JP2013065523A - Organic light emitting panel and lighting device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that a mechanical strength of a substrate becomes insufficient as the thickness of the substrate is reduced in a structure where a clip like electrode, holding the one substrate for connecting the electrode of an organic light-emitting element with a feed line of a lighting device, is adopted.SOLUTION: An organic light emitting panel comprises: a first substrate 1; an organic light emitting element 5 provided on the first substrate 1 and having a first electrode 2, an organic light emitting layer 3, and a second electrode 4; a second substrate 6 which is disposed facing the first substrate and sealing the organic light emitting element 5; wiring connection parts 7, 8 which are disposed at a peripheral part of the first substrate 1 exposed from the substrate 6 and respectively connect with the first electrode 2 and the second electrode 4; and a conductive coating material 10 coating end parts of the first substrate 1 and the second substrate 6. A connection part 11 is provided at the inner side of the conductive coating material 10, and the connection part 11 is electrically connected with the wiring connection parts 7, 8.

Description

  The present invention relates to an organic light emitting panel and a lighting device using the same, and more particularly to an organic light emitting panel that is easy to handle and a lighting device using the same.

  Organic light-emitting element (Organic Electro-Luminescence Device) is an element that emits an organic material when an appropriate direct current is applied. An organic light-emitting panel that is configured as a panel can realize a surface light source. In the lighting field, it is attracting attention as a next-generation light source considering the environment.

  When an organic light-emitting panel is used as a lighting device, generally, a configuration in which the organic light-emitting panel is attached to a holding unit that is a self-supporting type that is connected to a power supply line or that is fixed to a ceiling or a wall surface is common. It is.

  FIG. 12 is a diagram for explaining a conventional organic light emitting panel 100, FIG. 12A is a perspective view of the entire organic light emitting panel 100, FIG. 12B is an enlarged sectional view of an external connection terminal portion, and FIG. (C) and (D) are a plan view and a cross-sectional view, respectively, of the anisotropic conductive film.

  In the organic light emitting panel 100, for example, an anode, an organic EL (Electro-Luminescence) layer, and a cathode (all not shown) are laminated in this order in a light emitting region ER indicated by a broken line on the glass substrate 101, and sealed with a sealing substrate 103. It has stopped. In FIG. 12, the light emission direction (arrow) is described as upward, and the stacking order is such that the direction from the glass substrate 101 toward the sealing substrate 103 is upward. The anode is connected to an external connection terminal (anode terminal) 106 through anode wiring 104 provided along, for example, three sides around the light emitting region ER. The cathode is connected to an external connection terminal (cathode terminal) 107 via a cathode wiring 105 provided along the other side around the light emitting region ER.

  The external connection terminals 106 and 107 are FPCs (Flexible Printed Circuits) 120 each bonded to an organic light emitting panel with an anisotropic conductive film (ACF), which are connected to a power supply line of the lighting device. To do.

  Referring to FIG. 12B, a part of the anode wiring 104 (also on the cathode wiring 105 side) patterned on the glass substrate 101 is exposed from the sealing substrate 103 at the end of the organic light emitting panel 100. The tape-shaped ACF 110 is bonded to the FPC 120, and the FPC 120 is brought into contact therewith and fixed by thermocompression bonding.

  Referring to FIGS. 12C and 12D, the ACF 110 is obtained by scattering metal-plated beads (metal beads) 112 having a particle diameter equivalent to the thickness of the film 111 on an adhesive film (sheet) 111. The two conductive surfaces of the film 111 are brought into conduction by contacting with each other through the metal beads 112.

  As a method for attaching such an organic light emitting panel to a lighting device housing, the organic light emitting panel is dropped into a frame-shaped housing, and the housing is installed in an embedding hole such as a ceiling and fixed with a leaf spring (for example, Patent Document 1) is known.

  Also known is a structure (see, for example, Patent Document 2) in which a housing having an organic light emitting panel having a concave portion in the peripheral portion is fitted to a convex portion of an external connection member. The electrode and the external connection portion of the housing are directly connected without using a connecting means such as an FPC.

  Furthermore, a structure in which an auxiliary electrode for supplying power to the light emitting layer is provided at the outer end of the organic light emitting panel is also known (see, for example, Patent Document 3, Patent Document 4, and Patent Document 5).

  FIG. 13 is a side view showing an example of the organic light emitting panel 200 having the auxiliary electrode 205. The organic light emitting panel 200 is connected to the substrate 201 provided with the light emitting layer 206, the sealing substrate 203 for sealing the light emitting layer 206, the electrodes 204 (the anode 204 a and the cathode 204 b) disposed on the substrate 201, and the electrode 204. Wiring (anode wiring and cathode wiring) 204w to be connected, and an auxiliary electrode 205 that contacts the wiring 204w and supplies power from the outside. The auxiliary electrode 205 is made of a rectangular metal plate that contacts the substrate 201 and the wiring 204w. The auxiliary electrode 205 is supplied with power by sandwiching the substrate 201 and the protective member 208 with a predetermined pressing force and connected to a wiring from an external power source.

Japanese Patent No. 4389839 Japanese Patent No. 4442846 JP 2010-257723 A JP 2010-192819 A JP 2008-269988 A

  As shown in FIG. 12A, when the FPC 120 is used as the external connection terminals 106 and 107, the cost and the cost of connection means (ACF 110 or the like) for attaching the FPC 120 to the substrate 101 are required.

  In addition, as shown in FIG. 12B, since the FPC 120, the anode wiring 104, and the cathode wiring 105 are usually attached by pressure bonding with an ACF 110 or the like, the reliability of welding at this attachment portion becomes a problem.

  Furthermore, the anode wiring 104 (same as the cathode wiring 105), and the electrical joint CP (circle) of the ACF 110 and the FPC 120 are exposed to the outside. Intrusion of moisture may occur, and reliability may deteriorate.

In addition, as shown in FIG. 12C, since the ACF 110 scatters about nine metal beads 112 on a film 111 per 1 mm ^2, for example, the current capacity is determined by the number of metal beads 112 that are conductors. That is, there is a problem that the current capacity is small as compared with, for example, fixing by melting of solder.

  On the other hand, in the configuration of FIG. 13, the wiring 204w of the organic light emitting panel is in direct contact with the metal auxiliary electrode 205 and does not employ ACF or FPC. Therefore, compared with the structure of FIG. The problem of the lowering of cost and reliability, or the small current capacity can be improved. In addition, the number of components and the number of assembly steps can be reduced by sandwiching the substrate 201 with the auxiliary electrode 205 itself regardless of fixing means such as screws.

  However, in the structure shown in FIG. 13, when the substrate 201 is thinned, there is a concern that the strength of the substrate 201 is insufficient.

  Specifically, a transparent insulating material such as glass is used as the substrate 201. Since the auxiliary electrode 205 is handled as one module (finished product) integrally with the organic light emitting panel 200 (substrate 201), the substrate 201 is interposed by interposing a highly elastic protective member 208 so as not to be detached from the substrate 201. It is pinched. Alternatively, the auxiliary electrode 5 has a clip-like spring property (with an elastic stress) to sandwich the substrate 201 (see Patent Document 3 to Patent Document 5).

  At present, the thickness of one glass substrate, which is the substrate 201 of the organic light emitting panel, is 1 mm or less, more specifically, from 0.5 mm to 0.3 mm. Then, the auxiliary electrode 205 is attached to one glass substrate (the glass substrate is sandwiched with elastic stress), and a force is applied to the vicinity of the auxiliary electrode 205 during the manufacturing process or during handling as a product. There is a risk that the strength against mechanical destruction is insufficient, and defects such as cracks and chipping of the substrate 201 increase.

