JP2004309422A - Image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely pickup images of a plate-like substrate and a mounting component, without being affected by an adhesive member. <P>SOLUTION: This image pickup device 50 comprises a plate-like substrate position imaging part 51 for photographing the plate-like substrate 10 fixed with the adhesive member 70 via the first photographing port 53a, and a mounting component position imaging part 52 for photographing the mounting component 20 via the second photographing port 55a. The first and second photographing ports 53a, 55a are arranged coaxially in the plate-like substrate position imaging part 51 and the mounting component position image pickup part 52, and are arranged to photograph the plate-like substrate 10 and the mounting component 20 from the same direction, i.e. a side opposite to a face fixed with the adhesive member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an imaging device that images a plate-shaped base material and a mounted component when positioning a mounted component on a plate-shaped base material to which an adhesive member is fixed and mounting and fixing the mounted component to the adhesive member.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a component mounting apparatus, a plurality of terminals corresponding to each electrode are formed on a plate-like base material on which a plurality of electrodes are formed on one surface and an adhesive member is fixed so as to cover these electrodes. 2. Description of the Related Art There has been known a device in which mounting components formed on a surface are aligned and attached to an adhesive member. Such a component mounting apparatus is provided with a camera which is an imaging device for imaging the plate-shaped base material and the mounted component when aligning the plate-shaped base material and the mounted component.
[0003]
As the component mounting apparatus, the display panel and the chip are positioned and fixed at a distance so as not to overlap in the horizontal direction, and the alignment marks of the display panel and the chip are photographed by one camera arranged below them, and There is a method in which a chip is moved to a position directly above a display panel based on a photographing result and positioned, then lowered, pressed and bonded (Patent Document 1).
[0004]
In addition, as the component mounting apparatus, the circuit board is positioned and fixed in parallel with the transparent substrate of the positioned and fixed liquid crystal panel, and the alignment mark of the transparent substrate is fixed by one camera disposed below the transparent substrate. There is a method in which an alignment mark of a circuit board is photographed through a transparent substrate at the same time as photographing, and the circuit board is positioned on a liquid crystal panel based on the photographed result, and then lowered and pressure-bonded (Patent Document 2).
[0005]
[Patent Document 1]
JP-A-9-45728 (pages 3, 4; FIG. 2)
[0006]
[Patent Document 2]
JP-A-11-102932 (page 4, FIG. 3)
[0007]
[Problems to be solved by the invention]
In the component mounting apparatus of Patent Document 1, since the chip is moved directly above the display panel after the alignment mark of the display panel and the chip is photographed by the imaging device, the moving distance for alignment becomes longer, and Since there is an error due to mechanical factors, there is a problem that accurate alignment cannot be performed. Further, in the component mounting apparatus of Patent Document 2, when imaging the alignment mark of the circuit board through the transparent substrate, the imaging apparatus uses an adhesive member (ACF; Anisotropic Conductive Film: ACF) attached to the upper surface of the transparent substrate. Since the photographing is performed through an isotropic conductive film), there is a problem that the alignment mark cannot be clearly photographed by the adhesive member, and the alignment mark cannot be reliably detected.
[0008]
SUMMARY An advantage of some aspects of the invention is to provide an imaging device that reliably captures an image of a plate-shaped substrate and a mounted component without being affected by an adhesive member.
[0009]
Means for Solving the Problems and Actions and Effects of the Invention
In order to solve the above-mentioned problems, a structural feature of the invention according to claim 1 is that a plate-shaped substrate position imaging unit that photographs a plate-shaped substrate through a first photographing port, An image pickup apparatus comprising: a mounted component position imager for photographing, via a second photographing port, a mounted component fixed through an adhesive member fixed to the plate member; , The first and second photographing ports are arranged coaxially, and are arranged so as to photograph the plate-shaped substrate and the mounted component from the same direction.
[0010]
According to this, since the plate-shaped base material and the mounted component positioned so as to face each other in parallel are photographed from the opposite side of the surface on which the adhesive member is provided by the plate-shaped base position imaging unit and the mounted component position imaging unit, respectively. Thus, the plate-shaped base material and the mounted component can be directly photographed without photographing through the adhesive member. Therefore, the positions of the plate-shaped substrate and the mounted component can be reliably detected. In addition, since it is not necessary to move the mounted component directly above the plate-shaped substrate after photographing the plate-shaped substrate and the mounted component, the correction distance for alignment can be kept short, and errors due to mechanical factors can be reduced. Can be suppressed, so that accurate alignment can be achieved.
[0011]
Further, a structural feature of the invention according to claim 2 is that, in claim 1, the plate-shaped substrate position imaging means includes: a first optical system having a first imaging port at a front end; A first camera mounted to capture an image of the plate-like base material through the first imaging port, wherein the mounted component position imaging means includes a second optical system having a second imaging port at a distal end thereof; A second camera attached to the optical system and capturing an image of the mounted component through the second photographing port. The first and second optical systems have a space at each end of the first and second optical systems. And the base ends of the first and second optical systems are integrally connected to form a U-shape.
