JP2004320561A - Passive component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a passive component small in itself while the packaging area of a module including the passive component is reduced and at the same time the size is reduced. <P>SOLUTION: The conversion unit 24 of a passive component 10 includes a first line path 28 having one end connected to an output stage of a filter through a capacity Ca, a second line path 30 having one end connected to one balanced output terminal 36a, whereas a first coupling line path 20 is constituted by this second line path 30 and the first line path 28; and a third line path 32 having one end to connected to the other balanced output terminal 36b, whereas a second coupling two line path 22 is constituted by this third line path 32 and the first line path 28. The other end of the first line path 28 is grounded through a capacity Cb. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a passive component having an unbalanced-balanced conversion unit that converts unbalanced input / output into balanced input / output.
[0002]
[Prior art]
Recently, high integration of semiconductor components such as ICs has been progressing, and miniaturization of the semiconductor components themselves has also rapidly progressed. Along with this, passive components such as filters used around semiconductor components have also been reduced in size. In addition, a laminated dielectric filter using a dielectric substrate is effective for reducing the size of passive components (for example, see Patent Documents 1 and 2).
[0003]
[Patent Document 1]
JP 2002-280805 A (FIGS. 1 and 9)
[Patent Document 2]
JP-A-2002-261463 (FIG. 1, paragraph [0021])
[0004]
[Problems to be solved by the invention]
In general, when passive components such as filters are used in a microwave band of several hundred MHz to several GHz, for example, passive components that input and output signals in an unbalanced manner using a ground potential as a reference potential may be used. I have to.
[0005]
Therefore, a balun (unbalanced-balanced converter) must be used to connect a semiconductor component such as an IC circuit of a balanced input method to the passive component, which limits the miniaturization.
[0006]
Therefore, a method of integrally forming the filter unit and the unbalanced-balanced conversion unit in the dielectric substrate is conceivable. However, in order to form the unbalanced-balanced conversion unit in the dielectric substrate, a 1/4 wavelength And a half-wavelength line. In this case, there is a limit to miniaturization due to the existence of the half-wavelength line.
[0007]
Further, as a usage form of the passive component, there is a type in which a DC component is separately supplied to a semiconductor component connected to the passive component.
[0008]
Usually, in such a usage form, a dedicated circuit for supplying a DC component between the passive component and the semiconductor component is required. In such a case, if the DC component is supplied to the semiconductor component through the passive component, the size can be reduced. In particular, in the case of a passive component having an unbalanced-balanced conversion unit, a balanced signal in which, for example, a received signal component is superimposed on a DC component is output. In addition, the size of the module including the passive component and the semiconductor component can be reduced.
[0009]
In this case, it is necessary to provide the passive component with a DC terminal for supplying a DC voltage from a DC power supply, but there is a concern that common mode noise may be mixed. Therefore, it is necessary to connect an external capacitor separately to the passive component, and there is a possibility that a reduction in the mounting area and size of the module including the passive component and the semiconductor component may be limited.
[0010]
The present invention has been made in view of such a problem, and can reduce the size of a passive component itself, reduce the mounting area of a module including the passive component, and reduce the size. It is intended to provide a passive component that can be used.
[0011]
[Means for Solving the Problems]
The passive component according to the present invention is a passive component including at least an unbalanced-balanced conversion unit, wherein the unbalanced-balanced conversion unit includes a first line having one end connected to an unbalanced input / output, and the first line. A second coupled two line having one balanced input / output connected to one end thereof, and a second coupled two line together with the first line, and One end has a third line to which the other balanced input / output is connected, and the other end of the first line is grounded via a capacitor.
[0012]
Normally, when configuring an unbalanced-balanced conversion unit, an unbalanced input / output is connected to one end of a half-wavelength line (a line corresponding to the first line of the present invention), and the other end is opened. However, in the present invention, since the other end of the first line is grounded via the capacitor, the line length of the first line can be reduced. That is, it can be shortened to 以下 wavelength or less. As a result, miniaturization of the passive component itself can be further promoted.