  In addition, the wiring 204w and the auxiliary electrode 205 of the organic light emitting panel are fixed by a conductive fixing material, and also in this case, the joint portion CP (circle) is exposed to the outside. In general, the conductive fixing material is more likely to infiltrate moisture or the like than the insulating resin (sealing material), and therefore, there is a possibility that the connection portion CP may not be sufficiently sealed from the outside. Corrosion of the wiring 204w, intrusion of moisture from the connection portion CP, and the like may occur, and reliability may be deteriorated.

  The present invention has been made in view of the above problems. First, a first substrate, an organic light-emitting element provided on the first substrate and having a first electrode, an organic light-emitting layer, and a second electrode, and the first substrate And a second substrate for sealing the organic light emitting device disposed opposite to each other, and a wiring disposed on a peripheral portion of the first substrate exposed from the second substrate and connected to the first electrode and the second electrode, respectively. And a conductive coating covering the ends of the first substrate and the second substrate, and the conductive coating is provided with a connection portion on the inside, and the connection portion and the wiring portion This is solved by providing an organic light emitting panel to which is electrically connected.

  Second, a holding substrate provided with the organic light-emitting panel, a holding part that holds the organic light-emitting panel in contact with the conductive coating material, and a wiring that fixes the holding part and supplies power to the holding part It solves by providing the illuminating device which has.

  Accordingly, it is possible to realize an organic light emitting panel that can be easily and inexpensively attached to or replaced from a housing or a case, and a lighting device using the organic light emitting panel.

  According to the present invention, the end portions of the first substrate and the second substrate that support and seal the organic light emitting element are integrally covered with the cap-shaped conductive coating material, and the organic light emission is performed inside the conductive coating material. By adopting a configuration that connects to the wiring portion of the element, it is possible to realize an organic light-emitting panel including external connection terminals that can improve reliability at low cost while avoiding mechanical destruction of both substrates.

  The cap-shaped conductive coating material is inserted into the end portions of both substrates with almost no deformation, and is hermetically fixed with a sealing material. As a result, it is possible to suppress cracking and chipping of the substrate during the manufacturing process and handling of the product by the end user.

  In addition, the joint between the wiring portion of the organic light emitting element and the external connection terminal is provided inside the conductive coating material, and the conductive coating material is fixed to both substrates with a sealing material, so the joint portion is exposed to the outside. Therefore, it is possible to prevent the corrosion of the metal at the connection portion and the intrusion of moisture, thereby improving the reliability.

  Thus, an organic light emitting panel that is easy to handle, low cost, high performance, and high reliability and a lighting device using the same can be provided.

It is (A) perspective view, (B) top view, (C) sectional drawing explaining the structure of the organic light emitting panel of the 1st Embodiment of this invention. It is (A) top view, (B) perspective view, (C) perspective view explaining the structure of the organic light emitting panel of the 1st Embodiment of this invention. It is sectional drawing explaining the structure of the organic light emission panel of the 1st Embodiment of this invention. It is sectional drawing explaining the structure of the organic light emission panel of the 2nd Embodiment of this invention. It is (A) top view, (B) sectional drawing, (C) sectional view, (D) sectional drawing explaining the structure of the organic light emitting panel of the 3rd Embodiment of this invention. It is a perspective view explaining the structure of the organic light emitting panel of the 3rd Embodiment of this invention. It is sectional drawing explaining the structure of the organic light emission panel of the 4th Embodiment of this invention. It is a perspective view explaining the structure of the illuminating device of the 5th Embodiment of this invention. It is a perspective view explaining the structure of the illuminating device of the 6th Embodiment of this invention. It is the (A) top view, (B) perspective view, (C) side view, (D) side view explaining the structure of the illuminating device of the 7th Embodiment of this invention. It is the (A) perspective view, (B) perspective view, (C) side view explaining the structure of the illuminating device of the 7th Embodiment of this invention. It is (A) perspective view, (B) sectional drawing, (C) top view, (D) sectional drawing for demonstrating a prior art. It is sectional drawing for demonstrating a prior art.

  An embodiment of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a view showing a structure of an organic light emitting panel 50 according to a first embodiment of the present invention, and FIG. 1 (A) is a perspective view of the whole. 1B is a plan view, and FIG. 1C is a cross-sectional view taken along the line XX of FIG. 1B.

  Referring to FIG. 1A, an organic light emitting panel 50 includes a first substrate 1, a second substrate 6, an organic light emitting element (not shown here) provided therebetween, a first substrate 1, And a conductive coating material 10 provided at an end of the second substrate 6. As an example, the organic light emitting panel 50 emits light from the first substrate 1 side (emission surface ES) toward the outside. Here, the organic light emitting panel 50 includes conductive covering materials 10A and 10B having the same size and shape on two opposing sides. Hereinafter, when there is no need to distinguish between them, the two are collectively referred to as the conductive coating material 10.

  FIG. 1B is a diagram for mainly explaining components to be patterned on the first substrate 1, and is a plan view seen from the light emission surface ES side of the first substrate 1. .

  The first substrate 1 is an insulating transparent substrate such as rectangular glass or plastic in a plan view. A light emitting region ER is provided in the approximate center of the first substrate 1. The light emitting region ER is a region where the organic light emitting element 5 is disposed and emits surface light. Further, in the peripheral portion on the back surface side of the emission surface ES of the first substrate 1, a conductive material (for example, a metal layer such as an aluminum (Al) layer) is patterned so as to surround the light emitting region ER and the first wiring 17 is formed. And the 2nd wiring 18 is provided. For example, the first wiring 17 is patterned in a U-shape along three sides of the first substrate 1 in plan view, and the second wiring 18 is along the other one side of the first substrate 1. Patterned into strips. A sealing material (insulating resin adhesive) 21 is provided in the broken line region, and the second substrate (not shown) and the first substrate 1 are fixed.

  An end portion of the first wiring 17 (here, an end portion along one short side of the rectangular first substrate 1) is exposed to the outside of the sealing material 21 and becomes the first wiring connection portion 7. Similarly, the end portion of the second wiring 18 (here, the end portion along the other short side of the first substrate 1) is exposed to the outside of the sealing material 21 and becomes the second wiring connection portion 8.

  FIG. 1C is a cross-sectional view for explaining the main structure of the organic light emitting panel 50. Here, the conductive coating material 10 is not shown, but the conductive coating material 10 is a broken line region. Is attached. The light emitting region ER is a region in which the organic light emitting element 5 is provided on the first main surface S11 of the first substrate 1 having a thickness of, for example, about 0.7 mm (lower side in the illustrated state).

  Note that the organic light emitting panel described in each embodiment of the present invention has the first main surface S11 of the first substrate 1 facing upward in the manufacturing process, and the organic light emitting elements 5 are sequentially stacked thereon, and thereafter The second substrate 6 is formed, and in a finished product state, a bottom emission structure is formed in which light is emitted from the emission surface ES of the first substrate 1 to the outside. In each drawing (cross-sectional view, perspective view) referred to in the present specification, the completed organic light-emitting panel describes the light emission surface ES above the drawing (paper surface). Therefore, in the following description, for example, when the internal structure of the organic light emitting panel 50 is described, the first substrate 1 side is positioned downward (direction) and the second substrate 6 side is positioned upward (direction) according to the order of formation of the organic light emitting panel. Although it may be called, it may be upside down in the figure (paper surface).