[0012]
According to this, since the plate-shaped substrate position imaging unit and the mounted component position imaging unit have a U-shaped integrated structure, it is possible to reliably detect the positions of the plate-shaped substrate and the mounted component with a simple configuration. it can. In addition, since the plate-shaped substrate position imaging means and the mounted component position imaging means are formed as an integrated structure, only one moving mechanism for moving them is required, and the entire structure can be simply configured.
[0013]
Further, in the constitution of the invention according to the third aspect, in the first aspect, the plate-shaped substrate position imaging means includes: a third optical system having a first photographing opening at a front end; A third camera mounted to capture an image of the plate-like base material through the first imaging port, wherein the mounted component position imaging means includes a fourth optical system having a second imaging port at a distal end thereof; A third camera attached to the optical system and imaging the mounted component through the second photographing port. The third and fourth optical systems are configured such that each of the distal ends of the third and fourth optical systems has a space. And the base ends of the third and fourth optical systems are integrally connected to form a U-shape.
[0014]
According to this, since the plate-shaped substrate position imaging unit and the mounted component position imaging unit image the positions of the plate-shaped substrate and the mounted component with one camera, a low-cost imaging apparatus can be provided.
[0015]
According to a fourth aspect of the present invention, in the second aspect, the first and second optical systems are provided with first and second lights in the middle of the first and second optical systems. The first and second lights illuminate the plate-like base material and the mounted component from the vertical direction through the first and second photographing ports.
[0016]
According to this, the plate-shaped substrate position imaging means and the mounted component position imaging means reliably illuminate the plate-shaped substrate and the mounted component, so that the plate-shaped substrate and the mounted component can be clearly photographed.
[0017]
According to a fifth aspect of the present invention, in the third aspect, the third and fourth optical systems are provided with first and second lights in the middle of the third and fourth optical systems. The first and second lights illuminate the plate-like base material and the mounted component from the vertical direction through the first and second photographing ports.
[0018]
According to this, the plate-shaped substrate position imaging means and the mounted component position imaging means reliably illuminate the plate-shaped substrate and the mounted component, so that the plate-shaped substrate and the mounted component can be clearly photographed.
[0019]
According to a sixth aspect of the present invention, in the fourth or fifth aspect, a plurality of lights are provided along the periphery of the first and / or second photographing opening, and each of the lights is a plate. To illuminate the substrate and / or the mounted component at an angle.
[0020]
According to this, even when the surfaces of the plate-shaped base material and the mounted component are rough surfaces, the reflected light of the light surely enters the first and second photographing ports, so that the plate-shaped base material and the mounted component are sharp. Can be taken.
[0021]
According to a seventh aspect of the present invention, in the first aspect, the plate-shaped base member position imaging unit and the mounted component position imaging unit are moved in the horizontal direction. That is, a moving means is provided.
[0022]
According to this, after the plate-shaped substrate and the mounted component are photographed by the plate-shaped substrate position imaging unit and the mounted component position imaging unit, the two imaging units can be reliably and easily retracted.
[0023]
According to an eighth aspect of the present invention, in the first aspect, the plate-like base member position imaging unit and the mounted component position imaging unit are moved in the vertical direction. That is, a moving means is provided.
[0024]
According to this, when the plate-shaped substrate and the mounted component are photographed by the plate-shaped substrate position imaging unit and the mounted component position imaging unit, it is possible to reliably and easily focus.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment in which an imaging device according to the present invention is applied to a liquid crystal display device manufacturing apparatus will be described with reference to the drawings. FIG. 1 is a right side view showing the appearance of the liquid crystal display device manufacturing apparatus.
[0026]
The liquid crystal display device manufacturing apparatus A is for positioning and mounting the mounting component 20 on the plate-shaped base material 10, and as shown in FIG. 1, holding and moving the plate-shaped base material 10. A moving device 30, a mounted component holding and moving device 40 for holding and moving the mounted component 20, an imaging device 50 for photographing the positions of the plate-shaped base material 10 and the mounted component 20, and an imaging device for supporting and moving the imaging device 50 And a supporting and moving device 60.
[0027]
As shown in FIG. 2, the liquid crystal display device PL is fixed to the plate-shaped substrate 10, a liquid crystal unit PL <b> 1 provided at the center of the plate-shaped substrate 10, and an edge of the plate-shaped substrate 10 by an adhesive member 70. And a mounting component 20 for driving the liquid crystal unit PL1. The plate-shaped base material 10 is a transparent plate-shaped member (for example, a glass plate), and a plurality of electrodes are formed on one surface. As shown in FIG. 3, a plurality of electrodes 11 are formed at a narrow pitch on the edge of one surface of the plate-shaped base material 10. First and second alignment marks 12 and 13 are formed near these electrodes 11. These alignment marks 12 and 13 are formed in a shape such as a circle and a square. The bonding member 70 is a film-like member (ACF; Anisotropic Conductive Film) made of an anisotropic conductive material.