[0013]
In the configuration, the other end of the second line and the other end of the third line may be commonly grounded via a capacitor. In this case, a DC terminal to which a DC voltage from an external power supply is supplied is provided, and the other end of the second line and the other end of the third line are commonly connected to the DC terminal, and are connected through the capacitor. You may make it ground. Accordingly, the capacitance connected between the other end of the second line and the other end of the third line and GND (ground) functions as a capacitance for suppressing the common mode noise, and thus suppresses the common mode noise. It is not necessary to connect a target external capacitor, and it is possible to promote the miniaturization of a module including a passive component and an external circuit (semiconductor component or the like) to which the passive component is connected.
[0014]
An output stage of a non-balanced input / output type filter unit having one or more resonators may be connected to one end of the first line.
[0015]
Also, the present invention provides a method for manufacturing a semiconductor device, comprising: a dielectric substrate formed by laminating a plurality of dielectric layers; the first line, the second line, the third line, and one or more inner layer grounds. An electrode and a capacitive electrode that capacitively couples the first line and the inner layer ground electrode may be provided.
[0016]
Thus, an unbalanced-balanced conversion section is formed in the dielectric substrate, and a passive component advantageous for miniaturization can realize a configuration in which the other end of the first line is grounded via a capacitor. In addition, further miniaturization can be achieved.
[0017]
Further, the second line and the third line may be connected in common within the dielectric substrate, and may have a capacitive ground electrode opposed to the inner layer earth electrode with a dielectric layer interposed therebetween. . Thus, it is possible to realize a configuration in which the other end of the second line and the other end of the third line are commonly grounded via the capacitor.
[0018]
Further, the dielectric substrate may have a DC terminal to which a DC voltage from an external power supply is formed on a part of the surface, and the capacitor ground electrode may be connected to the DC terminal. In this case, at least two of the inner-layer ground electrodes may be arranged above and below the capacitive ground electrode. Accordingly, it is possible to realize a configuration in which the other end of the second line and the other end of the third line are commonly connected to the DC terminal and grounded via the capacitor.
[0019]
In the dielectric substrate, a plurality of electrodes constituting a non-balanced input / output type filter unit having one or more resonators, an output stage electrode of the filter unit, and the first line are further formed. A capacitive electrode for capacitively coupling may be formed.
[0020]
Thus, the unbalanced input / output type filter unit having a plurality of resonators and the unbalanced-balanced conversion unit are integrated in the dielectric substrate, so that the size of the passive component can be reduced. .
[0021]
In addition, by integrating, it is not necessary to set the characteristic impedance between the filter unit and the unbalanced-balanced conversion unit to a specific value (for example, 50Ω), and the characteristic impedance between both can be arbitrarily determined. , The degree of freedom of each design can be increased. In addition, since the characteristic impedance between the two can be set low, it is easy to form the filter unit, and the line width of the strip line constituting the unbalanced-balanced conversion unit can be increased. There is an effect that the loss of the part can be reduced.
[0022]
Further, since the filter section is connected to the unbalanced-balanced conversion section via the capacitor electrode, the phase of the unbalanced-balanced conversion section is changed by the capacitor electrode, and unnecessary matching with the filter section is performed. Can be suppressed.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of a passive component according to the present invention will be described below with reference to FIGS.
[0024]
As shown in FIG. 1, the passive component 10 according to the present embodiment includes, for example, an input-side resonator 14 connected to the unbalanced input terminal 12 and an output-side resonator 16 coupled to the input-side resonator. A filter section 18 of an unbalanced input / output type, an unbalanced-balanced conversion section (hereinafter simply referred to as a conversion section) 24 having two coupled two lines 20 and 22, and an output stage of the conversion section 24. And an impedance matching circuit 26.
[0025]
The output stage of the filter unit 18 and the input stage of the conversion unit 24 are connected via a capacitor Ca.
[0026]
The conversion unit 24 has a first line 28, a second line 30, and a third line 32. One end of the first line 28 is connected to the output stage of the filter section 18 via the capacitor Ca, and the other end is grounded via the capacitor Cb. One end of the second line 30 is connected to a DC terminal 34 (a terminal to which a DC voltage is supplied from an external power supply not shown) and grounded via a capacitor Cc, and the other end is connected via an impedance matching circuit 26. It is connected to one balanced output terminal 36a. The third line 32 has one end connected to the DC terminal 34 and grounded via the capacitor Cc, and the other end connected to the other balanced output terminal 36b via the impedance matching circuit 26. That is, in the conversion unit 24, the first coupled two lines 20 are formed by the first line 28 and the second line 30, and the second coupled two lines 22 are formed by the first line 28 and the third line 32. Is formed.
