JP2004337857A - Application method and apparatus for adhesive - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an application method and apparatus for adhesive for enhancing productivity of an electronic circuit substrate in various respects without making the apparatus large-sized. <P>SOLUTION: Adhesive is automatically applied, with the use of B control means 33, to a required position on the object 1 to be coated by means of coating heads 7, 8 capable of selecting a plurality of coating diameters in accordance with a prescribed program stored in a memory means 31. In such a case, from the program, dimensional information of a component to be mounted on the coating position is obtained by utilizing the adhesive to be applied, the coating diameter is determined by the dimensional information and, by applying the adhesive in coating diameters required on all such occasions. Thus, the productivity of the electronic circuit substrate is enhanced in various respects without making the apparatus large-sized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method and an apparatus for applying an adhesive for applying an adhesive to a required position of an object to be applied, for example, applying an adhesive to a position for mounting an electronic component of a circuit board, and then mounting the electronic component. It is used to manufacture electronic circuit boards by fixing components to mounting positions.

  The present applicant has previously proposed an apparatus as shown in FIG. 8 for applying an adhesive to a position where an electronic component of a circuit board is mounted as described above (for example, see Patent Document 1). . This device is located in the middle of the transport path b of the circuit board a, that is, the apparatus. A table e capable of receiving a circuit board a conveyed disposed between the loading section c and the unloading section d and moving in a direction perpendicular to the carrying direction; and a table e perpendicular to the carrying direction. A table positioning means f for positioning by moving in the direction, a coating head g which is arranged corresponding to the table e and can apply an adhesive to a required position of the circuit board a on the table e and can move in the transport direction; And a head positioning means h for moving and positioning the coating head g in the transport direction.

  The application positions of the adhesive on the circuit board a are scattered at various positions on the horizontal plane. Therefore, in order to be able to apply the adhesive to any position, it is necessary to relatively move the table e and the application head g in the XY2 directions orthogonal to each other on the horizontal plane.

The apparatus shown in FIG. 8 satisfies the above conditions by moving the table e in a direction perpendicular to the carrying direction and by moving the coating head g in the carrying direction. Therefore, it is possible to avoid a large device that moves in a range four times the area of the circuit board a, such as a device in which only the table e moves in the XY2 direction and a device in which only the coating head g moves in the XY2 direction. Can be.
JP-A-6-154684

  However, from a series of operations for applying the adhesive to the circuit board a using such an apparatus, the production efficiency of the electronic circuit board has not yet been sufficiently increased, and recently, the production efficiency of the electronic circuit board manufacturing line has not been improved. Can not meet the demand for high speed.

  First, there are limits to the moving speed of the table e and the coating head g, the speed of the coating operation in the positioning state corresponding to each bonding position, and the like. Therefore, the production efficiency of the electronic circuit board is poor due to the performance of the coating apparatus itself.

  In order to satisfy this, it has already been performed to arrange two coating devices side by side in the transport direction in the middle of the transport path b, and simultaneously apply the adhesive to the two circuit boards a using the respective coating devices. ing. However, in this case, the length of the circuit board a in the conveyance direction occupied by the coating apparatus on the production line is twice as long as that of a single apparatus, so that a plane space is increased and manufacturing is performed except for providing a bypass passage such as an overpass. Since a person cannot cross the line, it is inconvenient for various operations such as maintenance and management of each part of the manufacturing line and management and replenishment of circuit boards a, adhesives, parts and the like required for each part of the manufacturing line.

  Therefore, as shown in FIG. 9, there is provided a table e capable of receiving and positioning two circuit boards a conveyed in the middle of the conveying path b in the conveying direction in close proximity to each other. The two coating heads g corresponding to the respective mounted circuit boards a are integrally connected so that they can be moved and positioned in common, and the adhesive is simultaneously applied to both of the circuit boards a of the table e by the respective coating heads g. Therefore, it is possible to reduce the length in the transport direction occupying the production line as compared with the case where two coating apparatuses are arranged side by side, as compared with the case where the coating apparatuses are arranged side by side.