  The organic light emitting element 5 includes a first electrode 2, an organic EL (Electro-Luminescence) layer 3, and a second electrode 4. The first electrode 2 is a transparent electrode (for example, an indium tin oxide (ITO) film) that serves as an anode of the organic light emitting element 5. The ITO film is patterned so as to be disposed on the entire surface of the light emitting region ER on the first main surface S11 (lower side in the drawing) of the first substrate 1. The first electrode 2 partially overlaps the first wiring 17 and is in electrical contact therewith. The first wiring 17 is a wiring for connecting to the first electrode 2 and connecting it to an external power source (not shown).

  An organic EL layer 3 is laminated on the first electrode 2. The organic EL layer 3 consists of organic thin film layers, such as a positive hole injection layer, a positive hole transport layer, an organic light emitting layer, and an electron carrying layer, for example. A second electrode 4 is stacked on the organic EL layer 3.

  The second electrode 4 serves as a cathode of the organic light emitting element 5 and is, for example, an Al layer, a silver (Ag) layer, or an alloy layer. The second electrode 4 is electrically connected to the second wiring 18 in the peripheral portion. The second wiring 18 is a wiring for connecting to the second electrode 4 and connecting it to an external power source (not shown).

  The second substrate 6 is provided to face the first substrate 1. The 1st board | substrate 1 and the 2nd board | substrate 6 are adhere | attached with the sealing material 21, and the organic light emitting element 5 in the light emission area | region ER is sealed by this. Although illustration is omitted, a hygroscopic material (drying agent) may be provided on the second main surface S22 (the organic light emitting element 5 side) of the second substrate 6.

  The second substrate 6 serving as a sealing substrate has a thickness of, for example, about 0.7 mm and an area smaller than that of the first substrate 1. Therefore, when these are arranged facing each other, a part of the peripheral portion of the first substrate 1 is exposed from the second substrate 6. On the first main surface S11 of the first substrate 1 exposed from the second substrate 6, a part of the first wiring 17 and the second wiring 18, that is, the first wiring connection portion 7 and the second wiring connection portion 8 are exposed. .

  In the organic light emitting device 5, holes injected from the first electrode 2 and electrons injected from the second electrode 4 are recombined inside the organic EL layer 3 to excite organic molecules forming the organic EL layer 3. As a result, excitons are generated. Light is emitted from the organic EL layer 3 in the process of radiation deactivation of the excitons, and the light is emitted from the transparent first electrode 2 to the outside through the first substrate 1 as indicated by an arrow to emit light. In the present embodiment, as an example, the emitted light (arrow) from the emission surface ES of the first substrate 1 is white.

  In the present embodiment, the ends of the two sides facing each other in plan view of the first substrate 1 and the second substrate 6 are each integrally covered with the conductive coating material 10 (see FIG. 1A).

  The conductive coating material 10 will be described with reference to FIGS. 2 and 3. 2A and 2B are diagrams showing an assembly example of the conductive coating material 10, FIG. 2A is a plan development view before assembly, FIG. 2B is a perspective view during assembly, and FIG. 2C is after assembly. It is a perspective view of this, and is a figure from the viewpoint of the arrow direction of FIG. FIG. 3 is an enlarged cross-sectional view of an end portion of the organic light emitting panel 50 provided with the conductive coating material 10.

  Referring to FIG. 2 (A), the conductive coating material 10 is obtained by assembling a single metal material having a thickness of about 0.3 mm into a shape along the shape of the end portions of the first substrate 1 and the second substrate 6. It is. The metal material is preferably a material such as stainless steel or aluminum (Al) from the viewpoint of electrical characteristics, corrosion resistance, and cost.

  As an example, the conductive coating 10 includes a rectangular a surface having a long side and a short side, and a b surface, a c surface, and a d surface that are provided by sequentially adjoining the long side from one long side of the a surface. The long side or the short side of the f-plane, the h-plane, and the a-side of the f-plane, the e-plane, and the f-plane, the h-plane, and the a-plane, which are sequentially adjacent to each other This is a single metal plate composed of nine surfaces, i.e., g-plane and i-plane, which are provided with adjacent sides.

  Referring to FIG. 2B, the conductive coating material 10 is formed by sequentially bending the e-plane three-dimensionally from the a-plane so that the e-plane is wound inward, with the f-plane and the g-plane as side surfaces, and the i-plane and h-plane. Each surface is bent so as to be in contact with the c-plane to form a box shape. In addition, a surface-i surface is a general term for front and back. Part of c-plane, h-plane, and i-plane overlap, b-plane and d-plane, f-plane and g-plane, c-plane (h-plane, i-plane) and e-plane, e-plane and a-plane are opposed surfaces, respectively. Become.

  The d surface is a surface facing the b surface, but its height is lower than that of the b surface, and the bending position between the c surface and the d surface is the h surface and the f surface arranged in a straight line in FIG. , A-plane, g-plane, and i-plane end (b-plane side). The a-plane, e-plane, c-plane, i-plane, and h-plane are arranged substantially horizontally. In addition, the edge part of e surface and b surface may be contacting.

  Referring to FIG. 2 (C), the shape of the conductive covering 10 after assembly is composed of a-plane, b-plane, h-plane, i-plane, g-plane, and f-plane in appearance. That is, it has a pentahedron shape obtained by removing one surface (opposite surface of b surface) from a rectangular parallelepiped shape constituted by the a surface, b surface, and g surface shown in the drawing, and these opposing surfaces, and hereinafter this shape and A shape obtained by further removing the f-plane or g-plane from this shape is referred to as a cap shape.

  3 is a cross-sectional view of the conductive coating material 10A side of FIG. 1A, for example, and corresponds to a cross section taken along line YY in FIG. 1B.

  Referring to FIG. 3, the first surface portion 91 of the conductive coating material 10 is in contact with and covers the second main surface S <b> 12 (opposite surface of the first main surface S <b> 11) of the first substrate 1. Become. Further, the h surface and the i surface become a second covering portion 92 that comes into contact with and covers the first main surface S21 of the second substrate 6 (the surface facing the second main surface S22).

  The b surface connects the first covering portion 91 (a surface) and the second covering portion 92 (h surface, i surface) and continues the side surfaces (end surfaces in the thickness direction) of the first substrate 1 and the second substrate 6. The third covering portion 93 is covered.

  The c-plane, d-plane, and e-plane are bent so as to circulate inside the conductive coating material 10, and the e-plane is exposed from the second substrate 6 and provided on the first main surface S11 of the first substrate 1. Further, it is fixed to a part of the first wiring 17 (first wiring connecting portion 7) by, for example, the conductive fixing material 20. That is, the e-plane becomes a connection portion 11 that is electrically connected to the first wiring connection portion 7. Here, only the e-plane substantially contacts the first wiring connecting portion 7 here, but in this embodiment, the e-plane is supported separately from the first covering portion 91 to the third covering 93 portion. It is set as the connection part 11 also including c surface and d surface. In addition, the conductive fixing material 20 means an adhesive (fixing) material that can be electrically connected here, and the fixing by the conductive fixing material 20 means lead-free solder, conductive paste, conductive adhesive, or the like. Supplying and fixing the electrical connection possible through these.