[0027]
The impedance matching circuit 26 has a first inductance component L1 connected between the other end of the second line 30 and one of the balanced output terminals 36a, and is connected between the other end of the second line 30 and GND. A first capacitance component C1, a second inductance component L2 connected between the other end of the third line 32 and the other balanced output terminal 36b, and a second capacitance component L2 connected between the other end of the third line 32 and GND. And a second capacitance component C2 connected to the second capacitor C2.
[0028]
Normally, when the conversion unit 24 is configured, the output stage of the filter unit 18 is connected to one end of a half-wavelength line (a line corresponding to the first line 28 of the present embodiment), and the other end is opened. I do. However, in this embodiment, since the other end of the first line 28 is grounded via the capacitor Cb, the line length of the first line 28 can be reduced to １ ／ wavelength or less. Thereby, the miniaturization of the passive component 10 itself can be further promoted.
[0029]
Further, the other end of the second line 30 and the other end of the third line 32 are commonly connected to the DC terminal 34 and are grounded via the capacitor Cc. Function as a capacity for suppressing the noise. As a result, there is no need to connect an external capacitor for the purpose of suppressing common mode noise, and the module including the passive component 10 and an external circuit (semiconductor component or the like) to which the passive component 10 is connected can be reduced in size. Can be promoted.
[0030]
Also, for example, when the output stage of the filter unit 18 and the input stage of the conversion unit 24 are directly connected, the filter unit 18 and the conversion unit 24 cause unnecessary matching in the attenuation region on the pass characteristic, and do not require unnecessary matching in the attenuation region. A peak will be formed.
[0031]
However, in the present embodiment, since the filter unit 18 is connected to the conversion unit 24 via the capacitor Ca, the phase of the conversion unit 24 is changed by the capacitor Ca, and unnecessary matching with the filter unit 18 is suppressed. can do.
[0032]
Next, a specific example in which the above-described passive component 10 according to the present embodiment is formed on one dielectric substrate 40 will be described with reference to FIGS.
[0033]
As shown in FIG. 2, the passive component 10 according to this specific example includes a dielectric substrate 40 formed by stacking a plurality of dielectric layers (S1 to S14: see FIG. 3) and firing and integrating them.
[0034]
As shown in FIG. 3, the dielectric substrate 40 is configured by stacking first to fourteenth dielectric layers S1 to S14 in order from the top. These first to fourteenth dielectric layers S1 to S14 are composed of one or more layers.
[0035]
The filter section 18 and the conversion section 24 are formed in the dielectric substrate 40. The filter unit 18 has two quarter-wavelength resonators (the input side resonator 14 and the output side resonator 16). The input-side resonator 14 is constituted by an input-side resonance electrode 44 formed on the main surface of the fourth dielectric layer S4, and the output-side resonator 16 is similarly formed on the main surface of the fourth dielectric layer S4. The output-side resonance electrode 46 is formed.
[0036]
Further, on the main surface of the third dielectric layer S3, an inner-layer earth electrode 48 facing the open end of the input-side resonance electrode 44, an inner-layer earth electrode 50 facing the open end of the output-side resonance electrode 46, A coupling adjustment electrode 52 for adjusting the degree of coupling between the side resonator 14 and the output side resonator 16 is formed.
[0037]
The passive component 42 includes inner layer ground electrodes 54, 56 on the main surfaces of the second dielectric layer S2, the sixth dielectric layer S6, the eleventh dielectric layer S11, and the thirteenth dielectric layer S13, respectively. 58 and 60 are formed, and a DC electrode 62 is formed on the main surface of the twelfth dielectric layer S12.
[0038]
As shown in FIG. 2, the passive component 42 is connected to the inner-layer ground electrodes 54, 56, 58, 60, 48, and 50 on a first side surface 40a of the outer peripheral surface of the dielectric substrate 40, respectively. A ground electrode 64 is formed. On the second side surface 40b opposite to the first side surface 40a, one end (short-circuit end) of each of the inner layer ground electrodes 54, 56, 58 and 60, the input side resonance electrode 44 and the output side resonance electrode 46 is provided. An earth electrode 66 to be connected is formed.