[0028]
The mounting component 20 is an IC chip in which a plurality of terminals 21 corresponding to each electrode 11 of the plate-shaped base material 10 are formed on one surface. As shown in FIG. 4, the same first and second alignment marks 22, 23 as these alignment marks 12, 13 are formed near these terminals 21 so as to face the first and second alignment marks 12, 13. Have been. By superimposing the first and second alignment marks 22 and 23 of the mounted component 20 on the first and second alignment marks 12 and 13 of the plate-shaped substrate 10, the mounted component 20 is aligned with the plate-shaped substrate 10. ing.
[0029]
As shown in FIG. 5, the plate-shaped substrate holding and moving device 30 mainly includes a plate-shaped substrate holding member 31 that detachably holds the plate-shaped substrate 10, and an X that is orthogonal to the plate-shaped substrate holding member 31. , And a plate-shaped substrate holding member moving mechanism 32 that is a plate-shaped substrate holding member moving unit that rotates in the Y and Z axis directions and rotates around the Z axis.
[0030]
The plate-shaped base member holding member moving mechanism 32 includes an X-axis table 33 that reciprocates on the base B along the X-axis direction, and a reciprocation on the X-axis table 33 along the Y-axis direction orthogonal to the X-axis direction. A Y-axis table 34 that moves, a Z-axis slider 35 that reciprocates on the Y-axis table 34 in a Z-axis direction orthogonal to the X-axis and the Y-axis, and is provided on the Z-axis slider 35 and rotates around the Z-axis. The rotary table 36 is provided. The X-axis and the Y-axis are included in the same horizontal plane, and the X-axis, the Y-axis, and the Z-axis indicate the horizontal direction, the vertical direction, and the vertical direction in FIG.
[0031]
Each sliding engagement portion 33a fixed to the lower surface of the X-axis table 33 slidably engages with an X-axis rail 33b extending along the X-axis direction in the main body 37, and A screw engaging portion (not shown) fixed to the lower surface is screwed to an X-axis feed screw (not shown) arranged in parallel with the X-axis rail 33b and rotatably supported on the main body 37 around the axis. I have. An X-axis motor 33c is connected to the X-axis feed screw, and when the X-axis feed screw is rotated by the X-axis motor 33c, the X-axis table 33 reciprocates along the X-axis direction.
[0032]
Each sliding engagement portion 34a fixed to the lower surface of the Y-axis table 34 is slidably engaged with a Y-axis rail 34b extending on the X-axis table 33 along the Y-axis direction. A screw engaging portion (not shown) fixed to the lower surface of the Y-axis is screwed to a Y-axis feed screw (not shown) arranged in parallel with the Y-axis rail 34b and supported on the X-axis table 33 so as to be rotatable around the axis. Is engaged. A Y-axis motor 34c is connected to the Y-axis feed screw, and when the Y-axis feed screw is rotated by the Y-axis motor 34c, the Y-axis table 34 reciprocates along the Y-axis direction.
[0033]
The Z-axis slider 35 reciprocates along the Z-axis direction by a mechanism (not shown) (Z-axis rail, Z-axis feed screw, Z-axis motor, etc.) housed in a box 38 set up on the Y-axis table. I do. Note that the box 38 is located behind the Z-axis slider 35 (on the back side of the paper in FIG. 5).
[0034]
The turntable 36 is supported on the Z-axis slider 35 so as to be rotatable around the Z-axis, and is rotated by a Q-axis motor 36a fixed to the lower part of the Z-axis slider 35. A plate-shaped base material holding member 31 formed in a table shape is fixed to an upper portion of the rotary table 36. A plurality of suction holes are provided on the upper surface of the plate-like base material holding member 31, and the suction holding holes release the suction by holding the plate-like base material 10, and release the suction to release the suction holding.
[0035]
The mounted component holding and moving device 40 mainly moves the mounted component holding member 41 that detachably holds the mounted component 20 and moves the mounted component holding member 41 in the X, Y, and Z axis directions orthogonal to each other, as shown in FIG. And a mounted component holding member moving mechanism 42 which is mounted component holding member moving means for rotating about the Z axis.
[0036]
The mounted component holding member moving mechanism 42 includes an X-axis slider 43 that reciprocates along a X-axis direction on a gantry 42a fixed to the base B, and a Y-axis direction orthogonal to the X-axis direction on the X-axis slider 43. , A Z-axis slider 45 reciprocating on the Y-axis slider 44 in a Z-axis direction orthogonal to the X-axis and the Y-axis, and a Z-axis A rotation holder 46 that rotates around an axis is provided. The X-axis and the Y-axis are included in the same horizontal plane, and the X-axis, the Y-axis, and the Z-axis indicate the horizontal direction, the vertical direction, and the vertical direction in FIG.