  Here, as an example, as shown in FIG. 2, a case where a single T-shaped metal plate is assembled to form the cap-shaped conductive coating material 10 is shown, but the final shape is similar to FIG. A connecting portion 11 (c-plane, d-plane and d-plane which is electrically connected to the covering portion inside the covering portion (a pentahedron composed of a-plane, b-plane, f-plane, g-plane, h-plane and i-plane) The assembling method is not limited to this as long as the structure is provided with (e surface). For example, it may be assembled from a plurality of metal plates, or may be integrally formed by a mold or the like. Further, the h-plane or i-plane may be one surface having the same area as the a-plane, or may have a structure in which the h-plane and i-plane are overlapped with each other in the same area as the a-plane.

  As described above, the conductive coating material 10 has a cap-shaped coating portion that integrally covers the end portions of the first substrate 1 and the second substrate 6, and the first wiring connection portion of the organic light emitting panel 50 is provided on the inside thereof. 7 is provided. That is, the conductive coating material 10 functions as a metal cap type external connection terminal of the organic light emitting panel 50. Therefore, in the following description, the conductive coating material 10 may be referred to as an external connection terminal.

  As shown in FIG. 1, the organic light emitting panel 50 includes a first wiring 17 connected to the anode (first electrode 2) of the organic light emitting element 5 and a second wiring 18 connected to the cathode (second electrode 4). 3 is the first external connection terminal 10A for anode provided on one side of the organic light emitting panel 50, and the same applies to the other side of the organic light emitting panel 50 facing this. The second external connection terminal 10B (conductive coating material 10) for the cathode having the shape of is provided (see FIG. 1A). The second external connection terminal 10 </ b> B has a cover portion whose outer shape is a cap shape and a connection portion 11 provided therein, and the connection portion 11 is the second substrate 6 on the first main surface S <b> 11 of the first substrate 1. Is connected to a part of the second wiring 18 (second wiring connection portion 8) provided in the region exposed from.

  The conductive coating material 10 of the present embodiment is inserted from the side surfaces of the first substrate 1 and the second substrate 6 and integrally covers them. That is, the thickness D between the first covering portion 91 and the second covering portion 92 (the distance between the inner walls of the a surface and the i surface) is equal to the sum of the thickness D1 of the first substrate 1 and the thickness D2 of the second substrate 6. That's it. More specifically, the conductive coating material 10 includes the thickness (the second main surface of the first substrate 1) of both substrates (the first substrate 1 and the second substrate 6) after the organic light emitting element 5 is contained and sealed. Enables smooth insertion into the end portions of both substrates in the thickness from S12 to the first main surface S21 of the second substrate 6 (for example, it is possible to insert the external connection terminal 10 without deforming it as an outer shape). ) It has a thickness D (shape) that ensures a minimum clearance.

  The connecting portion 11 has an appropriate dimension so that the e-plane can be electrically connected (contacted) with the first wiring connecting portion 7 (second wiring connecting portion 8) with the conductive covering material 10 inserted. It is bent.

  The end portion of the first covering portion 91 is fixed to the second main surface S12 of the first substrate 1 by a sealing material (insulating resin adhesive) 22, and the end portion of the second covering portion 92 is fixed to the sealing material 22. Due to this, it is fixed to the first main surface S21 of the second substrate 6.

  The conductive coating material 10 integrally covers the first substrate 1 and the second substrate 6. In other words, since the structure is to be inserted into two substrates, when the thickness of one substrate is the same, compared to a structure in which only one substrate is sandwiched (for example, FIG. 13), the mechanical destruction on the substrate side is prevented. Strength can be increased.

  For example, the magnitude of the bending stress indicating the mechanical characteristics is inversely proportional to the square of the thickness in the direction in which the stress acts, and the deflection is inversely proportional to the cube of the thickness. In other words, the greater the thickness, the smaller the bending stress and the deflection. If the thickness is simply doubled with two substrates, the bending stress is four times stronger and the deflection is eight times stronger.

  Further, since the conductive coating material 10 also serves as a support member for the substrate, mechanical destruction of the first substrate 1 and the second substrate 6 can be achieved by providing the coating width W wide (so wide as not to reach the light emitting region ER). Therefore, it is preferable because it can secure the strength against the above.

  Furthermore, the conductive coating material 10 of the present embodiment has a thickness D (shape) that can be smoothly inserted into the ends of both substrates (for example, can be inserted without deforming the conductive coating material 10 as an outer shape). Have. That is, it can be inserted without applying a load to both substrates. Then, the conductive coating material 10 is fixed to the first substrate 1 and the second substrate 6 by the sealing material 22. Therefore, it is not necessary to provide a clip-like spring property (with an elastic stress) as in the prior art so as to apply a predetermined pressing force to the substrate. Therefore, stress on both substrates due to the mounting of the conductive coating material (external connection terminal) 10 can be reduced.

  Further, since the first covering portion 91 and the second covering portion 92 that are substantially flat surfaces are inserted into the second main surface S12 of the first substrate 1 and the first main surface S21 of the second substrate 6 that are flat surfaces, Insertion is also easy.

  For these reasons, it is possible to greatly suppress the breakage of the substrates (the first substrate 1 and the second substrate 6) during the manufacturing process of the organic light emitting panel 50 and when the end user handles the organic light emitting panel. Will improve.

  Further, the conductive coating material 10 and the substrate are fixed by a sealing material 22. The sealing material 22 is the same material as the sealing material 21 that fixes the first substrate 1 and the second substrate 6 together. Thereby, the inside of the conductive coating 10 can be sealed. Accordingly, both the main portions of the joint CP (e surface connected to the first wiring connection portion 7) that are substantially fixed portions between the first wiring connection portion 7 (second wiring connection portion 8) and the connection portion 11 (e surface). Surface and its surroundings) can be sealed in the conductive coating 10. As a result, the joint CP is not exposed to the outside, so that even when used for a long period of time, corrosion of these metals and entry of moisture can be prevented, and deterioration of reliability can be prevented.

  Here, an example of a method for manufacturing the organic light emitting panel of the present embodiment will be described mainly focusing on a connection method between the connection portion 11 and the first wiring connection portion 7. The same applies to the second wiring connection portion 8 side.

  First, the first wiring 17 including the first wiring connection portion 7 and the second wiring 18 including the second wiring connection portion 8 are patterned on the first main surface S11 of the first substrate 1, and an organic light emitting device is formed by a known method. 5 are stacked and sealed with the second substrate 6 (see FIGS. 1B and 1C).

  Thereafter, the conductive coating material 10 is inserted into opposite ends of the first substrate 1 and the second substrate 6 to connect the connecting portion 11 to the first wiring connecting portion 7 and the second wiring connecting portion 8, respectively.

  In the first method of connection, in the state of the metal plate in FIG. 2 (A), a lead-free solder plating layer is formed in advance as a conductive fixing material 20 on the e surface to be the connection portion 11, and then assembled into a cap shape. A conductive coating material 10 is prepared.

  Then, as shown in FIG. 3, the conductive coating material 10 (10 </ b> A) is inserted into the end portion of the organic light emitting panel 50 on the first wiring connection portion 7 side so as to integrally cover the first substrate 1 and the second substrate 6. At this time, the conductive coating material 10 can be inserted with almost no deformation of its outer shape, and the first wiring connection portion 7 and the connection portion 11 (e surface) come into contact with each other. And the conductive coating | covering material 10 is heated from the outside in the state which contact | abutted the 1st wiring connection part 7 and the connection part 11 (e surface), and the plating layer of a lead-free solder is melted and fixed.

