JP2004319407A - Connecting structure of organic el panel - Google Patents

Connecting structure of organic el panel Download PDF

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Publication number
JP2004319407A
JP2004319407A JP2003115142A JP2003115142A JP2004319407A JP 2004319407 A JP2004319407 A JP 2004319407A JP 2003115142 A JP2003115142 A JP 2003115142A JP 2003115142 A JP2003115142 A JP 2003115142A JP 2004319407 A JP2004319407 A JP 2004319407A
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Prior art keywords
organic
panel
circuit board
electrode
terminals
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JP2003115142A
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JP3632975B2 (en
JP2004319407A5 (en
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Raiei Cho
来英 張
Kazuo Fukushima
一夫 福島
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting structure of an organic EL panel capable of facilitating the management of application amount of a moisture proofing agent and improving the reliability in electric connection. <P>SOLUTION: This connecting structure of the organic EL panel comprises the organic EL panel 1 having a plurality of electrode terminals (drawing electrodes) 3c and 6a provided in lines, and a flexible circuit board (circuit board) 8 having connecting terminals (terminal part) 8b to be electrically connected to each of the electrode terminals 3c and 6a. The electrode terminals 3c and 6a are electrically connected to the connecting terminals 8b through an anisotropic conductive film (connecting member) 12, and the moisture proofing agent 11 is applied to cover the connecting parts of the electrode terminals 3c and 6a with the connecting terminals 8b. The organic EL panel 1 has an index part 10 for showing the application range of the moisture proofing agent 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、有機EL(electro luminescence)パネルの接続構造に関し、特に有機ELパネルの引出電極と回路基板の端子部との接合構造に関するものである。
【0002】
【従来の技術】