  However, in such an apparatus, each of the two circuit boards a to be received on one table e cannot be freely positioned, and each of the coating heads g cannot move freely due to connection with each other. It is difficult to accurately position each circuit board a and each coating head g corresponding thereto. Therefore, it is difficult to apply the adhesive with high accuracy, and the adhesive is applied to the electrodes for making electrical connection with the electronic components mounted on the circuit board a, which results in poor connection, such as poor connection. Cause.

  Further, in the conventional adhesive coating apparatus shown in FIG. 8, referring to FIG. 1 showing an embodiment of the present invention, a trial coating in which a tape is subjected to trial coating by a coating head in the vicinity of a table on a conveyance path is performed. An auxiliary tool 41 is provided. The test application assisting tool 41 provides the test application by the application head while updating the tape portion on the backup material 43 by winding the mounted roll tape 42 onto the take-up reel 44 via the backup material 43. The application head, for example, by this trial application, prevents the adhesive from drying out at the nozzle tip when the applicator is not in use, so that the required adhesion is always successfully achieved. Therefore, the roll tape 42 is a consumable item. When the roll tape 42 is completely consumed, the application device is stopped as the tape has run out, and the roll tape 42 is supplied.

  By the way, conventionally, the test coating aid 41 is provided with a use position where the backup material 43 is at the same height as the circuit board transfer level, and a retreat position which does not hinder the transfer of the circuit board below the circuit board transfer level. The time required for the transfer of the circuit board can be adjusted in a timely manner so that the coating of the coating head can be performed without interrupting the transfer of the circuit board.

  However, if the test applicator 41 is merely moved up to the level for transporting the circuit board, the transport mechanism for the circuit board and the like hinders the replacement of the roll tape 42. For this reason, a long time is required for the replacement operation, which affects the operation rate of the entire electronic circuit board production line, which is a cause that the production efficiency of the electronic circuit board cannot be increased.

  Further, an optimum application diameter of the adhesive is selected and set according to the type, particularly the size, of the electronic component to be mounted. In order to apply the conventional adhesive, various application parameters of the adhesive on a setting screen as shown in FIG. 10A are manually input to set conditions in an application program, and necessary work is performed. As for the selection of the coating diameter, as shown in FIG. 10B, the planar length L and the width B of the electronic component m to be mounted and the nozzle having the coating diameter corresponding thereto are selected one by one. And input settings.

  Such work is complicated, and in addition to having to deal with the field, a lot of time is required for data setting in producing various electronic circuit boards, which also causes a reduction in the manufacturing efficiency of electronic circuit boards. Has become.

  The coating head g is equipped with three coating nozzles i, j, and k having a large diameter L, a small diameter S, and a very small diameter VS, as shown in FIG. These application nozzles i, j, and k are selectively used in accordance with the setting corresponding to the difference in the dimensions of the electronic component m mounted at each application position. Each of the application nozzles i, j, and k is connected to its own adhesive tank to form an individual application tool, and when the adhesive in the tank runs out, the application device stops as the adhesive runs out. The stopped application device can resume the application operation by supplying the adhesive.

  The replenishment timing of the adhesive for each of the application nozzles i, j, and k differs depending on the difference in the consumption amount of the adhesive per unit time due to the application frequency, the application amount, and the like.

  The application device frequently stops when the replenishment timing is different. Therefore, the production efficiency of the electronic circuit board is greatly reduced. Therefore, if there is an application nozzle that consumes approximately twice the amount of the adhesive compared to the others, the two application heads g are equipped with these nozzles, and the adhesive replenishment timing can be changed by using another application nozzle. And the frequent stopping of the coating device can be prevented. FIG. 8 shows a state in which one application nozzle i having an application diameter L and two application nozzles j and k having an application diameter S are provided.

  However, if the application nozzle corresponding to the size of the electronic component is selected and set in accordance with each setting item on the setting screen as described above, which of the two application nozzles j and k having the same application diameter should be used. You cannot make a choice. In order to select and set these, further application parameters are required, and both the program and the setting operation become more complicated, so that the production efficiency of the electronic circuit board is further reduced.

  An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a method and an apparatus for applying an adhesive which can improve the production efficiency of electronic circuit boards in various aspects without increasing the size of the apparatus. It is.