  In the second method, a conductive paste (for example, silver (Ag) paste or lead-free solder paste) is applied as the conductive fixing material 20 to the first wiring connection portion 7 side of the e-plane. Then, after assembling into a cap shape, the conductive coating material 10 (10A) is inserted so as to integrally cover the first substrate 1 and the second substrate 6 on the first wiring connection portion 7 side of the organic light emitting panel 50. And it heats in the state which the 1st wiring connection part 7 and the connection part 11 (e surface) overlapped, a conductive paste is fuse | melted and it adheres.

  The third method is a case where a conductive adhesive (for example, a resin adhesive material mixed with a conductive material) is used as the conductive fixing material 20, and is substantially the same as the second method described above. In some cases, heat treatment for melting is unnecessary.

  After the first wiring connection portion 7 and the connection portion 11 are connected by such a method and the electrical connection is confirmed, the conductive coating material 10, the first substrate 1, and the second substrate 6 are bonded using the sealing material 22. The joint CP between the connection portion 11 (e surface) and the first wiring connection portion 7 is sealed inside the conductive coating material 10. To do.

  It is preferable that the process from the insertion process of the conductive coating material 10 to the sealing process by the sealing material 22 is performed in an inert gas atmosphere such as nitrogen. Accordingly, it is possible to prevent adhesion of moisture or a substance related to metal corrosion when the conductive coating material 10 is attached (particularly to the connection portion 11 and the vicinity thereof).

  Further, when a low-priced metal plate is used, it is also preferable to subject the connecting portion 11 (from the c surface to the e surface) to rust prevention or low contact resistance. For example, when a copper (Cu) plate is used, gold (Au) plating treatment may be performed for rust prevention. In this case, the connection part 11 is fixed by the second or third method.

  Next, a second embodiment will be described with reference to FIG. The second embodiment is different from the first embodiment in the configuration of the connecting portion 12.

  The connecting portion 12 of the second embodiment is bent (folded) so that the first wiring connecting portion 7 can be elastically deformed. That is, the first wiring connection portion 7 (the same applies to the second wiring connection portion 8) is pressed in the direction of the thickness D1 of the first substrate 1 by the spring-like connection portion 12, thereby electrically connecting the two. The connecting portion 12 only needs to be electrically connected to the first wiring connecting portion 7 and is not for pressing the first substrate 1. That is, as the pressing force, a (small) force that can maintain a constant contact (contact) between the e-plane and the first wiring connection portion 7 at the joint portion CP is sufficient.

  The conductive coating material 10 is fixed to the first substrate 1 and the second substrate 6 with the sealing material 22 as in the first embodiment, and the connecting portion 12 is sealed in the conductive coating material 10.

  The cross-sectional shape of the connecting portion 12 does not have to be a shape in which a plurality of planes are clearly recognized as shown in FIG. In this case, for example, the entire c-plane is electrically connected to the first wiring connection portion 7 with a curved surface. In other words, the connection portion of the conductive coating material 10 is conductive so that the joint portion CP with the first wiring connection portion 7 (second wiring connection portion 8) is sealed inside the conductive coating material 10. What is necessary is just the conductor provided inside the coating | covering material 10 (coating part).

  Thereby, the connection part 12 and the 1st wiring connection part 7 can be connected, without using a conductive adhering material, only by inserting the electroconductive coating | covering material 10 in the edge part of the 1st board | substrate 1 and the 2nd board | substrate 6, and conductive The process for supplying the adhesive fixing material (plating treatment) and the melt fixing process are not required. Since the configuration other than this is the same as that of the first embodiment, a description thereof will be omitted.

  In the second embodiment, a conductive fixing material may be further used for connection between the connection portion 12 and the first wiring connection portion 7.

  As mentioned above, although the connection part 11 of 1st Embodiment and the connection part 12 of 2nd Embodiment showed as an example the case where the bending process was performed so that a part of electroconductive coating | covering material 10 might be circulated, the 1st The shape of the bending process is not limited to that shown in the drawing, for example, a bellows-like folding shape as long as it can be electrically connected to the one wiring connection portion 7. Alternatively, the connecting portion may be formed of a conductive material such as a T-shape that is separate from the second covering portion 92 and fixed to the second covering portion 92. Further, the c-plane may not be included in the connecting portion 11, and for example, a configuration in which the d-plane and the e-plane protrude from the second covering portion 92 (i-plane, h-plane) may be used.

  That is, the shape of the conductive coating material 10 is composed of cap-shaped coating portions (a surface, b surface, f surface, g surface, h surface, and i surface) that integrally cover the first substrate 1 and the second substrate. The connecting portion 11 that is electrically connected to the covering portion may be provided on the inner side of the pentahedron. The planar development shape and the assembling method are not limited to those shown in FIGS. 2, 3, and 4. The b surface may be a curved surface.

  Next, a third embodiment of the present invention will be described with reference to FIGS. 5A and 5B are diagrams showing an organic light emitting panel 51 according to the third embodiment. FIG. 5A is a plan view of the organic light emitting panel 51, and FIGS. 5B to 5D are FIGS. ) Of the Z1-Z1 line, the Z2-Z2 line, and the Z3-Z3 line, respectively, and the illustration of the conductive coating material 10 is omitted.

  Referring to FIG. 5, the organic light emitting panel 51 is provided with a first wiring connection portion 7 for anode and a second wiring connection portion 8 for cathode on one end (one side) side of the first substrate 1. More specifically, for example, the first wiring 17 is provided in a comb shape in a plan view. The plurality of comb teeth of the first wiring 17 extend along the short side of the rectangular first substrate 1, and one end thereof is connected by a connecting portion extending along the long side of the first substrate 1. The The first wiring connection portion 7 is provided by exposing a part of the first wiring 17 outside the sealing material 21 on one short side.

  On the other hand, the second wiring 18 is arranged linearly along the long side opposite to the long side where the first wiring 17 is arranged, and on the one short side of the first substrate 1, the outer side of the sealing material 21. The second wiring connection portion 8 is provided by exposing a part of the second wiring 18. Thus, the first wiring connection portion 7 and the second wiring connection portion 8 are arranged side by side on one short side of the first substrate 1 exposed from the second substrate 6. A structure in which an organic light emitting element 5 in which a first electrode 2, an organic EL layer 3 and a second electrode 4 are stacked is provided on a first substrate 1 (on the lower side in the drawing) and sealed by a second substrate 6 (FIG. 5 ( C) is the same as the organic light emitting panel 50 of the first embodiment.

  FIGS. 6A and 6B are perspective views for explaining the conductive coating material 15 according to the third embodiment. FIGS. 6A and 6B are perspective views of the conductive coating material 15, and FIG. FIG. 3 is a perspective view of an organic light emitting panel 51 with a conductive covering material 15 attached. 6 (A) and 6 (B), the left figure and the right figure are different views of the same structure, the left figure is a perspective view as seen from above the a-plane, and the right figure is It is the perspective view seen from the lower side of h surface or i surface. FIG. 6B is a diagram showing the insulation reinforcing plate 15C of FIG.

  6 (A) and 6 (B), there are two conductive coating materials 15 (first conductive coating materials 15A, 15A, and B) according to the sizes of the first wiring connection portion 7 and the second wiring connection portion 8. A second conductive coating material 15B) is provided. The first conductive covering material 15A is obtained, for example, by assembling a metal plate having a pattern in which the f surface and the h surface are omitted from the metal plate shown in FIG. Has a shape obtained by omitting the opposing surface of the b surface and the opposing surface of the g surface from the six surfaces constituting the rectangular parallelepiped, that is, a cap shape including the a surface, the b surface, the i surface, and the g surface.

