ejection method, there are various known techniques such as a piezo method that ejects ink using a piezoelectric element, which is a piezoelectric element, and a bubble method that ejects a liquid material by bubbles generated by heating the liquid material. Applicable. Among these, the piezo method has an advantage that it does not affect the composition of the material because no heat is applied to the liquid material. In this example, the above piezo method is used from the viewpoint of the high degree of freedom in selecting the liquid material and the good controllability of the droplets.
[0051]
The mounting table 4 is fixed to the Y-direction guide shaft 5, and Y-direction drive motors 6 and 16 are connected to the Y-direction guide shaft 5. The Y-direction drive motors 6 and 16 are stepping motors or the like, and rotate the Y-direction guide shaft 5 when a drive pulse signal in the Y-axis direction is supplied from the control device 8. The mounting table 4 moves in the Y-axis direction with respect to the base 7 by the rotation of the Y-direction guide shaft 5.
The cleaning mechanism 14 cleans the liquid discharge head 10 and prevents nozzle clogging and the like. The cleaning mechanism 14 is moved along the Y-direction guide shaft 5 by the Y-direction drive motor 16 during the cleaning.
The heater 15 heat-treats the substrate 11 using heating means such as lamp annealing, and performs heat treatment for evaporating and drying the liquid discharged on the substrate 11 and converting it into a conductive film.
[0052]
In the wiring forming apparatus 100 of the present embodiment, the substrate 11 and the liquid ejection head 10 are relatively moved via the X-direction drive motor 3 and / or the Y-direction drive motor 6 while ejecting the liquid material from the liquid ejection head 10. By doing so, the liquid material is arranged on the substrate 11.
The discharge amount of droplets from each nozzle of the liquid discharge head 10 is controlled by a voltage supplied from the control device 8 to the piezo element.
Further, the pitch of the droplets arranged on the substrate 11 is controlled by the speed of the relative movement and the ejection frequency from the liquid ejection head 10 (frequency of the driving voltage to the piezo element).
In addition, the position at which droplets are started on the substrate 11 is controlled by the relative movement direction, timing control for starting the discharge of droplets from the liquid discharge head 10 during the relative movement, and the like.
Thereby, the conductive film pattern for wiring described above is formed on the substrate 11.
[0053]
Next, a liquid crystal device will be described as an example of the electro-optical device of the invention.
FIG. 5 shows a planar layout of signal electrodes and the like on the first substrate of the liquid crystal device according to this embodiment. The liquid crystal device according to this embodiment includes the first substrate, a second substrate (not shown) provided with scanning electrodes and the like, and a liquid crystal (not shown) sealed between the first substrate and the second substrate. )).
[0054]
As shown in FIG. 5, a plurality of signal electrodes 310 are provided in a multiple matrix form in the pixel region 303 on the first substrate 300. In particular, each signal electrode 310 is composed of a plurality of pixel electrode portions 310a provided corresponding to each pixel and signal wiring portions 310b that connect them in a multiplex matrix, and extends in the Y direction. ing.
Reference numeral 350 denotes a liquid crystal driving circuit having a one-chip structure, and the liquid crystal driving circuit 350 and one end side (lower side in the figure) of the signal wiring portions 310b... Are connected via first routing wirings 331.
Further, reference numeral 340... Is a vertical conduction terminal, and the vertical conduction terminals 340... Are connected to terminals provided on a second substrate (not shown) by vertical conduction members 341. Further, the vertical conduction terminals 340... And the liquid crystal driving circuit 350 are connected via the second routing wirings 332.
[0055]
In the present embodiment example, the signal wiring portions 310b..., The first routing wiring 331... And the second routing wiring 332... Provided on the first substrate 300 are the same as those in the wiring forming apparatus shown in FIG. It is formed based on the wiring forming method shown in FIG. Therefore, defects such as disconnection and short circuit of the above-mentioned wirings are unlikely to occur, and it is easy to realize miniaturization and thinning.
[0056]
Next, a plasma display device will be described as another example of the electro-optical device of the present invention.
FIG. 6 is an exploded perspective view of the plasma display device 500 of this embodiment.