In the method for applying an adhesive according to the present invention, the adhesive is automatically applied to a required position on an application object by a coating head capable of selecting a plurality of application diameters according to a predetermined program. Dimension information of the component mounted at the application position is obtained using an adhesive that is applied, the application diameter is determined based on this dimensional information, and the adhesive is applied at the required application diameter each time. ,
The adhesive application device that realizes this is a table that can be placed in the middle of the conveyance path of the application object and that can receive the application object that is conveyed, and a coating device that is arranged corresponding to this table and A coating head capable of selecting a plurality of coating diameters to apply an adhesive to a required position of an object, and a table and a coating head are relatively moved so that the coating head faces a required position of the coating object on the table. Utilizing the positioning means for positioning at each position, the positions on the object to which the adhesive is to be applied, the number of adhesives to be applied to each position, the ascending speed of the application head, and the adhesive applied to each of the positions Storage means for storing an operation program including dimensions of each component mounted at the application position, and applying an adhesive to a required position on the application object in accordance with the program stored in the storage means. Next, first control means for controlling the operation of the positioning means and the coating head so as to perform coating, and coating when the coating head applies the adhesive to each position in accordance with the information on the component dimensions of the program stored in the storage means. And a second control means for controlling the diameter, further, the coating head has a plurality of coating tools having different coating diameters, these are selectively used,
In any of these inventions, the application of the adhesive by the application head to the required position on the application object is automatically performed according to a predetermined program, and at the same time, the parts corresponding to the application position in the program are applied. No special setting operation for selecting the application diameter is required because the application information is automatically selected by selecting the application diameter of the multiple adhesives of the application head based on the dimensional information. Thus, the work efficiency for setting new application conditions corresponding to the application object is improved. Therefore, even in these inventions, it is possible to sufficiently respond to the demand for high speed in the production line of the electronic circuit board without increasing the size of the apparatus.

  According to the present invention, the application diameter of a plurality of adhesives possessed by an application head is automatically selected based on dimensional information of a part corresponding to an application position in a program for automatically applying an adhesive. Since the coating is performed, no special setting operation for selecting the coating diameter is required, the work efficiency for setting new coating conditions corresponding to the coating object is improved, and the electronic circuit board It is possible to sufficiently respond to the demand for high speed in the production line without increasing the size of the apparatus.

  Hereinafter, an embodiment of a method and an apparatus for applying an adhesive according to the present invention will be described with reference to FIGS.

  The adhesive applying apparatus according to the present embodiment is used for manufacturing an electronic circuit board by mounting electronic components on the circuit board, and FIG. 1 shows a schematic configuration thereof. As shown in FIG. 1, this coating apparatus is disposed in the vicinity of a transport path 2 of a circuit board 1 as an example of an object to be coated according to the present invention in a transport direction shown by an arrow, and receives a transported circuit board. A plurality of tables 3 and 4 which can be mounted and individually moved in a direction perpendicular to the carrying direction, and a plurality of table positioning means 5 for moving each of the tables 3 and 4 in a direction perpendicular to the carrying direction and individually positioning the tables 3 and 4 , 6 and a plurality of coating heads 7 arranged corresponding to the tables 3 and 4 so that the adhesive can be applied to required positions of the circuit board 1 on the corresponding tables 3 and 4 and can be individually moved in the transport direction. , 8 and a plurality of head positioning means 9, 10 for moving each of the coating heads 7, 8 in the transport direction and individually positioning them. The object to be applied is not limited to the circuit board 1, but may be applied to an object requiring an adhesive as required.

  In this embodiment, using such a device, the circuit boards 1 conveyed on the plurality of tables 3 and 4 arranged in the vicinity of the circuit board 1 in the conveying direction are respectively received, and each circuit board 1 is received. 1 is individually positioned by movement of the tables 3 and 4 by the table positioning means 5 and 6 in a direction perpendicular to the transport direction, and the individual coating heads 7 and 8 corresponding to the tables 3 and 4 are positioned by the head positioning means 9. , Are individually positioned by moving them in the transport direction, and the adhesive is individually applied to the required positions of the circuit boards 1 on the positioned tables 3 and 4 by the positioned application heads 7 and 8 respectively. .