有機ELパネルとしては、ガラス材料からなるガラス基板(透光性の支持基板)上に、ITO(indium tin oxide)等によって陽極となる透明電極(陽極電極)と、正孔注入層,正孔輸送層,発光層及び電子輸送層からなる有機層と、陰極となるアルミニウム(Al)等の非透光性の背面電極(陰極電極)とを順次積層して積層体である有機EL素子を形成し、この有機EL素子によって所定の発光部を形成し、前記発光部を覆うガラス材料からなる凹部形状の封止部材を前記ガラス基板上に紫外線硬化性接着剤を介して気密的に配設する構造のものが知られている(特許文献1参照)。
【0003】
特開2002−8855号公報
【0004】
かかる有機ELパネルは、前記透明電極及び前記背面電極から前記ガラス基板の一辺にそれぞれ引き出された列状の電極端子(引出端子)と、前記有機ELパネルを駆動する駆動回路が搭載された回路基板とを電気的に接続するためにフレキシブル配線板(FPC)が用いられている。前記フレキシブル配線板は、前記各電極端子に対応し列状に設けられる第1の接続端子(端子部)と、前記各第1の接続端子と電気的に接続する所定の回路配線と、前記回路配線の末端に設けられ、前記回路基板と接続するための第2の接続端子とが備えられている。前記有機ELパネルの前記電極端子と前記フレキシブル配線板の前記第1の接続端子は、異方性導電膜(異方性導電フィルム)等の接続部材によって電気的に接続される。
【0005】
【発明が解決しようとする課題】
かかる有機ELパネルは、温度変化が生じる環境下(例えば、車両に搭載される)で使用されることがあり、そのため有機ELパネルを含む製品に結露が生じる恐れがある。この結露による悪影響を抑え製品としての信頼性を向上させるために、前記各端子による接合個所には、樹脂系の防湿剤が塗布されることが一般的になっている。しかしながら、前記接合箇所が簡単に認識できない場合は、前記防湿剤の塗布範囲が不明確になり、前記防湿剤の塗布が不足する。すなわち前記接合箇所の全域が覆われず、前記各端子が露出することになり、高湿環境において露出している前記各端子部分が電食し、有機ELパネル自体が発光しなくなったり、あるいは有機ELパネルが部分的に発光しなくなるといった問題が生じ、電気的接続における信頼性が低下してしまうといった問題点を有している。
【0006】
そこで、本発明は、防湿剤の塗布量管理を容易に行いことが可能であり、また電気的接続における信頼性を向上させることが可能な有機ELパネルの接合構造を提供するものである。
【0007】
【課題を解決するための手段】
本発明は、前記課題を解決するため、請求項1に記載の通り、列状に設けられた複数の引出電極を備える有機ELパネルと、前記引出電極と電気的に接続される端子部を備える可撓性を有する回路基板とを備え、前記引出電極と前記端子部とが接続部材を介して電気的に接続されるとともに、前記引出電極と前記端子部との接合部分を覆うように防湿剤が塗布されてなる有機ELパネルの接合構造であって、前記有機ELパネルもしくは前記回路基板の少なくとも一方に、前記防湿剤の塗布範囲を示す指標部を備えてなるものである。
【0008】
また、請求項2に記載の通り、請求項1に記載した有機ELパネルの接合構造において、前記指標部は、前記有機ELパネルにおける有機EL素子の構成材料によって形成されてなるものである。
【0009】
また、請求項3に記載の通り、請求項2に記載の有機ELパネルの接合構造において、前記指標部は、認識可能な前記有機EL素子の構成材料によって形成されてなるものである。
【0010】
また、請求項4に記載の通り、請求項1に記載の有機ELパネルの接合構造において、前記指標部は、前記回路基板の構成材料によって形成されてなるものである。
【0011】
また、請求項5に記載の通り、請求項1に記載の有機ELパネルの接合構造において、前記指標部は、前記回路基板に形成される穴部もしくは切り欠き部から構成されるものである。
【0012】
【発明の実施の形態】
以下、本発明の実施形態を添付図面に基づき説明する。
【0013】
図1〜図3を用いて本発明の実施の形態について説明する。表示パネル1は、ガラス基板(透光性基板)2と、透明電極3と、絶縁層4と、有機層5と、背面電極6と、封止部材7と、フレキシブル回路基板8から主に構成されている。
【0014】
ガラス基板2は、長方形形状からなる透光性の支持基板である。
【0015】
透明電極3は、ガラス基板2上にITO等の導電性材料を蒸着法やスパッタリング法等の手段によって形成されるもので、日の字型の表示セグメント部3aと、個々の表示セグメント部3aからそれぞれ引き出し形成されたリード部3bと、リード部3bの終端部に設けられる電極端子3cとを備えており、表示セグメント部3a単位毎に図示しない給電回路からの定電流を選択的に与えることが可能な構造を得ている。尚、電極端子3cは、ガラス基板2の一辺に集中的に配設されるように各表示セグメント部3aに対応するリード部3bが引き出し形成される。