[0037]
Each sliding engagement portion 43a fixed to the lower surface of the X-axis slider 43 slidably engages with an X-axis rail 43b extending along the X-axis direction on the upper surface of the gantry 42a. A screw engaging portion 43c fixed to the lower surface of the X-axis feed screw 43e is arranged in parallel with the X-axis rail 43b, and is screwed to an X-axis feed screw 43e supported via a bearing 43d on a gantry 42a so as to be rotatable around the axis. I have. An X-axis motor 43f is connected to the X-axis feed screw 43e via a connecting portion 43g. When the X-axis feed screw 43e is rotated by the X-axis motor 43f, the X-axis slider 43 reciprocates along the X-axis direction. Move.
[0038]
Each sliding engagement portion 44a fixed to the back surface of the Y-axis slider 44 slidably engages with a Y-axis rail 44b extending along the Y-axis direction on the front surface of the X-axis slider 43, and The screw engaging portion 44c fixed to the rear surface of the slider 44 is screw-engaged with a Y-axis feed screw 44e arranged parallel to the Y-axis rail 44b and supported on the front of the X-axis slider 43 so as to be rotatable around the axis. ing. A Y-axis motor 44f is connected to the Y-axis feed screw 44e. When the Y-axis feed screw 44e is rotated by the Y-axis motor 44f, the Y-axis slider 44 reciprocates along the Y-axis direction.
[0039]
Each sliding engagement portion 45a fixed to the back surface of the Z-axis slider 45 slidably engages with a Z-axis rail 45b extending along the Z-axis direction on the front surface of the Y-axis slider 44, and A screw engaging portion 45c fixed to the back surface of the slider 45 has a Z-axis feed screw 45e arranged parallel to the Z-axis rail 45b and rotatably supported on the front surface of the Y-axis slider 44 via a bearing 45d. Is screw-engaged. A Z-axis motor 45f is connected to the Z-axis feed screw 45e via a connecting portion 45g. When the Z-axis feed screw 45e is rotated by the Z-axis motor 45f, the Z-axis slider 45 reciprocates along the Z-axis direction. Move.
[0040]
The rotation holder 46 is supported by a support member 46a provided in front of the Z-axis slider 45 so as to be rotatable around the Z-axis. A large-diameter gear 46b rotatably supported in a support member 46a is integrally fixed to an upper end of the rotary holder 46. A Q-axis motor 46c is fixed to the support member 46a, and a small-diameter gear 46d meshing with the large-diameter gear 46b is fixed to the output shaft of the Q-axis motor 46c. When the small-diameter gear 46d is rotated by the Q-axis motor 46c, the rotation holder 46 rotates around the Z-axis.
[0041]
The mounting component holding member 41 is assembled to the rotary holder 46 so as to reciprocate only in the Z-axis direction and to rotate integrally with the rotary holder 46. The mounting component holding member 41 includes a buffer portion 41b housed in the rotation holder 46. The buffer 41b includes a cylinder 41b1 and a piston 41b2. The cylinder 41b1 is connected to a pressure reducing valve 41c that reduces the pressure when the internal pressure becomes equal to or higher than a predetermined value. The pressure reducing valve 41c can prevent applying excessive pressure to the plate-shaped substrate 10 and the mounted component 20 when the mounted component 20 is pressed against the plate-shaped substrate 10; Damage or breakage of the mounted component 20 can be prevented. It should be noted that an electropneumatic proportional control valve is provided instead of the pressure reducing valve 41c, and by controlling the pressure in the cylinder 41b1, the pressure required for mounting can be varied.
[0042]
At the lower end of the piston 41b2, a holding portion 41a for holding the mounted component 20 by suction is fixed. The holding portion 41a has an elongated rectangular lower surface. A plurality of suction holes are provided on the lower surface of the holding portion 41a. The mounting component 20 is sucked and held by suction of the suction holes, and sucked and held by releasing the suction. Cancel. The holding unit 41a includes a heater (not shown) as a heating unit, and the mounted component 20 held by suction is heated by the heater.
[0043]
As shown in FIGS. 7 and 10, the imaging device 50 mainly includes a plate-shaped substrate position imaging unit 51 that is a plate-shaped substrate position imaging unit that photographs the plate-shaped substrate 10 positioned at a predetermined position; And a mounting component position imaging unit 52 that is a mounting component position imaging unit that captures an image of the mounting component 20 positioned so as to face the substrate 10 in parallel.
[0044]
The plate-shaped base material position imaging section 51 includes a first optical system 53 having a first photographing opening 53a at a distal end portion, and a plate-like base material 10 attached to the first optical system 53 through the first photographing opening 53a. And a first camera 54 for imaging. As shown in FIG. 8, the first optical system 53 includes first and second prisms 53b and 53c as reflecting members, a first light 53d provided in the middle of the optical system, and a first light 53d. A half mirror 53e that receives light and reflects the light on the first prism 53b is provided. Light emitted from the first light 53d is reflected by the half mirror 53e and the first prism 53b, respectively, reaches the plate-shaped base material 10 which is the subject through the first photographing opening 53a, and reaches the plate-shaped base material 10. The light is reflected by the substrate 10, passes through the first photographing port 53a again, is reflected by the first prism 53b, passes through the half mirror 53e, is reflected by the second prism 53c, and reaches the first camera 54.