[0039]
The unbalanced input terminal 12 and the DC terminal 34 are formed on the third side surface 40c of the dielectric substrate 40. The unbalanced input terminal 12 is electrically connected to the input-side resonance electrode 44 via the lead electrode 68 as shown in FIG. The DC terminal 34 is a terminal to which a DC voltage is applied from an external power supply (not shown), and is electrically connected to the DC electrode 62 via the lead electrode 70.
[0040]
As shown in FIG. 2, balanced output terminals 36a and 36b are formed on a fourth side surface 40d opposite to the third side surface 40c.
[0041]
On the other hand, as shown in FIG. 3, an output capacitance electrode 72 is formed on the main surface of the fifth dielectric layer S5. The output capacitance electrode 72 overlaps the output-side resonance electrode 46 with the fourth dielectric layer S4 interposed therebetween.
[0042]
On the main surface of the seventh dielectric layer S7, an end portion 86 of the first strip line electrode 78 of the conversion section 24, which will be described later, is connected to GND (in this case, formed on the main surface of the sixth dielectric layer S6). A capacitance electrode 74 for capacitive coupling to the inner layer ground electrode 56) is formed. This capacitance electrode 74 is electrically connected to the inner-layer earth electrode 56 through a via hole 76 penetrating through the sixth dielectric layer S6.
[0043]
On the main surface of the eighth dielectric layer S8, a first strip line electrode 78 serving as the first line 28 of the conversion unit 24 is formed, and on the main surface of the ninth dielectric layer S9, the conversion unit 24, a second strip line electrode 80 serving as the second line 30 and a third strip line electrode 82 serving as the third line 32 are formed.
[0044]
The first strip line electrode 78 has one end 84 and the other end 86 adjacent to each other, and is formed substantially spirally or meandering from one end 84 to the other end 86, and has a substantially symmetrical shape.
[0045]
The second strip line electrode 80 has a spiral or meandering shape from the end 88 toward one of the balanced output terminals 36a. The third stripline electrode 82 has a spiral or meandering shape from the end 90 toward the other balanced output terminal 36b. These second and third stripline electrodes 80 and 82 are symmetrically arranged.
[0046]
The second strip line electrode 80 has a first extraction electrode 92 having a meandering shape (substantially L-shaped in the illustrated example) from the middle to one of the balanced output terminals 36a. The third strip line electrode 82 has a second extraction electrode 94 having a meandering shape (substantially L-shaped in the illustrated example) from the middle to the other balanced output terminal 36b.
[0047]
In the main surface of the tenth dielectric layer S10, at a position facing the first extraction electrode 92, a capacitance is connected between the one balanced output terminal 36a and the lower inner layer earth electrode 58. A first capacitance electrode 96 to be formed is formed. Further, a second capacitance electrode 98 connected to the other balanced output terminal 36b and forming a capacitance with the inner-layer ground electrode 58 is formed at a position facing the second extraction electrode 94. .
[0048]
One end 84 of the first strip line electrode 78 is electrically connected to the output capacitor electrode 72 through a via hole 100 penetrating the fifth to seventh dielectric layers S5 to S7. As described above, the other end 86 of the first strip line electrode 78 is connected to GND (in this case, the inner-layer ground electrode 56) via the capacitor electrode 74 formed on the main surface of the seventh dielectric layer S7. Are combined. The inner layer ground electrode 56 has a region for insulating the via hole 100, that is, a region where no electrode film is formed.
[0049]
The end 88 of the second strip line electrode 80 and the end 90 of the third strip line electrode 82 are connected to the DC electrode 62 through via holes 102 and 104 that pass through the ninth to eleventh dielectric layers S9 to S11. It is electrically connected. The inner layer ground electrode 58 is provided with a region for insulating the via holes 102 and 104, that is, a region where no electrode film is formed.
[0050]
As shown in the equivalent circuit of FIG. 1, the passive component 42 according to this specific example has a capacitance electrode 74 formed on the main surface of the seventh dielectric layer S <b> 7 so that the first line 28 of the converter 24 can be formed. The other end is grounded via the capacitor Cb.