【0016】
絶縁層4は、例えば、ポリイミド系等の絶縁材料からなり、例えばフォトリソグラフィー法等の手段によって形成される。絶縁層4は、表示セグメント部3aに対応した窓部4aを有し、発光領域の輪郭を鮮明に表示するため、透明電極3の表示セグメント部3aの周縁部と若干重なるように窓部4aが形成され、また、透明電極3と背面電極6との絶縁を確保するためにリード部3b上を覆うように配設される。
【0017】
有機層5は、少なくとも発光層を有するものであれば良いが、本発明の実施の形態においては正孔注入層,正孔輸送層,発光層及び電子輸送層を蒸着法等の手段によって順次積層形成してなるものである。
【0018】
背面電極6は、アルミ(Al)やアルミリチウム(Al:Li),マグネシウム銀(Mg:Ag)等の金属性の導電性材料を蒸着法やスパッタリング法等の手段によって有機層6上に形成してなるもので、長方形形状をなす単一の金属電極であり、有機層5における発光部(表示セグメント部3a)の共通電極となる。背面電極6は、透明電極3の各電極端子3cに隣接するようにガラス基板2の一辺に設けられる陰極用の電極端子6aと電気的に接続される。尚、電極端子6aは透明電極3と同材料により、背面電極6の幅方向に沿うように細長状に形成される。
【0019】
以上のように、ガラス基板2上に透明電極3と絶縁層4と有機層5と背面電極6とを順次積層し積層体を形成することで有機EL素子9が得られる。
【0020】
封止部材7は、例えばガラス材料からなる平板部材に収納部である凹部7aを形成してなるものである。封止部材7は、凹部7aを取り囲むように形成される支持部7bを、例えば紫外線硬化型エポキシ樹脂接着剤10を介しガラス基板2上に気密的に配設することで、封止部材7とガラス基板2とで有機EL素子9を収納する気密空間Sを構成する。封止部材7は、透明電極3の電極端子3c及び背面電極6の電極端子6aが外部に露出するようにガラス基板2よりも若干小さ目に構成されている。
【0021】
以上の各部によって有機ELパネル1が構成される。
【0022】
また、フレキシブル回路基板(回路基板)8は、可撓性を有する絶縁材料に所定の回路配線8aが形成され、表示制御用のコントローラや定電流源回路等の他の機器と接続するための接続部材である。また回路配線8aの末端部分には、表示パネル1の各電極端子3c,6aと電気的に接合する接続端子(端子部)8bが、フレキシブル回路基板8の幅方向に沿って列状に複数設けられている。接続端子8bは、例えば銅箔上に銀や金等の導電材料を積層してなるもので、ITOからなる電極端子3c,6aよりも導電率が良好な材料によって構成される。
【0023】
次に図3から図5を用いて、有機ELパネル1とフレキシブル回路基板8との接合構造について詳述する。
【0024】
図中、10は、有機EL素子9を構成する透明電極3,絶縁層4,有機層5もしくは背面電極6の何れか材料が用いて形成され、四角形状の一対の指標部である。11は、一対の指標部9によって指定される範囲内に塗布される樹脂系の防湿剤である。12は、所定の間隔にてガラス基板1の一辺に列状に形成される表示パネル1の電極端子3c,6aと、電極端子3c,6aの幅より狭い幅を有するとともに、電極端子3c,6aと同等の形成間隔にて形成されるフレキシブル回路基板8の接続端子8bとを電気的に接合する異方性導電膜(接続部材)11である。尚、指標部10は、防湿剤11が塗布される領域を明確に判断するために、有機EL素子9を構成する色味のある材料で構成することが望ましい。
【0025】
かかる表示パネル1の接合構造において特徴となる点は、有機ELパネル1の電極端子3c,6aと、フレキシブル回路基板8の接続端子8bとを異方性導電膜11によって接合した後、指標部10によって指定された範囲内に位置する電極端子3c,6a及び接続端子8bの接合部分を含む所定領域が防湿剤11によって覆われる構造にある。従って、電極端子3c,6aと接続端子8bとの接合部分において、防湿剤11を塗布する領域を指標部10にて示すことによって、防湿剤11をはけにより塗布する場合やシリンジ等を用いた塗布装置により塗布する場合であっても、防湿剤11の塗布領域(塗布範囲)を容易に確認することが可能であるとともに、塗布後の確認作業においても防湿剤11が適正なる塗布量に達しているか否かを容易に判断することが可能であることから、塗布量管理を容易とする。また防湿剤11の塗布を安定して行うことで、各端子3c,6c,8bが露出することがなくなるため、高湿環境においても電気的接続の信頼性を向上させることが可能となる。
【0026】