[0045]
The mounted component position imaging unit 52 includes a second optical system 55 having a second imaging port 55a at the distal end, and a second optical system 55 attached to the second optical system 55 and imaging the mounted component 20 through the second imaging port 55a. And a camera 56. Similarly to the first optical system 53, the second optical system 55 includes a first prism 55b and a second prism (not shown) as reflecting members, a second light 55d provided in the middle of the optical system, A half mirror (not shown) that receives light from the two lights 55d and reflects the light on the first prism 55b is provided. The light emitted from the second light 55d reaches the mounted component 20, which is a subject, through the second imaging port 55a, and the light that has reached is reflected by the mounted component 20 and again passes through the second imaging port 55a. 2 The camera 56 is reached.
[0046]
Thereby, the plate-shaped substrate position imaging unit 51 and the mounted component position imaging unit 52 reliably illuminate the plate-shaped substrate 10 and the mounted component 20, so that the plate-shaped substrate 10 and the mounted component 20 can be clearly photographed. Can be.
[0047]
In the plate-shaped substrate position imaging section 51 and the mounted component position imaging section 52 configured as described above, the first and second imaging ports 53a and 55a are arranged coaxially and open in the same direction. Are located in The fact that the first and second photographing ports 53a and 55a are arranged coaxially means that the overlapping area of the two photographing ports 53a and 55a, that is, the overlapping photographing area is arranged as wide as possible. It is. Further, the first and second photographing ports 53a and 55a may not be strictly coaxial due to the assembling accuracy of the image pickup device 50. However, each alignment mark of the plate-shaped base material 10 and the mounted component 20 is located in the photographing area. There is no problem if the amount of displacement is such that the image is captured within the camera. Further, since the first and second photographing ports 53a and 55a are arranged so as to open in the same direction, the plate-shaped base material 10 and the mounted component 20 can be photographed from the same direction.
[0048]
Further, in the plate-shaped substrate position imaging section 51 and the mounted component position imaging section 52, the respective distal ends of the first and second optical systems 53 and 55 are arranged with a space therebetween, and the first and second optical systems 53 and 55 are arranged. Each base end of 55 is integrally connected by a connecting portion 57. Thereby, since the imaging device 50 has a U-shaped integral structure, the positions of the plate-shaped base material 10 and the mounted components 20 can be reliably detected with a simple configuration. In addition, since the imaging device 50 has an integrated structure, only one moving mechanism for moving the imaging device 50 needs to be prepared, and the configuration can be simplified as a whole.
[0049]
As shown in FIG. 7, a plurality of (eight in the present embodiment) lights 58 are provided along the periphery of the second imaging port 55a of the mounted component position imaging unit 52, as shown in FIG. Each light 58 is arranged obliquely upward in the direction of the central axis of the second photographing opening 55a, and illuminates the mounted component 20 from an oblique direction. Thereby, even when the surface of the mounted component 20 is rough, the reflected light of the light 58 is surely incident on the second photographing port 55a, so that the plate-shaped mounted component 20 can be clearly photographed. Note that a plurality of lights 58 may be provided along the periphery of the first photographing opening 53a to illuminate the plate-shaped base material 10 from an oblique direction. Further, instead of the plurality of lights 58, a ring-shaped light may be provided on the periphery of the second photographing opening 55a.
[0050]
The imaging device supporting and moving device 60 moves the imaging device 50 in the X, Y, and Z axis directions orthogonal to each other, and mainly moves on the gantry 61 fixed to the base B as shown in FIG. X-axis slider 62 which reciprocates along the direction, Y-axis slider 63 which reciprocates on the X-axis slider 62 along the Y-axis direction orthogonal to the X-axis direction, and X-axis and Y-axis on the Y-axis slider 63 A Z-axis slider 64 that reciprocates in the Z-axis direction perpendicular to the axis is provided. The X-axis and the Y-axis are included in the same horizontal plane, and the X-axis, the Y-axis, and the Z-axis indicate the horizontal direction, the vertical direction, and the vertical direction in FIG.
[0051]
Each sliding engagement portion 62a fixed to the lower surface of the X-axis slider 62 slidably engages with an upper surface of the gantry 61 on an X-axis rail 62b extending along the X-axis direction. The screw engaging portion 62c fixed to the lower surface of the X-axis feed screw 62e is arranged in parallel with the X-axis rail 62b, and is screw-engaged with the X-axis feed screw 62e supported on the gantry 61 via a bearing 62d so as to be rotatable around the axis. I have. An X-axis motor 62f is connected to the X-axis feed screw 62e via a connecting portion 62g. When the X-axis feed screw 62e is rotated by the X-axis motor 62f, the X-axis slider 62 reciprocates along the X-axis direction. Move.