  In the present embodiment, the length of the long side from the a-plane to the e-plane shown in FIG. 2A is shorter than that in the first embodiment. That is, in the first embodiment, these lengths are equivalent to one side (short side) of the first substrate 1, but in this embodiment, the length of the short side of the first substrate 1 is, for example, The length is less than half. The configuration of each surface other than this is the same as that of the first embodiment.

  The second conductive coating material 15B is obtained by assembling a metal plate having a pattern in which the g-plane and i-plane are omitted from the metal plate shown in FIG. The outer shape has a shape in which the opposing surface of the b surface and the opposing surface of the f surface are omitted from the six surfaces constituting the rectangular parallelepiped, that is, a cap shape including the a surface, the b surface, the h surface, and the f surface. Except this, it is the same as the first conductive coating material 15A.

  The first conductive coating material 15A and the second conductive coating material 15B are attached to both ends of one insulating reinforcing plate 15C. The insulating reinforcing plate 15C is, for example, a bake substrate, a glass epoxy substrate, or a plastic material. The insulating reinforcing plate 15 </ b> C has a length L <b> 1 equal to the side length L <b> 2 where the first wiring connection portion 7 of the organic light emitting panel 51 is provided, and the thickness D <b> 3 is substantially equal to the thickness D <b> 2 of the second substrate 6. And, for example, it has a rectangular parallelepiped (column) shape in which the connection portion 11 composed of the c-plane, d-plane, and e-plane in FIG.

  Then, as shown in FIG. 6C, the conductive coating material 15 is attached to the end portions of one side of the first substrate 1 and the second substrate 6.

  The enlarged cross-sectional view of the end is the same as FIG. 3A, but in the third embodiment, the separated first conductive coating material 15A and second conductive coating material 15B are held by an insulating reinforcing plate 15C. Is done. 3A, the area of the second substrate 6 is smaller than that of the first substrate 1, and a gap equivalent to the thickness D2 of the second substrate 6 is generated in the cross-sectional structure. In this embodiment, the connection part 11 (c surface, d surface, and e surface) that covers the periphery of the first substrate 1 and the second substrate 6 while filling the gap between the first substrate 1 and the second substrate 6 with the insulating reinforcing plate 15C is the first wiring connection portion. 7 and the second wiring connection portion 8 can be joined. That is, an appropriate shape (size) for filling the gap and joining the first wiring connection portion 7 and the second wiring connection portion 8 is appropriately selected as the shape of the insulating reinforcing plate 15C. Thereby, the first conductive coating material 15A and the second conductive coating material 15B can be easily and accurately mounted.

  In addition, it is good also as a structure which wraps the connection part 11 comprised by c surface, d surface, and e surface in an insulating reinforcement board in 1st Embodiment.

  When the insulating reinforcing plate 15C is not used, it is preferable to fill the space between the first conductive coating material 15A and the second conductive coating material 215B with a sealing material having both insulating properties and waterproof properties.

  A plurality of conductive coating materials 15 are arranged apart from each other and supported by an insulating reinforcing plate or filled between them with a sealing material, whereby the first wiring connection portion 7 and the second wiring connection portion 8 are provided. This is not limited to a structure in which the two are concentrated on one side, and the same can be applied to the case where they are scattered around the substrate. Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. 7A and 7B show the case where the second substrate 6 serving as the sealing substrate is a transparent insulating film or solid layer.

  Referring to FIG. 7A, in the case of an insulating film, for example, polyethylene terephthalate (PET) or acrylic resin is highly waterproof / gas-proof coated and the thickness D2 is the first substrate. It is thinner than 1, for example, about 0.1 mm. In the case of a solid layer, for example, a layer of silicon oxide (SiOx), silicon nitride (SiNx) or the like has a thickness D2 of, for example, about 2 μm to 10 μm.

  In addition, the conductive coating material 10 has a configuration in which the e-plane and the d-plane are omitted from the metal plate shown in FIG. 2, and in this case, the c-plane is connected to the first wiring connection portion 7 (the same applies to the second wiring connection portion 8 side). It becomes the connection part 13. The connecting portion 13 is electrically connected to the first wiring connecting portion 7 (the same applies to the second wiring connecting portion 8 side) through the conductive fixing material 20.

  Other configurations are the same as those in the first embodiment. Thus, even if the connecting portion 13 does not have a structure protruding upward from the i-plane (even if it is a flat plate overlapping the second covering portion 92), the i-plane and the c-plane that is the connecting portion are overlapped, The joint portion CP (both main surfaces of the c surface connected to the first wiring connection portion 7) is sealed inside the conductive coating material 10.

  Further, when an insulating film is used for the second substrate 6, its thickness D2 is generally smaller than that of glass and has flexibility, so that the conductive coating 10 is handled in a structure taught in a clip shape, for example. Is difficult. However, in this embodiment, the conductive coating material 10 is equal to or greater than the total thickness of the thickness D1 of the first substrate 1 and the thickness D2 of the second substrate 6, and is smoothly inserted into the end portions of the first substrate 1 and the second substrate. It has a thickness D (shape) that secures a minimum clearance that enables the above. For this reason, the handling at the time of attachment of the electroconductive coating | covering material 10 becomes easy.

  In FIG. 7B, a third substrate 9 is further provided in the structure of FIG. For example, when an insulating film having a thin thickness D2 or a solid layer having a very thin thickness D2 is employed for the second substrate 6 in the structure of FIG. You may reinforce by providing the 3rd board | substrate 9 which contact | abuts to this. The third substrate 9 is made of, for example, a plastic material such as PET, acrylic resin or polyvinyl chloride, or a metal plate (aluminum or stainless steel) that is coated with insulation, and has a thickness D3 of about 0.3 mm, and the second main surface S32. Comes into contact with the first main surface S21 of the second substrate 6.

  In this case, the second covering portion 92 of the conductive covering material 10 abuts on the first main surface S31 of the third substrate 9, and these are fixed by the sealing material 22. As a result, the joint portion CP between the first wiring connection portion 7 (the same applies to the second wiring connection portion 8 side) and the connection portion 13 (c surface) is sealed inside the conductive coating material 10.

  7C is inserted from the side surfaces of the first substrate 1, the second substrate 6, and the third substrate 9, and integrally covers them. In other words, the conductive coating material 10 has the thickness (the second main surface of the first substrate 1) of the three substrates (the first substrate 1, the second substrate 6, and the third substrate 9) after sealing the organic light emitting element 5. (Thickness from S12 to the first main surface S31 of the third substrate 9) has a thickness D (shape) that secures a minimum clearance that enables smooth insertion into the ends of both substrates. As a result, as in the first embodiment, the substrate is prevented from cracking or chipping when the conductive coating material 10 is attached, and the ease of handling by the end user is improved.

  Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

  In addition, you may comprise the 1st board | substrate 1 also by said insulating film or a solid layer.

  With reference to FIGS. 8 to 11, lighting devices 70, 71 and 72 using the organic light emitting panels 50 and 51 will be described.

  FIG. 8 is a perspective view illustrating a lighting device 70 according to the fifth embodiment and a method for attaching the organic light emitting panel 50 according to the first or second embodiment to the lighting device 70.