また、指標部10は、有機ELパネル1における有機EL素子9の構成材料によって形成されることから、指標部10を形成するに専用の材料及び工程を必要としないことから、製造工程を煩雑にすることがなく、また製造コストを高くすることもない。
【0027】
また、指標部10を視覚的に認識可能な有機ELパネル1における有機EL素子9の構成材料によって形成することで、塗布量管理がより容易となる。また、前記塗布装置のシリンジによって防湿剤11を塗布する場合、画像処理装置を用いて塗布位置を定める方法が挙げられるが、認識可能な指標部10とすることによって、前記画像処理装置による画像処理方法において、指標部10を座標として定めることが可能となるため、指定塗布領域に正確に防湿剤10を塗布することが可能となる。
【0028】
次に、図6を用いて、本発明の他の実施形態について説明する。前述した実施形態と同様もしくは相当個所には同一符号を付して、その詳細な説明は省略する。
【0029】
本発明の他の実施形態が、前述の実施形態と比べ異なる点は、指標部の形成位置にある。即ち、本発明の他の実施形態における指標部13は、線状形状を成し、銅箔やシルク印刷等のフレキシブル回路基板8の構成部品から形成されている。指標部13は、フレキシブル回路基板8の回路配線部8aの形成面側に設けられるものであり、電極端子3c,6aと電気的に接合し列状に設けられる複数の接続端子8b群の両端部に設けられるものである。
【0030】
従って、フレキシブル回路基板8に指標部13を設けることから、前述した実施形態と同様な効果を得ることが可能となる。
【0031】
尚、前述した各実施形態では、セグメント表示式の有機ELパネル1を用いて説明したが、少なくとも一方が透光性の第1,第2電極ライン(電極)をそれぞれ複数備え、前記各電極ラインを交差する状態で配設するとともに、前記各電極ライン間に少なくとも発光層を含む有機層を挟持してマトリクス状の有機EL素子を透光性基板上に配設する有機ELパネルに本発明を適用しても良い。
【0032】
また、前述した各実施形態では、電極端子3c,6aと接続端子8bとの接続部材として、異方性導電膜11を用いるものであったが、他の接続部材としてはヒートシールを用いるものであっても良い。
【0033】
また、前述した各実施形態では、指標部10,13を四角形状もしくは線状形状からなるものであったが、本発明は、防湿剤11の塗布領域を示すものであれば、前述した各実施形態の形状に限定されるものではない。
【0034】
また、前述した他の実施形態では、指標部13をフレキシブル回路基板8の構成部品により構成するものであったが、本発明にあっては、フレキシブル回路基板の所定位置に穴部や切り欠き部を形成し、防湿剤11の塗布範囲を示すものであっても良い。
【0035】
【発明の効果】
本発明は、列状に設けられた複数の引出電極を備える有機ELパネルと、前記引出電極と電気的に接続される端子部を備える可撓性を有する回路基板とを備え、前記引出電極と前記端子部とが接続部材を介して電気的に接続されるとともに、前記引出電極と前記端子部との接合部を覆うように防湿剤が塗布されてなる有機ELパネルの接合構造に関し、防湿剤の塗布量管理を容易に行いことが可能であり、また電気的接続における信頼性を向上させることが可能となる。
【図面の簡単な説明】
【図1】本発明の実施形態の有機ELパネルの接合構造を示す斜視図。
【図2】同上実施形態の有機ELパネルの要部断面図。
【図3】同上実施形態の有機ELパネル及び回路基板を示す平面図。
【図4】同上実施形態の有機ELパネルの接合構造を示す平面図。
【図5】同上実施形態の有機ELパネルの接合構造を示す要部断面図。
【図6】本発明の他の実施形態の有機ELパネルの接合構造を示す平面図。
【符号の説明】
1 有機ELパネル
2 ガラス基板(透光性基板)
3 透明電極
3a 表示セグメント部
3b リード部
3c 電極端子(引出電極)
5 有機層
6 背面電極
6a 電極端子(引出電極)
8 フレキシブル回路基板
8a 回路配線
8b 接続端子(端子部)
9 有機EL素子
10,13 指標部
11 防湿剤
12 異方性導電膜(接続部材)
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection structure of an organic EL (electro luminescence) panel, and more particularly to a joining structure of an extraction electrode of an organic EL panel and a terminal portion of a circuit board.