  As a result, a plurality of tables 3 and 4 arranged close to each other in the transport direction in the transport path 2 of the circuit board 1 and a plurality of coating heads 7 and 8 arranged corresponding to these tables are used. Since the tables 3 and 4 move in the direction perpendicular to the transport direction to position the circuit boards 1 to be respectively received, the plurality of tables 3 and 4 have a length in the transport direction that is longer than the proximity of the transport path 2. The coating heads 7 and 8 each have a length in the transport direction substantially equal to that of each of the tables 3 and 4 and move in the transport direction for positioning. 12 does not need to be longer than the length in the transport direction necessary for the arrangement of the tables 3 and 4, so that the size of the apparatus used is not increased. And each coating head 7 8 are individually positioned by independent movements that do not affect each other with adjacent ones, so that each of the circuit boards 1 on each of the tables 3 and 4 that are moved and positioned individually in a direction perpendicular to the transport direction. The corresponding application heads 7 and 8 are also accurately positioned at the positions, and the adhesive is applied to the plurality of circuit boards 1 in parallel, so that sufficient application accuracy can be ensured, thereby improving work efficiency. Therefore, it is possible to sufficiently respond to the demand for high speed in the circuit board production line without increasing the size of the apparatus.

  Although not shown, each of the tables 3 and 4 has a mechanism for receiving the circuit board 1 from the loading section 11 at a predetermined position, receiving and holding the circuit board 1, and sending the circuit board 1 to the unloading section 12 after the adhesive application operation. However, since it is different from the well-known one in the related art, the detailed description is omitted.

  Each of the table positioning means 5 and 6 and each of the head positioning means 9 and 10 are provided with servomotors 17 to 17 provided at one end of guide rails 13 to 16 for guiding the tables 3 and 4 and the coating heads 7 and 8. A screw shaft (not shown) is positioned at a predetermined position by rotationally driving the screw shaft (not shown) based on detected position information from position detecting means such as an encoder (not shown) that is linked to the screw shaft. Since such a mechanism is well known in the related art, a detailed description thereof will be omitted.

  The coating heads 7 and 8 of the present embodiment are equipped with a plurality of coating nozzles 21, 22, and 23 and a recognition camera 24, respectively. Each of the application nozzles 21 to 23 is connected to a unique tank (not shown) to form individual application tools 25 to 27. The application device is stopped as the adhesive runs out every time the adhesive in the tank runs out, and the supply of the adhesive is stopped. Is supposed to do it. This is also well known in the related art, and a detailed description thereof will be omitted. The recognition camera 24 utilizes the fact that the condition of the surface of the circuit board 1 is recognized and the coating conditions are automatically adjusted. The number of application nozzles provided in each of the application heads 7 and 8 may be one, two, or more than three, and is determined as necessary. The plurality of application nozzles 21 to 23 and the like basically have different application diameters. However, the application frequency of the application diameter, which is an integer multiple of the frequency of use, is equipped with a multiple of that number and used properly. It is possible to avoid such a problem that the application device is frequently stopped due to the irregular replenishment timing. In the coating apparatus of the present embodiment, the coating nozzle 21 provided in each of the coating heads 3 and 4 has a large diameter L, and the coating nozzles 22 and 23 each have a small diameter S.

  The application of the adhesive to the required position on the circuit board 1 by the application heads 7 and 8, which can select a plurality of application diameters, is automatically performed according to a predetermined program. For this purpose, the apparatus of the present embodiment utilizes a control device using a microcomputer 28 as shown in FIG. Of course, other types of control devices may be used. The microcomputer 28 controls the internal storage means 31 at each position on the circuit board 1 where the adhesive is to be applied, the number of adhesives to be applied to each position, the ascending speed of the application heads 7 and 8, and An operation program including dimensions and the like of each component mounted at the application position is stored using an adhesive. Such setting of the program and data can be performed not only by inputting to the internal storage means 31 by an input operation from the operation panel 36 but also by various connections of external storage means such as a flexible sheet, a compact disk, or another control device. I can do it. Of course, other suitable techniques can be used.

  The microcomputer 28 is also connected to the recognition camera 24. The microcomputer 28 is also connected to various kinds of abnormal signals, the adhesive running out at the application tools 25 to 27, and the test application aid 41 shown in FIG. A signal such as a tape break and other various signals are input. The input of the abnormal signal, the signal of the adhesive running out and the signal of the tape running out is treated as a stop signal of the coating apparatus.