[0051]
Further, by connecting the ends 88 and 90 of the second and third stripline electrodes 80 and 82 to the DC electrode 62 via the via holes 102 and 104, respectively, as shown in FIG. And one end of each of the second and third lines 30 and 32 is connected to the DC terminal 34 in common. Furthermore, by disposing the inner-layer ground electrodes 58 and 60 above and below the DC electrode 62, a capacitance Cc is formed between the common end of the second and third lines 30 and 32 and GND.
[0052]
Further, a coupling capacitance Cd connected between the input-side resonator 14 and the output-side resonator 16 is formed by the coupling adjustment electrode 52, and the output-side resonance electrode 46 and the output capacitance electrode 72 form the fourth dielectric layer S4. The capacitance Ca is formed by being opposed to each other.
[0053]
In addition, a first inductance component L1 by the first extraction electrode 92, a first capacitance component C1 by the first capacitance electrode 96, and a second inductance component L1 by the second extraction electrode 94 are provided at the output stage of the conversion unit 24. The impedance matching circuit 26 having the inductance component L2 and the second capacitance component C2 formed by the second capacitance electrode 98 is connected.
[0054]
In the passive component 42 according to the specific example described above, the filter section 18 of the unbalanced input / output type having the input side resonator 14 and the output side resonator 16 in the dielectric substrate 40 and the first to third strips Since the conversion unit 24 having the line electrodes 78, 80, and 82 is integrated, the size of the passive component 42 can be reduced.
[0055]
Also, by integrating, it is not necessary to set the characteristic impedance between the filter unit 18 and the conversion unit 24 to a specific value (for example, 50Ω), and the characteristic impedance between both can be arbitrarily determined. Design flexibility can be increased. In addition, since the characteristic impedance between the two can be set low, the filter section 18 can be easily formed, and the line width of the first to third strip line electrodes 78, 80, and 82 constituting the conversion section 24 can be increased. Therefore, there is an effect that the loss of the conversion unit 24 can be reduced.
[0056]
Further, since the output capacitance electrode 72 is formed so as to face the output-side resonance electrode 46 with the fourth dielectric layer S4 interposed therebetween, the output-side resonator 16 of the filter section 18 and the conversion section 24 are formed. And the input stage can easily form the capacitor Ca. Unnecessary matching can be prevented by the capacitor Ca.
[0057]
If the coupling adjustment electrode 52 is formed in the vicinity of the output capacitance electrode 72, for example, floating coupling may occur, and the above-described unnecessary matching may not be eliminated. However, in this specific example, the coupling adjustment electrode 52 is located at a position distant from the output capacitance electrode 72, and in the example of FIG. 3, the fourth dielectric layer S4 on which the input-side resonance electrode 44 and the output-side resonance electrode 46 are formed. Is formed on the third dielectric layer S3 sandwiched therebetween. As a result, unnecessary matching between the filter unit 18 and the conversion unit 24 is eliminated, and the frequency characteristics are improved. Note that the connection between the unbalanced input terminal 12 and the input-side resonance electrode 44 may be direct connection (tap coupling) by the lead electrode 68 or may be connected via a capacitor.
[0058]
Further, in a specific example, the first strip line electrode 78, the second strip line electrode 80, and the third strip line electrode 82 formed by mutual electromagnetic coupling are symmetrically arranged in a spiral or meandering manner. , The characteristics are balanced in phase and amplitude. As a result, an unbalanced input-balanced output type filter or a balanced input / output type filter having better quality than the unbalanced input / output type filter can be obtained in terms of the attenuation characteristic.
[0059]
The ends 88 and 90 of the second and third stripline electrodes 80 and 82 of the converter 24 are connected to the DC electrode 62 through via holes 102 and 104, respectively. The inner-layer ground electrode 58 and the lower-layer inner-layer ground electrode 60 are arranged to face each other. That is, the capacitor Cc is formed between the DC terminal 34 and GND. Since the capacitance Cc functions as a capacitance for suppressing common mode noise, there is no need to connect an external capacitor for suppressing common mode noise.
[0060]
Further, by arranging the inner-layer ground electrodes 58 and 60 above and below the DC electrode 62, the influence from the outside and the inside can be suppressed, and the isolation characteristics can be improved. Thereby, the characteristics can be made more stable.