[0002]
[Prior art]
As an organic EL panel, a transparent electrode (anode electrode) serving as an anode by ITO (indium tin oxide) or the like, a hole injection layer, and a hole transport are formed on a glass substrate (a translucent support substrate) made of a glass material. , An organic layer composed of a light emitting layer and an electron transport layer, and a non-transparent back electrode (cathode electrode) such as aluminum (Al) serving as a cathode are sequentially laminated to form an organic EL device as a laminate. A structure in which a predetermined light emitting portion is formed by the organic EL element, and a concave sealing member made of a glass material covering the light emitting portion is hermetically disposed on the glass substrate via an ultraviolet curable adhesive. Is known (see Patent Document 1).
[0003]
JP-A-2002-8855
Such an organic EL panel is a circuit board on which a row of electrode terminals (leading terminals) respectively drawn to one side of the glass substrate from the transparent electrode and the back electrode, and a drive circuit for driving the organic EL panel are mounted. A flexible wiring board (FPC) is used to electrically connect the FPC and the FPC. The flexible wiring board includes: first connection terminals (terminal portions) provided in a row corresponding to the electrode terminals; predetermined circuit wiring electrically connected to the first connection terminals; A second connection terminal is provided at an end of the wiring and is connected to the circuit board. The electrode terminals of the organic EL panel and the first connection terminals of the flexible wiring board are electrically connected by a connection member such as an anisotropic conductive film (anisotropic conductive film).
[0005]
[Problems to be solved by the invention]
Such an organic EL panel may be used in an environment where a temperature change occurs (for example, mounted on a vehicle), and thus there is a possibility that dew condensation may occur on a product including the organic EL panel. In order to suppress the adverse effect of this dew condensation and improve the reliability as a product, it is common to apply a resin-based moisture-proof agent to the joints between the terminals. However, if the joint cannot be easily recognized, the range of application of the desiccant becomes unclear, and the application of the desiccant is insufficient. That is, the entire area of the joint is not covered, and the respective terminals are exposed, and the respective exposed terminal portions are eroded in a high-humidity environment, and the organic EL panel itself does not emit light or the organic EL panel does not emit light. There is a problem that the panel partially emits no light, and the reliability of the electrical connection is reduced.
[0006]
Therefore, the present invention provides a bonding structure of an organic EL panel that can easily control the amount of a moisture-proofing agent applied and can improve the reliability in electrical connection.
[0007]
[Means for Solving the Problems]
The present invention, as set forth in claim 1, includes an organic EL panel including a plurality of extraction electrodes provided in a row, and a terminal unit electrically connected to the extraction electrodes. A flexible circuit board, wherein the extraction electrode and the terminal portion are electrically connected via a connecting member, and a moistureproofing agent is provided so as to cover a joint portion between the extraction electrode and the terminal portion. Is applied, and at least one of the organic EL panel and the circuit board is provided with an indicator indicating an application range of the moisture proofing agent.
[0008]
According to a second aspect of the present invention, in the bonding structure of the organic EL panel according to the first aspect, the index portion is formed of a constituent material of an organic EL element in the organic EL panel.
[0009]
According to a third aspect of the present invention, in the bonding structure of the organic EL panel according to the second aspect, the indicator portion is formed of a recognizable constituent material of the organic EL element.
[0010]
According to a fourth aspect of the present invention, in the bonding structure of the organic EL panel according to the first aspect, the indicator is formed of a constituent material of the circuit board.
[0011]
According to a fifth aspect of the present invention, in the bonding structure of the organic EL panel according to the first aspect, the index portion is formed of a hole or a cutout formed in the circuit board.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0013]
An embodiment of the present invention will be described with reference to FIGS. The display panel 1 mainly includes a glass substrate (translucent substrate) 2, a transparent electrode 3, an insulating layer 4, an organic layer 5, a back electrode 6, a sealing member 7, and a flexible circuit board 8. Have been.