  The microcomputer 28 controls the servomotors 17 to 20 of the table positioning means 5 and 6 and the head positioning means 9 and 10 by an internal A control means 32 which is an example of a first control means for the above control. An electromagnetic valve 47 that controls expansion and contraction of an air cylinder 46 as shown in FIG. The microcomputer 28 also controls the operation of a mechanism for moving the application nozzles 21 to 23 up and down in order to apply the adhesive using predetermined application nozzles 21 to 23 provided in the positioned application heads 7 and 8. In this case, too, the solenoid valve may be controlled by using an air cylinder. Each of the coating heads 7 and 8 is also positioned whenever necessary at a position facing the test coating aid 41 for the test coating, and performs the test coating on the tape 42 attached thereto. Do. The take-up of the roll tape 42 may be performed by providing a dedicated motor and controlling the operation of the microcomputer 28. However, the trial coating is performed by using the operation of the coating heads 7 and 8 to perform the trial coating. It is also possible to use a mechanism that is fed out by a predetermined amount each time.

  As shown in FIGS. 2 and 3, the test applicator 41 is moved to a standby position lower than the transport level LV of the circuit board 1 shown in FIGS. 2A and 3A by an appropriate guide mechanism 51. 2 (c) and 3 (c), the circuit board 1 is supported and guided so as to be able to move to and from an exchange position protruding above the transport level LV of the circuit board 1. As the guide structure of the guide mechanism 51, various known structures can be adopted. The test applicator 41 has a cylinder 52 connected to a substrate 52 and an air cylinder 46, and has the standby position and the same height as the transfer level LV of the circuit board 1 shown in FIGS. 2 (b) and 3 (b). It can be raised and lowered between different use positions. In the connection between the cylinder rod 47 and the substrate 52, a play S is provided between a lower positioning nut 53 and an upper positioning nut 54 provided at two positions above and below the distal end of the cylinder rod 47. By actuating a spring 55 between the base 52 and the base 52, the board 52 is normally moved up and down between the standby position and the use position in accordance with expansion and contraction of the air cylinder 46 in a state where the board 52 is positioned at the position of the lower positioning nut 52. When a hand (not shown) provided on the substrate 52 or an appropriate portion of the test applicator 41 is hooked or grasped and pulled upward, the test applicator 41 is compressed while using the play S to compress the spring 55. It can be raised to the exchange position. However, a motor or another actuator can be used as a driving means instead of the air cylinder 46, and the movement to the replacement position can be automatically performed by these driving means. In this case, the control may be performed so that the trial application aid 41 is raised to the replacement position in addition to the control for stopping the application device in response to the tape break signal.

  The trial application aid 41 is moved by the air cylinder 46 in a timely manner between the use position as described above and the standby position below the transport level LV of the circuit board 1, so that it does not hinder the transport of the circuit board 1. The coating aid 41 is moved above the object transport level LV of the circuit board 1 while being automatically used for the test coating at the timing, so that the roll tape can be transferred without disturbing the transport mechanism of the circuit board 1 or the like. The work efficiency can be improved because the 42 can be replaced easily and in a short time. Even if the roll tape 42 is replaced while still being hooked on the backup material 43 as shown in FIG. 2C and FIG. 3C, as shown by a virtual line in FIG. Since the roll tape 42 can be easily removed from the backup material 43 to the side by hand, the roll tape 42 can be easily replaced.

  Therefore, also in the present invention, it is possible to sufficiently respond to the demand for high speed in the production line of the electronic circuit board without increasing the size of the apparatus. Such a feature can be similarly exerted on other various devices such as the above-described conventional device which does not adopt the positioning type and the coating type as shown in FIG. The configuration also belongs to the category of the present invention.

  Further, in the present embodiment, in order to selectively use the application nozzles 21 and the application nozzles 22 and 23 having different application diameters provided in the application heads 7 and 8, a program stored in the storage unit 31 is used. The B control means 33 inside the microcomputer 28, which is an example of the second control means, obtains the dimensional information of the component mounted at the application position by using the adhesive to be applied, and obtains the dimensional information based on the dimensional information. The application diameter is determined, and data is set in the program so that the adhesive is applied at the required application diameter each time.