[0052]
Each sliding engagement portion 63a fixed to the lower surface of the Y-axis slider 63 is slidably engaged with a Y-axis rail 63b extending along the Y-axis direction on the upper surface of the X-axis slider 62. The screw engaging portion 63c fixed to the slider 63 is screw-engaged with a Y-axis feed screw 63e arranged in parallel with the Y-axis rail 63b and rotatably supported on the upper surface of the X-axis slider 62. . A Y-axis motor 63f is connected to the Y-axis feed screw 63e. When the Y-axis feed screw 63e is rotated by the Y-axis motor 63f, the Y-axis slider 63 reciprocates along the Y-axis direction.
[0053]
Each sliding engagement portion 64a fixed to the back surface of the Z-axis slider 64 has a Z-axis rail 64b extending along the Z-axis direction in front of a rising portion 65 provided on the upper surface of the Y-axis slider 64. A screw engaging portion 64c slidably engaged and fixed to the Z-axis slider 64 is arranged in parallel with the Z-axis rail 64b, and is rotatably supported on the front of the rising portion 65 via a bearing 64d. Screw engagement with the Z-axis feed screw 64e. A Z-axis motor 64f is connected to the Z-axis feed screw 64e via a connecting portion 64g. When the Z-axis feed screw 64e is rotated by the Z-axis motor 64f, the Z-axis slider 64 reciprocates along the Z-axis direction. Move. The imaging device 50 is fixed to the Z-axis slider 64.
[0054]
The operation of the first moving unit including the mechanism for moving the X-axis slider 62 and the mechanism for moving the Y-axis slider 63 can move the imaging device 50 in the horizontal direction. According to this, it is possible to reliably and easily evacuate the imaging device 50 after photographing the plate-shaped base material 10 and the mounted component 20. Therefore, it is possible to prevent interference when the mounting component 20 is moved (downward) and mounted on the plate-shaped base material 10 after imaging. Note that a mechanism that rotates the first moving means around the Z axis and moves the first moving means may be used. In addition, the imaging device 50 can be moved in the vertical direction (Z-axis direction) by the operation of the second moving unit that is a mechanism that moves the Z-axis slider 64. According to this, when imaging the plate-shaped base material 10 and the mounted component 20 by the imaging device 50, it is possible to reliably and easily focus. Therefore, even if the type of the mounted component 20 or the plate-shaped base material 10 to be produced due to the setup change is changed and their thickness is changed, it is possible to cope with this.
[0055]
Next, the operation of the above-described liquid crystal display device manufacturing apparatus A will be described. The control device of the liquid crystal display device manufacturing apparatus A moves the plate-shaped substrate holding member 31 holding the plate-shaped substrate 10 by suction to a predetermined position. Further, the mounted component holding member 41 is moved to the component collecting position, is quickly lowered to a predetermined height (for example, 1 mm before the mounted component), is slowly lowered to the mounted component 20, and sucks and holds the mounted component 20.
[0056]
Then, the control device raises the mounting component holding member 41 and moves the mounting component holding member 41 in the horizontal direction to position and fix the mounting member 41 so as to face the mounting position of the plate-shaped base material 10, that is, the electrode. At this time, in the case of the first mounting after the start of manufacturing (or after the setup change), it is moved to a previously input position.
[0057]
In addition, the control device also moves the imaging device 50 to position and fix the position of the plate-shaped base material 10 at the first point for photographing. At this time, as shown in FIG. 10, the first imaging port 53 a of the plate-shaped base material position imaging unit 51 is positioned facing the surface on which the adhesive member 70 is not bonded, and The second photographing opening 55a is positioned facing the surface on which the terminals 21 of the mounted component 20 are formed. The first point is a place where each of the first alignment marks 12 and 22 is photographed. Then, both the first alignment marks 12 and 22 of the plate-shaped substrate 10 and the mounted component 20 are imaged by the imaging device 50.
[0058]
Next, the control device moves the imaging device 50 to position and fix the position of the plate-shaped base material 10 at the second point where the image is taken. The second point is a place where the second alignment marks 13 and 23 are photographed. Then, both the second alignment marks 13 and 23 of the plate-shaped substrate 10 and the mounted component 20 are imaged by the imaging device 50.
[0059]
Further, based on the imaging results obtained at the first and second points, the control device shifts the position and direction of the first alignment marks 12 and 22 and shifts the direction and direction of the second alignment marks 13 and 23. Is derived, and the position shift is corrected by moving the plate-shaped base material holding member 31 and the mounted component holding member 41 based on the derived result. If the derived positional deviation amount is deviated from the position input in advance, the positional deviation amount includes the deviation amount due to the mechanical accuracy of the mounted component holding and moving mechanism 42. The second and subsequent movements of the mounted component holding member 41 to the position facing the plate-shaped base material 10 may be corrected so as to offset the shift amount. According to this, since the amount of movement in the second and subsequent alignments can be suppressed as small as possible, the mounted component 20 can be accurately placed at a predetermined position on the plate-shaped base material 10. Further, after the above-described correction, the positions of the plate-shaped base material 10 and the mounted component 20 are imaged. As a result, if the amount of displacement is out of the predetermined range, the position displacement is performed until the amount of displacement falls within the predetermined range. May be repeatedly executed. According to this, the mounting component 20 can be reliably placed at a predetermined position on the plate-shaped base material 10.