[0014]
The glass substrate 2 is a light-transmitting support substrate having a rectangular shape.
[0015]
The transparent electrode 3 is formed by depositing a conductive material such as ITO on the glass substrate 2 by a method such as a vapor deposition method or a sputtering method. Each of the lead portions 3b is provided with an electrode terminal 3c provided at the end of the lead portion 3b, and a constant current from a power supply circuit (not shown) can be selectively applied to each display segment 3a. I have a possible structure. In the electrode terminals 3c, lead portions 3b corresponding to the respective display segment portions 3a are drawn out so as to be intensively arranged on one side of the glass substrate 2.
[0016]
The insulating layer 4 is made of, for example, a polyimide-based insulating material, and is formed by, for example, a photolithography method. The insulating layer 4 has a window 4a corresponding to the display segment 3a, and the window 4a is slightly overlapped with the periphery of the display segment 3a of the transparent electrode 3 in order to clearly display the outline of the light emitting region. It is formed so as to cover the lead portion 3b in order to secure insulation between the transparent electrode 3 and the back electrode 6.
[0017]
The organic layer 5 may have at least a light emitting layer, but in the embodiment of the present invention, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially laminated by means such as a vapor deposition method. It is formed.
[0018]
The back electrode 6 is formed by forming a metallic conductive material such as aluminum (Al), aluminum lithium (Al: Li), and magnesium silver (Mg: Ag) on the organic layer 6 by a method such as an evaporation method or a sputtering method. This is a single metal electrode having a rectangular shape, and serves as a common electrode of the light emitting portion (display segment portion 3a) in the organic layer 5. The back electrode 6 is electrically connected to a cathode electrode terminal 6 a provided on one side of the glass substrate 2 so as to be adjacent to each electrode terminal 3 c of the transparent electrode 3. The electrode terminal 6a is formed of the same material as the transparent electrode 3 in an elongated shape along the width direction of the back electrode 6.
[0019]
As described above, the organic EL element 9 is obtained by sequentially laminating the transparent electrode 3, the insulating layer 4, the organic layer 5, and the back electrode 6 on the glass substrate 2 to form a laminate.
[0020]
The sealing member 7 is formed by forming a concave portion 7a as a storage portion in a flat plate member made of, for example, a glass material. The sealing member 7 is provided with a support portion 7b formed so as to surround the concave portion 7a in an airtight manner on the glass substrate 2 via, for example, an ultraviolet-curable epoxy resin adhesive 10, so that the sealing member 7 The glass substrate 2 forms an airtight space S for housing the organic EL element 9. The sealing member 7 is slightly smaller than the glass substrate 2 so that the electrode terminals 3c of the transparent electrode 3 and the electrode terminals 6a of the back electrode 6 are exposed to the outside.
[0021]
The organic EL panel 1 is configured by the above components.
[0022]
The flexible circuit board (circuit board) 8 has a predetermined circuit wiring 8a formed on a flexible insulating material, and is used for connection with another device such as a controller for display control or a constant current source circuit. It is a member. A plurality of connection terminals (terminal portions) 8b electrically connected to the respective electrode terminals 3c and 6a of the display panel 1 are provided in a row at the end of the circuit wiring 8a along the width direction of the flexible circuit board 8. Have been. The connection terminal 8b is formed by laminating a conductive material such as silver or gold on a copper foil, for example, and is made of a material having better conductivity than the electrode terminals 3c and 6a made of ITO.
[0023]
Next, a joint structure between the organic EL panel 1 and the flexible circuit board 8 will be described in detail with reference to FIGS.
[0024]
In the figure, reference numeral 10 denotes a pair of quadrangular indicators formed using any material of the transparent electrode 3, the insulating layer 4, the organic layer 5, and the back electrode 6 constituting the organic EL element 9. Reference numeral 11 denotes a resin-based desiccant applied within a range specified by the pair of index portions 9. Reference numeral 12 denotes electrode terminals 3c and 6a of the display panel 1 formed in a row on one side of the glass substrate 1 at predetermined intervals, and has a width smaller than the width of the electrode terminals 3c and 6a. This is an anisotropic conductive film (connection member) 11 for electrically connecting the connection terminals 8b of the flexible circuit board 8 formed at the same formation interval as the above. It is desirable that the index portion 10 be made of a material having a tint that constitutes the organic EL element 9 in order to clearly determine the region to which the desiccant 11 is applied.