The plasma display device 500 includes substrates 501 and 502 disposed opposite to each other, and a discharge display unit 510 formed therebetween.
The discharge display unit 510 is a collection of a plurality of discharge chambers 516. Among the plurality of discharge chambers 516, the three discharge chambers 516 of the red discharge chamber 516 (R), the green discharge chamber 516 (G), and the blue discharge chamber 516 (B) are arranged so as to form one pixel. Has been.
[0057]
Address electrodes 511 are formed in stripes at predetermined intervals on the upper surface of the substrate 501, and a dielectric layer 519 is formed so as to cover the address electrodes 511 and the upper surface of the substrate 501. A partition wall 515 is formed on the dielectric layer 519 so as to be positioned between the address electrodes 511 and 511 and along the address electrodes 511. The barrier ribs 515 include barrier ribs adjacent to the left and right sides of the address electrode 511 in the width direction, and barrier ribs extending in a direction orthogonal to the address electrodes 511. A discharge chamber 516 is formed corresponding to a rectangular region partitioned by the partition 515.
In addition, a phosphor 517 is disposed inside a rectangular region defined by the partition 515. The phosphor 517 emits red, green, or blue fluorescence. The red phosphor 517 (R) is located at the bottom of the red discharge chamber 516 (R), and the bottom of the green discharge chamber 516 (G). Are arranged with a green phosphor 517 (G) and a blue phosphor 517 (B) at the bottom of the blue discharge chamber 516 (B).
[0058]
On the other hand, a plurality of display electrodes 512 are formed in stripes at predetermined intervals on the substrate 502 in a direction orthogonal to the previous address electrodes 511. Further, a dielectric layer 513 and a protective film 514 made of MgO or the like are formed so as to cover them.
The substrate 501 and the substrate 502 are bonded to each other with the address electrodes 511... And the display electrodes 512.
The address electrode 511 and the display electrode 512 are connected to an AC power supply (not shown). By energizing each electrode, the phosphor 517 emits light in the discharge display portion 510, and color display is possible.
[0059]
In the present embodiment, the address electrodes 511 and the display electrodes 512 are each formed based on the wiring forming method shown in FIG. 1 using the wiring forming apparatus shown in FIG. Therefore, defects such as disconnection and short circuit of the above-mentioned wirings are unlikely to occur, and it is easy to realize miniaturization and thinning.
[0060]
Next, specific examples of the electronic device of the present invention will be described.
FIG. 7 is a perspective view showing an example of a mobile phone. In FIG. 7, reference numeral 600 denotes a mobile phone body, and reference numeral 601 denotes a liquid crystal display unit including the liquid crystal device shown in FIG.
FIG. 8 is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 8, reference numeral 700 denotes an information processing apparatus, 701 denotes an input unit such as a keyboard, 703 denotes an information processing body, and 702 denotes a liquid crystal display unit including the liquid crystal device shown in FIG.
FIG. 9 is a perspective view showing an example of a wristwatch type electronic apparatus. In FIG. 9, reference numeral 800 denotes a watch body, and reference numeral 801 denotes a liquid crystal display unit including the liquid crystal device shown in FIG.
Since the electronic apparatus shown in FIGS. 7 to 9 includes the liquid crystal device of the above-described embodiment, defects such as disconnection or short-circuiting of wirings hardly occur, and the size and thickness can be reduced.
In addition, although the electronic device of this embodiment shall be provided with a liquid crystal device, it can also be set as the electronic device provided with other electro-optical devices, such as an organic electroluminescent display apparatus and a plasma type display apparatus.
[0061]
Next, an embodiment of the contactless card medium of the present invention will be described.
FIG. 10 shows a non-contact type card medium according to the present embodiment. The non-contact type card medium 400 includes a semiconductor integrated circuit chip 408 and an antenna circuit 412 in a casing made up of a card base 402 and a card cover 418. And at least one of power supply and data transmission / reception by at least one of electromagnetic waves or capacitive coupling with an external transceiver (not shown).