[0060]
After the above-described imaging, the control device moves the imaging device 50 in the horizontal direction and retracts. Thereafter, the mounted component holding member 41 is moved to the component collecting position, is quickly lowered to a predetermined height (for example, 1 mm before the mounted component), is slowly lowered to the mounted component 20, and the mounted component 20 is moved to the plate-shaped base material. 10 and thermocompression bonded. This crimping is temporary crimping, and is performed in the next step. After the thermocompression bonding, the suction state of the mounted component 20 is released. Then, the control device raises the mounted component holding member 41 and moves it to the component collecting position.
[0061]
In addition, as advance preparation, the distance between the plate-shaped base material 10 and the first imaging port 53a of the plate-shaped substrate position imaging unit 51, and the second imaging port 55a of the mounted component 20 and the mounted component position imaging unit 52 are set. It is desirable to adjust the focus by adjusting the distance between.
[0062]
As can be understood from the above description, in this embodiment, the plate-shaped base material 10 and the mounting component 20 positioned so as to face each other in parallel to each other are placed on the plate-shaped base material from the side opposite to the surface on which the adhesive member 70 is provided. Since the imaging is performed by the position imaging unit 51 and the mounted component position imaging unit 52, the plate-shaped base material 10 and the mounted component 20 can be directly imaged without imaging through the adhesive member 70. (Note that direct photographing includes photographing through a transparent member.) Therefore, the positions of the plate-shaped base material 10 and the mounted component 20 can be reliably detected. In addition, since it is not necessary to move the mounted component 20 right above the plate-shaped substrate 10 after photographing the plate-shaped substrate 10 and the mounted component 20, the correction distance for alignment can be reduced, and Since it is possible to suppress the occurrence of an error due to a target factor, it is possible to perform accurate alignment.
[0063]
In the above-described embodiment, the imaging device 50 is provided with the first and second cameras 54 and 56, one each for the plate-shaped substrate position imaging unit 51 and the mounted component position imaging unit 52. As shown in FIG. 11, only one common camera (third camera 81) may be provided for the plate-shaped substrate position imaging section 51 and the mounted component position imaging section 52. In this case, the plate-shaped base material position imaging unit 51 includes a third optical system 53 ′ having a first imaging port 53a at the distal end, and a plate attached to the third optical system 53 ′ via the first imaging port 53a. And a third camera 81 that images the substrate 10. The mounted component position imaging unit 52 captures the mounted component 20 via the second optical port 55a attached to the fourth optical system 55 'and the fourth optical system 55' having the second imaging port 55a at the distal end. A third camera 81 is provided. In the third and fourth optical systems 53 'and 55', the distal ends of the third and fourth optical systems 53 'and 55' are arranged with a space therebetween, and the third and fourth optical systems 53 'are arranged. , 55 ′ are integrally connected to each other to form a U-shape.
[0064]
The third optical system 53 ′ includes, similarly to the first optical system 53, first and second prisms 53b and 53c as reflecting members, a first light 53d, and a half mirror (not shown). The reflecting surface 82a of the third prism 82 as a reflecting member is provided. Light emitted from the first light 53d is reflected by the half mirror and the first prism 53b, respectively, reaches the plate-shaped base material 10 as the subject through the first photographing opening 53a, and reaches the plate-shaped substrate. The light is reflected by 10 again, passes through the first photographing port 53a, is reflected by the first prism 53b, passes through the half mirror, is reflected by the reflection surfaces 82a of the second prism 53c and the third prism 82, and reaches the third camera 81. I do.
[0065]
Like the second optical system 55, the fourth optical system 55 'includes first and second prisms 55b and 55c as reflecting members, a second light 55d, and a half mirror (not shown). A reflecting surface 82b of the third prism 82 as a reflecting member is provided. Light emitted from the second light 55d is reflected by the half mirror and the first prism 55b, respectively, reaches the mounted component 20, which is a subject, through the second photographing opening 55a, and is reflected by the mounted component 20. Then, the light is again reflected by the first prism 55b through the second photographing opening 55a, transmitted through the half mirror, reflected by the reflection surfaces 82b of the second prism 55c and the third prism 82, and reaches the third camera 81. Thereby, the third camera 81 simultaneously captures images of the plate-shaped base material 10 and the mounted component 20.
[0066]
In the above-described embodiment, the present invention is applied to a case where the mounted component 20 is a chip, that is, a COG (Chip on Glass). However, the mounted component 20 is a flexible printed circuit (FPC) using a polyimide film as a base material. In other words, the present invention can be applied to the case of FOG (Film on Glass).
[0067]
Further, in the above-described embodiment, the alignment marks are aligned, but specific electrodes and terminals may be aligned.