[0025]
A feature of the bonding structure of the display panel 1 is that the electrode terminals 3 c and 6 a of the organic EL panel 1 and the connection terminals 8 b of the flexible circuit board 8 are bonded by the anisotropic conductive film 11, and then the index portion 10 is formed. A predetermined area including a joint portion between the electrode terminals 3c and 6a and the connection terminal 8b located in the range specified by the above is covered with the moisture proof agent 11. Therefore, in the joint portion between the electrode terminals 3c and 6a and the connection terminal 8b, the region to which the moisture-proofing agent 11 is applied is indicated by the indicator portion 10, so that the moisture-proofing agent 11 is applied by brushing or using a syringe or the like. Even when the application is performed by the application device, the application area (application range) of the moisture-proofing agent 11 can be easily confirmed, and the moisture-proofing agent 11 reaches an appropriate application amount even in the confirmation work after the application. Since it is possible to easily determine whether or not the application amount has been adjusted, the application amount management is facilitated. In addition, since the terminals 3c, 6c, and 8b are not exposed by stably applying the moisture proofing agent 11, the reliability of electrical connection can be improved even in a high-humidity environment.
[0026]
In addition, since the index portion 10 is formed of the constituent material of the organic EL element 9 in the organic EL panel 1, no special material and process are required to form the index portion 10, so that the manufacturing process is complicated. And there is no increase in manufacturing costs.
[0027]
Further, by forming the index portion 10 with the constituent material of the organic EL element 9 in the organic EL panel 1 that can be visually recognized, the application amount management becomes easier. When applying the moisture-proofing agent 11 by using the syringe of the application device, a method of determining the application position using an image processing device may be mentioned, but the image processing by the image processing device In the method, since the index portion 10 can be determined as coordinates, it becomes possible to accurately apply the moisture-proofing agent 10 to the designated application region.
[0028]
Next, another embodiment of the present invention will be described with reference to FIG. The same or corresponding parts as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0029]
The other embodiment of the present invention is different from the above-described embodiment in the formation position of the index portion. That is, the index portion 13 in another embodiment of the present invention has a linear shape and is formed from a component of the flexible circuit board 8 such as a copper foil or a silk print. The index portions 13 are provided on the side of the flexible circuit board 8 on which the circuit wiring portions 8a are formed. The index portions 13 are electrically connected to the electrode terminals 3c and 6a and are provided at both ends of a plurality of connection terminals 8b arranged in a row. It is provided in.
[0030]
Therefore, since the index portion 13 is provided on the flexible circuit board 8, it is possible to obtain the same effect as the above-described embodiment.
[0031]
In each of the above-described embodiments, the segment display type organic EL panel 1 has been described. However, at least one of the plurality of light-transmitting first and second electrode lines (electrodes) is provided. The present invention is applied to an organic EL panel in which a matrix-shaped organic EL element is disposed on a light-transmitting substrate while an organic layer including at least a light-emitting layer is interposed between the electrode lines. May be applied.
[0032]
Further, in each of the above-described embodiments, the anisotropic conductive film 11 is used as a connection member between the electrode terminals 3c and 6a and the connection terminal 8b, but a heat seal is used as another connection member. There may be.
[0033]
Further, in each of the above-described embodiments, the index portions 10 and 13 have a rectangular shape or a linear shape. However, the present invention may be applied to any of the above-described embodiments as long as they indicate the application area of the moisture proofing agent 11. It is not limited to the shape of the form.