  The lighting device 70 includes the organic light emitting panel 50 according to the first embodiment, a holding portion (socket) 61 (61A, 61B), and a holding substrate 62. The holding substrate 62 and the holding portion 61 are made of, for example, an acrylic resin material or a plastic material, and are arranged and fixed so that the two holding portions 61 face one main surface of the holding substrate 62. The holding portion 61 may be prepared and fixed separately from the holding substrate 62, or may be formed integrally. When the holding unit 61 is separated from the holding substrate 62, the holding unit 61 may be made of a metal material.

  The holding portions 61A and 61B are respectively in positions corresponding to the first external connection terminal 10A and the second external connection terminal 10B of the organic light emitting panel 50, that is, along two opposing sides of the organic light emitting panel 50. It is provided and holds the organic light emitting panel 50.

  The holding substrate 62 contains wiring (not shown) for supplying power to the holding unit 61 and a desired control circuit (not shown).

  Each of the holding portions 61 is an opening that is detachable by sandwiching the first substrate 1 and the second substrate 6 of the organic light emitting panel 50 in the thickness D direction and moving (sliding) the light emitting surface ES of the organic light emitting panel 50 in the horizontal direction. Part OP is provided. That is, each of the two holding portions 61 has one side surface in the longitudinal direction and two side surfaces in the short direction adjacent to each other when the shape is a rectangular parallelepiped shape having six surfaces (both ends in the slide direction (front and back)). 3 sides are opened, and an opening OP is provided in a U-shape as a side shape seen from the direction of the arrow in FIG. A pressing member 63 is provided on the inner wall of the holding portion 61. The pressing member 63 is, for example, a leaf spring. The pressing member 63 may be a resin (for example, rubber) that has a certain amount of pressing force and is elastically deformable. The opening height h2 of the opening OP is larger than the thickness D of the organic light emitting panel 50, and thus the organic light emitting panel 50 can be smoothly attached and detached by moving in the horizontal direction with respect to the light emitting surface ES.

  On the other hand, after the organic light emitting panel 50 is attached (see FIG. 8B), the margin is increased, so that the pressing is performed by the pressing member 63 to prevent erroneous dropping. The pressing member 63 may be provided on the inner wall of the upper surface 61 u of the holding portion 61.

  In this embodiment, the cap-like external connection terminals 10 that collectively cover the two substrates (the first substrate 1 and the second substrate 6) of the organic light emitting panel 50 increase the mechanical strength of the substrate. Thus, the substrate can be prevented from being damaged when being attached to or detached from the lighting device.

  Further, the outer surface of the external connection terminal 10 is a flat surface and can be easily and smoothly mounted by moving the organic light emitting panel 50 horizontally.

  In the illustrated case, the organic light emitting panel 50 is pressed upward by the pressing member 63 and comes into contact with the upper surface 61 u of the holding portion 61. A connection end of a power supply line is provided on the upper surface 61u, and is connected to a power supply device (power supply device) (not shown) through the connection end. Of the two, the holding portion 61A in contact with the first external connection terminal 10A is connected to the anode power supply line, and the holding portion 61B in contact with the second external connection terminal 10B is connected to the cathode power supply line. In addition, you may provide the connection end of an electric power feeding line in the press member 63. FIG.

  The holding substrate 62 is attached to an indoor ceiling, wall surface, or the like. In addition, a leg portion may be provided at one end of the holding substrate 62 to be a self-supporting type.

  With reference to FIG. 9, the illuminating device 71 provided with the organic light emitting panel 51 of 2nd Embodiment is demonstrated as 6th Embodiment. In this case, the connecting ends of the anode and cathode feeding lines are arranged in the holding portion 61A that holds one end of the organic light emitting panel 51 provided with the external connection terminals 15 (15A, 15B). For the insulation between the first external connection terminal 15A and the second external connection terminal 15B, the holding portion 61A is provided with two separate pressing members 63A and 63B. The connection ends of the power supply lines for the anode and the cathode may be disposed respectively on these. In addition, when comprising a pressing member with an insulating material, it is good also as one continuous pressing member.

  The other holding portion 61B has the same outer shape as the holding portion 61A, but does not require a connection end of the power supply line, and holds the other end portion of the organic light emitting panel 51. Since the other configuration is the same as that of the lighting device shown in FIG.

  With reference to FIG. 10, the illuminating device 72 of 7th Embodiment is demonstrated. FIG. 10A is a plan view of the organic light emitting panel 50 used in the illumination device 72 of the seventh embodiment, FIG. 10B is a perspective view of the holding portion 61 (61A, 61B), and FIG. 10C. FIG. 10D is a side view of the holding unit 61A viewed from the viewpoints V1, V2, and V3, and FIG. 10D is a side view of the holding unit 61B viewed from the viewpoints V1, V2, and V3. The viewpoint V2 is a viewpoint from the opening OP side of each of the holding portions 61A and 61B.

  The illuminating device 72 includes reverse insertion preventing means and popping prevention means for the organic light emitting panel 50.

  The organic light emitting panel 50 has a substantially symmetrical structure in a plan view, and if the direction of mounting (inserting) on the holding portion 61 is mistaken, the first external connection terminal 10A that is an anode and the second external connection terminal 10B that is a cathode are formed. There is a possibility that the holding portion 61 is connected in the opposite direction to the connection ends of the anode power supply line and the cathode power supply line.

  In order to prevent this, as shown in FIG. 10 (A), a reverse difference for preventing misidentification of the insertion direction when the organic light emitting panel 50 is attached to or detached from one external connection terminal 10 (for example, the first external connection terminal 10A). An anti-shrink protrusion 81 is provided.

  Referring to FIG. 10B, each of the two holding portions 61 has a rectangular parallelepiped-shaped one side surface in the longitudinal direction and one side surface in the lateral direction adjacent thereto (one end in the sliding direction ( It has a shape in which the opening OP is provided so that the two surfaces (the front side surface) are opened, that is, the side surfaces 61AS and 61BS at the other end (the back side) in the sliding direction are not opened.

  Referring to FIGS. 10C and 10D, a reverse insertion preventing groove 82 into which the reverse insertion preventing projection 81 is fitted is provided only on the side surface 61AS of the holding portion 61A that holds the first external connection terminal 10A. The side surface 61BS of the holding portion 61B that holds the second external connection terminal 10B is a flat surface.

  Further, a stepped portion 83 is provided on the holding substrate 62 at the end of the opening OP in the short direction of the two holding portions 61A and 61B. The step portion 83 is obtained by projecting the surface of the holding substrate 62 in the thickness direction of the holding substrate 62. The distance L3 of the lower flat surface (the lower surface 61d of the holding portion 61) of the step portion 83 is slightly longer than the length L2 of the organic light emitting panel 50 (here) in the short side direction, and the reverse insertion preventing protrusion in the short side direction. It is shorter than the length L4 of the longest part including the part 81.