[0061]
When adjusting the balance between the phase and the amplitude in the frequency characteristics, the area of the DC electrode 62 is changed, and the ends 88 and 90 of the second and third stripline electrodes 80 and 82 in the converter 24 are connected. The position can be adjusted by moving the positions of the via holes 102 and 104 that electrically connect to the DC electrode 62 in parallel.
[0062]
Further, in this specific example, since the impedance matching circuit 26 is formed in the dielectric substrate 40, when the passive component 42 according to this specific example is connected to, for example, a semiconductor component to form a module, There is no need to separately insert and connect an impedance matching circuit between the passive component 42 and the semiconductor component.
[0063]
As a result, the mounting area of the module including the passive component 42 can be reduced, and a design that does not require high-frequency technology can be performed. Therefore, when the module is configured by connecting to the semiconductor component as described above, it is possible to effectively reduce the size and cost of the module.
[0064]
In the above-described example, the number of the resonators constituting the filter unit 18 is two. However, the number may be one or three or more.
[0065]
In addition, the passive component according to the present invention is not limited to the above-described embodiment, and may adopt various configurations without departing from the gist of the present invention.
[0066]
【The invention's effect】
As described above, according to the passive component of the present invention, it is possible to reduce the size of the passive component itself, to reduce the mounting area of the module including the passive component, and to reduce the size. Can be.
[Brief description of the drawings]
FIG. 1 is an equivalent circuit diagram showing a passive component according to the present embodiment.
FIG. 2 is a perspective view showing a passive component according to a specific example.
FIG. 3 is an exploded perspective view showing a passive component according to a specific example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Passive components 12 ... Unbalanced input / output terminal 14 ... Input side resonator 16 ... Output side resonator 18 ... Filter part 24 ... Conversion part 26 ... Impedance matching circuit 28 ... First line 30 ... Second line 32 ... Third line 34 DC terminal 36a, 36b Balanced output terminal 40 Dielectric substrate 44 Input resonance electrode 46 Output resonance electrode 48, 50, 54, 56, 58, 60 Inner layer earth electrode 62 DC Electrode 72: output capacitance electrode 74: capacitance electrode Ca to Cd: capacitance

Claims (9)

In a passive component having at least an unbalanced-balanced conversion unit,
The unbalanced-balanced conversion unit,
A first line having an unbalanced input / output connected to one end;
A second line that forms a first coupled two line with the first line, and one end of which is connected to one balanced input / output;
A second coupled two lines together with the first line, and a third line having one end connected to the other balanced input / output;
The other end of the first line is grounded via a capacitor. The passive component according to claim 1,
A passive component, wherein the other end of the second line and the other end of the third line are commonly grounded via a capacitor. The passive component according to claim 1,
It has a DC terminal to which a DC voltage from an external power supply is supplied,
The other end of the second line and the other end of the third line are connected to the DC terminal in common and are grounded via the capacitor. The passive component according to any one of claims 1 to 3,
A passive component, wherein an output stage of a non-balanced input / output type filter unit having one or more resonators is connected to one end of the first line. The passive component according to claim 1,
In a dielectric substrate configured by laminating a plurality of dielectric layers,
Said first track;
Said second track;
Said third track;
One or more inner layer earth electrodes;
A passive component, comprising: a capacitive electrode that capacitively couples the first line and the inner-layer ground electrode. The passive component according to claim 5,
In the dielectric substrate,
A passive component, wherein the second line and the third line are commonly connected, and have a capacitive ground electrode facing the inner layer ground electrode with a dielectric layer interposed therebetween. The passive component according to claim 6,
A DC terminal to which a DC voltage from an external power supply is supplied is formed on a part of the surface of the dielectric substrate,
The passive component, wherein the capacitance ground electrode is connected to the DC terminal. The passive component according to claim 6 or 7,
A passive component, wherein at least two of the inner-layer ground electrodes are arranged above and below the capacitive ground electrode. The passive component according to claim 5,
In the dielectric substrate, further,
A plurality of electrodes constituting a non-balanced input / output type filter unit having one or more resonators;
A passive component, comprising: a capacitive electrode that capacitively couples an electrode at an output stage of the filter unit and the first line.

Images