[Brief description of the drawings]
FIG. 1 is a right side view illustrating an appearance of an embodiment of a liquid crystal display device manufacturing apparatus to which an imaging device according to the present invention is applied.
FIG. 2 is a plan view of a liquid crystal display device manufactured by the liquid crystal display device manufacturing apparatus shown in FIG.
FIG. 3 is a partially enlarged bottom view showing the periphery of an electrode of the liquid crystal display device shown in FIG. 2;
FIG. 4 is a partially enlarged bottom view showing the mounted component shown in FIG. 2;
FIG. 5 is a right side view showing the plate-shaped substrate holding and moving device shown in FIG.
FIG. 6 is a right side view showing the mounted component holding and moving device shown in FIG. 1;
FIG. 7 is an external perspective view showing the imaging device shown in FIG.
8 is a plan view showing the inside of the plate-shaped substrate position imaging section shown in FIG. 7;
FIG. 9 is a right side view showing the imaging device supporting and moving device shown in FIG. 1;
FIG. 10 is a side view showing a positional relationship among a plate-shaped base material, mounted components, and an imaging device.
FIG. 11 is a side view showing a modified example of the imaging device according to the present invention and showing a positional relationship between the imaging device, a plate-shaped base material, and a mounted component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Plate-shaped base material, 20 ... Mounting component, 30 ... Plate-shaped base material holding and moving device, 31 ... Plate-shaped base material holding member, 32 ... Plate-shaped base material holding member moving mechanism, 40 ... Mounted component holding and moving device, 41: mounted component holding member, 42: mounted component holding member moving mechanism, 50: imaging device, 51: plate base material position imaging unit, 52: mounted component position imaging unit, 53: first optical system, 53 '... 3 optical systems, 53a first aperture, 53d first light, 54 first camera, 55 second optical system, 55 'fourth optical system, 55a second aperture, 55d second light Reference numeral 56, a second camera, 58, a light, 60, an imaging device supporting and moving device, 70, an adhesive member, 81, a third camera, 82, a third prism, A, a liquid crystal display device manufacturing device, and PL, a liquid crystal display device.

Claims (8)

A plate-shaped substrate position imaging means for photographing the plate-shaped substrate through the first photographing port,
An imaging apparatus comprising: a mounted component position imaging unit configured to capture a mounted component fixed via an adhesive member previously fixed to the plate-shaped base material through a second imaging port;
The plate-shaped substrate position imaging unit and the mounted component position imaging unit are arranged such that the first and second imaging ports are coaxially arranged, and that the plate-shaped substrate and the mounted component are imaged from the same direction. An imaging device characterized in that: 2. The apparatus according to claim 1, wherein the plate-shaped substrate position imaging unit includes a first optical system having the first imaging port at a front end thereof, and the plate attached to the first optical system via the first imaging port. And a first camera for imaging the substrate.
The mounted component position imaging unit includes a second optical system having the second imaging port at a tip end thereof, and a second camera attached to the second optical system and configured to image the mounted component through the second imaging port. Is composed of
In the first and second optical systems, the distal ends of the first and second optical systems are disposed with a space therebetween, and the proximal ends of the first and second optical systems are integrally connected. An imaging device characterized by being formed in a U-shape. 2. The plate-shaped substrate position imaging means according to claim 1, wherein the third optical system having the first imaging port at a distal end thereof, and the plate attached to the third optical system through the first imaging port. A third camera for imaging the substrate.
The mounting component position imaging means includes: a fourth optical system having the second imaging port at a tip end; and the third optical system attached to the fourth optical system and imaging the mounting component through the second imaging port. Consists of a camera and
In the third and fourth optical systems, the distal ends of the third and fourth optical systems are arranged with a space therebetween, and the proximal ends of the third and fourth optical systems are integrally connected. An imaging device characterized by being formed in a U-shape. 3. The first and second optical systems according to claim 2, wherein the first and second optical systems are provided with first and second lights in the middle of the first and second optical systems, and the first and second lights are the first and second photographing. An imaging device, wherein the plate-like base material and the mounted component are illuminated from a vertical direction through an opening. 4. The third and fourth optical systems according to claim 3, wherein first and second lights are provided between the third and fourth optical systems, and the first and second lights are the first and second photographing units. An imaging device, wherein the plate-like base material and the mounted component are illuminated from a vertical direction through an opening. The light according to claim 4 or 5, wherein a plurality of lights are provided along a periphery of the first and / or second photographing opening, and each of the lights illuminates the plate-shaped base material and / or the mounted component at an angle. An imaging device characterized by the above-mentioned. The imaging apparatus according to claim 1, further comprising a first moving unit configured to move the plate-shaped substrate position imaging unit and the mounted component position imaging unit in a horizontal direction. The imaging apparatus according to any one of claims 1 to 6, further comprising a second moving unit that moves the plate-shaped base member position imaging unit and the mounted component position imaging unit in a vertical direction.

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