  Referring to FIG. 11, organic light emitting panel 50 is slid in the direction of the arrow to hold first external connection terminal 10A and second external connection terminal 10B by holding portions 61A and 62B, respectively. At this time, the distal ends (back end portions) of the first external connection terminal 10A and the second external connection terminal 10B are in contact with the side surfaces 61AS and 61BS of the holding portions 61A and 61B, respectively, and forward (back). Is blocked. In this state, the organic light emitting panel 50 is disposed so as to abut on the lower surface 61d of the holding portion 61 (pressed in the direction of the lower surface 61d by the pressing means 63), whereby the first external connection terminal 10A and the second external connection are connected. The rear end (front end) of the terminal 10B in the sliding direction is housed inside (lower side) the stepped portion 83, respectively. The organic light emitting panel 50 held in this way can be prevented from being erroneously detached (protruded) by restricting the movement of the rear end of the external connection terminal 10 in the sliding direction by the step portion 83. The length L3 of the lower surface 61u of the holding portions 61A and 61B is longer than the length L2 of the organic light emitting panel 50 but shorter than the length L4 of the longest portion, and the margin is in a state where the organic light emitting panel 50 is held. It shall be so small that it cannot be slid horizontally.

  Further, when the organic light emitting panel 50 is inserted into the holding portion 61 with the left and right sides reversed from the plan view of FIG. 10A (reversely inserted), the reverse insertion preventing projection 81 comes into contact with the flat side surface 61BS. The rear end of the first external connection terminal 10A in the sliding direction cannot be stored inside (lower side) of the step part 83 (on the holding part 61B side). Thereby, reverse insertion can be recognized and it can prevent that it supplies with electricity in the reverse insertion state. Note that this makes it impossible to store and hold the holder 61 in the holding portion 61 even when it is inserted upside down in the plan view of FIG.

  Further, by providing a switch (not shown) in the reverse insertion prevention groove 82 and attaching a mechanism for turning on the power only when the reverse insertion prevention protrusion 81 is properly inserted into the reverse insertion prevention groove 82, organic light emission In an unstable state in which the panel 50 is forcibly inserted, it is possible to prevent an electric shock accident when the organic light emitting panel 50 is broken or erroneously attached due to reverse voltage application.

  When removing the organic light emitting panel 50, one end of the organic light emitting panel 50 is pushed up in the direction of the upper surface 61u of the holding portion 61 and is slid in the direction opposite to the arrow.

  Further, the stepped portion 83 can prevent the organic light emitting panel 50 from popping out after being mounted.

  Thereby, it is possible to provide an illuminating device that can be easily replaced by an end user who has no knowledge, as in the case of replacing the bulb.

  As described above, the lighting device 72 according to the present embodiment is provided with the reverse insertion preventing protrusion 81 on one external connection terminal of the organic light emitting panel 50, and the side surface 61AS (or 61BS) on the abutting side of the holding portion 61 corresponding thereto. In the organic light emitting panel 50, a reverse insertion preventing groove 82 in which the protrusion fits is provided, and these are not provided on the side surface 61BS (or 61AS) on the abutting side of the holding portion 61 on the other external connection terminal side. Insertion by flipping horizontally or flipping upside down (insertion when the anode / cathode is reversed or when the organic light emitting panel 50 is turned upside down) is disabled, and the organic light emitting panel 50 is erroneously detached from the holding unit 61. Is to avoid.

  Therefore, the shapes and sizes of the reverse insertion preventing projection 81, the reverse insertion preventing groove 83, and the stepped portion 83 are not limited to those shown in the drawing, and are appropriately selected so that erroneous insertion can be prevented.

  In the above embodiment, when the development view of FIG. 2 (A) is assembled, the end portions of the i-plane and the h-plane are shown as an example. However, they overlap each other. It may be formed as follows. In the case of the structure of FIGS. 3 and 4, the i-plane and the h-plane do not necessarily overlap. That is, in these cases, even when the i-plane and the h-plane do not overlap and the tip is separated, the cap shape is maintained by overlapping with the c-plane, and the connecting portions 11, 12, 13 are inside the covering portion. Can be sealed. On the other hand, in the case of the structure shown in FIG. 7, the c-plane, that is, a part of the joint CP is exposed to the outside. It is good to form so that it may overlap.

As described above, in the present embodiment, the case where the cap-like external connection terminals 10 and 15 are provided along the short sides of the organic light emitting panels 50 and 51 has been described as an example, but along the long sides of the organic light emitting panels 50 and 51. It may be provided. Of course, in that case, the holding unit 61 of the lighting device is provided so as to hold these along the long sides of the organic light emitting panels 50 and 51.

  Further, the lighting devices 70, 71, and 72 have been described by taking the case where the holding unit 61 is provided on the main surface of the holding substrate 62 as an example, but the holding substrate 62 may be a part of a wall surface or a ceiling surface. Moreover, the structure by which the holding | maintenance part 61 of this embodiment is embedded in a part of wall surface or a ceiling surface may be sufficient.

1 First substrate
5 Organic light emitting devices
6 Second board
7 First wiring connection
8 Second wiring connection
10, 10A, 10B, 15, 15A, 15B External connection terminal
11, 12, 13 connection part
50, 51 Organic light-emitting panel
61 Holding part
70, 71, 72 Lighting device
CP junction

Claims (13)

A first substrate;
An organic light emitting device provided on the first substrate and having a first electrode, an organic light emitting layer, and a second electrode;
A second substrate disposed opposite to the first substrate and sealing the organic light emitting device;
A wiring portion disposed on a peripheral portion of the first substrate exposed from the second substrate and connected to the first electrode and the second electrode,
A conductive coating covering the ends of the first substrate and the second substrate; and
The conductive coating material is provided with a connecting portion on the inside, and the connecting portion is electrically connected to the wiring portion.   The conductive covering material has a first covering portion, a second covering portion, and a third covering portion, the first covering portion is in contact with the main surface of the first substrate, and the second covering portion is the second covering portion. The third covering portion is in contact with the main surface of the substrate, and the third covering portion connects the first covering portion and the second covering portion to continuously cover the side surfaces of the first substrate and the second substrate. The organic light emitting panel according to claim 1.   3. The conductive covering material is formed by molding a metal material into a cap shape and integrally covers at least one end of each of the first substrate and the second substrate. Organic light-emitting panel as described in 2.   4. The organic light-emitting panel according to claim 1, wherein a thickness of the conductive coating material is equal to or greater than a total thickness of the first substrate and the second substrate. 5.   The organic light emitting panel according to claim 1, wherein the connection portion is fixed to the wiring portion with a conductive fixing material.   The organic light emitting panel according to any one of claims 1 to 5, wherein the connection portion is formed by processing a metal material so as to be elastically deformable, and presses the wiring portion toward the first substrate.   The organic light-emitting device according to any one of claims 1 to 6, wherein the first covering portion and the second covering portion are fixed to the first substrate and the second substrate with a sealing material, respectively. panel.   A third substrate abutting on the second substrate, wherein the conductive coating material comprises a first coating portion contacting the main surface of the first substrate and a second coating contacting the main surface of the third substrate; The organic light emitting panel according to claim 1, wherein the first covering portion and the second covering portion are fixed to the first substrate and the third substrate with a sealing material, respectively. An organic light emitting panel according to any one of claims 1 to 8,
A holding part for holding the organic light emitting panel in contact with the conductive coating;
And a wiring for supplying power to the holding portion.   The lighting device according to claim 9, further comprising a holding substrate on which the holding unit is fixed and the wiring is provided.   11. The holding unit is provided along two opposing sides of the organic light emitting panel, and an opening is provided that is detachable by moving a light emitting surface of the organic light emitting panel in a horizontal direction. The lighting device described in 1.   The lighting device according to claim 10 or 11, wherein the organic light-emitting panel is provided with a protrusion on one side, and the holding part is provided with a groove into which the protrusion is fitted.   The lighting device according to any one of claims 10 to 12, wherein the holding substrate is provided with a step at an end portion of the opening.

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