  As described above, the application of the adhesive is performed by automatically selecting the application diameters of the plurality of adhesives of the application heads 7 and 8 based on the dimensional information of the component corresponding to the application position in the program. This eliminates the need for a special setting operation for selecting the application diameter, and improves the work efficiency for setting new application conditions corresponding to the application target. Therefore, also in these inventions, it is possible to sufficiently respond to the demand for high speed in the circuit board production line without increasing the size of the apparatus. Such a feature can be similarly exerted on other various devices such as the above-described conventional device which does not adopt the positioning type and the coating type as shown in FIG. 1 of the present embodiment, and a combination with these devices. The configuration also belongs to the category of the present invention. A plurality of application diameters can also be obtained by adjusting the application diameter in one application tool. In this case, only one applicator may be used, and the operation of selecting the application diameter only replaces the operation of adjusting the application diameter with one applicator, and there is no essential change.

  Further, in the present embodiment, the B control means 33 applies the adhesive on the circuit board 1 included in the program by using the plurality of applicators 22 and 23 having the same application diameter as described above. From the information on each position to be applied, the number of adhesives to be applied to each position, and the application diameter determined corresponding to the electronic component mounted using the adhesive applied at each position, the same application diameter Obtaining the necessary total number of times of use of the plurality of applicators 26 and 27 having a specific unit in a specific unit, and dividing the total number of uses by the number of applicators 26 and 27 having the same diameter, for example, inside the microcomputer 28 Data is set in the program so that a plurality of applicators 26 and 27 having the same diameter are sequentially switched and used each time the number of division application times is reached by using arithmetic means 34 as a function. That.

  By doing so, for example, the number of application times for one or an appropriate number of circuit boards 1 with the same application diameter or the number of application times for one circuit board 1 with the same application diameter is divided into a predetermined number. Within the range of various specific units called the number of times of application, the number of times of use of each of the plurality of applicators 26 and 27 having the same diameter becomes equal. However, the replenishment timings of the respective adhesives including the other ones are substantially the same, and the fact that the replenishment timings of the adhesives in the respective applicators 25 to 27 are different from each other and the workability is reduced is considered to be the same application diameter. Can be avoided without a special setting operation for properly using the plurality of applicators 25 to 27, and it is also possible to prevent extra time from being taken for the special setting operation and a decrease in workability. it can. Therefore, even in these inventions, it is possible to sufficiently respond to a demand for high speed in a production line of an electronic circuit board without increasing the size of the apparatus. Such a feature can be similarly exhibited in other various devices such as the above-described conventional device which does not adopt the positioning type and the coating type as shown in FIG. 1 of the present embodiment, and a combination configuration thereof. Also belong to the category of the present invention.

  FIGS. 5 to 7 are flowcharts showing specific examples of the operation control using the microcomputer 28.

  FIG. 5 is a main routine showing main operation control, and various initial settings are performed when the power is turned on. Then, after various input / output processing is performed, based on various data settings by the input / output processing, if the mode is a mode in which there are a plurality of application nozzles having the same application diameter, the data setting for uniformly using them as described above. The same kind of nozzle processing. Subsequently, according to the set various application conditions, the application operation by the application heads 7 and 8 is performed. Next, after performing operation control and other necessary control of the test application aid 41, stop processing is performed when there is a stop signal or an abnormal signal, and if there is no such signal, control after input / output processing is repeated. .

  FIG. 6 shows a specific example of the same type nozzle processing subroutine of FIG. 5, in which processing is performed only for a plurality of application nozzles having the same application diameter. According to this embodiment, a line in which a plurality of S application nozzles are set will be described as an example. When it is confirmed that a plurality of S application nozzles are set, the application program is simulated and set in the program. Obtain the required total number of times of use of a plurality of applicators having the same application diameter in a specific unit from the information provided, and divide this total number of uses by the number of applicators having the same application diameter and application nose. Is performed, the number of times of division application is set as the number of continuous uses Sn for one applicator, the flag S having a plurality of applicators having the same application diameter S is set to 1, and the routine returns. If not, the number Sn is cleared and the flag S is reset to 0. The same applies to the coating diameters L and VS, and a detailed description thereof will be omitted.