[0062]
In this embodiment, the antenna circuit 412 is formed based on the wiring forming method shown in FIG. 1 using the wiring forming apparatus shown in FIG. Therefore, defects such as disconnection and short circuit of the above-mentioned wirings are unlikely to occur, and it is easy to realize miniaturization and thinning.
[0063]
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the spirit of the present invention.
[0064]
【The invention's effect】
According to the film pattern forming method and the film pattern forming apparatus of the present invention, the step of disposing droplets made of a liquid material on a substrate at regular intervals is repeated while shifting the position at which the droplet disposition starts. As a result, the film pattern can be made thicker, and a film pattern that is less likely to cause problems such as disconnection and short circuit when formed into a conductive film can be formed.
[0065]
According to the conductive film wiring of the present invention, the film thickness is thick, which is advantageous for electric conduction, and troubles such as disconnection and short circuit are less likely to occur.
[0066]
According to the electro-optical device of the present invention, problems such as disconnection and short circuit are hardly caused, and the quality can be improved.
[0067]
According to the electronic device and the non-contact type card medium of the present invention, defects such as disconnection or short circuit of the wiring part or the antenna are hardly generated, and the quality can be improved.
[Brief description of the drawings]
FIG. 1 shows an embodiment of a film pattern forming method of the present invention, and shows an example of a procedure for forming a linear conductive film pattern on a substrate.
FIG. 2 shows an example of a film pattern formed on a substrate.
FIG. 3 shows another example of a film pattern formed on a substrate.
FIG. 4 shows an embodiment of the film forming apparatus of the present invention, and shows a schematic perspective view of the wiring forming apparatus.
FIG. 5 is a plan view showing an example in which the electro-optical device of the invention is applied to a liquid crystal device.
FIG. 6 is an exploded perspective view showing an example in which the electro-optical device of the invention is applied to a plasma display device.
7 is a diagram illustrating an example in which the electronic apparatus of the invention is applied to a mobile phone including a liquid crystal display device.
FIG. 8 is a diagram showing an example in which the electronic apparatus of the present invention is applied to a portable upper processing apparatus including a liquid crystal display device.
FIG. 9 is a diagram showing an example in which the electronic apparatus of the present invention is applied to a wristwatch type electronic apparatus equipped with a liquid crystal display device.
FIG. 10 is an exploded perspective view showing an embodiment of a contactless card medium of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Liquid discharge head (discharge means), 11 ... Board | substrate, 30 ... Nozzle, 100 ... Film pattern formation apparatus, Ln ... Droplet, S ... Shift amount, P ... Pitch.

Claims (9)

A method of forming a plurality of film patterns on a substrate by discharging liquid material as droplets from a discharge means in which a plurality of nozzles are arranged in a line,
A first step of disposing a plurality of droplets ejected from the ejection means on the substrate at a certain distance in a direction orthogonal to an arrangement direction of the plurality of nozzles;
The position where the droplet placement is started is shifted by a predetermined distance in the arrangement direction of the plurality of nozzles, and the droplet is placed so that the droplet overlaps a part of the droplet placed in the first step. And a second step of arranging the droplets so as to fill the gaps arranged in the first step, and forming a plurality of continuous patterns in the arrangement direction in which the plurality of nozzles are arranged, and
The first step and the second step are repeated, and the droplets are arranged on the droplets arranged in the first step and the second step to form a plurality of film patterns. And a film pattern forming method comprising: three steps.   The film pattern forming method according to claim 1, wherein a drying process is performed after the first step.   3. The film pattern forming method according to claim 1, wherein a drying process is performed after the second step.   The surface of the substrate is processed to be liquid repellent with respect to the liquid material before disposing the droplets on the substrate. Method for forming a film pattern. An apparatus for forming a film pattern on a substrate by discharging liquid material as droplets from a discharge means,
5. A film pattern forming apparatus, wherein a film pattern is formed by the film pattern forming method according to claim 1.   A conductive film wiring formed by the film pattern forming apparatus according to claim 5.   An electro-optical device comprising the conductive film wiring according to claim 6.   An electronic apparatus comprising the electro-optical device according to claim 7.   A non-contact card medium comprising the conductive film wiring according to claim 8 as an antenna circuit.

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