[0034]
Further, in the other embodiments described above, the index portion 13 is constituted by the components of the flexible circuit board 8, but in the present invention, a hole or a notch is provided at a predetermined position of the flexible circuit board. May be formed to indicate the application range of the desiccant 11.
[0035]
【The invention's effect】
The present invention includes an organic EL panel including a plurality of extraction electrodes provided in a row, and a flexible circuit board including a terminal portion that is electrically connected to the extraction electrodes. The present invention relates to a joining structure of an organic EL panel in which the terminal portion is electrically connected via a connecting member and a moistureproofing agent is applied so as to cover a joining portion between the extraction electrode and the terminal portion. Can be easily controlled, and the reliability of electrical connection can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a joint structure of an organic EL panel according to an embodiment of the present invention.
FIG. 2 is a sectional view of a main part of the organic EL panel according to the embodiment.
FIG. 3 is a plan view showing the organic EL panel and the circuit board of the embodiment.
FIG. 4 is a plan view showing a joint structure of the organic EL panel according to the embodiment.
FIG. 5 is an essential part cross sectional view showing the joint structure of the organic EL panel of the embodiment.
FIG. 6 is a plan view showing a bonding structure of an organic EL panel according to another embodiment of the present invention.
[Explanation of symbols]
1 Organic EL panel 2 Glass substrate (translucent substrate)
3 Transparent electrode 3a Display segment 3b Lead 3c Electrode terminal (lead electrode)
5 Organic layer 6 Back electrode 6a Electrode terminal (lead electrode)
8 Flexible circuit board 8a Circuit wiring 8b Connection terminal (terminal part)
9 Organic EL device 10, 13 Indicator 11 Moisture proof agent 12 Anisotropic conductive film (connecting member)

Claims (5)

列状に設けられた複数の引出電極を備える有機ELパネルと、前記引出電極と電気的に接続される端子部を備える可撓性を有する回路基板とを備え、前記引出電極と前記端子部とが接続部材を介して電気的に接続されるとともに、前記引出電極と前記端子部との接合部分を覆うように防湿剤が塗布されてなる有機ELパネルの接合構造であって、
前記有機ELパネルもしくは前記回路基板の少なくとも一方に、前記防湿剤の塗布範囲を示す指標部を備えてなることを特徴とする有機ELパネルの接続構造。
An organic EL panel including a plurality of extraction electrodes provided in a row, and a flexible circuit board including a terminal portion electrically connected to the extraction electrodes, wherein the extraction electrodes, the terminal portions, Are electrically connected via a connection member, and a moisture-proofing agent is applied so as to cover a joint portion between the extraction electrode and the terminal portion.
A connection structure for an organic EL panel, characterized in that at least one of the organic EL panel and the circuit board is provided with an indicator indicating an application range of the desiccant.
前記指標部は、前記有機ELパネルにおける有機EL素子の構成材料によって形成されてなることを特徴とする請求項1に記載の有機ELパネルの接合構造。The organic EL panel joining structure according to claim 1, wherein the indicator is formed of a constituent material of an organic EL element in the organic EL panel. 前記指標部は、認識可能な前記有機EL素子の構成材料によって形成されてなることを特徴とする請求項2に記載の有機ELパネルの接続構造。The connection structure for an organic EL panel according to claim 2, wherein the indicator is formed of a recognizable constituent material of the organic EL element. 前記指標部は、前記回路基板の構成材料によって形成されてなることを特徴とする請求項1に記載の有機ELパネルの接合構造。2. The organic EL panel bonding structure according to claim 1, wherein the indicator is formed of a constituent material of the circuit board. 前記指標部は、前記回路基板に形成される穴部もしくは切り欠き部から構成されることを特徴とする請求項1に記載の有機ELパネルの接合構造。The joint structure for an organic EL panel according to claim 1, wherein the indicator comprises a hole or a notch formed in the circuit board.
JP2003115142A 2003-04-21 2003-04-21 Organic EL panel connection structure Expired - Fee Related JP3632975B2 (en)

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