  FIG. This is an L application operation processing subroutine, in which a required application diameter is set on a program each time, and the processing is performed according to the set application diameter L or S or VS line. Here, assuming that the application diameter S has been set, only control of the S line will be described.

  First, it is determined whether or not the flag S is present. If the flag S is 0, there is no corresponding application nozzle, so the application nozzle S is specified and the application operation is performed as usual.

If the flag S is 1 and there are a plurality of applicable nozzles, the number of nozzles SN is determined.
Next, in order to sequentially specify the addresses assigned in advance from the first address for a plurality of nozzles, the address SN- (SN-1) is specified, and the first coating is performed. Each time the first application nozzle is used, the counters C and D are incremented by 1, and the use of the first application nozzle is repeated until the count of the counter A becomes equal to the previously set continuous use number Sn. . When they are equal to each other, the nozzle designation is performed by incrementing the application nozzle designation address by one, the count of the counter C is cleared, and the application by the second application nozzle is performed in the same manner. When the count of the counter D becomes equal to SN, it means that the use of all of the plurality of application nozzles has been completed, so the counter D is cleared and the process returns. Thus, the use of the plurality of application nozzles is reused from the first. The same applies to application nozzles of other application diameters, and a specific description is omitted.

  However, the specific control is not limited to those having such contents, and can be achieved by various programs.

  INDUSTRIAL APPLICABILITY The present invention can be used for automatic application of an adhesive, and contributes to speeding up and miniaturization of a production line.

It is a perspective view showing the schematic structure of the application device of the adhesive as one embodiment of the present invention. FIG. 2 is an explanatory view showing an operation state of a test application aid of the apparatus of FIG. 1. FIG. 2 is an explanatory view showing a support structure and an operation state of a test application aid of the apparatus of FIG. 1. FIG. 2 is a block diagram of a control circuit of the device in FIG. 1. 3 is a flowchart of a main routine showing main operation control of the control circuit of FIG. 1. 6 is a flowchart of a nozzle subroutine of the same kind shown in FIG. 5. R. of FIG. It is a flowchart of a subroutine of L application operation processing. It is a schematic structure figure showing the conventional application device of the adhesive. FIG. 9 is a schematic block diagram showing a possible improvement of the device of FIG. 8. FIG. 9 is an explanatory diagram showing an example of data setting for applying an adhesive in the apparatus of FIG. 8.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Conveying path 3, 4 Table 5, 6 Table positioning means 7, 8 Coating head 9, 10 Head positioning means 21-23 Coating nozzle 25-27 Coating tool 28 Microcomputer 31 Storage means 32 A control means 33 B control Means 34 Calculation means 41 Trial application aid 42 Roll tape 46 Air cylinder 47 Cylinder rod 51 Guide mechanism LV Circuit board transport level S Play

Claims (3)

Adhesive is automatically applied according to a predetermined program by a coating head capable of selecting a plurality of application diameters at a required position on an application target, and the application position is determined using the adhesive applied from the program. A method for applying an adhesive, comprising obtaining dimensional information of a component mounted on a device, determining an application diameter based on the dimensional information, and applying an adhesive at a required application diameter each time. A table that can receive an application object that is placed and conveyed in the middle of the conveyance path of the application object, and a plurality of application diameters that are arranged corresponding to the table and are provided at necessary positions of the application object on the table. A coating head that can select and apply an adhesive; a positioning unit that relatively moves the table and the coating head to position the coating head at a required position of the coating target on the table; Of each part to which the adhesive is to be applied, the number of the adhesive to be applied to each of the positions, the application head lifting speed, and the use of the adhesive to be applied to each of the above-described positions, for each component mounted at the application position. Storage means for storing an operation program including dimensions; positioning means and a positioning means for sequentially applying an adhesive to a required position on an application object in accordance with the program stored in the storage means; First control means for controlling the operation of the application head, and second control means for controlling the application diameter when the application head applies the adhesive to each position in accordance with the information on the component dimensions of the program stored in the storage means And a coating device for applying an adhesive. 3. The adhesive coating apparatus according to claim 2, wherein the coating head has a plurality of coating tools having different coating diameters, and these are selectively used.

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