JP2004320002A5 - - Google Patents

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Publication number
JP2004320002A5
JP2004320002A5 JP2004104093A JP2004104093A JP2004320002A5 JP 2004320002 A5 JP2004320002 A5 JP 2004320002A5 JP 2004104093 A JP2004104093 A JP 2004104093A JP 2004104093 A JP2004104093 A JP 2004104093A JP 2004320002 A5 JP2004320002 A5 JP 2004320002A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004104093A
Other languages
Japanese (ja)
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JP2004320002A (ja
JP4587443B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004104093A priority Critical patent/JP4587443B2/ja
Priority claimed from JP2004104093A external-priority patent/JP4587443B2/ja
Publication of JP2004320002A publication Critical patent/JP2004320002A/ja
Publication of JP2004320002A5 publication Critical patent/JP2004320002A5/ja
Application granted granted Critical
Publication of JP4587443B2 publication Critical patent/JP4587443B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004104093A 2003-03-31 2004-03-31 回路基板の製造方法 Expired - Fee Related JP4587443B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004104093A JP4587443B2 (ja) 2003-03-31 2004-03-31 回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003096675 2003-03-31
JP2004104093A JP4587443B2 (ja) 2003-03-31 2004-03-31 回路基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010159718A Division JP2010287899A (ja) 2003-03-31 2010-07-14 回路基板の製造方法および回路基板、液体吐出装置

Publications (3)

Publication Number Publication Date
JP2004320002A JP2004320002A (ja) 2004-11-11
JP2004320002A5 true JP2004320002A5 (cg-RX-API-DMAC10.html) 2007-05-24
JP4587443B2 JP4587443B2 (ja) 2010-11-24

Family

ID=33478740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004104093A Expired - Fee Related JP4587443B2 (ja) 2003-03-31 2004-03-31 回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP4587443B2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6188503B2 (ja) 2013-09-06 2017-08-30 キヤノン株式会社 記録素子基板、その製造方法、記録ヘッド及び記録装置
JP7166776B2 (ja) * 2018-04-04 2022-11-08 キヤノン株式会社 液体吐出ヘッド用基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5787973A (en) * 1980-11-21 1982-06-01 Seiko Epson Corp Thermal head
JP2711091B2 (ja) * 1996-10-21 1998-02-10 キヤノン株式会社 インクジェット記録ヘッド用基板の作製方法

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